Wiring board

Abstract

The purpose of the present invention is to improve coupling efficiency between optical wiring on a wiring board and an optical component and to facilitate mounting of the optical component. A wiring board (1) according to an embodiment includes: an electrical wiring portion (2) including an insulating layer and a conductor layer; an optical wiring region (A2) provided on one surface (2a) of the electrical wiring section (2); and a component region (A1) which is provided on one surface (2a) of the electrical wiring section (2) and in which a component (E1) can be disposed. Optical wiring (5) is disposed on the optical wiring region (A2), and a support substrate (6) is disposed on the optical wiring (5).

Description

Technical Field

[0001] The present invention relates to a wiring substrate. Background Art

[0002] In Patent Document 1, a substrate for mounting an optical component having an optical wiring formed on its surface is disclosed. The optical wiring is directly disposed on the surface of the substrate. An optical semiconductor element (light-emitting element or light-receiving element) mounted on the substrate is arranged to be optically coupled to the core of the waveguide via a support stage formed on the surface of the substrate.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Patent Laid-Open No. 5-196844 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] In the substrate disclosed in Patent Document 1, there is a case where the core of the optical wiring and the optical axis of the optical semiconductor element are not properly aligned in the thickness direction of the substrate. In the case of improper alignment, it is considered that the core of the waveguide and the light-emitting portion or light-receiving portion of the optical semiconductor element cannot be optically coupled with sufficient efficiency. In addition, when the substrate is made of an organic material, the substrate sometimes expands and contracts due to heat such as the heat generation of the optical semiconductor element and the usage conditions. In the case of expansion and contraction, in the wiring substrate on which the optical semiconductor element is mounted, the core of the waveguide and the optical axis of the optical semiconductor element sometimes not only have a positional shift in the thickness direction of the substrate, but also have a positional shift in the direction parallel to the surface of the substrate. As a result, if a positional shift occurs, it is considered that the optical coupling efficiency is reduced.

[0008] Means for Solving the Problems

[0009] The wiring substrate of the present invention includes: an electrical wiring portion including an insulating layer and a conductor layer; an optical wiring region provided on one surface of the electrical wiring portion; and a component region provided on the one surface of the electrical wiring portion and capable of arranging components. An optical wiring is disposed on the optical wiring region, and a support substrate is disposed on the optical wiring.

[0010] According to an embodiment of the present invention, it is possible to suppress a positional shift between the optical wiring of the wiring substrate and an optical component optically coupled to the optical wiring, and it is possible to improve the coupling efficiency or suppress its decrease. In addition, sometimes the mounting of the optical component to the wiring substrate becomes easy. Brief Description of the Drawings

[0011] Figure 1It is a cross-sectional view showing an example of a wiring substrate according to an embodiment of the present invention.

[0012] Figure 2 It is Figure 1 an enlarged view of part II.

[0013] Figure 3 It is a partial top view showing an example of the optical wiring part of Figure 1 when viewed from above.

[0014] Figure 4A It is a cross-sectional view showing an example of the manufacturing process of the optical wiring part in the wiring substrate of the embodiment.

[0015] Figure 4B It is a cross-sectional view showing an example of the manufacturing process of the optical wiring part in the wiring substrate of the embodiment.

[0016] Figure 4C It is a cross-sectional view showing an example of the manufacturing process of the optical wiring part in the wiring substrate of the embodiment.

[0017] Figure 5 It is a cross-sectional view showing Modification Example 1 of the wiring substrate according to the embodiment of the present invention.

[0018] Figure 6A It is Figure 5 an enlarged view of an example of part VI.

[0019] Figure 6B It is Figure 5 an enlarged view of another example of part VI.

[0020] Figure 7 It is a cross-sectional view showing Modification Example 2 of the wiring substrate according to the embodiment of the present invention.

[0021] Figure 8 It is a cross-sectional view showing Modification Example 3 of the wiring substrate according to the embodiment of the present invention.

[0022] Figure 9A It is Figure 8 an enlarged view of an example of part IX.

[0023] Figure 9B It is Figure 8 an enlarged view of another example of part IX.

[0024] Figure 10 It is a cross-sectional view showing Modification Example 4 of the wiring substrate according to the embodiment of the present invention.

[0025] Figure 11 It is Figure 10 an enlarged view of part XI.

[0026] Figure 12 is a partial top view showing an example of a light wiring portion when viewed from above. Figure 10 Detailed Embodiment

[0027] A wiring substrate according to an embodiment of the present invention will be described with reference to the accompanying drawings. Figure 1 is a cross-sectional view showing an example of a wiring substrate 1 as an example of a wiring substrate according to an embodiment. In Figure 2 shows Figure 1 an enlarged view of part II. Figure 3 shows Figure 1 an example of a light wiring portion included in the wiring substrate 1 when viewed from above. "Viewed from above" means observing the wiring substrate 1 of the embodiment with a line of sight along its thickness direction. In addition, the wiring substrate 1 is merely an example of the wiring substrate of the present embodiment. The stacked structure of the wiring substrate of the embodiment, the number of conductor layers, and the number of insulating layers are not limited to Figure 1 the stacked structure of the wiring substrate 1 and the number of conductor layers and insulating layers included in the wiring substrate 1. In addition, in each of the accompanying drawings referred to in the following description, in order to facilitate understanding of the disclosed embodiment, sometimes a specific part is enlarged and depicted, and regarding the size and length, sometimes the respective structural elements are not depicted at an accurate ratio to each other.

[0028] As Figure 1 shown, the wiring substrate 1 includes an electrical wiring portion 2. The electrical wiring portion 2 includes an insulating layer and a conductor layer. Specifically, Figure 1 the electrical wiring portion 2 in the example of

[0029] In addition, in the description of the embodiment, the side away from the insulating layer 32 in the thickness direction of the wiring substrate 1 is also referred to as the "upper side" or "above", or simply as "up", and the side close to the insulating layer 32 is also referred to as the "lower side" or "below", or simply as "down". Also, in each conductor layer and each insulating layer, the surface facing away from the insulating layer 32 is also referred to as the "upper surface", and the surface facing the insulating layer 32 side is also referred to as the "lower surface". The thickness direction of the wiring substrate 1 is also referred to as the "Z direction".

