A high-precision polishing machine for semiconductor cavity

Abstract

The present invention belongs to the field of semiconductor processing technology, and specifically relates to a high-precision polishing machine for semiconductor cavities, which includes a guide rail seat, a motor, a shaft sleeve, a support plate, a transmission cylinder and a polishing assembly fixedly connected; the polishing assembly includes a bracket, a protective shell, a shell, a take-up box, a spliced ​​polishing belt, a support roller and an adjusting roller. The present invention pulls the spliced ​​polishing belt through the adjusting roller, and the spliced ​​polishing belt drives the sliding roller 2 on the support roller to slide along the slide groove 1, thereby reducing the volume of the polishing assembly, allowing the polishing assembly to easily extend into a small-diameter cavity, increasing the operating space of the polishing assembly, and reducing the probability of the polishing assembly colliding with the cavity. While reducing the volume of the polishing assembly, the present invention switches the coarse-grained polishing belt to a fine-grained polishing belt. Polishing the small-diameter cavity with the coarse-grained polishing belt can ensure polishing accuracy and avoid excessive surface roughness of the small-diameter cavity, which leads to reduced accuracy of high-precision devices.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor processing, and in particular relates to a high-precision polishing machine for a semiconductor cavity. Background Art

[0002] A semiconductor cavity is a hollow structure used to house, protect, or implement specific functions within a semiconductor device or system. During its manufacture, semiconductor cavities require grinding and polishing to improve precision and reduce the side effects of machining burrs and rough edges.

[0003] In the prior art, during the polishing process of semiconductor cavities, polishing pieces are generally of fixed size. During the polishing process of small-diameter semiconductor cavities, it is difficult for the polishing piece to extend into the interior, which limits the operation and causes the polishing piece to easily bump into the cavity during the polishing process.

[0004] Furthermore, semiconductor cavities of different diameters require different polishing materials. Small-diameter cavities are typically used for high-precision devices and require higher polishing accuracy, as any minor flaw can significantly impact performance. Therefore, finer polishing tapes, such as those made with smaller abrasives, are required. Large-diameter cavities are often used in packaging or basic manufacturing (such as wafer-level processing). Due to their larger size, they have a higher tolerance for minor defects and generally use coarser polishing tapes. Summary of the Invention

[0005] The purpose of the present invention is to provide a high-precision polishing machine for semiconductor cavity in view of the shortcomings of the prior art, so as to solve the technical problems in the prior art.

[0006] The object of the present invention can be achieved through the following technical solutions: a high-precision polishing machine for a semiconductor cavity, which includes a guide rail seat, the guide rail seat is connected to the guide rail on the workbench, a motor is installed on the guide rail seat, the motor output end is fixedly connected to the shaft sleeve, a support plate is installed on the guide rail seat, a transmission cylinder is rotatably installed on the support plate, the transmission cylinder is fixedly connected to the polishing assembly, the shaft sleeve is connected to the transmission shaft through a slider slot, and the other end of the transmission shaft is connected to the transmission cylinder for transmission; the polishing assembly includes a bracket and a protective shell and a shell respectively installed at both ends of the bracket, a take-up box is installed in the protective shell, a spliced ​​polishing belt is installed in the bracket, a number of support rollers and adjusting rollers are slidably installed in the bracket, the spliced ​​polishing belt passes through the support roller and the adjusting roller in turn for installation, a sliding roller is installed on the adjusting roller, a sleeve is sleeved on the sliding roller, the sleeve is connected to the take-up roller inside the take-up box by a rope, the take-up roller inside the take-up box is coaxially connected to the transmission sleeve, and the transmission shaft is connected to the transmission sleeve for transmission by pushing the transmission shaft.

[0007] As a further optimization or improvement of this solution, a slide groove 1 and a slide groove 2 are respectively provided on the bracket, the support roller is slidingly connected to the slide groove 1 through the slide roller 2, a compression spring is installed in the slide groove 1, the compression spring is connected to the slide roller 2, and the adjustment roller is slidingly connected to the slide groove 2 through the slide roller 1.

