Test system and method for evaluating heat dissipation performance of electronic product

Abstract

The invention relates to the field of electronic product heat dissipation performance testing, and discloses a testing system and method for evaluating the heat dissipation performance of an electronic product. The system is characterized in that a scanning device scans internal layout information of a to-be-tested electronic product and sends the internal layout information to a signal processing device, and the signal processing device generates a heat dissipation scheme according to the internal layout information and sends a test instruction to a test device when the heat dissipation scheme meets a preset heat dissipation condition; the test device performs an overclocking test on the to-be-tested electronic product according to the test instruction, records a to-be-evaluated temperature of the to-be-tested electronic product during the overclocking test, and sends the to-be-evaluated temperature to the signal processing device, and the signal processing device calculates an actual temperature of the to-be-tested electronic product according to the to-be-evaluated temperature; and generating a heat dissipation performance evaluation result according to the actual temperature. According to the invention, extreme working conditions in an actual use scene can be simulated, and the heat dissipation performance of the electronic product is comprehensively evaluated.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation performance testing of electronic products, and specifically relates to a testing system and method for evaluating the heat dissipation performance of electronic products. Background Art

[0002] With the rapid development of technology, the functions of electronic products are becoming more and more powerful, and at the same time, the requirements for hardware are also getting higher and higher. Especially in portable devices such as mobile phones and laptops, the improvement of processor performance, graphics processing ability, and multitasking processing ability makes these devices generate a large amount of heat during operation. If this heat cannot be effectively dissipated, it will cause the device temperature to rise, which will in turn affect the performance stability, service life, and user experience of the device.

[0003] The existing testing methods for the heat dissipation performance of electronic products usually adopt simple temperature monitoring or standardized load testing, which cannot simulate extreme working conditions in actual use scenarios, nor can they perform customized evaluations for different internal layout schemes. In addition, the existing testing methods lack the monitoring of the temperature of key components such as the hard disk controller, and cannot comprehensively evaluate the heat dissipation performance of the whole machine.

[0004] Therefore, there is an urgent need for a new testing system and method that can evaluate the internal layout scheme of electronic products. Summary of the Invention

[0005] In order to solve the problem that the existing testing methods cannot evaluate the internal layout scheme of electronic products, the present application provides a testing system and method for evaluating the heat dissipation performance of electronic products.

[0006] In a first aspect, the present application provides a testing system for evaluating the heat dissipation performance of electronic products, including:

[0007] A scanning device, a signal processing device, and a testing device, where the scanning device is communicatively connected to the signal processing device, and the signal processing device is communicatively connected to the testing device;

[0008] The scanning device is configured to scan the internal layout information of the electronic product to be tested and send the internal layout information to the signal processing device;

[0009] The signal processing device is configured to generate a heat dissipation plan according to the internal layout information, and when the heat dissipation plan meets a preset heat dissipation condition, send a test instruction to the testing device;

[0010] The testing device is configured to perform an overclocking test on the electronic product to be tested according to the test instruction, record the temperature to be evaluated of the electronic product to be tested during the overclocking test, and send the temperature to be evaluated to the signal processing device;

[0011] The signal processing device is further configured to calculate the actual temperature of the electronic product to be tested according to the temperature to be evaluated, and generate a heat dissipation performance evaluation result according to the actual temperature.

[0012] In an alternative embodiment, the test system further includes a storage device, which is communicatively connected to the signal processing device;

[0013] The storage device is configured to store preset heat dissipation layout information;

[0014] The signal processing device is further configured to obtain the preset heat dissipation layout information and generate the preset heat dissipation conditions according to the preset heat dissipation layout information.

[0015] In an alternative embodiment, the internal layout information includes the layout information of the central processing unit, the memory module, and the hard disk;

[0016] The signal processing device is further configured to extract the layout information of the central processing unit, the memory module, and the hard disk, and the number of heat dissipation devices from the internal layout information, and generate the heat dissipation solution according to the layout information of the central processing unit, the memory module, and the hard disk, and the number of heat dissipation devices.

[0017] In an alternative embodiment, the test system further includes a temperature detection device;

[0018] The temperature detection device is configured to obtain the hard disk controller temperature, the flash memory temperature, and the motherboard temperature of the electronic product to be tested during overclocking testing, and send the hard disk controller temperature, the flash memory temperature, and the motherboard temperature to the signal processing device;

[0019] The signal processing device is further configured to generate a temperature curve change diagram according to the hard disk controller temperature, the flash memory temperature, and the motherboard temperature.

