Reusable inductive sensor glue pouring model and debugging method thereof

Abstract

The invention discloses a reusable inductive sensor glue pouring model and a debugging method thereof, and the model comprises a detachable cap assembly which is used for accommodating a magnetic core and a coil; the extension lead is connected with the tap of the coil and extends to the outside of the cap assembly; the glue pouring layer is filled in the cap assembly through glue and wraps the magnetic core and the coil; and the extension lead is used for separating the coil from an external circuit so as to realize repeated debugging of the external circuit. According to the reusable inductive sensor glue pouring model and the debugging method thereof provided by the invention, the debugging period can be shortened: independent debugging of a PCBA after glue pouring is realized by prolonging a lead, and a sample does not need to be duplicated; precise process shaping: quantifying solidification parameters and performance influences of different glues at different temperatures; and temperature compensation collaborative optimization: combining glue characteristics and thermistor response to quickly determine a compensation scheme.

Description

Technical Field

[0001] The present invention relates to the technical field of inductive sensor manufacturing, and particularly relates to a reusable potting model for an inductive sensor and a debugging method therefor. Background Art

[0002] In order to protect inductive sensors, improve the stability and reliability of sensors, enhance the waterproof performance of sensors, and improve the seismic resistance of sensors, the potting process has been widely used in the production process of sensors.

[0003] During the R & D and debugging process of sensors, since stress is generated during the curing process of the glue, the magnetic core and coil will deform, and the impedance and quality factor of the coil will change accordingly, thus affecting the performance of the inductive sensor. Therefore, potting is an essential process in the debugging process. The traditional potting process has a long time, low reuse rate, and since different glue materials have different effects on the performance of inductive proximity switches, during the development and debugging of inductive proximity switches, it is necessary to select the potting glue material, which lengthens the debugging cycle. The traditional potting process for inductive sensors has the following problems: the curing stress of the glue causes deformation of the magnetic core and coil, affecting performance stability; different glue materials need to be repeatedly trial-produced, with a long debugging cycle; the PCBA cannot be modified after potting, and multiple samples need to be made, resulting in high costs.

[0004] Therefore, in view of the deficiencies of the existing technology, it is necessary to design a reusable potting model for an inductive sensor and a debugging method therefor to solve the above problems. Summary of the Invention

[0005] To overcome the above deficiencies in the existing technology, the purpose of the present invention is to provide a reusable potting model for an inductive sensor and a debugging method therefor.

[0006] To achieve the above purpose and other related purposes, the technical solution provided by the present invention is: a reusable potting model for an inductive sensor, comprising: A detachable cap assembly for accommodating a magnetic core and a coil; An extended lead wire connecting the tap of the coil and extending outside the cap assembly; A potting layer filled with glue inside the cap assembly and wrapping the magnetic core and the coil; The extended lead wire is used to separate the coil from the external circuit to enable repeated debugging of the external circuit.

[0007] A preferred technical solution is: the extended lead wire is a flexible wire, and the length of the extended lead wire meets the physical separation requirement between the coil and the external circuit.

[0008] The preferred technical solution is: The cap assembly includes: An upper cover provided with a positioning groove for fixing the magnetic core; A lower cover provided with an installation cavity for the coil; The upper cover and the lower cover are hermetically fitted through a detachable connection structure.

[0009] The preferred technical solution is: It further includes a temperature compensation module, and the temperature compensation module includes: A temperature sensor for monitoring the ambient temperature of the potted layer; A compensation circuit for adjusting the parameters of the coil based on the detection result of the temperature sensor.

[0010] A debugging method based on the above potted model includes the following steps: Step 1: Measure the solidification time of the target glue at different temperatures to determine the optimal solidification temperature and time; Step 2: Assemble the magnetic core and the coil into the cap assembly and connect to an external test device through the extension lead; Step 3: Inject the target glue and cure it according to the optimal solidification temperature and time to form a potted layer; Step 4: Test the inductance value, quality factor and impedance of the coil at different ambient temperatures and record the parameter change trend; Step 5: Select a temperature compensation scheme according to the parameter change trend and optimize the external circuit.

[0011] The preferred technical solution is: In the step 1, the target glue includes at least one of epoxy resin, silica gel and polyurethane, and the temperature range is from 25°C to 120°C.

[0012] The preferred technical solution is: In the step 4, the ambient temperatures include -40°C, 25°C and 85°C, and the test time at each temperature point is 2 hours.

[0013] The preferred technical solution is: In the step 5, the temperature compensation scheme includes: Select a thermistor that matches the parameter change trend; Adjust the excitation signal frequency or amplitude of the coil through the compensation circuit.

[0014] Due to the application of the above technical solution, the beneficial effects of the present invention are: A reusable potting model for an inductive sensor and its debugging method proposed by the present invention have the following advantages: shortening the debugging cycle: independent debugging of the PCBA after potting is achieved by extending the leads, without the need to repeatedly make samples; precise process shaping: quantifying the solidification parameters and performance effects of different glues at different temperatures; collaborative optimization of temperature compensation: quickly determining the compensation scheme by combining the characteristics of the glue and the response of the thermistor. Brief Description of the Drawings

[0015] Figure 1 It is a schematic diagram of the method involved in the present invention.

[0016] Figure 2 It is a flow chart of the model involved in the present invention. Detailed Embodiments

[0017] The following specific embodiments illustrate the implementation manners of the present invention. Those skilled in the art can easily understand the other advantages and effects of the present invention from the content disclosed in this specification.