[0030] The electrical wiring portion 2 includes a solder resist 23 formed on the surface 30a side of the core substrate 30 and a solder resist 24 formed on the surface 30b side. The surface 2a of the electrical wiring portion 2 is mainly composed of the upper surface of the solder resist 23, and the surface 2b of the electrical wiring portion 2 is mainly composed of the upper surface of the solder resist 24. The solder resist 23 covers the necessary portions of the insulating layer 21 and the conductor layer 11, and the solder resist 24 covers the necessary portions of the insulating layer 22 and the conductor layer 12. The solder resist 23 has an opening 23a that exposes a part of the conductor layer 11. Similarly, the solder resist 24 also has an opening 24a that exposes a part of the conductor layer 12.

[0031] The electrical wiring portion 2 includes a component E1 connection portion 4 and a component E2 connection portion 25 formed in the opening 23a of the solder resist 23 in contact with the conductor layer 11. The component E1 connection portion 4 is, for example, a conductor post or a conductive bump. As the conductor post, for example, any metal such as copper or nickel is used. As the conductive bump, for example, a tin-based solder, a gold-based solder, etc. are used. As needed, the component E1 connection portion 4 may be two or more layers. For example, a conductive connection component 4a (refer to Figure 2 ) may be formed on the conductor post using a tin-based solder, a gold-based solder, etc. to make it two layers. The component E2 connection portion 25 is, for example, a conductor post or a conductive bump. As the conductor post, for example, any metal such as copper or nickel is used. As the conductive bump, for example, a tin-based solder, a gold-based solder, etc. are used. Since the component E2 connection portion 25 is lower than the component E1 connection portion 4, it is preferably formed as a conductive bump.

[0032] The insulating layers 21, 22, and 32 can be formed, for example, of a thermosetting insulating resin such as epoxy resin, bismaleimide triazine resin (BT resin), or phenolic resin. The insulating layers 21, 22, and 32 can also be formed of a thermoplastic insulating resin such as fluororesin, liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE) resin, polyester (PE) resin, and modified polyimide (MPI) resin. Although not shown, each insulating layer can include a core material (reinforcing material) formed of glass fiber, aramid fiber, etc., and can also include an inorganic filler composed of fine particles such as silica (SiO2), alumina, or mullite. On the other hand, the solder resists 23 and 24 are formed, for example, of a photosensitive epoxy resin, polyimide resin, etc.

[0033] The conductor layers 11, 12, 31, the via conductor 33, and the through-hole conductor 26 can be formed of any metal such as copper or nickel. Each of these conductors is Figure 1 simplified and depicted as a single layer in [the figure], but can also be a multilayer structure including two or more metal layers. For example, the conductor layers 11 and 12 can also be a two-layer structure including an electroless plating layer and an electroplating layer.

[0034] The conductor layers 11, 12, and 31 include arbitrary conductor patterns. In Figure 1 the example of [the figure], the conductor layer 11 includes conductor pads 11a and 11b. The conductor pads 11a and 11b are exposed within the openings 23a of the solder resist 23. Thus, Figure 1 the electrical wiring portion 2 of [the figure] has conductors such as the conductor pads 11a and 11b that are exposed on one surface 2a.

[0035] The component E2 is electrically and mechanically connected to the conductor pad 11b via the component E2 connection portion 25. Examples of the component E2 include electronic components such as semiconductor devices that generate electrical signals for causing the component E1 to emit light and / or process electrical signals generated by the component E1. Examples of the component E2 include semiconductor devices such as general-purpose operational amplifiers, driver ICs, microcomputers, programmable logic devices (PLDs), etc. The component E2 has, for example, an electrode E2a.

[0036] As Figures 1 - 3As shown, when using the wiring substrate 1, the component E1 is also mounted on the wiring substrate 1. Therefore, a component area A1 capable of arranging the component E1 is provided on the surface 2a of the electrical wiring portion 2. The component E1 is electrically and mechanically connected to the conductor pad 11a via the component E1 connection portion 4. The component area A1 is covered by the component E1 in a plan view when using the wiring substrate 1. In the component area A1, the component E1 is arranged through the component E1 connection portion 4 and the support component 7. The component E1 mounted on the component area A1 is an electrical component including a light receiving element and / or a light emitting element having a photoelectric conversion function. The component E1 has, for example, an electrode E1a and a light receiving portion or a light emitting portion E1b (refer to Figure 2 ).

[0037] In the illustrated example, the light receiving portion or the light emitting portion E1b has a light receiving surface or a light emitting surface E1c on the end surface E1f of the component E1 (refer to Figure 2 ), and the electrode E1a is provided on the surface of the component E1 facing the electrical wiring portion 2 side. That is, in the example of Figures 1 - 3 , the component E1 is mounted in a so-called face-down mounting (flip chip mounting) such that the surface of the component E1 facing the electrical wiring portion 2 side, except for the portion where the electrode E1a is formed, faces the support component 7. In addition, in the component E1, the electrode E1a is provided on the surface of the component E1 opposite to the surface facing the electrical wiring portion 2 side, and the component E1 can also be mounted in a so-called face-up mounting such that the surface of the component E1 facing the electrical wiring portion 2 side faces the support component 7. In the case of face-up mounting, the entire surface of the surface of the component E1 facing the electrical wiring portion 2 side may face the support component 7.

[0038] Examples of the component E1 include a light receiving element such as a photodiode and a light emitting element such as a light emitting diode (LED), an organic light emitting diode (OLED), a laser diode (LD), and a vertical cavity surface emitting laser (VCSEL). When the component E1 is a light emitting element, the component E1 generates an optical signal (light) based on an electrical signal input to the electrode E1a and emits the light from the light receiving portion or the light emitting portion E1b that functions as a light emitting portion (refer to Figure 2 ). In addition, when the component E1 is a light receiving element, an electrical signal based on the light incident on the light receiving portion or the light emitting portion E1b that functions as a light receiving portion is generated and output from the electrode E1a.

[0039] As Figures 1 - 3As shown, when using the wiring substrate 1, the optical wiring portion 3 is also disposed on the wiring substrate 1. Accordingly, an optical wiring region A2 capable of disposing the optical wiring portion 3 is provided on the surface 2a of the electrical wiring portion 2. The optical wiring region A2 is covered by the optical wiring portion 3 in a plan view when the wiring substrate 1 is in use. In the optical wiring region A2, the optical wiring portion 3 is disposed through the support member 7. The optical wiring portion 3 includes an optical wiring 5 and a support substrate 6. The optical wiring portion 3 is disposed on the wiring substrate 1 such that the support substrate 6 is disposed on the side of the optical wiring 5 opposite to the electrical wiring portion 2. That is, the optical wiring 5 is disposed on the optical wiring region A2, and the support substrate 6 is disposed on the optical wiring 5. The support member 7 is disposed between the electrical wiring portion 2 and the optical wiring portion 3. In Figures 1 - 3 the example of, the support member 7 is disposed not only in the optical wiring region A2 but also in the component region A1. In addition, all or a part of the optical wiring portion 3 may be disposed on the upper surface of the support member 7.

