Manufacturing method of LED high-precision metal groove

Abstract

The invention discloses a manufacturing method of an LED high-precision metal groove, and relates to the technical field of LED production and manufacturing, and the method comprises the steps of pre-coating treatment, positioning setting, clamping plate clamping structure setting, cutter parameter setting, machining parameter setting, milling machining and quality detection. A cutter with a specific diameter is selected, a specific feeding path and a segmented progressive cutting mode are set, and a multi-layer clamping plate clamping structure is combined to enhance clamping force and clamping stability, so that the machining stability and the precision of a groove body formed by milling are remarkably improved, and the formation of burrs on the edge of the groove body is inhibited; the manufacturing method of the LED high-precision metal groove has the advantages of being high in process controllability, high in yield and wide in adaptability, and is suitable for batch processing of high-precision LED packaging substrates; the technical problems that according to an existing machining method for manufacturing an LED metal groove through a BT plate, a machined gong groove is prone to deformation, and copper burrs are generated on the edge of the groove are solved.

Description

Technical Field

[0001] The invention relates to the technical field of LED production and manufacturing, and in particular to a method for manufacturing a high-precision metal groove of an LED. Background Art

[0002] With the rapid development of high-density interconnect (HDI) multilayer printed circuit boards and high-performance packaging substrates, BT resin substrate materials (Bismaleimide Triazine) have been widely used in high-frequency and high-speed circuits and LED packaging applications due to their excellent electrical properties and thermal stability; resin substrates have high glass transition temperature (Tg = 255-330°C), good heat resistance (160-230°C), excellent moisture resistance, low dielectric constant (Dk) and low dissipation factor (Df). While meeting the needs of miniaturization and high integration, they also put forward higher requirements for subsequent precision processing technology.

[0003] In the structural design of LED metal grooves, in order to achieve precise optical structure coordination and effective thermal management, it is often necessary to perform micro-groove processing on the PCB substrate of BT sheet material with a thickness of only 0.10mm to form a light guide path or a structure for placing reflective components.

[0004] At present, the processing technologies of LED metal slots include mechanical milling and laser etching. Mechanical milling optimizes processing accuracy by adjusting tool parameters such as spindle speed, feed rate and path planning, but it is easy to cause slot deformation or copper foil tearing at the slot edge (i.e. "copper burr") due to the superposition of tool thermal stress and mechanical stress on ultra-thin BT sheets; in addition, the rigidity of high Tg materials will aggravate local stress concentration during cutting, further causing microcracks or delamination defects; although laser etching can reduce mechanical contact stress, high-energy lasers may cause carbonization of BT sheets or degradation of dielectric properties, and the equipment cost and processing efficiency are difficult to meet the needs of large-scale production.

[0005] In order to maintain the low dielectric constant and low loss factor characteristics of BT sheets, the existing LED metal slot processing technology mainly adopts conventional CNC milling methods, combined with multi-layer lamination anti-deformation fixtures or relying on reducing the feed speed to alleviate stress concentration, but it is still difficult to achieve ideal results in high-precision, small structural feature processing; in addition, some processes increase auxiliary cooling or chemical post-treatment to remove the flash, but the operation is cumbersome and there are constraints on cost and yield.

[0006] Therefore, how to explore a method for manufacturing LED metal troughs with high structural stability, good processing precision and effective control of trough deformation, structural warping and copper burring without sacrificing the characteristics of BT sheets has become a key technical problem that needs to be urgently solved in the industry.

[0007] In summary, it is found that the prior art has at least the following technical problems:

[0008] The existing processing method of making LED metal grooves from BT sheet materials is likely to cause technical problems such as easy deformation of the milled grooves and copper burrs on the groove edges, which affect wire connection and finished product quality in the subsequent production of LED metal grooves. Summary of the Invention

[0009] The purpose of the present invention is to provide a method for making a high-precision LED metal groove to solve the technical problems of the existing processing method of making LED metal grooves from BT sheet materials, which are likely to cause easy deformation of the milled grooves and copper burrs on the groove edges, affecting wire connection and finished product quality in the subsequent production of LED metal grooves.