[0020] In an alternative embodiment, the signal processing device is further configured to:

[0021] Determine the memory temperature fitting parameter of the electronic product to be tested according to the temperature curve change diagram;

[0022] Calculate the actual memory temperature according to the hard disk controller temperature and the memory temperature fitting parameter, and use the actual memory temperature as the actual temperature of the electronic product to be tested.

[0023] In an alternative embodiment, the signal processing device is further configured to:

[0024] If the overclocking test is successful, determine that there is no heat dissipation abnormality in the electronic product to be tested;

[0025] If the overclocking test fails, and the motherboard temperature is higher than the first temperature threshold, the hard disk controller temperature is higher than the second temperature threshold, or the actual temperature is higher than the third temperature threshold before the test fails, it is determined that the ambient temperature is abnormal;

[0026] If the overclocking test fails, and the motherboard temperature is higher than the first temperature threshold, the hard disk controller temperature is lower than the second temperature threshold, and the actual temperature is lower than the third temperature threshold before the test fails, it is determined that the hardware of the electronic product to be tested is abnormal.

[0027] In an alternative embodiment, the test device includes a plurality of test interfaces;

[0028] The test device is further configured to perform an overclocking test on the electronic product to be tested through the plurality of test interfaces.

[0029] In an alternative embodiment, the test interface includes at least one of a central processing unit test interface, a hard disk test interface, a memory test interface, a sound card test interface, and a graphics card test interface.

[0030] In an alternative embodiment, the test system further includes:

[0031] A temperature control device for cooling the electronic product to be tested when the temperature to be evaluated is higher than a preset temperature threshold.

[0032] In an alternative embodiment, the test system further includes:

[0033] A heat conductor for connecting to the heat source when the temperature to be evaluated corresponding to the heat source of the electronic product to be tested is higher than a preset temperature threshold, and conducting the heat of the heat source to the heat conductor.

[0034] In an alternative embodiment, the signal processing device is further configured to:

[0035] If the overclocking test fails, generate a heat dissipation improvement strategy according to the internal layout information.

[0036] In a second aspect, the present application provides a test method for evaluating the heat dissipation performance of an electronic product, including:

[0037] Scanning the internal layout information of the electronic product to be tested;

[0038] Generating a heat dissipation solution according to the internal layout information, and generating a test instruction when the heat dissipation solution meets a preset heat dissipation condition;

[0039] Performing an overclocking test on the electronic product according to the test instruction, and recording the temperature to be evaluated of the electronic product to be tested during the overclocking test;

[0040] Calculate the actual temperature of the electronic product to be tested according to the temperature to be evaluated, and generate a heat dissipation evaluation result according to the actual temperature.

[0041] In a third aspect, the present application provides a computer device, which includes a processor and a memory. The memory stores a computer program, and the processor is configured to execute the computer program to implement the test method for evaluating the heat dissipation performance of electronic products described in the second aspect.

[0042] In a fourth aspect, the present application provides a computer storage medium, which stores a computer program. When the computer program is executed on a processor, it implements the test method for evaluating the heat dissipation performance of electronic products described in the second aspect.

[0043] The embodiments of the present application have the following beneficial effects:

[0044] The present application can simulate extreme working conditions in an actual use scenario and comprehensively evaluate the heat dissipation performance of electronic products; by applying high loads through overclocking tests and other means, it simulates the heat dissipation performance of electronic products in a high-temperature and high-power consumption state, ensuring the accuracy and reliability of the test results. Description of the Drawings

[0045] In order to more clearly illustrate the technical solutions of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the protection scope of the present application. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0046] Figure 1 Shows a structural diagram of a test system framework for evaluating the heat dissipation performance of electronic products provided in this embodiment;

[0047] Figure 2 Shows a schematic flowchart of a test method for evaluating the heat dissipation performance of electronic products provided in this embodiment.

[0048] Main Component Symbol Explanation:

[0049] 100. Scanning device; 200. Signal processing device; 300. Test device. Detailed Embodiments

[0050] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments.

[0051] The components of the embodiments of the present application that are generally described and illustrated in the accompanying drawings herein can be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but merely represents selected embodiments of the present application. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative efforts belong to the scope of protection of the present application.