[0008] As a further optimization or improvement of this solution, an outer groove is opened in the second slide groove, a rack is built in the outer groove, a gear ring is installed on the slide roller, the gear ring is connected to the rack by transmission, and the spliced ​​grinding belt consists of a coarse-grained grinding belt and a fine-grained grinding belt.

[0009] As a further optimization or improvement of this solution, a pressure plate is installed in the shell, and the pressure plate slides with the shell through a slide rod. A reset spring is installed between the slide rod and the shell, and an electromagnetic suction cup 2 is installed on the side of the bracket close to the shell, and the electromagnetic suction cup 2 adsorbs the pressure plate.

[0010] As a further optimization or improvement of this solution, a pressure block is installed on the sliding roller one and the sliding roller two, and the pressure plate fixes the positions of the supporting roller and the adjusting roller by pressing the pressure block.

[0011] As a further optimization or improvement of this solution, an electromagnetic suction cup is installed in the transmission sleeve, and a magnetic metal block is installed on the transmission shaft, and the electromagnetic suction cup absorbs the magnetic metal block; when the electromagnetic suction cup is energized, the electromagnetic suction cup absorbs the magnetic metal block, causing the transmission shaft to move into the transmission sleeve, and at this time the transmission shaft is transmission-connected with the transmission sleeve; when the electromagnetic suction cup is de-energized, the transmission shaft is reset, so that the transmission shaft is transmission-connected with the transmission cylinder again.

[0012] As a further optimization or improvement of this solution, a threading barrel is installed inside the bracket.

[0013] Beneficial effects of the present invention:

[0014] (1) The present invention stores the rope into the take-up box by rotating the take-up roller. The rope drives the sliding roller 1 and the adjusting roller to slide along the sliding groove 2 through the sleeve, so that the adjusting roller pulls the spliced ​​grinding belt. The spliced ​​grinding belt is pulled by the adjusting roller, and the spliced ​​grinding belt drives the sliding roller 2 on the support roller to slide along the sliding groove 1, so that the support roller shrinks toward the inside of the bracket, reducing the volume of the grinding assembly, so that the grinding assembly can be easily inserted into a small-diameter cavity, increasing the operating space of the grinding assembly, and reducing the probability of the grinding assembly colliding with the cavity.

[0015] While reducing the volume of the polishing component, the present invention switches the coarse-grained polishing belt to a fine-grained polishing belt. Polishing the small-diameter cavity with the coarse-grained polishing belt can ensure polishing accuracy and avoid excessive surface roughness of the small-diameter cavity, which leads to reduced accuracy of high-precision devices.

[0016] (2) In the process of switching the fine-grained grinding belt, the rope drives the sliding roller 1 to slide along the sliding groove 2, so that the adjusting roller drives the sliding roller 2 on the supporting roller to slide along the sliding groove 1 through the spliced ​​grinding belt. At the same time, the compression spring is compressed. Under the rebound action of the compression spring, the fine-grained grinding belt is gradually stretched, so that the fine-grained grinding belt is tightly attached to the supporting roller, thereby preventing the fine-grained grinding belt from loosening during the polishing of the small-diameter cavity, causing the fine-grained grinding belt to twist. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention will be further described below with reference to the accompanying drawings.

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0019] Figure 2 Schematic diagram of the connection structure between the support plate and the transmission cylinder.

[0020] Figure 3 It is a schematic diagram of the transmission connection between the transmission shaft and the shaft sleeve and the transmission cylinder respectively.

[0021] Figure 4 for Figure 3 A magnified view of the structure of part A.

[0022] Figure 5 Schematic diagram of the internal structure of the protective shell.

[0023] Figure 6 Schematic diagram of the internal structure of the bracket.

[0024] Figure 7 This is a front view of the interior of the protective case.

[0025] Figure 8 for Figure 7 A magnified view of the structure of part B.

