Wiring board

Abstract

The purpose of the present invention is to improve coupling efficiency between optical wiring on a wiring board and an optical component and to facilitate mounting of the optical component. A wiring board (1) according to an embodiment includes: an electrical wiring portion (2) including an insulating layer and a conductor layer; an optical wiring region (A2) provided on one surface (2a) of the electrical wiring section (2); and a component region (A1) which is provided on one surface (2a) of the electrical wiring section (2) and in which a component (E1) can be disposed. The support member (7) is formed on one surface (2a) of the electrical wiring section (2), and is disposed so as to straddle the optical wiring region (A2) and the member region (A1).

Description

Technical Field

[0001] The present invention relates to a wiring substrate. Background Art

[0002] A substrate for mounting an optical component having an optical wiring formed on its surface is disclosed in Patent Document 1. The optical wiring is directly disposed on the surface of the substrate. An optical semiconductor element (light-emitting element or light-receiving element) mounted on the substrate is disposed so as to be optically coupled to the core of the waveguide via a support formed on the surface of the substrate.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Patent Laid-Open No. 5-196844 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] In the substrate disclosed in Patent Document 1, there is a case where the core of the optical wiring and the optical axis of the optical semiconductor element are not properly aligned in the thickness direction of the substrate. In the case of improper alignment, it is considered that the core of the waveguide and the light-emitting portion or light-receiving portion of the optical semiconductor element cannot be optically coupled with sufficient efficiency. In addition, when the substrate is made of an organic material, the substrate sometimes expands and contracts due to heat such as the heat generation of the optical semiconductor element and the usage conditions. In the case of expansion and contraction, in the wiring substrate on which the optical semiconductor element is mounted, the core of the waveguide and the optical axis of the optical semiconductor element sometimes shift not only in the thickness direction of the substrate but also in the direction parallel to the surface of the substrate. As a result, if a position shift occurs, it is considered that the optical coupling efficiency decreases.

[0008] Means for Solving the Problems

[0009] The wiring substrate of the present invention includes: an electrical wiring portion including an insulating layer and a conductor layer; an optical wiring region provided on one surface of the electrical wiring portion; and a component region provided on the one surface of the electrical wiring portion and capable of arranging components. A support member is formed on the one surface of the electrical wiring portion and is disposed so as to straddle the optical wiring region and the component region.

[0010] According to an embodiment of the present invention, it is possible to suppress a position shift between the optical wiring of the wiring substrate and an optical component optically coupled to the optical wiring, and it is possible to improve the coupling efficiency or suppress its decrease. In addition, sometimes the mounting of the optical component to the wiring substrate becomes easy. Brief Description of the Drawings

[0011] Figure 1It is a cross-sectional view showing an example of a wiring substrate according to an embodiment of the present invention.

[0012] Figure 2 It is Figure 1 an enlarged view of part II.

[0013] Figure 3 It is a partial top view showing an example of the optical wiring portion of Figure 1 when viewed from above.

[0014] Figure 4A It is a cross-sectional view showing an example of the manufacturing process of the optical wiring portion in the wiring substrate of the embodiment.

[0015] Figure 4B It is a cross-sectional view showing an example of the manufacturing process of the optical wiring portion in the wiring substrate of the embodiment.

[0016] Figure 4C It is a cross-sectional view showing an example of the manufacturing process of the optical wiring portion in the wiring substrate of the embodiment.

[0017] Figure 5 It is a cross-sectional view showing Modification 1 of the wiring substrate according to the embodiment of the present invention.

[0018] Figure 6A It is Figure 5 an enlarged view of an example of part VI.

[0019] Figure 6B It is Figure 5 an enlarged view of another example of part VI.

[0020] Figure 7 It is a cross-sectional view showing Modification 2 of the wiring substrate according to the embodiment of the present invention.

[0021] Figure 8 It is Figure 7 an enlarged view of part VIII.

[0022] Figure 9 It is Figure 7 a partial top view showing an example of the optical wiring portion when viewed from above.

[0023] Figure 10 It is a cross-sectional view showing Modification 3 of the wiring substrate according to the embodiment of the present invention.

[0024] Figure 11 It is a cross-sectional view showing Modification 4 of the wiring substrate according to the embodiment of the present invention. Detailed Description of the Embodiment

[0025] A wiring substrate according to an embodiment of the present invention will be described with reference to the accompanying drawings. Figure 1FIG. 1 is a cross-sectional view of a wiring substrate 1 showing an example of a wiring substrate as one embodiment. In Figure 2 FIG. 2 Figure 1 shows an enlarged view of part II. Figure 3 FIG. 3 Figure 1 shows an example of a top view of the optical wiring portion included in the wiring substrate 1. "Top view" means observing the wiring substrate 1 of the embodiment with a line of sight along its thickness direction. In addition, the wiring substrate 1 is merely an example of the wiring substrate of the present embodiment. The stacked structure of the wiring substrate of the embodiment, the number of conductor layers, and the number of insulating layers are not limited to Figure 1 the stacked structure of the wiring substrate 1 and the number of conductor layers and insulating layers included in the wiring substrate 1. In addition, in each of the drawings referred to in the following description, in order to facilitate understanding of the disclosed embodiment, sometimes a specific part is enlarged and depicted, and regarding the size and length, sometimes the respective structural elements are not depicted at an accurate ratio to each other.

[0026] As Figure 1 shown, the wiring substrate 1 includes an electrical wiring portion 2. The electrical wiring portion 2 includes an insulating layer and a conductor layer. Specifically, Figure 1 the example electrical wiring portion 2 includes: a core substrate 30 having two surfaces 30a and 30b opposed to each other in its thickness direction; an insulating layer 21 and a conductor layer 11, which are sequentially stacked on the surface 30a of the core substrate 30; and an insulating layer 22 and a conductor layer 12, which are sequentially stacked on the surface 30b. Via conductors 26 for connecting the conductor layers to each other are formed in the insulating layer 21 and the insulating layer 22. The core substrate 30 includes an insulating layer 32 and conductor layers 31 formed on both surfaces of the insulating layer 32. Through-hole conductors 33 are provided in the insulating layer 32 to connect the conductor layers 31 on both sides to each other through the insulating layer 32. The inside of the cylindrical through-hole conductor 33 is filled with a filler 34, and the filler 34 is formed of an insulating resin such as epoxy resin or a conductive resin containing metal particles, for example.

[0027] In addition, in the description of the embodiment, the side farther from the insulating layer 32 in the thickness direction of the wiring substrate 1 is also referred to as "upper side" or "above", or simply as "up", and the side closer to the insulating layer 32 is also referred to as "lower side" or "below", or simply as "down". Also, in each conductor layer and each insulating layer, the surface facing away from the insulating layer 32 is also referred to as the "upper surface", and the surface facing the insulating layer 32 side is also referred to as the "lower surface". The thickness direction of the wiring substrate 1 is also referred to as the "Z direction".

