Multifunctional chip test equipment

Abstract

The invention relates to the technical field of chip testing, in particular to multifunctional chip testing equipment. Comprising a magnetic suspension guide rail, a follow-up testing head mechanism, a testing table, five testing sliding seats, four testing fixing frames and four testing mechanisms, horizontal electric cylinder lead screws are arranged on the testing sliding seats, a vertical plate is arranged at the moving ends of the horizontal electric cylinder lead screws, a vertical electric cylinder lead screw is arranged on one side of the vertical plate, and a testing adsorption head is arranged at the moving end of the vertical electric cylinder lead screw; a preheating plate is arranged at one end of the vertical plate, a preheating mechanism is arranged in the preheating plate, a test rotating table is arranged in the test fixing frame through a rotating motor, test placement tables are arranged at the two ends of the test rotating table, chip testing under the condition from room temperature to high temperature can be supported through the preheating mechanism, and the temperature control precision can be smaller than or equal to + / -3 DEG C; the chip state monitoring system has high stability, meanwhile, the five-face detection system can monitor the chip state in real time in the test transplanting process, and the comprehensive monitoring capacity of the chip state is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and particularly to a multi-functional chip testing device. Background Art

[0002] With the continuous progress of information technology, the development prospect of the chip industry is becoming increasingly broad. As a key component of modern electronic devices, the performance of chips is directly related to the operating efficiency and stability of the entire system. Therefore, in the chip manufacturing process, the testing link is particularly important. Existing chip testing methods cover various methods such as analog testing, digital testing, and mixed-signal testing. These testing methods and systems can comprehensively detect the functions, performance, and reliability of chips, thereby ensuring that the quality of chips meets relevant standards and requirements.

[0003] However, during the testing process, for chip testing under high-temperature conditions, the temperature control accuracy and stability of existing equipment still need to be improved. Secondly, during the testing process, the phenomenon of high-voltage arcing occurs frequently, which not only affects the accuracy of test results but may also damage the testing equipment. In addition, the real-time monitoring ability of existing testing systems during the testing transplant process is also limited, making it difficult to achieve comprehensive monitoring of the chip state. Summary of the Invention

[0004] The purpose of the present invention is to provide a multi-functional chip testing device, aiming to solve the technical problems in the prior art that during the testing process, for chip testing under high-temperature conditions, the temperature control accuracy and stability of existing equipment still need to be improved. Secondly, during the testing process, the phenomenon of high-voltage arcing occurs frequently, which not only affects the accuracy of test results but may also damage the testing equipment. In addition, the real-time monitoring ability of existing testing systems during the testing transplant process is also limited, making it difficult to achieve comprehensive monitoring of the chip state.

[0005] To achieve the above-mentioned purpose, the present invention adopts a multifunctional chip testing equipment, including a magnetic levitation guide rail, a follow-up test head mechanism and a test bench, the magnetic levitation guide rail is provided with five test slides adapted to the magnetic levitation guide rail, the test slide is provided with a horizontal electric cylinder screw, the movable end of the horizontal electric cylinder screw is provided with a vertical plate, one side of the vertical plate is provided with a vertical electric cylinder screw, the movable end of the vertical electric cylinder screw is provided with a test adsorption head, one end of the vertical plate is provided with a preheating plate, a preheating mechanism is provided in the preheating plate, a heating hole is provided on the preheating plate, and the test adsorption head extends into the heating hole, four test fixing frames and four test flying cameras are provided on the test bench, and the test fixing frames and four test flying cameras are provided. A test rotating table is arranged in the fixed frame through a rotating motor, test placing tables are arranged at both ends of the test rotating table, a cleaning brush is arranged at one end of the test rotating table, a cleaning telescopic rod is arranged at the other end of the test rotating table, and needle cleaning paper is arranged at the output end of the cleaning telescopic rod, four test mechanisms are arranged on one side of the test table, the magnetic levitation guide rail is fixedly connected to the test table and is located on the other side of the test table, and the preheating plates at four of the test slides are arranged toward the corresponding test placing tables, the follow-up test head mechanism is fixedly connected to the test table and is located on one side of the test table, and the test end of the follow-up test table is connected to the test end of the corresponding test mechanism.

