Testing board card cooling device for chip testing machine

The test board cooling device addresses overheating issues by using a pivoting air distribution system to maintain optimal temperatures, reducing defects and improving chip testing efficiency.

CN120321918APending Publication Date: 2025-07-15GUANGDONG LEADYO IC TESTING CO LTD
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Patent Information

Application Number
CN202510489787.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-18
Publication Date
2025-07-15

AI Technical Summary

Technical Problem

During the chip test process, the chip test yield decreases due to high temperature and components aging, which affects the testing efficiency.

Method used

A test board cooling device for chip testing machines is designed. Through the cooperation of suspension parts and air outlet modules, the test board cooling is cooled by using the gas transmission device to provide cooling gas to ensure that it does not overheat for a long time.

Benefits of technology

Effectively reduce the temperature of the test board, reduce the low yield of chip tests, improve chip test efficiency, and extend component life.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a test board card cooling device for a chip test machine, which comprises an air outlet module and two suspension parts, two ends of the air outlet module are provided with a rotating groove and a transverse channel, each suspension part comprises a connecting rod and a connecting block, in a storage state, the first end of each connecting rod is inserted into the transverse channel, and the second end of each connecting rod is inserted into the transverse channel. The second end of the connecting rod is contained in the rotating groove and fixedly connected with the connecting blocks, the first end is pulled out of the transverse groove channel, the second end rotates around the first end to be switched into a hanging state, and the two connecting blocks are magnetically connected with the chip testing machine so that the multiple air outlets of the air outlet module can be arranged corresponding to the testing board cards on the shell. An air inlet in the bottom face of the air outlet module is connected with the air conveying device, and the air outlet module guides cooling air input through the air inlet to all the air outlets to be output through the air guide channel. The test board card cooling device for the chip testing machine can cool the test board card, the situation that the yield of chip testing is low can be reduced, and the test efficiency is improved. And the chip testing efficiency is improved.
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Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and particularly to a cooling device for a test board of a chip tester. Background Art

[0002] The chip tester is connected to the test board through a wire harness provided with a socket. The test board is installed at the bottom of the test area of the chip tester through a base. Since the test board is connected to the test area, the test board will also be heated during the process of high-temperature environment testing of the chip. During the test, if the temperature of the test board is too high, it will affect the test yield of the chip, resulting in an increase in the number of defective products in the tested chips. Moreover, the increase in the number of recycled tested chips will affect the test efficiency. In addition, the components of the test board are easily aged due to being in a high-temperature state for a long time, resulting in performance abnormalities, and it is necessary to frequently replace the components to maintain the performance of the test board, which also greatly affects the test efficiency. Summary of the Invention

[0003] The purpose of the present invention is to provide a cooling device for a test board of a chip tester, which can cool the test board, avoid it being in an overheated state for a long time due to high-temperature testing, and is beneficial to reducing the occurrence of low test yields of chips and improving the chip test efficiency.

[0004] To achieve the above purpose, the present invention discloses a cooling device for a test board of a chip tester, which includes:

[0005] An air outlet module and two suspension members,

[0006] Both ends of the air outlet module are provided with rotating grooves. The rotating grooves include a vertically opening and a horizontally opening that communicate with each other. The side wall of the rotating groove is provided with a horizontally extending groove. The suspension member includes a connecting rod and a connecting block. The connecting rod includes a first end and a second end. The second end is fixedly connected with the connecting block;

[0007] The first end is inserted into the horizontally extending groove. The second end is received in the rotating groove and corresponds to the horizontally opening, so that the connecting rod is in a received state. The second end passes out from the horizontally opening, and the first end is pulled out from the horizontally extending groove and placed in the rotating groove, so that the connecting rod switches to an intermediate state. The second end rotates around the first end to correspond to the vertically opening, so that the connecting rod switches to a suspended state;

[0008] The bottom surface and the top surface of the air outlet module are respectively provided with an air inlet and a plurality of air outlets. The air inlet is connected to the output end of the air delivery device. When the connecting rod is in a suspended state, the connecting blocks of the two suspension members are magnetically connected to the housing of the chip tester. The plurality of air outlets are correspondingly arranged with the test board on the housing. A gas guiding channel communicating with the air inlet and the air outlets is arranged in the air outlet module. The gas guiding channel is used to guide the cooling gas input through the air inlet to each air outlet for output.

