Wafer detection device and detection method

Abstract

The present invention discloses a wafer detection device and detection method, which belongs to the field of wafer detection, and includes: a rotating table, suitable for carrying and adsorbing wafers and driving the wafers to rotate; a positioning mechanism, suitable for detecting the offset of the wafers during the wafer rotation process; an adjustment mechanism, suitable for lifting the wafer off the rotating table and, in response to the offset detected by the positioning mechanism, driving the lifted wafer to fine-tune the wafer along a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction; a first detection mechanism, used to detect the edge of the wafer; a first support mechanism, located below the wafer and corresponding to a portion of the wafer within the detection area of ​​the first detection mechanism, the first support mechanism being suitable for approaching and supporting the edge of the wafer upward; the wafer being suitable for rotating under the drive of the rotating table so that all parts of its peripheral edge flow through the detection area of ​​the first detection mechanism. The present invention adopts the above structure and can accurately and efficiently detect wafers.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer detection, and in particular to a wafer detection device and a detection method. Background Art

[0002] During the wafer production process, the edge morphology needs to be detected. For example, Chinese invention patent CN202410048950.5 discloses a wafer edge detection device, including a rotating mechanism, a clamping mechanism and a supporting mechanism. The clamping mechanism is transmission-connected to the rotating mechanism, and the supporting mechanism is located below the clamping mechanism. During detection, the wafer is placed on the clamping mechanism, the clamping mechanism clamps the outer edge of the wafer, and the rotating mechanism drives the clamping mechanism to rotate so that the detection structure detects most of the outer edge of the wafer that is not blocked by the clamping mechanism; then the clamping mechanism releases the wafer, the supporting mechanism rises and supports the wafer, the turntable rotates a certain angle, and the supporting mechanism puts the wafer back into the clamping mechanism, so that the clamping mechanism clamps the outer edge of the wafer that has been detected; then the rotating mechanism continues to drive the clamping mechanism to rotate, and the detection structure can detect the outer edge of the remaining part of the wafer.

[0003] With the above structure, the clamping mechanism needs to clamp and release during the wafer placement process, which is inefficient and can easily damage the wafer during the clamping process. At the same time, the clamping mechanism will also block the outer edge of the wafer. After most of the wafer edges are inspected during the inspection, the supporting mechanism needs to cooperate with the rotating mechanism to adjust the clamping position of the wafer in order to inspect the edges of the remaining wafers, further reducing the inspection efficiency. In addition, the entire inspection process is discontinuous, which is not conducive to analysis and processing after inspection.

[0004] Therefore, it is necessary to improve the prior art to overcome the above defects. Summary of the Invention

[0005] The object of the present invention is to provide a wafer inspection device and a method for significantly improving wafer inspection efficiency.

[0006] The object of the present invention is to achieve the following technical solution: a wafer detection device, comprising:

[0007] A rotating table, suitable for carrying and adsorbing wafers and driving the wafers to rotate;

[0008] A positioning mechanism adapted to detect wafer offset during wafer rotation;

[0009] an adjustment mechanism adapted to lift the wafer off the rotating table and, in response to the offset detected by the positioning mechanism, drive the lifted wafer to fine-tune the wafer along a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction;

[0010] A first detection mechanism is used to detect the edge of the wafer;

[0011] a first supporting mechanism, located below the wafer and corresponding to a portion of the wafer within the detection area of ​​the first detection mechanism, the first supporting mechanism being adapted to approach upward and support an edge of the wafer;

[0012] The wafer is adapted to rotate driven by the rotating table so that all parts of its periphery flow through the detection area of ​​the first detection mechanism.

[0013] Furthermore, the adjustment mechanism includes:

[0014] Lifting module;

[0015] A fine-tuning module is carried by the jacking module and is adapted to be lifted and lowered in a vertical direction under the drive of the jacking module;

[0016] a jacking frame, carried by the fine-tuning module and adapted to move along a first horizontal direction and a second horizontal direction under the drive of the fine-tuning module;

[0017] The lifting frame is located below the wafer and is used to support the wafer.

[0018] Furthermore, the wafer detection device includes a mounting table, the rotating table is arranged on the table top of the mounting table, a receiving space is formed in the mounting table, the lifting module and the fine-tuning module are arranged in the receiving space, the lifting frame is partially located in the receiving space to be transmission-connected with the fine-tuning module, and partially located outside the receiving space and surrounded by the rotating table.

[0019] Furthermore, the jacking frame includes:

[0020] a bottom plate, received in the receiving space and supported by the fine-tuning module;

[0021] a top frame, located above the bottom plate and surrounding the outer periphery of the rotating platform;

[0022] a connecting member connected between the bottom plate and the top frame, and a plurality of connecting members are arranged at intervals along the periphery of the bottom plate and / or the top frame;

[0023] Wherein, the top frame is provided with a first support member protruding relative to the top surface of the top frame, and a plurality of the first support members are evenly distributed along the circumference of the top frame to contact the bottom surface of the wafer.

