Dispensing height measuring mechanism of die bonder

Abstract

The present application relates to a kind of dispensing height measuring mechanism of die bonder, including workbench, transmission component, dispensing function head and height measuring function head, workbench is provided with first stand and second stand, the top of first stand is provided with X-axis displacement mechanism, the output end of X-axis displacement mechanism is provided with Y-axis displacement mechanism, the output end of Y-axis displacement mechanism is provided with Z-axis displacement mechanism, the output end of Z-axis displacement mechanism is provided with dispensing function head and height measuring function head, transmission component is set on second stand.The present application simplifies the overall structure of equipment, reduces floor area, is conducive to arranging more production equipment in limited space, improves the utilization of production site, dispensing and height measuring can be completed in the same station, reduces the error caused by multiple positioning, improves the reliability and consistency of product, can be flexibly adjusted according to different production process requirements, adapts to the fixing requirements of multiple types of chips, provides more broad application prospect.

Description

Technical Field

[0001] This invention relates to the field of die bonder technology, and in particular to a dispensing height measuring mechanism for a die bonder. Background Technology

[0002] With the development of semiconductor packaging technology, die bonders are increasingly widely used in the electronics manufacturing industry. Die bonders are mainly used to precisely fix chips onto substrates or lead frames, and are one of the indispensable key pieces of equipment in the semiconductor packaging process. Among these processes, dispensing and height measurement are crucial steps that directly affect the chip fixing effect and the overall packaging quality.

[0003] Traditional die bonders typically include separate dispensing and height measurement units. However, this separate design has some significant drawbacks: firstly, because dispensing and height measurement functions belong to different modules, the overall structure of the equipment is complex, occupies a large space, and increases maintenance difficulty and cost; secondly, if the height measurement is inaccurate during dispensing, it can easily cause uneven dispensing thickness, affecting the quality of subsequent chip bonding and potentially even causing product quality problems. Summary of the Invention

[0004] This invention aims to at least solve the technical problems existing in the prior art. To this end, this invention proposes a dispensing height measurement mechanism for a die bonder, which can achieve precise positioning, simplify the equipment structure, reduce the floor space, and improve the accuracy and efficiency of dispensing and height measurement, thereby improving the overall production quality and work efficiency. Dispensing and height measurement can be completed at the same station, reducing errors caused by multiple positioning, and further improving the reliability and consistency of the products.

[0005] According to some embodiments of the present invention, a dispensing height measuring mechanism for a die bonder is characterized in that it includes a worktable, a transmission component, a dispensing functional head, and a height measuring functional head. A first support and a second support are provided on the worktable. An X-axis displacement mechanism is provided at the top of the first support. A Y-axis displacement mechanism is provided at the output end of the X-axis displacement mechanism. A Z-axis displacement mechanism is provided at the output end of the Y-axis displacement mechanism. A first connecting plate is provided at the output end of the Z-axis displacement mechanism. The dispensing functional head and the height measuring functional head are provided at the front end of the first connecting plate. The transmission component is disposed on the second support and is arranged along the X-axis direction. The transmission component is located at the bottom of the Z-axis displacement mechanism.

[0006] According to some embodiments of the present invention, a dispensing height measuring mechanism for a die bonder has at least the following beneficial effects:

[0007] This invention integrates the dispensing head and the height measuring head onto the same mobile platform, greatly simplifying the overall structure of the equipment, reducing the floor space required, and facilitating the arrangement of more production equipment in a limited space, thus improving the utilization rate of the production site. It employs X-axis, Y-axis, and Z-axis displacement mechanisms to achieve precise positioning in three dimensions, ensuring the accuracy of dispensing and height measurement. Since dispensing and height measurement can be completed at the same workstation, it reduces errors caused by multiple positioning steps, thereby improving product reliability and consistency. It can be flexibly adjusted according to different production process requirements, adapting to the fixed requirements of various types of chips, exhibiting strong versatility and expandability, and providing a broader application prospect.

