Copper-plated brass strip processing technology

Abstract

The invention discloses a copper-plated brass strip machining process. The copper-plated brass strip machining process comprises the following steps that S1, an alkaline degreasing agent is used for cleaning the surface of a brass strip to obtain a first brass strip; s2, soaking the first brass strip with dilute sulfuric acid to obtain a second brass strip; s3, plating copper on the surface of the brass strip II by using an electroplating bath to obtain a brass strip III, and extruding the brass strip II from two sides by using a defoaming roller in the electroplating process to eliminate bubbles on the surface of the brass strip II; s4, the third brass strip is rinsed with deionized water and then dried, and a fourth brass strip is obtained; and S5, dip-coating a copper protective agent on the four surfaces of the brass strip, and drying to obtain a copper-plated brass strip finished product. In the copper plating process of the brass strip, bubbles attached to the surface of the brass strip are eliminated through the defoaming roller, the quality of a plating layer can be improved, the plating layer and a base body are tightly combined, and the porosity is reduced; the appearance can be improved, and the surface is flatter and flawless; the product performance can be improved, the conductivity and corrosion resistance are enhanced, and the service life of the product is prolonged.

Description

Technical Field

[0001] The present invention belongs to the technical field of electroplating, and particularly relates to a processing technology for copper-plated brass strips. Background Art

[0002] When using brass strips as shields or armors for cables, it is necessary to electroplate copper on the surface of the brass strips to improve the appearance, making their color beautiful and the gloss good; enhancing corrosion resistance and isolating corrosive media; improving wear resistance, increasing surface hardness and reducing the friction coefficient; and also enhancing processing performance, improving electrical and thermal conductivity to meet the performance requirements of various application scenarios.

[0003] There are side reactions when electroplating copper on the surface of brass strips. When copper ions on the cathode gain electrons and deposit copper, hydrogen ions in the solution may also gain electrons to generate hydrogen gas, resulting in the formation of bubbles. The bubbles adhering to the brass strips affect the quality of the coating, causing pitting and pinholes, and reducing the bonding strength and uniformity.

[0004] Therefore, it is necessary to improve the processing technology for copper-plated brass strips in the prior art. Summary of the Invention

[0005] The purpose of the present invention is to overcome the defects existing in the prior art and provide a processing technology for copper-plated brass strips to improve the quality of copper plating on brass strips.

[0006] To achieve the above purpose, the specific technical solution of the processing technology for copper-plated brass strips of the present invention is as follows: A processing technology for copper-plated brass strips includes the following steps: S1. Use an alkaline degreaser to clean the surface of the brass strip to remove oil, grease and other organic contaminants, obtaining Brass Strip 1; S2. Immerse Brass Strip 1 in an acidic solution to remove the oxide film and adjust the surface activity, obtaining Brass Strip 2; S3. Use an electroplating tank to electroplate copper on the surface of Brass Strip 2 to obtain Brass Strip 3. During the electroplating process, use an anti-foaming roller to squeeze Brass Strip 2 from both sides to eliminate the bubbles on the surface of Brass Strip 2; S4. Rinse Brass Strip 3 with deionized water to remove the residue of the copper plating solution, and then dry it to obtain Brass Strip 4; S5. Dip-coat a copper protective agent on the surface of Brass Strip 4, and then dry it to obtain the finished copper-plated brass strip.

[0007] Preferably, the anti-foaming roller in step S4 is rotatably arranged inside the electroplating tank. A plurality of hemispherical protrusions are evenly distributed on the outer peripheral surface of the anti-foaming roller, and a diversion groove is arranged in a spiral distribution along its own axis. A lubricating layer is arranged on the surface of the anti-foaming roller.

[0008] Preferably, the working process of the defoaming roller is as follows: S301, the brass belt 2 passes between the two defoaming rollers, ensuring that the moving speed of the brass belt 2 is the same as the peripheral line speed of the defoaming roller and in the same direction; S302, the defoaming roller squeezes the brass belt 2, and breaks the bubbles on the surface of the brass belt 2 through the protrusions; S303, the guide groove guides the flow of the electroplating solution, flushes the bubbles through the flowing electroplating solution, and guides the bubbles to move toward the end of the defoaming roller, thereby separating the bubbles from the brass belt 2.

