Circuit board and switch

Abstract

The invention discloses a circuit board and a switch, and belongs to the technical field of switches. The circuit board comprises at least one first circuit board, the first circuit board is provided with a switching chip, at least one near-end connector is arranged in the circumferential direction of the switching chip, the distance between each near-end connector and the switching chip is smaller than a target distance threshold value, and each near-end connector is connected with the switching chip; each second circuit board is provided with at least one optical module interface, and the near-end connector is connected with the at least one optical module interface through a fly wire cable. When the switch needs to support different forms of optical module interfaces, only the second circuit board needs to be replaced, so that the flexibility and convenience of operation are improved, the design cost and the processing cost of a switch chip board card are reduced, the flexibility of replacement is improved, and the maintainability of the whole machine is improved; the routing length of the PCIe on the circuit board is shortened, and the routing complexity of the PCIe on the circuit board is reduced.

Description

Technical Field

[0001] This application relates to the technical field of switches, and particularly to a circuit board and a switch. Background Art

[0002] A switch is a network device for forwarding electrical (optical) signals, which can provide an exclusive electrical (optical) signal path for any two nodes accessing the switch. Common switches include Ethernet switches, telephone voice switches, fiber optic switches, etc. The switch can provide various external interfaces, such as optical module interfaces, service network ports, management network ports, and debugging serial ports. In related technologies, when a user wants to expand various different forms of optical module interfaces, multiple switching chip boards need to be designed to respectively carry different forms of optical module interfaces, and most of the circuits of the switching chips are reused multiple times, only a small part of the circuits of different forms of optical module interfaces are modified, which increases the design cost and processing cost of the board. Moreover, in order to match different forms of optical module interfaces, the whole machine needs to replace different switching chip boards, resulting in waste of the switching chip boards, poor flexibility in replacement, and low maintainability of the whole machine. Summary of the Invention

[0003] This application aims to solve at least one of the technical problems existing in the related technologies. For this purpose, this application provides a circuit board and a switch. When different forms of optical module interfaces need to be supported, only the second circuit board needs to be replaced, which improves the flexibility and convenience of operation, reduces the design cost and processing cost of the switching chip board, improves the flexibility of replacement, and improves the maintainability of the whole machine; shortens the routing length of PCIe on the circuit board and reduces the complexity of PCIe routing on the circuit board.

[0004] In a first aspect, this application provides a circuit board, including: At least one first circuit board, the first circuit board is configured with a switching chip, and at least one proximal connector is arranged along the circumferential direction of the switching chip. The distance between each proximal connector and the switching chip is less than a target distance threshold, and each proximal connector is connected to the switching chip; A plurality of second circuit boards, each second circuit board is configured with at least one optical module interface, and the proximal connector is connected to at least one of the optical module interfaces through a flying wire cable.

[0005] According to the circuit board provided by the embodiments of the present application, by designing the switching chip on a first circuit board and designing the optical module interface on another second circuit board, the switching chip only needs to be designed once without repeated design, which can reduce the R & D cost. When different forms of optical module interfaces need to be supported, only the second circuit board needs to be replaced, which improves the flexibility and convenience of operation. Moreover, there is no need to replace the entire machine with different switching chip boards, which reduces the design cost and processing cost of the switching chip board, improves the flexibility of replacement, and improves the maintainability of the whole machine. And proximal connectors are closely arranged circumferentially around the switching chip for accessing the optical module interface through jumper cables, effectively reducing the loss of PCIe high-speed signals, extending the transmission distance of PCIe signals, and improving the anti-interference ability of the overall system; shortening the routing length of PCIe on the circuit board, reducing the complexity of PCIe routing on the circuit board, reducing the number of board layers of the board, and reducing the requirements for the circuit board material, thereby reducing the design cost and processing cost of the switching chip board.

[0006] For the circuit board of an embodiment of the present application, the switching chip is configured with at least one interconnect channel, and the interconnect channel is connected to the proximal connector through a connection cable; the at least one proximal connector is arranged in one-to-one correspondence with the at least one interconnect channel.

[0007] For the circuit board of an embodiment of the present application, the lengths of the connection cables between each of the interconnect channels and the proximal connector are substantially the same.

[0008] For the circuit board of an embodiment of the present application, the lengths of each of the jumper cables are substantially the same.

[0009] For the circuit board of an embodiment of the present application, the first circuit board is configured with a programmable logic device, and the programmable logic device is respectively connected to the switching chip and each of the second circuit boards, and the programmable logic device is used to obtain the low-speed signals corresponding to each of the second circuit boards.

[0010] For the circuit board of an embodiment of the present application, the first circuit board is configured with a plurality of first low-speed signal connectors, and the first low-speed signal connectors are installed at the edge close to the second circuit board, and the programmable logic device is connected to each of the first low-speed signal connectors.

[0011] For the circuit board of an embodiment of the present application, the second circuit board is configured with second low-speed signal connectors, and the second low-speed signal connectors are installed at the edge close to the first circuit board, and each of the second low-speed signal connectors is arranged opposite to each of the first low-speed signal connectors, and each of the first low-speed signal connectors is connected to each of the second low-speed signal connectors through a cable.

[0012] The circuit board according to an embodiment of the present application, where the at least one optical module interface includes at least one of a double-density four-channel small form-factor pluggable optical module interface, a pluggable optical module interface, an eight-channel small form-factor pluggable optical module interface, and an extended-density eight-channel small form-factor pluggable optical module interface.

[0013] The circuit board according to an embodiment of the present application, when the at least one optical module interface includes the double-density four-channel small form-factor pluggable optical module interface, the number of the at least one first circuit board is two, and the two first circuit boards are stacked vertically.