[0010] The many technical effects that can be produced by the preferred technical solutions among the many technical solutions provided by the present invention are described in detail below.

[0011] To solve the above technical problems, the present invention provides the following technical solutions:

[0012] The present invention provides a method for making a high-precision LED metal groove, including the following steps: S1. Pretreatment: Select a PCB board made of BT sheet material with a thickness of 0.10 mm as the processing object; perform pre-coating treatment on the PCB board using a pre-coated material;

[0013] S2. Positioning setting: Set 2 - 3 positioning holes on the long sides and short sides of each set of panels of the PCB board respectively, and use precision pins in combination with a negative pressure adsorption device for positioning and fixing;

[0014] S3. Clamping plate setting: Stack the cardboard, cold punching plate, PCB board, cold punching plate, and cover plate in sequence. The thickness of the cover plate is greater than 2.0 mm, and both the cold punching plate and the cover plate are provided with anti-slip layers;

[0015] S4. Tool parameter setting: Use a cemented carbide tool with a diameter more than 0.10 mm smaller than the target milling groove width for milling, and set the cutting path to a back-and-forth G40 feed; the tool's cutting-in position and starting position are set at both ends inside the length direction of the target milling groove and at the center positions on both sides of the groove width;

[0016] S5. Processing parameter setting: The cutting path is to set a slow-in section at the cutting-in position, a slow-out section at the starting position, and segmented progressive cutting during cutting, and control the spindle speed to match the feed speed to reduce stress concentration on the plate and inhibit the formation of burrs on the groove edges;

[0017] S6. Milling processing;

[0018] S7. Quality inspection;

[0019] Each processing is carried out in sequence according to the above steps S1 to S7 for producing high-precision metal grooves for LEDs.

[0020] In one embodiment, the cutting tool is a three-edge superhard alloy coated cutting tool, and the rotational speed of the cutting tool is controlled between 30000 and 60000 RPM, and the feed speed is controlled within the range of 20 to 50 mm / s.

[0021] In one embodiment, the segmented progressive control of the cutting depth of the cutting tool does not exceed 30% of the total plate thickness for each progression, and a buffer corner is provided to reduce the impact force of the cutting tool.

[0022] In one embodiment, the cold punching plate is composed of a high-strength cold-rolled steel plate with a thickness of 1.0 to 1.5 mm and an earthquake-resistant foam with a thickness of 0.5 to 1.0 mm laminated together. The surface of the earthquake-resistant foam is provided with micro-concave structures to enhance the friction force; one side of the earthquake-resistant foam of the cold punching plate faces the PCB board, and an anti-slip layer is pasted on the side facing away from the PCB board.

[0023] In one embodiment, the material of the cover plate is a cemented carbide plate or an aluminum alloy plate, the surface roughness Ra is not greater than 0.8 μm, and an anti-slip layer is pasted on the side close to the surface of the PCB board.

[0024] In one embodiment, the pre-coated material is a polyimide film with a thickness of 20 to 40 μm, and it is pressed on both sides of the PCB board by a constant temperature pressing device at a pressure of 0.2 to 0.5 MPa.

[0025] In one embodiment, the negative pressure adsorption device is arranged below the processing platform, the adsorption pressure is controlled between -0.06 and -0.09 MPa, and a constant negative pressure is maintained throughout the milling process.

[0026] In one embodiment, before the pre-coating treatment in step S1, the PCB board is dried at a drying temperature of 100 to 130 °C for 30 to 40 minutes to reduce the influence of moisture on processing deformation.

[0027] In one embodiment, after the milling process in step S6 is completed, step S7 quality inspection is entered. The online optical detection system is used to detect the outer contour and burr residue of each milled and formed target groove, and the detection accuracy is not lower than ±10 μm.

[0028] In one embodiment, during the milling process of the milling process in step S6, the milling control is scheduled by a database integrating processing parameters. The database automatically matches the optimal processing parameters according to the PCB board thickness, Tg value, copper layer thickness and tool diameter.