[0009] Preferably, the step S101 includes water washing after the step S1: using a reverse circulation water flow and a spray water flow to wash the brass strip 1 for 2-5 minutes; The step S201 includes water washing after the step S201: using a reverse circulating water flow and a spraying water flow to wash the brass strip 2 for 2-5 minutes.

[0010] Preferably, the step S2 comprises: a pre-activation step S21, soaking the brass strip in 10% sulfuric acid for 50-60 seconds; a deep activation step S22, soaking the brass strip in a mixed solution of 50-80 g / L sulfuric acid and 10-20 g / L hydrochloric acid for 20-40 seconds, and applying an electric current to the brass strip while soaking.

[0011] Preferably, a tubular rotating shaft is rotatably arranged inside the electroplating tank, the defoaming roller is coaxially fixedly connected to the rotating shaft, the electroplating tank is provided with a power assembly and a separation assembly, the power assembly is transmission-connected to one end of the rotating shaft, the separation assembly is connected to the other end of the rotating shaft, and an exhaust hole connected to the rotating shaft is provided at the bottom of the guide groove.

[0012] Preferably, the separation assembly includes a box body fixedly connected to the electroplating tank, the box body sealing cover is provided with a box cover, the end of the rotating shaft extends into the interior of the box body and cooperates with the box body for rotational sealing, and the top of the box body is connected to a vacuum pump through a check valve.

[0013] Preferably, a filter cover is provided at one end of the rotating shaft located inside the box body, the filter cover is fixedly connected with a threaded sleeve that is threadedly matched with the end of the rotating shaft, and a support bar is provided on the inner side of the filter cover.

[0014] Preferably, the bottom of the box body is connected to the interior of the electroplating tank through a reflux pipe, the reflux pipe is provided with a power pump, and the reflux pipe is provided with a check valve.

[0015] Preferably, an anode assembly is arranged inside the electroplating tank in the step S3. The anode assembly includes a first anode plate and a second anode plate disposed on the upper and lower sides of the brass strip II. The second anode plate is fixedly connected with a vertically arranged connecting rod. The first anode plate is fixedly connected with a fixing sleeve, and the fixing sleeve is sleeved on the outer periphery of the connecting rod. The connecting rod is provided with a sliding groove in the vertical direction. An installation frame is erected above the electroplating tank, and the sliding groove is connected with the installation frame through bolts.

[0016] The copper-plated brass strip processing process of the present invention has the following advantages: During the process of copper plating on the brass strip, the air bubbles attached to the surface of the brass strip are eliminated by the defoaming roller, which can improve the coating quality, make the coating combine tightly with the substrate, and reduce the porosity; it can improve the appearance, make the surface smoother and free of defects; it can also improve the product performance, enhance the electrical conductivity and corrosion resistance, and extend the service life of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is the process flow chart of the present invention; Figure 2 is the structural schematic diagram of the electroplating tank of the present invention; Figure 3 is the installation structural schematic diagram of the defoaming roller of the present invention; Figure 4 is the structural schematic diagram of the anode assembly of the present invention; Figure 5 is the structural schematic diagram of the separation assembly of the present invention; Figure 6 is Figure 5 the enlarged view of part A of Figure 7 is the structural schematic diagram of the defoaming roller of the present invention; Figure 8 is the structural schematic diagram of the filter screen cover of the present invention; Figure 9 is the cross-sectional view of the filter screen cover of the present invention; Explanation of the reference numerals in the drawings: 1. Filter screen cover; 2. Electroplating tank; 3. Defoaming roller; 4. Rotating shaft; 5. Anode assembly; 8. Power assembly; 201. Installation frame; 202. Guide roller; 301. Flow guide groove; 302. Convex block; 303. Exhaust hole; 501. First anode plate; 502. Second anode plate; 503. Fixing sleeve; 504. Connecting rod; 505. Sliding groove; 601. Box cover; 602. Box body; 603. Check valve; 604. Vacuum pump; 701. Return pipe; 702. Power pump; 901. Threaded sleeve; 902. Support bar. DETAILED DESCRIPTION OF THE INVENTION

[0018] The following will further describe the specific embodiments of the present invention in conjunction with the accompanying drawings and embodiments. The following embodiments are only used to more clearly illustrate the technical solutions of the present invention and cannot be used to limit the protection scope of the present invention.

[0019] "Top surface", "bottom", and "bottom surface" are referenced based on the normal use state of the electroplating tank. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation to the present invention.

