Electric connector and combination thereof
By designing a step-shaped support table in the center of the backplane, the problems of difficulty in processing the backplane and poor electrical contact are solved, and the stable connection between the backplane and the circuit board and high-speed signal transmission are achieved.
Patent Information
- Application Number
- CN202410036235.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-10
- Publication Date
- 2025-07-11
AI Technical Summary
The backplane of existing chip connectors is difficult to process and poor electrical contact, resulting in poor connection between the circuit board and the chip connector.
A back panel is designed, with an upwardly projecting step-shaped support table at the center, including a top surface and a step surface lower than the top surface, for fitting with the circuit board and fixing it by a locking member. The contact area between the support table and the circuit board surface is greater than the arc-shaped contact surface, providing reliable support force for high-speed signal transmission.
The backplane is easy to process, has good electrical contact performance, and can evenly disperse the downforce of the chip module, ensuring stable transmission of high-speed signals.
Smart Images
Figure CN120302527A_ABST
Abstract
Description
Technical Field
[0001] The present invention discloses an electrical connector and its combination, particularly related to a chip connector.
Background Art
[0002] The prior art related to the present invention can refer to CN214505804U. The backplane of this chip connector is provided with an arched area and an installation area. The arched area can be pre-pressed against the center of the circuit board to improve the packaging quality. The arched area is a gradually changing arc along the length direction of the backplane, making the processing of the backplane relatively difficult. In addition, there are significant differences in the lengths of the arched area in the length and width directions of the backplane, resulting in significant differences in the effects of the arched area on the circuit board in the length and width directions, and the electrical contact between the circuit board and the chip connector is still not ideal.
[0003] Therefore, it is necessary to provide a new electrical connector combination to solve the above problems.
Summary of the Invention
[0004] The purpose of the present invention is to provide an electrical connector and its combination, which has an improved backplane.
[0005] To solve the above technical problems, the present invention adopts the following technical solutions: An electrical connector combination includes a chip connector installed on the upper surface of a circuit board, a backplane attached to the lower surface of the circuit board, and a locking member for fixing the backplane and the circuit board to each other. It is characterized in that: the backplane is provided with a support platform protruding upward at its central position, the support platform is in a stepped shape, including a top surface and a stepped surface lower than the top surface.
[0006] To solve the above technical problems, the present invention can also adopt the following technical solutions: A backplane is used for installing on the lower surface of a circuit board, abutting against the circuit board to make up for possible bending problems of the circuit board, thereby reducing the impact on the chip connector installed on the upper surface of the circuit board. The upper surface of the backplane is attached to the lower surface of the circuit board. It is characterized in that: the backplane is provided with a support platform protruding upward, the support platform is in a stepped shape, including a top surface and a stepped surface lower than the top surface, and the top surface is provided with an opening penetrating up and down.
[0007] Compared with the prior art, the present invention has the following beneficial effects: The stepped surface at the central position of the backplane is a plane, which can be fitted with the lower surface of the circuit board, making the backplane easy to process and having good electrical contact performance. In addition, the contact area of the stepped surface is larger than that of the arc-shaped contact surface, providing a reliable supporting force and facilitating high-speed signal transmission.
Description of the Drawings
[0008] Figure 1 It is a perspective view of a prior art electrical connector.
[0009] Figure 2 is Figure 1 A perspective view from another angle.
[0010] Figure 3 is a perspective view of the improved backplane in the present invention.
[0011] Figure 4 is a perspective view of the backplane of another embodiment in the present invention.
[0012] Figure 5 is Figure 3 a side view of
[0013] Figure 6 is Figure 3 a cross-sectional view along line A - A.
[0014]
Description of Component Symbols
[0015] circuit board 10 supporting platform 91 upper surface of the circuit board 11 stepped surface 912 upper surface of the circuit board 12 top surface 911 chip connector 20 chamfered hypotenuse 913 cover plate 21 opening 92 fixed seat 22 protruding part 93 backplane 30、9 first locking hole 931 arch area 31 ear part 94 installation area 32 second locking hole 941 locking part 40 locking area 95 chip module 50
[0016] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.
Specific Embodiments
[0017] Please refer to Figure 1-2 As shown, the existing electrical connector assembly of our company includes a circuit board 10, a chip connector 20 mounted on the upper surface 11 of the circuit board, a backplane 30 attached to the lower surface 12 of the circuit board, and a locking member 40 for fixing the backplane 30 and the circuit board 10 to each other. A chip module 50 is installed in the chip connector 20. The backplane 30 has an upwardly protruding arched area 31 at its central position, and the outer ring is a horizontal mounting area 32.
