Immersion liquid cooling device, control method and system

Abstract

The present invention provides an immersion liquid cooling device, control method, and system, relating to the field of heat dissipation technology. Preset sensors are used to obtain the temperatures at the inlet and outlet of a chip-level evaporator and the maximum chip temperature in real time, and determine the corresponding relationship between the inlet and outlet temperature difference and a preset threshold value. If the outlet temperature difference is less than the preset threshold, the valve opening of the pipeline valve corresponding to the outlet temperature difference is controlled to decrease as the outlet temperature difference increases, and the valve opening is determined in real time. When the valve opening reaches a minimum and the outlet temperature is still less than the preset threshold, the target fan speed is determined according to a first preset formula based on the maximum chip temperature and the chip heat output. If the outlet temperature difference is equal to the preset threshold, the target fan speed is determined based on the maximum chip temperature and the chip heat output. The present invention solves the problem in the prior art of lacking an immersion liquid cooling device, control method, and system with controllable cooling objects and cooling effects and a wide range of applicability.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to an immersion liquid cooling device, a control method and a system. Background Art

[0002] As electronic devices advance towards higher performance and density, the heat they generate is increasing dramatically. Traditional air cooling methods are no longer able to meet these demands. Immersion liquid cooling, as a highly efficient heat dissipation method, has garnered widespread attention in recent years. This technology directly immerses electronic devices in an insulating coolant, leveraging the coolant's high heat capacity and thermal conductivity to achieve efficient cooling.

[0003] However, traditional immersion liquid cooling systems usually use a single coolant circulation, which makes it difficult to achieve precise temperature control of different heating elements. For equipment with large differences in heat generation, it is easy to cause local overheating, affecting the performance and life of the equipment. And it is usually necessary to connect a drive device to drive the circulation of the coolant through the drive device, but this coolant circulation cooling method is expensive and noisy, and has limited scope of application. In the prior art, there is also a method of using a thermal siphon to achieve coolant circulation, but this method mainly relies on the thermal siphon effect to achieve the circulation of the coolant, and it is difficult to control the cooling effect according to demand, which makes the cooling effect uncontrollable and prone to energy waste. Summary of the Invention

[0004] Based on this, the purpose of the present invention is to provide an immersion liquid cooling device, control method and system, aiming to solve the problem in the prior art of the lack of an immersion liquid cooling device, control method and system with controllable cooling objects and cooling effects and a wide range of applications.

[0005] A control method for an immersion liquid cooling device according to an embodiment of the present invention is applied to the immersion liquid cooling device, wherein the immersion liquid cooling device includes a liquid cooling cabinet, servers and cabinet-level evaporators arranged in an array within the liquid cooling cabinet, a chip-level evaporator arranged at a chip of the server, a thermosiphon connecting the cabinet-level evaporator and the chip-level evaporator, and an air-cooled condenser for cooling the thermosiphon. The method includes:

[0006] The temperature at the inlet and outlet of the chip-level evaporator and the maximum temperature of the chip are obtained in real time through preset sensors;

[0007] Determine the corresponding relationship between the inlet and outlet temperature difference and the preset threshold;

[0008] If the inlet and outlet temperature difference is less than the preset threshold, then according to a preset adjustment method, the valve opening of the pipeline valve corresponding to the inlet and outlet temperature difference is controlled to decrease as the inlet and outlet temperature difference increases, and it is determined in real time whether the valve opening reaches the minimum;

[0009] When the valve opening reaches a minimum and the outlet temperature is still lower than the preset threshold, a target fan speed is determined according to a first preset formula based on the maximum chip temperature and the chip heating power, so that the fan in the air-cooled condenser rotates at the target fan speed;

[0010] If the inlet and outlet temperature difference is equal to the preset threshold, the target fan speed is determined by a first preset formula according to the maximum chip temperature and the chip heating power, so that the fan in the air-cooled condenser rotates at the target fan speed.

[0011] In addition, the control method of an immersion liquid cooling device according to the above embodiment of the present invention may also have the following additional technical features:

[0012] Furthermore, the first preset formula is:

[0013]

[0014] Among them, v min is the minimum speed of the fan, K P 、 K i 、 K d are the gain coefficients of proportional, integral, and differential, is the current maximum temperature, is the heat generation power of the chip, C is the fan cooling efficiency constant, t is the time independent variable in the control system, is the integration variable.

[0015] Furthermore, after the step of obtaining the temperature at the inlet and outlet of the chip-level evaporator and the maximum temperature of the chip in real time through a preset sensor and determining the corresponding relationship between the inlet and outlet temperature difference and a preset threshold value, the following steps are included:

[0016] If the inlet and outlet temperature difference is less than the preset threshold, then according to a preset adjustment method, the valve opening of the pipeline valve corresponding to the inlet and outlet temperature difference is controlled to increase as the inlet and outlet temperature difference increases;

[0017] determining the target fan speed according to the maximum temperature of the chip and the heat generation power of the chip using the first preset formula, so that the fan in the air-cooled condenser rotates at the target fan speed, and detecting the valve opening and the inlet and outlet temperature difference in real time;

[0018] If the inlet and outlet temperature difference is greater than the preset threshold and the valve opening reaches the maximum, an alarm message is generated, and the server corresponding to the chip is shut down after the current state lasts for more than the preset time critical value.

