Junction temperature testing tool, junction temperature testing method, power module control method and vehicle
By connecting the driving board and the power module to be tested, the problems of inconsistent lead lengths and copper drain interference are solved, more accurate junction temperature testing and higher temperature rise curve accuracy are achieved, and the risk of power module damage is reduced.
Patent Information
- Application Number
- CN202510464372.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-14
- Publication Date
- 2025-07-11
AI Technical Summary
In the existing IGBT junction temperature testing methods, inconsistent lead welding lengths lead to inconsistent door-level miscellaneousness, affecting the accuracy of the test results, and the driving board is disturbed when placed above the three-phase copper bar, resulting in large test errors.
The junction temperature test tooling is used, and the tooling plate is connected to the drive plate and the power module to be tested through the tooling plate to ensure the consistent door-level miscellaneousness of the upper and lower bridge arms, and the driving plate and the three-phase copper strip are staggered to avoid inconsistent lead lengths and interference from the copper strip.
It improves the accuracy and accuracy of the junction temperature test results, reduces the error of the temperature rise curve, and reduces the probability of power module damage.
Smart Images
Figure CN120294528A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of motor controllers, and more particularly, to a junction temperature testing tooling, a junction temperature testing method, a power module control method, and a vehicle. Background Art
[0002] As a key component of a motor controller, the IGBT mainly functions to achieve energy conversion and transmission. By controlling the different conduction states of the six tubes of the IGBT through a drive circuit, direct current is converted into alternating current to drive the motor.
[0003] The junction temperature of the IGBT is a very important parameter for the IGBT. Currently, the general method for testing the junction temperature of the IGBT is to adopt the NTC embedding method, or to make the power module into a black module, and then manually connect the signal terminal 1 of the power module to the signal hole 3 on the drive board through a lead 3. However, this method has the following disadvantages:
[0004] First, the welding lengths of the leads are inconsistent, resulting in inconsistent gate inductance, and further leading to inaccurate junction temperature test results.
[0005] Second, the drive board needs to be placed directly above the three-phase copper busbar, so that the junction temperature test will be interfered by the three-phase copper busbar, and the interference is large. Summary of the Invention
[0006] The purpose of the present application is to provide a junction temperature testing tooling, a junction temperature testing method, a power module control method, and a vehicle, which are used to improve the junction temperature test results of the power module.
[0007] In a first aspect, the present invention provides a junction temperature testing tooling, which includes: a tooling board, a power module to be tested, and a drive board;
[0008] The tooling board is connected to the drive board
[0009] The power module to be tested is connected to the tooling board;
[0010] The tooling board includes a gate trace circuit for the upper transistor and a gate trace circuit for the lower transistor, wherein the gate inductance generated by the gate trace circuit for the upper transistor is equal to the gate inductance generated by the gate trace circuit for the lower transistor.
[0011] The junction temperature test tooling of the first aspect of the present application does not need to use leads to connect the terminals of the driver board with the terminals of the power module to be tested, but instead connects the driver board with the power module to be tested through a tooling board, thereby avoiding inconsistent welding lengths of the leads. At the same time, the gate-level inductance generated by the routing loop of the upper tube gate level of the tooling board is equal to the gate-level inductance generated by the routing loop of the lower tube gate level, thereby making the gate-level inductance of the upper and lower bridge arms in the driver board consistent, thereby avoiding inaccurate junction temperature test results caused by inconsistent gate-level inductance of the upper and lower bridge arms, thereby improving the accuracy of the junction temperature test results.
[0012] In an optional implementation, the length of the routing loop of the upper tube gate level is equal to the length of the routing loop of the lower tube gate level.
[0013] This optional implementation manner can make the gate-level noise of the upper and lower bridge arms in the driving board consistent by setting the length of the routing loop of the upper tube gate level to be equal to that of the lower tube gate level.
[0014] In an optional implementation, the tooling plate and the power module to be tested are connected by welding.
[0015] This optional implementation method can use welding as a connection method between the tooling board and the power module to be tested, wherein the welding method can shorten the length of the gate-level loop, thereby reducing the gate-level noise, and further improving the accuracy of the junction temperature test results. In addition, the welding method is simpler to operate than the lead connection method, and when the power module to be tested or the driver board needs to be replaced, it can be replaced more promptly.