[0052] Hereinafter, the terms "including", "having" and their cognates that can be used in various embodiments of the present application are only intended to indicate specific features, numbers, steps, operations, elements, components or combinations of the foregoing items, and should not be construed as first excluding the existence of one or more other features, numbers, steps, operations, elements, components or combinations of the foregoing items or increasing the possibility of one or more features, numbers, steps, operations, elements, components or combinations of the foregoing items.

[0053] In addition, terms such as "first", "second", "third", etc. are only used for differentiating descriptions and cannot be construed as indicating or implying relative importance.

[0054] Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which various embodiments of the present application belong. The terms (such as those defined in a commonly used dictionary) will be interpreted as having the same meaning as the contextual meaning in the relevant technical field and will not be interpreted as having an idealized meaning or being overly formal, unless clearly defined in various embodiments of the present application.

[0055] The following will describe in detail some embodiments of the present application in conjunction with the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0056] Referring to Figure 1 , Figure 1 is a schematic diagram of the framework structure of a test system for evaluating the heat dissipation performance of electronic products provided for this embodiment. The test system mainly includes:

[0057] A scanning device 100, a signal processing device 200, and a test device 300. The scanning device 100 is communicatively connected to the signal processing device 200, and the signal processing device 200 is communicatively connected to the test device 300. The test system may further include a test platform for placing electronic products to be tested, such as mobile phones, laptops, tablets, and so on.

[0058] After the test starts, the scanning device 100 scans the internal layout information of the electronic product to be tested and sends the internal layout information to the signal processing device 200. The internal layout information mainly includes the positions and quantities of various heat-generating components, temperature-sensitive components, and heat-dissipating components in the electronic product, etc.

[0059] The signal processing device 200 then generates a heat dissipation plan based on the internal layout information, and when the heat dissipation plan meets the preset heat dissipation conditions, it sends a test instruction to the test device 300. Different internal layout information of the electronic product corresponds to different heat dissipation plans. If there are multiple generated heat dissipation plans, each heat dissipation plan can be evaluated to see if it meets the preset heat dissipation conditions. If there is a heat dissipation plan that meets the preset heat dissipation conditions, the subsequent test of the electronic product can be carried out.

[0060] The test device 300 then performs an overclocking test on the electronic product to be tested, records the temperature to be evaluated of the electronic product to be tested during the overclocking test, and sends the temperature to be evaluated to the signal processing device 200. Then, the signal processing device 200 calculates the actual temperature of the electronic product to be tested based on the temperature to be evaluated and generates a heat dissipation performance evaluation result based on the actual temperature.

[0061] This embodiment can comprehensively monitor the temperature changes of key components such as the hard disk controller, so as to comprehensively evaluate the heat dissipation performance of the whole machine; not only pays attention to the temperatures of main heat sources such as the CPU and GPU, but also focuses on monitoring components such as the hard disk controller that are sensitive to temperature, ensuring that the heat dissipation performance of each component of the whole machine can be evaluated. Moreover, it can simulate extreme working conditions in the actual use scenario to comprehensively evaluate the heat dissipation performance of the electronic product; by means of overclocking tests, etc., high loads are applied to simulate the heat dissipation performance of the electronic product in a high-temperature and high-power consumption state, ensuring the accuracy and reliability of the test results.

[0062] In one implementation manner, the test system further includes a storage device, and the storage device is communicatively connected to the signal processing device 200;

[0063] The storage device is used to store preset heat dissipation layout information;

[0064] The signal processing device 200 is further used to obtain the preset heat dissipation layout information and generate the preset heat dissipation conditions based on the preset heat dissipation layout information.

[0065] The preset heat dissipation layout information can be layout information that meets the heat dissipation requirements. For example, for various types of electronic products, such as mobile phones, notebooks, tablets, etc., it is stipulated that their internal heat sources are centrally managed, that is, the main heat sources such as CPU, GPU are placed together and close to cooling devices such as fans, heat sinks or liquid cooling systems; optimize the airflow path, and the internal design of the equipment has clear air inlets and outlets to ensure that air can smoothly pass through the equipment to take away heat; use high-efficiency thermal conductive materials, and apply high-efficiency thermal conductive paste or thermal conductive pads between key heating components and radiators to enhance heat conduction efficiency; space utilization and isolation, non-heat sensitive components are kept as far away from heat sources as possible, while maintaining sufficient physical spacing to prevent heat accumulation, or the distance between each heating component cannot be less than the preset distance, the number of heat dissipation components cannot be less than the preset number, the location and number of vents must be reasonably planned, etc., and based on these factors, generate preset heat dissipation conditions that meet the heat dissipation requirements for various electronic products.

