Mainboard assembling machine
By designing the motherboard assembly machine, the cables on the motherboard are incorporated into the chamber using protective covers and driving mechanisms, the precise transfer and fixing of the motherboard is achieved, and the installation accuracy problem caused by wiring interference is solved and the assembly qualification rate is improved.
Patent Information
- Application Number
- CN202510416509.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2022-11-30
- Publication Date
- 2025-07-18
AI Technical Summary
In the process of assembly of the motherboard, the interference between the cable and the case causes the installation position to be inconsistent, affecting the installation accuracy, and even causing the product to be scrapped. The existing anti-interference method is only applicable to the situation where the motherboard is still.
A motherboard assembly machine is designed, including a carrier platform, a driving mechanism and an adsorption head. The cables on the motherboard are incorporated into the chamber through a protective cover, and the driving mechanism is used to achieve accurate transfer and fixation of the motherboard to avoid interference with the casing.
Ensure that the motherboard falls smoothly and accurately to the predetermined assembly position, improves the assembly qualification rate, solves the problem of wiring interference, and is suitable for the assembly process of the motherboard above the case.
Smart Images

Figure CN120326328A_ABST
Abstract
Description
[0001] This application is a divisional application of a Chinese application with the application number 202211527998.1, the application date of November 30, 2022, and the invention name of "A Main Board Assembly Machine". Technical Field
[0002] The present invention relates to the technical field of main board assembly, and particularly relates to a main board assembly machine. Background Art
[0003] With the rapid development of electronic product technology, the electronic product processing and manufacturing industry has also developed rapidly. In the electronic product processing and manufacturing industry, the assembly of the main board in various electronic products is an essential link. However, since the main board is equipped with a cable, when the main board is assembled into the mounting hole position of the chassis, the cable on the main board will interfere with the surrounding chassis entity part of the mounting hole position, resulting in the mounting position of the main board not matching the predetermined position, affecting the mounting accuracy, and even causing product scrapping.
[0004] Although there are currently methods to avoid cable interference, such as a positioning device and a positioning method disclosed in Patent No. CN202110476239.6B. The positioning device includes: "a pressing plate provided with a mounting hole and a tightening mechanism located on the pressing plate. The tightening mechanism includes a top block located in the mounting hole, an elastic member connected to the top block, and a driving component for driving the top block to move towards one side of the mounting hole.
[0005] The positioning method using the positioning device includes the following steps:
[0006] S1. First, load the main board into the main board carrier, and then install the pressing plate onto the main board carrier so that the pressing plate presses the cable on the main board, and the mounting hole corresponds to the main board;
[0007] S2. Place the vibrator on the main board through the mounting hole". However, the existing cable anti-interference method only applies to the case where the main board is in a stationary state during assembly, that is, the main board remains stationary while another fitting to be installed is assembled onto the main board. It is not applicable when the main board needs to be assembled onto another component. Summary of the Invention
[0008] In order to solve the above existing technical problems, the present invention proposes a main board assembly machine.
[0009] A main board assembly machine proposed by the present invention includes: a loading platform, a driving mechanism A, and a suction head for adsorbing the main board, where:
[0010] On the load platform, there are a chassis carrier for fixing the chassis, a main board carrier for fixing the main board, and a driving mechanism B arranged below the chassis carrier;
[0011] The middle part of the chassis carrier has a through hole, and inside the through hole, there is a protective cover that can pass through the installation hole position in the middle of the chassis;
[0012] The protective cover is connected to the driving mechanism B to be driven to move up and down by the driving mechanism B. The protective cover has a chamber for receiving the wiring harness on the main board, and the top of the protective cover is open to form a port;
[0013] The driving mechanism A is used to drive the suction head to move so as to transfer the main board on the main board carrier into the chassis in the chassis carrier.
[0014] Preferably, it further includes a wiring harness arrangement mechanism for arranging the wiring harness on the main board. The wiring harness arrangement mechanism includes a push block located on the outer periphery of the suction head and a power component A for driving the push block to telescopically move towards the suction head direction.