[0019] Furthermore, the step of controlling the valve opening of the pipeline valve corresponding to the inlet and outlet temperature difference to decrease as the inlet and outlet temperature difference increases according to the preset adjustment method includes:

[0020] Determining a real-time system thermal imbalance index using a second preset formula, and determining whether the system thermal imbalance index is less than a preset value;

[0021] If the system thermal imbalance index is less than a preset value, the valve opening is controlled to decrease linearly as the inlet and outlet temperature difference increases;

[0022] If the system thermal imbalance index is not less than a preset value, adjusting the opening of each valve to adjust the flow rate of each pipeline in the chip-level evaporator;

[0023] The second preset formula is:

[0024]

[0025] in, is the system thermal imbalance index, is the standard deviation of all pipe outlet temperatures, is the mean temperature of all pipe outlets, is the power coefficient, It is the maximum value corresponding to the highest temperature of all chips.

[0026] Furthermore, the step of adjusting the opening of each valve to adjust the flow rate of each pipeline in the chip-level evaporator includes:

[0027] Determining a flow weight coefficient of each pipeline using a third preset formula, and adjusting the valve opening of the valve corresponding to each pipeline according to the flow weight coefficient to adjust the flow rate of each pipeline in the chip-level evaporator;

[0028] The third preset formula is:

[0029]

[0030] in, For the The flow weight coefficient of the pipeline, For the The temperature difference between the inlet and outlet of the pipeline, is the total number of pipelines, is the temperature penalty factor, For the The maximum chip temperature of the pipeline.

[0031] Furthermore, the chip power consumption change rate and the chip maximum temperature change rate are obtained to adjust the gain coefficient of the first preset formula through a preset adjustment formula;

[0032] The preset adjustment formula is:

[0033]

[0034]

[0035] in, and is the gain coefficient of the proportional and integral differential before adjustment, is the chip power consumption change rate, is the maximum temperature change rate, and is the attenuation coefficient.

[0036] Another object of an embodiment of the present invention is to provide an immersion liquid cooling device for implementing the above-mentioned immersion liquid cooling device control method, the device comprising:

[0037] A liquid cooling cabinet filled with a high thermal conductivity insulating coolant;

[0038] Servers, a plurality of the servers are distributed in an array in the liquid cooling cabinet and immersed in the cooling liquid, and the servers are provided with chips;

[0039] A cabinet-level evaporator, wherein the cabinet-level evaporator is hollow and surrounds the inner wall of the liquid-cooling cabinet, and a liquid condensing medium circulates inside the cabinet to cool all the coolant in the liquid-cooling cabinet;

[0040] Chip-level evaporators, wherein a plurality of chip-level evaporators are individually covered on the corresponding chips, and a liquid condensing medium circulates inside the evaporators for independently cooling the corresponding chips;

[0041] A thermosiphon, used to connect the cabinet-level evaporator and the chip-level evaporator, so that the cabinet-level evaporator and the chip-level evaporator form a low thermal resistance coupled closed circulation system;

[0042] An air-cooled condenser is arranged outside the liquid-cooled cabinet and connected to the thermosiphon through a pipeline, and is used to dissipate heat from the condensed working medium in the thermosiphon.

[0043] Furthermore, the cabinet-level evaporator adopts a double-layer coil structure, the inner layer is a low-temperature liquid condensing working medium channel, and the outer layer is a high-temperature steam condensing working medium channel; the low-temperature liquid condensing working medium flows to the chip-level evaporator, and the high-temperature steam condensing working medium flows to the thermal siphon air-cooled condenser.

[0044] Furthermore, the pipelines of each of the thermosiphons are composed of a Z-shaped structure, and a first temperature sensor is provided at the inlet and outlet of the chip-level evaporator in each of the thermosiphons, and a second temperature sensor is provided at the chip.

[0045] Another object of an embodiment of the present invention is to provide an immersion liquid cooling device control system, the system comprising:

[0046] A parameter acquisition module is used to obtain the temperature at the inlet and outlet of the chip-level evaporator and the maximum temperature of the chip in real time through a preset sensor and determine the corresponding relationship between the inlet and outlet temperature difference and a preset threshold value;

[0047] a valve adjustment judgment module, configured to, when the inlet and outlet temperature difference is less than the preset threshold, control the valve opening of the pipeline valve corresponding to the inlet and outlet temperature difference to decrease linearly as the inlet and outlet temperature difference increases, and to judge in real time whether the valve opening has reached a minimum;

[0048] a first air-cooling control module, configured to determine a target fan speed using a first preset formula according to the maximum chip temperature and the chip heat power when the valve opening reaches a minimum and the outlet temperature is still less than the preset threshold, so as to rotate the fan in the air-cooled condenser at the target fan speed;

[0049] The second air cooling control module is used to determine the target fan speed by a first preset formula according to the maximum temperature of the chip and the heat power of the chip when the inlet and outlet temperature difference is equal to the preset threshold, so that the fan in the air-cooled condenser rotates at the target fan speed.