[0028] The electrical wiring portion 2 includes a solder resist 23 formed on the surface 30a side of the core substrate 30 and a solder resist 24 formed on the surface 30b side. The surface 2a of the electrical wiring portion 2 is mainly constituted by the upper surface of the solder resist 23, and the surface 2b of the electrical wiring portion 2 is mainly constituted by the upper surface of the solder resist 24. The solder resist 23 covers the necessary portions of the insulating layer 21 and the conductor layer 11, and the solder resist 24 covers the necessary portions of the insulating layer 22 and the conductor layer 12. The solder resist 23 has an opening 23a that exposes a part of the conductor layer 11. Similarly, the solder resist 24 also has an opening 24a that exposes a part of the conductor layer 12.

[0029] The electrical wiring portion 2 includes a component E1 connection portion 4 and a component E2 connection portion 25 formed in the opening 23a of the solder resist 23 in contact with the conductor layer 11. The component E1 connection portion 4 is, for example, a conductor post or a conductive bump. As the conductor post, for example, any metal such as copper or nickel is used to form it. As the conductive bump, for example, a tin-based solder, a gold-based solder, etc. are used to form it. As needed, the component E1 connection portion 4 can also be made into two or more layers. For example, a conductive connection component 4a (refer to Figure 2 ) can be formed on the conductor post using a tin-based solder, a gold-based solder, etc. to make it into two layers. The component E2 connection portion 25 is, for example, a conductor post or a conductive bump. As the conductor post, for example, any metal such as copper or nickel is used to form it. As the conductive bump, for example, a tin-based solder, a gold-based solder, etc. are used to form it. Since the component E2 connection portion 25 is lower than the component E1 connection portion 4, it is preferably formed as a conductive bump.

[0030] The insulating layer 21, the insulating layer 22, and the insulating layer 32 can be formed, for example, using a thermosetting insulating resin such as an epoxy resin, a bismaleimide triazine resin (BT resin), or a phenolic resin. The insulating layer 21, the insulating layer 22, and the insulating layer 32 can also be formed using a thermoplastic insulating resin such as a fluororesin, a liquid crystal polymer (LCP), a polytetrafluoroethylene (PTFE) resin, a polyester (PE) resin, and a modified polyimide (MPI) resin. Although not shown, each insulating layer may include a core material (reinforcing material) formed of glass fiber, aramid fiber, etc., and may also include an inorganic filler composed of fine particles such as silica (SiO2), alumina, or mullite. On the other hand, the solder resist 23 and the solder resist 24 are formed, for example, of a photosensitive epoxy resin, a polyimide resin, etc.

[0031] The conductor layer 11, the conductor layer 12, the conductor layer 31, the via conductor 33, and the through-hole conductor 26 can be formed using any metal such as copper or nickel. Each of these conductors is Figure 1 simplified and depicted as a single layer in the figure, but can also be made into a multi-layer structure including two or more metal layers. For example, the conductor layer 11 and the conductor layer 12 can also be a two-layer structure including an electroless plating layer and an electroplating layer.

[0032] The conductor layer 11, the conductor layer 12, and the conductor layer 31 include arbitrary conductor patterns. In Figure 1 the example of, the conductor layer 11 includes the conductor pads 11a and 11b. The conductor pads 11a and 11b are exposed within the openings 23a of the solder resist 23. Thus, Figure 1 the electrical wiring portion 2 has conductors exposed on one surface 2a, such as the conductor pads 11a and 11b.

[0033] The component E2 is electrically and mechanically connected to the conductor pad 11b via the component E2 connection portion 25. Examples of the component E2 include electronic components such as semiconductor devices that generate electrical signals for causing the component E1 to emit light and / or process electrical signals generated by the component E1. Examples of the component E2 include semiconductor devices, such as general-purpose operational amplifiers, driver ICs, microcomputers, programmable logic devices (PLDs), and the like. The component E2 has, for example, an electrode E2a.

[0034] As Figures 1 - 3 shown, when the wiring substrate 1 is used, the component E1 is also mounted on the wiring substrate 1. Therefore, a component region A1 capable of accommodating the component E1 is provided on the surface 2a of the electrical wiring portion 2. The component E1 is electrically and mechanically connected to the conductor pad 11a via the component E1 connection portion 4. The component region A1 is covered by the component E1 in a plan view when the wiring substrate 1 is used. In the component region A1, the component E1 is arranged via the component E1 connection portion 4 and the support member 7. The component E1 mounted in the component region A1 is an electrical component including a light-receiving element and / or a light-emitting element having a photoelectric conversion function. The component E1 has, for example, an electrode E1a and a light-receiving portion or a light-emitting portion E1b (see Figure 2 ).

[0035] In the illustrated example, the light-receiving portion or the light-emitting portion E1b has a light-receiving surface or a light-emitting surface E1c on the end face E1f of the component E1 (see Figure 2 ), and the electrode E1a is provided on the surface of the component E1 facing the electrical wiring portion 2 side. That is, in Figures 1 - 3 the example of, the component E1 is mounted in a so-called face-down manner (flip-chip mounting) such that the surface of the component E1 facing the electrical wiring portion 2 side, except for the portion where the electrode E1a is formed, faces the support member 7. Further, in the component E1, the electrode E1a is provided on the surface of the component E1 opposite to the surface facing the electrical wiring portion 2 side, and the component E1 may also be mounted in a so-called face-up manner such that the surface of the component E1 facing the electrical wiring portion 2 side faces the support member 7. In the case of face-up mounting, the entire surface of the component E1 facing the electrical wiring portion 2 side may face the support member 7.

[0036] As the component E1, a light-receiving element such as a photodiode and a light-emitting element such as a light-emitting diode (LED), an organic light-emitting diode (OLED), a laser diode (LD), and a vertical-cavity surface-emitting laser (VCSEL) are exemplified. When the component E1 is a light-emitting element, the component E1 generates an optical signal (light) based on an electrical signal input to the electrode E1a and emits the light from a light-receiving portion or a light-emitting portion E1b that functions as a light-emitting portion (see Figure 2 ). Further, when the component E1 is a light-receiving element, an electrical signal based on light incident on a light-receiving portion or a light-emitting portion E1b that functions as a light-receiving portion is generated and output from the electrode E1a.