[0016] In an optional embodiment, the tooling plate is welded to the driving plate.
[0017] This optional implementation method can use welding as a connection method between the tooling board and the driver board, wherein the welding method can shorten the length of the gate-level loop, thereby reducing the gate-level noise, and further improving the accuracy of the junction temperature test results. In addition, the welding method is simpler to operate than the lead connection method, and when the power module or driver board to be tested needs to be replaced, it can be replaced more promptly.
[0018] In an optional embodiment, the tooling board is provided with a copper column, and the copper column is welded to the driving board.
[0019] This optional implementation method uses copper pillars to weld the tooling board and the driving board, which facilitates the welding operation.
[0020] In an optional implementation, the driving board is mounted on the rear of the tooling board so that the driving board is staggered from the position of the three-phase copper busbar of the power module to be tested.
[0021] In this alternative embodiment, the drive board can be installed at the tail of the tooling board, so that the position of the drive board is staggered from the positions of the three-phase copper bars of the power module to be tested, thereby avoiding interference caused by the three-phase copper bars during the junction temperature test, and further improving the accuracy of the junction temperature test results.
[0022] In an alternative embodiment, the drive board and the tooling board are an integral board.
[0023] In this alternative embodiment, the drive board and the tooling board can be an integral board, which can further reduce the gate inductance and thus further improve the accuracy of the junction temperature test results.
[0024] Second, the present invention provides a junction temperature test method, which is applied to the junction temperature test tooling as described in any one of the foregoing embodiments. The method includes:
[0025] Obtaining junction temperature test data of the power module to be tested based on the junction temperature test tooling;
[0026] Fitting a temperature rise curve of the power module to be tested based on the junction temperature test data of the power module to be tested.
[0027] The method of the second aspect of the present application can obtain junction temperature test data of the power module to be tested based on the junction temperature test tooling, and then can fit a temperature rise curve of the power module to be tested based on the junction temperature test data of the power module to be tested. Compared with the existing temperature rise curves, the temperature rise curve of the present application is obtained based on the junction temperature test tooling of the present application. Therefore, this temperature rise curve has higher accuracy.
[0028] Third, the present invention provides a power module control method, which includes:
[0029] Obtaining a temperature rise curve of the power module to be tested, where the temperature rise curve of the power module to be tested is obtained based on the junction temperature test method as described in the foregoing embodiments;
[0030] Controlling the power module to be tested based on the temperature rise curve of the power module to be tested.
[0031] In this alternative embodiment, a temperature rise curve of the power module to be tested can be obtained, where the temperature rise curve of the power module to be tested is obtained based on the junction temperature test method as described in the foregoing embodiments, and then the power module to be tested can be controlled based on the temperature rise curve of the power module to be tested. Since the temperature rise curve has higher accuracy, the probability of damage to the power module to be tested is lower.
[0032] Fourth, the present invention provides a vehicle, which includes an in-vehicle controller for executing the power module control method as described in the foregoing embodiments.
[0033] The vehicle of the fourth aspect of this application has advantages such as a lower probability of damaging the power module to be tested. BRIEF DESCRIPTION OF THE DRAWINGS
[0034] In order to more clearly illustrate the technical solutions of the embodiments of this application, the drawings required for the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.
[0035] Figure 1 is a schematic structural diagram of a junction temperature test tooling provided by an embodiment of this application;
[0036] Figure 2 is a schematic structural diagram of a tooling plate disclosed by an embodiment of this application;
[0037] Figure 3 is a schematic structural diagram of another tooling plate disclosed by an embodiment of this application;
[0038] Figure 4 is a schematic flowchart of a power module control method disclosed by an embodiment of this application;
[0039] Figure 5 is a schematic flowchart of a power module control method disclosed by an embodiment of this application.
[0040] Reference numerals: power module to be tested 1, tooling plate 2, and drive board 3. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0041] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the drawings in the embodiments of this application. Obviously, the described embodiments are some, but not all, of the embodiments of this application. Usually, the components of the embodiments of this application described and illustrated in the drawings here can be arranged and designed in various different configurations.
[0042] In the description of this application, it should be noted that the orientation or positional relationship indicated by terms such as "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of this application is usually placed during use. It is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. In addition, terms such as "first", "second", etc. are only used for descriptive distinction and cannot be understood as indicating or implying relative importance.