[0040] The optical wiring 5 includes a core portion 51 that transmits light and a cladding portion 52 that surrounds the core portion 51. The cladding portion 52 is provided around the core portion 51 and sandwiches the core portion 51 in any direction perpendicular to the extending direction of the core portion 51, that is, the light propagation direction in the core portion 51 (+X direction or -X direction, hereinafter also simply referred to as "X direction").

[0041] The cladding portion 52 includes: a first cladding 521 that constitutes a portion closer to the support substrate 6 than the core portion 51; and a second cladding 522 that constitutes a portion closer to the lower side and farther from the support substrate 6 than the first cladding 521. The second cladding 522 covers the lower surface (the surface opposite to the support substrate 6) and the side surface of the core portion 51.

[0042] The core portion 51 and the cladding portion 52 are formed of materials having appropriate refractive indices. The core portion 51 and the cladding portion 52 can be constituted by, for example, an organic material, an inorganic material, or a hybrid material including an organic material and an inorganic material such as an inorganic polymer. Examples of the inorganic material include quartz glass and silicon, and examples of the organic material include acrylic resins such as polymethyl methacrylate (PMMA), polyimide resins, polyamide resins, polyether resins, and epoxy resins. The optical wiring 5 made of an organic material is easily lightweight and has high toughness.

[0043] The core portion 51 and the cladding portion 52 may be constituted by different materials from each other, or may be constituted by materials of the same system as each other. In addition, the core portion 51 uses a material having a higher refractive index than the material used for the cladding portion 52 so that light can be totally reflected at the interface between the core portion 51 and the cladding portion 52. The core portion 51 and the cladding portion 52 may also have different refractive indices from each other after being formed of materials having the same refractive index through appropriate processing.

[0044] The optical wiring 5 can be formed by any method. As an example, the optical wiring 5 is formed on the support substrate 6. For example, the optical wiring 5 and the support substrate 6 can be joined by curing the material of the semi-cured coating portion 52 on the support substrate 6. In addition, the optical wiring 5 can be formed independently of the support substrate 6 and fixed to the support substrate 6 using any adhesive (not shown), for example. As in the example of Figures 1 - 3 , in the optical wiring portion 3 and the component E1, when the end face 3f of the optical wiring portion 3 and the end face E1f of the component E1 are optically connected to each other, the end face 5f of the optical wiring 5 and the end face 6f of the support substrate 6 can be formed to be coplanar (refer to Figure 2 ). That is, the end face 3f of the optical wiring portion 3 constituted by the end face 5f of the optical wiring 5 and the end face 6f of the support substrate 6 can be formed in a planar shape.

[0045] The support substrate 6 has, for example, a lower coefficient of thermal expansion than that of the optical wiring 5. When the core portion 51 and the coating portion 52 have different coefficients of thermal expansion from each other, the support substrate 6 has, for example, a lower coefficient of thermal expansion than the average value of the coefficients of thermal expansion of the core portion 51 and the coating portion 52. Preferably, the coefficient of thermal expansion of the support substrate 6 is lower than the lower one of the coefficients of thermal expansion of the core portion 51 and the coating portion 52. The support substrate 6 can be made of any material so as to have a lower coefficient of thermal expansion than the optical wiring 5 and preferably have a higher rigidity than the optical wiring 5. For example, the support substrate 6 can also have a higher flexural rigidity than the flexural rigidity of the optical wiring 5. Examples of the material of the support substrate 6 include glass materials such as soda-lime glass, borosilicate glass, and quartz glass, various ceramics such as alumina, silicon nitride, and silicon oxide, and semiconductors such as silicon and germanium.

[0046] The coefficient of thermal expansion of the optical wiring 5 is, for example, 10 ppm / °C to 100 ppm / °C. In contrast, the coefficient of thermal expansion of the support substrate 6 is, for example, 3 ppm / °C to 10 ppm / °C. The flexural rigidity of the support substrate 6 is, for example, 1.1 times or more the flexural rigidity of the optical wiring 5 and 2 times or less the flexural rigidity of the electrical wiring portion 2. It is considered that the optical wiring 5 can be handled and its shape can be maintained, and the optical wiring portion 3 can follow the warping of the electrical wiring portion 2 to some extent. The thickness of the support substrate 6 is not particularly limited and can be set to, for example, about 30 μm or more and 1000 μm or less.

[0047] The support member E1 and the support member 7 of the optical wiring portion 3 are formed on one surface 2a of the electrical wiring portion 2. Specifically, it is formed on the upper surface of the solder resist 23. In the example of Figures 1 - 3 , the support member 7 is arranged so as to straddle the component region A1 and the optical wiring region A2. Therefore, in Figures 1 - 3In the example, when using the wiring substrate 1, the component E1 and the optical wiring portion 3 are arranged on the wiring substrate 1 on the support member 7. In the illustrated example, the support member 7 is formed in the component region A1 and the optical wiring region A2 in a plan view. That is, the support member 7 is formed to cover a part of the component region A1 and the optical wiring region A2 in a plan view. The shape and size of the support member covering the component region A1 and the optical wiring region A2 are not particularly limited. Moreover, a component E1 connection portion 4 is formed on one surface 2a of the electrical wiring portion 2 close to the support member 7. As a result, the adjacent component E1 connection portion 4 is connected to the electrode E1a of the component E1. In addition, the support member 7 may also be formed on one surface 2a of the electrical wiring portion 2 where the solder resist 23 is not formed.

[0048] The shape and size of the support member 7 can be appropriately changed according to the shape and size of the component region A1, the shape and size of the optical wiring region A2, the arrangement of the component region A1 on the electrical wiring portion 2, and the arrangement of the optical wiring region A2 on the electrical wiring portion 2. For example, in the case where the component E1 is mounted face up on the electrical wiring portion 2, the support member 7 may also be formed over the entire component region A1. In addition, in the case where the entire optical wiring portion 3 is arranged on the surface 2a of the electrical wiring portion 2, the support member 7 may also be formed over the entire optical wiring region A2. In the illustrated example, one end surface 7e of the support member 7 is located near one end surface 2e of the electrical wiring portion 2 (refer to Figure 1 and Figure 3 ). Specifically, one end surface 7e of the support member 7 is substantially coplanar with one end surface 2e of the electrical wiring portion 2. It should be noted that one end surface 7e of the support member 7 may be arranged to be closer to the inside than one end surface 2e of the electrical wiring portion 2, or one end surface 7e of the support member 7 may be arranged to protrude beyond one end surface 2e of the electrical wiring portion 2.

