Temperature control method and system for solid phase collection device

Abstract

The invention relates to the technical field of instrument temperature control, and discloses a temperature control method and system for a solid phase collection device, and the method comprises the steps: obtaining a first temperature value of a to-be-treated sample at a column tube inlet, and determining the sample temperature adjustment amount of the to-be-treated sample; after the adsorbent in the column tube completes adsorption of the to-be-treated sample, the flow rate, the pressure value and the second temperature value of the eluent at the inlet of the column tube are obtained; determining the eluent temperature adjustment amount, the flow rate adjustment amount and the pressure adjustment amount of the eluent according to the second temperature value; setting the working state of the pump according to the flow rate adjustment amount and the pressure adjustment amount based on the flow rate and the pressure of the eluent; controlling a temperature adjusting module to adjust the temperature of the to-be-treated sample according to the sample temperature adjusting amount, and controlling the pump according to the working state of the pump, so as to realize the temperature control of the solid phase collecting device. According to the invention, high-precision and quick-response temperature control can be realized, so that the product quality and the production efficiency are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of instrument temperature control, and particularly to a temperature control method and system for a solid-phase collection device. Background Art

[0002] Solid-phase collection devices are widely used in various industrial processes, such as chemical production, pharmaceutical processes, and food processing. These devices are typically used to separate and collect solid particles from gas or liquid mixtures. These processes often require precise control of the temperature of the solid-phase collection device to ensure product quality and production efficiency.

[0003] However, traditional solid-phase collection devices have some deficiencies in temperature control, such as insufficient temperature control accuracy, slow response speed, and susceptibility to environmental factors. These problems may lead to low solid-phase collection efficiency, unstable collection quality, and even affect subsequent experimental or production processes. Therefore, there is an urgent need for a temperature control method and system for a solid-phase collection device to achieve precise temperature control during the solid-phase collection process. Summary of the Invention

[0004] The object of the present invention is to provide a temperature control method and system for a solid-phase collection device, which solves the problems of insufficient temperature control accuracy, slow response speed, and susceptibility to environmental factors of traditional solid-phase collection devices.

[0005] The present invention provides a temperature control method for a solid-phase collection device, which is applied to a solid-phase collection device. The solid-phase collection device includes a column tube, an adsorbent, an eluent container, a pump, and a control module. The column tube is filled with the adsorbent, the eluent container is connected to the column tube, the pump is arranged between the eluent container and the column tube, the pump is used to control the flow rate and pressure of the eluent, and the control module is connected to the pump and used to control the working state of the pump; The method includes: Obtain a first temperature value of a sample to be processed at the inlet of the column tube, and determine a sample temperature adjustment amount of the sample to be processed according to the first temperature value; After the adsorbent in the column tube completes the adsorption of the sample to be processed, obtain the flow rate, pressure value, and a second temperature value of the eluent at the inlet of the column tube; Determine an eluent temperature adjustment amount of the eluent according to the second temperature value; Determine a flow rate adjustment amount and a pressure adjustment amount of the eluent according to the eluent temperature adjustment amount; Based on the flow rate and pressure of the eluent, set the working state of the pump according to the flow rate adjustment amount and the pressure adjustment amount; Adjust the temperature of the sample to be processed by controlling the temperature adjustment module according to the sample temperature adjustment amount, and control the pump according to the working state of the pump to achieve temperature control of the solid-phase collection device.

[0006] Preferably, determining the sample temperature adjustment amount of the sample to be processed according to the first temperature value includes: Preset a preset sample temperature in advance; Determine the sample temperature difference between the first temperature value and the preset sample temperature; Determine the sample temperature adjustment amount of the sample to be processed according to the sample temperature difference; The sample temperature adjustment amount is ∆T1 = |Ty1 - Ty0|, where Ty1 is the first temperature value and Ty0 is the preset sample temperature.