[0024] Furthermore, the positioning mechanism is located on one side of the rotating table in the first horizontal direction, and includes:

[0025] First bracket;

[0026] A detection sensor is provided on the first bracket, and a detection direction is parallel to the vertical direction. Two detection sensors are arranged at intervals along the vertical direction, and detection ends of the two detection sensors are arranged opposite to each other;

[0027] A detection area is formed between the two detection sensors. When the wafer is rotated by the rotating table, the edge of the wafer is suitable for flowing through the detection area of ​​the detection sensor.

[0028] Furthermore, the first detection mechanism is located on one side of the rotating platform in the second horizontal direction, and includes:

[0029] There are two second brackets, which are spaced apart along a first horizontal direction, and the first supporting mechanism is located between the two second brackets;

[0030] A first detection camera is disposed on one of the second brackets, and its shooting direction is parallel to the first horizontal direction;

[0031] A first light source is provided on another of the second brackets, and an irradiation direction is parallel to the first horizontal direction, and an irradiation end of the first light source and a shooting end of the first detection camera are arranged opposite to each other;

[0032] A detection area is formed between the first detection camera and the first light source. When the rotating table drives the wafer to rotate, the edge of the wafer is suitable for flowing through the detection area between the first detection camera and the first light source.

[0033] Furthermore, the first supporting mechanism includes:

[0034] The third bracket;

[0035] A supporting driving member, arranged on the third bracket;

[0036] A support assembly, connected to the support drive member and located below the wafer;

[0037] The support assembly is adapted to move upwards under the drive of the support driving member, and to make its support surface for supporting the wafer flush with the support surface of the rotating table.

[0038] Furthermore, the wafer detection device includes a second detection mechanism, which is located on the other side of the rotating table in the first horizontal direction, and the second detection mechanism includes:

[0039] Fourth bracket;

[0040] a second detection camera, which is disposed on the fourth bracket and has a shooting direction parallel to the vertical direction; two second detection cameras are arranged at intervals along the vertical direction, and the shooting ends of the two second detection cameras are arranged opposite to each other;

[0041] a second light source, disposed on the fourth bracket, located between the two second detection cameras and adapted to illuminate the bottom surface of the wafer, the second light source being a ring-shaped light source, the shooting ends of the two second detection cameras corresponding to the hollow area of ​​the second light source;

[0042] a third light source, disposed on the fourth bracket and adapted to illuminate the circumference of the wafer;

[0043] In which, a detection area is formed between the two second detection cameras, the third light source is staggered with the detection area of ​​the second detection camera, and when the rotating table drives the wafer to rotate, the gap on the edge of the wafer is suitable for flowing through the detection area of ​​the second detection camera.

[0044] Furthermore, the wafer detection device includes a second supporting mechanism located below the wafer, the second supporting mechanism corresponds to a portion of the wafer within the detection area of ​​the second detection mechanism, and the second supporting mechanism is suitable for approaching and supporting the edge of the wafer upward.

[0045] In addition, the present invention also provides a wafer detection method, comprising the following steps:

[0046] S100, transporting the wafer to a rotating table, wherein the rotating table drives the wafer to rotate one circle, and a positioning mechanism obtains the center deviation of the wafer;

[0047] S200, the adjustment mechanism adjusts the position of the wafer according to the center deviation obtained by the positioning mechanism, so that the actual center of the wafer coincides with the preset standard center;

[0048] S300, the rotating table drives the wafer to rotate one more circle, and the positioning mechanism rechecks the position of the wafer. If the actual center of the wafer coincides with the preset standard center, the rotating table drives the wafer to rotate one more circle for inspection. If the actual center of the wafer does not coincide with the preset standard center, the step of S200 is repeated.

[0049] S400. During the detection process of the wafer rotation driven by the rotating table, it stops after each rotation of a preset angle, and then the first supporting mechanism rises to support the edge of the wafer. The first detection mechanism detects the edge of the supported wafer until the wafer rotates one circle, completing the detection of multiple measurement points on the edge of the wafer.

[0050] Compared with the prior art, the present invention has the following beneficial effects: the present invention directly carries and adsorbs wafers through a rotating table, and there is no need to set up an additional clamping structure. The wafer is not easily damaged during the picking and placing process, and the picking and placing process is more convenient and efficient. At the same time, the edge of the wafer will not be blocked, thereby improving the subsequent detection efficiency and the continuity of the edge detection process; by setting up a positioning mechanism and an adjustment mechanism, the positioning mechanism can perform position detection on the wafer placed on the rotating table, and the adjustment mechanism can fine-tune the wafer according to the actual deviation of the wafer to make the wafer precisely coaxial with the rotating table, so that the edge of the wafer can be reliably detected during subsequent detection; in order to ensure that wafers of different sizes can reliably achieve edge detection, the size of the rotating table will be made smaller, so that the sizes of different wafers are all larger than the size of the rotating table to avoid blocking the edge of the wafer. However, the use of the above structure will cause the edges of some larger wafers to warp downward, affecting the detection accuracy. By setting up a first support mechanism, it can support the edges of some wafers in the detection area to prevent the part from warping downward, thereby improving the detection accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 It is a structural schematic diagram of the wafer detection device of the present invention.

[0052] Figure 2 It is a structural schematic diagram of the wafer detection device of the present invention when a wafer is installed.