[0006] Among them, the follow-up test head mechanism includes a follow-up test assembly, a follow-up electric cylinder lead screw and a follow-up fixed table. The test end of the follow-up test assembly is provided with a follow-up test head. The follow-up test assembly is fixedly connected to the follow-up electric cylinder lead screw and is located at the moving end of the follow-up electric cylinder lead screw. The follow-up electric cylinder lead screw is fixedly connected to the follow-up fixed table and is located in the follow-up fixed table. The follow-up test assembly is located above the follow-up fixed table. The follow-up fixed table is also fixedly connected to the test table and is located on one side of the test table.

[0007] Wherein, the preheating mechanism includes a ceramic heating ring and a conduction plate, the upper end surface of the conduction plate has an air groove, one end of the air groove is connected to an air inlet joint, and the air inlet joint extends to the preheating plate, the other end of the air groove is connected to a preheating groove, the ceramic heating ring is arranged between the conduction plate and the preheating plate, and the ceramic heating ring is electrically heated, the conduction plate is fixedly connected to the preheating plate, and is located below the preheating plate.

[0008] Wherein, the preheating groove is connected to the heating hole, and the test adsorption head can pass through the preheating groove and the heating hole.

[0009] Among them, four planar cameras are arranged below the magnetic levitation guide rail, a plane mirror is arranged in the middle of the test placement table, and the plane mirror is arranged towards the upper end surface of the corresponding test placement table, and the shooting end of the planar camera is arranged towards the refracting end of the plane mirror.

[0010] Among them, the test mechanism includes a test position, a test mounting plate and two test fixing sleeves. A plurality of test needles are arranged at the test end of the test position. Test sliding rods are arranged at both ends of the test mounting plate. A test cross plate is arranged below the two test sliding rods. A test telescopic rod is arranged below the test cross plate. The test position is fixedly connected to the test mounting plate and is located above the test mounting plate, and the plurality of test needles extend to the lower end surface of the test mounting plate. The two test sliding rods are respectively slidably connected to the corresponding test fixing sleeves and are located within the test fixing sleeves, and the output end of the test telescopic rod is arranged on one side of the test table. The follow-up test assembly is fixedly connected to the corresponding test mounting plate and is located outside the test mounting plate, and the test position is connected to the follow-up test head. The two test fixing sleeves are respectively fixedly connected to the test table and are located on one side of the test table.

[0011] Among them, a dust suction pipe cylinder is arranged at one end of the test mounting plate, and a dust suction pipe body is arranged at the output end of the dust suction pipe cylinder. The dust suction pipe body is arranged towards the direction of the test rotating table.

[0012] A multifunctional chip testing device of the present invention includes a magnetic levitation guide rail, a follow-up test head mechanism and a test table. Five test sliding seats adapted to the magnetic levitation guide rail are arranged on the magnetic levitation guide rail. A horizontal electric cylinder screw rod is arranged on the test sliding seat. A vertical plate is arranged at the mobile end of the horizontal electric cylinder screw rod. A vertical electric cylinder screw rod is arranged on one side of the vertical plate. A test suction head is arranged at the mobile end of the vertical electric cylinder screw rod. A preheating plate is arranged at one end of the vertical plate. A preheating mechanism is arranged inside the preheating plate. Heating holes are provided on the preheating plate. Four test fixing frames and four test flying shooting cameras are arranged on the test table. A test rotating table is arranged in the test fixing frame through a rotating motor. Test placement tables are arranged at both ends of the test rotating table. Four test mechanisms are arranged on one side of the test table. Through the design of the preheating mechanism, it can support chip testing under room temperature to high temperature conditions, and the temperature control accuracy can reach ≤±3 degrees Celsius, with high stability. At the same time, the device supports inert gas protection, which can effectively prevent the occurrence of high-voltage arcing phenomena and avoid damage to the test results and the device. In addition, the device is also equipped with a high-speed five-sided detection system, which can monitor the chip state in real time during the test transplanting process, improving the comprehensive monitoring ability of the chip state. Therefore, the multifunctional chip testing device effectively improves the problems in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0014] Figure 1 is the front view of a multifunctional chip testing device of the present invention.