[0008] According to some embodiments of the present invention, a dispensing height measuring mechanism for a die bonder includes a height measuring head comprising a 2D camera, a height measuring sensor, a beam splitter, and a light source. A first connecting block is disposed at the upper end of a first connecting plate, the 2D camera is disposed on the first connecting block, a second connecting block is disposed at the lower end of the first connecting plate, the beam splitter is disposed on the second connecting block, the light source is disposed at the bottom of the second connecting block, the height measuring sensor is disposed on the outer side of the second connecting block, and the 2D camera and the height measuring sensor are respectively disposed at the top and front end of the beam splitter.

[0009] According to some embodiments of the present invention, in a die bonder dispensing height measuring mechanism, the bottom of the first stand extends towards the front end to form an assembly platform, the height of the second stand is less than the height of the first stand, and the transmission component is located at the bottom of the assembly platform.

[0010] According to some embodiments of the present invention, a dispensing height measuring mechanism for a die bonder is provided with a third connecting plate at the output end of the Y-axis displacement mechanism, a fourth connecting plate at the rear end of the Z-axis displacement mechanism, a fixing frame on the third connecting plate, and the fixing frame being connected to the fourth connecting plate.

[0011] According to some embodiments of the present invention, a dispensing height measuring mechanism for a die bonder includes a Z-axis displacement mechanism comprising a drive motor and a right-angle commutator. The drive motor is mounted on the third connecting plate, and a rotating shaft is mounted at the output end of the drive motor. The right-angle commutator is mounted at the rear end of the fourth connecting plate, and the rotating shaft is connected to the input end of the right-angle commutator. A lead screw is mounted at the output end of the right-angle commutator. A lead screw nut is mounted at the rear end of the first connecting plate, and the lead screw nut is connected to the lead screw. The rotating shaft is positioned along the Y-axis direction, and the lead screw is positioned along the Z-axis direction.

[0012] According to some embodiments of the present invention, a dispensing height measuring mechanism for a die bonder includes a transmission assembly comprising a frame, a linear drive mechanism, a lifting mechanism, and a lifting platform. A first connecting frame is provided at the front end of the frame, and a second connecting frame is provided at the front end of the first connecting frame. A first clearance space is provided between the frame and the first connecting frame, and a second clearance space is provided between the first connecting frame and the second connecting frame. The linear drive mechanism is located at the top of the frame, and its output end is connected to the lifting mechanism. The lifting mechanism is located within the first clearance space, and its output end is connected to the lifting platform. A connecting portion is provided at the rear end of the lifting platform, and a first clearance groove is provided at the top of the connecting portion. The first connecting frame is located within the first clearance groove, and the front end of the lifting platform extends into the second clearance space.

[0013] According to some embodiments of the present invention, a dispensing height measuring mechanism for a die bonder includes a first fixing plate at the output end of the lifting mechanism, a second fixing plate at the bottom of the first fixing plate, positioning blocks on both sides of the rear end of the lifting platform, a positioning groove between the two positioning blocks, and the bottom of the second fixing plate connected to the bottom of the positioning groove.

[0014] According to some embodiments of the present invention, a dispensing height measuring mechanism for a die bonder includes a gas connection port on each positioning block, a first gas flow channel on both the left and right ends of the connection portion, a second gas flow channel on the rear end of the lifting platform, a receiving space in the middle of the lifting platform, and multiple receiving slots on the top of the lifting platform. The gas connection port, the first gas flow channel, the second gas flow channel, the receiving space, and the receiving slots are sequentially connected and arranged in an array.

[0015] According to some embodiments of the present invention, a dispensing height measuring mechanism for a die bonder includes a second gas channel arranged laterally, two first gas channels respectively communicating with both ends of the second gas channel, and an elongated notch provided at the top of the first gas channel, wherein the accommodating space communicates with the second gas channel through the notch.

[0016] According to some embodiments of the present invention, a dispensing height measuring mechanism for a die bonder is provided, wherein both the dispensing functional head and the height measuring functional head are located at the top of the second clearance space.