[0049] The support member 7 is not particularly limited. For example, it is plate-shaped, film-shaped, etc. The support member 7 may also have a rigidity sufficient to maintain a specified thickness. As an example, the support member 7 is film-shaped. In the case of using a film, the surface of the support member 7 facing the electrical wiring portion 2 may also have adhesiveness so as to be fixed to the electrical wiring portion 2. In addition, in the case of using a film, the opposite surface of the surface of the support member 7 facing the electrical wiring portion 2 (the surface facing the component E1 side and the optical wiring portion 3 side) may also have adhesiveness so as to be fixed to the component E1 and the optical wiring portion 3.

[0050] The material constituting the support member 7 is not particularly limited and may be a resin material, a metal material, an inorganic material, or a composite material of these materials. As the material constituting the support member 7, a resin material is preferably used. Examples of the resin material constituting the support member 7 include thermosetting resins, thermoplastic resins, UV-curable resins, etc. In addition, these resins can be used alone or in combination of multiple resins. Examples of the combination of multiple resins include the combination of a thermosetting resin and a UV-curable resin, the combination of a thermosetting resin and a thermoplastic resin, etc. Specific examples of the resin constituting the support member 7 are not particularly limited, and epoxy resins, polyester resins, polyimide resins, olefin resins, etc. can be cited. The thermosetting resin constituting the support member 7 is not particularly limited, and examples thereof include epoxy resins, polyester resins, polyimide resins, olefin resins, phenolic resins, polyurethane resins, silicone resins, etc. The thermoplastic resin constituting the support member 7 is not particularly limited, and examples thereof include polyethylene resins, polypropylene resins, polyvinyl chloride resins, polystyrene resins, ABS resins, methacrylic resins, acrylic resins, polyacetal resins, polycarbonate resins, PET resins, PPS resins, polystyrene resins, etc. The UV-curable resin constituting the support member 7 is not particularly limited, and examples thereof include epoxy resins, acrylic resins, etc. A part of the thermosetting resin can be substituted with an acryloyl group.

[0051] When the material constituting the support member 7 is a resin material, its glass transition temperature is preferably 50°C to 200°C. The thermal expansion rate of the support member 7 is, for example, 30 ppm / °C to 200 ppm / °C. The thickness of the support member 7 is not particularly limited and is about 5 μm or more and 200 μm or less.

[0052] The support member 7 may also contain particles such as inorganic particles, metal particles, resin particles, etc. The size of the particles contained in the support member is not particularly limited and is, for example, about 0.1 μm or more and 20 μm or less. By containing particles in the support member 7, an increase in the rigidity and heat resistance of the support member can be imparted.

[0053] The support member 7 can be a single-layer structure or a multi-layer structure with two or more layers. When the support member 7 is a single-layer structure, the support member 7 is arranged on the wiring substrate 1, for example, by forming a film using film lamination, printing, potting, etc., or by placing a pre-formed sheet. When the support member 7 is a multi-layer structure, the support member 7 is formed, for example, by a two-layer structure having an adhesive layer provided on one side of a resin layer as a base layer, or a three-layer structure having adhesive layers provided on both sides of a resin layer as a base layer. When the support member 7 is a two-layer structure, the support member 7 is arranged, for example, with the adhesive layer provided on its single side facing the electrical wiring portion 2 side. In addition, the support member 7 is adhered to the electrical wiring portion 2 using the adhesive layer. When the support member 7 is a three-layer structure, it is arranged such that the adhesive layer provided on one of its sides faces the electrical wiring portion 2 side, and the adhesive layer provided on the other of its sides faces the component E1 side and the optical wiring portion 3 side. In addition, the support member 7 is adhered to the electrical wiring portion 2, the component E1, and the optical wiring portion 3 using the adhesive layer.

[0054] There is no particular limitation on the metal material constituting the support member 7, and examples thereof include copper, aluminum, nickel, titanium, beryllium, iron, platinum, stainless steel, etc. The support member 7 can be constituted by covering a metal material as a core material with a resin material, or can be constituted by two or more layers including a layer made of a metal material and a layer made of a resin material having adhesiveness to the metal material. By using a metal material, heat dissipation can be imparted to the support member 7.

[0055] There is no particular limitation on the inorganic material constituting the support member 7, and examples thereof include glass, semiconductor materials, etc. The support member 7 can be constituted by covering an inorganic material as a core material with a resin material, or can be constituted by two or more layers including a layer made of an inorganic material and a layer made of a resin material having adhesiveness to the inorganic material. By using an inorganic material, rigidity and heat expansion resistance can be imparted to the support member 7.

[0056] Continuing to refer to Figure 2 and Figure 3 , an example of the optical and electrical connection methods between the electrical wiring portion 2, the component E1, and the optical wiring portion 3 will be further described. As Figure 2 shown, the height (dimension in the Z direction) of the component E1 connection portion 4 of the electrical wiring portion 2 is adjusted so that the lower surface of the component E1 is flush with the upper surface of the support member 7. In addition, the position of the core portion 51 of the optical wiring portion 3 is adjusted to be flush with the position of the light-receiving portion or the light-emitting portion E1b of the component E1 in the thickness direction (Z direction) of the electrical wiring portion 2. As Figure 2 and Figure 3As shown, when the component E1 and the optical wiring portion 3 are disposed on the wiring substrate 1, they are disposed on a common support member 7 that straddles the component region A1 and the optical wiring region A2 on one surface 2a of the electrical wiring portion 2. The optical wiring portion 3 and the component E1 are positioned on one surface 2a of the electrical wiring portion 2 in such a manner that optical coupling is performed in a state where the light receiving portion or the light emitting portion E1b and the core portion 51 are disposed on the common support member 7. Therefore, it is considered that after being disposed on the wiring substrate 1, the positional deviation in the Z direction between the light receiving portion or the light emitting portion E1b of the component E1 disposed on the common support member 7 and the core portion 51 of the optical wiring portion 3 becomes smaller.