[0015] Figure 2 is the schematic internal structure diagram of a multifunctional chip testing device of the present invention.

[0016] Figure 3 is the schematic structural diagram of a test fixing frame in a multifunctional chip testing device of the present invention.

[0017] Figure 4 is the schematic structural diagram of a test slide, a horizontal electric cylinder screw rod, and a vertical electric cylinder screw rod in a multifunctional chip testing device of the present invention.

[0018] Figure 5 is the bottom view of a test mechanism in a multifunctional chip testing device of the present invention.

[0019] Figure 6 is the top view of a test mechanism in a multifunctional chip testing device of the present invention.

[0020] Figure 7 is the schematic structural diagram of a follow-up test head mechanism in a multifunctional chip testing device of the present invention.

[0021] Figure 8 is the exploded schematic diagram of a preheating mechanism in a multifunctional chip testing device of the present invention.

[0022] 201 - Magnetic levitation guide rail, 202 - Follow-up test head mechanism, 203 - Test bench, 204 - Test slide, 205 - Horizontal electric cylinder screw rod, 206 - Vertical plate, 207 - Vertical electric cylinder screw rod, 208 - Test suction head, 209 - Preheating plate, 210 - Preheating mechanism, 211 - Heating hole, 212 - Test fixing frame, 213 - Rotating motor, 214 - Test rotating table, 215 - Test placement table, 216 - Cleaning brush, 217 - Cleaning telescopic rod, 218 - Needle cleaning paper, 219 - Test mechanism, 220 - Follow-up test component, 221 - Follow-up electric cylinder screw rod, 222 - Follow-up fixing table, 223 - Follow-up test head, 224 - Ceramic heating ring, 225 - Conductive plate, 226 - Air groove, 227 - Air inlet joint, 228 - Planar camera, 229 - Plane mirror, 230 - Test position, 231 - Test mounting plate, 232 - Test fixing sleeve, 233 - Test needle, 234 - Test slide bar, 235 - Test cross plate, 236 - Test telescopic rod, 237 - Suction pipe cylinder, 238 - Suction pipe body, 239 - Test flying shooting camera. Detailed implementation manners

[0023] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present invention and should not be construed as a limitation of the present invention.

[0024] Please refer to Figures 1 to 8, the present invention provides a multi-functional chip testing device, including a magnetic levitation guide rail 201, a follow-up test head 223 mechanism 202 and a test bench 203. Five test sliders 204 adapted to the magnetic levitation guide rail 201 are arranged on the magnetic levitation guide rail 201. A horizontal electric cylinder screw rod 205 is arranged on the test slider 204. A vertical plate 206 is arranged at the mobile end of the horizontal electric cylinder screw rod 205. A vertical electric cylinder screw rod 207 is arranged on one side of the vertical plate 206. A test suction head 208 is arranged at the mobile end of the vertical electric cylinder screw rod 207. A preheating plate 209 is arranged at one end of the vertical plate 206. A preheating mechanism 210 is arranged inside the preheating plate 209. The preheating plate 209 has heating holes 211, and the test suction head 208 extends into the heating holes 211. Four test fixing frames 212 and four test flying shooting cameras 239 are arranged on the test bench 203. A test rotating table 214 is arranged inside the test fixing frame 212 through a rotating motor 213. Test placing tables 215 are arranged at both ends of the test rotating table 214. A cleaning brush 216 is arranged at one end of the test rotating table 214. A cleaning telescopic rod 217 is arranged at the other end of the test rotating table 214. A cleaning needle paper 218 is arranged at the output end of the cleaning telescopic rod 217. Four test mechanisms 219 are arranged on one side of the test bench 203. The magnetic levitation guide rail 201 is fixedly connected to the test bench 203 and is located on the other side of the test bench 203. The preheating plates 209 at four of the test sliders 204 are arranged towards the corresponding test placing tables 215. The follow-up test head 223 mechanism 202 is fixedly connected to the test bench 203 and is located on one side of the test bench 203. The test end of the follow-up test bench 203 is connected to the test end of the corresponding test mechanism 219.