[0053] Figure 3 It is a schematic diagram of the installation of the rotating table, the adjustment mechanism and the mounting table in the present invention.

[0054] Figure 4 It is a structural diagram of the adjustment mechanism in the present invention.

[0055] Figure 5 It is a structural schematic diagram of the positioning mechanism in the present invention.

[0056] Figure 6 It is a structural schematic diagram of the first detection mechanism and the first supporting mechanism in the present invention.

[0057] Figure 7 It is a schematic diagram of the installation of the shielding plate and the adjustment block in the present invention.

[0058] Figure 8 It is a schematic diagram of the exploded structure of the shielding plate and the adjustment block in the present invention.

[0059] Figure 9 It is a cross-sectional schematic diagram of the first supporting mechanism in the present invention.

[0060] Figure 10 It is a structural schematic diagram of the second detection mechanism and the second supporting mechanism in the present invention.

[0061] Description of reference numerals:

[0062] 100, rotating table; 110, wafer; 111, notch; 200, adjustment mechanism; 210, lifting module; 211, lifting drive member; 212, sliding seat; 213, slide rail assembly; 220, fine-tuning module; 230, lifting frame; 231, bottom plate; 232, top frame; 233, connecting member; 234, first support member; 300, positioning mechanism; 310, first bracket; 320, detection sensor; 400, first detection mechanism; 410, second bracket; 411, displacement slide; 412, mounting seat; 413, shielding plate; 4131, avoidance hole; 4132, connecting hole; 414, adjustment block; 4141, waist adjustment hole; 420, first detection camera; 430 , first light source; 500, first supporting mechanism; 510, third bracket; 520, supporting drive member; 530, supporting assembly; 531, supporting seat; 5311, mounting hole; 5312, first section; 5313, second section; 532, second supporting member; 5321, rod body; 5322, protrusion; 533, spring; 534, micrometer screw; 600, mounting table; 610, receiving space; 620, substrate; 630, table plate; 631, avoidance area; 640, column; 700, second detection mechanism; 710, fourth bracket; 720, second detection camera; 730, second light source; 740, third light source; 750, adjusting cylinder; 800, second supporting mechanism. DETAILED DESCRIPTION

[0063] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. It will be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some, rather than all, structures related to the present application are shown in the accompanying drawings. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0064] As used herein, the terms "comprise," "comprising," and "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not limited to the listed steps or elements but may optionally include steps or elements not listed, or may optionally include other steps or elements inherent to the process, method, product, or apparatus.

[0065] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0066] See also Figure 1 and Figure 2 As shown, a wafer inspection device corresponding to a preferred embodiment of the present invention includes: a rotating table 100, suitable for carrying and adsorbing a wafer 110 and driving the wafer 110 to rotate; a positioning mechanism 300, suitable for detecting the offset of the wafer 110 during the rotation of the wafer 110; an adjustment mechanism 200, suitable for lifting the wafer 110 off the rotating table 100, and in response to the offset detected by the positioning mechanism 300, driving the lifted wafer 110 to fine-tune the wafer 110 along a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction; a first inspection mechanism 400, used to detect the edge of the wafer 110; a first support mechanism 500, located below the wafer 110 and corresponding to a portion of the wafer 110 within the inspection area of ​​the first inspection mechanism 400, the first support mechanism 500 being suitable for approaching and supporting the edge of the wafer 110 upward; wherein the wafer 110 is suitable for rotating under the drive of the rotating table 100 so that all parts of its peripheral edge flow through the inspection area of ​​the first inspection mechanism 400.

[0067] The present invention directly carries and adsorbs the wafer 110 through the rotating table 100, without setting up an additional clamping structure, and the wafer 110 is not easily damaged during the taking and placing process, and the taking and placing process is more convenient and efficient. At the same time, the edge of the wafer 110 will not be blocked, thereby improving the efficiency of subsequent detection and the consistency of the edge detection process; by setting up a positioning mechanism 300 and an adjustment mechanism 200, the positioning mechanism 300 can perform position detection on the wafer 110 placed on the rotating table 100, and the adjustment mechanism 200 can fine-tune the wafer 110 according to the actual deviation of the wafer 110, so that the wafer 110 and the rotating table 100 are accurately coaxial, so that subsequent detection During the detection process, the edge of the wafer 110 can be reliably detected; in order to ensure that wafers 110 of different sizes can all achieve edge detection reliably, the size of the turntable 100 will be made smaller, so that the sizes of different wafers 110 are all larger than the size of the turntable 100 to avoid blocking the edge of the wafer 110. However, the use of the above structure will cause the edges of some larger wafers 110 to warp downward, affecting the detection accuracy. By setting up a first support mechanism 500, it can support the edge of the portion of the wafer 110 that is in the detection area of ​​the wafer 110 to prevent the portion from warping downward, thereby improving the detection accuracy.

[0068] Furthermore, the rotating table 100 is a conventional vacuum adsorption turntable. The table top of the rotating table 100 is circular and is provided with a plurality of adsorption holes for adsorbing the bottom surface of the wafer 110 , which will not be described in detail in the present invention.