[0066] This embodiment generates preset heat dissipation conditions that meet heat dissipation requirements for different electronic products according to their internal layout information, so that the internal layout information of the electronic product to be evaluated can be reasonably evaluated according to the preset heat dissipation conditions.

[0067] In one embodiment, the internal layout information includes layout information of a central processing unit, a memory bar, and a hard disk;

[0068] The signal processing device 200 is also used to extract the layout information of the central processing unit, memory bar and hard disk and the number of heat dissipation devices from the internal layout information, and generate the heat dissipation solution according to the layout information of the central processing unit, memory bar and hard disk and the number of heat dissipation devices.

[0069] The scanning device 100 obtains the internal layout information of the electronic product to be evaluated, usually in the form of a picture. Therefore, the signal processing device 200 is also required to extract the corresponding electronic components from the picture, such as the location of the central processing unit, memory bar and hard disk, as well as the number of other heat-generating electronic components, heat-sensitive electronic components or heat sinks, and generate a corresponding heat dissipation solution.

[0070] Specifically, after obtaining the internal layout information, various different cooling solutions can be generated based on the internal layout information, and then different cooling solutions can be evaluated through preset cooling conditions. If all cooling solutions do not meet the preset cooling conditions, the layout of the electronic product needs to be adjusted. If there is a cooling solution that meets the preset cooling conditions, the electronic product can be subsequently overclocked.

[0071] In this embodiment, the signal processing device 200 evaluates the internal layout information to determine whether the electronic product to be tested meets the preset heat dissipation conditions. If it meets the conditions, the electronic product to be tested is then subjected to an overclocking test, reducing the test cost.

[0072] In one implementation, the test system further includes a temperature detection device.

[0073] The temperature detection device is configured to obtain the hard disk controller temperature, the flash memory temperature, and the motherboard temperature of the electronic product to be tested when the test device 300 performs an overclocking test, and send the hard disk controller temperature, the flash memory temperature, and the motherboard temperature to the signal processing device 200.

[0074] The signal processing device 200 is further configured to generate a temperature curve change diagram based on the hard disk controller temperature, the flash memory temperature, and the motherboard temperature.

[0075] Specifically, for a laptop computer, use the Intel XTU software to adjust the CPU frequency to the manufacturer-recommended safe range, such as 2.8 GHz to 3.2 GHz; use the AnTuTu Benchmark software to create a custom test scenario, apply a high load to the processor, memory, and hard disk controller, and set the test parameters as follows: running time is 8 hours, and the load type is continuous playback of 4K high-definition video, multitasking, large games, etc.; use the HWMonitor temperature monitoring software to monitor the temperature of the hard disk controller and other key components, and set the automatic recording function to ensure that the temperature data is saved once every minute.

[0076] For example, for a mobile phone, use the ADB command to overclock the CPU frequency to the manufacturer-recommended safe range, such as 1.8 GHz to 2.2 GHz; use the AnTuTu Benchmark software to apply a high load, and set the test parameters as follows: running time is 8 hours, and the load type is continuous playback of 4K high-definition video, multitasking, large games, etc.; start the CPU-Z application to monitor the overall system temperature in real time; use the ADB command to regularly read the temperature sensor data to ensure that the temperature data is saved once every minute.

[0077] Specifically, for important components such as the hard disk controller, flash memory, and motherboard, once their temperature exceeds a certain temperature threshold, it will cause a significant drop in their performance and cannot meet the normal working requirements. Therefore, at this time, it can be considered that the overclocking test fails. If the temperature of important components such as the hard disk controller, flash memory, and motherboard does not exceed the temperature threshold from the start to the end of the overclocking test, it can be considered that the overclocking test is successful.

[0078] In this embodiment, different overclocking test methods are adopted according to different electronic products, and the temperature data of the key components of the electronic product during the overclocking test are recorded, and whether the overclocking test is successful is judged according to the temperature data.

[0079] In one embodiment, the signal processing device 200 is further configured to:

[0080] Determine the memory temperature fitting parameter of the electronic product to be tested according to the temperature curve change diagram;

[0081] Calculate the actual memory temperature according to the hard disk controller temperature and the memory temperature fitting parameter, and use the actual memory temperature as the actual temperature of the electronic product to be tested.