[0020] As Figure 1 shown, a copper-plated brass strip processing process includes the following steps: S1. Use an alkaline degreaser to clean the surface of the brass strip to remove oil stains, grease, and other organic pollutants, obtaining Brass Strip 1. S2. Immerse Brass Strip 1 in an acidic solution to remove the oxide film and adjust the surface activity, obtaining Brass Strip 2. S3. Use electroplating tank 2 to electroplate copper on the surface of Brass Strip 2, obtaining Brass Strip 3. During the electroplating process, use a defoaming roller 3 to squeeze Brass Strip 2 from both sides to eliminate the bubbles on the surface of Brass Strip 2. S4. Rinse Brass Strip 3 with deionized water to remove the residue of the electroplating solution, and then dry it to obtain Brass Strip 4. S5. Dip-coat a copper protective agent on the surface of Brass Strip 4, and then dry it to obtain the finished copper-plated brass strip.

[0021] When electroplating the brass strip through the above steps, in step S1, the alkaline degreaser includes 50 - 80 g / L of sodium hydroxide, which has strong alkalinity and is used for saponifying grease; 30 - 50 g / L of sodium carbonate, which is used for buffering the solution pH and softening water; 20 - 30 g / L of sodium phosphate, which is used for dispersing dirt and promoting emulsification; at the same time, silica particles are added to adsorb stubborn oil stains. When cleaning, use a stainless-steel alkaline cleaning tank, and the alkaline cleaning tank is equipped with a heater and a stirrer. Control the solution temperature at 50 - 60 degrees Celsius through the heater to promote the dissolution of grease, and control the alkaline cleaning time within 5 - 10 minutes. The alkaline cleaning time should not be too long to prevent the zinc of the brass strip from being corroded. During the alkaline cleaning process, promote the flow of the solution through the stirrer, which can accelerate the stripping of oil stains and improve the effect of removing oil stains. By improving the cleaning effect of the oil stains on the surface of the brass strip, the electroplating solution can be evenly contacted with the surface of the brass strip during the electroplating process, improving the uniformity of the current distribution, reducing the hydrogen evolution reaction, thereby reducing the generation of bubbles on the surface of the brass strip and improving the quality of the produced copper-plated brass strip.

[0022] Step S2 includes two steps. Step S21 is pre-activation. The brass strip 1 is soaked in sulfuric acid with a concentration of 10% for 50 - 60 seconds, the soaking temperature is controlled at 30 °C, and thiourea is added as a corrosion inhibitor to inhibit the excessive corrosion of the brass strip 1. Through the above steps, the surface of the brass strip can be preliminarily treated, laying a foundation for subsequent deep activation. Step S22 is deep activation. The brass strip 1 is soaked in a mixed solution of 50 - 80 mL / L sulfuric acid and 10 - 20 mL / L hydrochloric acid for 20 - 40 seconds, and the soaking temperature is controlled at 40 °C. While soaking, an electric current is applied to the brass strip 1. Through the above steps, it can promote the better reaction of the acid solution with impurities, oxide layers, etc. on the surface of the brass strip, accelerate the dissolution and removal speed, reduce the surface roughness difference caused by uneven pickling, reduce the surface roughness, reduce the number of active sites during the subsequent electroplating process, thereby reducing the hydrogen evolution reaction and the number of bubbles generated on the surface of the brass strip, and improving the quality of the finished copper-plated brass strip.

[0023] In step S3, the electroplating solution used includes 40 - 80 g / L copper sulfate to provide copper ions; 65 - 75 g / L sulfuric acid to improve conductivity and inhibit the hydrolysis of copper ions; 0.03 - 0.04 g / L chloride ions to promote anodic dissolution and prevent anode passivation; and brighteners, wetting agents, and leveling agents as additives. The anode is a phosphorus copper plate, which is distributed parallel to the upper and lower sides of the brass strip, and the width of the phosphorus copper plate is greater than the width of the brass strip. During electroplating, the brass strip continuously passes through the inside of the electroplating tank 2, and a stirrer is arranged inside the electroplating tank to promote the flow of the electroplating solution. The electroplating time of the brass strip inside the electroplating tank 2 is 10 - 30 minutes, and the temperature of the electroplating solution is 20 - 35 °C. Finally, a copper coating with a thickness of 5 - 15 microns is formed on the surface of the brass strip.