[0069] Further, refer to Figure 3 and Figure 4 As shown, the adjustment mechanism 200 includes a lifting module 210, a fine-tuning module 220, and a lifting frame 230. The fine-tuning module 220 is supported by the lifting module 210 and is adapted to be raised and lowered in a vertical direction under the drive of the lifting module 210. The lifting frame 230 is supported by the fine-tuning module 220 and is adapted to be moved in a first horizontal direction and a second horizontal direction under the drive of the fine-tuning module 220. The lifting frame 230 is located below the wafer 110 and is adapted to be lifted to support the wafer 110.

[0070] In this embodiment, the jacking module 210 includes a jacking drive 211 and a sliding seat 212. The jacking drive 211 can be an electric cylinder or a pneumatic cylinder. In this embodiment, an electric cylinder is preferably used to improve the reliability of the load-bearing. The sliding seat 212 is connected to the output end of the jacking drive 211 so as to be lifted and lowered in the vertical direction under the drive of the jacking drive 211. Preferably, a slide rail assembly 213 is provided between the sliding seat 212 and the jacking drive 211. The slide rail assembly 213 is arranged along the vertical direction to smoothly and reliably guide the sliding seat 212 to rise and fall. The fine-tuning module 220 is an electric slide, which is fixed on the sliding seat 212. The electric slide is a well-known structure and the present invention will not be described in detail here. The lifting frame 230 is connected to the output end of the fine-tuning module 220 and is located below the wafer 110. It is suitable for lifting and supporting the wafer 110 under the drive of the lifting module 210, and is suitable for moving along the first horizontal direction and the second horizontal direction under the drive of the fine-tuning module 220 to achieve fine-tuning of the wafer 110.

[0071] Furthermore, the wafer inspection device includes a mounting table 600, a rotating table 100 is arranged on the table top of the mounting table 600, a receiving space 610 is formed in the mounting table 600, a lifting module 210 and a fine-tuning module 220 are arranged in the receiving space 610, and the lifting frame 230 is partially located in the receiving space 610 to be transmission-connected with the fine-tuning module 220, and partially located outside the receiving space 610 and surrounded by the rotating table 100.

[0072] Specifically, the mounting platform 600 includes a base plate 620, a table plate 630, and columns 640. The table plate 630 is arranged parallel to and above the base plate 620. The rotation platform 100 is fixed to the table surface of the table plate 630. The columns 640 are connected between the base plate 620 and the table plate 630. There are multiple columns 640, which are arranged at intervals along the periphery of the base plate 620 and / or the table plate 630. The columns 640 enclose a receiving space 610.

[0073] The lifting frame 230 includes a base plate 231, a top frame 232, and connectors 233. The base plate 231 is housed within the receiving space 610 and supports the fine-tuning module 220. The top frame 232 is a vertically penetrating structure, located outside the receiving space 610 and surrounding the outer periphery of the turntable 100. Connectors 233 partially extend through the receiving space 610 to connect between the base plate 231 and the top frame 232. Multiple connectors 233 are arranged at intervals along the periphery of the base plate 231 and / or the top frame 232.

[0074] In this embodiment, the connector 233 is a columnar structure arranged in a vertical direction. A clearance area 631 is formed through the table 630 in the vertical direction. The connector 233 is accommodated in the clearance area 631 to connect the bottom plate 231 and the top frame 232 via the clearance area 631. In the clearance area 631, the connector 233 can move along the first horizontal direction and the second horizontal direction to avoid obstructing the fine-tuning of the wafer 110. Several connectors 233 are provided on both sides of the bottom plate 231 and / or the top frame 232 in the first horizontal direction, and preferably two connectors 233 are provided on each side. Accordingly, there are two clearance areas 631, which are provided on both sides of the table 630 in the first horizontal direction, and the clearance area 631 on each side accommodates two connectors 233.

[0075] However, when using the top frame 232 to directly lift the wafer 110, the contact area between the top frame 232 and the wafer 110 is relatively large. To ensure reliability during the lifting process, the top frame 232 must have a high flatness. As a preferred embodiment, the top frame 232 is provided with a first support member 234 that protrudes from the top surface of the top frame 232. Multiple first support members 234 are evenly distributed along the axial direction of the top frame 232 to contact the bottom surface of the wafer 110, ensuring reliable contact and lifting of the wafer 110. The first support member 234 is preferably a vacuum nozzle that can absorb the wafer 110 to prevent the wafer 110 from shifting relative to the lifting frame 230 during the lifting and fine-tuning process.

[0076] Further, refer to Figure 1 、 Figure 2 and Figure 5As shown, the positioning mechanism 300 is located on one side of the turntable 100 in the first horizontal direction. It includes a first bracket 310 and a detection sensor 320 disposed on the first bracket 310. The detection sensor 320 can be a laser sensor, with its detection direction parallel to the vertical direction. Two detection sensors 320 are arranged vertically at intervals. One detection sensor 320 is located above the wafer 110, while the other detection sensor 320 is located below the wafer 110. The detection ends of the two detection sensors 320 are arranged opposite each other. A detection area is formed between the two detection sensors 320. As the turntable 100 rotates the wafer 110, the edge of the wafer 110 is adapted to flow through the detection area of ​​the detection sensor 320 to detect the eccentricity of the wafer 110. Because the size of the wafer 110 is larger than the table size of the turntable 100, the wafer 110 may warp downward. By providing two detection sensors 320 that cooperate with each other, errors caused by vertical deformation of the wafer 110 can be compensated and / or eliminated, making the acquired deviation information more accurate.