[0015] Preferably, the first driving mechanism A includes a first driving component for driving the suction head to horizontally move along the connection line direction between the chassis carrier and the main board carrier, and a second driving component for driving the suction head to reciprocally move in the vertical direction; the wiring harness arrangement mechanism is driven by the first driving component to move synchronously with the horizontal movement of the suction head.
[0016] Preferably, the wiring harness arrangement mechanism further includes an adapter plate. The adapter plate has a notch. The power component A is installed on the adapter plate to drive the push block to telescopically move towards the inner side of the notch. The adapter plate is connected to the first driving component; the suction head is driven by the second driving component to vertically move inside the notch.
[0017] Preferably, the first driving component includes a horizontal guide rail linearly arranged along the connection line direction between the chassis carrier and the main board carrier, a horizontal sliding seat slidably assembled with the horizontal guide rail, and a first driving part for driving the horizontal sliding seat to move back and forth on the horizontal guide rail; the adapter plate is installed on the horizontal sliding seat to move along with the movement of the horizontal sliding seat; the second driving component includes a vertical guide rail vertically fixed on the horizontal sliding seat, a vertical sliding seat slidably assembled on the vertical guide rail, and a second driving part for driving the vertical sliding seat to move back and forth on the vertical guide rail; the suction head is installed on the vertical sliding seat to move along with the movement of the vertical sliding seat.
[0018] Preferably, a driving mechanism C is further provided on the loading platform and below the housing carrier. A wire arranging press head is further provided between the protective cover and the inner side wall of the through hole. The wire arranging press head is connected to the driving mechanism C and is driven by the driving mechanism C to horizontally move towards the inner side wall of the through hole.
[0019] Preferably, a plurality of the wire arranging press heads are provided and are arranged along the circumference of the through hole.
[0020] Preferably, when the adsorption surface of the adsorption head sucks the main board, the contour edge of the adsorption surface is inside the contour edge of the main board to form a pressing area between the outside of the adsorption surface and the contour edge of the main board. A pressing assembly and a driving mechanism D for driving the pressing assembly to move towards the housing carrier are further provided on the loading platform and on one side of the housing carrier. The pressing assembly includes a pressing head located above the pressing area and a power component B for driving the pressing head to move up and down.
[0021] Preferably, the pressing head includes a substrate and a pressing head vertically fixed at the lower end of the substrate. The side of the substrate opposite to the through hole has a lateral opening for the lateral entry of the adsorption head. The pressing head is arranged along the inner side wall of the lateral opening. The inner side wall of the lateral opening has a continuously extending portion extending vertically downward to form the pressing head. A plurality of the pressing heads are provided, and the pressing heads are arranged at intervals along the inner peripheral wall of the lateral opening.
[0022] Preferably, the port shape of the protective cover is adapted to the shape of the main board, so that when the port of the protective cover contacts the main board, the contour edge of the port is inside the contour edge of the main board. The end edge of the port of the protective cover has a contact surface abutting against the main board and a relief notch A lower than the contact surface. The position of the relief notch A is adapted to the position of the wire arrangement on the main board, so that when the main board is placed on the upper end of the protective cover, the relief notch A forms a relief for the wire arrangement on the main board and the port contacts the lower end surface of the main board.
[0023] Preferably, an upper detection mechanism for detecting whether the upper surface of the main board is qualified is provided on one side of the adsorption head. The driving mechanism A is used to drive the adsorption head and the upper detection mechanism to move synchronously. A lower detection mechanism for detecting whether the lower surface of the main board is qualified is provided below the moving track of the adsorption head.
[0024] Preferably, it further includes a workbench and a driving mechanism D. The workbench has a loading station and an assembly station. The driving mechanism D is used to drive the loading platform to reciprocate between the loading station and the assembly station. The adsorption head is located above the assembly station.