[0043] In the description of the present application, it should also be noted that, unless otherwise clearly specified and limited, the terms "arrangement" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.
[0044] The junction temperature of the IGBT is a very important parameter for the IGBT. At present, the general test method for the junction temperature of the IGBT is to adopt the NTC embedded method, or to make the power module into a black module, and then manually connect the signal terminal 1 of the power module with the signal hole 3 on the drive board through the lead 3. However, this method has the following disadvantages: First, the welding lengths of the leads are inconsistent, resulting in inconsistent gate inductance, and further leading to inaccurate junction temperature test results. Second, the drive board needs to be placed directly above the three-phase copper busbar, and thus the junction temperature test will be interfered by the three-phase copper busbar, and this interference is large.
[0045] Therefore, the present application provides a junction temperature test tooling. It does not need to use leads to connect the terminals of the drive board with the terminals of the power module to be tested, but connects the drive board with the power module to be tested through the tooling board. Thus, the inconsistent welding lengths of the leads can be avoided. At the same time, the gate inductance generated by the wiring loop of the upper-tube gate of the tooling board is equal to the gate inductance generated by the wiring loop of the lower-tube gate, and thus the gate inductances of the upper and lower bridge arms in the drive board can be made consistent, and further the inaccurate junction temperature test results caused by inconsistent gate inductances of the upper and lower bridge arms can be avoided, thereby improving the accuracy of the junction temperature test results.
[0046] The junction temperature test method of the present application can obtain the junction temperature test data of the power module to be tested based on the junction temperature test tooling, and then can fit the temperature rise curve of the power module to be tested based on the junction temperature test data of the power module to be tested. Compared with the existing temperature rise curves, the temperature rise curve of the present application is obtained based on the junction temperature test tooling of the present application. Therefore, this temperature rise curve has higher accuracy.
[0047] The power module control method of the present application can control the power module to be tested based on the temperature rise curve of the power module to be tested. Since the temperature rise curve has higher accuracy, the probability of damage to the power module to be tested is lower.
[0048] The vehicle of the present application can make the probability of damage to the power module smaller.
[0049] Please refer to Figure 1 , Figure 1 which is a schematic structural diagram of a junction temperature test tooling provided by an embodiment of the present application. As Figure 1As shown in the figure, the junction temperature test tooling of the embodiment of the present application includes: a tooling board 2, a power module 1 to be tested, and a drive board 3; the tooling board is connected to the drive board, and the power module to be tested is connected to the tooling board.
[0050] The tooling board includes a gate trace circuit for the upper transistor and a gate trace circuit for the lower transistor. Among them, the gate stray inductance generated by the gate trace circuit for the upper transistor is equal to the gate stray inductance generated by the gate trace circuit for the lower transistor.
[0051] The junction temperature test tooling of the embodiment of the present application does not need to use leads to connect the terminals of the drive board to the terminals of the power module to be tested. Instead, the drive board and the power module to be tested are connected through the tooling board, which can avoid inconsistent welding lengths of the leads. At the same time, the gate stray inductance generated by the gate trace circuit for the upper transistor of the tooling board is equal to the gate stray inductance generated by the gate trace circuit for the lower transistor, which can make the gate stray inductances of the upper and lower bridge arms in the drive board consistent, and further avoid inaccurate junction temperature test results caused by inconsistent gate stray inductances of the upper and lower bridge arms, thereby improving the accuracy of the junction temperature test results.
[0052] In the embodiment of the present application, the power module to be tested can refer to an IGBT power module for testing or a MOSFET power module for testing.
[0053] In the embodiment of the present application, the tooling board can be a PCB board. Among them, the PCB board is printed with traces for signal transmission. At the same time, the tooling board is provided with pads through which it can be connected to the power module to be tested and the drive board.
[0054] In the embodiment of the present application, the drive board is a circuit board for driving the power module, and it can achieve electrical signal transmission with the power module through the traces of the tooling board.
[0055] In the embodiment of the present application, the gate trace circuit for the upper transistor refers to the trace connecting the upper bridge arm of the power module and the drive board, and the gate trace circuit for the lower transistor refers to the trace connecting the lower bridge arm of the power module and the drive board.
