Probe and electrical connection device

Abstract

The probe is inserted into a guide hole of a guide plate included in the probe head and held by the probe head. The probe is provided with: a columnar base material; and a protector that covers at least a portion of a side surface of a region of the base material passing through the guide hole, the protector having a hardness higher than that of the base material. A protector covering a region of the base material passing through the same guide hole is divided into a plurality of portions in the axial direction of the base material.

Description

Technical Field

[0001] The present invention relates to a probe and an electrical connection device used for inspecting the electrical characteristics of an object to be inspected. Background Art

[0002] In order to inspect the electrical characteristics of an object to be inspected, such as a semiconductor integrated circuit, in a wafer state, an electrical connection device including a probe is used. In an inspection using a probe, one end of the probe is brought into contact with an electrode pad of the object to be inspected, and the other end of the probe is brought into contact with a terminal (hereinafter referred to as "land") disposed on a printed circuit board or the like. The land is electrically connected to an inspection device such as a tester.

[0003] During the inspection of the object to be inspected, after bringing the probe into contact with the electrode pad, the electrical connection device and the object to be inspected are further brought closer (over-driven), so that the probe is bent by elastic deformation. By bending the probe, the elastic force of the probe can be used to stably contact the probe with the electrode pad and the land.

[0004] Prior art documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Laid-Open No. 2018-91870 Summary of the Invention

[0007] Problems to be Solved by the Invention

[0008] The probe is supported in a state of passing through a guide hole formed in a guide plate by a probe head having a plurality of guide plates. In order to prevent the probe from being damaged due to contact between the inner wall surface or the opening of the guide hole and the side surface of the probe, a process of covering the periphery of the side surface of the region where the probe passes through the guide hole with a protective member made of a material harder than the base material of the probe is performed. However, sometimes the probe warps due to the stress applied to the probe by forming the protective member.

[0009] An object of the present invention is to provide a probe and an electrical connection device capable of suppressing warping of the probe caused by forming a protective member covering the side surface.

[0010] Means for Solving the Problems

[0011] The probe according to one aspect of the present invention is inserted into a guide hole of a guide plate included in a probe head and held by the probe head. The probe includes: a columnar base material; and a protective member that covers at least a part of the side surface of the region where the base material passes through the guide hole, and the hardness of the protective member is higher than the hardness of the base material. The protective members covering the regions where the base material passes through the same guide hole are divided into a plurality of parts along the axial direction of the base material.

[0012] Effects of the Invention

[0013] According to the present invention, it is possible to provide a probe and an electrical connection device that can suppress warping of the probe caused by forming a protective member covering the side surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram showing the structure of an electrical connection device according to an embodiment of the present invention.

[0015] Figure 2 It is a schematic diagram showing the structure of a probe according to an embodiment of the present invention.

[0016] Figure 3 It is Figure 2 A schematic cross-sectional view taken along the III-III direction.

[0017] Figure 4 It is a schematic diagram showing an example of the state of the manufacturing process of a probe according to an embodiment of the present invention.

[0018] Figure 5A It is a schematic diagram showing the structure of a probe according to a first modification of an embodiment of the present invention.

[0019] Figure 5B It is Figure 5A A schematic cross-sectional view taken along the V-V direction.

[0020] Figure 6 It is a schematic diagram showing the structure of an electrical connection device according to a second modification of an embodiment of the present invention.

[0021] Figure 7 It is Figure 6 A schematic cross-sectional view taken along the VII-VII direction. DETAILED DESCRIPTION OF THE INVENTION

[0022] Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, the drawings are schematic, and it should be noted that the ratio of the thickness of each part and the like is different from the actual situation. In addition, there are of course parts with different dimensional relationships and ratios between the drawings. The embodiments shown below illustrate devices and methods for embodying the technical idea of the present invention, and the embodiments of the present invention do not specify the materials, shapes, structures, configurations, manufacturing methods, etc. of the constituent parts as the following manner.

[0023] Figure 1The electrical connection device 100 of the embodiment of the present invention shown is used for inspecting the electrical characteristics of the object to be inspected 2. In the electrical connection device 100, the probe 1 is held by the probe head 20. Specifically, a plurality of probes 1 are inserted into the guide holes of the first guide plate 21, the second guide plate 22, and the third guide plate 23 included in the probe head 20 and are held by the probe head 20. The probe head 20 has a structure in which the first guide plate 21, the second guide plate 22, and the third guide plate 23 are arranged so as to be separated from each other in the direction of the surface normal of the main surface of the guide plate. Hereinafter, without separately defining the first guide plate 21, the second guide plate 22, and the third guide plate 23, they are referred to as guide plates.