[0007] Preferably, determining the sample temperature adjustment amount of the sample to be processed according to the first temperature value further includes: When the first temperature value is greater than the preset sample temperature, perform a cooling adjustment on the sample to be processed; When the first temperature value is less than the preset sample temperature, perform a heating adjustment on the sample to be processed.

[0008] Preferably, determining the eluent temperature adjustment amount of the eluent according to the second temperature value includes: Determine the eluent temperature difference between the second temperature value and the preset eluent temperature; Preset a first eluent temperature difference, a second eluent temperature difference, and a third eluent temperature difference, and the first eluent temperature difference, the second eluent temperature difference, and the third eluent temperature difference increase in sequence; Set the eluent temperature adjustment amount of the eluent according to the relationship between the eluent temperature difference and the first eluent temperature difference, the second eluent temperature difference, and the third eluent temperature difference; If the eluent temperature difference is less than the first eluent temperature difference, set the eluent temperature adjustment amount of the eluent to a first preset temperature adjustment amount Ts1; If the eluent temperature difference is greater than or equal to the first eluent temperature difference and less than the second eluent temperature difference, set the eluent temperature adjustment amount of the eluent to a second preset temperature adjustment amount Ts2; If the eluent temperature difference is greater than or equal to the second eluent temperature difference and less than the third eluent temperature difference, set the eluent temperature adjustment amount of the eluent to a third preset temperature adjustment amount Ts3; If the temperature difference of the eluent is greater than or equal to the third temperature difference of the eluent, set the eluent temperature adjustment amount of the eluent to the fourth preset temperature adjustment amount Ts4; where Ts1 < Ts2 < Ts3 < Ts4.

[0009] Preferably, determining the flow rate adjustment amount and the pressure adjustment amount of the eluent according to the eluent temperature adjustment amount includes: If the eluent temperature adjustment amount of the eluent is the first preset temperature adjustment amount Ts1, set the flow rate adjustment amount to the first preset flow rate adjustment amount V1, and set the pressure adjustment amount to the first preset pressure adjustment amount P1; If the eluent temperature adjustment amount of the eluent is the second preset temperature adjustment amount Ts2, set the flow rate adjustment amount to the second preset flow rate adjustment amount V2, and set the pressure adjustment amount to the second preset pressure adjustment amount P2; If the eluent temperature adjustment amount of the eluent is the third preset temperature adjustment amount Ts3, set the flow rate adjustment amount to the third preset flow rate adjustment amount V3, and set the pressure adjustment amount to the third preset pressure adjustment amount P3; If the eluent temperature adjustment amount of the eluent is the fourth preset temperature adjustment amount Ts4, set the flow rate adjustment amount to the fourth preset flow rate adjustment amount V4, and set the pressure adjustment amount to the fourth preset pressure adjustment amount P4; where V1 < V2 < V3 < V4, P1 < P2 < P3 < P4.

[0010] Preferably, setting the working state of the pump based on the flow rate and pressure of the eluent, according to the flow rate adjustment amount and the pressure adjustment amount includes: Determine the required flow rate of the eluent according to the flow rate of the eluent and the flow rate adjustment amount; Determine the required pressure of the eluent according to the pressure of the eluent and the pressure adjustment amount; Set the working state of the pump according to the required flow rate and the required pressure.

[0011] Preferably, setting the working state of the pump according to the required flow rate and the required pressure includes: Determine the initial motor speed of the pump according to the required flow rate; Preset the first preset required flow rate, the second preset required flow rate, and the third preset required flow rate, and the first preset required flow rate, the second preset required flow rate, and the third preset required flow rate increase in sequence; Set the initial motor speed of the pump according to the relationship between the required flow rate and the first preset required flow rate, the second preset required flow rate, and the third preset required flow rate; If the required flow rate is less than the first preset required flow rate, set the initial motor speed of the pump to the first preset motor speed N1; If the required flow rate is greater than or equal to the first preset required flow rate and less than the second preset required flow rate, set the initial motor speed of the pump to the second preset motor speed N2; If the required flow rate is greater than or equal to the second preset required flow rate and less than the third preset required flow rate, set the initial motor speed of the pump to the third preset motor speed N3; If the required flow rate is greater than or equal to the third preset required flow rate, set the initial motor speed of the pump to the fourth preset motor speed N4; where N1 < N2 < N3 < N4.