[0050] Another object of an embodiment of the present invention is to provide a storage medium having a computer program stored thereon, which implements the steps of the above-mentioned immersion liquid cooling device control method when executed by a processor.

[0051] Another object of an embodiment of the present invention is to provide an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, the steps of the above-mentioned method for controlling an immersion liquid cooling device are implemented.

[0052] The present invention combines a thermosyphon with immersion liquid cooling technology, using a chip-level evaporator to precisely cool high-heat server chips and a cabinet-level evaporator to diffusely cool other electronic components in the server through immersion in a liquid cooling medium, achieving efficient and precise cooling in each zone. Because the thermosyphon uses passive heat transfer, relying on the phase change cycle of the internal working fluid for heat transfer, no additional power devices such as pumps are required, thereby simplifying the system structure, reducing energy consumption and noise, and enhancing the applicability of the device. Furthermore, by detecting the temperature difference between the inlet and outlet of the chip-level evaporator and the maximum temperature of the corresponding chip, the valve opening on the corresponding pipeline and the fan speed in the air-cooled condenser are accurately adjusted according to the chip's thermal condition. This, in turn, adjusts the flow rate at the corresponding chip-level evaporator and the heat exchange efficiency between the thermosyphon and the fan, achieving targeted control and adjustment of the cooling effect at each chip, ensuring that the chip operates within a normal range and the fan speed is not excessive, thereby ensuring stable control of the cooling effect at each chip and avoiding waste of fan energy. Therefore, the present invention solves the problem in the prior art of lacking an immersion liquid cooling device, control method and system with controllable cooling objects and cooling effects and a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Figure 1 is a flow chart of a control method for an immersion liquid cooling device in a first embodiment of the present invention;

[0054] Figure 2 is a structural block diagram of a control system for an immersion liquid cooling device in a second embodiment of the present invention;

[0055] Figure 3 is a schematic structural diagram of an electronic device in an embodiment of the present invention;

[0056] Figure 4 Schematic diagram of the structure of an immersion liquid cooling device in a third embodiment of the present invention;

[0057] Figure 5 Schematic diagram of the structure of a server in a third embodiment of the present invention;

[0058] Figure 6 Schematic diagram of the structure of a liquid cooling cabinet in a third embodiment of the present invention;

[0059] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0060] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. The drawings illustrate several embodiments of the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present invention.

[0061] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one skilled in the art to which this invention pertains. The terms used in this specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0062] Example 1

[0063] See also Figure 1 , shown is an immersion liquid cooling device control method in the first embodiment of the present invention, which is applied to the immersion liquid cooling device, the immersion liquid cooling device includes a liquid cooling cabinet, servers and cabinet-level evaporators arranged in an array in the liquid cooling cabinet, a chip-level evaporator arranged at the chip of the server, a thermosiphon connecting the cabinet-level evaporator and the chip-level evaporator, and an air-cooled condenser for cooling the thermosiphon. The method specifically includes S01-S05.

[0064] S01, obtaining the temperature at the inlet and outlet of the chip-level evaporator and the maximum temperature of the chip in real time through a preset sensor.

[0065] Specifically, the sensor can be a micro sensor installed at the chip-level evaporator and chip, and installed together with the cooling device. It can also be an infrared sensor installed on the outside of the liquid cooling cabinet, which can remotely obtain the thermal conditions of each chip through infrared imaging. The use of micro sensors can accurately obtain the temperature conditions of the chip, but the assembly is difficult and the cost is high. Using infrared imaging, the thermal conditions of each chip in the liquid cooling cabinet can be obtained through a small number of acquisition devices, but a large amount of infrared data needs to be processed in a timely manner to obtain the corresponding thermal conditions of each chip. The amount of data calculation is large, so the equipment needs to have strong data processing capabilities.

[0066] S02: Determine the corresponding relationship between the inlet and outlet temperature difference and a preset threshold.

[0067] S03, if the inlet and outlet temperature difference is less than the preset threshold, then according to the preset adjustment method, the valve opening of the pipeline valve corresponding to the inlet and outlet temperature difference is controlled to decrease as the inlet and outlet temperature difference increases, and it is determined in real time whether the valve opening reaches the minimum.

