A through-flow module and a method for producing a through-flow module

Abstract

The present application relates to a kind of through-flow module and its preparation method, wherein the through-flow module includes first through-flow block, second through-flow block, and insulating piece, the second through-flow block includes main body, and boss is arranged at the both ends of the main body, the first through-flow block is arranged between two the boss, the insulating piece is clamped between the first through-flow block and the main body and boss, the surface of the first through-flow block away from the main body is formed as first welding surface, the end face of the boss is formed as second welding surface, and the first welding surface is coplanar with second welding surface.The present application increases the number of through-flow channel by using the space in height direction, is conducive to reducing the occupation of through-flow module to board area, makes the layout of circuit board more compact, to save space, and the structure is stable and reliable, effectively improves product performance.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of circuit board, in particular to a through-flow module and a preparation method thereof. BACKGROUND

[0002] At present, the processor and camera of mobile phone or other consumer products have more and more powerful functions, and the power during work is also more and more large, but the area of the main control board is more and more miniaturized, so as to leave more space for the battery, and therefore there is not enough space on the main control board to pass through the current, and the current solution is to paste a copper sheet on the surface of the main control board to increase the current passing capacity. The existing through-flow module can only meet the through-flow of a single channel, and with the development of technology, the number of through-flow channels required is also increasing, and multiple through-flow modules need to occupy a larger area, which is not conducive to the layout of components. SUMMARY

[0003] The purpose of the present application is to provide a through-flow module and a preparation method thereof, which increase the number of through-flow channels by utilizing the space in the height direction, which is conducive to reducing the occupation of the through-flow module on the surface area of the board, making the layout of the circuit board more compact, thereby saving space, and the structure is stable and reliable, effectively improving the performance of the product.

[0004] A through-flow module, comprising a first through-flow block, a second through-flow block, and an insulating piece, the second through-flow block comprises a main body and a boss arranged at both ends of the main body, the first through-flow block is arranged between the two bosses, the insulating piece is clamped between the first through-flow block and the main body and the boss, the surface of the first through-flow block away from the main body is formed into a first welding surface, the end surface of the boss is formed into a second welding surface, and the first welding surface and the second welding surface are coplanar.

[0005] In the above technical solution, the two ends of the first through-flow block can be connected to the circuit board to form a first through-flow channel, and the second through-flow block is stacked above the first through-flow block through the boss, and is connected to the circuit board through the two bosses to form a second through-flow channel, effectively utilizing the space in the height direction, reducing the occupation of the surface area of the circuit board, and being conducive to the layout of the circuit board, making the design of the circuit more flexible. The insulating piece is clamped between the first through-flow block and the second through-flow block, which can ensure the insulation performance between the two, thereby improving the stability and reliability of the structure.

[0006] Further, it further comprises an insulating outer layer, which is wrapped around the outer periphery of the first through-flow block and the second through-flow block, the insulating outer layer comprises a functional surface and a non-functional surface, and the first welding surface and the second welding surface are located on the functional surface.

[0007] In the technical scheme, the insulating outer layer is arranged to insulate the surfaces of the through-flow module except the first welding surface and the second welding surface, thereby improving the reliability of the through-flow module, and other components can be arranged closer to the through-flow module, which is conducive to high-density component arrangement and further improves the utilization rate of the circuit board. Moreover, due to the peripheral insulation of the through-flow module, the distance between two adjacent through-flow modules can be closer while meeting the voltage resistance requirement.

[0008] Further, the non-functional surface is provided with a metal plating layer, and the functional surface is provided with at least one grounding part, and the grounding part is electrically connected with the metal plating layer.

[0009] In the technical scheme, the non-functional surface is provided with a metal plating layer, and the metal plating layer can be connected with the ground of the circuit board through the grounding part, so that the metal plating layer plays a role of electromagnetic shielding to prevent the large current of the through-flow module from causing signal interference to the outside.