[0077] In addition, some other wafers 110 need to have their diameters measured during the inspection process. The inspection sensor 320 can also measure the diameter of the wafer 110, that is, the positioning mechanism 300 can simultaneously have the wafer 110 deviation detection and diameter measurement functions, without the need to set up additional measurement structures, simplifying the structure and reducing costs.

[0078] Further, refer to Figure 1 、 Figure 2 and Figure 6 As shown, the first detection mechanism 400 is located on one side of the rotating table 100 in the second horizontal direction, and includes a second bracket 410, a first detection camera 420, and a first light source 430. There are two second brackets 410, which are spaced apart along the first horizontal direction, and the first support mechanism 500 is located between the two second brackets 410. The first detection camera 420 is set on one of the second brackets 410, and its shooting direction is parallel to the first horizontal direction. The first light source 430 is set on the other second bracket 410, and its irradiation direction is parallel to the first horizontal direction. The irradiation end of the first light source 430 and the shooting end of the first detection camera 420 are arranged opposite to each other, and a detection area is formed between the first detection camera 420 and the first light source 430. When the rotating table 100 drives the wafer 110 to rotate, the edge of the wafer 110 is suitable for passing through the detection area between the first detection camera 420 and the first light source 430 to detect the chamfer or edge appearance of the edge of the wafer 110.

[0079] Preferably, each of the two second brackets 410 is provided with a displacement slide 411, which is provided with a mounting seat 412. The first detection camera 420 and the first light source 430 are respectively provided on different mounting seats 412. The displacement slide 411 is a manually adjustable structure that can adjust the first detection camera 420 and the first light source 430 to correspond to the preset position of the edge of the wafer 110 to ensure detection accuracy.

[0080] Preferably, a shielding plate 413 is provided on the mounting base 412 corresponding to the first light source 430, and the shielding plate 413 is suitable for shielding the irradiation end of the first light source 430. Figure 7 and Figure 8 As shown, the shielding plate 413 is provided with a relief hole 4131 that is concentric with the first light source 430. The relief hole 4131 can limit the illumination range of the first light source 430 to precisely match the edge of the wafer 110, that is, the light is precisely hit on the edge area that needs to be inspected, reducing interference and enabling the first detection camera 420 to clearly capture the edge contour. In the illumination direction of the first light source 430, the inner circumference of the relief hole 4131 gradually decreases, so that the light emitted from the relief hole 4131 can be more concentrated, further improving the illumination effect. The relief hole 4131 is preferably a square hole, with two edges of the cross section of the relief hole 4131 parallel to the vertical direction and the other two edges parallel to the second horizontal direction. With the above structure, the light emitted by the first light source 430 is square, and the edges of the square light are straight, which can produce a light-dark dividing line with a sharp boundary and extremely high contrast. This greatly simplifies the edge positioning process of the image, improves positioning accuracy, and makes it extremely sensitive to tiny defects in the edge morphology while maintaining illumination uniformity.

[0081] Furthermore, an adjustment block 414 is provided on the baffle plate 413. This adjustment block 414 is located on the side of the baffle plate 413 facing away from the first light source 430. This adjustment block 414 is movable relative to the baffle plate 413 to gradually open or close the side of the avoidance hole 4131 facing away from the first light source 430. This allows the opening of the avoidance hole 4131 to be flexibly adjusted as needed to meet varying lighting requirements. In this embodiment, there are two adjustment blocks 414, which are arranged vertically opposite each other. The adjustment blocks 414 are vertically slidable, and are adapted to move toward each other to gradually close the avoidance hole 4131, or move away from each other to gradually open the avoidance hole 4131. One of the adjustment block 414 and the baffle plate 413 is provided with a connecting hole 4132, and the other is provided with an adjusting waist hole 4141. The length direction of the adjusting waist hole 4141 is parallel to the vertical direction. A threaded member such as a bolt or screw is provided between the connecting hole 4132 and the adjusting waist hole 4141 to secure the adjustment block 414 to the baffle plate 413. Preferably, in the second horizontal direction, the two sides of the adjustment block 414 protrude relative to the inner walls of the avoidance hole 4131, and the opposing sides of the two adjustment blocks 414 are parallel to the second horizontal direction. This ensures that during adjustment of the adjustment block 414, the defined areas of different openings are also square areas, and the dimensions in the second horizontal direction remain unchanged, while only the vertical dimensions change. This avoids readjusting the positions of the first light source 430 and the first detection camera 420 after adjustment of the adjustment block 414.