[0024] In the above electroplating step, the brass strip is extruded from the upper and lower sides by the defoaming roller 3 to break and transfer the bubbles formed on the surface of the brass strip, thereby improving the quality of the produced copper-plated brass strip.

[0025] In step S4, the brass strip 3 is rinsed with deionized water in a countercurrent manner for 2 - 3 minutes to remove the residual electroplating solution on the brass strip 3; then the brass strip 3 is dried with hot air at 50 - 60 °C for 5 - 10 minutes to dry the surface of the brass strip and avoid copper oxidation caused by high temperature.

[0026] In step S5, the copper protection agent is one of benzotriazole, methylbenzotriazole, acrylic resin, or silicone resin. A protective layer can be formed on the surface of the copper-plated brass strip through dip coating and drying to prevent the surface of the copper-plated brass strip from oxidation and corrosion.

[0027] A further improvement is that, as Figure 7As shown in the figure, the defoaming roller 3 in step S4 is rotatably arranged inside the electroplating tank 2. A plurality of hemispherical bumps 302 are evenly distributed on the outer peripheral surface of the defoaming roller 3, and a diversion groove 301 is arranged in a spiral distribution along its own axis. A lubricating layer is arranged on the surface of the defoaming roller 3.

[0028] Specifically, there are multiple groups of defoaming rollers 3 arranged along the advancing direction of the brass strip. Each group includes two defoaming rollers 3, which are horizontally arranged on the upper and lower sides of the brass strip respectively and clamp the brass strip from both sides; the bumps 302 are formed by laser micro-melting technology and are arranged in an array on the surface of the defoaming roller 3. Their diameter is 60 microns, height is 30 microns, and the interval between two adjacent bumps 302 is 5 microns; the lubricating layer is a fluoropolymer with a thickness of 5 microns; through the setting of the bumps 302, the contact area between the bubbles and the defoaming roller 3 can be reduced, and the contact angle can be increased, making it difficult for the bubbles to adhere to the contact roller 302. And through the setting of the lubricating layer, the surface energy of the contact roller 302 can be reduced, further reducing the adhesion force of the bubbles on the contact tube 302; making the bubbles on the surface of the brass strip more likely to burst and reducing the secondary adhesion of the bubbles on the contact roller 302; at the same time, during the rotation of the defoaming roller 3, the electroplating solution flows inside the diversion groove 301, which can strip the bubbles adsorbed on the brass strip and the defoaming roller 3, and make the bubbles move along the diversion groove 302 towards the end of the defoaming roller 3, thereby realizing the separation of the bubbles from the brass strip, reducing the adhesion of the bubbles on the brass strip, and improving the quality of the copper-plated brass strip product.

[0029] A further improvement is that the working process of the defoaming roller 3 is as follows: S301, the second brass strip passes between the two defoaming rollers 3, ensuring that the moving speed of the second brass strip is the same as and in the same direction as the outer peripheral linear speed of the defoaming roller 3; S302, the defoaming roller 3 squeezes the second brass strip, and the bubbles on the surface of the second brass strip are broken by the bumps 302; S303, the diversion groove 301 guides the flow of the electroplating solution, washes the bubbles through the flowing electroplating solution, and guides the bubbles towards the end of the defoaming roller 3 to realize the separation of the bubbles from the second brass strip. Through the above steps, the breaking and separation of the bubbles on the surface of the brass strip can be realized.

[0030] A further improvement is that after step S1, it includes step S101 water washing: the first brass strip is rinsed for 2 - 5 minutes using reverse circulating water flow in combination with spray water flow; After step S2, it includes step S201 water washing: the second brass strip is rinsed for 2 - 5 minutes using reverse circulating water flow in combination with spray water flow.

[0031] The water washing in the above step S101 can remove the residual alkali solution on the surface and prevent contamination of the subsequent pickling process; the water washing in step S201 can thoroughly remove the residual acid solution and prevent it from being brought into the electroplating tank, thereby ensuring the processing effect on the brass strip.

[0032] A further improvement is that as Figure 2 and3 As shown, a tubular rotating shaft 4 is provided inside the electroplating tank 2, and the defoaming roller 3 is coaxially fixedly connected to the rotating shaft 4. The electroplating tank 2 is provided with a power component 8 and a separation component. The power component 8 is transmission-connected to one end of the rotating shaft 4, and the separation component is connected to the other end of the rotating shaft 4. An exhaust hole 303 connected to the rotating shaft 4 is provided at the bottom of the guide groove 301.