[0018] Please refer to Figure 1 - Figure 2 . It should be noted that in the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship when the product of the present invention is usually placed. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention. In addition, the terms "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance. The terms "horizontal", "vertical", "hanging", etc. do not mean that the components are required to be absolutely horizontal or hanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0019] In the description of the present invention, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection, an electrical connection. It can be directly connected, or indirectly connected through an intermediate medium. It can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0020] Embodiment: Such as Figure 2As shown, according to a general technical concept of the present invention, a reusable potting model for an inductive sensor is provided, including: A detachable cap assembly for accommodating a magnetic core and a coil; An extended lead 3, connecting the tap of the coil and extending to the outside of the cap assembly; A potting layer, filled with glue inside the cap assembly and wrapping the magnetic core and the coil; The extended lead 3 is used to separate the coil from the external circuit to achieve repeated debugging of the external circuit.

[0021] As Figure 2 shown, in an exemplary embodiment of the present invention, the extended lead 3 is a flexible wire, and the length of the extended lead 3 meets the physical separation requirement between the coil and the external circuit.

[0022] As Figure 2 shown, in an exemplary embodiment of the present invention, the cap assembly includes: An upper cover 1 provided with a positioning groove for fixing the magnetic core; A lower cover 2 provided with an installation cavity for the coil; The upper cover 1 and the lower cover 2 are hermetically fitted through a detachable connection structure.

[0023] A preferred technical solution is: further including a temperature compensation module, and the temperature compensation module includes: A temperature sensor for monitoring the ambient temperature of the potting layer; A compensation circuit for adjusting the parameters of the coil based on the detection result of the temperature sensor.

[0024] As Figure 1 shown, the present application also discloses a debugging method based on the above potting model, including the following steps: Step 1: Measure the solidification time of the target glue at different temperatures to determine the optimal solidification temperature and time; Step 2: Assemble the magnetic core and the coil into the cap assembly and connect to an external test device through the extended lead 3; Step 3: Inject the target glue and cure it according to the optimal solidification temperature and time to form a potting layer; Step 4: Test the inductance value, quality factor and impedance of the coil at different ambient temperatures and record the parameter change trend; Step 5: Select a temperature compensation scheme according to the parameter change trend and optimize the external circuit.

[0025] As Figure 1 shown, in an exemplary embodiment of the present invention, in Step 1, the target glue includes at least one of epoxy resin, silica gel and polyurethane, and the temperature range is 25°C to 120°C.

[0026] As Figure 1 shown, in an exemplary embodiment of the present invention, in step 4, the ambient temperature includes -40°C, 25°C, and 85°C, and the test time for each temperature point is 2 hours.

[0027] As Figure 1 shown, in an exemplary embodiment of the present invention, in step 5, the temperature compensation scheme includes: selecting a thermistor that matches the trend of parameter change; adjusting the excitation signal frequency or amplitude of the coil through a compensation circuit.

[0028] Therefore, the present invention has the following advantages: A reusable potting model for an inductive sensor and its debugging method proposed by the present invention have the following advantages: shortening the debugging cycle: realizing independent debugging of the PCBA after potting by extending the leads, without repeated sample preparation; precise process determination: quantifying the solidification parameters and performance effects of different glues at different temperatures; collaborative optimization of temperature compensation: quickly determining the compensation scheme by combining the characteristics of the glue and the response of the thermistor.

[0029] The above embodiments merely illustrate the principles and effects of the present invention, rather than limiting the present invention. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. A reusable potting model for an inductive sensor, characterized in that, Comprising: A detachable cap assembly for accommodating a magnetic core and a coil; An extended lead wire connecting the tap of the coil and extending outside the cap assembly; A potting layer filled with glue inside the cap assembly and wrapping the magnetic core and the coil; The extended lead wire is used to separate the coil from the external circuit to achieve repeated debugging of the external circuit.

2. The reusable potting model of an inductive sensor according to claim 1, wherein: The extended lead wire is a flexible wire, and the length of the extended lead wire meets the physical separation requirement between the coil and the external circuit.

3. A reusable potting model for an inductive sensor according to claim 1, characterized in that: The cap assembly includes: An upper cover provided with a positioning groove for fixing the magnetic core; A lower cover provided with an installation cavity for the coil; The upper cover and the lower cover are hermetically fitted through a detachable connection structure.

4. A reusable potting model for an inductive sensor according to claim 1, characterized in that: It further includes a temperature compensation module, and the temperature compensation module includes: A temperature sensor for monitoring the ambient temperature of the potting layer; A compensation circuit for adjusting the parameters of the coil based on the detection result of the temperature sensor.

5. A debugging method for the potting model according to claim 1, characterized in that Including the following steps: Step 1: Measure the solidification time of the target glue at different temperatures to determine the optimal solidification temperature and time; Step 2: Assemble the magnetic core and the coil inside the cap assembly and connect to an external test device through the extended lead wire; Step 3: Inject the target glue and cure it according to the optimal solidification temperature and time to form a potting layer; Step 4: Test the inductance value, quality factor and impedance of the coil at different ambient temperatures and record the parameter change trend; Step 5: Select a temperature compensation scheme according to the parameter change trend and optimize the external circuit.

6. The debugging method according to claim 5, characterized in that: In the said Step 1, the target glue includes at least one of epoxy resin, silica gel and polyurethane, and the temperature range is from 25°C to 120°C.

7. The debugging method according to claim 5, wherein: In the said Step 4, the ambient temperatures include -40°C, 25°C and 85°C, and the test time at each temperature point is 2 hours.

8. The debugging method according to claim 5, wherein: In the said Step 5, the temperature compensation scheme includes: Select a thermistor matching the parameter change trend; Adjust the excitation signal frequency or amplitude of the coil through the compensation circuit.

Images