[0082] The key components of the electronic product mainly include the hard disk controller temperature, the flash memory temperature, the motherboard temperature, etc. Then, according to the temperatures of the key components, an overall temperature change curve of the electronic product to be tested is fitted, and the temperature change curve is updated according to the real-time temperature data. If the temperature exceeds the preset temperature, it is determined that the overclocking test fails, the test is stopped, and the temperatures of each key component before the test is stopped are recorded.

[0083] In one embodiment, the signal processing device 200 is further configured to:

[0084] If the overclocking test is successful, it is determined that there is no abnormal heat dissipation in the electronic product to be tested;

[0085] If the overclocking test fails, and before the test fails, the motherboard temperature is higher than the first temperature threshold, the hard disk controller temperature is higher than the second temperature threshold, or the actual temperature is higher than the third temperature threshold, it is determined that the ambient temperature is abnormal;

[0086] If the overclocking test fails, and before the test fails, the motherboard temperature is higher than the first temperature threshold, the hard disk controller temperature is lower than the second temperature threshold, and the actual temperature is lower than the third temperature threshold, it is determined that there is an abnormality in the hardware of the electronic product.

[0087] For example, the first temperature threshold can be 70 °C, the second temperature threshold can be 120 °C, and the third temperature threshold can be 90 °C. That is, before the overclocking test fails, if the motherboard temperature has been higher than 70 °C, the hard disk controller temperature is higher than 120 °C, or the actual temperature is higher than 90 °C, it can be determined that the reason for the test failure is caused by the ambient temperature.

[0088] If before the overclocking test fails, the motherboard temperature has been higher than 70 °C, the hard disk controller temperature is lower than 120 °C, and the actual temperature is lower than 90 °C, it can be determined that the reason for the test failure is caused by the hardware.

[0089] In one implementation, the signal processing device 200 is further configured to:

[0090] If the overclocking test fails, a heat dissipation improvement strategy is generated according to the internal layout information.

[0091] Specifically, the signal processing device 200 can combine the internal layout information with components such as a micro fan, a heat conductor, and a fan control circuit to realize a combined heat dissipation structure based on a heat dissipation fan. The heat dissipation structure includes a micro fan installed in an electronic product, a fan control circuit for adjusting the fan wind speed, and a heat conductor for absorbing heat from a heat source; one end of the heat conductor is connected to the heat source, and the other end of the heat conductor is connected to the fan, and the fan control circuit is electrically connected to the fan. During the use or charging of the electronic product, the heat generated by the heat source is transferred to the heat conductor, and the fan is turned on to fully dissipate the heat on the heat conductor.

[0092] The fan control circuit includes a temperature sensor and an adjustable speed circuit for sensing the temperature of the electronic product. The temperature sensor is electrically connected to the input end of the electronic product main chip, the output end of the main chip is electrically connected to the adjustable speed circuit, and the adjustable speed circuit is electrically connected to the fan. The temperature sensor senses the temperature signal of the electronic product and sends the sensed signal to the main chip for processing. After processing, the main chip sends a control signal to the adjustable speed circuit. The adjustable speed circuit increases or decreases the wind speed of the fan according to the control signal. Through the design of the fan control circuit, the fan wind speed can be controlled, and the heat source of the electronic product can be controlled to work within a suitable temperature range.

[0093] If the electronic product to be tested is a notebook, a special cooling solution for notebooks can also be generated: Heat pipe layered layout: the main heat pipe is directly connected to the CPU / GPU, and the secondary heat pipe covers the power module. Dual fan special blade design: high and low speed difference fan + asymmetric blades reduce resonance noise. Keyboard air intake structure: use the keycap gap as an auxiliary air inlet. Dynamic heat spreader technology: the scalable vacuum chamber coverage rate reaches 85%. 3D three-dimensional air duct: the motherboard double-layer stacking design is combined with vertical heat dissipation fins.

[0094] If the electronic product to be tested is a mobile phone, a special heat dissipation solution for mobile phones can also be generated: Phase change energy storage material: Fill paraffin-based phase change material on the surface of SoC to buffer instantaneous heat. Graphene film stacking: Up to 7 layers of directional heat-conducting graphite stacking. Liquid metal filling: Inject gallium-based alloy between SoC and middle frame. Active semiconductor cooling: Integrated TEC cooling sheet with cold plate. Frame liquid cooling cycle: Built-in micro pump drives coolant to flow in the metal middle frame.