[0056] In the embodiment of the present application, as an alternative implementation, please refer to Figure 2 , Figure 2 is a schematic structural diagram of a tooling board disclosed in the embodiment of the present application. As Figure 2 shown, the length of the gate trace circuit for the upper transistor is equal to the length of the gate trace circuit for the lower transistor.
[0057] In this alternative implementation, by setting the lengths of the gate trace circuit for the upper transistor and the gate trace circuit for the lower transistor to be equal, the gate stray inductances of the upper and lower bridge arms in the drive board can be made consistent.
[0058] For the above optional embodiments, gate stray inductance refers to the core parasitic parameters during the switching process of power devices (such as IGBTs, SiC MOSFETs).
[0059] For the above optional embodiments, in addition to setting the lengths of the trace loops of the upper gate and the lower gate to be equal, the difference in the lengths of the trace loops of the upper gate and the lower gate can also be set within a reasonable range.
[0060] In an embodiment of the present application, as an optional embodiment, the connection method between the tooling board and the power module to be tested is welding.
[0061] This optional embodiment can use welding as the connection method between the tooling board and the power module to be tested. Among them, the welding method can shorten the length of the gate loop, thereby reducing the gate stray inductance and further improving the accuracy of the junction temperature test results. In addition, compared with the connection method using leads, the welding method is more simple in operation, and thus when it is necessary to replace the power module or the drive board to be tested, it can be replaced more timely.
[0062] For this optional embodiment, the shorter the length of the gate loop, the smaller the gate stray inductance.
[0063] For this optional embodiment, the welding of the tooling board and the power module to be tested may refer to directly welding the connection terminals of the tooling board and the pre-embedded terminals of the power module to be tested with solder at the corresponding pads.
[0064] In an embodiment of the present application, as an optional embodiment, the tooling board is welded to the drive board.
[0065] This optional embodiment can use welding as the connection method between the tooling board and the drive board. Among them, the welding method can shorten the length of the gate loop, thereby reducing the gate stray inductance and further improving the accuracy of the junction temperature test results. In addition, compared with the connection method using leads, the welding method is more simple in operation, and thus when it is necessary to replace the power module or the drive board to be tested, it can be replaced more timely.
[0066] In an embodiment of the present application, the welding of the tooling board and the drive board may refer to directly welding the connection terminals of the tooling board and the pre-embedded terminals of the drive board with solder at the corresponding pads.
[0067] In an embodiment of the present application, as an optional embodiment, the tooling board is provided with copper posts, and the copper posts are welded to the drive board.
[0068] This optional embodiment welds the tooling board and the drive board through copper posts, which is convenient for welding operation.
[0069] For an alternative embodiment, the copper pillars facilitate aligning and welding the tooling board with the drive board. The entire welding operation process is simpler compared to using lead wire connection, facilitating the replacement of the drive board or the power module under test.
[0070] In an alternative embodiment, the drive board is installed at the tail of the tooling board, such that the position of the drive board is offset from the position of the three-phase copper busbars of the power module under test.
[0071] In this alternative embodiment, the drive board can be installed at the tail of the tooling board, with its position offset from the position of the three-phase copper busbars of the power module under test, so as to avoid interference generated by the three-phase copper busbars during the junction temperature test, thereby further improving the accuracy of the junction temperature test results.
[0072] For this alternative embodiment, the power module under test is provided with three-phase copper busbars. If the drive board is connected to the power module under test using lead wires, the drive board needs to be placed directly above the power module under test, which will cause the three-phase copper busbars to affect the junction temperature performance and have an impact on the junction temperature test results. Therefore, the position of the drive board needs to be offset from the position of the three-phase copper busbars of the power module under test to avoid interference generated by the three-phase copper busbars during the junction temperature test, and by setting it at the tail, the position of the drive board can be offset from the three-phase copper busbars.
[0073] In an embodiment of the present application, as an alternative embodiment, please refer to Figure 3 , Figure 3 which is a schematic structural diagram of another tooling board disclosed in the embodiment of the present application. As shown in Figure 3 , the drive board and the tooling board are an integral board.
[0074] In this alternative embodiment, the drive board and the tooling board can be an integral board, which can further reduce the gate inductance, thereby further improving the accuracy of the junction temperature test results.