[0025] In the present invention, the chassis carrier and the main board carrier are respectively used to hold the chassis and the main board to be assembled. During assembly, the suction head, driven by the driving mechanism A, completes the adsorption and transfer of the main board. When the main board is moved by the suction head above the chassis, the protective cover rises under the drive of the driving mechanism B and passes through the chassis until the main board together with the wiring harness on the main board is covered in its chamber. Subsequently, the protective cover and the suction head move downward synchronously until the main board falls onto the chassis. At this time, the protective cover moves downward and the suction head moves upward to release the restriction on the main board. Finally, the two are fixed together with locking screws. This main board assembly machine can use the protective cover to bind the wiring harness on the main board before the main board is inserted into the chassis, avoiding interference between the main board and the chassis when the main board is inserted into the chassis, ensuring that the main board smoothly and accurately falls to the predetermined assembly position, and guaranteeing the qualification rate of the assembly. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 FIG. is a schematic structural diagram of a main board assembly machine proposed by the present invention.
[0027] Figure 2 FIG. is a schematic structural diagram of the loading platform and the driving mechanism E in a main board assembly machine proposed by the present invention.
[0028] Figure 3 FIG. is a schematic structural diagram of the wiring harness arrangement mechanism in a main board assembly machine proposed by the present invention.
[0029] Figure 4 FIG. is a schematic structural diagram of the loading platform in a main board assembly machine proposed by the present invention.
[0030] Figure 5 FIG. is a partially enlarged view of the chassis carrier and the main board carrier in a main board assembly machine proposed by the present invention.
[0031] Figure 6 FIG. is a partially enlarged view of the protective cover in a main board assembly machine proposed by the present invention.
[0032] Figure 7 FIG. is a schematic structural diagram of the loading platform after removing the chassis carrier in a main board assembly machine proposed by the present invention.
[0033] Figure 8 FIG. is a schematic structural diagram of the loading platform after removing the chassis carrier from a bird's-eye view in a main board assembly machine proposed by the present invention.
[0034] Figure 9 FIG. is a schematic structural diagram of the pressing component in a main board assembly machine proposed by the present invention. DETAILED DESCRIPTION OF THE INVENTION
[0035] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only for explaining the present invention, rather than limiting the present invention. In addition, it should be noted that for the convenience of description, only parts related to the present invention rather than all structures are shown in the drawings.
[0036] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.
[0037] In the present invention, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "above", and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "below", and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.
[0038] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "left", "right", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention. In addition, the terms "first" and "second" are only used for distinction in description and have no special meanings.
[0039] Refer to Figure 1 , a main board assembly machine proposed by the present invention includes: a loading platform 1, a driving mechanism A 2, a workbench 7, a driving mechanism E 17, an adsorption head 3 for adsorbing the main board, and a wire arrangement mechanism for arranging the wires on the main board. Among them: the workbench 7 has a loading station and an assembly station, and the driving mechanism E 17 is used to drive the loading platform 1 to reciprocate between the loading station and the assembly station.
[0040] Refer to Figure 2, a housing carrier 4 for fixing the housing, a main board carrier 5 for fixing the main board, and drive mechanisms B and C disposed below the housing carrier 4 are provided on the load platform 1; the housing carrier 4 has a housing groove matching the shape of the housing and clamping jaws disposed outside the housing groove to form clamping on the housing in the groove; the main board carrier 5 has a receiving groove, the receiving groove includes the main board groove matching the shape of the main board and a wire harness receiving groove located at the side of the main board groove for receiving the wire harness on the main board, and a suction cup for adsorbing the main board is provided at the bottom of the main board groove. During the working process, when the load platform 1 is at the loading station, the staff places the housing to be assembled and the main board in the housing carrier 4 and the main board carrier 5 respectively, and then the drive mechanism E7 drives the load platform 1 loaded with the housing and the main board to the assembly station for assembly. And a position sensor 15 for detecting whether the suction head 3 is in place is provided on the load platform 1 and outside the housing carrier 4.