[0033] Specifically, the rotating shaft 4 is horizontally rotatable and arranged inside the electroplating tank 2. The axial extension direction of the rotating shaft 4 is perpendicular to the forward direction of the brass strip. The width of the electroplating tank 2 can accommodate multiple brass strips passing side by side. Therefore, the number of defoaming rollers 3 arranged on the rotating shaft 4 is consistent with the number of brass strips, and each defoaming roller 3 is arranged at equal intervals along its axial direction on the rotating shaft 4. The end of the rotating shaft 4 is connected to the electroplating tank 2 through a bearing, and the end of the rotating shaft 4 passes through the side wall of the electroplating tank 2 and extends to the outside. The rotating shaft 4 and the electroplating tank 2 are sealed by a seal to prevent the electroplating solution inside the electroplating tank 2 from leaking. There are two rotating shafts 4, which are respectively located on the upper and lower sides of the brass strip. The power assembly 8 includes a motor fixedly connected to the electroplating tank 2 and transmission gears respectively arranged at the ends of the two rotating shafts 4. One end of the rotating shaft 4 fixedly connected to the transmission gear is in a closed state to prevent the electroplating solution from leaking. The two transmission gears are meshed with each other, and one of the transmission gears is driven by the motor to rotate, so that the two rotating shafts 4 rotate synchronously in opposite directions.

[0034] One end of the rotating shaft 4 away from the transmission gear extends to the interior of the separation component and is interconnected with the separation component. The interior of the separation component is in a negative pressure state, which can generate suction inside the rotating shaft 4, thereby generating suction at the exhaust hole 303, so that the bubbles inside the guide groove 301 are absorbed through the exhaust hole 303, thereby improving the exhaust efficiency and effect of the bubbles, thereby improving the effect of eliminating the bubbles on the surface of the brass strip, and improving the quality of the finished copper-plated brass strip.

[0035] A further improvement is, Figure 5 and 6As shown, the separation component includes a box body 602 fixedly connected to the electroplating tank 2. The box body 602 is hermetically covered with a box cover 601. The end of the rotating shaft 4 extends into the interior of the box body 602 and is rotationally and hermetically fitted with the box body 602. The top of the box body 602 is connected to a vacuum pump 604 through a check valve 603. The box body 602 is integrally formed on the electroplating tank 2 and covers the end of the rotating shaft 4 inside it. After the box cover 601 is hermetically connected to the box body 602, a sealed chamber is formed. The chamber communicates with the exhaust hole 303 through the rotating shaft 4. During operation, the air inside the chamber is extracted by the vacuum pump 604 to generate negative pressure, so that suction is generated at the exhaust hole 303. The setting of the check valve 603 can prevent external air from flowing back into the chamber, so that the inside of the chamber can maintain a negative pressure state. When the bubbles are mixed with the electroplating solution and sucked into the chamber, under the negative pressure state, the separation of the bubbles from the electroplating solution can be accelerated. Then the separated bubbles are sucked and discharged by the vacuum pump 604, effectively separating the bubbles inside the electroplating solution, thereby reducing the number of bubbles on the electroplating solution, the brass strip and the electroplating anode, and overall improving the electroplating effect of the brass strip.

[0036] A further improvement is that, as Figure 8 and 9 shown, one end of the rotating shaft 4 located inside the box body 602 is provided with a filter screen cover 1. The filter screen cover 1 is fixedly connected with a threaded sleeve 901 that is threadedly matched with the end of the rotating shaft 4. The inner side of the filter screen cover 1 is provided with support bars 902. The filter screen cover 1 is detachably connected to the end of the rotating shaft 4 through the threaded sleeve 901, which improves the convenience of disassembling the filter screen cover 1. At the same time, the opening and closing of the box body 602 can be realized by disassembling and assembling the box cover 601, greatly improving the convenience of replacing and maintaining the filter screen cover 1. The filter screen cover 1 covers the end of the rotating shaft 4, so that the electroplating solution flowing out of the end of the rotating shaft 4 first enters the inside of the filter screen cover 1, and then the electroplating solution is filtered by the filter screen cover 1, reducing the number of impurities inside the electroplating solution, thereby improving the electroplating effect. And after the impurities are reduced, the hydrogen evolution reaction on the surface of the brass strip can also be reduced, and the generation of bubbles on the surface of the brass strip can be reduced. At the same time, the filter screen cover 1 can also preliminarily break the bubbles inside the electroplating solution, improving the separation efficiency of the bubbles from the electroplating solution. The setting of the support bars 902 can support the filter screen cover 1, improve its strength, prevent it from deforming, and the filter screen cover 1 can rotate together with the rotating shaft 4. Through the rotation of the filter screen cover 1, the filter screen cover 1 and the support bars 902 stir the electroplating solution. Under the negative pressure state, combined with the stirring, it is more conducive to the separation of the bubbles inside the electroplating solution. And in the stirring state, the electroplating solution can also wash the surface of the filter screen cover 1, reducing the accumulation of impurities on the filter screen cover 1 and reducing the probability of blockage of the filter screen cover 1 to maintain the filtering effect of the filter screen cover 1 and extend its service life.