[0012] Preferably, setting the working state of the pump according to the required flow rate and the required pressure further includes: After setting the initial motor speed of the pump to the i-th preset motor speed Ni according to the relationship between the required flow rate and the first preset required flow rate, the second preset required flow rate, and the third preset required flow rate, where i = 1, 2, 3, 4, adjust the i-th preset motor speed Ni according to the required pressure to obtain the final motor speed of the pump; Preset a first preset required pressure, a second preset required pressure, and a third preset required pressure, which increase in sequence; Adjust the i-th preset motor speed Ni according to the relationship between the required pressure and the first preset required pressure, the second preset required pressure, and the third preset required pressure to obtain the final motor speed of the pump; If the required pressure is less than the first preset required pressure, select the first speed correction coefficient m1 to adjust the i-th preset motor speed Ni to obtain the final motor speed of the pump as Ni × m1; If the required pressure is greater than or equal to the first preset required pressure and less than the second preset required pressure, select the second speed correction coefficient m2 to adjust the i-th preset motor speed Ni to obtain the final motor speed of the pump as Ni × m2; If the required pressure is greater than or equal to the second preset required pressure and less than the third preset required pressure, select the third speed correction coefficient m3 to adjust the i-th preset motor speed Ni to obtain the final motor speed of the pump as Ni × m3; If the required pressure is greater than or equal to the third preset required pressure, select the fourth rotational speed correction coefficient m4 to adjust the i-th preset motor speed Ni of the pump, and the final motor speed of the pump is obtained as Ni×m4; where m1 < m2 < m3 < m4.

[0013] The present invention also discloses a temperature control system for a solid-phase collection device, which is used to apply the temperature control method for the solid-phase collection device as described above. The system includes: A temperature adjustment module for adjusting the temperature of the sample to be processed. An acquisition module for acquiring the first temperature value of the sample to be processed at the inlet of the column tube, and acquiring the flow rate, pressure value, and second temperature value of the eluent at the inlet of the column tube after the adsorbent in the column tube has completed the adsorption of the sample to be processed. A processing module for determining the sample temperature adjustment amount of the sample to be processed according to the first temperature value, determining the eluent temperature adjustment amount of the eluent according to the second temperature value, and determining the flow rate adjustment amount and pressure adjustment amount of the eluent according to the eluent temperature adjustment amount. A setting module for setting the working state of the pump based on the flow rate and pressure of the eluent according to the flow rate adjustment amount and pressure adjustment amount. A control module for controlling the temperature adjustment module to adjust the temperature of the sample to be processed according to the sample temperature adjustment amount, and controlling the pump according to the working state of the pump to achieve temperature control of the solid-phase collection device.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows. By precisely controlling the temperatures of the sample to be processed and the eluent, the present invention can optimize the adsorption and desorption processes of the target analyte on the adsorbent, thereby improving the separation efficiency. By controlling the temperature and maintaining its constancy, the present invention can reduce the degradation or structural change of the sample caused by temperature fluctuations and ensure the stability of the analyte. The present invention can achieve high-precision and fast-response temperature control, thereby improving product quality and production efficiency. Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present invention, and those of ordinary skill in the art can also obtain other drawings according to the provided drawings without creative efforts.