[0057] That is, when the support substrate 6 is not disposed above the optical wiring 5, the optical wiring 5 is not pressed downward by the self-weight of the support substrate 6. Since it is not pressed by the support substrate 6, in an environment where the optical wiring 5 expands and contracts, the difference in dimensional error in the Z direction of the optical wiring portion 3 sometimes becomes large due to the expansion and contraction of the optical wiring 5. Therefore, the optical coupling efficiency between the optical wiring portion 3 and the component E1 sometimes decreases. In contrast, in the present embodiment, since the support substrate 6 is disposed above the optical wiring 5, it is considered that even in an environment where the optical wiring 5 expands and contracts, the optical wiring 5 is pressed downward by the self-weight of the support substrate 6, so that the optical wiring 5 is less likely to change in size. Therefore, it is considered that the core portion 51 of the optical wiring portion 3 and the light receiving portion or the light emitting portion E1b of the component E1 are easily positioned at positions where optical coupling can be performed with sufficient efficiency. Particularly when the optical wiring 5 uses an organic material, the optical wiring 5 is likely to expand and contract. In addition, in the present embodiment, since the optical wiring 5 is pressed downward by the self-weight of the support substrate 6, the optical wiring 5 is less likely to change in size, and therefore it is speculated that the positional deviation in the Z direction between the optical wiring portion 3 and the core portion 51 is small.

[0058] When the optical wiring portion 3 and the component E1 are disposed on the wiring substrate 1, for example, they are sometimes heated from the outside by a reflow process or the like. In addition, the optical wiring portion 3 generates heat due to the propagation of light in the core portion 51, and the component E1 sometimes generates heat due to light reception from the core portion 51 or light emission to the core portion 51. Thus, it is considered that the optical wiring portion 3 and the component E1 are affected by heat when disposed on the wiring substrate 1 and after being disposed on the wiring substrate 1, due to being heated from the outside or generating heat from the optical wiring portion 3 and the component E1. When the optical wiring 5 is not disposed on the support substrate 6, it is considered that due to such heating from the outside when disposed on the wiring substrate 1 and after being disposed on the wiring substrate 1 and the heat generation based on the optical wiring portion 3 and the component E1, the optical wiring portion 3 thermally expands.

[0059] When the optical wiring portion 3 thermally expands, the core portion 51 follows the expansion direction, and thus may move in different directions from the desired configuration position. Therefore, a positional deviation occurs not only in the Z direction but also in the directions (X direction and Y direction) along one surface 2a of the electrical wiring portion 2 between the position of the core portion 51 of the optical wiring portion 3 and the light receiving portion or the light emitting portion E1b of the component E1. As a result, the optical coupling efficiency between the optical wiring portion 3 and the component E1 may sometimes decrease.

[0060] In contrast, in the present embodiment, the support substrate 6 is disposed above the optical wiring 5. Therefore, it is considered that even in an environment where the optical wiring 5 expands and contracts due to external heating when being disposed on the wiring substrate 1 and after being disposed on the wiring substrate 1, and due to the heat generation of the optical wiring portion 3 and the component E1, the optical wiring 5 is pressed downward by the self-weight of the support substrate 6, and the expansion and contraction are suppressed in the X direction and the Y direction. Therefore, it is considered that the relative positions of the core portion 51 of the optical wiring portion 3 and the light receiving portion or the light emitting portion E1b of the component E1 are also difficult to change in the X direction and the Y direction. As a result, if the optical wiring portion 3 and the component E1 are positioned at positions where optical coupling can be performed with sufficient efficiency, it is presumed that a decrease in the optical coupling efficiency between the optical wiring portion 3 and the component E1 is suppressed when being disposed on the wiring substrate 1 and after being disposed on the wiring substrate 1.

[0061] In addition, in the present embodiment, the optical wiring portion 3 and the component E1 are disposed on a common support member 7 that straddles the component region A1 and the optical wiring region A2. Therefore, due to external heating when being disposed on the wiring substrate 1 and after being disposed on the wiring substrate 1, and due to the heat generation of the optical wiring portion 3 and the component E1, the support member 7 is affected by heat. When the support member 7 expands due to the influence of heat, it is also considered that the optical wiring portion 3 and the component E1 move in the same direction through the common support member 7 that straddles the component region A1 and the optical wiring region A2. Therefore, it is considered that the relative positions of the core portion 51 of the optical wiring portion 3 and the light receiving portion or the light emitting portion E1b of the component E1 are also difficult to change. As a result, if the optical wiring portion 3 and the component E1 are positioned at positions where optical coupling can be performed with sufficient efficiency, it is presumed that a decrease in the optical coupling efficiency between the optical wiring portion 3 and the component E1 is suppressed during and after the configuration.

[0062] As Figure 3 shown, Figures 1 - 3 the optical wiring portion 3 includes a plurality of core portions 51. The plurality of core portions 51 are arranged in parallel in a direction intersecting the direction of light propagation (X direction) in the core portion 51. Moreover, in Figure 3In the example, the intervals between multiple cores 51 increase as approaching the other end 3n in the X direction of the optical wiring section 3 from one end 3m of the optical wiring section 3. Therefore, the arrangement interval of the cores 51 at the other end 3n of the optical wiring section 3 is larger than the arrangement interval at one end 3m of the optical wiring section 3. For example, in some cases, the multiple optical fibers optically coupled to the cores 51 at the other end 3n may not be arranged at intervals as small as the arrangement intervals of the multiple light-receiving parts or light-emitting parts E1b (refer to Figure 2 ) of the component E1. In the example of Figure 3 , the multiple cores 51 are arranged at an interval larger than that at one end 3m of the optical wiring section 3 at the other end 3n of the optical wiring section 3. The cores 51 at one end 3m of the optical wiring section 3 are optically coupled to the component E1 (refer to Figure 2 ), and it is considered that optical coupling can be appropriately performed without an additional conversion unit such as an interval. In addition, it is considered that the cores 51 at the other end 3n of the optical wiring section 3 are externally connected through optical fibers or the like, and optical coupling can be appropriately performed without an additional conversion unit such as an interval.

[0063] Next, with reference to Figures 4A - 4C , an example of a method for manufacturing a wiring substrate in a manufacturing embodiment will be described by taking the case of manufacturing the wiring substrate 1 of Figure 1 as an example.

[0064] First, the optical wiring section 3 is manufactured. As shown in Figure 4A , a semiconductor substrate such as a glass plate, a ceramic plate, or silicon is prepared as the support substrate 6.

[0065] Next, as shown in Figure 4B , the optical wiring 5 is formed on the surface of the support substrate 6. Specifically, first, the first cladding 521 of the cladding portion 52 is formed on the surface of the support substrate 6. The first cladding 521 is formed using a resin material, for example. The formation of the first cladding 521 is performed by coating such as spin coating or film lamination, for example. In the case of film molding, the first cladding 521 is thermally bonded to the surface of the support substrate 6.