[0026] Figure 9 Schematic diagram of the structure of coarse-grained grinding belt and fine-grained grinding belt.

[0027] Figure 10 It is a schematic diagram of the structure of electromagnetic chuck 2.

[0028] Figure 11 This is a schematic diagram of the pressure plate installation position.

[0029] The following are marked in the figure: 1. Guide rail seat; 2. Support plate; 3. Bushing; 4. Drive shaft; 5. Drive cylinder; 6. Grinding assembly; 601. Bracket; 602. Split grinding belt; 6021. Coarse-grained grinding belt; 6022. Fine-grained grinding belt; 603. Protective shell; 604. Shell; 605. Wire take-up box; 606. Drive sleeve; 607. Electromagnetic chuck 1; 608. Magnetic metal block; 609 , slide 1; 610, slide 2; 611, outer groove; 612, support roller; 613, adjusting roller; 614, threading spool; 615, slide roller 1; 616, sleeve; 617, rope; 618, gear ring; 619, rack; 620, slide roller 2; 621, compression spring; 622, pressure block; 623, electromagnetic chuck 2; 624, pressure plate; 625, slide rod; 626, return spring. DETAILED DESCRIPTION

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0031] See also Figures 1-9 , a semiconductor cavity high-precision polishing machine, which includes a guide rail seat 1, the guide rail seat 1 is connected to the guide rail on the workbench, a motor is installed on the guide rail seat 1, the motor output end is fixedly connected to the shaft sleeve 3, a support plate 2 is installed on the guide rail seat 1, a transmission cylinder 5 is rotatably installed on the support plate 2, the transmission cylinder 5 is fixedly connected to the polishing assembly 6, the shaft sleeve 3 is connected to the transmission shaft 4 through a slider slot, and the other end of the transmission shaft 4 is connected to the transmission cylinder 5; the polishing assembly 6 includes a bracket 601 and a protective shell 603 and a shell 604 respectively installed at both ends of the bracket 601, and a receiving assembly is installed in the protective shell 603 Wire box 605, the split grinding belt 602 is installed in the bracket 601, and several support rollers 612 and adjusting rollers 613 are slidably installed in the bracket 601. The split grinding belt 602 passes through the support rollers 612 and the adjusting rollers 613 in sequence. A sliding roller 615 is installed on the adjusting roller 613, and a sleeve 616 is sleeved on the sliding roller 615. The sleeve 616 is connected to the wire take-up roller inside the wire take-up box 605 through a rope 617. The wire take-up roller inside the wire take-up box 605 is coaxially connected to the transmission sleeve 606. By pushing the transmission shaft 4, the transmission shaft 4 is connected to the transmission sleeve 606.

[0032] Specifically, the bracket 601 is respectively provided with a slide groove 1 609 and a slide groove 2 610, the support roller 612 is slidingly connected to the slide groove 1 609 through the slide roller 2 620, a compression spring 621 is installed in the slide groove 1 609, the compression spring 621 is connected to the slide roller 2 620, and the adjustment roller 613 is slidingly connected to the slide groove 2 610 through the slide roller 1 615.

[0033] Specifically, an electromagnetic suction cup 607 is installed in the transmission sleeve 606, and a magnetic metal block 608 is installed on the transmission shaft 4. The electromagnetic suction cup 607 absorbs the magnetic metal block 608; when the electromagnetic suction cup 607 is energized, the electromagnetic suction cup 607 absorbs the magnetic metal block 608, causing the transmission shaft 4 to move into the transmission sleeve 606. At this time, the transmission shaft 4 is transmission-connected with the transmission sleeve 606; when the electromagnetic suction cup 607 is de-energized, the transmission shaft 4 is reset, so that the transmission shaft 4 is transmission-connected with the transmission cylinder 5 again.

[0034] It should be noted that the guide rail base 1 is first installed on the electric guide rail on the workbench, and then the drive motor is fixedly installed on the guide rail base 1, and the motor output end is connected to the shaft sleeve 3 by bolts. The polishing assembly 6 is moved by the guide rail and driven by the motor to rotate to polish the semiconductor cavity.