[0041] The suction head 3 is located above the assembly station. The first drive mechanism A2 includes a first drive component 201 for driving the suction head 3 to horizontally move along the connection line direction of the housing carrier 4 and the main board carrier 5 and a second drive component 202 for driving the suction head 3 to reciprocate vertically.
[0042] Refer to Figure 3, the cable arranging mechanism is driven by the first driving component 201 to move synchronously with the horizontal movement of the suction head 3. The cable arranging mechanism includes a push block 9 located on the outer periphery of the suction head 3 and a power component A10 for driving the push block 9 to telescopically move towards the suction head 3. Specifically, the adapter plate 11 has a notch, and the power component A10 is installed on the adapter plate 11 to drive the push block 9 to telescopically move towards the inner side of the notch. The adapter plate 11 is connected to the first driving component 201; the suction head 3 is driven by the second driving component 202 to move vertically inside the notch. Further specifically, the first driving component 201 includes a horizontal guide rail 2011 linearly arranged along the connection direction of the machine shell carrier 4 and the main board carrier 5, a horizontal sliding seat 2012 slidably assembled with the horizontal guide rail 2011, and a first driving part for driving the horizontal sliding seat 2012 to move back and forth on the horizontal guide rail 2011; the adapter plate 11 is installed on the horizontal sliding seat 2012 to move with the movement of the horizontal sliding seat 2012; the second driving component 202 includes a vertical guide rail vertically fixed on the horizontal sliding seat 2012, a vertical sliding seat slidably assembled on the vertical guide rail, and a second driving part for driving the vertical sliding seat to move back and forth on the vertical guide rail; the suction head 3 is installed on the vertical sliding seat to move with the movement of the vertical sliding seat. During the assembly process, the first driving component 201 and the second driving component 202 of the first driving mechanism A2 cooperate with each other to drive the suction head 3 to move to the main board carrier 5 to suck the main board on the main board carrier 5 and transfer it above the machine shell carrier 4; at this time, the second driving component 202 alone drives the suction head 3 to move to the position where the cable arranging mechanism is located, and the power component A10 in the cable arranging mechanism pushes the push block 9 towards the suction head 3 to push the cable on the main board towards its central part, so as to achieve the purpose of arrangement, and then ensure that the cable can be smoothly incorporated into the protective cover 6.
[0043] Refer to Figures 4 - 6, a through hole is provided in the middle of the housing carrier 4. Inside the through hole, a protective cover 6 capable of passing through the mounting hole position in the middle of the housing and a wire harness pressing head 8 arranged between the protective cover 6 and the inner side wall of the through hole are provided. The protective cover 6 is connected to the driving mechanism B and is driven by the driving mechanism B to move up and down. The protective cover 6 has a chamber for receiving the wire harness on the main board. The top of the protective cover 6 is open to form a port. During the working process, the protective cover 6 rises under the drive of the driving mechanism B to pass through the mounting hole of the housing until the main board together with the wire harness on the main board is covered in its chamber, so as to avoid interference between the main board and the housing when the main board is installed in the housing; subsequently, the protective cover 6 and the suction head 3 move down synchronously until the main board falls onto the housing; finally, the protective cover 6 and the suction head 3 are reset, and the main board and the housing are fixed together by using locking screws.
[0044] Referring to Figures 7 - 8 , the shape of the port of the protective cover 6 is adapted to the shape of the main board, so that when the port of the protective cover 6 contacts the main board, the contour edge of the port is located inside the contour edge of the main board. During the working process, the protective cover 6 moves up so that the wire harness on the main board falls into its chamber, and the port edge of the protective cover 6 abuts against the main board to buckle the wire harness inside its chamber. When the main board moves to the mounting hole of the housing, the edge of the main board is directly carried on the periphery of the mounting hole.
[0045] Specifically: the end edge of the port of the protective cover 6 has a contact surface that abuts against the main board and a relief notch A lower than the contact surface. The position of the relief notch A is adapted to the position of the wire harness on the main board, so that when the main board is placed on the upper end of the protective cover 6, the relief notch A forms a relief for the wire harness on the main board.