[0066] After that, the core 51 is formed on the first cladding 521. The core 51 is formed using a resin material, for example. The formation of the core 51 is performed by coating such as spin coating or film lamination, for example. In the case of film molding, the core 51 is thermally bonded to the entire surface of the first cladding 521 and patterned into cores 51 having a desired shape and number by photolithography.

[0067] Next, a second cladding layer 522 is formed on the first cladding layer 521 and the core 51. The second cladding layer 522 is formed using, for example, a resin material. The formation of the second cladding layer 522 is performed, for example, by coating using spin coating or the like, film lamination, or the like. In the case of film molding, the second cladding layer 522 is thermally laminated onto the first cladding layer 521 and the core 51. As a result, a cladding portion 52 composed of the first cladding layer 521 and the second cladding layer 522 is formed. Then, the core 51, the cladding portion 52, and the support substrate 6 are cut by cutting or laser processing or the like so as to have a predetermined shape and size in a plan view. Through the above steps, the optical wiring portion 3 composed of the optical wiring 5 and the support substrate 6 is completed. The end faces 3f of the obtained optical wiring portion 3, that is, the end face 5f of the optical wiring 5 and the end face 6f of the support substrate 6 are formed to be coplanar by cutting.

[0068] Figure 4C A method for manufacturing the wiring substrate 1 and a method for disposing the optical wiring portion 3 on the wiring substrate 1 are shown. In the manufacture of the wiring substrate 1, first, an electrical wiring portion 2 is prepared. As an example, the electrical wiring portion 2 is prepared using a general method for forming a multilayer wiring substrate including a core substrate. For example, a core substrate 30 is formed by forming via conductors 33 on a double-sided copper-clad laminate including an insulating layer 32 or by forming a conductor layer 31 using a subtractive method. Then, the insulating layers 21, 22 and the conductor layers 11, 12 and the via conductor 26 are formed by thermally laminating an insulating resin film on both sides of the core substrate 30 and forming a conductor layer based on a semi-additive method (see Figure 1 ). Further, a solder resist 23, a solder resist 24 are formed by laminating an epoxy resin, a polyimide resin or the like or by coating based on these resins, and openings 23a, 24a are formed by photolithography, for example. And, in the opening 23a where the conductor pad 11b is exposed, the component E1 connection portion 4 is formed as a conductor post made of copper or nickel by plating treatment. As needed, on the component E1 connection portion 4, a conductive connection member 4a made of a tin-based solder, a gold-based solder or the like is formed by coating a paste containing metal powder and performing a reflow process. Although not shown in Figure 4C , in the opening 23a where the conductor pad 11b is exposed, the component E2 connection portion 25 is formed as a conductive bump made of a tin-based solder or a gold-based solder by disposing a ball and performing a reflow process (see Figure 1 ).

[0069] Next, the support member 7 is disposed on one surface 2a of the electrical wiring portion 2. For example, the support member 7 formed in a film shape is disposed on the one surface 2a. The support member 7 is formed of an arbitrary plate-like member such as a material containing an epoxy resin and inorganic particles, for example. The support member 7 may also be fixed to the electrical wiring portion 2.

[0070] Next, as Figure 4CAs shown, the optical wiring section 3 is arranged on the support member 7. When arranged on the support member 7, the surface 3a on the optical wiring 5 side of the optical wiring section 3 and the surface 3b on the support substrate 6 side are inverted up and down (refer to Figure 4B and Figure 4C ). That is, the optical wiring 5 of the optical wiring section 3 faces the support member 7 formed on one surface 2a of the electrical wiring section 2. After that, the optical wiring section 3 is arranged on the support member 7. The optical wiring section 3 can also be fixed to the support member 7. In addition, after the optical wiring section 3 is mounted on the support member 7 with an adhesive, the composite member of the optical wiring section 3 and the support member 7 can be arranged on one surface 2a of the electrical wiring section 2. Through the above processes, the wiring substrate 1 is completed. As required, the connector C is arranged in such a manner that the upper housing C1 and the lower housing C2 sandwich the optical wiring section 3. For example, the upper housing C1 is mounted on the support substrate 6, and the lower housing C2 is mounted on the optical wiring 5. During the installation of the connector C to the optical wiring section 3, the upper housing C1 and the lower housing C2 are fitted together. In addition, the connector C can also be installed after the optical wiring section 3 is arranged on one surface 2a of the electrical wiring section 2. In addition, the optical wiring section 3 can also be arranged on the wiring substrate 1 without using the support member 7.

[0071] After that, as Figure 1 shown, the component E1 including the optical element is arranged on the wiring substrate 1. The component E2 can also be installed together with the component E1. The electrode E1a of the component E1 is connected to the component E1 connection portion 4 through the conductive connection member 4a on the component E1 connection portion 4 melted during installation, for example. On the other hand, the light receiving portion or the light emitting portion E1b is optically coupled to the exposed portion of the core 51 of the optical wiring section 3. According to the present embodiment, it is considered that both appropriate optical coupling between the light receiving portion or the light emitting portion E1b of the component E1 and the core 51 of the optical wiring section 3 and reliable electrical connection and mechanical connection between the electrode E1a of the component E1 and the component E1 connection portion 4 can be achieved. In addition, the component E1 can also be arranged on the wiring substrate 1 without using the support member 7. In addition, it can also be that the optical wiring section 3 does not use the support member 7 and the component E1 uses the support member 7 and is arranged on the wiring substrate 1. Moreover, it can also be that the optical wiring section 3 uses the support member 7 and the component E1 does not use the support member 7 and is arranged on the wiring substrate 1.

[0072] Figures 5 - 6B The wiring substrate 1α showing a modification example 1 of the wiring substrate as an embodiment is shown. Figure 5 It is a cross-sectional view of the wiring substrate 1α showing a modification example 1 of the wiring substrate as an embodiment. Figure 6A Shown Figure 5 is an example of an enlarged view of the VI portion of Figure 6B Shown Figure 5 is another example of an enlarged view of the VI portion of Figures 5 - 6B In addition, inFigures 1 - 3 The structural elements shown with the same structural elements are labeled the same as Figures 1 - 3 the labels marked, and repeated descriptions are appropriately omitted. In addition, in Figure 6A and Figure 6B for the sake of convenience in explanation, the double-dot dash lines in Figure 5 are omitted.