[0010] Further, the metal plating layer comprises a first metal layer and a second metal layer, and the first metal layer and the second metal layer are copper and stainless steel respectively.

[0011] In the technical scheme, copper has good conductivity and shielding performance, and stainless steel has corrosion resistance, and the combination of the first metal layer and the second metal layer effectively improves the performance of the through-flow module.

[0012] Further, the non-functional surface is provided with at least one signal channel, the functional surface is provided with a first signal connection surface and a second signal connection surface, and the first signal connection surface and the second signal connection surface are respectively electrically connected to two ends of the signal channel.

[0013] In the technical scheme, the signal channel can be formed by an LDS (Laser-Direct-structuring) process, and the first signal connection surface and the second signal connection surface cooperate with the signal channel to form a signal transmission circuit on the through-flow module, so that the through-flow module has both through-flow and communication functions, further improving the flexibility of the through-flow module and making the layout of the circuit more convenient.

[0014] Further, the insulating part comprises an insulating layer, and two side surfaces of the insulating layer are respectively provided with a first adhesive layer and a second adhesive layer, and the first adhesive layer and the second adhesive layer are respectively adhered to the first through-flow block and the second through-flow block.

[0015] In the technical scheme, the insulating part is provided with the insulating layer, the first adhesive layer and the second adhesive layer, so that the insulating part not only has the function of insulation, but also can connect the first through-flow block and the second through-flow block, making the assembly more convenient.

[0016] A through-flow module preparation method comprises the following steps:

[0017] The first flow-through block and the second flow-through block are made of conductive metal;

[0018] The first flow-through block and the second flow-through block are bonded by the insulating member to obtain a flow-through main body;

[0019] The isolation rubber paper is pasted on the first welding surface and the second welding surface of the flow-through main body;

[0020] The insulating outer layer is formed on the outer periphery of the flow-through main body by injection molding of the insulating material;

[0021] The isolation rubber paper is separated from the flow-through main body after injection molding;

[0022] The flow-through module is obtained by cutting the flow-through main body after injection molding.

[0023] Further, after the flow-through module is obtained by cutting the flow-through main body after injection molding, a metal plating layer is generated on a non-functional surface of the flow-through module.

[0024] Further, a grounding part is made, and the grounding part is in conduction with the metal plating layer.

[0025] Further, the metal plating layer is ablated to form a signal channel, and a first signal connection surface and a second signal connection surface in communication with the signal channel are made.

[0026] Compared with the prior art, the beneficial effects of the present application are that the two ends of the first flow-through block can be connected to the circuit board to form a first flow-through channel, the second flow-through block is stacked above the first flow-through block through the bosses, and the two bosses are connected to the circuit board to form a second flow-through channel, effectively utilizing the space in the height direction, reducing the occupation of the surface area of the circuit board, and being conducive to the layout of the circuit board, making the design of the circuit more flexible. The insulating member is clamped between the first flow-through block and the second flow-through block, which can ensure the insulation performance between the two, thereby improving the stability and reliability of the structure. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 It is a structure schematic view of the first embodiment of the flow-through module of the present application.

[0028] Figure 2 It is a structure schematic view of the second embodiment of the flow-through module of the present application.

[0029] Figure 3 It is a structure schematic view of the functional surface of the second embodiment of the flow-through module of the present application.

[0030] Figure 4 It is a structure schematic view of the third embodiment of the flow-through module of the present application.

[0031] Figure 5 Structure diagram of the functional surface of the third embodiment of the through-flow module of the present application.

[0032] Figure 6 Structure diagram of the communication channel of the fourth embodiment of the through-flow module of the present application.

[0033] Figure 7 Structure diagram of the functional surface of the fourth embodiment of the through-flow module of the present application.

[0034] Figure 8 Structure diagram of the insulation piece of the present application.

[0035] Figure 9 Flow chart of the preparation method of the through-flow module of the present application.

[0036] Figure 10 Flow chart of the first embodiment of the preparation method of the through-flow module of the present application.