[0029] The beneficial effects of the present invention are as follows:

[0030] The present invention provides a method for manufacturing an LED high-precision metal groove on a PCB board suitable for an ultra-thin BT sheet material with a thickness of only 0.10 mm. Aiming at the problems of groove deformation and copper burrs on the groove edge existing in the existing processing technology, a method combining structural combination optimization and precise control of process parameters is adopted to significantly improve the milling quality and process stability of the metal groove, and has the following beneficial effects:

[0031] (1) Effectively prevent groove deformation: By setting multi-point positioning holes before processing and combining precise pins and a negative pressure adsorption device for composite positioning, the position of the thin PCB board can be stabilized during processing, preventing structural deformation caused by displacement and stress concentration;

[0032] (2) Significantly reduce copper burrs on the groove edge: Adopt carbide tools with precisely controlled diameters, combined with slow-in, slow-out paths and progressive cutting depth control, to achieve gradient adjustment of cutting force and stress distribution, effectively suppressing the generation of copper burrs on the groove edge during processing;

[0033] (3) Improve stability: Introduce a multi-layer clamping structure of cardboard, cold stamping plate and cover plate. Especially when the thickness of the cover plate is set to be greater than 2.0 mm, combined with the anti-slip layer design, it further improves the processing rigidity, prevents vibration and material slippage, and improves the groove shape consistency and accuracy of the target groove;

[0034] (4) Enhance adaptability and practicability: This method is applicable to BT resin substrates and high-Tg materials, taking into account the requirements of high-precision processing and high-temperature performance. The overall process has strong versatility and meets the precision and quality requirements of various LED packaging structures for metal grooves;

[0035] (5) Facilitate automated integration and quality control: The standardization degree of steps S1 to S7 in the method is high, which is convenient for integrating automated control and quality inspection systems on the production line. While improving production efficiency, it can also significantly reduce the defective rate.

[0036] Therefore, the method of the present invention can fundamentally overcome the main defects of groove deformation and copper burrs on the groove edge in the existing BT board milling process, and has the technical advantages of reasonable clamping structure, precise milling control and high reliability. It is suitable for high-precision packaging applications of LEDs and has significant technical progressiveness and industrial practical value. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions of the present invention, the drawings required for implementation will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0038] Figure 1 It is a schematic flow chart of the manufacturing method of the LED high-precision metal groove of the present invention;

[0039] Figure 2 It is a schematic cutting path diagram of the manufacturing method of the LED high-precision metal groove of the present invention. Specific embodiments

[0040] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention.

[0041] A manufacturing method of an LED high-precision metal groove is provided in the specific embodiments. The steps included in this method are pre-cladding treatment, positioning setting, clamping structure setting of splints, tool parameter setting, machining parameter setting, milling machining, and quality inspection steps; by selecting a tool with a specific diameter, setting a specific tool path and a segmented progressive cutting method, and combining a multi-layer splint clamping structure to enhance the clamping force and clamping stability, the machining stability and the accuracy of the groove formed by milling are significantly improved, and the formation of burrs on the edges of the groove is inhibited; this manufacturing method of the LED high-precision metal groove has the advantages of strong process controllability, high yield, and wide adaptability, and is suitable for batch processing of high-precision LED packaging substrates; it effectively solves the technical problems that the existing machining method for manufacturing the LED metal groove on the BT board material is prone to deformation of the milled groove and the generation of copper burrs on the groove edge, which affects the wire connection and the finished product quality in the subsequent production of the LED metal groove.

[0042] The first embodiment of the manufacturing method of the LED high-precision metal groove is as Figure 1 shown, and it includes the following steps: S1. Pretreatment: Select a PCB board made of BT board material with a thickness of 0.10 mm as the processing object; use a pre-cladding material to perform pre-cladding treatment on the PCB board;

[0043] S2. Positioning setting: Set 2 to 3 positioning holes on the long side and short side of each set of panels of the PCB board respectively, and use precision pins and a negative pressure adsorption device for positioning and fixing;

[0044] S3. Splint setting: Stack the cardboard, cold stamping plate, PCB board, cold stamping plate, and cover plate in sequence. The thickness of the cover plate is greater than 2.0 mm, and the cold stamping plate and the cover plate are both provided with anti-slip layers;

[0045] S4. Tool parameter setting: Use a cemented carbide tool with a diameter more than 0.10 mm smaller than the target milling groove width for milling; as Figure 2 shown, the cutting path is set to G40 feed back and forth, and the tool's down-cut position and start position are set at both ends in the length direction of the target milling groove and at the center positions on both sides of the groove width;

[0046] S5. Machining parameter setting: The cutting path is set with a slow approach section at the tool entry position, a slow exit section at the tool start position, and segmented progressive cutting during machining. The spindle speed and feed rate are controlled to match each other to reduce the stress concentration on the board and inhibit the formation of burrs on the slot edge.