[0009] Optionally, a guiding channel is provided on the side wall of the transverse channel. The guiding channel extends horizontally to the side wall of the rotating channel. A pivoting portion inserted into the guiding channel is provided at the first end. When the first end is inserted into or withdrawn from the transverse channel, the pivoting portion transversely moves along the guiding channel. When the second end rotates around the first end, the pivoting portion forms a rotating pivot shaft of the connecting rod.

[0010] Optionally, a first magnetic member is provided on the side wall of the rotating channel. When the connecting rod is switched to the suspended state, the first magnetic member is magnetically connected to the first end.

[0011] Optionally, second magnetic members are provided on both end faces of the air outlet module. When the connecting rod is switched to the storage state, the second magnetic members are magnetically connected to the connecting blocks.

[0012] Optionally, the connecting rod includes a rod body and at least one rod barrel. One end of the rod body is inserted into the rod barrel, and the other end forms the telescopic second end. The end of the rod barrel away from the rod body forms the first end.

[0013] Optionally, two rotating channels are arranged side by side along the longitudinal direction of the air outlet module, two connecting rods are arranged side by side along the longitudinal direction of the suspension member, and the two connecting rods are correspondingly connected to the two rotating channels.

[0014] Optionally, the air outlet module is further provided with a control valve and a quick connector. Two ends of the control valve are respectively connected to the air inlet and the quick connector. The end of the quick connector away from the control valve is connected to the quick connection air pipe of the air delivery device. The control valve is used to control the flow rate of the cooling gas output by the air delivery device through the quick connector into the air inlet.

[0015] Optionally, the cooling gas is compressed air.

[0016] The present invention is provided with two suspension members to fix the air outlet module to the housing of the chip tester for cooling the test board. Rotating grooves and transverse channels are provided at both ends of the air outlet module. The suspension member includes a connecting rod and a connecting block. When the connecting rod is in a stored state, the first end of the connecting rod is inserted into the transverse channel, and the second end of the connecting rod is stored in the rotating groove and fixedly connected to the connecting block. The first end is pulled out from the transverse channel, and the second end is rotated around the first end to switch the connecting rod to a suspended state. The connecting blocks of the two suspension members are magnetically connected to the housing of the chip tester, so that a plurality of air outlets on the top surface of the air outlet module are arranged corresponding to the test board on the housing. The air inlet on the bottom surface of the air outlet module is connected to an air delivery device. The air outlet module guides the cooling gas input through the air inlet to each air outlet through a gas guiding channel for output, so as to realize the cooling of the test board, thereby avoiding its overheated state due to long-term high-temperature testing, which is beneficial to reducing the occurrence of low yield in chip testing and improving the chip testing efficiency. Description of the Drawings

[0017] Figure 1 FIG. is a perspective structure diagram of a test board cooling device for a chip tester according to an embodiment of the present invention.

[0018] Figure 2 FIG. is an exploded structure diagram of a test board cooling device for a chip tester according to an embodiment of the present invention.

[0019] Figure 3 FIG. is a first sectional view of a test board cooling device for a chip tester according to an embodiment of the present invention.

[0020] Figure 4 FIG. is a second sectional view of a test board cooling device for a chip tester according to an embodiment of the present invention. Detailed Embodiment

[0021] To describe in detail the technical content, structural features, achieved objectives and effects of the present invention, the following is a detailed description in conjunction with the embodiments and with reference to the accompanying drawings.