[0014] The circuit board according to an embodiment of the present application, when the at least one optical module interface includes the double-density four-channel small form-factor pluggable optical module interface, the number of the plurality of second circuit boards is six, and every two second circuit boards are stacked vertically, and each second circuit board is configured with six double-density four-channel small form-factor pluggable optical module interfaces.

[0015] The circuit board according to an embodiment of the present application, when the at least one optical module interface includes the pluggable optical module interface, the number of the at least one first circuit board is two, and the two first circuit boards are stacked vertically.

[0016] The circuit board according to an embodiment of the present application, when the at least one optical module interface includes the pluggable optical module interface, the number of the plurality of second circuit boards is six, and every two second circuit boards are stacked vertically, and each second circuit board is configured with three pluggable optical module interfaces.

[0017] The circuit board according to an embodiment of the present application, when the at least one optical module interface includes the eight-channel small form-factor pluggable optical module interface, the number of the at least one first circuit board is one.

[0018] The circuit board according to an embodiment of the present application, when the at least one optical module interface includes the eight-channel small form-factor pluggable optical module interface, the number of the plurality of second circuit boards is three, and one side of each second circuit board is configured with three eight-channel small form-factor pluggable optical module interfaces, and the other side of each second circuit board is configured with three eight-channel small form-factor pluggable optical module interfaces.

[0019] The circuit board according to an embodiment of the present application, when the at least one optical module interface includes the extended-density eight-channel small form-factor pluggable optical module interface, the number of the at least one first circuit board is one.

[0020] For the circuit board according to an embodiment of the present application, when at least one of the optical module interfaces includes the extended-density eight-channel small form-factor pluggable (QSFP) optical module interface, the number of the plurality of second circuit boards is three, and each of the second circuit boards is configured with three extended-density eight-channel small form-factor pluggable optical module interfaces.

[0021] In a second aspect, the present application provides a switch, including: The circuit board as described in the first aspect; A heat dissipation device, where the heat dissipation device and the first circuit board are respectively disposed on two sides of the switching chip.

[0022] For the switch according to an embodiment of the present application, the first circuit board is configured with a plurality of proximal connectors, the plurality of proximal connectors are disposed around the switching chip, and the heat dissipation device has a notch for avoiding the proximal connectors.

[0023] For the switch according to an embodiment of the present application, the heat dissipation device includes a first part and a second part connected to each other. The first part covers the switching chip, the second part is mounted on the first circuit board, the orthographic projection of the second part does not cover the proximal connectors, and the second part is disposed at intervals along the circumferential direction of the switching chip. The notch is formed between the first part and the second part.

[0024] For the switch according to an embodiment of the present application, the first side, the second side, and the third side of the switching chip are all provided with the proximal connectors; the second part includes: A first sub-part, located on the fourth side of the switching chip and connected to the first part; A second sub-part, located outside the corners between the first side and the second side of the switching chip, and outside the corners between the second side and the third side of the switching chip, and the second sub-part is connected to the first part through a connection section, and the connection section passes through the gap between two adjacent proximal connectors.

[0025] One or more of the above technical solutions in the embodiments of the present application have at least one of the following technical effects: By designing the switching chip on a first circuit board, designing the optical module interface on another second circuit board, and setting the optical module interfaces to be respectively connected to the switching chip, the switching chip only needs to be designed once without repeated design, which can reduce the R & D cost. When different forms of optical module interfaces need to be supported, only the second circuit board needs to be replaced, which improves the operation flexibility and convenience, and there is no need to replace the entire machine with different switching chip boards, reducing the design cost and processing cost of the switching chip boards, improving the replacement flexibility, and improving the maintainability of the entire machine.

[0026] Furthermore, the optical module interface is designed separately on a circuit board. When different forms of optical module interfaces need to be supported, only the optical module interface board needs to be replaced, making the operation more flexible and convenient.

[0027] Furthermore, a notch is formed between the first part and the second part of the heat dissipation device to avoid the connector. On the basis of ensuring the heat dissipation effect of the switching chip, the heat dissipation device is prevented from interfering with the cable layout of the connector, improving the user experience.

[0028] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. Description of the Drawings

[0029] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, where: Figure 1 is a schematic system block diagram of the circuit board provided by an embodiment of the present application; Figure 2 is one of the schematic structural diagrams of the circuit board provided by an embodiment of the present application; Figure 3 is another schematic structural diagram of the circuit board provided by an embodiment of the present application; Figure 4 is the third schematic structural diagram of the circuit board provided by an embodiment of the present application; Figure 5 is the fourth schematic structural diagram of the circuit board provided by an embodiment of the present application; Figure 6 is the fifth schematic structural diagram of the circuit board provided by an embodiment of the present application; Figure 7 is the sixth schematic structural diagram of the circuit board provided by an embodiment of the present application; Figure 8 is the seventh schematic structural diagram of the circuit board provided by an embodiment of the present application; Figure 9 is the eighth schematic structural diagram of the circuit board provided by an embodiment of the present application; Figure 10 is the ninth schematic structural diagram of the circuit board provided by an embodiment of the present application; Figure 11 is the tenth schematic structural diagram of the circuit board provided by an embodiment of the present application; Figure 12 is the eleventh schematic structural diagram of the circuit board provided by an embodiment of the present application; Figure 13 is the twelfth schematic structural diagram of the circuit board provided by an embodiment of the present application; Figure 14It is the thirteenth schematic structural diagram of the circuit board provided by the embodiments of the present application; Figure 15 It is the schematic structural diagram of the switch provided by the embodiments of the present application.