[0035] Large-caliber cavity polishing; Under normal conditions, after the motor is started, the motor drives the transmission shaft 4 to rotate through the shaft sleeve 3. Under the action of the transmission shaft 4 and the transmission cylinder 5, the motor drives the bracket 601 to rotate. Figure 9 At this time, the semiconductor large-diameter cavity is polished by the coarse-grained grinding belt 6021.

[0036] Polishing of small-diameter cavities; When polishing of small-diameter cavities is required, the electromagnetic chuck 607 is energized, and the electromagnetic chuck 607 attracts the magnetic metal block 608 on the transmission shaft 4, causing the transmission shaft 4 to move toward the inside of the transmission sleeve 606. Through the cooperation of the slider on the transmission shaft 4 and the slide groove in the transmission sleeve 606, the transmission shaft 4 and the transmission sleeve 606 are connected in transmission. When the motor drives the transmission shaft 4 to rotate through the shaft sleeve 3, the transmission shaft 4 drives the transmission sleeve 606 to rotate, and the transmission sleeve 606 drives the take-up roller inside the take-up box 605 to rotate. As the take-up roller rotates, Figure 8 The rope 617 is stored in the take-up box 605. The rope 617 drives the sliding roller 1 615 and the adjusting roller 613 to slide along the sliding groove 2 610 through the sleeve 616, causing the adjusting roller 613 to pull the split grinding belt 602. The adjusting roller 613 pulls the split grinding belt 602, which drives the sliding roller 2 620 on the support roller 612 to slide along the sliding groove 1 609, causing the support roller 612 to retract into the bracket 601, reducing the size of the grinding assembly 6. This allows the grinding assembly 6 to easily fit into a small-diameter cavity, increasing the operating space of the grinding assembly 6 and reducing the probability of the grinding assembly 6 colliding with the cavity.

[0037] As roller 1 615 slides along chute 2 610 , the toothed ring 618 on roller 1 615 meshes with the rack 619. As roller 1 615 slides along chute 2 610 , it drives adjustment roller 613 to rotate, which in turn drives the combined polishing belt 602 to move. As the combined polishing belt 602 rotates, the fine-grained polishing belt 6022 replaces the coarse-grained polishing belt 6021. While reducing the volume of the polishing assembly 6 , the present invention switches from the coarse-grained polishing belt 6021 to the fine-grained polishing belt 6022. Polishing small-diameter cavities with the coarse-grained polishing belt 6021 ensures polishing accuracy and prevents excessive surface roughness in small-diameter cavities, which could reduce the accuracy of high-precision components.

[0038] Fixed position: Electromagnetic chuck 2 623 is energized, attracting pressure plate 624 within housing 604. Pressure plate 624 presses against pressure blocks 622 on slide roller 2 620 and slide roller 1 615, securing support roller 612 and adjustment roller 613 in their current positions. Electromagnetic chuck 1 607 is de-energized, automatically resetting drive shaft 4 and establishing a transmission connection with drive cylinder 5. The motor drives bracket 601 to rotate, causing fine-grained grinding belt 6022 to polish the small-diameter cavity.

[0039] It should be noted that because fine-grained polishing belt 6022 is primarily used for fine polishing, with fine abrasive particles and a soft substrate, fine-grained polishing belt 6022 has a relatively high overall elasticity. Because coarse-grained polishing belt 6021 has coarse abrasive particles and a hard substrate, coarse-grained polishing belt 6021 has a relatively low overall elasticity, resulting in less deformation during polishing. After switching from coarse-grained polishing belt 6021 to fine-grained polishing belt 6022, due to its inherent softness and high elasticity, fine-grained polishing belt 6022 is prone to loosening due to inertia during the polishing of small-diameter cavities, resulting in displacement or distortion of fine-grained polishing belt 6022.