[0022] Please refer to Figures 1 to 4 , the present invention discloses a test board cooling device for a chip tester, which includes:

[0023] An air outlet module 1 and two suspension members 2,

[0024] Rotating grooves 11 are provided at both ends of the air outlet module 1. The rotating grooves 11 include a vertically communicating opening 12 and a horizontally communicating opening 13. A horizontally extending transverse channel 14 is provided on the side wall of the rotating groove 11. The suspension member 2 includes a connecting rod 21 and a connecting block 22. The connecting rod 21 includes a first end 211 and a second end 212. The second end 212 is fixedly connected with a connecting block 22;

[0025] The first end 211 is inserted into the transverse groove 14, and the second end 212 is received in the rotation groove 11 and corresponds to the transverse opening 13, so that the connecting rod 21 is in a received state, the second end 212 passes through the transverse opening 13, the first end 211 is pulled out of the transverse groove 14 and placed in the rotation groove 11, so that the connecting rod 21 is switched to an intermediate state, and the second end 212 rotates around the first end 211 to correspond to the vertical opening 12, so that the connecting rod 21 is switched to a suspended state;

[0026] An air inlet 15 and a plurality of air outlets 16 are respectively provided on the bottom and top surfaces of the air outlet module 1. The air inlet 15 is connected to the output end of the gas delivery device. When the connecting rod 21 is in a suspended state, the connecting block 22 of the two suspension members 2 is magnetically connected to the shell of the chip tester. The plurality of air outlets 16 are arranged corresponding to the test boards on the shell. An air guide channel 17 connected to the air inlet 15 and the air outlet 16 respectively is provided in the air outlet module 1. The air guide channel 17 is used to guide the cooling gas input through the air inlet 15 to each air outlet 16 for output.

[0027] The present invention is provided with two suspension members 2 to fix the air outlet module 1 to the housing of the chip tester to cool the test board. The two ends of the air outlet module 1 are provided with a rotation groove 11 and a transverse groove 14. The suspension member 2 includes a connecting rod 21 and a connecting block 22. When the connecting rod 21 is in the storage state, the first end 211 of the connecting rod 21 is inserted into the transverse groove 14, and the second end 212 of the connecting rod 21 is received in the rotation groove 11 and fixedly connected to the connecting block 22. The first end 211 is pulled out from the transverse groove 14, and the second end 212 is rotated around the first end 211 to make the connecting rod 21 The rod 21 is switched to a hanging state, and the connecting block 22 of the two hanging parts 2 is magnetically connected to the shell of the chip tester, so that the multiple air outlets 16 on the top surface of the air outlet module 1 are arranged corresponding to the test board on the shell, and the air inlet 15 on the bottom surface of the air outlet module 1 is connected to the gas delivery device. The air outlet module 1 guides the cooling gas input through the air inlet 15 to each air outlet 16 for output through the air guide channel 17, so as to achieve cooling of the test board, thereby avoiding it from being in an overheated state for a long time due to high-temperature testing, which is beneficial to reducing the occurrence of low yield of chip testing and improving chip testing efficiency.

[0028] See also Figures 1 to 4 The side wall of the transverse groove 14 is provided with a guide groove 18, and the guide groove 18 extends laterally to the side wall of the rotating groove 11. The first end 211 is provided with a pivot portion 213 inserted into the guide groove 18. When the first end 211 is inserted into or pulled out of the transverse groove 14, the pivot portion 213 moves laterally along the guide groove 18. When the second end 212 rotates around the first end 211, the pivot portion 213 forms a rotating pivot axis of the connecting rod 21.

[0029] Specifically, in this embodiment, the transverse channels 14 provided at both ends of the air outlet module 1 communicate with each other to form a single channel, and the guiding channels 18 provided in the two transverse channels 14 also communicate with each other. However, this is not limited thereto. The side of the guiding channel 18 that communicates with the rotating channel 11 forms a rotating pivot hole. When the first end 211 is withdrawn from the transverse channel 14 and placed in the rotating channel 11, the pivoting portion 213 and the guiding channel 18 form a pivoting fit, achieving the effect of the second end 212 rotating around the first end 211, and the suspension member 2 switches from the intermediate state to the suspended state.

[0030] Refer to Figures 1 to 4 , a first magnetic member 101 is provided on the side wall of the rotating channel 11. When the connecting rod 21 switches to the suspended state, the first magnetic member 101 is magnetically connected to the first end 211, which is beneficial for keeping the connecting rod 21 upright and improving the stability of the magnetic adsorption of the connecting block 22 to the bottom of the testing machine platform.