[0016] Figure 1 It is a schematic flow chart of a temperature control method for a solid-phase collection device of the present invention; Figure 2It is a functional block diagram of a temperature control system for a solid-phase collection device of the present invention. Detailed implementation manners

[0017] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0018] As Figure 1 shown, the present invention provides a temperature control method for a solid-phase collection device, which is applied to the solid-phase collection device. The solid-phase collection device includes a column tube, an adsorbent, an eluent container, a pump, and a control module. The column tube is filled with the adsorbent. The eluent container is connected to the column tube. The pump is arranged between the eluent container and the column tube. The pump is used to control the flow rate and pressure of the eluent. The control module is connected to the pump and is used to control the working state of the pump.

[0019] The method includes: S1, obtaining a first temperature value of a sample to be processed at the inlet of the column tube, and determining a sample temperature adjustment amount of the sample to be processed according to the first temperature value.

[0020] S2, when the adsorbent in the column tube finishes adsorbing the sample to be processed, obtaining the flow rate, pressure value, and a second temperature value of the eluent at the inlet of the column tube.

[0021] S3, determining an eluent temperature adjustment amount of the eluent according to the second temperature value.

[0022] S4, determining a flow rate adjustment amount and a pressure adjustment amount of the eluent according to the eluent temperature adjustment amount.

[0023] S5, based on the flow rate and pressure of the eluent, setting the working state of the pump according to the flow rate adjustment amount and the pressure adjustment amount.

[0024] S6, controlling the temperature adjustment module to adjust the temperature of the sample to be processed according to the sample temperature adjustment amount, and controlling the pump according to the working state of the pump to achieve temperature control of the solid-phase collection device.

[0025] In some embodiments of the present application, determining the sample temperature adjustment amount of the sample to be processed according to the first temperature value includes: presetting a preset sample temperature in advance; determining the sample temperature difference between the first temperature value and the preset sample temperature; determining the sample temperature adjustment amount of the sample to be processed according to the sample temperature difference; the sample temperature adjustment amount is ∆T1 = |Ty1 - Ty0|, where Ty1 is the first temperature value and Ty0 is the preset sample temperature.

[0026] In this embodiment, to ensure that the sample to be processed reaches the optimal temperature during adsorption in the column tube, it is necessary to adjust the temperature of the sample to be processed, such as heating or cooling. In some cases, the sample to be processed needs to be heated to a certain temperature to promote its adsorption process in the column tube. This is mainly because certain chemical reactions or physical processes become more active at higher temperatures. In addition, heating can also accelerate the movement speed of molecules, helping the target components in the sample to diffuse into the column tube faster and achieve more efficient adsorption. In some specific cases, cooling the sample to be processed can also achieve the purpose of optimizing the adsorption effect. Cooling can slow down the movement speed of molecules and reduce the diffusion speed of the target components in the sample, so that they are adsorbed more concentratedly in the column tube. In addition, cooling can also change the solubility of certain substances, making the components that are not easily adsorbed at room temperature become more easily adsorbed at low temperature. Therefore, whether to heat or cool is determined according to the properties of the solid phase to be collected.

[0027] In some embodiments of the present application, determining the sample temperature adjustment amount of the sample to be processed according to the first temperature value further includes: when the first temperature value is greater than the preset sample temperature, performing a cooling adjustment on the sample to be processed; when the first temperature value is less than the preset sample temperature, performing a heating adjustment on the sample to be processed.

[0028] In this embodiment, the preset sample temperature is determined according to the properties of the solid phase to be collected. If the solid phase to be collected is easily adsorbed at high temperature, a higher preset sample temperature is set; if the solid phase to be collected is easily adsorbed at low temperature, a lower preset sample temperature is set.

[0029] In some embodiments of the present application, determining the eluent temperature adjustment amount of the eluent according to the second temperature value includes: determining the eluent temperature difference between the second temperature value and the preset eluent temperature.

[0030] Preset a first eluent temperature difference, a second eluent temperature difference, and a third eluent temperature difference, and the first eluent temperature difference, the second eluent temperature difference, and the third eluent temperature difference increase in sequence.

[0031] Set the adjustment amount of the eluent temperature according to the relationship between the eluent temperature difference and the first eluent temperature difference, the second eluent temperature difference, and the third eluent temperature difference.