[0047] S6. Milling machining; S7. Quality inspection.

[0048] As Figure 1 shown, each machining is carried out in sequence according to the above steps S1 to S7 for producing high-precision metal slots for LED.

[0049] The present invention provides a method for manufacturing high-precision metal slots for PCB boards applicable to ultra-thin BT board materials with a thickness of only 0.10 mm. Aiming at the problems of slot deformation and copper burrs on the slot edge existing in the existing processing technology, a combination of structural combination optimization and precise control of process parameters is adopted to significantly improve the milling machining quality and process stability of metal slots, and has the following advantages: effectively preventing slot deformation: By setting multi-point positioning holes before machining and combining precise pins and a negative pressure adsorption device for composite positioning, the position of the thin PCB board can be stabilized during machining, preventing structural deformation caused by displacement and stress concentration;

[0050] significantly reducing copper burrs on the slot edge: Using carbide tools with precisely controlled diameters, combined with slow approach and slow exit paths and progressive cutting depth control, realizing gradient adjustment of cutting force and stress distribution, effectively inhibiting the generation of copper burrs on the slot edge during machining;

[0051] enhancing stability: Introducing a multi-layer clamping structure of cardboard, cold punching plate and cover plate, especially setting the thickness of the cover plate greater than 2.0 mm, combined with the anti-slip layer design, further enhancing the machining rigidity, preventing vibration and material slip, and improving the slot shape consistency and accuracy of the target slot;

[0052] enhancing adaptability and practicability: This method is applicable to BT resin substrates and materials with high Tg, taking into account both high-precision machining requirements and high-temperature performance requirements. The overall process has strong versatility and meets the accuracy and quality requirements of various LED packaging structures for metal slots;

[0053] facilitating automated integration and quality control: The standardization degree of steps S1 to S7 in the method is high, which is convenient for integrating automated control and quality inspection systems on the production line. While improving production efficiency, it can also significantly reduce the defective rate.

[0054] In summary, the method of the present invention can fundamentally overcome the main defects of slot deformation and copper burrs on the slot edge in the existing BT board milling machining, has technical advantages of reasonable clamping structure, precise milling control and high reliability, is suitable for high-precision packaging applications of LED, and has significant technical progressiveness and industrial practical value.

[0055] As one of the optional implementation manners:

[0056] Regarding the selection of the cutting tool and the setting of the machining parameter control in the above step S4, the cutting tool is a three-edge superhard alloy coated tool, the rotation speed of the cutting tool is controlled between 30000 and 60000 RPM, and the feed speed is controlled within the range of 20 to 50 mm / s.

[0057] Specifically, for the segmented progressive control of the cutting depth of the cutting tool, the progressive depth of each segment does not exceed 30% of the total board thickness, and a buffer corner is provided to reduce the impact force of the cutting tool.

[0058] During application, a three-edge superhard alloy coated tool is selected, which has high wear resistance and thermal stability and is suitable for precision milling of high-Tg and high-hardness BT board materials; its rotation speed is set between 30000 and 60000 RPM, and the feed speed is controlled between 20 and 50 mm / s, which can avoid the generation of burrs on the groove edge caused by tool overload or low-speed biting while ensuring the cutting efficiency; through the segmented progressive cutting method, the cutting depth of each segment does not exceed 30% of the total board thickness, ensuring the uniform release of machining stress. With the path setting of the buffer corner, the instantaneous impact force is effectively reduced, preventing tool breakage or damage to the cutting groove edge; thereby improving the cutting stability of the cutting tool in step S6, reducing burrs, prolonging the tool life, and solving the problems of easy curling at the edge of the BT board and unstable groove shape in traditional high-speed machining.