[0031] Refer to Figures 1 to 4 , second magnetic members 102 are provided on both end faces of the air outlet module 1. When the connecting rod 21 switches to the storage state, the second magnetic members 102 are magnetically connected to the connecting block 22, which is beneficial for preventing the first end 211 and the second end 212 of the connecting rod 21 from sliding out of the transverse channel 14 and the rotating channel 11 in the storage state and maintaining the connection stability of the connecting rod 21 in the storage state.

[0032] Specifically, in this embodiment, the first magnetic member 101, the second magnetic member 102, and the connecting block 22 are magnets, which is convenient for the installation and disassembly of the cooling device. However, this is not limited thereto. When cooling is required, the connecting block 22 of the two suspension members 2 is separated from the second magnetic member 102, and then the two connecting rods 21 are withdrawn outward from the transverse channels 14 at both ends of the air outlet module 1. Then, the two connecting rods 21 are folded upward and magnetically adsorbed and fixed to the first magnetic member 101, so that the two connecting rods 21 are kept upright, and the two suspension members 2 switch to the suspended state. Then, the connecting block 22 is adsorbed to the bottom of the testing machine platform by magnetic attraction, so that the air outlet module 1 can be suspended below the testing board to be cooled at the bottom of the machine platform, and the multiple air outlets 16 of the air outlet module 1 are correspondingly arranged with the testing board.

[0033] Refer to Figures 1 to 4 , the connecting rod 21 includes a rod body 214 and at least one rod barrel 215. One end of the rod body 214 is inserted into the rod barrel 215, and the other end forms a telescopic second end 212. The end of the rod barrel 215 away from the rod body 214 forms a first end 211.

[0034] Specifically, in this embodiment, the rod body 214 and the rod barrel 215 cooperate to enable the connecting rod 21 to achieve the effect of a telescopic rod. By pulling out or inserting the rod body 214 from the rod barrel 215, the relative position between the rod body 214 and the rod barrel 215 is adjusted to change the distance between the air outlet module 1 and the test board, thereby changing the cooling distance and cooling effect of the air outlet module 1.

[0035] Refer to Figures 1 to 4 , two rotating grooves 11 are arranged side by side along the longitudinal direction on the air outlet module 1, two connecting rods 21 are arranged side by side along the longitudinal direction on the suspension member 2, and the two connecting rods 21 are correspondingly connected to the two rotating grooves 11, effectively improving the connection stability of the suspension member 2 and ensuring the flexibility of the suspension member 2 to switch between the suspended state and the stored state.

[0036] Specifically, in this embodiment, the air outlet module 1 includes an air outlet member 103 and two housing members 104. The two housing members 104 are respectively arranged on both sides of the air outlet member 103 along the longitudinal direction. The air inlet 15, multiple air outlets 16, and the air guide channel 17 are formed on the air outlet member 103, and the rotating groove 11 and the transverse channel 14 are formed on the housing member 104, but are not limited thereto.

[0037] Refer to Figures 1 to 4 , the air outlet module 1 is further provided with a control valve 105 and a quick connector 106. Both ends of the control valve 105 are respectively connected to the air inlet 15 and the quick connector 106. The end of the quick connector 106 away from the control valve 105 is connected to the quick connection air pipe of the gas transmission device. The control valve 105 is used to control the flow rate of the cooling gas output by the gas transmission device through the quick connector 106 into the air inlet 15.

[0038] Further, the cooling gas is compressed air.

[0039] Specifically, in this embodiment, the quick connector 106 is a 20PM quick connector, which is directly connected to the quick connection air pipe of the chip tester machine platform, so that the compressed air of the machine platform quick connection air pipe is connected to the air outlet module 1 through the air inlet 15, but is not limited thereto.

[0040] Specifically, in this embodiment, the control valve 105 is a throttle valve. The flow rate of the compressed air entering the air inlet 15 is adjusted through the control valve 105 to change the air output volume of the air outlet 16, but is not limited thereto.