[0046] A plurality of wire harness pressing heads 8 are provided and arranged circumferentially along the through hole. Each wire harness pressing head 8 is connected to the driving mechanism C and is driven by the driving mechanism C to move horizontally towards the inner side wall of the through hole. During the assembly process, since there is also a wire harness at the mounting hole position of the housing, when the suction head 3 transfers the main board above the housing carrier 4, the wire harness inside the mounting hole of the housing is pressed against its side wall by each wire harness pressing head 8 in advance to avoid interference with it during the lifting and lowering process of the protective cover 6 and ensure the smooth lifting and lowering of the protective cover 6.
[0047] Referring to Figure 9, when the adsorption surface of the adsorption head 3 holds the main board, the contour edge of the adsorption surface is inside the contour edge of the main board to form a pressing area between the outside of the adsorption surface and the contour edge of the main board; on the carrier platform 1 and on one side of the chassis carrier 4, there is also a pressing assembly and a driving mechanism D13 for driving the pressing assembly to move towards the chassis carrier 4. The pressing assembly includes a pressing head 12 located above the pressing area, a power component B for driving the pressing head 12 to move up and down, and a first support frame 14 for supporting the power component B. On the carrier platform 1, there is a linear guide linearly extending from the position of the chassis carrier 4 to one side thereof and a mounting slide seat slidably assembled with the linear guide. The first support frame 14 is fixed on the mounting slide seat; the driving mechanism D13 is connected to the mounting slide seat to drive the mounting slide seat to move back and forth on the linear guide. Specifically: the driving mechanism D13 includes a cylinder, the cylinder is fixed at one end of the linear guide, and its ejecting end is connected to the mounting slide seat to drive the pressing assembly to move towards the chassis carrier 4 by using the expansion and contraction of the cylinder.
[0048] The pressing head 12 includes a substrate 1201 and a pressing head 1202 vertically fixed at the lower end of the substrate 1201. One side of the substrate 1201 opposite to the through hole has a lateral opening for the lateral entry of the adsorption head 3. The pressing head 1202 is arranged along the inner side wall of the lateral opening, and there are multiple pressing heads 1202, and the pressing heads 1202 are arranged at intervals along the inner peripheral wall of the lateral opening. During the working process, when the adsorption head transfers the main board to the installation hole position of the chassis, the driving mechanism D13 drives the pressing head 12 to move towards the adsorption head 3 until the lateral opening encloses the adsorption head 3 inside it. At this time, the power component B drives the pressing head 12 to move downwards so that the pressing heads 1202 respectively press on the pressing area to prevent the main board from rebounding due to the loss of pressure restriction when the adsorption head 6 resets. And the pressing head 12 forms multiple pressing points in the pressing area through its pressing heads 1202, which can not only avoid excessive contact area affecting subsequent assembly but also ensure the uniformity of pressing.
[0049] Specifically: the inner side wall of the lateral opening has a continuously extending part extending vertically downwards to form the pressing head 1202. So that the pressing head 1202 and the substrate 1201 form an integral body.
[0050] The power component B is located on one side of the pressing head 12 to avoid interference between the power component B and other components.
[0051] As can be seen from the above, the specific working mode of a main board assembly machine proposed by the present invention is as follows:
[0052] When the load platform 1 is at the feeding station, the staff places the housing to be assembled and the main board on the housing carrier 4 and the main board carrier 5 respectively, and then the drive mechanism E7 drives the load platform 1 loaded with the housing and the main board to the assembly station.