[0024] The probe 1 has a first contact portion 111 as one end and a second contact portion 112 as the other end. When inspecting the object to be inspected 2, the first contact portion 111 of the probe 1 contacts an electrode pad (not shown) of the object to be inspected 2. The second contact portion 112 of the probe 1 contacts the connection pad 31 of the substrate 30. The connection pad 31 is electrically connected to an inspection device such as an IC tester (not shown). The first contact portion 111 passes through the guide holes penetrating the second guide plate 22 and the third guide plate 23. The second contact portion 112 passes through the guide hole penetrating the first guide plate 21.

[0025] The probe 1 includes: a columnar base material; and a protective member 50 that covers at least a part of the side surface of the region where the base material passes through the guide hole, and the hardness of the protective member 50 is higher than that of the base material. Figure 1 The probe 1 shown includes: a first protective member 501 that covers the outer periphery of the region passing through the first guide plate 21; a second protective member 502 that covers the outer periphery of the region passing through the second guide plate 22; and a third protective member 503 that covers the outer periphery of the region passing through the third guide plate 23. Hereinafter, without separately defining the first protective member 501, the second protective member 502, and the third protective member 503, they are referred to as the protective member 50.

[0026] The protective member 50 is used to prevent damage to the probe caused by contact between the side surface of the guide hole and the probe 1. The "side surface" of the guide hole includes the inner wall surface and the opening of the guide hole. In the probe 1 of the embodiment, in at least any one of a plurality of regions penetrating the guide plate, the protective member 50 covering the region where the base material 10 passes through the same guide hole is divided into a plurality of parts along the axial direction of the base material 10. In Figure 1 In the probe 1 shown, the third protective member 503 is divided into a first protective part 50A and a second protective part 50B.

[0027] As Figure 1As shown, in the probe head 20, with respect to the guide holes penetrated by the same probe 1, the positions of the guide holes of the second guide plate 22 are arranged offset in the direction F parallel to the main surface of the first guide plate 21. Hereinafter, the arrangement in which the positions of the guide holes are offset is referred to as an "offset arrangement". In addition, the direction F in which the positions of the guide holes are offset is also referred to as the "offset direction". By the offset arrangement, the probe 1 bends between the first guide plate 21 and the second guide plate 22. That is, in the hollow region 200 between the first guide plate 21 and the second guide plate 22, the probe 1 is in a state of being bent by elastic deformation. When viewed from the direction normal to the surface of the guide plate, the positions of the guide holes of the second guide plate 22 and the positions of the guide holes of the third guide plate 23 coincide.

[0028] By the offset arrangement of the guide holes of the first guide plate 21 and the second guide plate 22, when the first contact portion 111 of the probe 1 contacts the object to be inspected 2, the probe 1 buckles in the hollow region 200. That is, in the state where the probe 1 is in contact with the object to be inspected 2 (hereinafter referred to as the "contact state"), the probe 1 further bends from the bent shape in the state where the probe 1 is not in contact with the object to be inspected 2 (hereinafter referred to as the "non-contact state") by flexural deformation. By the further bending of the probe 1, the probe 1 contacts the object to be inspected 2 with a predetermined pressing force. Therefore, by the offset arrangement, the electrical characteristics of the object to be inspected 2 can be stably measured using the probe 1. The probe 1 has elasticity to return to the shape before contacting the object to be inspected 2 when it becomes the non-contact state.

[0029] Hereinafter, with reference to Figure 2 a detailed description of the probe 1 will be given.

[0030] Figure 2 The probe 1 of the embodiment shown is columnar in shape with a structure in which the first contact portion 111, the first connecting portion 121, the bending portion 13, the second connecting portion 122, and the second contact portion 112 are connected in sequence along the axial direction. Hereinafter, without separately defining the first contact portion 111 and the second contact portion 112, they are referred to as the contact portion 11. In addition, without separately defining the first connecting portion 121 and the second connecting portion 122, they are referred to as the connecting portion 12. In other words, the probe 1 includes the contact portion 11, the bending portion 13, and the connecting portion 12 that connects the contact portion 11 and the bending portion 13.