[0037] Figure 11 Structure diagram of step 103 of the first embodiment of the preparation method of the through-flow module of the present application.

[0038] Figure 12 Flow chart of the second embodiment of the preparation method of the through-flow module of the present application.

[0039] Figure 13 Structure diagram of the first wire frame of the second embodiment of the preparation method of the through-flow module of the present application.

[0040] Figure 14 Structure diagram of the second wire frame of the second embodiment of the preparation method of the through-flow module of the present application.

[0041] Figure 15 Structure diagram of the insulation piece of the second embodiment of the preparation method of the through-flow module of the present application.

[0042] Figure 16 Structure diagram of the isolation adhesive paper and the through-flow main frame of the second embodiment of the preparation method of the through-flow module of the present application.

[0043] First through-flow block 1, first welding surface 11, second through-flow block 2, main body 21, boss 22, second welding surface 23, insulation piece 3, insulation layer 31, first adhesive layer 32, second adhesive layer 33, insulation outer layer 4, functional surface 41, non-functional surface 42, metal plating layer 5, grounding part 53, signal channel 54, first signal connecting surface 55, second signal connecting surface 56, isolation adhesive paper 6, through-flow main body 7, first wire frame 8, first frame 81, second wire frame 9, second frame 91. DETAILED DESCRIPTION

[0044] For the purpose of promoting the understanding of the present application, the present application will be described in further detail below with reference to the attached drawings. In the drawings, preferred embodiments of the present application are shown. However, the present application can be realized in many different forms and should not be limited to the embodiments described herein.

[0045] Please refer to Figure 1 , Figure 1 For the first embodiment of the through-flow module of the present application, the through-flow module comprises a first through-flow block 1, a second through-flow block 2, and an insulating member 3. The second through-flow block 2 comprises a main body 21 and bosses 22 arranged at both ends of the main body 21. The first through-flow block 1 is arranged between the two bosses 22. The insulating member 3 is arranged between the first through-flow block 1 and the main body 21 and the bosses 22. The surface of the first through-flow block 1 facing away from the main body 21 is formed as a first soldering surface 11. The end surface of the boss 22 is formed as a second soldering surface 23. The first soldering surface 11 is coplanar with the second soldering surface 23.

[0046] For example, the first through-flow block 1 and the second through-flow block 2 are both made of conductive metal. In the present embodiment, the first through-flow block 1 and the second through-flow block 2 are preferably made of copper. The first through-flow block 1 is formed as a cuboid. From the perspective of the angle, the lower end surface of the first through-flow block 1 is the first soldering surface 11. The first through-flow block 1 can be soldered to the circuit board through the two ends of the first soldering surface 11 to form a first through-flow channel. Figure 1 From the perspective of the angle, the lower end surface of the first through-flow block 1 is the first soldering surface 11. The first through-flow block 1 can be soldered to the circuit board through the two ends of the first soldering surface 11 to form a first through-flow channel.

[0047] The second through-flow block 2 makes the main body 21 overlap the first through-flow block 1 through the bosses 22 and connects the circuit board through the two bosses 22 to form a second through-flow channel. The space in the height direction is effectively utilized, the surface area of the circuit board is reduced, the layout of the circuit board is facilitated, and the design of the circuit is more flexible. The insulating member 3 is arranged between the first through-flow block 1 and the second through-flow block 2 to ensure the insulation performance between the two, thereby improving the stability and reliability of the structure.

[0048] Please refer to Figure 2 and Figure 3 The second embodiment of the through-flow module of the present application is different from the first embodiment in that it further comprises an insulating outer layer 4. The insulating outer layer 4 wraps the outer periphery of the first through-flow block 1 and the second through-flow block 2. The insulating outer layer 4 comprises a functional surface 41 and a non-functional surface 42. The first soldering surface 11 and the second soldering surface 23 are located on the functional surface 41.