[0030] Reference numerals: Circuit board 110; First circuit board 120; Switching chip 130; Second circuit board 140; Optical module interface 150; Proximal connector 260; Jumper cable 250; Complex Programmable Logic Device CPLD; Heat dissipation device 160; First part 170; Connection section 180; First sub-part 190; Second sub-part 200; Double-density four-channel small form-factor pluggable optical module interface 210; Pluggable optical module interface 220; Eight-channel small form-factor pluggable optical module interface 230; Extended-density eight-channel small form-factor pluggable optical module interface 240; First low-speed signal connector 270; Second low-speed signal connector 280. Detailed implementation manners

[0031] Next, the technical solutions in the embodiments of the present application will be clearly described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.

[0032] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. generally belong to the same category, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / ", generally represents an "or" relationship between the associated objects before and after.

[0033] 1. In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0034] 2. In the description of this application, the meaning of "a plurality of" is two or more.

[0035] The following will combine the accompanying drawings to detail the circuit board 110 provided by the embodiments of this application through specific embodiments and application scenarios.

[0036] As Figure 1 shown, the circuit board 110 includes: at least one first circuit board 120 and a plurality of second circuit boards 140.

[0037] In this embodiment, the circuit board 110 (Printed Circuit Board, PCB) is a support for electronic components and can be used as a carrier for the electrical interconnection of electronic components.

[0038] The number of at least one first circuit board 120 can be one or more, and the number of at least one first circuit board 120 can be determined based on the type and number of optical module interfaces to be connected.

[0039] Each first circuit board 120 is configured with a switching chip 130, and the switching chip 130 only needs to be designed once.

[0040] The switching chip 130 can be a PCIe Gen6 Switch chip (the sixth-generation PCIe switching chip), where "PCIe" is short for "Peripheral Component Interconnect Express", that is, the "High-Speed Serial Computer Expansion Bus Standard".

[0041] The PCIe Gen6 Switch chip can support a single-channel data transmission rate of 64 GT / s, and the PCIe Gen6 Switch chip supports multi-port and multi-form factor general motherboard designs.

[0042] The first circuit board 120 is configured with at least one proximal connector 260.

[0043] At least one proximal connector 260 can be arranged circumferentially around the switching chip 130.

[0044] The proximal connector 260 can be a connector close to the package of the switching chip 130.

[0045] The distance between each proximal connector 260 and the switching chip 130 is less than the target distance threshold, where the size of the target distance threshold can be user-defined and is not limited in this application.

[0046] Each proximal connector 260 is connected to the switching chip 130.

[0047] A plurality of second circuit boards 140 are used to carry optical module interfaces.

[0048] A plurality of optical module interfaces are used for multi-network node interconnection to implement the data exchange function of multi-network nodes.

[0049] Each second circuit board 140 may be configured with at least one optical module interface 150. The number of at least one optical module interface 150 may be one or more, and the number of optical module interfaces 150 can be configured based on requirements.

[0050] The proximal connector 260 can be connected to at least one optical module interface 150 through a fly wire cable 250 (Fly Pass Cable, FPC).

[0051] The at least one optical module interface 150 can be arranged based on the type of optical module interface 150 to be accessed. The number of optical module interfaces 150 connected by one proximal connector 260 can be determined based on the type of optical module interface 150.

[0052] The optical module interface 150 can be used as a connector to connect to the switching chip 130.

[0053] One end of the fly wire cable 250 is a connector close to the chip package (i.e., the proximal connector 260), and the other end is a connector of the optical module interface 150 (which can be the optical module interface 150).

[0054] The fly wire cable 250 supports the transmission rate of the PCIe Gen6 Switch chip, and the fly wire cable 250 supports high-speed signal transmission.

[0055] In this application, the proximal connector 260 is directly connected to the optical module interface 150 through a group of fly wire cables 250 that support the PCIe Gen6 rate. There will no longer be PCIe trace design on the optical module interface board (the second circuit board 140). The PCIe high-speed signal can be transmitted through the fly wire cable 250, effectively reducing the loss of the PCIe high-speed signal, extending the transmission distance of the PCIe signal, and improving the anti-interference ability of the overall system; shortening the trace length of PCIe on the circuit board 110, reducing the complexity of PCIe traces on the circuit board 110, reducing the number of board layers of the board card, and reducing the board material requirements of the circuit board 110, thereby reducing the design cost and processing cost of the switching chip 130 board card.

[0056] When multiple optical module interfaces 150 are configured on the second circuit board 140, the arrangement method of the multiple optical module interfaces 150 can be customized based on the chassis size of the circuit board 110 and user requirements, and this application does not make a limitation.

[0057] Such as Figure 1As shown, the optical module interface can be designed on the second circuit board 140, and the optical module interface board can be divided into three circuit boards. That is, the number of multiple second circuit boards 140 can be three, or it can also be other numbers, which is not limited in this application.

[0058] In this application, the optical module interface is designed separately on a circuit board. When different forms of optical module interfaces need to be supported, only the optical module interface board needs to be replaced, and the operation is more flexible and convenient.

[0059] The optical module interface board is divided into multiple second circuit boards 140. In the case of a failure of an interface on a certain interface board, the faulty second circuit board 140 can be directly replaced, and the maintainability is higher.

[0060] In some embodiments, the layout and wiring of other PCIe high-speed lines such as the CPU (Central Processing Unit) and GPU (Graphics Processing Unit) in the server can also use the combination of the proximal connector 260 and the flying wire cable 250, thereby reducing the design difficulty and development cost.