[0017] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0019] Figure 1 This is a schematic diagram of the structure of an embodiment of the present invention.

[0020] Figure 2 This is a side view of an embodiment of the present invention.

[0021] Figure 3 This is a schematic diagram of the dispensing head and the height measuring head according to an embodiment of the present invention.

[0022] Figure 4 This is a schematic diagram of the Y-axis displacement mechanism of this invention with the fixing frame removed.

[0023] Figure 5 This is a schematic diagram of the transmission component according to an embodiment of the present invention.

[0024] Figure 6 This is a schematic diagram of the lifting mechanism according to an embodiment of the present invention.

[0025] Figure 7 This is a cross-sectional view of the lifting mechanism according to an embodiment of the present invention.

[0026] Figure 8 For Figure 7 Enlarged view of part A in the middle.

[0027] Reference numerals: 1. Worktable; 2. Transmission assembly; 3. Dispensing head; 4. Height measuring head; 5. First upright; 6. Second upright; 7. X-axis displacement mechanism; 8. Y-axis displacement mechanism; 9. Z-axis displacement mechanism; 10. First connecting plate; 11. 2D camera; 12. Height sensor; 13. Beam splitter; 14. Light source; 15. First connecting block; 16. Second connecting block; 17. Assembly platform; 18. Third connecting plate; 19. Fourth connecting plate; 20. Fixing frame; 21. Drive motor; 22. Right-angle commutator; 23. Rotating shaft; 24. Lead screw; 25. Lead screw nut; 26. Frame; 27. Linear drive mechanism; 28. Lifting mechanism. 29. Lifting platform; 30. First connecting frame; 31. Second connecting frame; 32. First clearance space; 33. Second clearance space; 34. Connecting part; 35. First clearance groove; 36. First fixing plate; 37. Second fixing plate; 38. Positioning block; 39. Positioning groove; 40. Gas connection port; 41. First gas flow channel; 42. Second gas flow channel; 43. Long strip notch; 44. Accommodation space; 45. Receiving groove; 46. Assembly plate; 47. First step; 48. Second step; 49. Third connecting plate; 50. Second clearance groove; 51. First boss; 52. Second boss; 53. Third connecting frame; 54. Third clearance groove. Detailed Implementation

[0028] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0029] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, left, right, front, and back, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the module or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0030] In the description of this invention, the use of "first" and "second" is for the purpose of distinguishing technical features only, and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of the technical features indicated.

[0031] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0032] like Figures 1-8 As shown in the figure, an embodiment of the present invention provides a dispensing height measuring mechanism for a die bonder.

[0033] A dispensing height measuring mechanism for a die bonder includes a worktable 1, a transmission component 2, a dispensing functional head 3, and a height measuring functional head 4. The worktable 1 is provided with a first support 5 and a second support 6. An X-axis displacement mechanism 7 is provided at the top of the first support 5. A Y-axis displacement mechanism 8 is provided at the output end of the X-axis displacement mechanism 7. A Z-axis displacement mechanism 9 is provided at the output end of the Y-axis displacement mechanism 8. A first connecting plate 10 is provided at the output end of the Z-axis displacement mechanism 9. The dispensing functional head 3 and the height measuring functional head 4 are provided at the front end of the first connecting plate 10. The transmission component 2 is mounted on the second support 6 and is arranged along the X-axis direction. The transmission component 2 is located at the bottom of the Z-axis displacement mechanism 9.

[0034] This invention integrates the dispensing head 3 and the height measuring head 4 onto the same mobile platform, greatly simplifying the overall structure of the equipment, reducing the floor space, and facilitating the arrangement of more production equipment in a limited space, thus improving the utilization rate of the production site. The use of X-axis, Y-axis, and Z-axis displacement mechanisms achieves precise positioning in three dimensions, ensuring the accuracy of dispensing and height measurement. Since dispensing and height measurement can be completed at the same workstation, errors caused by multiple positioning steps are reduced, thereby improving product reliability and consistency. It can be flexibly adjusted according to different production process requirements, adapting to the fixed requirements of various types of chips, exhibiting strong versatility and expandability, and providing a broader application prospect.