[0095] This embodiment can generate different heat dissipation improvement strategies according to the type of electronic product, so that the component layout of the electronic product meets the heat dissipation requirements, enabling the electronic product to operate normally in complex environments.

[0096] In one embodiment, the test device 300 includes a plurality of test interfaces;

[0097] The test device 300 is further configured to perform overclocking tests on the electronic product to be tested through the plurality of test interfaces. The test interfaces include at least one of a central processing unit test interface, a hard disk test interface, a memory test interface, a sound card test interface, and a graphics card test interface.

[0098] Specifically, when testing an electronic product, it usually includes tests of various components. Different components generally require different test interfaces. Therefore, different interfaces can be set to test different aspects of the electronic product and collect relevant test data.

[0099] In one embodiment, the test system further includes:

[0100] A temperature control device configured to cool the electronic product to be tested when the temperature to be evaluated is higher than a preset temperature threshold.

[0101] When the temperature to be evaluated is higher than the preset temperature threshold, it indicates that there may be a risk of fire for the electronic product to be tested. At this time, it is necessary to cool the electronic product to be tested through the temperature control device to ensure the safety of the test device 300 and the test personnel.

[0102] In one embodiment, the overclocking test method mainly includes:

[0103] Use an overclocking test tool to synchronously perform stress tests on the SSD, CPU, Memory, Audio, Video, and Graphics. The test sequence is CPU, memory, audio subsystem, video codec test, and graphics rendering test. Among them, the test tool can be the Passmark Burnin9.1 tool.

[0104] (1) CPU stress test:

[0105] The flowchart corresponding to the script of the test tool is as follows:

[0106] Step 1: Start Prime95, set the mode to small_fft, and set the number of threads to the maximum;

[0107] Step 2: Configure ThrottleStop, set the long-term power consumption wall (PL1) to 45W, set the short-term power consumption wall (PL2) to 90W, and set the temperature limit to 95°C;

[0108] Step 3: Monitor system metrics, including Package Temp (surface temperature), Core Freq (core frequency), and VRM Temp (power supply module temperature); set the monitoring interval to 1 second and the monitoring duration to 30 minutes.

[0109] Step 4: The test process ends.

[0110]

[0111] Exemplarily, under the condition of PL1 = 55W, the Dell XPS15 9520 needs to maintain the i7-12700H all-core at 3.2GHz for 20 minutes. The Samsung Galaxy S23 Ultra needs to maintain the X3 big core at 2.8GHz for more than 10 minutes.

[0112] (2) Memory stress test:

[0113]

[0114] Monitoring key points and pass conditions: Error address distribution pattern, memory controller temperature (read through SMBUS), and the number of RAS feature triggers (Correctable Error count). Zero uncorrectable errors (UC Error), read / write bandwidth fluctuation < 8% (compared with the reference value), and refresh latency compliant with JEDEC standards.

[0115] Interrupt case: When the Lenovo Legion 5Pro overclocks the DDR5-4800 to 5200MHz, address line cross-interference occurs and it needs to be reduced to 5066MHz.

[0116] (3) Audio subsystem test:

[0117] Test item list, background noise test (20Hz - 20kHz sweep), pop noise detection (44.1kHz / 24bit sine wave mutation), power amplifier stability (1kHz square wave continuous output), Bluetooth encoding stress (LDAC 990kbps loopback test).

[0118] Exemplarily, failure feature library: Notebook: Realtek ALC4080 has harmonic distortion at a 120dB dynamic range. Mobile phone: The built-in DAC of the Snapdragon 8 Gen2 has high-frequency attenuation at 105dB SNR.

[0119] (4) Video codec test

[0120]

[0121] And, further, the performance evaluation formula is as follows:

[0122] Decoding stability coefficient = (number of successful frames / total number of frames) × 100 - (temperature compensation coefficient × ΔT);

[0123] Temperature compensation coefficient: for laptops = 0.3 / °C, for mobile phones = 0.5 / °C

[0124] (5) Graphics rendering test

[0125] Grading test scheme:

[0126]

[0127] Dynamic frequency modulation monitoring, this application exemplifies a GPU frequency stability analysis algorithm as follows:

[0128] Step 1: Input the frequency log freq_log, specifically, input the frequency log data;

[0129] Step 2: Calculate the average frequency avg, specifically, use np.mean(freq_log) to calculate the average frequency;

[0130] Step 3: Calculate the standard deviation std, specifically, use np.std(freq_log) to calculate the standard deviation;

[0131] Step 4: Calculate the stability index stability_index, specifically, calculate the stability index according to the formula;

[0132] Step 5: Determine whether the stability index is greater than 0.85, specifically, determine whether it passes according to the condition;

[0133] Step 6: Return True / False, return True or False according to the judgment result;

[0134] Step 7: The process ends.