[0040] In the process of switching from the coarse-grained grinding belt 6021 to the fine-grained grinding belt 6022 of the present invention, the rope 617 drives the sliding roller 1 615 to slide along the sliding groove 2 610, so that the sliding roller 1 615 and the adjusting roller 613 move toward the inside of the bracket 601. At this time, the adjusting roller 613 drives the sliding roller 2 620 on the supporting roller 612 to slide along the sliding groove 1 609 through the spliced ​​grinding belt 602. At the same time, the compression spring 621 is compressed. Under the rebound action of the compression spring 621, the fine-grained grinding belt 6022 is gradually stretched, so that the fine-grained grinding belt 6022 is tightly attached to the supporting roller 612, thereby preventing the fine-grained grinding belt 6022 from loosening during the polishing of the small-diameter cavity, causing the fine-grained grinding belt 6022 to twist.

[0041] See also Figure 7-Figure 9An outer groove 611 is provided in the second slide groove 610, and a rack 619 is built in the outer groove 611. A gear ring 618 is installed on the sliding roller 1 615. The gear ring 618 is connected to the rack 619 for transmission. The spliced ​​grinding belt 602 consists of a coarse-grained grinding belt 6021 and a fine-grained grinding belt 6022.

[0042] It should be noted that the combined grinding belt 602 is composed of a coarse-grained grinding belt 6021 and a fine-grained grinding belt 6022. The adjusting roller 613 is driven to slide along the interior of the second chute 610, causing the adjusting roller 613 to drive the second roller 620 on the support roller 612 to slide along the first chute 609 through the combined grinding belt 602, causing the support roller 612 to retract toward the interior of the bracket 601, thereby reducing the volume of the grinding assembly 6. The adjusting roller 613 is driven to slide along the interior of the second chute 610, and the gear ring 618 on the first roller 615 engages with the rack 619, causing the adjusting roller 613 to slide and rotate along the second chute 610, switching from the coarse-grained grinding belt 6021 to the fine-grained grinding belt 6022, and the small-diameter cavity is polished and ground by the fine-grained grinding belt 6022.

[0043] See also Figure 10-11 A pressure plate 624 is installed in the shell 604, and the pressure plate 624 slides with the shell 604 through a slide rod 625. A return spring 626 is installed between the slide rod 625 and the shell 604. An electromagnetic suction cup 2 623 is installed on the side of the bracket 601 close to the shell 604, and the electromagnetic suction cup 2 623 adsorbs the pressure plate 624.

[0044] Specifically, a pressing block 622 is installed on the sliding roller 1 615 and the sliding roller 2 620 , and the pressing plate 624 fixes the positions of the supporting roller 612 and the adjusting roller 613 by pressing the pressing block 622 .

[0045] It should be noted that a pressure block 622 is installed on both the sliding roller 2 620 and the sliding roller 1 615. When the electromagnetic suction cup 2 623 is energized, the electromagnetic suction cup 2 623 adsorbs the pressure plate 624 inside the shell 604. The pressure plate 624 fixes the sliding roller 2 620 and the sliding roller 1 615 on the bracket 601 by pressing the pressure block 622 on the sliding roller 2 620 and the sliding roller 1 615, thereby fixing the current position of the support roller 612 and the adjustment roller 613.

[0046] See also Figure 6 and Figure 9 A threading barrel 614 is installed inside the bracket 601.

[0047] It should be noted that the power supply harnesses of the electromagnetic chuck 2 623 and the electromagnetic chuck 1 607 pass through the wire barrel 614 , thereby preventing the harnesses from interfering with the operation of the polishing assembly 6 .

[0048] Working principle of the present invention: large-caliber cavity polishing; under normal conditions, after the motor is started, the motor drives the transmission shaft 4 to rotate through the shaft sleeve 3, and under the action of the transmission shaft 4 and the transmission cylinder 5, the motor drives the bracket 601 to rotate, see Figure 9 At this time, the semiconductor large-diameter cavity is polished by the coarse-grained grinding belt 6021.