[0068] Specifically, the step of controlling the valve opening of the pipeline valve corresponding to the inlet and outlet temperature difference to decrease as the inlet and outlet temperature difference increases according to the preset adjustment method includes:

[0069] The real-time system thermal imbalance index is determined by a second preset formula, and it is determined whether the system thermal imbalance index is less than a preset value; if the system thermal imbalance index is less than the preset value, the valve opening is controlled to decrease linearly with the increase of the inlet and outlet temperature difference; if the system thermal imbalance index is not less than the preset value, the valve opening is adjusted to adjust the flow rate of each pipeline in the chip-level evaporator; the second preset formula is:

[0070]

[0071] in, is the system thermal imbalance index, is the standard deviation of all pipe outlet temperatures, is the mean temperature of all pipe outlets, is the power coefficient, is the maximum value of the highest temperature corresponding to all chips. In specific implementation, due to the large differences in the heat generation of chips in different servers, the traditional current equalization solution is prone to local overheating, and only adjusts the flow rate according to the heat condition of a single chip. It is impossible to accurately judge the heat condition of the entire device system, which may cause the corresponding flow at other chips to be affected, resulting in overheating. It is necessary to judge the heat condition of the entire system. If the system thermal imbalance index is less than the preset value, the valve opening of the valve corresponding to the chip can be adjusted separately. The adjustment at this time will not have a great impact on the overall heat condition of the system. If the system thermal imbalance index is greater than the preset value, it is necessary to adjust the opening of each valve in the system to ensure the cooling effect at the target chip and to ensure that other chips are not affected and overheated.

[0072] Furthermore, the step of adjusting the opening of each valve to adjust the flow rate of each pipeline in the chip-scale evaporator includes: determining the flow weight coefficient of each pipeline by a third preset formula, and adjusting the valve opening of the valve corresponding to each pipeline according to the flow weight coefficient to adjust the flow rate of each pipeline in the chip-scale evaporator; the third preset formula is:

[0073]

[0074] in, For the The flow weight coefficient of the pipeline, For the The temperature difference between the inlet and outlet of the pipeline, is the total number of pipelines, is the temperature penalty factor, For the The maximum chip temperature in the pipeline. During specific implementation, the weight of the flow rate of each pipeline is adjusted based on the real-time maximum temperature of the chip, thereby adjusting the flow rate conditions in all pipelines within the device as a whole. This allows the cooling effect at each chip to be adjusted in a targeted manner to ensure the cooling effect and efficiency of locally overheated chips and avoid overheating of chips in other areas. In addition, the flow weight coefficient calculated by the above formula may result in the sum of all flow weight coefficients being greater than 1, so normalization processing is required, and the flow rate in the pipeline is adjusted according to the normalized flow weight coefficient.

[0075] S04, when the valve opening reaches the minimum and the outlet temperature is still lower than the preset threshold, the target fan speed is determined by a first preset formula according to the maximum temperature of the chip and the chip heating power, so that the fan in the air-cooled condenser rotates at the target fan speed.

[0076] By way of example and not limitation, in some optional embodiments, the output u(t) of the controller may be expressed as: ,in is the temperature error, K P 、 K i 、 K d are the proportional, integral, and differential gain coefficients, setting the fan speed v(t) to be proportional to the output u(t) of the PID controller: , where v min is the minimum speed of the fan (to ensure basic heat dissipation), K is the proportional coefficient, which maps the PID output to the speed. In order to save energy, we hope that v(t) is as small as possible, but we must ensure that T max ≤85℃, set the chip maximum temperature T max The dynamic model can be simplified as: , P in is the heat generation power of the chip, P cool (v) is the cooling power of the fan, which is proportional to the fan speed v: ,therefore, , C is the fan cooling efficiency constant. Combining the above content, the following relationship can be obtained: ,in: ,therefore , combined with the above formula, we can solve:

[0077]

[0078] Among them, v min is the minimum speed of the fan, K P 、 K i 、 K d are the gain coefficients of proportional, integral, and differential, is the current maximum temperature, is the heat generation power of the chip, C is the fan cooling efficiency constant, t is the time independent variable in the control system, is the integration variable.

[0079] Furthermore, the chip power consumption change rate and the chip maximum temperature change rate are obtained to adjust the gain coefficient of the first preset formula through a preset adjustment formula;

[0080] The preset adjustment formula is:

[0081]

[0082]

[0083] in, and is the gain coefficient of proportional and integral differential before adjustment, is the chip power consumption change rate, is the maximum temperature change rate, and is the attenuation coefficient. In specific implementation, the chip power consumption change rate can accurately reflect the severity of power changes, and the maximum temperature change rate can accurately reflect the temperature response speed. Then, the gain coefficient is dynamically adjusted based on these two parameters to avoid the oscillation of fan speed and temperature to ensure stability. In addition, when the power changes drastically ( When the To avoid overshoot (temperature oscillation) caused by excessive control action, the exponential decay form ensures rapid reduction in power mutations. , and recovers more when the load is stable To improve the response speed. When the temperature change rate ( ) is larger, increase To accelerate the elimination of static errors (for example, when the temperature rises rapidly, a stronger integral action is needed to suppress it). Here, a linear increase is used to ensure that the integral action is enhanced when the temperature changes rapidly, and the integral action returns to normal when the temperature stabilizes to avoid integral windup.