[0061] According to the circuit board 110 provided by the embodiments of the present application, by designing the switching chip 130 on a first circuit board 120 and designing the optical module interface 150 on another second circuit board 140, the switching chip 130 only needs to be designed once without repeated design, which can reduce the R & D cost. When different forms of optical module interfaces need to be supported, only the second circuit board 140 needs to be replaced, improving the flexibility and convenience of the operation. Moreover, there is no need to replace the entire machine with different switching chip 130 boards, reducing the design cost and processing cost of the switching chip 130 board, improving the flexibility of replacement, and improving the maintainability of the whole machine. And the proximal connector 260 is closely arranged around the switching chip 130 for accessing the optical module interface 150 through the flying wire cable 250, effectively reducing the loss of PCIe high-speed signals, extending the transmission distance of PCIe signals, and improving the anti-interference ability of the overall system; shortening the routing length of PCIe on the circuit board 110, reducing the complexity of PCIe routing on the circuit board 110, reducing the number of board layers of the board, and reducing the board material requirements of the circuit board 110, thereby reducing the design cost and processing cost of the switching chip 130 board.

[0062] Continue to refer to Figure 1 , in some embodiments, the switching chip 130 is configured with at least one interconnect channel.

[0063] In this embodiment, the switching chip 130 can support one or more groups of interconnect channels, such as Figure 1As shown, the switching chip 130 can support 9 groups of x16 PCIe Lanes. Among them, each interconnect channel (x16 PCIe Lanes) can have 16 data channels (Lanes), and each channel can include a pair of differential signal lines, which can be used for bidirectional full-duplex transmission.

[0064] The interconnect channels can be connected to the proximal connector 260 through a connection cable. For example, after each group of x16 PCIe Lanes is led out from the switching chip 130, it can be connected to the proximal connector 260.

[0065] Each interconnect channel can be connected to the optical module interface 150 through the proximal connector 260.

[0066] Such as Figure 1 As shown, the switching chip 130 can include pins 0 to 8, and each pin can be connected to a proximal connector 260.

[0067] In this application, after the x16 interconnect channels are led out from the switching chip 130, they are immediately connected to the proximal connector 260, which is beneficial to shortening the routing length of PCIe on the first circuit board 120, reducing the PCIe routing complexity on the board, thereby reducing the number of PCB layers of the board, reducing the requirements for the PCB material, and reducing the design cost and processing cost of the switching chip 130 board.

[0068] Connecting a group of x16 PCIe Lanes to one proximal connector 260 only requires 9 proximal connectors 260 to be arranged around the switching chip 130. The overall design meets the requirements of PCIe for wire out, and at the same time, it can ensure that the layout of the switching chip 130 and the proximal connector 260 is very compact, which is beneficial to controlling the routing length of PCIe on the PCB to the shortest extent. The layout of the Switch board is relatively simple, the number of cables between the Switch board and the optical module interface board is small, the cable management is relatively simple, and it will not affect the air blowing channel of the fan and the heat dissipation design.

[0069] In some embodiments, the lengths of the connection cables between each interconnect channel and the proximal connector 260 are substantially the same.

[0070] In this embodiment, the lengths of the connection cables between each interconnect channel and the proximal connector 260 can be the same or substantially the same. For example, the difference between the lengths of the connection cables between each interconnect channel and the proximal connector 260 can be less than the first length threshold, where the value of the first length threshold can be user-defined and is not limited in this application.

[0071] In some embodiments, the lengths of the jumper cables 250 are substantially the same.

[0072] In this embodiment, the lengths of the jumper cables 250 can be the same or substantially the same. For example, the difference between the lengths of the jumper cables 250 can be less than a second length threshold, where the value of the second length threshold can be user-defined and is not limited in this application.

[0073] Using the jumper cables 250 to interconnect the proximal connectors 260 and the optical module interfaces 150 can ensure that the PCIe trace lengths between the switching chip 130 and the proximal connectors 260 are substantially the same, and ensure that the lengths of the jumper cables 250 are substantially the same, thus ensuring that the PCIe trace lengths from all the optical module interfaces on the circuit board 110 to the switching chip 130 are substantially the same, thereby ensuring that the delay time of each signal path is substantially the same, reducing the routing difficulty of the board and reducing the design cost.

[0074] As Figure 1 shown, in some embodiments, the first circuit board 120 can be configured with a Complex Programmable Logic Device (CPLD).

[0075] In this embodiment, the Complex Programmable Logic Device (CPLD) can be connected to the switching chip 130 and each second circuit board 140 respectively.

[0076] The Complex Programmable Logic Device (CPLD) can be used to obtain the low-speed signals corresponding to each second circuit board 140 (i.e., the optical module interface board).

[0077] The low-speed signals can include a reset signal, an interrupt signal, an I2C (Inter-Integrated Circuit, serial communication protocol) signal, a low-power control signal, and an optical module interface type ID signal. The low-speed signals can implement functions such as type identification, reset control, and status detection of the optical module interface 150.

[0078] Different forms of optical modules require different low-speed signals, and a compatible design can be carried out to be compatible with the low-speed signals of multiple optical modules.

[0079] The Complex Programmable Logic Device (CPLD) can also be responsible for controlling the power-on or power-off timing of the switching chip 130, the reset signal, and the hot-swap control logic of the optical module interface. The CPLD can also provide common external indication interfaces, such as the LED status indicator and the ERROR alarm indicator for each optical module interface 150, etc.

[0080] In some embodiments, the first circuit board 120 is configured with a plurality of first low-speed signal connectors 270.

[0081] In this embodiment, a plurality of first low-speed signal connectors 270 can be installed near the edge of the second circuit board 140.

[0082] The programmable logic device CPLD can be connected to each first low-speed signal connector 270.