[0031] The first connecting portion 121 connects the first contact portion 111 and the bending portion 13. The second connecting portion 122 connects the second contact portion 112 and the bending portion 13. The tip of the first contact portion 111 contacts the object to be inspected during the inspection. The tip of the second contact portion 112 contacts the connection pad during the inspection of the object to be inspected. When inspecting the object to be inspected, the probe 1 bends by elastic deformation.

[0032] In the description of the embodiments of the present invention, the X-direction, Y-direction, and Z-direction are defined as shown below. In Figure 2 , the X-direction is parallel to the left-right direction of the paper surface, the Y-direction is parallel to the depth direction of the paper surface, and the Z-direction is parallel to the up-down direction of the paper surface. The axial direction of the probe 1 is along the Z-direction. Hereinafter, the case where the cross-section of the probe 1 perpendicular to the axial direction is rectangular will be described. Further, the X-direction is set as the width direction of the probe 1, and the Y-direction is set as the thickness direction of the probe 1. Figure 2

[0033] Figure 3 In Figure 2 shows Figure 3 the structure of the cross-section (hereinafter simply referred to as "cross-section") of the probe 1 perpendicular to the axial direction along the III-III direction. In the probe 1 shown in Figure 3 , an example is shown in which one long side and two short sides of the four side surfaces of the base material 10 are covered by the protective member 50. As shown in , it may also be that three side surfaces of the base material 10 having a rectangular cross-section are covered by the protective member 50, and the remaining one side surface is not covered by the protective member 50. Or, the protective member 50 may surround the side surface of the base material 10.

[0034] According to the probe 1 of the embodiment, by disposing the protective member 50 on the side surface of the base material 10, damage to the probe 1 caused by contact with the side surface of the guide hole can be suppressed. For example, the base material 10 is made of nickel (Ni) or nickel alloy, etc. The protective member 50 is preferably made of rhodium (Rh), etc. Or, the protective member 50 may also be made of DLC (Diamond Like Carbon), etc. In addition, the base material 10 may be a single material or a laminated structure of different materials.

[0035] Figure 2 In the probe 1, as shown in Figure 2 , the cross-sectional area of the region of the bending portion 13 connected to the connecting portion 12 may be made smaller than the cross-sectional area of other regions of the bending portion 13. Hereinafter, the region of the bending portion 13 connected to the connecting portion 12 will also be referred to as the "connection region". In addition, the remaining region of the bending portion 13 other than the connection region will also be referred to as the "intermediate region". The bending portion 13 shown in

[0036] includes an intermediate region 133, a first connection region 131 connected to one end of the intermediate region 133, and a second connection region 132 connected to the other end of the intermediate region 133. The first connection region 131 is connected to the first connecting portion 121, and the second connection region 132 is connected to the second connecting portion 122. Hereinafter, without separately defining the first connection region 131 and the second connection region 132, it will be referred to as the connection region 130.By making the cross-sectional area of the connection region 130 smaller than the cross-sectional area of the intermediate region 133 in the bent portion 13, when the probe 1 is bent, the connection region 130 between the intermediate region 133 and the connection portion 12 bends to a particularly large extent. Therefore, the straightness of the contact portion 11 connected to the connection portion 12 on the side opposite to the bent portion 13 can be ensured. For example, as also Figure 2 shown, by making the width of the connection region 130 narrower than the width of the intermediate region 133 in the X direction, the cross-sectional area of the connection region 130 is made smaller than the cross-sectional area of the intermediate region 133. At this time, when viewed from the X direction, the thickness of the bent portion 13 is constant.

[0037] When the probe 1 is bent in the contact state where the probe 1 is in contact with the inspection object 2, when the bent portion 13 includes the intermediate region 133 and the connection region 130, the probe 1 bends to a particularly large extent at the connection region 130. Therefore, the linear movement of the contact portion 11 along the guide hole can be ensured. As a result, the contact between the side surface of the guide hole and the contact portion 11 can be suppressed. However, when the contact between the side surface of the guide hole and the contact portion 11 can also be suppressed even if the bent portion 13 does not include the connection region 130, the diameter of the bent portion 13 may also be constant.