[0084] S05, if the inlet and outlet temperature difference is equal to the preset threshold, the target fan speed is determined by a first preset formula according to the maximum temperature of the chip and the heat power of the chip, so that the fan in the air-cooled condenser rotates at the target fan speed.

[0085] Specifically, the outlet temperature difference being equal to the preset threshold indicates that the chip is in a suitable operating temperature range, and the fan speed is then adjusted to ensure that the chip can continue to operate within the temperature range, thereby adjusting the fan speed so that the fan speed is as small as possible to avoid energy waste while still meeting the heat dissipation requirements of the chip.

[0086] In addition, after the step of obtaining the temperature at the inlet and outlet of the chip-level evaporator and the maximum temperature of the chip in real time through a preset sensor and determining the correspondence between the inlet and outlet temperature difference and a preset threshold, the method further includes: if the inlet and outlet temperature difference is less than the preset threshold, then according to a preset adjustment method, controlling the valve opening of the pipeline valve corresponding to the inlet and outlet temperature difference to increase as the inlet and outlet temperature difference increases; determining the target fan speed according to the first preset formula based on the maximum temperature of the chip and the chip heat generation power, so that the fan in the air-cooled condenser rotates at the target fan speed, and detecting the valve opening and the inlet and outlet temperature difference in real time; if the inlet and outlet temperature difference is greater than the preset threshold and the valve opening reaches the maximum, generating an alarm message, and shutting down the server corresponding to the chip after the current state lasts for more than a preset time threshold. In a specific implementation, when an overheating condition occurs at the chip, it is necessary to adjust the valve opening and fan speed according to the real-time temperature condition to quickly dissipate heat from the chip. When the heat dissipation efficiency of the device is maximized and the chip is still in an overheating state, it indicates that a fault has occurred at the chip and the server needs to be shut down to avoid affecting the stable operation of other servers or chips.

[0087] In summary, the control method for an immersion liquid cooling device in the above-described embodiment of the present invention combines a thermosyphon with immersion liquid cooling technology. It utilizes a chip-level evaporator to precisely cool high-heat chips in a server, and a cabinet-level evaporator to diffusely cool other electronic components in the server through an immersion liquid cooling medium, achieving efficient and precise cooling in each zone. Because the thermosyphon utilizes passive heat transfer, relying on the phase change cycle of the internal working fluid for heat transfer, it eliminates the need for additional power devices such as pumps, thereby simplifying the system structure, reducing energy consumption and noise, and enhancing the device's applicability. Furthermore, by detecting the temperature difference between the inlet and outlet of the chip-level evaporator and the maximum temperature of the corresponding chip, the valve opening on the corresponding pipeline and the fan speed in the air-cooled condenser are accurately adjusted according to the chip's thermal status. This, in turn, adjusts the flow rate at the corresponding chip-level evaporator and the heat exchange efficiency between the thermosyphon and the fan, achieving targeted control and adjustment of the cooling effect at each chip, ensuring that the chip operates within a normal range and the fan speed is not excessively high. This ensures stable control of the cooling effect at each chip and avoids wasting fan energy. Therefore, the present invention solves the problem in the prior art of lacking an immersion liquid cooling device, control method and system with controllable cooling objects and cooling effects and a wide range of applications.

[0088] Example 2

[0089] See also Figure 2 , which is a structural block diagram of an immersion liquid cooling device control system proposed in a second embodiment of the present invention, the immersion liquid cooling device control system 20 includes: a parameter acquisition module 21, a judgment module 22, a valve adjustment judgment module 23, a first air cooling control module 24, and a second air cooling control module 25, wherein:

[0090] The parameter acquisition module 21 is used to obtain the temperature at the inlet and outlet of the chip-level evaporator and the maximum temperature of the chip in real time through a preset sensor and determine the corresponding relationship between the inlet and outlet temperature difference and a preset threshold value;

[0091] A judgment module 22 is used to judge the correspondence between the inlet and outlet temperature difference and a preset threshold value;

[0092] a valve adjustment judgment module 23 for controlling the valve opening of the pipeline valve corresponding to the inlet and outlet temperature difference to decrease linearly as the inlet and outlet temperature difference increases, when the inlet and outlet temperature difference is less than the preset threshold, and determining in real time whether the valve opening has reached a minimum;

[0093] a first air-cooling control module 24, configured to determine a target fan speed using a first preset formula according to the maximum chip temperature and chip heat power when the valve opening reaches a minimum and the outlet temperature is still less than the preset threshold, so as to rotate the fan in the air-cooled condenser at the target fan speed;

[0094] The second air cooling control module 25 is used to determine the target fan speed according to the maximum temperature of the chip and the heat power of the chip through a first preset formula when the inlet and outlet temperature difference is equal to the preset threshold, so that the fan in the air-cooled condenser rotates at the target fan speed.