[0037] As Figures 1 - 3 shown, when the wiring substrate 1 is used, the optical wiring portion 3 is also disposed on the wiring substrate 1. Accordingly, an optical wiring region A2 capable of disposing the optical wiring portion 3 is provided on the surface 2a of the electrical wiring portion 2. The optical wiring region A2 is covered by the optical wiring portion 3 in a plan view when the wiring substrate 1 is used. In the optical wiring region A2, the optical wiring portion 3 is disposed on the support member 7. In the illustrated example, the optical wiring portion 3 includes an optical wiring 5 and a support substrate 6. Further, the optical wiring portion 3 may be constituted only by the optical wiring 5 (see Figure 10 and Figure 11 ). In the illustrated example, the optical wiring portion 3 is disposed on the wiring substrate 1 such that the support substrate 6 is disposed on the side of the optical wiring 5 opposite to the electrical wiring portion 2. That is, the optical wiring portion 3 is disposed on the wiring substrate 1 such that the surface 3a on the optical wiring 5 side faces the surface 2a side of the electrical wiring portion 2. The support member 7 is disposed between the electrical wiring portion 2 and the optical wiring portion 3. Further, the support member 7 is disposed between the electrical wiring portion 2 and the support substrate 6 of the optical wiring portion 3. In addition, the support substrate 6 of the optical wiring portion 3 may be disposed between the optical wiring 5 of the optical wiring portion 3 and the electrical wiring portion 2. Further, the support member 7 is disposed not only in the optical wiring region A2 but also in the component region A1. A part or all of the component E1 may be disposed on the upper surface of the support member 7, or all or a part of the optical wiring portion 3 may be disposed on the upper surface of the support member 7.

[0038] The optical wiring 5 includes a core portion 51 that transmits light and a cladding portion 52 that surrounds the core portion 51. The cladding portion 52 is provided around the core portion 51 and sandwiches the core portion 51 in an arbitrary direction perpendicular to the extending direction of the core portion 51, that is, the light propagation direction in the core portion 51 (+X direction or -X direction, hereinafter also simply referred to as "X direction").

[0039] The cladding portion 52 includes: a first cladding layer 521 that constitutes the portion closer to the support substrate 6 than the core portion 51; and a second cladding layer 522 that constitutes the portion below the first cladding layer 521 and on the side farther from the support substrate 6 than the first cladding layer 521. The second cladding layer 522 covers the lower surface (the surface on the side opposite to the support substrate 6) and the side surface of the core portion 51.

[0040] The core portion 51 and the cladding portion 52 are formed of materials having appropriate refractive indices. The core portion 51 and the cladding portion 52 can be constituted by, for example, organic materials, inorganic materials, or hybrid materials including organic materials and inorganic materials such as inorganic polymers. Examples of inorganic materials include quartz glass and silicon, and examples of organic materials include acrylic resins such as polymethyl methacrylate (PMMA), polyimide resins, polyamide resins, polyether resins, and epoxy resins. The optical wiring 5 made of an organic material is easily lightweight and has high toughness.

[0041] The core portion 51 and the cladding portion 52 can be constituted by different materials from each other, or can be constituted by materials of the same system. In addition, the core portion 51 uses a material having a higher refractive index than the material used for the cladding portion 52 so that light can be totally reflected at the interface between the core portion 51 and the cladding portion 52. The core portion 51 and the cladding portion 52 can also have different refractive indices from each other after being formed of materials having the same refractive index through appropriate processing.

[0042] The optical wiring 5 can be formed by any method. As an example, the optical wiring 5 is formed on the support substrate 6. For example, the optical wiring 5 and the support substrate 6 can be joined by curing the material of the semi-cured cladding portion 52 on the support substrate 6. In addition, the optical wiring 5 can be formed independently of the support substrate 6 and fixed to the support substrate 6 using an arbitrary adhesive (not shown), for example. As in Figures 1 - 3 the example, in the optical wiring portion 3 and the component E1, when the end face 3f of the optical wiring portion 3 and the end face E1f of the component E1 are optically connected to each other, the end face 5f of the optical wiring 5 and the end face 6f of the support substrate 6 can be formed to be coplanar (refer to Figure 2 ). That is, the end face 3f of the optical wiring portion 3 constituted by the end face 5f of the optical wiring 5 and the end face 6f of the support substrate 6 can be formed in a planar shape. In addition, the optical wiring 5 can be formed only on the electrical wiring portion 2 (refer to Figure 10 and Figure 11 ).

[0043] The support substrate 6, for example, has a coefficient of thermal expansion lower than that of the optical wiring 5. When the core portion 51 and the cladding portion 52 have different coefficients of thermal expansion from each other, the support substrate 6, for example, has a coefficient of thermal expansion lower than the average value of the coefficients of thermal expansion of the core portion 51 and the cladding portion 52. Preferably, the coefficient of thermal expansion of the support substrate 6 is lower than the lower one of the coefficient of thermal expansion of the core portion 51 and the coefficient of thermal expansion of the cladding portion 52. The support substrate 6 can be made of any material in such a manner that it has a coefficient of thermal expansion lower than that of the optical wiring 5 and preferably has a higher rigidity than the optical wiring 5. For example, the support substrate 6 may also have a flexural rigidity higher than that of the optical wiring 5. Examples of the material of the support substrate 6 include glass materials such as soda-lime glass, borosilicate glass, and quartz glass, various ceramics such as alumina, silicon nitride, and silicon oxide, and semiconductors such as silicon and germanium.

[0044] The coefficient of thermal expansion of the optical wiring 5 is, for example, 10 ppm / °C to 100 ppm / °C. In contrast, the coefficient of thermal expansion of the support substrate 6 is, for example, 3 ppm / °C to 10 ppm / °C. The flexural rigidity of the support substrate 6 is, for example, 1.1 times or more the flexural rigidity of the optical wiring 5 and 2 times or less the flexural rigidity of the electrical wiring portion 2. It is considered that the optical wiring 5 can be handled, the shape can be maintained, and the optical wiring portion 3 can follow the warpage of the electrical wiring portion 2 to some extent. The thickness of the support substrate 6 is not particularly limited and can be set, for example, to be about 30 μm or more and 1000 μm or less.

[0045] The support member E1 and the support member 7 of the optical wiring portion 3 are formed on one surface 2a of the electrical wiring portion 2. Specifically, it is formed on the upper surface of the solder resist 23. The support member 7 is disposed so as to straddle the component region A1 and the optical wiring region A2. Therefore, when using the wiring substrate 1, the component E1 and the optical wiring portion 3 are disposed on the wiring substrate 1 on the common support member 7 that straddles the component region A1 and the optical wiring region A2. In the illustrated example, the support member 7 is formed in the component region A1 and the optical wiring region A2 in a plan view. That is, the support member 7 is formed to cover at least a part of the component region A1 and the optical wiring region A2 in a plan view. The shape and size of the support member that covers the component region A1 and the optical wiring region A2 are not particularly limited. Moreover, a component E1 connection portion 4 is formed on one surface 2a of the electrical wiring portion 2 close to the support member 7. As a result, the adjacent component E1 connection portion 4 is connected to the electrode E1a of the component E1. In addition, the support member 7 may also be formed on one surface 2a of the electrical wiring portion 2 where the solder resist 23 is not formed.