[0035] The dispensing height measuring mechanism described in this embodiment includes a height measuring head 4 comprising a 2D camera 11, a height sensor 12, a beam splitter 13, and a light source 14. A first connecting block 15 is provided at the upper end of the first connecting plate 10, and the 2D camera 11 is mounted on the first connecting block 15. A second connecting block 16 is provided at the lower end of the first connecting plate 10, and the beam splitter 13 is mounted on the second connecting block 16. The light source 14 is located at the bottom of the second connecting block 16, and the height sensor 12 is located on the outside of the second connecting block 16. The 2D camera 11 and the height sensor 12 are respectively located at the top and front end of the beam splitter 13. Specifically, the height sensor 12 uses a laser sensor, and the beam splitter 13 is set so that the 2D camera 11 and the height sensor 12 are coaxial. The 2D camera can be accurately positioned, while the height sensor can monitor the amount of glue dispensing. Based on the amount of glue dispensing the previous point, the amount of glue dispensing the next point can be adjusted. This design provides more accurate height measurement data, ensuring the accuracy of the dispensing process. It not only improves the detection accuracy but also enhances the adaptability and flexibility of the system.

[0036] In the dispensing height measuring mechanism described in this embodiment, the bottom of the first upright 5 extends towards the front to form an assembly platform 17. The height of the second upright 6 is less than the height of the first upright 5, and the transmission component 2 is located at the bottom of the assembly platform 17. Specifically, the assembly platform 17 formed by the extension of the bottom of the first upright towards the front provides a stable foundation for other components, while the lower height design of the second upright optimizes the overall structural layout. The assembly platform 17 can accommodate the transmission component 2. The first upright 5 and the second upright 6 raise the overall structure, facilitating the layout of various devices and lines.

[0037] In this embodiment, the dispensing height measuring mechanism has a third connecting plate 18 at the output end of the Y-axis displacement mechanism 8 and a fourth connecting plate 19 at the rear end of the Z-axis displacement mechanism 9. A fixing frame 20 is mounted on the third connecting plate 18 and connected to the fourth connecting plate 19. Specifically, by setting the third connecting plate 18 at the output end of the Y-axis displacement mechanism 8 and the fourth connecting plate 19 at the rear end of the Z-axis displacement mechanism 9, and connecting the fixing frame 20 to both, the stability of the entire moving system is increased, ensuring the accuracy and repeatability of the position during dispensing and height measurement. The third connecting plate 18 is connected to the output end of the Y-axis displacement mechanism 8 via the fixing frame 20.

[0038] The dispensing height measuring mechanism described in this embodiment includes a Z-axis displacement mechanism 9 comprising a drive motor 21 and a right-angle commutator 22. The drive motor 21 is mounted on the third connecting plate 18, and its output end is provided with a rotating shaft 23. The right-angle commutator 22 is located at the rear end of the fourth connecting plate 19, with the rotating shaft 23 connected to the input end of the right-angle commutator 22. The output end of the right-angle commutator 22 is provided with a lead screw 24, and a lead screw nut 25 is provided at the rear end of the first connecting plate 10, connected to the lead screw 24. The rotating shaft 23 is positioned along the Y-axis, and the lead screw 24 is positioned along the Z-axis. Specifically, the design of the drive motor and right-angle commutator 22 in the Z-axis displacement mechanism 9 achieves efficient vertical motion conversion, improves the positioning speed and accuracy in the Z-axis direction, reduces energy consumption, and extends the service life of the equipment. It is understandable that, since the transmission component is located at the bottom of the X, Y, Z axis displacement mechanism, and the assembly platform 17 is formed by extending from the bottom of the first stand 5 to the front end, the present invention can adjust the center of gravity to a certain extent by setting the drive motor 21 on the third connecting plate 18.