[0025] In this embodiment, by integrating components such as the magnetic levitation guide rail 201, the follow-up test head 223 mechanism 202 and the test bench 203, efficient and accurate testing of the chip is achieved. The test slider 204 on the magnetic levitation guide rail 201 can stably and quickly move the test suction head 208 between the preheating plate 209 and the test mechanism 219, improving the test efficiency. At the same time, the design of the preheating plate 209 enables the chip to reach the required temperature before testing, thus ensuring the accuracy of the test. In addition, the test rotating table 214 and the cleaning mechanism on the test bench 203 can automatically complete actions such as placing, rotating and cleaning the chip, further improving the automation degree of the test.

[0026] Furthermore, the follow-up test head 223 mechanism 202 includes a follow-up test component 220, a follow-up electric cylinder screw 221 and a follow-up fixed table 222. The test end of the follow-up test component 220 is provided with a follow-up test head 223. The follow-up test component 220 is fixedly connected to the follow-up electric cylinder screw and is located at the moving end of the follow-up electric cylinder screw 221. The follow-up electric cylinder screw 221 is fixedly connected to the follow-up fixed table 222 and is located in the follow-up fixed table 222. The follow-up test component 220 is located above the follow-up fixed table 222. The follow-up fixed table 222 is also fixedly connected to the test table 203 and is located on one side of the test table 203.

[0027] In this embodiment, through the cooperation of the follow-up test component 220, the follow-up electric cylinder screw 221 and the follow-up fixed platform 222, when one of the test mechanisms 219 in the device performs a dynamic test, since some dynamic tests require the connection of a hard board, the follow-up test component 220 can move following the hard board, thereby providing flexibility.

[0028] Furthermore, the preheating mechanism 210 includes a ceramic heating ring 224 and a conduction plate 225, the upper end surface of the conduction plate 225 has an air groove 226, one end of the air groove 226 is connected to an air inlet connector 227, and the air inlet connector 227 extends to the preheating plate 209, the other end of the air groove 226 is connected to a preheating groove, the ceramic heating ring 224 is arranged between the conduction plate 225 and the preheating plate 209, and the ceramic heating ring 224 is electrically heated, and the conduction plate 225 is fixedly connected to the preheating plate 209 and is located below the preheating plate 209.

[0029] In this embodiment, the cooperation of the ceramic heating ring 224 and the conduction plate 225 achieves uniform heating and rapid temperature rise of the chip. At the same time, the design of the gas groove 226 and the preheating groove enables the gas in the heating process to be discharged smoothly to preheat the chip.

[0030] Furthermore, the preheating groove is communicated with the heating hole 211 , and the test adsorption head 208 can pass through the preheating groove and the heating hole 211 .

[0031] In this embodiment, this design enables the test adsorption head 208 to fully contact the heat in the heating hole 211 during the preheating process, thereby achieving rapid preheating of the chip.

[0032] Further, four planar cameras 228 are arranged below the maglev guide rail 201, a plane mirror 229 is arranged in the middle of the test placement table 215, and the plane mirror 229 faces the upper end surface of the corresponding test placement table 215, and the shooting end of the planar camera 228 faces the refraction end of the plane mirror 229.

[0033] In this embodiment, through this design, the device can perform real-time monitoring and shooting of the chip during the test, so as to timely discover and handle the defects and problems on the chip surface. At the same time, due to the refraction effect of the plane mirror 229, the shooting range of the camera can be expanded and the shooting clarity can be improved, further improving the accuracy and reliability of the test.