[0046] The shape and size of the support member 7 can be appropriately changed according to the shape and size of the component area A1, the shape and size of the optical wiring area A2, the arrangement of the component area A1 relative to the electrical wiring portion 2, and the arrangement of the optical wiring area A2 relative to the electrical wiring portion 2. For example, in the case where the component E1 is mounted face-up on the electrical wiring portion 2, the support member 7 may be formed over the entire component area A1. Additionally, in the case where the entire optical wiring portion 3 is disposed on the surface 2a of the electrical wiring portion 2, the support member 7 may be formed over the entire optical wiring area A2. In the Figures 1 - 3 example, one end face 7e of the support member 7 is located near one end face 2e of the electrical wiring portion 2 (see Figure 1 and Figure 3 ). Specifically, one end face 7e of the support member 7 is substantially coplanar with one end face 2e of the electrical wiring portion 2. It should be noted that one end face 7e of the support member 7 may be arranged to be inside one end face 2e of the electrical wiring portion 2, or one end face 7e of the support member 7 may be arranged to protrude beyond one end face 2e of the electrical wiring portion 2.

[0047] On the other hand, in the Figure 1 wiring substrate 1, at one end face 2e of the electrical wiring portion 2, the end faces of the optical wiring 5 and the support substrate 6 protrude outward beyond one end face 2e of the electrical wiring portion 2. Connectors C are mounted on the protruding portions of the optical wiring 5 protruding from the electrical wiring portion 2 and the protruding portions of the support substrate 6 protruding from the electrical wiring portion 2. The upper housing C1 of the connector C is mounted on the support substrate 6, and the lower housing C2 of the connector C is mounted on the optical wiring 5. The optical fiber F held between the upper housing C1 and the lower housing C2 is optically coupled to the core portion 51 of the optical wiring 5. Since the optical wiring 5 and the support substrate 6 protrude outward beyond one end face 2e of the electrical wiring portion 2, the connector C can be easily mounted.

[0048] The support member 7 is not particularly limited and may be, for example, plate-shaped, film-shaped, etc. The support member 7 may also have rigidity to maintain a specified thickness. As an example, the support member 7 is film-shaped. In the case of using a film, the surface of the support member 7 facing the electrical wiring portion 2 may have adhesiveness so as to be fixed to the electrical wiring portion 2. Additionally, in the case of using a film, the opposite surface of the surface of the support member 7 facing the electrical wiring portion 2 (the surface facing the component E1 side and the optical wiring portion 3 side) may have adhesiveness so as to be fixed to the component E1 and the optical wiring portion 3.

[0049] The material constituting the support member 7 is not particularly limited and may be a resin material, a metal material, an inorganic material, or a composite material of these materials. As the material constituting the support member 7, a resin material is preferably used. Examples of the resin material constituting the support member 7 include thermosetting resins, thermoplastic resins, UV curable resins, etc. In addition, these resins may be used alone or in combination of multiple resins. Examples of the combination of multiple resins include the combination of a thermosetting resin and a UV curable resin, the combination of a thermosetting resin and a thermoplastic resin, etc. Specific examples of the resin constituting the support member 7 are not particularly limited, and epoxy resins, polyester resins, polyimide resins, olefin resins, etc. may be cited. Examples of the thermosetting resin constituting the support member 7 are not particularly limited, and epoxy resins, polyester resins, polyimide resins, olefin resins, phenolic resins, polyurethane resins, silicone resins, etc. may be cited. Examples of the thermoplastic resin constituting the support member 7 are not particularly limited, and polyethylene resins, polypropylene resins, polyvinyl chloride resins, polystyrene resins, ABS resins, methacrylic resins, acrylic resins, polyacetal resins, polycarbonate resins, PET resins, PPS resins, polystyrene resins, etc. may be cited. Examples of the UV curable resin constituting the support member 7 are not particularly limited, and epoxy resins, acrylic resins, etc. may be cited. A part of the thermosetting resin may be substituted with an acryloyl group.

[0050] When the material constituting the support member 7 is a resin material, its glass transition temperature is preferably 50°C to 200°C. The thermal expansion rate of the support member 7 is, for example, 30 ppm / °C to 200 ppm / °C. The thickness of the support member 7 is not particularly limited and is about 5 μm or more and 200 μm or less.

[0051] The support member 7 may also contain particles such as inorganic particles, metal particles, resin particles, etc. The size of the particles contained in the support member is not particularly limited and is, for example, about 0.1 μm or more and 20 μm or less. By containing particles in the support member 7, an improvement in the rigidity and heat resistance of the support member can be imparted.

[0052] The support member 7 can be a single-layer structure or a multi-layer structure with two or more layers. When the support member 7 is a single-layer structure, the support member 7 is disposed on the wiring substrate 1, for example, by forming a film using film lamination, printing, potting, etc., or by placing a pre-formed sheet. When the support member 7 is a multi-layer structure, the support member 7 is formed, for example, by a two-layer structure having an adhesive layer provided on one side of a resin layer as a base layer, or by a three-layer structure having adhesive layers provided on both sides of a resin layer as a base layer. When the support member 7 is a two-layer structure, the support member 7 is disposed, for example, such that the adhesive layer provided on one of its sides faces the electrical wiring portion 2 side. In addition, the support member 7 is adhered to the electrical wiring portion 2 using the adhesive layer. When the support member 7 is a three-layer structure, it is configured such that the adhesive layer provided on one of its sides faces the electrical wiring portion 2 side, and the adhesive layer provided on the other side faces the component E1 side and the optical wiring portion 3 side. In addition, the support member 7 is adhered to the electrical wiring portion 2, the component E1, and the optical wiring portion 3 using the adhesive layer.

[0053] There is no particular limitation on the metal material constituting the support member 7, and examples thereof include copper, aluminum, nickel, titanium, beryllium, iron, platinum, stainless steel, etc. The support member 7 can be constituted by covering a metal material as a core material with a resin material, or can be constituted by two or more layers including a layer made of a metal material and a layer made of a resin material having adhesiveness to the metal material. By using a metal material, heat dissipation can be imparted to the support member 7.

[0054] There is no particular limitation on the inorganic material constituting the support member 7, and examples thereof include glass, semiconductor materials, etc. The support member 7 can be constituted by covering an inorganic material as a core material with a resin material, or can be constituted by two or more layers including a layer made of an inorganic material and a layer made of a resin material having adhesiveness to the inorganic material. By using an inorganic material, rigidity and heat expansion resistance can be imparted to the support member 7.

[0055] Continuing to refer to Figure 2 and Figure 3 , an example of the optical and electrical connection methods between the electrical wiring portion 2, the component E1, and the optical wiring portion 3 will be further described. As Figure 2 shown, the height (dimension in the Z direction) of the component E1 connection portion 4 of the electrical wiring portion 2 is adjusted so that the lower surface of the component E1 is flush with the upper surface of the support member 7. In addition, the position of the core portion 51 of the optical wiring portion 3 is adjusted to be flush with the position of the light receiving portion or the light emitting portion E1b of the component E1 in the thickness direction (Z direction) of the electrical wiring portion 2. As Figure 2 and Figure 3As shown, when the component E1 and the optical wiring portion 3 are arranged on the wiring substrate 1, they are arranged on a common support member 7 that spans the component region A1 and the optical wiring region A2 on one surface 2a of the electrical wiring portion 2. The optical wiring portion 3 and the component E1 are positioned on one surface 2a of the electrical wiring portion 2 in such a manner that optical coupling is performed in a state where the light receiving portion or the light emitting portion E1b and the core portion 51 are arranged on the common support member 7. Therefore, it is considered that after being arranged on the wiring substrate 1, the position deviation in the Z direction between the light receiving portion or the light emitting portion E1b of the component E1 arranged on the common support member 7 and the core portion 51 of the optical wiring portion 3 becomes smaller.