[0039] The dispensing height measuring mechanism described in this embodiment includes a transmission component 2 comprising a frame 26, a linear drive mechanism 27, a lifting mechanism 28, and a lifting platform 29. A first connecting frame 30 is provided at the front end of the frame 26, and a second connecting frame 31 is provided at the front end of the first connecting frame 30. A first clearance space 32 is provided between the frame 26 and the first connecting frame 30, and a second clearance space 33 is provided between the first connecting frame 30 and the second connecting frame 31. The linear drive mechanism 27 is located at the top of the frame 26, and its output end is connected to the lifting mechanism 28. The lifting mechanism 28 is located within the first clearance space 32, and its output end is connected to the lifting platform 29. A connecting portion 34 is provided at the rear end of the lifting platform 29, and a first clearance groove 35 is provided at the top of the connecting portion 34. The first connecting frame 30 is located within the first clearance groove 35, and the front end of the lifting platform 29 extends into the second clearance space 33. Specifically, by designing the first avoidance space 32 and the second avoidance space 33, the linear drive mechanism 27 and the lifting mechanism 28 avoid direct contact with the track or other fixed components during operation, thereby significantly reducing the possibility of metal dust and mechanical vibration caused by friction. This helps prevent semiconductor products from being contaminated, ensures that their electrical performance is not affected, protects the chips from the risk of being scattered due to vibration, and thus improves the quality of the final product and reduces maintenance costs. At the same time, the first avoidance groove 35 is provided at the connection part at the rear end of the lifting platform 29, and the first connecting frame 30 is located therein, so that the overall structure does not occupy the space at the bottom of the rack. The clever avoidance is conducive to the placement of various components at the bottom of the rack.

[0040] In the dispensing height measuring mechanism described in this embodiment, the output end of the lifting mechanism 28 is provided with a first fixing plate 36, and the bottom of the first fixing plate 36 is provided with a second fixing plate 37. Positioning blocks 38 are provided on both sides of the rear end of the lifting platform 29, and a positioning groove 39 is provided between the two positioning blocks 38. The bottom of the second fixing plate 37 is connected to the bottom of the positioning groove 39. Specifically, by providing gas connection ports on the positioning blocks 38 and providing first and second gas flow channels, a receiving space, and a receiving groove on the lifting platform 29, a complete gas flow path is formed, which can adsorb the chip into the receiving groove, greatly improving the stability of chip transmission.

[0041] In the dispensing height measuring mechanism described in this embodiment, each positioning block 38 is provided with a gas connection port 40. The left and right ends of the connecting portion 34 are each provided with a first gas flow channel 41. The rear end of the lifting platform 29 is provided with a second gas flow channel 42, which is arranged laterally. The two first gas flow channels 41 are respectively connected to both ends of the second gas flow channel 42. The top of the first gas flow channel 41 is provided with an elongated notch 43, and the accommodating space 44 is connected to the second gas flow channel 42 through the notch 43. The middle part of the lifting platform 29 is provided with an accommodating space 44, and the top of the lifting platform 29 is provided with multiple receiving slots 45. The gas connection port 40, the first gas flow channel 41, the second gas flow channel 42, the accommodating space 44, and the receiving slots 45 are sequentially connected, and the receiving slots 45 are arranged in an array. Specifically, by setting a gas connection port 40 on the positioning block 38 and setting a first and second gas flow channels 41 and 42, a accommodating space 44 and a receiving groove 45 on the lifting platform 29, a complete gas flow path is formed, which can adsorb the chip in the receiving groove 45, greatly improving the stability of chip transmission.

[0042] In this embodiment of the dispensing height measuring mechanism, since the positioning block 38 is located on both sides of the positioning groove 39, the first gas flow channel 41 will connect to both sides of the second gas flow channel 42, and the connecting part 34 is provided with a first clearance groove 35. The first gas flow channel 41 needs to be angled. Therefore, the width L3 of the first gas flow channel 41 and the width L4 of the second gas flow channel 42 should be greater than the height L5 of the accommodating space 44 to ensure the efficiency of the gas in the accommodating space 44 being drawn into the first gas flow channel 41 from the second gas flow channel 42 and finally drawn out from the gas connection port 40. The above-mentioned dimensions of the flow channels and the accommodating space 44 ensure the chip adsorption effect of this embodiment with the first clearance groove 35.