[0038] The protection member 50 may also cover a part of the connection portion 12 beyond the connection portion between the contact portion 11 and the connection portion 12. That is, the region of the connection portion 12 closer to the contact portion 11 may be covered with the protection member 50, and the region of the connection portion 12 closer to the bent portion 13 may not be covered with the protection member 50. By covering the region of the connection portion 12 closer to the contact portion 11 with the protection member 50, even when a part of the connection portion 12 passes through the inside of the guide hole, the situation where the probe 1 is damaged due to contact with the side surface of the guide hole can be suppressed.

[0039] The protection member 50 is divided into a region covering the opening portion of the base material 10 passing through the guide hole according to the range of the region where the probe 1 passes through the guide hole. In other words, the region of the base material 10 where the protection member 50 is disposed is the region that passes through the guide hole in either the case of inspecting the inspection object or not inspecting the inspection object. For example, in a state where the base material 10 is bent inside the probe head 20 due to offset arrangement, the region of the base material 10 passing through the guide hole is covered with the protection member 50. And, when inspecting the inspection object, the region of the base material 10 that passes through the guide hole due to over-driving in a manner of pressing the probe 1 against the inspection object is covered with the protection member 50.

[0040] The protective member 50 is divided in consideration of, for example, the length of the guide hole in the axial direction of the probe 1 (e.g., 250 μm) and the length of the stroke caused by the bending of the probe 1 (e.g., 120 μm). The "stroke" refers to the amount of change in the range through the guide hole between the contact state and the non-contact state.

[0041] The offset direction is, for example, the direction in which the long side of the cross section of the base material 10 is oriented. Figure 3 In the base material 10 shown in which the three side surfaces are covered by the protective member 50, the protective member 50 is arranged on at least any one of the side surfaces facing in the direction parallel to the offset direction. On the other hand, the side surface facing in the direction parallel to the offset direction that faces in the opposite direction to the side surface on which the protective member 50 is arranged may not be covered by the protective member 50. In other words, the protective member 50 may be formed on the remaining side surfaces of the base material 10 except for any one of the side surfaces facing in the offset direction or the side surfaces facing in the direction opposite to the offset direction.

[0042] In recent years, probe cards are expected to have narrower pitches in which the intervals between probes are narrowed, and in order to prevent short circuits with adjacent probes, the probes are thinner. By covering the side of the base material 10 that may come into contact with the guide plate with the protective member 50, it is possible to suppress the probe 1 from becoming thicker while suppressing the base material 10 from coming into contact with the guide hole and being damaged. For example, the probe 1 of the present embodiment is covered with the protective member 50 on the remaining side surfaces of the base material 10 except for any side surface facing the offset direction or the side surface facing the direction opposite to the offset direction. On the other hand, the base material 10 is exposed on the side surface facing the direction opposite to the offset direction. Therefore, by covering the protective member 50 on three surfaces and exposing the base material 10 on one surface, it is possible to suppress the probe 1 from becoming thicker due to the protective member 50 covering the surface of the base material 10 while suppressing the base material 10 from coming into contact with the guide hole and being damaged.

[0043] In addition, the protective member 50 is not limited to covering only three surfaces of the base material 10. In addition, it is also considered that the protective member 50 is buried in the base material 10 to prevent the probe 1 from becoming thicker and to prevent the base material 10 from contacting the guide hole and being damaged. The structure is not limited to one of the structure in which the protective member 50 is provided on the probe 1 and the structure in which the protective member 50 is buried in the base material 10.

[0044] The probe 1 is formed by, for example, patterning a base material 10 formed on a flat base into a predetermined shape by etching. In the manufacturing process of the probe 1, the protective member 50 is formed on the surface of the base material 10 by plating or the like. At this time, for example Figure 4As shown in the top view, the base material 10 is formed in a state where one end is supported by the support table 300 and is suspended above a base (not shown). Therefore, as it goes from the second contact portion 112 integrated with the support table 300 toward the first contact portion 111, the base material 10 is liable to be affected by stress. That is, the region of the first contact portion 111 plated with the protective member 50 is liable to warp under the influence of stress caused by the plating process. In particular, after the process of forming the protective member 50, the probe 1 is liable to warp. Also, after the manufacturing process, the region of the probe 1 covered by the protective member 50 is liable to warp. In contrast, the probe 1 of the embodiment reduces the influence of stress on the base material 10 by dividing the protective member 50, thereby being able to suppress the generation of warping. For the probe 1, an example is shown where the third protective member 503 formed around the first contact portion 111 that is particularly liable to warp is divided.