[0056] That is, when the optical wiring portion 3 and the component E1 are arranged on different support members, the difference in dimensional errors in the Z direction between the support member supporting the optical wiring portion 3 and the support member supporting the component E1 sometimes becomes large. Therefore, the optical coupling efficiency between the optical wiring portion 3 and the component E1 sometimes decreases. In contrast, in the present embodiment, the optical wiring portion 3 and the component E1 are arranged on the common support member 7 that spans the component region A1 and the optical wiring region A2, so it is difficult to be affected by the dimensional error of the support member 7. Therefore, it is considered that the core portion 51 of the optical wiring portion 3 and the light receiving portion or the light emitting portion E1b of the component E1 are easily positioned at positions where optical coupling can be performed with sufficient efficiency.

[0057] When the optical wiring portion 3 and the component E1 are arranged on the wiring substrate 1, for example, they are sometimes heated from the outside by a reflow process or the like. In addition, the optical wiring portion 3 generates heat due to the propagation of optical signals in the core portion 51, and the component E1 sometimes generates heat due to light reception from the core portion 51 or light emission from the core portion 51. Thus, it is considered that the optical wiring portion 3 and the component E1 are affected by heat when being arranged on the wiring substrate 1 and after being arranged on the wiring substrate 1, either by being heated from the outside or by generating heat from the optical wiring portion 3 and the component E1. When the optical wiring portion 3 and the component E1 are arranged on different support members, it is considered that due to heating from the outside when being arranged on the wiring substrate 1 and after being arranged on the wiring substrate 1 and the heat generation based on the optical wiring portion 3 and the component E1, the support member on which the optical wiring portion 3 is arranged and the support member on which the component E1 is arranged thermally expand independently of each other. When the two support members expand independently of each other, the support member of the arranged optical wiring portion 3 and the support member of the component E1 follow different expansion directions, and thus sometimes move in different directions from the desired arranged positions. Therefore, the position deviation between the position of the core portion 51 of the optical wiring portion 3 and the position of the light receiving portion or the light emitting portion E1b of the component E1 occurs not only in the Z direction but also sometimes in the directions (X direction and Y direction) along one surface 2a of the electrical wiring portion 2. Therefore, the optical coupling efficiency between the optical wiring portion 3 and the component E1 sometimes decreases.

[0058] In contrast, in the present embodiment, the optical wiring portion 3 and the component E1 are arranged on the common support member 7 that straddles the component region A1 and the optical wiring region A2. Therefore, due to the external heating when the wiring substrate 1 is arranged and the heat generation from the optical wiring portion 3 and the component E1 after the wiring substrate 1 is arranged, the support member 7 is affected by heat. When the support member 7 expands due to the influence of heat, it is also considered that the optical wiring portion 3 and the component E1 move in the same direction through the common support member 7. Therefore, it is considered that even when the support member 7 expands, the relative positions of the core portion 51 of the optical wiring portion 3 and the light receiving portion or the light emitting portion E1b of the component E1 are difficult to change. As a result, if the optical wiring portion 3 and the component E1 are positioned at positions where they can be optically coupled with sufficient efficiency, it is speculated that the reduction in the optical coupling efficiency between the optical wiring portion 3 and the component E1 is suppressed when the optical wiring portion 3 is arranged and after the optical wiring portion 3 is arranged.

[0059] As Figure 3 shown, Figures 1 - 3 the optical wiring portion 3 of Figure 3 includes a plurality of core portions 51. The plurality of core portions 51 are arranged in parallel in a direction intersecting the direction of light propagation (X direction) in the core portion 51. Moreover, in Figure 3 the example of Figure 2 , the interval between the plurality of core portions 51 increases as it approaches the other end portion 3n in the X direction of the optical wiring portion 3 from one end portion 3m. Therefore, the arrangement interval of the core portions 51 at the other end portion 3n of the optical wiring portion 3 is larger than the arrangement interval at one end portion 3m of the optical wiring portion 3. For example, in some cases, the plurality of optical fibers optically coupled to the core portions 51 at the other end portion 3n may not be able to be set to an interval as small as the arrangement interval of the plurality of light receiving portions or light emitting portions E1b (refer to Figure 2 ) of the component E1. In Figure 3 the example of Figure 2 , the arrangement interval of the core portions 51 at the other end portion 3n of the optical wiring portion 3 among the plurality of core portions 51 is configured to be larger than the arrangement interval at one end portion 3m of the optical wiring portion 3. The core portions 51 at one end portion 3m of the optical wiring portion 3 are optically coupled to the component E1 (refer to Figure 2 ), but it is considered that optical coupling can be appropriately performed without an additional conversion unit such as an interval. In addition, it is considered that the core portions 51 at the other end portion 3n of the optical wiring portion 3 are externally connected through optical fibers or the like, but optical coupling can be appropriately performed without an additional conversion unit such as an interval.

[0060] Next, with reference to Figures 4A - 4C , an example of a method for manufacturing a wiring substrate according to the manufacturing embodiment will be described by taking the case of manufacturing Figure 1 the wiring substrate 1 as an example. In addition, in Figures 4A - 4C the example of

[0061] Figure 4A and Figure 4B shows an example of a method for manufacturing an optical wiring portion 3 disposed on a wiring substrate 1. In the manufacture of the optical wiring portion 3, first, as Figure 4A shown, a semiconductor substrate such as a glass plate, a ceramic plate, or silicon is prepared as a support substrate 6.

[0062] Next, as Figure 4B shown, an optical wiring 5 is formed on the surface of the support substrate 6. Specifically, first, a first cladding 521 of a cladding portion 52 is formed on the surface of the support substrate 6. The first cladding 521 is formed using a resin material, for example. The formation of the first cladding 521 is performed by coating using spin coating or the like, film lamination, or the like. In the case of film molding, the first cladding 521 is thermally laminated on the surface of the support substrate 6.

[0063] After that, a core portion 51 is formed on the first cladding 521. The core portion 51 is formed using a resin material, for example. The formation of the core portion 51 is performed by coating using spin coating or the like, film lamination, or the like. In the case of film molding, the core portion 51 is thermally laminated on the entire surface of the first cladding 521 and patterned into a desired shape and number of core portions 51 by photolithography.