[0135] Refer to Figure 2 , Figure 2 is a schematic flow diagram of a test method for evaluating the heat dissipation performance of electronic products provided in this embodiment. The method includes:

[0136] S201. Scan the internal layout information of the electronic product to be tested.

[0137] S202. Generate a heat dissipation solution according to the internal layout information, and generate a test instruction when the heat dissipation solution meets the preset heat dissipation conditions.

[0138] S203. Perform an overclocking test on the electronic product according to the test instruction, and record the temperature to be evaluated of the electronic product to be tested during the overclocking test.

[0139] S204. Calculate the actual temperature of the electronic product to be tested according to the temperature to be evaluated, and generate a heat dissipation evaluation result according to the actual temperature.

[0140] It can be understood that the test method of this embodiment corresponds to the test system of the above embodiment. The optional items in the above embodiment are also applicable to this embodiment, so they will not be described repeatedly here.

[0141] This application also provides a computer device. Exemplarily, the computer device includes a processor and a memory. Among them, the memory stores a computer program, and the processor runs the computer program to enable the computer device to execute the above test method or the functions of each module in the above test system.

[0142] Among them, the processor can be an integrated circuit chip with signal processing capabilities. The processor can be a general-purpose processor, including at least one of a central processing unit (CPU), a graphics processing unit (GPU), a network processor (NP), a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, and discrete hardware components. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor, etc., which can implement or execute the various methods, steps, and logic block diagrams disclosed in the embodiments of the present application.

[0143] The memory can be, but is not limited to, a random access memory (RAM), a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), etc. Among them, the memory is used to store the computer program, and after receiving the execution instruction, the processor can execute the computer program accordingly.

[0144] The present application also provides a computer storage medium for storing the computer program used in the above computer device. Among them, the computer storage medium can be a readable storage medium, a non-volatile storage medium or a volatile storage medium. For example, the computer storage medium may include, but is not limited to: USB flash drives, mobile hard disks, read-only memories (ROMs), random access memories (RAMs), magnetic disks or optical discs, and other media that can store program codes.

[0145] In several embodiments provided by the present application, it should be understood that the disclosed devices and methods can also be implemented in other ways. The device embodiments described above are merely illustrative. For example, the flowcharts and block diagrams in the accompanying drawings show the possible architectures, functions, and operations of the devices, methods, and computer program products according to multiple embodiments of the present application. In this regard, each block in the flowchart or block diagram may represent a module, a program segment, or a part of code, and the module, program segment, or part of code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in an alternative implementation, the functions marked in the blocks may occur in a different order than marked in the accompanying drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram and / or flowchart, and the combination of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system for performing the specified functions or actions, or can be implemented by a combination of dedicated hardware and computer instructions.

[0146] In addition, in each embodiment of the present application, the various functional modules or units may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.

[0147] If the above functions are implemented in the form of software function modules and sold or used as an independent product, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, or a part of this technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a smart phone, a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in each embodiment of the present application.

[0148] As described above, it is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or substitutions, which should all be covered within the protection scope of the present application.

Claims

1. A test system for evaluating the heat dissipation performance of electronic products, characterized in that, Including: A scanning device, a signal processing device, and a testing device. The scanning device is communicatively connected to the signal processing device, and the signal processing device is communicatively connected to the testing device; The scanning device is configured to scan the internal layout information of the electronic product to be tested and send the internal layout information to the signal processing device; The signal processing device is configured to generate a heat dissipation solution based on the internal layout information and send a test instruction to the testing device when the heat dissipation solution meets the preset heat dissipation conditions; The testing device is configured to perform an overclocking test on the electronic product to be tested according to the test instruction, record the temperature to be evaluated of the electronic product to be tested during the overclocking test, and send the temperature to be evaluated to the signal processing device; The signal processing device is further configured to calculate the actual temperature of the electronic product to be tested based on the temperature to be evaluated and generate a heat dissipation performance evaluation result based on the actual temperature.