[0045] As described above, in the electrical connection device 100, a protective member 50 having a hardness higher than that of the contact portion 11 is disposed around the region of the contact portion 11 of the probe 1 that passes through the guide hole. Thus, according to the electrical connection device 100, a situation where the probe 1 comes into contact with the side surface of the guide hole and is damaged can be suppressed. On the other hand, the longer the region where the protective member 50 is continuously formed along the axial direction of the base material 10, the more liable the probe 1 is to warp. In contrast, in the electrical connection device 100 of the embodiment, the protective member 50 covering the region of the probe 1 that passes through the same guide hole is divided into a plurality of parts along the axial direction of the base material 10. Therefore, warping of the probe 1 caused by the formation of the protective member 50 can be suppressed.

[0046] <First Modified Example>

[0047] Figure 5A and Figure 5B The probe 1 of the first modified example shown in and has a structure in which a convex portion 15 extending along the axial direction is provided on one side surface of the base material 10. By forming the convex portion 15 on the side surface of the base material 10, the rigidity of the base material 10 can be increased, and the generation of warping of the probe 1 can be suppressed. By disposing the convex portion 15 on the side surface of the base material 10, the rigidity of the base material 10 is further increased, and the portion of the probe 1 inserted into the guide hole is not easily bent. For example, the convex portion 15 may be formed on the side surface of the base material 10 facing the offset direction (hereinafter referred to as the "offset surface"). The reason for forming the convex portion 15 on the offset surface is that when the cross section of the base material 10 is rectangular, warping is usually liable to occur on the long side, which is the side surface that becomes the offset surface. The protective member 50 is disposed on the base material 10 so as to cover the surface of the convex portion 15 including the end surface facing the axial direction.

[0048] Preferably, the convex portion 15 does not extend to the top end of the base material 10. By not forming the convex portion 15 at the top end of the base material 10, it is possible to suppress the situation where the end face of the convex portion 15 abuts against the opening portion of the guide hole when the probe 1 is inserted into the guide hole of the probe head 20, thereby hindering the insertion of the probe 1 into the guide hole. The convex portion 15 may also be formed only in the area covered by the protection member 50.

[0049] <Second Modified Example>

[0050] Figure 6 In the electrical connection device 100 of the second modified example shown, a plurality of insulating coating members 60 are arranged on the surface of the probe 1 at intervals along the axial direction of the probe 1. The coating members 60 are arranged in the remaining area of the area where the protection member 50 is arranged.

[0051] When the probe 1 is bent inside the probe head 20 during the inspection of the object to be inspected, there may be a short circuit between the probes. In Figure 6 In the electrical connection device 100 shown, the short circuit between the probes is prevented by the contact between the insulating coating member 60 arranged on the surface of the probe 1 and the adjacent probe 1.

[0052] Preferably, the coating member 60 is arranged on the offset surface of the probe 1 or the side surface facing the opposite direction of the offset surface. For example, as Figure 7 shown, the coating member 60 may be continuously arranged on the offset surface of the base material 10 having a rectangular cross-section and the two side surfaces adjacent to the offset surface. Alternatively, the coating member 60 may be arranged around the entire circumference of the probe 1.

[0053] The coating member 60 is intermittently arranged at least including a bent portion in the portion where the probe 1 passes through the hollow region 200. In contrast, when the surface of the base material 10 is continuously covered with the coating member 60 in the range from the first contact portion 111 to the second contact portion 112 along the axial direction, the probe 1 is likely to warp. However, in Figure 6 In the probe 1 shown, by arranging the coating member 60 intermittently along the axial direction, the warping of the probe 1 can be suppressed.

[0054] In addition, the probe 1 is passed through the guide hole of the guide plate to set the probe 1 in the probe head 20. For example, in a state where the central axes of the guide holes of all the guide plates are aligned, the probe 1 is continuously passed through the guide holes of the guide plates. Therefore, the sum of the outer diameter of the probe 1 and the thickness of the coating member 60 is set to be smaller than the inner diameter of the guide hole. That is, the thickness of the coating member 60 is set to a thickness that can ensure a gap between the sum of the outer diameter of the probe 1 and the thickness of the coating member 60 and the inner diameter of the guide hole and can prevent a short circuit between the probes.