[0064] In addition, a second cladding 522 is formed on the first cladding 521 and the core portion 51. The second cladding 522 is formed using a resin material, for example. The formation of the second cladding 522 is performed by coating using spin coating or the like, film lamination, or the like. In the case of film molding, the second cladding 522 is thermally laminated on the first cladding 521 and the core portion 51. As a result, a cladding portion 52 composed of the first cladding 521 and the second cladding 522 is formed. Then, the core portion 51, the cladding portion 52, and the support substrate 6 are cut by cutting or laser processing or the like so as to have a predetermined shape and size in a top view. Through the above steps, the optical wiring portion 3 composed of the optical wiring 5 and the support substrate 6 is completed. The end face 3f of the obtained optical wiring portion 3, that is, the end face 5f of the optical wiring 5 and the end face 6f of the support substrate 6 are formed to be coplanar by cutting.

[0065] In addition, after forming the optical wiring 5, the support substrate 6 may be removed from the optical wiring portion 3. In the case of removing the support substrate 6, the optical wiring portion 3 is composed of the optical wiring 5 (see Figure 10 and Figure 11 ). In order to easily remove the support substrate 6 from the optical wiring portion 3, a release agent (not shown) may be pasted on the surface of the support substrate 6 before forming the optical wiring 5. Alternatively, after forming the optical wiring portion 3 on the surface of the support substrate 6, a laser may be irradiated to the interface between the optical wiring portion 3 (the first cladding 521) and the support substrate 6 to peel the support substrate 6 from the optical wiring 5, thereby removing the support substrate 6 from the optical wiring portion 3.

[0066] Figure 4C Disclosed are a method for manufacturing a wiring substrate 1 and a method for disposing an optical wiring portion 3 on the wiring substrate 1. In the manufacture of the wiring substrate 1, first, an electrical wiring portion 2 is prepared. As an example, a general method for forming a multilayer wiring substrate including a core substrate is used to prepare the electrical wiring portion 2. For example, a core substrate 30 is formed by forming via conductors 33 on a double-sided copper-clad laminate including an insulating layer 32 or by forming a conductor layer 31 using a subtractive method. Then, an insulating layer 21, an insulating layer 22, conductor layers 11, 12, and via conductors 26 are formed by thermocompression bonding of an insulating resin film to both surfaces of the core substrate 30 and formation of a conductor layer based on a semi-additive method (see Figure 1 ). Further, a solder resist 23 and a solder resist 24 are formed by laminating an epoxy resin, a polyimide resin, or the like or by coating based on these resins, and openings 23a and 24a are formed by photolithography, for example. And, in the opening 23a where the conductor pad 11b is exposed, a component E1 connection portion 4 is formed as a conductor post made of copper or nickel by plating treatment. As needed, on the component E1 connection portion 4, a conductive connection member 4a made of a tin-based solder, a gold-based solder, or the like is formed by coating with a paste containing metal powder and reflow treatment. Although not shown in Figure 4C , in the opening 23a where the conductor pad 11b is exposed, a component E2 connection portion 25 is formed as a conductive bump made of a tin-based solder or a gold-based solder by, for example, disposing balls and reflow treatment (see Figure 1 ).

[0067] After that, a support member 7 is disposed on one surface 2a of the electrical wiring portion 2. For example, a support member 7 formed in a film shape is disposed on the one surface 2a. The support member 7 is formed of an arbitrary plate-like member such as a material containing an epoxy resin and inorganic particles, for example. The support member 7 may also be fixed to the electrical wiring portion 2.

[0068] As Figure 4C shown, when the wiring substrate 1 is used, the optical wiring portion 3 is disposed on the wiring substrate 1. When disposed on the wiring substrate 1, the surface 3a on the optical wiring 5 side and the surface 3b on the support substrate 6 side of the optical wiring portion 3 are inverted up and down (see Figure 4B and Figure 4C)。That is, the optical wiring 5 of the optical wiring section 3 faces the support member 7 formed on one surface 2a of the electrical wiring section 2. After that, the optical wiring section 3 is arranged on the support member 7. The optical wiring section 3 may be fixed to the support member 7. Alternatively, after the optical wiring section 3 is mounted on the support member 7 by means of an adhesive, the composite member of the optical wiring section 3 and the support member 7 may be arranged on one surface 2a of the electrical wiring section 2. As required, the connector C is provided in such a manner that the optical wiring section 3 is sandwiched between the upper housing C1 and the lower housing C2. For example, the upper housing C1 is mounted on the support substrate 6, and the lower housing C2 is mounted on the optical wiring 5. During the installation of the connector C to the optical wiring section 3, the upper housing C1 and the lower housing C2 are fitted together. In addition, the connector C may also be installed after the optical wiring section 3 is arranged on one surface 2a of the electrical wiring section 2.

[0069] After that, as Figure 1 shown, the component E1 including the optical element is mounted on the wiring substrate 1. The component E2 may also be mounted together with the component E1. The electrode E1a of the component E1 is connected to the component E1 connection portion 4 through the conductive connection member 4a on the component E1 connection portion 4 melted during installation, for example. On the other hand, the light receiving portion or light emitting portion E1b is optically coupled to the exposed portion of the core 51 of the optical wiring section 3. According to the present embodiment, it is considered that both appropriate optical coupling between the light receiving portion or light emitting portion E1b of the component E1 and the core 51 of the optical wiring section 3 and reliable electrical connection and mechanical connection between the electrode E1a of the component E1 and the component E1 connection portion 4 can be achieved.

[0070] Figures 5 - 6B The wiring substrate 1α showing a modification example 1 of the wiring substrate as an embodiment is shown. Figure 5 It is a cross-sectional view of the wiring substrate 1α showing a modification example 1 of the wiring substrate as an embodiment. Figure 6A Shown Figure 5 An example of an enlarged view of part VI is shown, Figure 6B Shown Figure 5 Another example of an enlarged view of part VI is shown. In addition, in Figure 6A and Figure 6B , for ease of explanation, the double-dot chain line in Figure 5 is omitted.

[0071] The wiring substrate 1α includes the same electrical wiring section 2 as the electrical wiring section 2 included in the wiring substrate 1 such as Figure 1 . In addition, in the wiring substrate 1α of Figures 5 - 6B , the same as Figure 1Unlike the wiring substrate 1 etc., the support member 7α extends outward from one end face 2e of the electrical wiring portion 2. Therefore, the support member 7α is arranged so as to protrude from one end face 2e of the electrical wiring portion 2. When protruding from one end face 2e of the electrical wiring portion 2, the support area of the support member 7α for the optical wiring portion 3 increases corresponding to the amount by which the support member 7α protrudes from one end face 2e of the electrical wiring portion 2. In other words, the bonding area of the optical wiring portion 3 based on the support member 7α increases. Therefore, it is considered that the support of the optical wiring portion 3 by the support member 7α is more stable, or the bonding is more stable. Specifically, in Figure 6A the example, the support member 7α is arranged such that one end face 7αe thereof protrudes from one end face 2e of the electrical wiring portion 2. On the other hand, in Figure 6B the example, the support member 7α is arranged such that one end face 7αe thereof is shown to protrude from one end face 2e of the electrical wiring portion 2 and covers a part of one end face 2e of the electrical wiring portion 2. As Figure 6B shown, by the support member 7α covering a part of one end face 2e of the electrical wiring portion 2, the support area of the support member 7α based on the electrical wiring portion 2 increases. In other words, the bonding area of the optical wiring portion 3 based on the support member 7α increases. Therefore, it is considered that the support of the optical wiring portion 3 by the electrical wiring portion 2 is more stable, or the bonding is more stable.