[0095] The functions or operation steps implemented when the above modules are executed are substantially the same as those in the above method embodiments and will not be repeated here.

[0096] Example 3

[0097] See also Figures 4 to 6 On the other hand, the present invention also provides an immersion liquid cooling device.

[0098] The device includes:

[0099] Liquid cooling cabinet 9, the liquid cooling cabinet 9 is filled with high thermal conductivity insulating coolant;

[0100] Server 1, multiple servers 1 are distributed in an array in a liquid cooling cabinet 9 and immersed in cooling liquid, and chips 2 are provided on the servers 1;

[0101] The cabinet-level evaporator 4 is hollow and surrounds the inner wall of the liquid-cooling cabinet 9. A liquid condensing medium circulates inside the cabinet to cool all the coolant in the liquid-cooling cabinet 9.

[0102] Chip-level evaporators 3, where multiple chip-level evaporators 3 are individually covered on corresponding chips 2, and liquid condensing medium circulates inside the evaporators for independently cooling the corresponding chips 2;

[0103] Thermosyphon 5 is used to connect the cabinet-level evaporator 4 and the chip-level evaporator 3, so that the cabinet-level evaporator 4 and the chip-level evaporator 3 form a low thermal resistance coupled closed circulation system;

[0104] The air-cooled condenser 8 is arranged outside the liquid-cooled cabinet 9 and connected to the thermosiphon 5 through a pipeline, and is used to dissipate heat from the condensed working medium in the thermosiphon 5.

[0105] Specifically, the cabinet-level evaporator 4 utilizes a double-coil structure, with the inner layer serving as a channel for the low-temperature liquid condensate and the outer layer serving as a channel for the high-temperature steam condensate. The low-temperature liquid condensate flows to the chip-level evaporator 3, while the high-temperature steam condensate flows to the thermosyphon 5, which then feeds the air-cooled condenser 8. The air-cooled condenser 8 includes an integrated fin-tube heat exchanger 10 and a fan 11. The server is also equipped with a power supply 14 and expansion cards 13. This double-coil structure reduces the heat exchange efficiency between the two channels, ensuring effective heat dissipation while maximizing space utilization.

[0106] In addition, the pipelines of each thermosyphon 5 are arranged in a Z-shaped structure. A first temperature sensor 6 is provided at the inlet and outlet of the chip-level evaporator 3 in each thermosyphon 5, and a second temperature sensor 12 is provided at the chip 2. The temperature sensors monitor the inlet and outlet temperatures of the chip 2 and chip-level evaporator 3 to adjust the valve opening of the corresponding valve 7 and the cooling efficiency of the air-cooled condenser 8, thereby achieving targeted cooling of the chip 2.

[0107] In specific implementation, the liquid phase working medium in the liquid cooling cabinet 9 is a high thermal conductivity insulating coolant such as 3M fluorinated liquid, PAO or mineral oil, and a two-phase refrigerant with a low boiling working medium circulates in the thermal siphon 5 chip-level evaporator 3.

[0108] In summary, by combining the thermosiphon 5 with the immersion liquid cooling technology, the chip-level evaporator 3 is used to accurately cool the high-temperature chip of the server, and the cabinet-level evaporator 4 is used to diffusely cool other electronic components of the server 1 through the immersion liquid cooling medium, thereby achieving efficient and accurate cooling in different zones; and combined with the corresponding control method, the sensor is used to sense the maximum temperature of the chip and the temperature difference between the inlet and outlet of the chip-level evaporator 3, and the speed of the fan 11 and the refrigerant supply volume of different evaporators are adjusted respectively, so as to solve the problem of uneven liquid distribution between the cabinet-level evaporator 4 and the chip-level evaporator 3 of the immersion liquid cooling coupled thermosiphon 5 zone cooling system, thereby achieving the purpose of eliminating local hot spots and improving system energy efficiency.

[0109] Example 4

[0110] Another aspect of the present invention provides an electronic device, see Figure 3 , shown is a schematic diagram of an electronic device in the current regional embodiment of the present invention, including a memory 200, a processor 100, and a computer program 300 stored in the memory and executable on the processor. When the processor 100 executes the computer program 300, the control method of the immersion liquid cooling device as described above is implemented.

[0111] In some embodiments, the processor 100 may be a central processing unit (CPU), a controller, a microcontroller, a microprocessor, or other data processing chip, used to run program codes or process data stored in the memory 200, such as executing access restriction programs.

[0112] The memory 200 includes at least one type of readable storage medium, including flash memory, a hard disk, a multimedia card, a card-type memory (e.g., SD or DX memory), a magnetic memory, a magnetic disk, an optical disk, etc. In some embodiments, the memory 200 may be an internal storage unit of the electronic device, such as the hard disk of the electronic device. In other embodiments, the memory 200 may also be an external storage device of the electronic device, such as a plug-in hard disk equipped on the electronic device, a Smart Media Card (SMC), a Secure Digital (SD) card, a flash memory card, etc. Furthermore, the memory 200 may include both an internal storage unit of the electronic device and an external storage device. The memory 200 can be used not only to store application software and various types of data of the electronic device, but also to temporarily store data that has been output or is about to be output.