[0018] Please refer to Figure 3-6As shown, the company further designs an improved backplane 9. The backplane 9 is provided with a support platform 91 protruding upward at its central position. The support platform 91 is in a stepped shape, including a top surface 911 and a stepped surface 912 lower than the top surface. In order to make the backplane 9 better fit the lower surface 12 of the circuit board 10, the top surface 911 is rectangular in shape to adapt to the shape of the chip connector 20. Preferably, the support platform 91 is integrally formed with the backplane 9. The stepped surface 912 surrounds the top surface 911 in a circle, and its shape matches that of the top surface 911. The top surface 911 is provided with an opening 92 penetrating up and down in the middle. In this embodiment, the support platform 91 is stamped from one side of the backplane 9 to make the protruding heights of the stepped surface 912 and the top surface 911 consistent. In actual applications, the sizes and thicknesses of chips from different manufacturers vary, and the protruding heights of the two can be changed according to requirements to adapt to different working environments. In this embodiment, the opening 92 is in a square structure. Correspondingly, the top surface 911 and the stepped surface 912 are also square. And the abutting area of the top surface 911 for contacting the circuit board 10 is larger than the abutting area of the stepped surface 912 and the circuit board 10. In this way, the downward pressure received by the chip module 20 can be evenly dispersed, so that the terminals (not shown) in the chip connector, especially the high-speed differential pair terminals, can be more fully electrically connected to the circuit board 10 to meet the transmission requirements of high-frequency signals.
[0019] Please refer to Figure 1-2 As shown, when the cover plate 21 of the chip connector is pressed down to the chip 50, the circuit board 10 will warp downward, and the support platform 91 will abut upward. The lower surface 12 of the circuit board 10 abuts against the top surface 911 and the stepped surface 912 successively. Preferably, refer to Figure 4 As shown, chamfered bevels 913 are further formed at the four corners of the top surface 911 and the stepped surface 912 to blunt the sharpness of each corner, which can reduce the repeated scratches on the circuit board 10 due to frequent downward pressing. In this embodiment, the angles of the two chamfered bevels 913 are the same, which can make the surface 12 of the circuit board 10 press down smoothly between the corners of the top surface 911 and the stepped surface 912 and better protect the circuit board 10.
[0020] Please refer to Figure 3-4As shown, protruding portions 93 extend from the four corners of the backplane 9. The protruding portions 93 are provided with first locking holes 931 penetrating up and down. Then, the chip connector 20, the circuit board 10, and the backplane 9 can be locked together by locking members. In this embodiment, the protruding portions 93 at the four corners are arranged in mirror symmetry with the center line of the opening 92 as the axis, and the protruding portions 93 on the same side are connected in pairs to form locking regions 95 on both sides of the backplane 9. Preferably, the first locking holes 931 in the locking regions 95 on the same side are located on the same straight line, and the first locking holes 931 are opened near the support platform 91, which is convenient for the backplane 9 to abut against the terminals in the chip connector 10 after locking; further, in the middle position of the locking region 95, ears 94 protruding outward and second locking holes 941 penetrating through the ears are further provided. Then, the cover plate 21 is installed on the fixing base 22 to which the backplane 9 has been attached. Preferably, the second locking holes 941 on both sides are located on the same straight line, and the second locking holes 941 are opened far from the support platform 91. When locking misalignment occurs, the influence on the electrical connection between the terminals and the circuit board 10 can be reduced. In this embodiment, the locking members are all mutually matched screws (not shown) and nuts.
[0021] The above are only some embodiments of the present invention, not all embodiments. Any equivalent changes made by those of ordinary skill in the art to the technical solutions of the present invention by reading the specification of the present invention are covered by the claims of the present invention.
Claims
1. An electrical connector assembly, comprising a chip connector mounted on the upper surface of a circuit board, a backplane attached to the lower surface of the circuit board, and a locking member for fixing the backplane and the circuit board to each other, characterized in that: The backplane is provided with a support platform protruding upward at its central position. The support platform is in a stepped shape and includes a top surface and a stepped surface lower than the top surface.
2. The electrical connector assembly according to claim 1, wherein: The top surface is rectangular, and the stepped surface surrounds the top surface in a circle, and its shape matches that of the top surface.
3. The electrical connector assembly as described in claim 2, wherein: The top surface and the stepped surface further form chamfered hypotenuses at their four corners.
4. The electrical connector assembly according to claim 1 or 2, wherein: The top surface is provided with an opening penetrating up and down in the middle.
5. The electrical connector assembly as claimed in claim 4, wherein: The opening is a square structure.
6. The electrical connector assembly according to claim 1 or 2, wherein: The support platform and the backplane are integrally formed. The backplane extends protruding parts at its four corners. The protruding parts are provided with locking holes penetrating up and down. The locking parts are mutually matched screws and nuts.
7. A backplane, which is used to be mounted on the lower surface of a circuit board, abuts against the circuit board to make up for possible bending problems of the circuit board, thereby reducing the impact on a chip connector mounted on the upper surface of the circuit board. The upper surface of the backplane is adhered to the lower surface of the circuit board, and is characterized in that: The backplane is provided with a support platform protruding upward. The support platform is in a stepped shape and includes a top surface and a stepped surface lower than the top surface. The top surface is provided with an opening penetrating up and down.
8. The backplane according to claim 7, characterized in that: The top surface is rectangular, the stepped surface surrounds the top surface in a circle, and its shape matches that of the top surface. The opening is square.
9. The backplane according to claim 8, characterized in that: The top surface and the stepped surface are provided with chamfered hypotenuses at their four corners.
10. The backplane according to claim 7, characterized in that: The support platform and the backplane are integrally formed.