[0072] Figures 7 - 9 Fig. 10 shows a wiring substrate 1β which is a modification example 2 of the wiring substrate as an embodiment. Figure 7 Fig. 11 is a cross-sectional view showing the wiring substrate 1β which is a modification example 2 of the wiring substrate as an embodiment, Figure 8 showing Figure 7 an enlarged view of part VIII. Figure 9 Fig. 18 shows an example of a top view of the optical wiring portion 3β arranged on the Figure 7 wiring substrate 1β.

[0073] An optical wiring portion 3β having a structure similar to that of the Figure 1 etc. optical wiring portion 3 is arranged on the wiring substrate 1β. As Figure 7 shown, at one end portion 3βm in the light propagation direction (X direction) within the core portion 51 of the optical wiring portion 3β, it is exposed from the coating portion 52 and the support substrate 6 on the second cladding 522, which is different from the Figure 1 etc. exemplified optical wiring portion 3. In Figures 7 - 9 the example, one end portion 3βm of the optical wiring portion 3β where the core portion 51 is exposed extends along the X direction.

[0074] As Figure 8As shown, the light-receiving part or the light-emitting part E1βb of the component E1β mounted on the wiring substrate 1β has a light-receiving surface or a light-emitting surface E1βc facing the side and the bottom of the component E1β. The upper surface 51a of the core part 51 exposed from the covering part 52 and the support substrate 6 is positioned to face the light-receiving surface or the light-emitting surface E1βc of the component E1β optically coupled to the core part 51. The component E1β is arranged at one end part 3βm of the optical wiring part 3β such that the light-receiving part or the light-emitting part E1βb faces the upper surface 51a of the core part 51 in the Z direction. That is, the component area A1β and the optical wiring area A2β partially overlap when viewed from above.

[0075] As Figure 8 shown, the upper surface 7βa of a part of the component area A1β in the support component 7β is higher than the upper surface 7βb of the optical wiring area A2β in the support component 7β by an amount equal to the thicknesses of the core part 51 and the second cladding 522 so that the light-receiving surface or the light-emitting surface E1βc of the component E1β is substantially coplanar with the upper surface 51a of the core part 51. In addition, the height (dimension in the Z direction) of the component E1β connection part 4β of the electrical wiring part 2 is adjusted so that the lower surface of the component E1β coincides with the upper surface 7βa of the support component 7β.

[0076] As Figure 8 and Figure 9 shown, when the component E1β and the optical wiring part 3β are arranged on the wiring substrate 1β, a common support component 7β spanning the component area A1β and the optical wiring area A2β is arranged on one surface 2a of the electrical wiring part 2. Similar to the case shown in Figure 1 etc., after being arranged on the wiring substrate 1β, it is considered that the positional deviation in the Z direction between the light-receiving part or the light-emitting part E1βb of the component E1β arranged on the common support component 7β and the core part 51 of the optical wiring part 3β becomes smaller. In addition, if the optical wiring part 3β and the component E1β are positioned at positions where optical coupling can be performed with sufficient efficiency, it is presumed that a decrease in the optical coupling efficiency between the optical wiring part 3β and the component E1β can be suppressed during and after the arrangement of the optical wiring part 3β.

[0077] For example, when the component E1β is a light-receiving element, a part of the light propagating toward the one end part 3βm in the core part 51 leaks out of the upper surface 51a of the core part 51 as evanescent light to the outside of the core part 51 and is incident on the light-receiving part or the light-emitting part E1βb serving as the light-receiving part of the component E1β. Since the upper surface 51a faces the light-receiving surface or the light-emitting surface E1βc of the component E1β without passing through the covering part 52, it is considered that highly efficient optical coupling can be achieved.

[0078] In addition, in the examples of Figures 1 - 3 and Figures 5 - 6B , the optical wiring part 3 includes an optical wiring 5 and a support substrate 6. InFigures 7 - 9 In the example, the optical wiring portion 3β includes the optical wiring 5 and the support substrate 6. In addition, the optical wiring portion 3 and the optical wiring portion 3β may also be composed only of the optical wiring 5.

[0079] Figure 10 Fig. shows a cross-sectional view of the wiring substrate 1γ which is a modified example 3 of the wiring substrate as an embodiment. The support substrate 6 included in the optical wiring portion 3 is not provided in the wiring substrate 1γ, and the optical wiring portion 3γ which is substantially composed only of the optical wiring 5 is included. In addition, in the wiring substrate 1γ, one end face 5e of the optical wiring 5 and one end face 2e of the electrical wiring portion 2 are substantially coplanar. The difference between the wiring substrate 1γ and Figure 1 the wiring substrate 1 shown is that the support substrate 6 is not provided in the optical wiring portion 3γ and the optical wiring 5 does not protrude from one end face 2e of the electrical wiring portion 2. For the structural elements identical to those of the wiring substrate 1 included in the wiring substrate 1γ, Figure 1 the same reference numerals as those marked in Figure 1 are marked or appropriately omitted in Figure 10 , and the repeated description of the same structural elements is omitted. Figure 1

[0080] As shown in Figure 10 , the wiring substrate 1γ forms the optical wiring 5 without providing the support substrate 6 in the optical wiring portion 3γ, but like the Figure 1 wiring substrate 1, it includes the support member 7 that spans the component region A1 and the optical wiring region A2. The optical wiring portion 3γ and the component E1 are arranged on the common support member 7 that spans the component region A1 and the optical wiring region A2. Therefore, the relative positional relationship between the optical wiring portion 3γ and the component E1 is hardly affected by the dimensional error of the support member 7. Therefore, it is considered that the core portion 51 of the optical wiring portion 3γ and the light receiving portion or the light emitting portion E1b of the component E1 are easily positioned at positions where optical coupling can be performed with sufficient efficiency.

[0081] In addition, when the support member 7 expands due to the influence of heat during or after the arrangement of the optical wiring portion 3γ, it is also considered that the optical wiring portion 3γ and the component E1 move in the same direction through the common support member 7. Therefore, it is considered that even when the support member 7 is affected by heat, the relative position between the core portion 51 of the optical wiring portion 3γ and the light receiving portion or the light emitting portion E1b of the component E1 hardly changes. Therefore, if the optical wiring portion 3γ and the component E1 are positioned at positions where optical coupling can be performed with sufficient efficiency, it is speculated that the optical coupling efficiency between the optical wiring portion 3γ and the component E1 hardly decreases during and after the arrangement of the optical wiring portion 3γ.