[0034] Further, the test mechanism 219 includes a test position 230, a test mounting plate 231 and two test fixing sleeves 232. A plurality of test needles 233 are arranged at the test end of the test position 230. Test slide bars 234 are arranged at both ends of the test mounting plate 231. A test cross plate 235 is arranged below the two test slide bars 234. A test telescopic rod 236 is arranged below the test cross plate 235. The test position 230 is fixedly connected to the test mounting plate 231 and is located above the test mounting plate 231, and the plurality of test needles 233 extend to the lower end surface of the test mounting plate 231. The two test slide bars 234 are respectively slidably connected to the corresponding test fixing sleeves 232 and are located inside the test fixing sleeves 232, and the output end of the test telescopic rod 236 is arranged on one side of the test table 203. The follow-up test assembly 220 is fixedly connected to the corresponding test mounting plate 231 and is located outside the test mounting plate 231, and the test position 230 is connected to the follow-up test head 223. The two test fixing sleeves 232 are respectively fixedly connected to the test table 203 and are located on one side of the test table 203.

[0035] In this embodiment, through the cooperation of the test position 230, the test mounting plate 231 and the test fixing sleeves 232, multi-point testing and precise positioning of the chip are realized. At the same time, the design of the test slide bars 234 and the test telescopic rod 236 enables the test position 230 to be flexibly adjusted according to different test requirements, thereby ensuring the accuracy and adaptability of the test. In addition, the design of the dust suction tube cylinder 237 and the dust suction tube body 238 can also effectively remove the damaged chips generated during the test, further improving the cleanliness and accuracy of the test.

[0036] Further, one end of the test mounting plate 231 is provided with a dust suction tube cylinder 237, the output end of the dust suction tube cylinder 237 is provided with a dust suction tube body 238, and the dust suction tube body 238 is arranged towards the direction of the test rotating table 214.

[0037] In the present invention, the guide rail and the sliding seat used in this design are both driven electrically. The follow-up test assembly 220 and the test position 230 are both prior arts, so the specific structures and working principles will not be elaborated here.

[0038] In the invention, through the test sliding seat 204 on the magnetic levitation guide rail 201, by the synergistic effect of the horizontal electric cylinder screw rod 205 and the vertical electric cylinder screw rod 207, the test suction head 208 is accurately moved into the heating hole 211 of the preheating plate 209. The ceramic heating ring 224 in the preheating mechanism 210 is electrified to heat, and the heat is transferred to the preheating plate 209 through the conduction plate 225, thereby preheating the chip on the test suction head 208. After preheating, the test suction head 208 transfers the chip to the test rotating table 214 on the test bench 203. The test rotating table 214 is driven by the rotating motor 213 to sequentially send the chip to the four test mechanisms 219 for testing. The test mechanism 219 is connected to the follow-up test head 223 through the test needle 233 on the test position 230 to perform multi-point testing on the chip. During the testing process, the planar camera 228 below the magnetic levitation guide rail 201 and the plane mirror 229 on the test placement table 215 cooperate to capture the image of the chip surface in real time to ensure the accuracy of the test. At the same time, the cleaning brush 216 and the cleaning needle paper 218 at one end of the test rotating table 214 can automatically clean the test needle 233 to ensure the continuity and stability of the test. After the test is completed, the dust suction tube cylinder 237 and the dust suction tube body 238 are started to remove the dust, impurities and damaged chips generated during the test, and keep the test environment clean. The whole test process is efficient, accurate and has a high degree of automation.

[0039] The above-disclosed is only a preferred embodiment of the present invention. Of course, it cannot be used to limit the scope of the rights of the present invention. Those of ordinary skill in the art can understand the whole or part of the processes of the above embodiments, and the equivalent changes made according to the claims of the present invention still fall within the scope covered by the present invention.