[0073] The wiring substrate 1α includes the same electrical wiring portion 2 as the electrical wiring portion 2 included in Figures 1 - 3 the wiring substrate 1. In addition, in Figures 5 - 6B the wiring substrate 1α, different from Figures 1 - 3 the wiring substrate 1, the support member 7α extends outward more than one end face 2e of the electrical wiring portion 2. Therefore, the support member 7α is arranged so as to protrude beyond one end face 2e of the electrical wiring portion 2. When protruding beyond one end face 2e of the electrical wiring portion 2, corresponding to the amount by which the support member 7α protrudes beyond one end face 2e of the electrical wiring portion 2, the support area of the support member 7α for the optical wiring portion 3 increases. In other words, the bonding area of the optical wiring portion 3 based on the support member 7α increases. Therefore, it is considered that the support of the optical wiring portion 3 by the support member 7α is more stable, or the bonding is more stable. Specifically, in Figure 6A the example of, the support member 7α is arranged such that one end face 7αe thereof protrudes beyond one end face 2e of the electrical wiring portion 2. On the other hand, in Figure 6B the example of, the support member 7α is arranged such that one end face 7αe thereof is shown to protrude beyond one end face 2e of the electrical wiring portion 2 and covers a part of one end face 2e of the electrical wiring portion 2. As Figure 6B shown, by the support member 7α covering a part of one end face 2e of the electrical wiring portion 2, the support area of the support member 7α based on the electrical wiring portion 2 increases. In other words, the bonding area of the optical wiring portion 3 based on the support member 7α increases. Therefore, it is considered that the support of the optical wiring portion 3 by the electrical wiring portion 2 is more stable, or the bonding is more stable.

[0074] In addition, in the wiring substrate 1α, similar to Figures 1 - 3 the wiring substrate 1, since the optical wiring 5 is arranged on the support substrate 6 above it, it is considered that the optical wiring 5 is pressed downward by the self-weight of the support substrate 6, and thus it is difficult to expand and contract in the X direction, Y direction, and Z direction. Therefore, it is speculated that the reduction in the optical coupling efficiency between the optical wiring portion 3 and the component E1 is suppressed during and after the arrangement.

[0075] Figure 7 The wiring substrate 1β showing a modification example 2 of the wiring substrate as an embodiment is shown. Figure 7 is a cross-sectional view of the wiring substrate 1β showing a modification example 2 of the wiring substrate as an embodiment. In addition, in Figure 7 for, for Figures 1 - 3The same structural elements as those shown are labeled with Figures 1 - 3 the same reference numerals as the labeled reference numerals, and redundant descriptions are appropriately omitted.

[0076] The wiring substrate 1β includes the same electrical wiring portion 2 as the electrical wiring portion 2 included in the wiring substrate 1 of the example of Figures 1 - 3 . In addition, in Figure 7 the wiring substrate 1β of the example of Figures 1 - 3 , different from the wiring substrate 1 of the example of

[0077] , the support member 7β2 only supports the optical wiring portion 3, and the support member 7β1 different from the support member 7β2 supports the component E1. In addition, hereinafter, the member that supports the optical wiring portion 3 is also referred to as the optical wiring portion support member 7β2, and the member that supports the component E1 is also referred to as the component support member 7β1. Figures 1 - 3 The component support member 7β1 is disposed in the component region A1, and the optical wiring portion support member 7β2 is disposed in the optical wiring region A2. The materials constituting the component support member 7β1 and the optical wiring portion support member 7β2 are not particularly limited. For example, they are respectively formed of the same materials as the

[0078] support member 7 of Figure 7 . The materials constituting the component support member 7β1 and the optical wiring portion support member 7β2 may be the same as each other or different from each other.

[0079] Figures 8 - 9B The wiring substrate 1γ showing a modification example 3 of the wiring substrate as an embodiment is shown. Figure 8 It is a cross-sectional view of the wiring substrate 1γ showing a modification example 3 of the wiring substrate as an embodiment. Figure 9A An example of an enlarged view of the IX portion of Figure 8 is shown, Figure 9B Another example of an enlarged view of the IX portion of Figure 8 is shown. In addition, in Figures 8 - 9B , the same structural elements as those shown in Figures 1 - 3 are labeled with the same reference numerals as the Figures 1 - 3 labeled reference numerals, and redundant descriptions are appropriately omitted. In addition, in Figure 9A andFigure 9B In order to facilitate the description, the double-dashed lines in Figure 8 are omitted.

[0080] The wiring substrate 1γ includes the same electrical wiring portion 2 as the electrical wiring portion 2 included in the wiring substrate 1 of the example of Figures 1 - 3 . In addition, in the wiring substrate 1γ of the example of Figure 8 , different from the wiring substrate 1 of the example of Figures 1 - 3 , similar to the wiring substrate 1β of the example of Figure 7 , the component support member 7γ1 and the optical wiring portion support member 7γ2 are separately provided in the component area A1 and the optical wiring area A2, respectively. In addition, in the wiring substrate 1γ of the example of Figure 8 , different from the wiring substrate 1β of the example of Figure 7 , similar to the wiring substrate 1α of the example of Figures 5 - 6B , the optical wiring portion support member 7γ2 is arranged so as to protrude from one end face 2e of the electrical wiring portion 2. The protruding shape of the optical wiring portion support member 7γ2 is not particularly limited. The optical wiring portion support member 7γ2 may be arranged such that one end face 7γe thereof protrudes from one end face 2e of the electrical wiring portion 2 as shown in Figure 9A , or may be arranged so as to cover a part of one end face 2e of the electrical wiring portion 2 as shown in Figure 9B .

[0081] In Figures 8 - 9B , the wiring substrate 1γ of the example is also the same as the wiring substrate 1α of Figures 5 - 6B , and the optical wiring portion support member 7γ2 is arranged such that one end face 7γe thereof protrudes from one end face 2e of the electrical wiring portion 2. Therefore, it is considered that the support (or adhesion) of the optical wiring portion support member 7γ2 to the optical wiring portion 3 is more stable. As shown in Figure 9B , it is considered that by covering a part of one end face 2e of the electrical wiring portion 2 with the optical wiring portion support member 7γ2, the support of the electrical wiring portion 2 to the optical wiring portion support member 7γ2 is more stable, or the adhesion is more stable.

[0082] In addition, in the wiring substrate 1γ, similar to the wiring substrate 1 of Figures 1 - 3 , since the optical wiring 5 is arranged on the support substrate 6 above it, it is considered that the optical wiring 5 is pressed downward by the self-weight of the support substrate 6, and it is difficult to expand and contract in the X direction, Y direction, and Z direction. Therefore, it is speculated that the decrease in the optical coupling efficiency between the optical wiring portion 3 and the component E1 is suppressed during and after the arrangement of the optical wiring 5.