[0075] For this alternative embodiment, making the drive board and the tooling board an integral board means drawing the traces of the drive board and the tooling board on a single circuit board. With this design, the gate inductance is smaller.
[0076] In addition, please refer to Figure 4 , Figure 4 which is a schematic flowchart of a power module control method disclosed in the embodiment of the present application. This method is applied to the junction temperature test tooling as described in any one of the foregoing embodiments. The method of the embodiment of the present application includes the following steps:
[0077] S101. Obtain junction temperature test data of the power module under test based on the junction temperature test tooling;
[0078] S102. Fit the temperature rise curve of the power module to be tested based on the junction temperature test data of the power module to be tested.
[0079] The method of the embodiment of the present application can obtain the junction temperature test data of the power module to be tested based on the junction temperature test tooling, and then can fit the temperature rise curve of the power module to be tested based on the junction temperature test data of the power module to be tested. Compared with the existing temperature rise curves, the temperature rise curve of the present application is obtained based on the junction temperature test tooling of the present application. Therefore, this temperature rise curve has higher accuracy.
[0080] In addition, please refer to Figure 5 , Figure 5 which is a schematic flow chart of a power module control method disclosed in an embodiment of the present application. As Figure 5 shown, this power module control method includes the following steps:
[0081] S201. Obtain the temperature rise curve of the power module to be tested, where the temperature rise curve of the power module to be tested is obtained based on the junction temperature test method as described in the foregoing embodiment;
[0082] S202. Control the power module to be tested based on the temperature rise curve of the power module to be tested.
[0083] This optional embodiment can obtain the temperature rise curve of the power module to be tested, where the temperature rise curve of the power module to be tested is obtained based on the junction temperature test method as described in the foregoing embodiment, and then can control the power module to be tested based on the temperature rise curve of the power module to be tested. Since the temperature rise curve has higher accuracy, the probability of damage to the power module to be tested is lower.
[0084] In addition, an embodiment of the present application provides a vehicle, which includes an in-vehicle controller for executing the power module control method as described in the foregoing embodiment.
[0085] The vehicle of the embodiment of the present application has advantages such as a lower probability of damage to the power module to be tested.
[0086] It should be noted that, without conflict, the features in the embodiments of the present application can be combined with each other.
[0087] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A junction temperature test tooling, characterized in that, The junction temperature test fixture shown includes: a fixture board, a power module to be tested, and a driver board; The tooling plate is connected to the driving plate; The power module to be tested is connected to the tooling board; The tooling board includes a routing loop at the upper tube gate level and a routing loop at the lower tube gate level, wherein the gate-level inductance generated by the routing loop at the upper tube gate level is equal to the gate-level inductance generated by the routing loop at the lower tube gate level.
2. The junction temperature testing tooling according to claim 1, wherein The length of the wiring loop of the upper tube gate level is equal to the length of the wiring loop of the lower tube gate level.
3. The junction temperature testing tooling according to claim 1, characterized in that The tooling plate and the power module to be tested are connected by welding.
4. The junction temperature testing tooling according to claim 1, wherein, The tooling plate is welded to the driving plate.
5. The junction temperature testing tooling according to claim 4, characterized in that, The tooling plate is provided with a copper column, and the copper column is welded to the driving plate.
6. The junction temperature testing tooling according to claim 1, characterized in that, The driving board is installed at the tail of the tooling board so that the driving board and the three-phase copper busbar of the power module to be tested are staggered.
7. The junction temperature test tooling according to claim 1, wherein, The driving plate and the tooling plate are an integrated plate.
8. A method for measuring the junction temperature, characterized in that, The method is applied to the junction temperature test tool as described in any one of claims 1 to 7, and the method comprises: Acquiring junction temperature test data of the power module to be tested based on the junction temperature test tool; A temperature rise curve of the power module to be tested is fitted based on the junction temperature test data of the power module to be tested.
9. A power module control method, characterized in that, The power module control method comprises: Obtaining a temperature rise curve of the power module to be tested, wherein the temperature rise curve of the power module to be tested is obtained based on the junction temperature testing method according to claim 8; The power module to be tested is controlled based on the temperature rise curve of the power module to be tested.
10. A vehicle, characterized in that, The vehicle comprises an on-board controller, and the on-board controller is used to execute the power module control method as claimed in claim 9.