[0082] Further, refer to Figure 1 、 Figure 2 、 Figure 6 and Figure 9 As shown, the first support mechanism 500 includes a third bracket 510, a support driver 520, and a support assembly 530. The support driver 520 is disposed on the third bracket 510. The support assembly 530 is transmission-connected to the support driver 520 and is located below the wafer 110. The support assembly 530 is adapted to move upward under the drive of the support driver 520, and to align its support surface for supporting the wafer 110 with the support surface of the turntable 100, thereby correcting the edge of the wafer 110 so that the edge and center of the wafer 110 are on the same horizontal plane, ensuring that the first inspection camera 420 and the first light source 430 are facing the cross-section of the wafer 110 perpendicular to the first horizontal direction, facilitating accurate analysis after imaging. The support driver 520 preferably utilizes an electric cylinder arranged in a vertical direction to ensure the lifting accuracy of the support assembly 530.

[0083] The support assembly 530 includes a support base 531 and a second support member 532. The support base 531 is connected to the output end of the support driver 520. The support base 531 is recessed inward from its top to form a mounting hole 5311. The second support member 532 is inserted into the mounting hole 5311, with its top protruding relative to the top of the support base 531. The second support member 532 is used to contact and support the top surface of the wafer 110. In this embodiment, two second support members 532 are preferably arranged side by side along the first horizontal direction. The two second support members 532 cooperate to support the edge of the wafer 110, thereby improving the correction effect.

[0084] Preferably, in this embodiment, the second support member 532 is a rod-shaped structure, comprising a rod body 5321 and a protrusion 5322 coaxially disposed at the bottom end of the rod body 5321. The outer diameter of the protrusion 5322 is larger than the outer diameter of the rod body 5321. The mounting hole 5311 is formed through the vertical direction and comprises a first section 5312 and a second section 5313 connected to the first section 5312. The first section 5312 is adapted to fit the rod body 5321, and the second section 5313 is adapted to fit the protrusion 5322. The rod body 5321 is accommodated in the first section 5312, and the bottom end extends into the second section 5313. The protrusion 5322 is accommodated in the second section 5313. The second support member 532 can move in the vertical direction. A spring 533 is provided on the outer cover of the rod body 5321. One end of the spring 533 abuts against the protrusion 5322, and the other end abuts against the step surface between the first section 5312 and the second section 5313. A micrometer screw 534 is provided at the bottom of the support seat 531. The telescopic end of the device 534 extends into the second section 5313 from the end of the second section 5313 away from the first section 5312, and abuts against the protrusion 5322. By rotating the screw micrometer 534, it can push the protrusion 5322, so that the rod body 5321 gradually extends out of the first section 5312 and compresses the spring 533. When the screw micrometer 534 is rotated in the opposite direction, the rod body 5321 gradually extends into the first section 5312 under the rebound action of the spring 533.

[0085] By adopting the above structure, the extension amount of the rod body 5321 can be adjusted. When the support driving member 520 rises to the preset position and the top end of the second support member 532 is not flush with the table surface of the rotating table 100, the two can be made flush by adjusting the rod body 5321. The operation is simple and no additional adjustment of the support driving member 520 is required.

[0086] Furthermore, when inspecting the wafer 110 , in addition to inspecting the edge of the wafer 110 , there is also a need to inspect the notch 111 on the edge of the wafer 110 , for example, to inspect whether the size and contour of the notch 111 meet the requirements.

[0087] As a preferred embodiment, refer to Figure 1 、 Figure 2 and Figure 10 As shown, the wafer inspection device includes a second inspection mechanism 700 located on the other side of the rotating table 100 in the first horizontal direction. The second inspection mechanism 700 includes a fourth bracket 710, a second inspection camera 720, a second light source 730, and a third light source 740. The second inspection camera 720 is set on the fourth bracket 710, and the shooting direction is parallel to the vertical direction. Two second inspection cameras 720 are arranged at intervals along the vertical direction. One of the second inspection cameras 720 is located above the wafer 110, and the other second inspection camera 720 is located below the wafer 110. The shooting ends of the two second inspection cameras 720 are arranged relative to each other, and an inspection area is formed between the two second inspection cameras 720. During the rotation of the wafer 110 driven by the rotating table 100, the notch 111 on the edge of the wafer 110 is suitable for passing through the inspection area of ​​the second inspection camera 720.

[0088] The second light source 730 is arranged on the fourth bracket 710, which is located between the two second detection cameras 720 and is suitable for illuminating the bottom surface of the wafer 110 in the vertical direction. The second light source 730 is an annular light source. The shooting ends of the two second detection cameras 720 correspond to the hollow area of ​​the second light source 730. The second detection camera 720 can shoot the notch 111 through the hollow area of ​​the second light source 730.

[0089] The third light source 740 is disposed on the fourth bracket 710, and is staggered with the detection area of ​​the second detection camera 720 so as not to obstruct the shooting of the second detection camera 720. The third light source 740 is arranged relative to the peripheral side of the wafer 110, and is suitable for illuminating the peripheral side of the wafer 110 along the first horizontal direction. Through the cooperation between the second light source 730 and the third light source 740, the notch 111 can be illuminated in all directions, ensuring that the second detection camera 720 clearly captures the image of the notch 111. Preferably, an adjusting cylinder 750 is provided between the third light source 740 and the fourth bracket 710, and the adjusting cylinder 750 is suitable for driving the third light source 740 along the first horizontal direction to approach or move away from the peripheral side of the wafer 110 to adapt to wafers 110 of different sizes.