[0083] In some embodiments, the second circuit board 140 is configured with second low-speed signal connectors 280.

[0084] In this embodiment, each second low-speed signal connector 280 is installed near the edge of the first circuit board 120.

[0085] Each second low-speed signal connector 280 is disposed opposite to each first low-speed signal connector 270.

[0086] Each first low-speed signal connector 270 is connected to each second low-speed signal connector 280 through a cable.

[0087] As Figure 1 shown, the programmable logic device CPLD can be connected to each first low-speed signal connector 270 through the internal traces of the first circuit board 120, and the first low-speed signal connector 270 can be connected to the second low-speed signal connector 280 on the second circuit board 140 through a cable.

[0088] In the present application, by setting the programmable logic device CPLD to access the second low-speed signal connector 280 using ordinary cables to obtain the low-speed signals of each second circuit board 140 (optical module interface board), the hardware complexity is reduced and the development cost is lowered.

[0089] In some embodiments, at least one optical module interface 150 includes at least one of a double-density four-channel small form-factor pluggable optical module interface 210, a pluggable optical module interface 220, an eight-channel small form-factor pluggable optical module interface 230, and an extended-density eight-channel small form-factor pluggable optical module interface 240.

[0090] In this embodiment, in the double-density four-channel small form-factor pluggable optical module interface 210 (Quad Small FormFactor Pluggable-Double Density, QSFP-DD), the rate of each channel is up to 25 Gb / s or 50 Gb / s.

[0091] The pluggable optical module interface 220 (400Gigabits Form-factor Pluggable, CDFP) has 16 channels, a maximum data rate of 28 Gbps, and a total bandwidth of 400 Gbps.

[0092] The octal small form-factor pluggable optical module interface 230 (Octal Small Form-factor Pluggable, OSFP) can reach a rate of 25 Gb / s or 50 Gb / s per channel and supports 100G or 200G transmission.

[0093] The octal small form-factor pluggable optical module interface 240 with extended density (Octal Small Form-factor Pluggable-eXtended Density, OSFP-XD) supports a data rate of 212.5 Gb / s per channel through single-mode optical fiber. Through 8 independent channels in parallel transmission, its total bandwidth reaches 1.6 Tb / s (8×212.5 Gb / s).

[0094] Such as Figure 2 Illustrated is an FPC cable supporting two QSFP-DD interfaces, which is an FPC cable that interconnects the proximal connector 260 with two optical module interfaces in the form of QSFP-DD. The proximal connector 260 supports a group of x16 PCIe Lanes, and one optical module interface in the form of QSFP-DD supports x8 PCIe Lanes. Two optical module interfaces in the form of QSFP-DD can be set.

[0095] In some embodiments, when at least one optical module interface 150 includes the quad small form-factor pluggable optical module interface 210 with double density (QSFP-DD), the number of at least one first circuit board 120 is two.

[0096] In some embodiments, when at least one optical module interface 150 includes the quad small form-factor pluggable optical module interface 210 with double density, the number of multiple second circuit boards 140 is six, and every two second circuit boards 140 are stacked vertically. Each second circuit board 140 is configured with six quad small form-factor pluggable optical module interfaces 210 with double density.

[0097] In this embodiment, the chassis height of the circuit board 110 is 1U, approximately 44.45 mm, the width of the chassis is 19 inches, approximately 482.6 mm, the height of the optical module interface in the form of QSFP-DD is 12.45 mm, and the width is 20.55 mm. The front window of the whole machine can layout at most two layers of optical module interfaces in the form of QSFP-DD, and at most 18 optical module interfaces in the form of QSFP-DD can be layout in each layer. Six optical module interfaces in the form of QSFP-DD can be layout on each second circuit board 140.

[0098] Two first circuit boards 120 can be placed inside the circuit board 110, and a switching chip 130 is set on each first circuit board 120. The two first circuit boards 120 can be layout stacked vertically.

[0099] As shown Figure 3 in Figure 2 , six second circuit boards 140 can be placed inside the circuit board 110, with every two second circuit boards 140 stacked on top of each other. Six QSFP-DD form optical module interfaces can be placed on each second circuit board 140. Among them, every two QSFP-DD form optical module interfaces are placed in the manner shown Figure 2 .

[0100] Continuing to refer to Figure 3 , the whole machine can provide 36 QSFP-DD form optical module interfaces. The number of interfaces of the circuit board 110 has been maximized, so that the data exchange function of 36 nodes can be realized. Figure 3 .

[0101] As shown Figure 4 , the switching chip 130 can be placed in the center of the first circuit board 120. Three proximal connectors 260 can be placed close to the left side, right side, and upper side of the switching chip 130 respectively, that is, a total of 9 proximal connectors 260 can be set around the switching chip 130. Each proximal connector 260 leads out a group of x16 PCIe Lanes, and two QSFP-DD form optical module interfaces can be connected through the FPC cable shown Figure 2 Figure 2 .

[0102] During the actual execution process, the cable interconnection can be carried out with reference to the connection method shown Figure 4 , so as to keep the normalization of the FPC cable length and ensure the consistent delay of the PCIe signals on different optical module interfaces. Figure 4

[0103] Figure 5 Illustrates an FPC cable supporting a pluggable optical module interface 220 (CDFP), which is an FPC cable that interconnects the proximal connector 260 and a CDFP form optical module interface. The proximal connector 260 supports a group of x16 PCIe Lanes, and a CDFP form optical module interface can support x16 PCIe Lanes. One CDFP form optical module interface can be set.

[0104] In some embodiments, when at least one optical module interface 150 includes a pluggable optical module interface 220, the number of at least one first circuit board 120 is two, and the two first circuit boards 120 are stacked vertically on top of each other.