[0083] Figures 10 - 12 The wiring substrate 1δ shown as a modified example of the wiring substrate of the embodiment is shown. Figure 10It is a cross-sectional view of a wiring substrate 1δ showing a modified example of the wiring substrate as an embodiment. Figure 11 Shown Figure 10 An enlarged view of the XI portion. Figure 12 Shown disposed Figure 10 An example of a top view of the optical wiring portion 3δ disposed on the wiring substrate 1δ.

[0084] The wiring substrate 1δ includes an optical wiring portion 3δ having a structure similar to that of the optical wiring portion 3 included in the wiring substrate 1. As Figures 1 - 3 shown, at one end portion 3δm of the optical wiring portion 3δ in the light propagation direction (X direction) within the core portion 51, it is exposed from the cladding portion 52 and the support substrate 6, which is different from the optical wiring portion 3 exemplified in Figure 10 etc. In the example of Figure 1 etc., one end portion 3δm of the optical wiring portion 3δ where the core portion 51 is exposed extends in the X direction. Figures 10 - 12

[0085] Figure 11 As shown, the light receiving portion or light emitting portion E1δb of the component E1δ mounted on the wiring substrate 1δ has a light receiving surface or light emitting surface E1δc facing the side and the lower side of the component E1δ. The upper surface 51a of the core portion 51 exposed from the cladding portion 52 and the support substrate 6 is positioned to face the light receiving surface or light emitting surface E1δc of the component E1δ optically coupled to the core portion 51. The component E1δ is arranged such that at one end portion 3δm of the optical wiring portion 3δ, the light receiving portion or light emitting portion E1δb faces the upper surface 51a of the core portion 51 in the Z direction. That is, the component region A1δ and the optical wiring region A2δ partially overlap in a top view.

[0086] Figure 11 As shown, the upper surface 7δa of a part of the component region A1δ in the support component 7δ is higher than the upper surface 7δb of the optical wiring region A2δ in the support component 7δ by an amount equal to the thickness of the core portion 51 and the second cladding 522 so that the light receiving surface or light emitting surface E1δc of the component E1δ is substantially coplanar with the upper surface 51a of the core portion 51. In addition, the height (dimension in the Z direction) of the component E1δ connection portion 4δ of the electrical wiring portion 2 is adjusted such that the lower surface of the component E1δ coincides with the upper surface 7δa of the support component 7δ.

[0087] Figure 11 As Figure 12 and Figures 1 - 3 shown, when the component E1δ and the optical wiring portion 3δ are disposed on the wiring substrate 1δ, they are disposed on a common support component 7δ on one surface 2a of the electrical wiring portion 2. Therefore, in this example as well as in Figures 1 - 3Similar to the example, it is considered that after the component E1δ is arranged on the wiring substrate 1δ, the positional deviation in the Z direction between the light-receiving part or the light-emitting part E1δb of the component E1δ arranged on the common support member 7δ and the core part 51 of the optical wiring part 3δ becomes smaller. In addition, it is speculated that if the optical wiring part 3δ and the component E1δ are positioned at positions where optical coupling can be achieved with sufficient efficiency, the reduction in the optical coupling efficiency between the optical wiring part 3δ and the component E1δ is suppressed during and after the arrangement of the optical wiring part 3δ.

[0088] For example, when the component E1δ is a light-receiving element, a part of the light propagating toward one end 3δm in the core part 51 leaks out of the upper surface 51a of the core part 51 as evanescent light to the outside of the core part 51 and is incident on the light-receiving part or the light-emitting part E1δb which is the light-receiving part of the component E1δ. Since the upper surface 51a faces the light-receiving surface or the light-emitting surface E1δc of the component E1δ without passing through the coating part 52, it is considered that highly efficient optical coupling can be achieved.

[0089] The wiring substrate of the embodiment is not limited to the structures illustrated in the respective drawings and the structures, shapes, and materials illustrated in this specification. The wiring substrate of the embodiment, particularly the electrical wiring part, can be set to any laminated structure. For example, the electrical wiring part can also be a coreless substrate that does not include a core substrate, and can also be any number of layers of conductor layers and insulating layers. The conductor pad 11b may not be formed. The wiring substrate can also be provided in a state where components are mounted. That is, when components are mounted, the components are included in the wiring substrate.

[0090] Reference Signs Explanation

[0091] 1, 1α, 1β, 1γ, 1δ: Wiring Substrate; 2: Electrical Wiring Part; 2a: One Surface of the Electrical Wiring Part; 3, 3δ: Optical Wiring Part; 11, 12, 31: Conductor Layers; 21, 22, 32: Insulating Layers; 4: Component E1 Connection Part; 4δ: Component E1δ Connection Part; 4a: Conductive Connection Member; 5: Optical Wiring; 51: Core Part; 52: Coating Part; 521: First Cladding; 522: Second Cladding; 6: Support Substrate; 7, 7α, 7δ: Support Members; 7β1, 7γ1: Component Support Members; 7β2, 7γ2: Optical Wiring Part Support Members; A1, A1δ: Component Areas; A2, A2δ: Optical Wiring Areas; E1, E2: Components; E1a, E2a: Electrodes; E1b, E1δb: Light-Receiving or Light-Emitting Parts; E1c, E1δc: Light-Receiving or Light-Emitting Surfaces.

Claims

1. A wiring substrate comprising: An electrical wiring portion including an insulating layer and a conductor layer; An optical wiring region provided on one surface of the electrical wiring portion; and A component region provided on the one surface of the electrical wiring portion where components can be arranged, wherein An optical wiring is arranged on the optical wiring region, A support substrate is arranged on the optical wiring.

2. The wiring substrate according to claim 1, wherein A support member is arranged between the electrical wiring portion and the optical wiring.

3. The wiring substrate according to claim 2, wherein The support member is arranged within the optical wiring region.

4. The wiring substrate according to claim 2, wherein The support member is arranged so as to straddle the optical wiring region and the component region.

5. The wiring substrate according to claim 2, wherein The support member is arranged so as to protrude from an end portion of the wiring substrate.

6. The wiring substrate according to claim 1, wherein End faces of the optical wiring and the support substrate are formed to be coplanar.

7. The wiring substrate according to claim 1, wherein The optical wiring region and the component region are separated from each other in a plan view.

8. The wiring substrate according to claim 1, wherein The optical wiring region and the component region partially overlap with the support member in a plan view.

9. The wiring substrate according to claim 2, wherein The electrical wiring portion has a connection portion connected to the component optically coupled to the optical wiring.

10. The wiring substrate according to claim 9, wherein The connection portion is formed on the one surface of the electrical wiring portion close to the support member.

11. The wiring substrate according to claim 10, wherein A conductive connection member is formed on the connection portion.

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