[0055] The material of the covering member 60 can also be, for example, resin, glass fiber, permanent resist, ceramic vapor deposition, etc. In order to form the covering member 60 at a predetermined position on the surface of the probe 1, for example, after the covering member 60 is formed on the entire surface of the probe 1, the covering member 60 can be patterned by lithography technology or the like.

[0056] (Other embodiments)

[0057] As described above, the present invention has been described using embodiments, but it should not be understood that the discussions and drawings forming part of this disclosure limit the present invention. Based on this disclosure, those skilled in the art can identify various alternative embodiments, examples, and application techniques.

[0058] For example, in the above description, the case where the protection member 50 passing through the same guide hole is divided into two parts is illustratively described, but the protection member 50 can also be divided into three or more parts. However, the region of the opening of the guide hole of the base material 10 passing through the guide plate is covered by the protection member 50. In addition, the case of dividing the third protection member 503 has been described, but it is possible that the first protection member 501 and the second protection member 502 are also divided into multiple parts.

[0059] In addition, in the above description, the case where the cross-sectional shape of the base material 10 is a rectangular shape has been described, but the cross-section of the base material 10 can also be other shapes. For example, the cross-section of the base material 10 can also be a polygonal shape other than a rectangle. Regardless of the cross-sectional shape of the base material 10, by covering the side surface of the region of the base material 10 passing through the guide hole with the protection member 50, damage to the probe 1 caused by contact with the side surface of the guide hole can be suppressed. Moreover, by dividing the protection member 50 passing through the same guide hole into multiple parts, the occurrence of warping of the probe 1 can be suppressed.

[0060] In addition, the case where the probe head 20 includes three guide plates has been described, but the number of guide plates of the probe head 20 is not limited to three. For example, the number of guide plates of the probe head 20 can also be two, or four or more. Preferably, regardless of the number of guide plates of the probe head 20, a protection member 50 is formed on the side surface of the region of the base material 10 passing through the guide holes of each guide plate, and the protection member 50 passing through the same guide hole is divided into multiple parts.

[0061] Thus, the present invention naturally includes various embodiments not described above and the like.

[0062] Description of reference numerals

[0063] 1. Probe; 10. Base material; 15. Convex part; 20. Probe head; 21. First guide plate; 22. Second guide plate; 23. Third guide plate; 30. Substrate; 31. Connecting pad; 50. Protective member; 60. Coating member; 501. First protective member; 502. Second protective member; 503. Third protective member; 50A. First protective part; 50B. Second protective part; 100. Electrical connection device.

Claims

1. A probe is inserted into a guide hole of a guide plate included in a probe head and held by the probe head, and is used for inspecting the electrical characteristics of an object to be inspected. Among them, The probe includes: A columnar base material; and A protective member that covers at least a part of the side surface of the region where the base material passes through the guide hole. The hardness of the protective member is higher than that of the base material. The protective member covering the region where the base material passes through the same guide hole is divided into a plurality of parts along the axial direction of the base material.

2. The probe according to claim 1, wherein, The protective member is divided such that the region where the base material passes through the opening of the guide plate is covered by the protective member.

3. The probe according to claim 1, wherein, The cross-section of the base material perpendicular to the axial direction is rectangular, At least three side surfaces of the base material are covered by the protective member.

4. The probe according to claim 1, wherein, A convex portion extending along the axial direction is formed on the side surface of the base material, The protective member is disposed on the base material so as to cover the surface of the convex portion including the end surface facing the axial direction.

5. An electrical connection device, wherein, The electrical connection device includes: The probe according to any one of claims 1 to 4; and The probe head having a structure in which a first guide plate and a second guide plate each formed with the guide hole are disposed separately, The probe is inserted into the guide hole and held by the probe head, For the guide hole penetrated by the same probe, the position of the guide hole of the second guide plate is offset and disposed in a direction parallel to the main surface of the first guide plate and offset in the offset direction, The probe is held in a bent state between the first guide plate and the second guide plate.

6. The electrical connection device according to claim 5, wherein, The cross-section of the base material of the probe perpendicular to the axial direction is rectangular, One of the side surfaces of the base material facing the direction parallel to the offset direction is covered by the protective member, and the other is not covered by the protective member.

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