[0090] Furthermore, the wafer inspection apparatus further includes a second support mechanism 800 positioned below the wafer 110. The second support mechanism 800 corresponds to a portion of the wafer 110 within the inspection area of ​​the second inspection mechanism 700. The second support mechanism 800 is adapted to approach and support the edge of the wafer 110 upwardly to improve the inspection accuracy of the second inspection camera 720. The second light source 730 is positioned between the second support mechanism 800 and the third light source 740. In this embodiment, the second support mechanism 800 is directly mounted on the fourth bracket 710. The structure of the second support mechanism 800 is similar to that of the first support mechanism 500, and will not be further described herein.

[0091] In addition, the present invention also provides a detection method, comprising the following steps:

[0092] S100 , transporting the wafer 110 to the rotating table 100 , which drives the wafer 110 to rotate one circle, and the positioning mechanism 300 obtains the center deviation of the wafer 110 .

[0093] S200 , the adjustment mechanism 200 adjusts the position of the wafer 110 according to the circle center deviation obtained by the positioning mechanism 300 , so that the actual circle center of the wafer 110 coincides with the preset standard circle center.

[0094] In this step, the turntable 100 first releases the adsorption of the wafer 110, and then the lifting frame 230 is lifted by the lifting module 210 to separate the wafer 110 from the turntable 100. Then, the fine-tuning module 220 adjusts the wafer 110 along the first horizontal direction and the second horizontal direction according to the actual deviation, so that the wafer 110 coincides with the center of the turntable 100. Then, the lifting module 210 drives the lifting frame 230 to descend, and the wafer 110 is re-adsorbed on the turntable 100.

[0095] S300, the rotating table 100 drives the wafer 110 to rotate one circle again, and the positioning mechanism 300 rechecks the position of the wafer 110. If the actual center of the wafer 110 coincides with the preset standard center, the rotating table 100 drives the wafer 110 to rotate one circle for detection. If the actual center of the wafer 110 does not coincide with the preset standard center, the step S200 is repeated.

[0096] S400, during the rotation inspection process of the rotating table 100 driving the wafer 110, it stops after each rotation of a preset angle, and then the first supporting mechanism 500 rises to support the edge of the wafer 110, and the first inspection mechanism 400 inspects the edge of the supported wafer 110 until the wafer 110 rotates one circle, completing the inspection of multiple measurement points on the edge of the wafer 110.

[0097] In this step, the turntable 100 stops every 45° of rotation and performs edge detection during the pause. After the detection is completed, the turntable 100 continues to rotate 45° for another detection, until the wafer 110 completes one rotation, the detection is completed, and the wafer 110 is removed. Of course, in other embodiments, the turntable 100 may rotate every 30°, 60°, etc., and the present invention is not limited thereto.

[0098] Furthermore, when a second detection mechanism 700 and a second support mechanism 800 are provided, during the multiple stop gaps of the turntable 100, there is a situation where the edge notch 111 of the wafer 110 corresponds to the second detection mechanism 700. When the notch 111 corresponds to the second detection mechanism 700, the second support mechanism 800 rises and supports the edge of the wafer 110, and then the second detection mechanism 700 detects the notch 111.

[0099] The above description is only an implementation method of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A wafer inspection device, characterized in that: include: A rotating table (100) is suitable for carrying the adsorbed wafer (110) and driving the wafer (110) to rotate; A positioning mechanism (300) is suitable for detecting the offset of the wafer (110) during the rotation of the wafer (110), and the positioning mechanism (300) is located on one side of the rotating table (100) in the first horizontal direction, and comprises: a first bracket (310); a detection sensor (320) arranged on the first bracket (310), and the detection direction is parallel to the vertical direction, and two detection sensors (320) are arranged at intervals along the vertical direction, and the detection ends of the two detection sensors (320) are arranged opposite to each other; wherein a detection area is formed between the two detection sensors (320), and when the rotating table (100) drives the wafer (110) to rotate, the edge of the wafer (110) is suitable for flowing through the detection area of ​​the detection sensor (320); an adjustment mechanism (200) adapted to lift the wafer (110) off the rotating table (100) and, in response to an offset detected by the positioning mechanism (300), drive the lifted wafer (110) to fine-tune the wafer (110) along a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction; A first detection mechanism (400) for detecting an edge of a wafer (110); a first supporting mechanism (500) located below the wafer (110) and corresponding to a portion of the wafer (110) within the detection area of ​​the first detection mechanism (400), the first supporting mechanism (500) being adapted to approach and support an edge of the wafer (110); The wafer (110) is adapted to rotate under the drive of the rotating table (100), so that all parts of its periphery flow through the detection area of ​​the first detection mechanism (400).

2. The wafer inspection device according to claim 1, wherein: The adjustment mechanism (200) comprises: Lifting module (210); a fine-tuning module (220), carried by the jacking module (210) and adapted to be lifted and lowered in a vertical direction under the drive of the jacking module (210); A lifting frame (230), supported by the fine-tuning module (220), and adapted to move along a first horizontal direction and a second horizontal direction under the drive of the fine-tuning module (220); The lifting frame (230) is located below the wafer (110) and is used to support the wafer (110).