[0059] In addition, a spindle dynamic load monitoring module of the milling machine tool can be set in step S6, and the cutting depth and feed rate of the cutting tool are adjusted according to the real-time feedback of the dynamic load.

[0060] Regarding the specific setting of using a clamping plate to form a multi-layer clamping structure in the above step S3, the cold punching plate is composed of a high-strength cold-rolled steel plate with a thickness of 1.0 to 1.5 mm and a seismic foam with a thickness of 0.5 to 1.0 mm. The surface of the seismic foam is provided with a micro-concave structure to enhance the friction force; one side of the seismic foam of the cold punching plate faces the PCB board, and an anti-slip layer is pasted on the side facing away from the PCB board.

[0061] The material of the cover plate is a cemented carbide plate or an aluminum alloy plate, the surface roughness Ra is not greater than 0.8 μm, and an anti-slip layer is pasted on the side close to the surface of the PCB board.

[0062] During application, the cold punching plate of the multi-layer clamping structure adopts a composite form of "high-strength cold-rolled steel plate + anti-seismic foam", with the total thickness controlled between 1.5 and 2.5 mm, effectively improving the rigidity in the vertical direction and absorbing the vibration of the machine tool; one side of the anti-seismic foam faces the PCB board and has a micro-concave friction structure, which can prevent local slippage of the PCB board to be processed; on the side of the cold punching plate facing away from the PCB, an anti-slip layer is attached to ensure stable contact with the cover plate and improve the stability between the cover plate and the cold punching plate; the cover plate is made of cemented carbide or aluminum alloy, and its high flatness surface with Ra ≤ 0.8 μm ensures the uniformity of the pressing force transmitted by the tool to the cover plate and the cold punching plate during processing. Attaching the anti-slip layer can prevent the relative movement of the cardboard, cold punching plate, and cover plate in the upper and lower layers; thereby improving the lamination rigidity and clamping stability of the multi-layer clamping structure, ensuring that the groove body does not twist during processing, and solving the problems of warping, displacement, or clamping slippage of the PCB board of the BT sheet due to uneven stress.

[0063] Among them, a heat conduction layer and a pressure distribution film can be arranged between the cardboard and the cold punching plate, and between the cover plate and the cold punching plate in the multi-layer clamping structure to improve the overall heat field distribution during cutting by the tool, and further reduce the characteristics of low dielectric and low loss factors of the PCB board of the BT sheet material changed due to heat generation during processing.

[0064] Regarding the specific setting of the pre-coating treatment of the PCB board in the above step S1, the pre-coating material is a polyimide film with a thickness of 20 - 40 μm, and it is pressed onto both sides of the PCB board with a pressure of 0.2 - 0.5 MPa through a constant temperature pressing device.

[0065] During application, by thermally pressing the polyimide film onto both sides of the PCB board, a physical buffer layer and a thermal protection layer can be formed before processing; this film layer not only enhances the integrity of the groove edge when cutting the groove body on the PCB board, but also can reduce the mechanical tearing tendency of the groove edge during the cutting tool entering and exiting process, reduce the generation of burrs on the groove edge, and at the same time inhibit the extension of local burrs on the groove edge. In addition, the polyimide film has high heat resistance and will not soften and deform under the processing heat; thereby improving the edge strength of the cut groove body, reducing the extension of burrs and the thermal stress deformation of the PCB board, and solving the problem of burrs pulling the copper foil and forming "flashing" during the processing.

[0066] Among them, polyimide films with different thicknesses can be selected to adapt to different combinations of groove depths and tool diameters, providing targeted protection for the groove edges of different PCB boards under different cutting stresses when processing grooves of different sizes.

[0067] Regarding the specific setting of the negative pressure adsorption positioning of the PCB board in the above step S2, the negative pressure adsorption device is arranged under the processing platform, and the adsorption pressure is controlled between -0.06 and -0.09 MPa, and a constant negative pressure is maintained throughout the milling process.