[0113] It should be pointed out that Figure 3 The structure shown does not constitute a limitation to the electronic device. In other embodiments, the electronic device may include fewer or more components than shown in the figure, or combine certain components, or arrange the components differently.

[0114] An embodiment of the present invention further provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the above-mentioned control method for the immersion liquid cooling device.

[0115] Those skilled in the art will appreciate that the logic and / or steps represented in the flowcharts or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by an instruction execution system, apparatus, or device (e.g., a computer-based system, a system including a processor, or other system that can fetch and execute instructions from an instruction execution system, apparatus, or device), or in conjunction with such instruction execution system, apparatus, or device. For purposes of this specification, "computer-readable medium" can be any device that can contain, store, communicate, propagate, or transport a program for use by an instruction execution system, apparatus, or device, or in conjunction with such instruction execution system, apparatus, or device.

[0116] More specific examples (a non-exhaustive list) of computer-readable media include the following: an electrical connection with one or more wires (electronic devices), a portable computer disk cartridge (magnetic devices), a random access memory (RAM), a read-only memory (ROM), an erasable and programmable read-only memory (EPROM or flash memory), a fiber optic device, and a portable compact disc read-only memory (CDROM). In addition, the computer-readable medium may even be paper or other suitable medium on which the program is printed, since the program may be obtained electronically, for example, by optically scanning the paper or other medium and then editing, interpreting, or processing it in another suitable manner as necessary, and then storing it in a computer memory.

[0117] It should be understood that various components of the present invention may be implemented using hardware, software, firmware, or a combination thereof. In the aforementioned embodiments, multiple steps or methods may be implemented using software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented using hardware, as in another embodiment, any one or a combination of the following technologies known in the art may be used: a discrete logic circuit having logic gate circuits for implementing logic functions on data signals, an application-specific integrated circuit having suitable combinational logic gate circuits, a programmable gate array (PGA), a field-programmable gate array (FPGA), etc.

[0118] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0119] The above embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A control method for an immersion liquid cooling device, characterized in that: Applied to an immersion liquid cooling device, the immersion liquid cooling device includes a liquid cooling cabinet, servers and cabinet-level evaporators arranged in an array within the liquid cooling cabinet, a chip-level evaporator arranged at a chip of the server, a thermosiphon connecting the cabinet-level evaporator and the chip-level evaporator, and an air-cooled condenser for cooling the thermosiphon, the method comprising: The temperature at the inlet and outlet of the chip-level evaporator and the maximum temperature of the chip are obtained in real time through preset sensors; Determine the corresponding relationship between the inlet and outlet temperature difference and the preset threshold; If the inlet and outlet temperature difference is less than the preset threshold, then according to a preset adjustment method, the valve opening of the pipeline valve corresponding to the inlet and outlet temperature difference is controlled to decrease as the inlet and outlet temperature difference increases, and it is determined in real time whether the valve opening reaches the minimum; When the valve opening reaches a minimum and the outlet temperature is still lower than the preset threshold, a target fan speed is determined according to a first preset formula based on the maximum chip temperature and the chip heating power, so that the fan in the air-cooled condenser rotates at the target fan speed; If the inlet and outlet temperature difference is equal to the preset threshold, determining the target fan speed according to the maximum temperature of the chip and the heat generation power of the chip using a first preset formula, so that the fan in the air-cooled condenser rotates at the target fan speed; The first preset formula is: Among them, v min is the minimum speed of the fan, K P 、 K i 、 K d are the gain coefficients of proportional, integral, and differential, is the current maximum temperature, is the heat generation power of the chip, C is the fan cooling efficiency constant, t is the time independent variable in the control system, is the integral variable; The step of controlling the valve opening of the pipeline valve corresponding to the inlet and outlet temperature difference to decrease as the inlet and outlet temperature difference increases according to the preset adjustment method includes: Determining a real-time system thermal imbalance index using a second preset formula, and determining whether the system thermal imbalance index is less than a preset value; If the system thermal imbalance index is less than a preset value, the valve opening is controlled to decrease linearly as the inlet and outlet temperature difference increases; If the system thermal imbalance index is not less than a preset value, adjusting the opening of each valve to adjust the flow rate of each pipeline in the chip-level evaporator; The second preset formula is: in, is the system thermal imbalance index, is the standard deviation of all pipe outlet temperatures, is the mean temperature of all pipe outlets, is the power coefficient, It is the maximum value corresponding to the highest temperature of all chips.