[0053] When the load platform 1 moves to the assembly station, the first driving component 201 and the second driving component 202 of the first driving mechanism A2 cooperate with each other to drive the suction head 3 to move to transfer the main board in the main board carrier 5 above the housing carrier 4. At this time, the second driving component 202 drives the suction head 3 to move to the position where the wire arrangement mechanism is located alone, and the power component A10 in the wire arrangement mechanism pushes the push block 9 towards the suction head 3 to push the wires on the main board towards its central part. At this time, each wire pressing head 8 presses the wires inside the mounting holes on the housing against its side wall, and the protective cover 6 rises under the drive of the drive mechanism B to pass through the mounting station of the housing until the main board together with the wires on the main board is covered in its chamber; then, the protective cover 6 and the suction head 3 move down synchronously until the main board falls onto the housing; then, the power component B drives the pressing head 12 to move downwards so that each pressing head 1202 presses against the main board to press the main board; finally, the protective cover 6 and the suction head 3 reset, and the main board and the housing are fixed together with locking screws.
[0054] In addition, in this embodiment, an upper detection mechanism for detecting whether the upper surface of the main board is qualified is provided on one side of the suction head 3, and a lower detection mechanism 16 for detecting whether the lower surface of the main board is qualified is provided below the moving track of the suction head 3; during the working process, the drive mechanism A2 drives the suction head 3 together with the upper detection mechanism to move synchronously in advance to detect the upper surface of the main board 5 placed on the main board carrier 5 by using the upper detection mechanism. After the detection is qualified, the suction head 3 sucks the main board and takes the main board through the lower detection mechanism 16 to detect its lower surface by using the lower detection mechanism 16.
[0055] Specifically: The upper detection mechanism is installed on the horizontal slide 2012 and moves with the movement of the horizontal slide 2012. A second support frame is provided on one side of the assembly station, and the first driving component 201 is fixedly installed on the second support frame; the lower detection mechanism 16 is installed on the workbench 7.
[0056] In summary, the present invention can use the protective cover 6 to bind the flexible cable on the main board before the main board is installed into the chassis, avoiding interference between the main board and the chassis when the main board is installed into the chassis, ensuring that the main board smoothly and accurately falls to the predetermined assembly position, and guaranteeing the qualification rate of assembly.
[0057] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, making equivalent substitutions or changes, should be covered within the protection scope of the present invention.
Claims
1. A main board assembly machine, characterized in that, Comprising: A load platform (1), a driving mechanism A (2), a suction head (3) for sucking the main board, and a wire harness arranging mechanism for arranging the wire harness on the main board, wherein: On the load platform (1), there are provided a chassis carrier (4) for fixing the chassis and a main board carrier (5) for fixing the main board, and a driving mechanism B is arranged below the chassis carrier (4); In the middle of the chassis carrier (4), there is a through hole, and a protective cover (6) capable of passing through the middle mounting hole position of the chassis is arranged inside the through hole; The protective cover (6) is connected to the driving mechanism B to be driven to move up and down by the driving mechanism B. The protective cover (6) has a chamber for receiving the wire harness on the main board, and the top of the protective cover (6) is open to form a port; The wire harness arranging mechanism includes a push block (9) located on the outer periphery of the suction head (3) and a power component A (10) for driving the push block (9) to telescopically move towards the suction head (3); The protective cover (6) and the suction head (3) move down synchronously until the main board falls onto the chassis.
2. The motherboard assembly machine according to claim 1, characterized in that, The first driving mechanism A (2) includes a first driving component (201) for driving the suction head (3) to horizontally move along the connection line direction of the chassis carrier (4) and the main board carrier (5), and a second driving component (202) for driving the suction head (3) to reciprocally move in the vertical direction; the wire harness arranging mechanism is driven by the first driving component (201) to move synchronously with the horizontal movement of the suction head (3).
3. The motherboard assembly machine according to claim 2, characterized in that, The wire harness arranging mechanism further includes an adapter plate (11). The adapter plate (11) has a notch. The power component A (10) is installed on the adapter plate (11) to drive the push block (9) to telescopically move towards the inner side of the notch. The adapter plate (11) is connected to the first driving component (201); the suction head (3) is driven by the second driving component (202) to vertically move inside the notch.