[0105] In some embodiments, when at least one optical module interface 150 includes a pluggable optical module interface 220, the number of multiple second circuit boards 140 is six, and every two second circuit boards 140 are stacked vertically on top of each other. Each second circuit board 140 is configured with three pluggable optical module interfaces 220.

[0106] In this embodiment, the height of the optical module interface in the form of CDFP is 12.45 mm, and the width is 36.74 mm. At most two layers of optical module interfaces in the form of CDFP can be arranged on the front window of the whole machine. At most 9 optical module interfaces in the form of CDFP can be arranged on each layer, and 3 optical module interfaces in the form of CDFP can be arranged on each interface board.

[0107] Two first circuit boards 120 can be placed inside the circuit board 110. A switching chip 130 is arranged on each first circuit board 120, and the two first circuit boards 120 can be arranged in a stacked manner, one on top of the other.

[0108] As Figure 6 shown, 6 second circuit boards 140 can be placed inside the circuit board 110. Every two second circuit boards 140 are stacked. 3 optical module interfaces in the form of CDFP can be placed on each second circuit board 140. The whole machine can provide 18 optical module interfaces in the form of CDFP. The number of interfaces of the circuit board 110 has been maximized, so that the data exchange function of 18 nodes can be realized.

[0109] As Figure 7 shown, each proximal connector 260 can lead out a group of x16 PCIe Lanes and is connected to an optical module interface in the form of CDFP through the Figure 5 FPC cable shown.

[0110] As Figure 8 illustrated, the FPC cable supports two eight-channel small form-factor pluggable optical module interfaces 230 (OSFP). It is an FPC cable that interconnects the proximal connector 260 and two optical module interfaces in the form of OSFP. The proximal connector 260 supports a group of x16 PCIe Lanes, and one optical module interface in the form of OSFP supports x8 PCIe Lanes. Two optical module interfaces in the form of OSFP can be set.

[0111] In some embodiments, when at least one optical module interface 150 includes an eight-channel small form-factor pluggable optical module interface 230, the number of at least one first circuit board 120 is one.

[0112] In some embodiments, when at least one optical module interface 150 includes an eight-channel small form-factor pluggable optical module interface 230, the number of multiple second circuit boards 140 is three. Three eight-channel small form-factor pluggable optical module interfaces 230 are configured on one side of each second circuit board 140, and three eight-channel small form-factor pluggable optical module interfaces 230 are configured on the other side of each second circuit board 140.

[0113] In this embodiment, the height of the optical module interface in the OSFP form is 14.65 mm, the width is 24.08 mm, and at most two layers of optical module interfaces in the OSFP form can be arranged in the front window of the whole machine. At most 9 optical module interfaces in the OSFP form can be arranged in each layer, and 6 optical module interfaces in the OSFP form can be arranged on each interface board.

[0114] A first circuit board 120 can be placed inside the circuit board 110, and a switching chip 130 is arranged on the first circuit board 120.

[0115] As Figure 9 shown, 3 second circuit boards 140 can be placed inside the circuit board 110. Each second circuit board 140 can correspondingly hold 6 optical module interfaces in the OSFP form. As Figure 10 shown, two optical module interfaces in the OSFP form can be installed on a PCB in a back-to-back manner, top and bottom. For example, 3 optical module interfaces in the OSFP form can be placed on one side of the second circuit board 140, and 3 optical module interfaces in the OSFP form can be placed on the other side of the second circuit board 140. The whole machine can provide 18 optical module interfaces in the OSFP form, and the number of interfaces on the circuit board 110 has been maximized, so that the data exchange function of 18 nodes can be realized.

[0116] As Figure 11 shown, each proximal connector 260 leads out a group of x16 PCIe Lanes, and two optical module interfaces in the OSFP form can be connected through the Figure 8 shown FPC cable.

[0117] In this application, by using the back-to-back manner, top and bottom, to install two optical module interfaces in the OSFP form on a second circuit board 140, the thickness of one layer of PCB can be reduced, ensuring that two layers of optical module interfaces in the OSFP form can be arranged in the front window of the circuit board 110.

[0118] As Figure 12 illustrates an FPC cable for an eight-channel small form-factor pluggable optical module interface 240 (OSFP-XD) that supports extended density. It is an FPC cable that interconnects the proximal connector 260 and an optical module interface in the OSFP-XD form. The proximal connector 260 supports a group of x16 PCIe Lanes, and an optical module interface in the OSFP-XD form supports x16 PCIe Lanes. One optical module interface in the OSFP-XD form can be set.

[0119] In some embodiments, when at least one optical module interface 150 includes an eight-channel small form-factor pluggable optical module interface 240 with extended density, the number of at least one first circuit board 120 is one.

[0120] In some embodiments, when at least one optical module interface 150 includes an extended-density eight-channel small form-factor pluggable (OSFP-XD) optical module interface 240, the number of the plurality of second circuit boards 140 is three, and the second circuit boards 140 are configured with three extended-density eight-channel small form-factor pluggable optical module interfaces 240.

[0121] In this embodiment, the height of the optical module interface in the form of OSFP-XD is 16.65 mm, and the width is 23.98 mm. Only one layer of optical module interfaces in the form of OSFP-XD can be arranged on the front window of the whole machine. At most 9 optical module interfaces in the form of OSFP-XD can be arranged in this layer, and 3 optical module interfaces in the form of OSFP-XD are arranged on each interface board.

[0122] A first circuit board 120 can be placed inside the circuit board 110, and a switching chip 130 is arranged on each first circuit board 120.