[0043] In this embodiment, the dispensing and height measuring mechanism has both the dispensing head 3 and the height measuring head 4 located at the top of the second clearance space 33. Specifically, this design, where both the dispensing head 3 and the height measuring head 4 are located at the top of the second clearance space 33, makes full use of the space while avoiding mutual interference, ensuring efficient dispensing and height measuring operations, and improving overall work efficiency and product quality.

[0044] In this embodiment, the dispensing height measuring mechanism includes an output end mounting plate 46 for the linear drive mechanism 27, and the lifting mechanism 28 is mounted on the mounting plate 46. Specifically, the output end of the linear drive mechanism 27 is mounted on the mounting plate 46 to ensure precise control during operation and improve the reliability of the entire transmission assembly.

[0045] In the dispensing height measuring mechanism described in this embodiment, a first step 47 is provided on the top of the first connecting plate 10 near the second connecting plate 19, and a second step 48 is provided on the top of the second connecting plate 19 near the first connecting plate 10. The first step 47 and the second step 48 are correspondingly arranged. Specifically, the corresponding steps are provided between the first connecting plate 10 and the second connecting plate 19, allowing the lifting platform 29 to rise and fall between the two steps, thus limiting the range of forward and backward movement of the lifting platform 29.

[0046] In the dispensing height measuring mechanism described in this embodiment, the distance between the top of the first recess 35 and the bottom of the first connecting frame 30 is L1, and the height between the first step 47 and the second step 48 is L2, where L1 is less than L2. Specifically, L1 refers to the distance between the top of the first recess 35 and the bottom of the first connecting frame 30 when the lifting platform 29 is at its lowest position. That is, the highest height that the lifting platform 29 can rise is less than the height between the first step 47 and the second step 48, ensuring that the lifting platform 29 is always located between the first step 47 and the second step 48.

[0047] In the dispensing height measuring mechanism described in this embodiment, a plurality of third connecting plates 49 are provided between the first connecting frame 30 and the second connecting frame 31. The bottom of each third connecting plate 49 is recessed upward to form a second clearance groove 50, which is located at the top of the second clearance space 33. Specifically, the provision of a plurality of third connecting plates 49 between the first connecting frame 30 and the second connecting frame 31, with their bottoms recessed upward to form the second clearance groove 50, ensures both connection stability and clearance space, preventing the chip from contacting the chip on the lifting platform 29 during chip transmission.

[0048] In the dispensing height measuring mechanism described in this embodiment, two second uprights 6 are provided. Each of the front and rear ends of the second upright 6 is provided with a first protrusion 51 and a second protrusion 52, respectively. A third connecting frame 53 is provided at the front end of the second connecting frame 31, and the third connecting frame 53 is connected to the top of the first protrusion 51. Both ends of the frame 26 are connected to the two second protrusions 52, respectively. A third clearance groove 54 is provided between the first protrusion 51 and the second protrusion 52. The first clearance space 32 and the second clearance space 33 are both located at the top of the third clearance groove 54. Specifically, the design of the first protrusion 51 and the second protrusion 52 at the front and rear ends of the uprights, as well as the third connecting frame 53, provides a solid foundation for the entire device. The formed third clearance groove 54 can accommodate the lifting mechanism 28 and the lifting platform 29, meaning that both the lifting mechanism 28 and the lifting platform 29 are within the third clearance groove 54, allowing for smooth sliding without interference.