[0049] Specifically, the insulating outer layer 4 can be formed by injection molding of an insulating material such as EMC (Epoxy Molding Compound). The formed insulating outer layer 4 is generally a cuboid. From the perspective of the angle, the lower end surface of the insulating outer layer 4 is the first soldering surface 11. The first through-flow block 1 can be soldered to the circuit board through the two ends of the first soldering surface 11 to form a first through-flow channel. Figure 2The lower end surface of the through-flow module is formed as a functional surface 41, and the first welding surface 11 and the second welding surface 23 are located on the functional surface 41, and the five surfaces of the insulating outer layer 4 except the functional surface 41 are formed as non-functional surfaces 42.

[0050] By arranging the insulating outer layer 4, the surfaces of the through-flow module except the first welding surface 11 and the second welding surface 23 are insulated, so that the reliability of the through-flow module is improved, other components can be arranged closer to the through-flow module, which is beneficial to high-density arrangement, and further improves the utilization rate of the circuit board. And due to the insulation of the outer periphery of the through-flow module, the distance between the two adjacent through-flow modules can be closer, while meeting the voltage withstand requirement.

[0051] Please refer to Figure 4 and Figure 5 The third embodiment of the through-flow module of the present application, the difference between this embodiment and the second embodiment is that the non-functional surface 42 is provided with a metal plating layer 5, and the functional surface 41 is provided with at least one grounding part 53, and the grounding part 53 is electrically connected with the metal plating layer 5.

[0052] The metal plating layer 5 can be generated by PVD (Physical Vapor Deposition) or LDS (Laser-Direct-structuring). Figure 4 From the direction, the first metal layer is located on the side close to the insulating outer layer 4, that is, the first metal layer is located on the inner side of the second metal layer, and the first metal layer and the second metal layer are respectively made of conductive metal and stainless steel, wherein the metal copper has good conductivity and shielding performance, and the stainless steel has corrosion resistance, and through the cooperation of the first metal layer and the second metal layer, the performance of the through-flow module is effectively improved. In specific implementation, the thickness of the first metal layer is preferably 1um~5um, the thickness of the second metal layer is preferably 0.5um~2um, and the total thickness of the metal plating layer 5 is preferably 1.5um~6um, so as to optimize the size of the through-flow module while ensuring the performance of the metal plating layer 5.

[0053] The grounding part 53 can be made of conductive metal, which is formed as a thin plane and is electrically connected with the metal plating layer 5, and the grounding part 53 can be connected with the ground of the circuit board, so that the metal plating layer 5 plays a role of electromagnetic shielding, preventing the large current of the through-flow module from causing signal interference to the outside.

[0054] Please refer to Figure 6 and Figure 7In the fourth embodiment of the through-flow module, the non-functional surface 42 is provided with at least one signal channel 54, the functional surface 41 is provided with a first signal connecting surface 55 and a second signal connecting surface 56, and the first signal connecting surface 55 and the second signal connecting surface 56 are respectively electrically connected to two ends of the signal channel 54.

[0055] In the implementation, the signal channel 54 can be formed by ablation of the unnecessary metal plating layer 5 by high-precision laser, patterning, or by an LDS (Laser-Direct-structuring) process. The first signal connecting surface 55 and the second signal connecting surface 56 cooperate with the signal channel 54 to form a signal transmission line on the through-flow module, so that the through-flow module has both through-flow and communication functions, further improving the flexibility of use of the through-flow module and making the layout of the line more convenient.

[0056] Please refer to Figure 8 The insulating member 3 includes an insulating layer 31, and the two side surfaces of the insulating layer 31 are respectively provided with a first adhesive layer 32 and a second adhesive layer 33, and the first adhesive layer 32 and the second adhesive layer 33 are respectively adhered to the first through-flow block 1 and the second through-flow block 2. For example, the insulating layer 31 can be made of PI (Polyimide), and the first adhesive layer 32 and the second adhesive layer 33 can use adhesive. By providing the insulating member 3 with the insulating layer 31, the first adhesive layer 32 and the second adhesive layer 33, the insulating member 3 not only has the function of insulation, but also can connect the first through-flow block 1 and the second through-flow block 2, making the assembly more convenient.