[0068] During application, a constant-pressure negative-pressure adsorption device is set below the processing platform, and the pressure range is controlled between -0.06 and -0.09 MPa, which can continuously provide a stable adsorption force field. Cooperating with the pin auxiliary positioning device, it can double-prevent the multi-layer clamping device for clamping the PCB board from displacement, warping or vibration during the milling process; the negative-pressure system of the negative-pressure adsorption device is controlled by a dedicated electric control pump unit, and has a real-time pressure feedback adjustment function, which can ensure that the multi-layer clamping device for clamping the large-area PCB board is evenly stressed, thus ensuring the positioning stability of the large-area PCB board during processing; realizing the stable positioning of the thin high-Tg board during processing, and solving the problems of unstable fixing and easy slipping during processing in the traditional adhesive pasting and fixing method.

[0069] Since the PCB board is a BT resin substrate and a high-Tg material, in order to reduce the phenomenon of deformation generated during processing due to the material itself, before the pre-coating treatment in step S1, the PCB board is dried, the drying temperature is 100-130 °C, and the drying time is 30-40 minutes, which is used to reduce the influence of moisture on processing deformation.

[0070] During application, before processing, the selected BT board PCB board is placed in a drying device at 100-130 °C in advance for 30-40 minutes of heat drying treatment, which can effectively remove the trace moisture inside the PCB board and prevent the expansion and warping caused by the evaporation of moisture excited by processing heat; this drying step can significantly improve the dimensional stability of the material, especially suitable for humidity-sensitive BT board materials; effectively reducing the influence of the moisture inside the PCB board on the deformation of the PCB board during processing, which is beneficial to improving the flatness of the processed groove body, and solving the problems of bulging during processing and slot edge cracking caused by internal moisture of the BT board PCB board.

[0071] Among them, before drying, the wet ratio of the PCB board to be processed can be measured, and combined with the moisture content of the board material, the drying duration of the PCB board by the drying device can be set intelligently.

[0072] Regarding the specific operation settings of the quality inspection in step S7 above, after the milling process in step S6 is completed, step S7 quality inspection is entered, and the online optical inspection system is used to detect the outer contour and burr residue of each milled target groove body, and the detection accuracy is not less than ±10 μm.

[0073] During application, an online optical detection system is used to perform contour scanning, dimension measurement, and burr residue detection on each processed metal groove. The detection accuracy is controlled within ±10μm, enabling automatic burr identification and warning feedback, facilitating subsequent groove trimming or rejection of defective products for the PCB board. Moreover, the set detection data can be uploaded to the system server in real time for production statistics and process optimization tracking, realizing traceability of product processing data. This is conducive to comprehensively controlling the quality consistency of the processed PCB boards, improving the yield of the groove products of the PCB boards, solving the problems of missing burrs or groove deviation during manual visual inspection, and reducing the rework rate and the outflow rate of defective products.

[0074] Since the processing parameter setting step in step S5 only gives the control rules for the cutting path, spindle speed, and feed rate, the specific processing parameter setting in the milling process of the above step S6 is as follows: During the milling process of step S6, the milling control is scheduled by a database integrating processing parameters. The database automatically matches the optimal processing parameters according to the PCB board thickness, Tg value, copper layer thickness, and tool diameter.

[0075] During application, the milling process of step S6 is connected to the processing parameter database system. The system stores standard models related to processing results such as different PCB board thicknesses, Tg values, copper layer thicknesses, and tool diameters, and can automatically match the processing parameter combinations of the optimal path, speed, feed, and cooling mode to achieve one-key scheduling and personalized processing. Through the auxiliary optimization of the processing process by the database integrating processing parameters, the dependence on the experience of technicians can be significantly reduced, the scientificity and consistency of parameter setting can be improved, the volatility of parameter setting can be reduced, thereby improving the standardization of the PCB board product process and reducing quality fluctuations. It can also enhance process stability and replicability, reduce the process debugging costs for processing PCB boards with different thicknesses, different depths of grooves, and different lengths of grooves, and solve the problem of out-of-control milling quality of grooves caused by inconsistent parameters of multiple batches of PCBs.

[0076] In addition, the database can be embedded with a self-learning module to continuously update the optimal process data for improving the adaptation range of the processing parameters of PCB boards with different processing requirements.

[0077] The technical features of the above embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above embodiments are described.