[0123] As Figure 13 shown, 3 second circuit boards 140 can be placed inside the circuit board 110, and 3 optical module interfaces in the form of OSFP-XD can be arranged on each second circuit board 140. The whole machine can provide 9 optical module interfaces in the form of OSFP-XD, and the number of interfaces of the circuit board 110 has been maximized, so that the data exchange function of 9 nodes can be realized.

[0124] As Figure 14 shown, each proximal connector 260 leads out a group of x16 PCIe Lanes, and can be connected to an optical module interface in the form of OSFP-XD through the Figure 12 shown FPC cable.

[0125] As Figure 2 、 Figure 5 、 Figure 8 and Figure 12 shown, the terminals of the proximal connector 260 can be fixed, that is, the same proximal connector 260 can be connected to different optical module interfaces 150 through different jumper cables 250. When it is necessary to expand different optical module interfaces 150, only the interface board corresponding to the optical module interface 150 needs to be replaced.

[0126] It should be noted that the circuit board 110 provided in the embodiments of the present application can support but is not limited to four different forms of optical module interfaces, namely QSFP-DD, CDFP, OSFP, and OSFP-XD. When it is necessary to support more forms of optical module interfaces, only a new interface board needs to be developed separately and the existing Switch board can be directly reused, and then a new circuit board 110 can be developed to meet the market demand.

[0127] As shown Figure 1 In some embodiments, the first circuit board 120 may include a control board connector.

[0128] In this embodiment, the control board connector may be connected to the switching chip 130 through a first interface and a second interface.

[0129] Among them, the first interface may include an I2C interface (Inter-Integrated Circuit) or an RST interface (Reset), etc. The I2C interface can implement functions such as data reading, writing, and configuration; The control signal corresponding to the RST interface can be used to restore the switching chip 130 or a specific module to the initial state, so as to restart working or solve faults.

[0130] The second interface may include a UART interface (Universal Asynchronous Receiver / Transmitter), an SDB interface (B-port 485 data transmission), an INT interface (Interrupt), a GPIO interface (General-Purpose Input / Output), etc.

[0131] The UART interface can be used to communicate with external devices to achieve data transmission and reception; the interrupt signal corresponding to the INT interface can be used to notify the processor that an event has occurred and needs to be processed immediately; the GPIO interface can be used to achieve simple interaction with external devices, such as controlling the on / off of an LED indicator and reading the status of a button, etc.

[0132] The embodiment of the present application also provides a switch.

[0133] The switch includes: a circuit board 110 and a heat dissipation device 160.

[0134] In this embodiment, the circuit board 110 is the circuit board 110 described in any of the above embodiments.

[0135] As shown Figure 15 The heat dissipation device 160 and the first circuit board 120 may be respectively disposed on both sides of the switching chip 130, that is, the switching chip 130 may be placed on the first circuit board 120, and then the heat dissipation device 160 may be disposed above the switching chip 130.

[0136] In some embodiments, the heat dissipation device 160 may be a heat sink.

[0137] In this embodiment, the coverage area of the heat sink may be larger than the area of the switching chip 130.

[0138] In some embodiments, the first circuit board 120 may be configured with a plurality of proximal connectors 260.

[0139] In this embodiment, the plurality of proximal connectors 260 may be disposed around the switching chip 130.

[0140] The heat dissipation device 160 has a notch for avoiding the connector.

[0141] In some embodiments, the heat dissipation device 160 may include a connected first portion 170 and a second portion.

[0142] In this embodiment, the first portion 170 may cover the switching chip 130.

[0143] The second portion may be mounted on the first circuit board 120. The orthographic projection of the second portion does not cover the proximal connector 260, and the second portion is disposed at intervals along the circumferential direction of the switching chip 130. The notch of the heat dissipation device 160 is formed between the first portion 170 and the second portion.

[0144] In some embodiments, proximal connectors 260 are provided on the first side, the second side, and the third side of the switching chip 130; the second portion may include: a first sub-portion 190 and a second sub-portion 200.

[0145] In this embodiment, the first sub-portion 190 is located on the fourth side of the switching chip 130 and is connected to the first portion 170.

[0146] The second sub-portion 200 is located outside the corner between the first side and the second side of the switching chip 130, and outside the corner between the second side and the third side of the switching chip 130. The second sub-portion 200 is connected to the first portion 170 through a connecting section 180, and the connecting section 180 passes through the gap between two adjacent proximal connectors 260.

[0147] In some embodiments, copper tubes are arranged inside the heat dissipation device 160.

[0148] In this embodiment, copper tubes may be used inside the heat dissipation device 160 to spread the heat to the first sub-portion 190 and the second sub-portion 200 of the heat dissipation device 160, thereby increasing the heat dissipation area and improving the heat dissipation effect.

[0149] In some embodiments, the heat dissipation device 160 includes a plurality of spaced-apart heat dissipation fins.

[0150] In this embodiment, the distance between two adjacent heat dissipation fins may be 1.5 mm, or it may be other values, which can be customized based on user requirements and are not limited in this application.

[0151] The thickness of each heat dissipation fin can be 1.0 mm, or it can also be other values, which can be customized based on user requirements and are not limited in this application.

[0152] For example, when the thickness of the heat dissipation fin is 1.0 mm and the distance between two adjacent heat dissipation fins is 1.5 mm, compared with traditional heat sinks (including heat dissipation fins with a thickness of 1.2 mm and a distance of 2.0 mm), the number of heat dissipation fins can be increased by 28% in the same area, thus further improving the heat dissipation effect.

[0153] In this application, by forming a notch between the first part 170 and the second part of the heat dissipation device 160 to avoid the proximal connector 260, while ensuring the heat dissipation effect of the switching chip 130, it avoids the interference of the heat dissipation device 160 with the cable layout of the proximal connector 260 and improves the user experience.