[0057] Please refer to Figure 9 The application further provides a through-flow module preparation method, including the following steps:

[0058] S1, the first through-flow block 1 and the second through-flow block 2 are made of conductive metal.

[0059] S2, the first through-flow block 1 and the second through-flow block 2 are adhered by the insulating member 3 to obtain a through-flow main body 7;

[0060] S3, the isolation rubber paper 6 is pasted on the first welding surface 11 and the second welding surface 23 of the through-flow main body 7;

[0061] S4, an insulating material is injection molded to form an insulating outer layer 4 on the outer periphery of the through-flow main body 7;

[0062] S5, the isolation rubber paper 6 is separated from the injection-molded through-flow main body 7;

[0063] S6, the injection-molded through-flow main body 7 is cut to obtain the through-flow module.

[0064] Further, in order to improve the corrosion resistance of the through-flow module, the method further includes:

[0065] S7, generating the metal plating layer 5 on the non-functional surface 42 of the through-flow module.

[0066] Further, in order to make the through-flow module have electromagnetic shielding performance, the through-flow module further comprises:

[0067] S8, making the grounding part 53 in conduction with the metal plating layer 5.

[0068] Further, in order to make the through-flow module have communication function, the through-flow module further comprises:

[0069] S9, ablating the metal plating layer 5 to form the signal channel 54, and making the first signal connecting surface 55 and the second signal connecting surface 56 in communication with the signal channel 54.

[0070] The preparation method of the through-flow module will be described below through specific embodiments.

[0071] Please refer to Figure 10 The first embodiment of the preparation method of the through-flow module comprises the following steps:

[0072] S101, making the single-piece first through-flow block 1 and the single-piece second through-flow block 2 by using conductive metal.

[0073] In this step, the first through-flow block 1 and the second through-flow block 2 are preferably made of metal copper, the first through-flow block 1 is formed into a copper strip in the shape of a cuboid, and the main body 21 of the second through-flow block 2 is formed into a cuboid, and the two ends of the main body 21 are formed with the bosses 22 perpendicular to the main body 21.

[0074] S102, bonding the first through-flow block 1 and the second through-flow block 2 by using the insulating part 3 to obtain the through-flow main body 7.

[0075] In this step, the insulating part 3 can be first attached to the surface of the first through-flow block 1, specifically, to the three surfaces of the first through-flow block 1 facing the main body 21 and the bosses 22, and then the second through-flow block 2 is pressed on the insulating part 3, so as to form the through-flow main body 7.

[0076] S103, obtaining the isolation adhesive paper 6, and arranging and pasting a plurality of through-flow main bodies 7 on the isolation adhesive paper 6.

[0077] Please refer to Figure 11 In this step, the isolation adhesive paper 6 can be a large-area whole piece of adhesive paper, the isolation adhesive paper 6 is laid on a preset clamp with the adhesive side upward, and a plurality of prepared through-flow main bodies 7 are arranged and pasted on the surface of the isolation adhesive paper 6, wherein the first welding surface 11 and the second welding surface 23 face the isolation adhesive paper 6.

[0078] S104, injection molding by using insulating material to form an insulating outer layer 4 on the outer periphery of the through-flow main body 7 to obtain an injection molding part.

[0079] In this step, the EMC is evenly spread on the release film 6 using an injection molding machine until it completely wraps the main body 7, forming a single injection molded part.

[0080] S105. Place the injection molded part in a high-temperature environment to make the release adhesive 6 lose its stickiness and separate the release adhesive 6 from the injection molded part.

[0081] In this step, the injection molded part can be placed in an environment of 180°C for a preset time, so that the release liner 6 loses its stickiness at high temperature, so that the injection molded part can be removed.

[0082] S106. Cut the injection molded part to decompose the product into individual flow modules.