Claims

1. A multifunctional chip testing device, characterized in that it includes a magnetic levitation guide rail, a follow-up test head mechanism and a test bench. Five test sliders adapted to the magnetic levitation guide rail are arranged on the magnetic levitation guide rail. A horizontal electric cylinder screw rod is arranged on the test slider. A vertical plate is arranged at the mobile end of the horizontal electric cylinder screw rod. A vertical electric cylinder screw rod is arranged on one side of the vertical plate. A test suction head is arranged at the mobile end of the vertical electric cylinder screw rod. A preheating plate is arranged at one end of the vertical plate. A preheating mechanism is arranged inside the preheating plate. The preheating plate has heating holes, and the test suction head extends into the heating holes. Four test fixing frames and four test flying shooting cameras are arranged on the test bench. A test rotating table is arranged in the test fixing frame through a rotating motor. Test placing tables are arranged at both ends of the test rotating table. A cleaning brush is arranged at one end of the test rotating table. A cleaning telescopic rod is arranged at the other end of the test rotating table. A cleaning needle paper is arranged at the output end of the cleaning telescopic rod. Four test mechanisms are arranged on one side of the test bench. The magnetic levitation guide rail is fixedly connected to the test bench and is located on the other side of the test bench. The preheating plates at four of the test sliders are arranged towards the corresponding test placing tables. The follow-up test head mechanism is fixedly connected to the test bench and is located on one side of the test bench. The test end of the follow-up test bench is connected to the test end of the corresponding test mechanism.

2. The multifunctional chip testing device according to claim 1, characterized in that the follow-up test head mechanism includes a follow-up test component, a follow-up electric cylinder screw rod and a follow-up fixed table. A follow-up test head is arranged at the test end of the follow-up test component. The follow-up test component is fixedly connected to the follow-up electric cylinder screw rod and is located at the mobile end of the follow-up electric cylinder screw rod. The follow-up electric cylinder screw rod is fixedly connected to the follow-up fixed table and is located inside the follow-up fixed table. The follow-up test component is located above the follow-up fixed table. The follow-up fixed table is also fixedly connected to the test bench and is located on one side of the test bench.

3. The multifunctional chip testing device according to claim 2, characterized in that the preheating mechanism includes a ceramic heating ring and a conduction plate. An air groove is arranged on the upper end surface of the conduction plate. An air inlet joint is communicated with one end of the air groove, and the air inlet joint extends to the preheating plate. A preheating groove is communicated with the other end of the air groove. The ceramic heating ring is arranged between the conduction plate and the preheating plate, and the ceramic heating ring is electrified for heating. The conduction plate is fixedly connected to the preheating plate and is located below the preheating plate.

4. The multifunctional chip testing device according to claim 3, characterized in that the preheating groove is communicated with the heating hole, and the test suction head can pass through the preheating groove and the heating hole.

5. The multifunctional chip testing device according to claim 4, characterized in that Four planar cameras are arranged below the magnetic levitation guide rail. A plane mirror is arranged in the middle of the test placement table, and the plane mirror is arranged towards the upper end surface of the corresponding test placement table. The shooting end of the planar camera is arranged towards the refraction end of the plane mirror.

6. The multi-functional chip testing device according to claim 5, wherein The testing mechanism includes a testing position, a testing mounting plate, and two testing fixing sleeves. A plurality of testing needles are arranged at the testing end of the testing position. Testing slide rods are arranged at both ends of the testing mounting plate. A testing cross plate is arranged below the two testing slide rods. A testing telescopic rod is arranged below the testing cross plate. The testing position is fixedly connected to the testing mounting plate and is located above the testing mounting plate, and a plurality of the testing needles extend to the lower end surface of the testing mounting plate. The two testing slide rods are respectively slidably connected to the corresponding testing fixing sleeves and are located within the testing fixing sleeves, and the output end of the testing telescopic rod is arranged on one side of the testing table. The follow-up testing component is fixedly connected to the corresponding testing mounting plate and is located outside the testing mounting plate, and the testing position is connected to the follow-up testing head. The two testing fixing sleeves are respectively fixedly connected to the testing table and are located on one side of the testing table.

7. The multi-functional chip testing device according to claim 6, wherein A dust suction tube cylinder is arranged at one end of the testing mounting plate. The output end of the dust suction tube cylinder is provided with a dust suction tube body, and the dust suction tube body is arranged towards the direction of the testing rotary table.

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