2. The control method of the immersion liquid cooling device according to claim 1, characterized in that: After the steps of obtaining the temperature at the inlet and outlet of the chip-level evaporator and the maximum temperature of the chip in real time through a preset sensor and determining the corresponding relationship between the inlet and outlet temperature difference and a preset threshold value, the following steps are included: If the inlet and outlet temperature difference is less than the preset threshold, then according to a preset adjustment method, the valve opening of the pipeline valve corresponding to the inlet and outlet temperature difference is controlled to increase as the inlet and outlet temperature difference increases; determining the target fan speed according to the maximum temperature of the chip and the heat generation power of the chip using the first preset formula, so that the fan in the air-cooled condenser rotates at the target fan speed, and detecting the valve opening and the inlet and outlet temperature difference in real time; If the inlet and outlet temperature difference is greater than the preset threshold and the valve opening reaches the maximum, an alarm message is generated, and the server corresponding to the chip is shut down after the current state lasts for more than the preset time critical value.

3. The control method of the immersion liquid cooling device according to claim 1, characterized in that: The step of adjusting the opening of each valve to adjust the flow rate of each pipeline in the chip-level evaporator includes: Determining a flow weight coefficient of each pipeline using a third preset formula, and adjusting the valve opening of the valve corresponding to each pipeline according to the flow weight coefficient to adjust the flow rate of each pipeline in the chip-level evaporator; The third preset formula is: in, For the The flow weight coefficient of the pipeline, For the The temperature difference between the inlet and outlet of the pipeline, is the total number of pipelines, is the temperature penalty factor, For the The maximum chip temperature of the pipeline.

4. The control method of the immersion liquid cooling device according to claim 1, characterized in that: Obtaining a chip power consumption change rate and a chip maximum temperature change rate to adjust a gain coefficient of the first preset formula using a preset adjustment formula; The preset adjustment formula is: in, and is the gain coefficient of proportional and integral differential before adjustment, is the chip power consumption change rate, is the maximum temperature change rate, and is the attenuation coefficient.

5. An immersion liquid cooling device, characterized in that: A method for controlling an immersion liquid cooling device according to any one of claims 1 to 4, the device comprising: A liquid cooling cabinet filled with a high thermal conductivity insulating coolant; Servers, a plurality of the servers are distributed in an array in the liquid cooling cabinet and immersed in the cooling liquid, and the servers are provided with chips; A cabinet-level evaporator, wherein the cabinet-level evaporator is hollow and surrounds the inner wall of the liquid-cooling cabinet, and a liquid condensing medium circulates inside the cabinet to cool all the coolant in the liquid-cooling cabinet; Chip-level evaporators, wherein a plurality of chip-level evaporators are individually covered on the corresponding chips, and a liquid condensing medium circulates inside the evaporators for independently cooling the corresponding chips; A thermosiphon, used to connect the cabinet-level evaporator and the chip-level evaporator, so that the cabinet-level evaporator and the chip-level evaporator form a low thermal resistance coupled closed circulation system; An air-cooled condenser is arranged outside the liquid-cooled cabinet and connected to the thermosiphon through a pipeline, and is used to dissipate heat from the condensed working medium in the thermosiphon.

6. The immersion liquid cooling device according to claim 5, characterized in that: The cabinet-level evaporator adopts a double-layer coil structure, the inner layer is a low-temperature liquid condensing working medium channel, and the outer layer is a high-temperature steam condensing working medium channel; the low-temperature liquid condensing working medium flows to the chip-level evaporator, and the high-temperature steam condensing working medium flows to the thermosiphon air-cooled condenser.

7. The immersion liquid cooling device according to claim 5, characterized in that: The pipelines of each of the thermosiphons are formed in a Z-shaped structure. A first temperature sensor is provided at the inlet and outlet of the chip-level evaporator in each of the thermosiphons, and a second temperature sensor is provided at the chip.

8. An immersion liquid cooling device control system, characterized in that: For implementing the control method of the immersion liquid cooling device according to any one of claims 1 to 4, the system comprises: A parameter acquisition module is used to obtain the temperature at the inlet and outlet of the chip-level evaporator and the maximum temperature of the chip in real time through a preset sensor; A judgment module, used to judge the corresponding relationship between the inlet and outlet temperature difference and a preset threshold; a valve adjustment judgment module, configured to, when the inlet and outlet temperature difference is less than the preset threshold, control the valve opening of the pipeline valve corresponding to the inlet and outlet temperature difference to decrease linearly as the inlet and outlet temperature difference increases, and to judge in real time whether the valve opening has reached a minimum; a first air-cooling control module, configured to determine a target fan speed using a first preset formula according to the maximum chip temperature and the chip heat power when the valve opening reaches a minimum and the outlet temperature is still less than the preset threshold, so as to rotate the fan in the air-cooled condenser at the target fan speed; The second air cooling control module is used to determine the target fan speed by a first preset formula according to the maximum temperature of the chip and the heat power of the chip when the inlet and outlet temperature difference is equal to the preset threshold, so that the fan in the air-cooled condenser rotates at the target fan speed.

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