[0083] In this step, laser depaneling equipment or cutting equipment can be used to cut the injection molded part and separate it into independent flow modules.

[0084] In this embodiment, to improve the performance of the flow module, the following steps are also included:

[0085] S107. A metal plating layer 5 is formed on the non-functional surface 42 of the flow module.

[0086] In this step, the metal coating 5 can be generated by PVD (Physical Vapor Deposition) or LDS (Laser-Direct Structuring). The metal coating 5 includes a first metal layer and a second metal layer, which are formed using conductive metal and stainless steel, respectively. The thickness of the first metal layer is preferably 1µm to 5µm, the thickness of the second metal layer is preferably 0.5µm to 2µm, and the total thickness of the metal coating 5 is preferably 1.5µm to 6µm.

[0087] In order to enable the current-carrying module to have electromagnetic shielding function, after the metal plating layer 5 is formed, the following steps are also included:

[0088] S108. Make a grounding part 53, and make the grounding part 53 conductive with the metal plating layer 5.

[0089] In this step, the grounding part 53 can be generated by PVD, or before generating the insulating outer layer 4, the grounding copper sheet can be arranged on the side of the first welding surface 11 and the second welding surface 23 by a fixture, and then injection molded to form an integral current-carrying module.

[0090] This embodiment also includes the following steps:

[0091] S109. The metal plating layer 5 is ablated to form a signal channel 54, and a first signal connection surface 55 and a second signal connection surface 56 connected to the signal channel 54 are made.

[0092] In this step, ablation can be performed using a high-precision laser. The first signal connection surface 55 and the second signal connection surface 56 can be generated by PVD, or before generating the insulating outer layer 4, the copper block is arranged next to the first welding surface 11 and the second welding surface 23 using a fixture, and then injection molded to form an integrated flow module. One end of the copper block protrudes from the functional surface 41 to form the first signal connection surface 55 and the second signal connection surface 56, and the other end protrudes from the non-functional surface 42 or is flush with the non-functional surface 42. After the signal channel 54 is fabricated, the copper block is connected to the signal channel 54.

[0093] Please refer to Figure 12 Figure 1 shows a second embodiment of the flow module manufacturing method of the present invention. The difference between this embodiment and the first embodiment is that this embodiment uses a batch method to manufacture the first flow block 1 and the second flow block 2, thereby improving manufacturing efficiency. The specific steps include:

[0094] S201. A first conductor frame 8 and a second conductor frame 9 are made of conductive metal, wherein the first conductor frame 8 and the second conductor frame 9 respectively include a plurality of first current-passing blocks 1 and second current-passing blocks 2.

[0095] Please refer to Figure 13 and Figure 14 In this step, the first conductor frame 8 and the second conductor frame 9 are preferably made of copper. The first conductor frame 8 includes a first frame 81 and a plurality of first flow blocks 1 disposed within the first frame 81. The second conductor frame 9 includes a second frame 91 and a plurality of second flow blocks 2 disposed within the second frame 91. The first flow blocks 1 and the second flow blocks are connected by connecting ribs.

[0096] S202. The first conductor frame 8 and the second conductor frame 9 are bonded together using the insulating component 3 to obtain the current-carrying body 7 frame.

[0097] Please refer to Figure 15 In this step, the insulating member 3 can be made into a shape that fits the first conductor frame 8. The insulating member 3 is first attached to the surface of the first conductor frame 8, and then the second conductor frame 9 is pressed on the insulating member 3 to form the current-carrying body 7 frame.

[0098] S203. Obtain the insulating tape 6 and attach several flow-through main body 7 frames as a whole onto the insulating tape 6.

[0099] Please refer to Figure 16 In this step, the isolation tape 6 can be a large sheet of tape. The isolation tape 6 is laid flat on the surface of the flow body 7 frame, with the first welding surface 11 and the second welding surface 23 facing the isolation tape 6.