[0082] ​In the wiring substrate 1γ, one end face 7e of the support member 7 is also substantially coplanar with one end face 2e of the electrical wiring portion 2. Accordingly, one end face 5e of the optical wiring 5, one end face 7e of the support member 7, and one end face 2e of the electrical wiring portion 2 are substantially coplanar. An optical fiber F is connected to the end face 5e of the optical wiring 5 that is substantially coplanar with one end face 2e of the electrical wiring portion 2. Therefore, it is considered that the optical coupling portion with the optical fiber F can be made close to the member E1.

[0083] Figure 11 FIG. shows a cross-sectional view of a wiring substrate 1δ as a modified example 4 of the wiring substrate according to the embodiment. The wiring substrate 1δ does not dispose Figures 7 - 9 the support substrate 6 included in the optical wiring portion 3β, but includes an optical wiring portion 3δ composed substantially only of the optical wiring 5. Further, in the wiring substrate 1δ, Figure 10 similar to the Figures 7 - 9 wiring substrate 1γ, one end face 5e of the optical wiring 5 is substantially coplanar with one end face 2e of the electrical wiring portion 2. The difference between the wiring substrate 1δ and Figure 7 the wiring substrate 1β shown in Figure 11 is that the support substrate 6 is not disposed in the optical wiring portion 3δ and the optical wiring 5 does not protrude from one end face 2e of the electrical wiring portion 2. For structural elements that are the same as those of the wiring substrate 1β included in the wiring substrate 1δ, Figure 7 the same reference numerals as those labeled in

[0084] are labeled or appropriately omitted in Figure 11 to avoid redundant description of the same structural elements. Figure 7 As shown in

[0085] Figure 11 the wiring substrate 1δ forms the optical wiring 5 without disposing the support substrate 6 in the optical wiring portion 3δ, but similar to Figure 7 the wiring substrate 1β, includes a support member 7β that straddles the component region A1β and the optical wiring region A2β. The optical wiring portion 3δ and the component E1β are disposed on the common support member 7β that straddles the component region A1β and the optical wiring region A2β. Therefore, the relative positional relationship between the optical wiring portion 3δ and the component E1β is less likely to be affected by the dimensional error of the support member 7β. Therefore, it is considered that the core portion 51 of the optical wiring portion 3δ and the light receiving portion or the light emitting portion E1βb of the component E1β can be easily positioned at a position where optical coupling can be performed with sufficient efficiency.

[0085] In addition, when the support member 7β expands due to the configuration of the optical wiring portion 3δ or the heat after the configuration of the optical wiring portion 3δ, it is also considered that the optical wiring portion 3δ and the component E1β move in the same direction through the common support member 7β. Therefore, it is considered that even when the support member 7β is affected by heat, the relative position between the core portion 51 of the optical wiring portion 3δ and the light-receiving portion or the light-emitting portion E1βb of the component E1β is difficult to change. Therefore, if the optical wiring portion 3δ and the component E1β are positioned at positions where optical coupling can be performed with sufficient efficiency, it is speculated that the optical coupling efficiency between the optical wiring portion 3δ and the component E1β is difficult to decrease during and after the configuration of the optical wiring portion 3δ.

[0086] In the wiring substrate 1δ, one end face 5e of the optical wiring 5 and one end face 7e of the support member 7β are substantially coplanar. That is, one end face 5e of the optical wiring 5, one end face 7e of the support member 7β, and one end face 2e of the electrical wiring portion 2 are substantially coplanar. In the wiring substrate 1δ, similar to Figure 10 the wiring substrate 1γ, an optical fiber F is connected to one end face 5e of the optical wiring 5 that is substantially coplanar with one end face 2e of the electrical wiring portion 2. Therefore, it is considered that the optical coupling portion with the optical fiber F can be brought close to the component E1β.

[0087] The wiring substrate of the embodiment may be as Figure 10 the wiring substrate 1γ shown and Figure 11 the wiring substrate 1δ shown, without arranging Figure 1 and Figure 7 the support substrate 6 shown, etc., to form the optical wiring portion.

[0088] The wiring substrate of the embodiment is not limited to the structures illustrated in the respective drawings and the structures, shapes, and materials illustrated in this specification. The wiring substrate of the embodiment, particularly the electrical wiring portion, may have any laminated structure. For example, the electrical wiring portion may be a coreless substrate that does not include a core substrate, and the number of conductor layers and the number of insulating layers may be set to any number. The conductor pad 11b may not be formed. The wiring substrate may be provided in a state where either the component or the optical wiring portion is arranged, or in a state where both the component and the optical wiring portion are arranged. That is, in this case, either or both of the component and the optical wiring portion may be included in the wiring substrate.

[0089] Reference Numeral Explanation

[0090] 1, 1α, 1β, 1γ, 1δ: Wiring substrate; 2: Electrical wiring portion; 2a: One surface of the electrical wiring portion; 2e: One end face of the electrical wiring portion; 3, 3β, 3γ, 3δ: Optical wiring portion; 11, 12, 31: Conductor layer; 21, 22, 32: Insulating layer; 4: Component E1 connection portion; 4β: Component E1β connection portion; 4a: Conductive connection component; 5: Optical wiring; 51: Core portion; 52: Cladding portion; 521: First cladding; 522: Second cladding; 6: Support substrate; 7, 7β: Support component; 7e: One end face of the support component; A1, A1β: Component region; A2, A2β: Optical wiring region; E1, E2: Component; E1a, E2a: Electrode; E1b, E1βb: Light receiving portion or light emitting portion; E1c, E1βc: Light receiving surface or light emitting surface.

Claims

1. A wiring substrate, comprising: An electrical wiring portion including an insulating layer and a conductor layer; An optical wiring region provided on one surface of the electrical wiring portion; and A component region provided on the one surface of the electrical wiring portion, capable of accommodating components, wherein A support member is formed on the one surface of the electrical wiring portion and is arranged so as to straddle the optical wiring region and the component region.

2. The wiring substrate according to claim 1, wherein Optical wiring is arranged in the optical wiring region.

3. The wiring substrate according to claim 2, wherein An optical wiring portion including optical wiring and a support substrate is arranged in the optical wiring region, The support substrate is arranged on a side opposite to the electrical wiring portion in the optical wiring.

4. The wiring substrate according to claim 3, wherein The end face of the optical wiring and the end face of the support substrate are formed to be coplanar.

5. The wiring substrate according to claim 2, wherein The support member is arranged so as to protrude from an end of the wiring substrate.

6. The wiring substrate according to claim 1, wherein The optical wiring region and the component region are separated from each other in a plan view.

7. The wiring substrate according to claim 1, wherein The optical wiring region and the component region partially overlap with the support member in a plan view.

8. The wiring substrate according to claim 1, wherein The electrical wiring portion has a connection portion connected to the component optically coupled to the optical wiring.

9. The wiring substrate according to claim 8, wherein The connection portion is formed on the one surface of the electrical wiring portion close to the support member.

10. The wiring substrate according to claim 9, wherein A conductive connection member is formed on the connection portion.

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