[0049] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A dispensing height measuring mechanism for a die bonder, characterized in that: The system includes a worktable, a transmission assembly, a dispensing head, and a height measuring head. The worktable is equipped with a first and a second upright. An X-axis displacement mechanism is located at the top of the first upright, with a Y-axis displacement mechanism at its output end, and a Z-axis displacement mechanism at its output end. A first connecting plate is located at the output end of the Z-axis displacement mechanism, and the dispensing head and height measuring head are located at the front end of the first connecting plate. The transmission assembly is mounted on the second upright, oriented along the X-axis, and located at the bottom of the Z-axis displacement mechanism. The transmission assembly includes a frame, a linear drive mechanism, a lifting mechanism, and a lifting platform. A first connecting frame is located at the front end of the frame, and a second connecting frame is located at the front end of the first connecting frame. A first clearance space is provided between the frame and the first connecting frame, and a second clearance space is provided between the first and second connecting frames. The linear drive mechanism is located at the top of the frame, and its output end is connected to the lifting mechanism. The lifting mechanism is located within the first clearance space. The output end of the lifting mechanism is connected to the lifting platform. The rear end of the lifting platform is provided with a connecting part, and the top of the connecting part is provided with a first clearance groove. The first connecting frame is located in the first clearance groove. The front end of the lifting platform extends into the second clearance space. The output end of the lifting mechanism is provided with a first fixing plate, and the bottom of the first fixing plate is provided with a second fixing plate. Positioning blocks are provided on both sides of the rear end of the lifting platform, and a positioning groove is provided between the two positioning blocks. The bottom of the second fixing plate is connected to the bottom of the positioning groove. Each positioning block is provided with a gas connection port. The left and right ends of the connecting part are provided with a first gas flow channel, and the rear end of the lifting platform is provided with a second gas flow channel. The middle part of the lifting platform is provided with an accommodating space, and the top of the lifting platform is provided with multiple accommodating slots. The gas connection ports, the first gas flow channels, the second gas flow channels, the accommodating space, and the accommodating slots are sequentially connected, and the accommodating slots are arranged in an array.

2. The dispensing height measuring mechanism for a die bonder according to claim 1, characterized in that: The height measuring head includes a 2D camera, a height sensor, a beam splitter, and a light source. A first connecting block is provided at the upper end of the first connecting plate, and the 2D camera is provided on the first connecting block. A second connecting block is provided at the lower end of the first connecting plate, and the beam splitter is provided on the second connecting block. The light source is provided at the bottom of the second connecting block, and the height sensor is provided on the outside of the second connecting block. The 2D camera and the height sensor are respectively provided at the top and front end of the beam splitter.

3. The dispensing height measuring mechanism for a die bonder according to claim 1, characterized in that: The bottom of the first stand extends towards the front to form an assembly platform, the height of the second stand is less than the height of the first stand, and the transmission component is located at the bottom of the assembly platform.

4. The dispensing height measuring mechanism for a die bonder according to claim 1, characterized in that: The output end of the Y-axis displacement mechanism is provided with a third connecting plate, and the rear end of the Z-axis displacement mechanism is provided with a fourth connecting plate. A fixing frame is provided on the third connecting plate, and the fixing frame is connected to the fourth connecting plate.

5. The dispensing height measuring mechanism for a die bonder according to claim 4, characterized in that: The Z-axis displacement mechanism includes a drive motor and a right-angle commutator. The drive motor is mounted on the third connecting plate, and a rotating shaft is provided at the output end of the drive motor. The right-angle commutator is located at the rear end of the fourth connecting plate, and the rotating shaft is connected to the input end of the right-angle commutator. A lead screw is provided at the output end of the right-angle commutator. A lead screw nut is provided at the rear end of the first connecting plate, and the lead screw nut is connected to the lead screw. The rotating shaft is arranged along the Y-axis direction, and the lead screw is arranged along the Z-axis direction.

6. The dispensing height measuring mechanism for a die bonder according to claim 1, characterized in that: The second gas flow channel is arranged horizontally, and the two first gas flow channels are respectively connected to the two ends of the second gas flow channel. The top of the first gas flow channel is provided with an elongated notch, and the accommodating space is connected to the second gas flow channel through the notch.

7. The dispensing height measuring mechanism for a die bonder according to claim 1, characterized in that: Both the dispensing head and the height measuring head are located at the top of the second clearance space.

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