[0049] Polishing of small-diameter cavities; When polishing of small-diameter cavities is required, the electromagnetic chuck 607 is energized, and the electromagnetic chuck 607 attracts the magnetic metal block 608 on the transmission shaft 4, causing the transmission shaft 4 to move toward the inside of the transmission sleeve 606. Through the cooperation of the slider on the transmission shaft 4 and the slide groove in the transmission sleeve 606, the transmission shaft 4 and the transmission sleeve 606 are connected in transmission. When the motor drives the transmission shaft 4 to rotate through the shaft sleeve 3, the transmission shaft 4 drives the transmission sleeve 606 to rotate, and the transmission sleeve 606 drives the take-up roller inside the take-up box 605 to rotate. As the take-up roller rotates, Figure 8 The rope 617 is stored in the take-up box 605. The rope 617 drives the sliding roller 1 615 and the adjusting roller 613 to slide along the sliding groove 2 610 through the sleeve 616, causing the adjusting roller 613 to pull the split grinding belt 602. The adjusting roller 613 pulls the split grinding belt 602, which drives the sliding roller 2 620 on the support roller 612 to slide along the sliding groove 1 609, causing the support roller 612 to retract into the bracket 601, reducing the size of the grinding assembly 6. This allows the grinding assembly 6 to easily fit into a small-diameter cavity, increasing the operating space of the grinding assembly 6 and reducing the probability of the grinding assembly 6 colliding with the cavity.

[0050] As roller 1 615 slides along chute 2 610 , the toothed ring 618 on roller 1 615 meshes with the rack 619. As roller 1 615 slides along chute 2 610 , it drives adjustment roller 613 to rotate, which in turn drives the combined polishing belt 602 to move. As the combined polishing belt 602 rotates, the fine-grained polishing belt 6022 replaces the coarse-grained polishing belt 6021. While reducing the volume of the polishing assembly 6 , the present invention switches from the coarse-grained polishing belt 6021 to the fine-grained polishing belt 6022. Polishing small-diameter cavities with the coarse-grained polishing belt 6021 ensures polishing accuracy and prevents excessive surface roughness in small-diameter cavities, which could reduce the accuracy of high-precision components.

[0051] Fixed position: Electromagnetic chuck 2 623 is energized, attracting pressure plate 624 within housing 604. Pressure plate 624 presses against pressure blocks 622 on slide roller 2 620 and slide roller 1 615, securing support roller 612 and adjustment roller 613 in their current positions. Electromagnetic chuck 1 607 is de-energized, automatically resetting drive shaft 4 and establishing a transmission connection with drive cylinder 5. The motor drives bracket 601 to rotate, causing fine-grained grinding belt 6022 to polish the small-diameter cavity.

[0052] Specifically, because fine-grained polishing belt 6022 is primarily used for fine polishing, with fine abrasive particles and a soft substrate, fine-grained polishing belt 6022 has a relatively high overall elasticity. Because coarse-grained polishing belt 6021 has coarse abrasive particles and a hard substrate, coarse-grained polishing belt 6021 has a relatively low overall elasticity, resulting in less deformation during polishing. After switching from coarse-grained polishing belt 6021 to fine-grained polishing belt 6022, due to its inherent softness and high elasticity, fine-grained polishing belt 6022 is prone to loosening due to inertia during the polishing of small-diameter cavities, resulting in displacement or distortion of fine-grained polishing belt 6022.

[0053] In the process of switching the fine-grained grinding belt 6022 of the present invention, the rope 617 drives the sliding roller 1 615 to slide along the sliding groove 2 610, so that the sliding roller 1 615 and the adjusting roller 613 move toward the inside of the bracket 601. At this time, the adjusting roller 613 drives the sliding roller 2 620 on the supporting roller 612 to slide along the sliding groove 1 609 through the spliced ​​grinding belt 602. At the same time, the compression spring 621 is compressed. Under the rebound action of the compression spring 621, the fine-grained grinding belt 6022 is gradually stretched, so that the fine-grained grinding belt 6022 is tightly attached to the supporting roller 612, thereby preventing the fine-grained grinding belt 6022 from loosening during the polishing of the small-diameter cavity, causing the fine-grained grinding belt 6022 to twist.