[0037] A further improvement is that, as Figure 5As shown in the figure, the bottom of the box body 602 is internally connected to the electroplating tank 2 through a reflux pipe 701. A power pump 702 is provided on the reflux pipe 701, and a check valve 603 is provided on the reflux pipe 701. The electroplating solution after filtration and defoaming is stored inside the box body 602. Powered by the power pump 702, the electroplating solution inside the box body 602 is sent back to the inside of the electroplating tank 2 through the reflux pipe 701, realizing the circulating flow of the electroplating solution. And during the circulation process, the electroplating solution can also be defoamed and filtered to improve the electroplating effect. Through the circulation of the electroplating solution, the flow of the electroplating solution around the defoaming roller 3 can also be accelerated, improving the stirring effect on the electroplating solution and further improving the electroplating effect on the brass strip.

[0038] A further improvement is that, as Figure 4 shown, an anode assembly 5 is arranged inside the electroplating tank 2 in step S3. The anode assembly 5 includes a first anode plate 501 and a second anode plate 502 arranged on the upper and lower sides of the brass strip II. The second anode plate 502 is fixedly connected with a vertically arranged connecting rod 504. The first anode plate 501 is fixedly connected with a fixed sleeve 503. The fixed sleeve 503 is sleeved on the outer periphery of the connecting rod 504. The connecting rod 504 is provided with a chute 505 along the vertical direction. An installation frame 201 is erected above the electroplating tank 2. The chute 505 is connected to the installation frame 201 through bolts.

[0039] Specifically, multiple anode assemblies 5 are provided. Along the axial direction of the rotating shaft 4, the number of anode assemblies is the same as the number of juxtaposed brass strips. Along the advancing direction of the brass strip, the anode assemblies and the defoaming roller 3 are arranged alternately; so that the anode assemblies are evenly distributed in the advancing direction of the brass strip, enabling the anode assemblies to provide a uniform current density and improving the electroplating effect on the brass strip; both the first anode plate 501 and the second anode plate 502 are phosphor copper plates, which are arranged parallel to the brass strip and distributed on the upper and lower sides of the brass strip along the advancing direction of the brass strip, so as to make the current density of the anode more uniform and improve the electroplating effect; the fixed sleeve 503 is used to fix the first anode plate 503 on the connecting rod 504 and can adjust the position of the first anode plate 503 vertically. The setting of the chute 505 can be used to adjust the height of the connecting rod 504, thereby adjusting the position of the second anode plate 502, and thus the distance between the first anode plate 501 and the second anode plate 502 and the brass strip can be adjusted to improve the electroplating effect.

[0040] In the above electroplating tank 2, the defoaming roller 3, the rotating shaft 4, the box body 602, the filter mesh cover 1, the vacuum pump 604 and the reflux pipe 701 are combined to form a complete electroplating solution circulation system. All components cooperate closely, starting from multiple aspects such as eliminating the source of bubble generation, reducing the attachment of bubbles and eliminating the already generated bubbles, reducing the influence of bubbles on the electroplating quality of the brass strip during the electroplating process, and finally improving the quality of the copper-plated brass strip product.

[0041] It is understood that the present invention is described by way of some embodiments. Those skilled in the art will know that various changes or equivalent replacements can be made to these features and embodiments without departing from the spirit and scope of the present invention. Additionally, under the teaching of the present invention, these features and embodiments can be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application belong to the scope protected by the present invention.