Claims

1. A manufacturing method of an LED high-precision metal groove, characterized in that It includes the following steps: S1. Pretreatment: Select a PCB board made of a BT board with a thickness of 0.10 mm as the processing object; use a pre-coated material to perform pre-coating treatment on the PCB board. S2. Positioning setting: Set 2 - 3 positioning holes on the long and short sides of each set of panel boards of the PCB board respectively, and use precision pins in cooperation with a negative pressure adsorption device for positioning and fixing. S3. Clamping plate setting: Stack the cardboard, cold punching plate, PCB board, cold punching plate and cover plate in sequence. The thickness of the cover plate is greater than 2.0 mm, and anti-slip layers are provided on both the cold punching plate and the cover plate. S4. Tool parameter setting: Use a cemented carbide tool with a diameter more than 0.10 mm smaller than the target milling groove width for milling. The cutting path is set to move back and forth in G40 feed, and the tool's down-cut position and start-cut position are set at both ends in the length direction of the target milling groove and at the center positions on both sides of the groove width. S5. Processing parameter setting: The cutting path is to set a slow feed section at the down-cut position, a slow out section at the start-cut position, and perform segmented progressive cutting during cutting, and control the spindle speed to match the feed speed to reduce the stress concentration of the board and inhibit the formation of burrs on the groove edge. S6. Milling processing; S7. Quality inspection; Each processing is carried out in sequence according to the above steps S1 to S7 for producing high-precision metal grooves for LEDs.

2. The manufacturing method of the high-precision metal groove for LEDs according to claim 1, wherein the tool is a three-edge super-hard alloy coated tool, the rotation speed of the tool is controlled between 30000 - 60000 RPM, and the feed speed is controlled within the range of 20 - 50 mm / s.

3. The manufacturing method of the high-precision metal groove for LEDs according to claim 1, wherein the segmented progressive control of the tool cutting depth does not exceed 30% of the total board thickness for each progressive segment, and a buffer corner is provided to reduce the tool impact force.

4. The manufacturing method of the high-precision metal groove for LEDs according to claim 1, wherein the cold punching plate is composed of a high-strength cold-rolled steel plate with a thickness of 1.0 - 1.5 mm and a shock-resistant foam with a thickness of 0.5 - 1.0 mm laminated together. The surface of the shock-resistant foam is provided with a micro-concave structure to enhance the friction force; the side of the shock-resistant foam of the cold punching plate faces the PCB board, and an anti-slip layer is pasted on the side facing away from the PCB board.

5. The manufacturing method of the high-precision metal groove for LEDs according to claim 1, wherein the cover plate is made of a cemented carbide plate or an aluminum alloy plate, the surface roughness Ra is not greater than 0.8 μm, and an anti-slip layer is pasted on the side close to the surface of the PCB board.

6. The manufacturing method of the high-precision metal groove for LEDs according to claim 1, wherein the pre-coated material is a polyimide film with a thickness of 20 - 40 μm, and is pressed onto both sides of the PCB board through a constant temperature pressing device with a pressure of 0.2 - 0.5 MPa.

7. The manufacturing method of the high-precision metal groove for LEDs according to claim 1, wherein the negative pressure adsorption device is arranged below the processing platform, the adsorption pressure is controlled between -0.06 and -0.09 MPa, and a constant negative pressure is maintained throughout the milling process.

8. The manufacturing method of the high-precision metal groove for LEDs according to claim 1, wherein Before the pre - coating treatment in step S1, the PCB board is dried at a temperature of 100 - 130 °C for 30 - 40 minutes to reduce the influence of moisture on processing deformation.

9. The manufacturing method of the LED high - precision metal groove according to claim 1, wherein After the milling process in step S6 is completed, it enters step S7 for quality inspection. The online optical detection system is used to detect the outer contour and burr residue of each milled target groove, and the detection accuracy is not less than ±10 μm.

10. The manufacturing method of the LED high - precision metal groove according to claim 1, wherein During the milling process of step S6, the milling control is scheduled by a database integrating processing parameters. The database automatically matches the optimal processing parameters according to the PCB board thickness, Tg value, copper layer thickness and tool diameter.

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