[0041] Specifically, in this embodiment, the air outlet module 1 is in a cuboid shape, and multiple air outlets 16 are arranged at intervals along the transverse direction on the top surface of the air outlet module 1. When the suspension members 2 arranged at both ends thereof straddle the lower part of the test board, its cooling range can cover all the test boards, but is not limited thereto. After installing the cooling device at the bottom of the test machine platform, opening the control valve 105 can start cooling the test board.

[0042] The above-disclosed are only the preferred embodiments of the present invention, and of course, the scope of the rights of the present invention cannot be limited thereby. Therefore, equivalent changes made according to the scope of the patent application of the present invention still fall within the scope covered by the present invention.

Claims

1. A cooling device for a test board of a chip tester, characterized in that, Including: An air outlet module and two suspension members, Both ends of the air outlet module are provided with rotation grooves, the rotation grooves include a vertically opened portion and a horizontally opened portion that communicate with each other, the side wall of the rotation groove is provided with a horizontally extending channel, the suspension member includes a connecting rod and a connecting block, the connecting rod includes a first end and a second end, and the second end is fixedly connected with the connecting block; The first end is inserted into the horizontally extending channel, the second end is received in the rotation groove and corresponds to the horizontally opened portion, so that the connecting rod is in a received state, the second end passes out from the horizontally opened portion, the first end is pulled out from the horizontally extending channel and placed in the rotation groove, so that the connecting rod switches to an intermediate state, the second end rotates around the first end to correspond to the vertically opened portion, so that the connecting rod switches to a suspended state; An air inlet and a plurality of air outlets are respectively arranged on the bottom surface and the top surface of the air outlet module, the air inlet is connected with the output end of the gas transmission device, when the connecting rod is in the suspended state, the connecting blocks of the two suspension members are magnetically connected with the housing of the chip tester, and the plurality of air outlets are correspondingly arranged with the test board on the housing, and a gas guiding channel that communicates with the air inlet and the air outlets respectively is arranged in the air outlet module, and the gas guiding channel is used for guiding the cooling gas input through the air inlet to be output from each air outlet.

2. The test board cooling device for a chip tester according to claim 1, characterized in that A guiding channel is arranged on the side wall of the horizontally extending channel, the guiding channel extends horizontally to the side wall of the rotation groove, a pivoting portion inserted into the guiding channel is arranged at the first end, when the first end is inserted into or pulled out from the horizontally extending channel, the pivoting portion moves horizontally along the guiding channel, and when the second end rotates around the first end, the pivoting portion forms a rotation pivot axis of the connecting rod.

3. The test board cooling device for a chip tester according to claim 1, characterized in that, A first magnetic member is arranged on the side wall of the rotation groove, when the connecting rod switches to the suspended state, the first magnetic member is magnetically connected with the first end.

4. The test board cooling device for a chip tester according to claim 1, characterized in that Second magnetic members are arranged on both end faces of the air outlet module, when the connecting rod switches to the received state, the second magnetic members are magnetically connected with the connecting block.

5. The test board cooling device for a chip tester according to claim 1, characterized in that, The connecting rod includes a rod body and at least one rod barrel, one end of the rod body is inserted into the rod barrel, the other end forms the telescopic second end, and the end of the rod barrel away from the rod body forms the first end.

6. The test board cooling device for a chip tester according to any one of claims 1 to 5, characterized in that, Two rotation grooves are arranged side by side along the longitudinal direction of the air outlet module, two connecting rods are arranged side by side along the longitudinal direction of the suspension member, and the two connecting rods are correspondingly connected with the two rotation grooves.

7. The cooling device for the test board of the chip tester according to claim 1, characterized in that, The air outlet module is further provided with a control valve and a quick connector, both ends of the control valve are respectively connected with the air inlet and the quick connector, the end of the quick connector away from the control valve is connected with the quick connecting air pipe of the gas transmission device, and the control valve is used for controlling the flow rate of the cooling gas output by the gas transmission device through the quick connector and entering the air inlet.

8. The test board cooling device for a chip tester according to claim 1, characterized in that, The cooling gas is compressed air.