[0054] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and modifications fall within the scope of the invention as claimed.

Claims

1. A high-precision polishing machine for semiconductor cavities, characterized by: The invention comprises a guide rail seat (1), the guide rail seat (1) is connected to the guide rail on the workbench, a motor is installed on the guide rail seat (1), the output end of the motor is fixedly connected to the shaft sleeve (3), a support plate (2) is installed on the guide rail seat (1), a transmission cylinder (5) is rotatably installed on the support plate (2), the transmission cylinder (5) is fixedly connected to the grinding assembly (6), the shaft sleeve (3) is connected to the transmission shaft (4) through a sliding block groove, and the other end of the transmission shaft (4) is connected to the transmission cylinder (5); The grinding assembly (6) includes a bracket (601) and a protective shell (603) and a shell (604) respectively installed at both ends of the bracket (601); a take-up box (605) is installed in the protective shell (603); a spliced ​​grinding belt (602) is installed in the bracket (601); a plurality of supporting rollers (612) and adjusting rollers (613) are slidably installed in the bracket (601); the spliced ​​grinding belt (602) passes through the supporting rollers (612) and the adjusting rollers (613) in sequence; a sliding roller (615) is installed on the adjusting roller (613); a sleeve (616) is sleeved on the sliding roller (615); the sleeve (616) is connected to the take-up roller inside the take-up box (605) through a rope (617); the take-up roller inside the take-up box (605) is coaxially connected to the transmission sleeve (606); and the transmission shaft (4) is pushed to connect the transmission shaft (4) to the transmission sleeve (606); The bracket (601) is provided with a first slide groove (609) and a second slide groove (610), the support roller (612) is slidably connected to the first slide groove (609) via the second slide roller (620), a compression spring (621) is installed in the first slide groove (609), the compression spring (621) is connected to the second slide roller (620), and the regulating roller (613) is slidably connected to the second slide groove (610) via the first slide roller (615); An outer groove (611) is provided in the second slide groove (610), a rack (619) is built into the outer groove (611), a gear ring (618) is installed on the first slide roller (615), the gear ring (618) is connected to the rack (619) in a transmission manner, and the combined grinding belt (602) is composed of a coarse-grained grinding belt (6021) and a fine-grained grinding belt (6022); An electromagnetic suction cup (607) is installed in the transmission sleeve (606), and a magnetic metal block (608) is installed on the transmission shaft (4). The electromagnetic suction cup (607) absorbs the magnetic metal block (608); when the electromagnetic suction cup (607) is powered on, the electromagnetic suction cup (607) absorbs the magnetic metal block (608), so that the transmission shaft (4) moves into the transmission sleeve (606), and at this time, the transmission shaft (4) is transmission-connected with the transmission sleeve (606); when the electromagnetic suction cup (607) is powered off, the transmission shaft (4) is reset, so that the transmission shaft (4) is transmission-connected with the transmission cylinder (5) again.

2. A semiconductor cavity high-precision polishing machine according to claim 1, characterized in that: A pressure plate (624) is installed in the shell (604), and the pressure plate (624) is slidably matched with the shell (604) through a slide rod (625). A return spring (626) is installed between the slide rod (625) and the shell (604). An electromagnetic suction cup 2 (623) is installed on the side of the bracket (601) close to the shell (604), and the electromagnetic suction cup 2 (623) adsorbs the pressure plate (624).

3. The high-precision polishing machine for semiconductor cavity according to claim 2, characterized in that: The sliding roller 1 (615) and the sliding roller 2 (620) are mounted with a pressing block (622), and the pressing plate (624) fixes the positions of the supporting roller (612) and the regulating roller (613) by pressing the pressing block (622).

4. The semiconductor cavity high-precision polishing machine according to claim 1, characterized in that: A threading barrel (614) is installed inside the bracket (601).

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