4. The motherboard assembly machine according to claim 3, wherein The first driving component (201) includes a horizontal guide rail (2011) linearly arranged along the connection line direction of the chassis carrier (4) and the main board carrier (5), a horizontal sliding seat (2012) slidably assembled with the horizontal guide rail (2011), and a first driving part for driving the horizontal sliding seat (2012) to move back and forth on the horizontal guide rail (2011); the adapter plate (11) is installed on the horizontal sliding seat (2012) to move along with the movement of the horizontal sliding seat (2012); the second driving component (202) includes a vertical guide rail vertically fixed on the horizontal sliding seat (2012), a vertical sliding seat slidably assembled on the vertical guide rail, and a second driving part for driving the vertical sliding seat to move back and forth on the vertical guide rail; the suction head (3) is installed on the vertical sliding seat to move along with the movement of the vertical sliding seat.
5. The motherboard assembly machine according to claim 1, wherein A driving mechanism C is further provided on the load platform (1) and below the housing carrier (4). A wire arranging press head (8) is further provided between the protective cover (6) and the inner side wall of the through hole. The wire arranging press head (8) is connected to the driving mechanism C and is driven by the driving mechanism C to horizontally move towards the inner side wall of the through hole.
6. The main board assembly machine according to claim 5, wherein, A plurality of the wire arranging press heads (8) are provided and arranged circumferentially along the through hole.
7. The motherboard assembly machine according to claim 1, wherein, When the adsorption surface of the adsorption head (3) adsorbs the main board, the contour edge of the adsorption surface is located inside the contour edge of the main board to form a pressing area between the outer side of the adsorption surface and the contour edge of the main board; a pressing component and a driving mechanism D (13) for driving the pressing component to move towards the housing carrier (4) are further provided on the load platform (1) and on one side of the housing carrier (4). The pressing component includes a pressing head (12) located above the pressing area and a power component B for driving the pressing head (12) to move up and down.
8. The motherboard assembly machine according to claim 7, characterized in that, The pressing head (12) includes a substrate (1201) and a pressing head (1202) vertically fixed at the lower end of the substrate (1201). One side of the substrate (1201) opposite to the through hole has a lateral opening for the lateral entry of the adsorption head (3), and the pressing head (1202) is arranged along the inner side wall of the lateral opening.
9. The motherboard assembly machine according to claim 8, wherein, The inner side wall of the lateral opening has a continuously extending portion extending vertically downward to form the pressing head (1202). A plurality of the pressing heads (1202) are provided, and the pressing heads (1202) are arranged at intervals along the inner peripheral wall of the lateral opening.
10. The motherboard assembly machine according to claim 1, characterized in that, The port shape of the protective cover (6) is adapted to the shape of the main board, so that when the port of the protective cover (6) contacts the main board, the contour edge of the port is located inside the contour edge of the main board.
11. The motherboard assembly machine according to claim 10, wherein, The end edge of the port of the protective cover (6) has a contact surface abutting against the main board and a relief notch A lower than the contact surface. The position of the relief notch A is adapted to the position of the wire arrangement on the main board, so that when the main board is placed on the upper end of the protective cover (6), the relief notch A forms a relief for the wire arrangement on the main board so that the port contacts the lower end surface of the main board.
12. The motherboard assembly machine according to claim 1, wherein An upper detection mechanism for detecting whether the upper surface of the main board is qualified is provided on one side of the adsorption head (3), and the driving mechanism A (2) is used to drive the adsorption head (3) and the upper detection mechanism to move synchronously.
13. The motherboard assembly machine according to claim 1, characterized in that, A lower detection mechanism (16) for detecting whether the lower surface of the main board is qualified is provided below the moving track of the adsorption head (3).
14. The motherboard assembly machine according to any one of claims 1-13, characterized in that, It further includes a workbench (7) and a driving mechanism E (17). The workbench (7) has a feeding station and an assembly station. The driving mechanism E (17) is used to drive the load platform (1) to reciprocate between the feeding station and the assembly station; the adsorption head (3) is located above the assembly station.