[0154] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art can understand and implement it without creative efforts.

[0155] Through the description of the above embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus a necessary general hardware platform, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence, or the part that contributes to the related technologies, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0156] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of each embodiment of this application.

Claims

1. A circuit board, characterized in that, Including: At least one first circuit board, the first circuit board is configured with a switching chip, at least one proximal connector is arranged circumferentially along the switching chip, the distance between each proximal connector and the switching chip is less than a target distance threshold, and each proximal connector is connected to the switching chip; A plurality of second circuit boards, each second circuit board is configured with at least one optical module interface, and the proximal connector is connected to at least one of the optical module interfaces through a flying wire cable.

2. The circuit board according to claim 1, wherein The switching chip is configured with at least one interconnect channel, and the interconnect channel is connected to the proximal connector through a connection cable; the at least one proximal connector and the at least one interconnect channel are arranged in one-to-one correspondence.

3. The circuit board according to claim 2, wherein The lengths of the connection cables between each interconnect channel and the proximal connector are substantially the same.

4. The circuit board according to any one of claims 1-3, characterized in that, The lengths of each flying wire cable are substantially the same.

5. The circuit board according to any one of claims 1-3, characterized in that, The first circuit board is configured with a programmable logic device, the programmable logic device is respectively connected to the switching chip and each second circuit board, and the programmable logic device is used to obtain low-speed signals corresponding to each second circuit board.

6. The circuit board according to claim 5, characterized in that, The first circuit board is configured with a plurality of first low-speed signal connectors, the first low-speed signal connectors are installed at the edge close to the second circuit board, and the programmable logic device is connected to each first low-speed signal connector.

7. The circuit board according to claim 6, characterized in that, The second circuit board is configured with a second low-speed signal connector, the second low-speed signal connectors are installed at the edge close to the first circuit board, each second low-speed signal connector is arranged opposite to each first low-speed signal connector, and each first low-speed signal connector is connected to each second low-speed signal connector through a cable.

8. The circuit board according to any one of claims 1 to 3, characterized in that The at least one optical module interface includes at least one of a double-density four-channel small form-factor pluggable optical module interface, a pluggable optical module interface, an eight-channel small form-factor pluggable optical module interface, and an extended-density eight-channel small form-factor pluggable optical module interface.

9. The circuit board according to claim 8, characterized in that, When the at least one optical module interface includes the double-density four-channel small form-factor pluggable optical module interface, the number of the at least one first circuit board is two, and the two first circuit boards are stacked up and down.

10. The circuit board according to claim 8, wherein, When the at least one optical module interface includes the double-density four-channel small form-factor pluggable optical module interface, the number of the plurality of second circuit boards is six, and every two second circuit boards are stacked up and down, and each second circuit board is configured with six double-density four-channel small form-factor pluggable optical module interfaces.

11. The circuit board according to claim 8, wherein, When the at least one optical module interface includes the pluggable optical module interface, the number of the at least one first circuit board is two, and the two first circuit boards are stacked up and down.

12. The circuit board according to claim 8, characterized in that, When the at least one optical module interface includes the pluggable optical module interface, the number of the plurality of second circuit boards is six, and every two second circuit boards are stacked up and down, and each second circuit board is configured with three pluggable optical module interfaces.

13. The circuit board according to claim 8, characterized in that, When the at least one optical module interface includes the eight-channel small form-factor pluggable optical module interface, the number of the at least one first circuit board is one.

14. The circuit board according to claim 8, wherein When the at least one optical module interface includes the eight-channel small form-factor pluggable (SFP+) optical module interface, the number of the plurality of second circuit boards is three, and three eight-channel small form-factor pluggable optical module interfaces are disposed on one side of each of the second circuit boards, and three eight-channel small form-factor pluggable optical module interfaces are disposed on the other side of each of the second circuit boards.

15. The circuit board according to claim 8, wherein When the at least one optical module interface includes the extended-density eight-channel small form-factor pluggable optical module interface, the number of the at least one first circuit board is one.

16. The circuit board according to claim 8, characterized in that, When the at least one optical module interface includes the extended-density eight-channel small form-factor pluggable optical module interface, the number of the plurality of second circuit boards is three, and each of the second circuit boards is provided with three extended-density eight-channel small form-factor pluggable optical module interfaces.

17. A switch, characterized in that, Comprising: A circuit board according to any one of claims 1-16; A heat dissipation device, wherein the heat dissipation device and the first circuit board are respectively disposed on two sides of the switching chip.

18. The switch according to claim 17, wherein The first circuit board is provided with a plurality of proximal connectors, the plurality of proximal connectors are disposed around the switching chip, and the heat dissipation device has a notch for avoiding the proximal connectors.

19. The switch according to claim 18, characterized in that, The heat dissipation device includes a first portion and a second portion connected to each other, the first portion covers the switching chip, the second portion is mounted on the first circuit board, a front projection of the second portion does not cover the proximal connectors, and the second portion is disposed at intervals along the circumferential direction of the switching chip, and the notch is formed between the first portion and the second portion.

20. The switch according to claim 19, characterized in that, Proximal connectors are disposed on the first side, the second side and the third side of the switching chip; the second portion includes: A first sub-portion, located on the fourth side of the switching chip and connected to the first portion; A second sub-portion, located outside the corners between the first side and the second side of the switching chip, and outside the corners between the second side and the third side of the switching chip, and the second sub-portion is connected to the first portion through a connection segment, and the connection segment passes through a gap between two adjacent proximal connectors.

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