[0100] S204. Insulating material is used for injection molding to form an insulating outer layer 4 on the outer periphery of the flow-through body 7 frame, thereby obtaining an injection molded part.

[0101] S205. Place the injection molded part in a high-temperature environment to make the release adhesive 6 lose its stickiness and separate the release adhesive 6 from the injection molded part.

[0102] S206. Cut the injection molded part to decompose the product into individual flow modules.

[0103] S207. A metal plating layer 5 is formed on the non-functional surface 42 of the flow module.

[0104] S208. A grounding part 53 is made on the functional surface 41, and the grounding part 53 is connected to the metal plating layer 5.

[0105] S209. The metal plating layer 5 is ablated to form a signal channel 54, and a first signal connection surface 55 and a second signal connection surface 56 connected to the signal channel 54 are made.

[0106] Steps S204-S209 are the same as steps S104-S109 in the first embodiment, and will not be described again here.

[0107] It should be noted that in other possible embodiments, the above-described current-carrying module preparation method can adapt the shape of the current-carrying module according to the needs of the line. For example, the current-carrying module can be made into an "L" shape, and the grounding part 53 can be arranged on the first welding surface 11 or one side of the first welding surface 11.

[0108] In the description of this invention, it should be understood that terms such as "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0109] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0110] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A flow-through module, characterized in that, The device includes a first flow block, a second flow block, and an insulating component. The second flow block includes a main body and bosses at both ends of the main body. The first flow block is disposed between the two bosses. The insulating component is sandwiched between the first flow block, the main body, and the bosses. The surface of the first flow block facing away from the main body forms a first welding surface, and the end face of the boss forms a second welding surface. The first welding surface and the second welding surface are coplanar. The insulating component includes an insulating layer, and a first adhesive layer and a second adhesive layer are respectively provided on both sides of the insulating layer. The first adhesive layer and the second adhesive layer are respectively bonded to the first flow block and the second flow block. The first current-passing block is welded to the circuit board at both ends of the first welding surface to form a first current-passing channel; the second current-passing block is connected to the circuit board through the two bosses to form a second current-passing channel.

2. The flow module according to claim 1, characterized in that, It also includes an insulating outer layer, which wraps around the outer periphery of the first flow block and the second flow block. The insulating outer layer includes functional surfaces and non-functional surfaces, and the first welding surface and the second welding surface are located on the functional surfaces.

3. The flow module according to claim 2, characterized in that, The non-functional surface is provided with a metal plating layer, and the functional surface is provided with at least one grounding part, which is electrically connected to the metal plating layer.

4. The flow-through module according to claim 3, characterized in that, The metal coating includes a first metal layer and a second metal layer, wherein the first metal layer and the second metal layer are copper and stainless steel, respectively.

5. The flow-through module according to claim 2, characterized in that, The non-functional surface is provided with at least one signal channel, and the functional surface is provided with a first signal connection surface and a second signal connection surface, which are electrically connected to the two ends of the signal channel, respectively.

6. A method for preparing the flow module as described in claim 1, characterized in that, Includes the following steps: The first and second current-passing blocks are made of conductive metal; The first and second flow blocks are bonded together using insulating components to obtain the flow body. Adhesive tape is applied to the first and second welding surfaces of the flow-through body; Insulating materials are injection molded to form an insulating outer layer on the outer periphery of the flow-through body; Separate the release film from the injection-molded flow body; The injection-molded flow-through body is cut to obtain the flow-through module.

7. The method for preparing a flow module according to claim 6, characterized in that, After cutting the injection-molded flow-through body to obtain the flow-through module, the process also includes generating a metal plating layer on the non-functional surface of the flow-through module.

8. The method for preparing a flow module according to claim 7, characterized in that, It also includes the fabrication of a grounding part, which is in contact with the metal plating layer.

9. The method for preparing a flow module according to claim 7, characterized in that, It also includes ablating the metal coating to form a signal channel, and creating a first signal connection surface and a second signal connection surface that are connected to the signal channel.

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