2. The test system for evaluating the heat dissipation performance of electronic products according to claim 1, characterized in that The test system further includes a storage device, and the storage device is communicatively connected to the signal processing device; The storage device is configured to store preset heat dissipation layout information; The signal processing device is further configured to obtain the preset heat dissipation layout information and generate the preset heat dissipation conditions based on the preset heat dissipation layout information.

3. The test system for evaluating the heat dissipation performance of electronic products according to claim 2, characterized in that, The internal layout information includes the layout information of the central processing unit, the memory module, and the hard disk; The signal processing device is further configured to extract the layout information of the central processing unit, the memory module, and the hard disk and the number of heat dissipation devices from the internal layout information, and generate the heat dissipation solution based on the layout information of the central processing unit, the memory module, and the hard disk and the number of heat dissipation devices.

4. The test system for evaluating the heat dissipation performance of electronic products according to claim 1, wherein, The test system further includes a temperature detection device; The temperature detection device is configured to obtain the hard disk controller temperature, the flash memory temperature, and the motherboard temperature of the electronic product to be tested when the testing device performs an overclocking test, and send the hard disk controller temperature, the flash memory temperature, and the motherboard temperature to the signal processing device; The signal processing device is further configured to generate a temperature curve change diagram based on the hard disk controller temperature, the flash memory temperature, and the motherboard temperature.

5. The test system for evaluating the heat dissipation performance of electronic products according to claim 4, wherein The signal processing device is further configured to: Determine the memory temperature fitting parameter of the electronic product to be tested according to the temperature curve change diagram; Calculate the actual memory temperature based on the hard disk controller temperature and the memory temperature fitting parameter, and use the actual memory temperature as the actual temperature of the electronic product to be tested.

6. The test system for evaluating the heat dissipation performance of electronic products according to claim 5, wherein The signal processing device is further configured to: If the overclocking test is successful, determine that there is no heat dissipation abnormality in the electronic product to be tested; If the overclocking test fails, and the motherboard temperature is higher than the first temperature threshold, the hard disk controller temperature is higher than the second temperature threshold, or the actual temperature is higher than the third temperature threshold before the test fails, determine that the ambient temperature is abnormal; If the overclocking test fails, and the motherboard temperature is higher than the first temperature threshold, the hard disk controller temperature is lower than the second temperature threshold, and the actual temperature is lower than the third temperature threshold before the test fails, determine that there is a hardware abnormality in the electronic product to be tested.

7. The test system for evaluating the heat dissipation performance of electronic products according to claim 1, characterized in that, The testing device includes a plurality of test interfaces; The test device is further configured to perform overclocking tests on the electronic product under test through a plurality of the test interfaces.

8. The test system for evaluating the heat dissipation performance of electronic products according to claim 7, wherein The test interface includes at least one of a central processing unit test interface, a hard disk test interface, a memory test interface, a sound card test interface, and a graphics card test interface.

9. The test system for evaluating the heat dissipation performance of electronic products according to claim 1, wherein, The test system further includes: A temperature control device configured to cool the electronic product under test when the temperature to be evaluated is higher than a preset temperature threshold.

10. The test system for evaluating the heat dissipation performance of electronic products according to claim 9, characterized in that, The test system further includes: A heat conductor configured to connect to the heat source when the temperature to be evaluated corresponding to the heat source of the electronic product under test is higher than a preset temperature threshold, and conduct the heat of the heat source to the heat conductor.

11. The test system for evaluating the heat dissipation performance of electronic products according to claim 1, characterized in that, The signal processing device is further configured to: If the overclocking test fails, generate a heat dissipation improvement strategy according to the internal layout information.

12. A test method for evaluating the heat dissipation performance of electronic products, characterized in that, Including: Scanning the internal layout information of the electronic product under test; Generating a heat dissipation solution according to the internal layout information, and generating a test instruction when the heat dissipation solution meets a preset heat dissipation condition; Performing an overclocking test on the electronic product according to the test instruction, and recording the temperature to be evaluated of the electronic product under test during the overclocking test; Calculating the actual temperature of the electronic product under test according to the temperature to be evaluated, and generating a heat dissipation evaluation result according to the actual temperature.

13. A computer device, characterized in that, The computer device includes a processor and a memory, the memory stores a computer program, and the processor is configured to execute the computer program to implement the test method for evaluating the heat dissipation performance of an electronic product described in claim 12.

14. A computer storage medium, characterized in that, It stores a computer program, and when the computer program is executed on a processor, it implements the test method for evaluating the heat dissipation performance of an electronic product described in claim 12.

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