Claims

1. A processing technology for copper-plated brass strips, characterized in that, The following steps are involved: S1, using an alkaline degreasing agent to clean the surface of the brass strip to remove oil, grease and other organic pollutants to obtain a brass strip 1; S2, soaking the brass strip 1 in an acidic solution to remove the oxide film and adjust the surface activity to obtain the brass strip 2; S3, using an electroplating tank to plate copper on the surface of the brass strip 2 to obtain a brass strip 3, and using a defoaming roller to squeeze the brass strip 2 from both sides during the electroplating process to eliminate bubbles on the surface of the brass strip 2; S4, rinsing the brass strip three with deionized water to remove the copper plating solution residue, and then drying to obtain the brass strip four; S5, dip-coating the copper protective agent on the four surfaces of the brass strip, and then drying to obtain a finished copper-plated brass strip.

2. The copper-plated brass strip processing technology according to claim 1, characterized in that, The defoaming roller in step S4 is rotatably arranged inside the electroplating tank, a plurality of hemispherical bumps are evenly distributed on the outer circumference of the defoaming roller, and a guide groove is spirally distributed along its own axis, and a lubricating layer is arranged on the surface of the defoaming roller.

3. The copper-plated brass strip processing technology according to claim 2, wherein The working process of the defoaming roller is as follows: S301, the brass belt 2 passes between the two defoaming rollers to ensure that the moving speed of the brass belt 2 is the same as the peripheral line speed of the defoaming roller and the direction is consistent; S302, the defoaming roller squeezes the brass belt 2 and breaks the bubbles on the surface of the brass belt 2 through the protrusions; S303, the guide groove guides the flow of the electroplating solution, flushes the bubbles through the flowing electroplating solution, and guides the bubbles to move toward the end of the defoaming roller to separate the bubbles from the brass belt 2.

4. The copper-plated brass strip processing technology according to claim 1, characterized in that, After step S1, step S101 of water washing is included: using reverse circulation water flow and spraying water flow to wash the brass strip 1 for 2-5 minutes; The step S201 includes water washing after the step S201: using a reverse circulating water flow and a spraying water flow to wash the brass strip 2 for 2-5 minutes.

5. The copper-plated brass strip processing technology according to claim 1, characterized in that, The step S2 comprises: a pre-activation step S21, wherein the brass strip is soaked in 10% sulfuric acid for 50-60 seconds; and a deep activation step S22, wherein the brass strip is soaked in a mixed solution of 50-80 g / L sulfuric acid and 10-20 g / L hydrochloric acid for 20-40 seconds, and an electric current is applied to the brass strip during the soaking.

6. The copper-plated brass strip processing process according to claim 2, characterized in that, A tubular rotating shaft is rotatably arranged inside the electroplating tank, and the defoaming roller is coaxially fixedly connected to the rotating shaft. The electroplating tank is provided with a power assembly and a separation assembly. The power assembly is transmission-connected to one end of the rotating shaft, and the separation assembly is connected to the other end of the rotating shaft. An exhaust hole connected to the rotating shaft is provided at the bottom of the guide groove.

7. The copper-plated brass strip processing technology according to claim 6, characterized in that The separation assembly includes a box body fixedly connected to the electroplating tank, the box body sealing cover is provided with a box cover, the end of the rotating shaft extends into the interior of the box body and cooperates with the box body for rotation and sealing, and the top of the box body is connected to a vacuum pump through a check valve.

8. The copper-plated brass strip processing process according to claim 7, characterized in that, A filter screen cover is arranged at one end of the rotating shaft located inside the box body, the filter screen cover is fixedly connected with a threaded sleeve which is threadably matched with the end of the rotating shaft, and a support bar is arranged on the inner side of the filter screen cover.

9. The copper-plated brass strip processing process according to claim 7, characterized in that, The bottom of the box is connected to the inside of the electroplating tank through a reflux pipe, the reflux pipe is provided with a power pump, and a check valve is provided on the reflux pipe.

10. The copper-plated brass strip processing technology according to claim 1, characterized in that, An anode assembly is provided inside the electroplating tank in the step S3. The anode assembly includes a first anode plate and a second anode plate disposed on the upper and lower sides of the brass strip II. The second anode plate is fixedly connected to a vertically arranged connecting rod. The first anode plate is fixedly connected to a fixed sleeve. The fixed sleeve is sleeved on the outer periphery of the connecting rod. The connecting rod is provided with a chute along the vertical direction. An installation frame is erected above the electroplating tank. The chute is connected to the installation frame by bolts.

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