3. The wafer inspection device according to claim 2, wherein: The wafer detection device includes a mounting table (600), the rotating table (100) is arranged on the table surface of the mounting table (600), a receiving space (610) is formed in the mounting table (600), the lifting module (210) and the fine-tuning module (220) are arranged in the receiving space (610), the lifting frame (230) is partially located in the receiving space (610) to be transmission-connected with the fine-tuning module (220), and is partially located outside the receiving space (610) and is arranged around the rotating table (100).

4. The wafer inspection device according to claim 3, wherein: The jacking frame (230) comprises: A bottom plate (231) is received in the receiving space (610) and supported by the fine-tuning module (220); A top frame (232) is located outside the receiving space (610) and surrounds the outer periphery of the rotating platform (100); Connecting members (233) connected between the bottom plate (231) and the top frame (232), with a plurality of connecting members arranged at intervals along the periphery of the bottom plate (231) and / or the top frame (232); The top frame (232) is provided with a first support member (234) protruding relative to the top surface of the top frame (232), and a plurality of the first support members (234) are evenly distributed along the circumference of the top frame (232) to contact the bottom surface of the wafer (110).

5. The wafer inspection device according to claim 1, wherein: The first detection mechanism (400) is located on one side of the rotating platform (100) in the second horizontal direction, and comprises: There are two second brackets (410) arranged at intervals along a first horizontal direction, and the first supporting mechanism (500) is located between the two second brackets (410); A first detection camera (420) is arranged on one of the second brackets (410), and its shooting direction is parallel to the first horizontal direction; a first light source (430) disposed on another of the second brackets (410), with an irradiation direction parallel to the first horizontal direction, and an irradiation end of the first light source (430) and a shooting end of the first detection camera (420) arranged opposite to each other; A detection area is formed between the first detection camera (420) and the first light source (430), and when the rotating table (100) drives the wafer (110) to rotate, the edge of the wafer (110) is suitable for flowing through the detection area between the first detection camera (420) and the first light source (430).

6. The wafer inspection device according to claim 1, wherein: The first supporting mechanism (500) comprises: A third bracket (510); A supporting driving member (520) is provided on the third bracket (510); A support assembly (530) is transmission-connected to the support drive member (520) and is located below the wafer (110); The support assembly (530) is adapted to move upwards under the drive of the support driving member (520), and to make its support surface for supporting the wafer (110) flush with the support surface of the rotating table (100).

7. The wafer inspection device according to claim 1, wherein: The wafer detection device comprises a second detection mechanism (700), the second detection mechanism (700) being located on the other side of the rotating platform (100) in the first horizontal direction, the second detection mechanism (700) comprising: Fourth bracket (710); a second detection camera (720) disposed on the fourth bracket (710), with a shooting direction parallel to the vertical direction; two second detection cameras (720) are arranged at intervals along the vertical direction, and the shooting ends of the two second detection cameras (720) are arranged opposite to each other; a second light source (730) disposed on the fourth bracket (710), located between the two second detection cameras (720), and suitable for illuminating the bottom surface of the wafer (110), the second light source (730) being a ring-shaped light source, and the shooting ends of the two second detection cameras (720) corresponding to the hollow area of ​​the second light source (730); a third light source (740), disposed on the fourth support (710) and adapted to illuminate the circumference of the wafer (110); A detection area is formed between the two second detection cameras (720), the third light source (740) is staggered with the detection area of ​​the second detection camera (720), and when the rotating table (100) drives the wafer (110) to rotate, the notch (111) on the edge of the wafer (110) is suitable for flowing through the detection area of ​​the second detection camera (720).

8. The wafer inspection device according to claim 7, wherein: The wafer detection device comprises a second support mechanism (800) located below the wafer (110), the second support mechanism (800) corresponding to a portion of the wafer (110) within the detection area of ​​the second detection mechanism (700), and the second support mechanism (800) is suitable for approaching and supporting the edge of the wafer (110) upwards.

9. A wafer detection method, characterized in that: The following steps are involved: S100, transporting the wafer (110) to the rotating table (100), wherein the rotating table (100) drives the wafer (110) to rotate one circle, and the positioning mechanism (300) obtains the center deviation of the wafer (110); S200, the adjustment mechanism (200) adjusts the position of the wafer (110) according to the circle center deviation amount obtained by the positioning mechanism (300), so that the actual circle center of the wafer (110) coincides with the preset standard circle center; S300, the rotating table (100) drives the wafer (110) to rotate one circle again, and the positioning mechanism (300) rechecks the position of the wafer (110). If the actual center of the wafer (110) coincides with the preset standard center, the rotating table (100) drives the wafer (110) to rotate one circle for detection. If the actual center of the wafer (110) does not coincide with the preset standard center, the step of S200 is repeated; S400, during the detection process of the rotation of the wafer (110) driven by the rotating table (100), the rotating table stops after each rotation of a preset angle, and then the first supporting mechanism (500) rises to support the edge of the wafer (110), and the first detection mechanism (400) detects the edge of the supported wafer (110) until the wafer (110) rotates one circle, thereby completing the detection of multiple measurement points on the edge of the wafer (110).

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