[0032] If the eluent temperature difference is less than the first eluent temperature difference, set the adjustment amount of the eluent temperature to the first preset temperature adjustment amount Ts1; if the eluent temperature difference is greater than or equal to the first eluent temperature difference and less than the second eluent temperature difference, set the adjustment amount of the eluent temperature to the second preset temperature adjustment amount Ts2; if the eluent temperature difference is greater than or equal to the second eluent temperature difference and less than the third eluent temperature difference, set the adjustment amount of the eluent temperature to the third preset temperature adjustment amount Ts3; if the eluent temperature difference is greater than or equal to the third eluent temperature difference, set the adjustment amount of the eluent temperature to the fourth preset temperature adjustment amount Ts4; where Ts1 < Ts2 < Ts3 < Ts4.

[0033] In this embodiment, after the solid-phase collection device completes the separation task, it usually needs to be further processed with an eluent to more thoroughly remove impurities and purify the target component, laying a solid foundation for subsequent experimental steps. The eluent can effectively remove the non-target components adsorbed on the solid phase material. These non-target components may include impurities, interferents, or other unwanted substances that can have a negative impact on the separation and purification of the target component. By using an appropriate eluent, these non-target components can be eluted from the solid phase material, thereby improving the purity of the target component. During the elution process, the temperature of the eluent is also important. At the appropriate temperature, the eluent can elute the sample solid adsorbed on the adsorbent with the highest efficiency.

[0034] In some embodiments of the present application, determining the flow rate adjustment amount and the pressure adjustment amount of the eluent according to the eluent temperature adjustment amount includes: if the eluent temperature adjustment amount of the eluent is the first preset temperature adjustment amount Ts1, setting the flow rate adjustment amount as the first preset flow rate adjustment amount V1 and setting the pressure adjustment amount as the first preset pressure adjustment amount P1; if the eluent temperature adjustment amount of the eluent is the second preset temperature adjustment amount Ts2, setting the flow rate adjustment amount as the second preset flow rate adjustment amount V2 and setting the pressure adjustment amount as the second preset pressure adjustment amount P2; if the eluent temperature adjustment amount of the eluent is the third preset temperature adjustment amount Ts3, setting the flow rate adjustment amount as the third preset flow rate adjustment amount V3 and setting the pressure adjustment amount as the third preset pressure adjustment amount P3; if the eluent temperature adjustment amount of the eluent is the fourth preset temperature adjustment amount Ts4, setting the flow rate adjustment amount as the fourth preset flow rate adjustment amount V4 and setting the pressure adjustment amount as the fourth preset pressure adjustment amount P4; where V1 < V2 < V3 < V4 and P1 < P2 < P3 < P4.

[0035] In this embodiment, the liquid temperature, as an important parameter of the liquid state, is often affected by multiple factors jointly. Among many influencing factors, the flow rate and pressure of the liquid are two particularly crucial elements. The flow rate of the liquid is one of the important factors affecting its temperature. The speed of the flow rate is directly related to the frequency and intensity of the interaction between liquid molecules. When the liquid flow rate is fast, the collision and friction between molecules will intensify, thereby releasing more heat and causing the liquid temperature to rise. On the contrary, when the flow rate is slow, the interaction between molecules weakens, the heat release decreases, and the liquid temperature will decrease accordingly. This phenomenon is particularly obvious in industrial production. For example, the control of the liquid flow rate in the cooling system directly affects the heat dissipation effect and temperature stability of the equipment. The pressure of the liquid also has an important impact on the temperature. The pressure is closely related to the distance and interaction force between liquid molecules. In a high-pressure environment, the distance between liquid molecules is compressed more tightly, and the interaction force increases, which will cause the molecular movement speed to accelerate, and then release more heat, increasing the liquid temperature. In a low-pressure environment, the distance between molecules increases, the interaction force weakens, and the liquid temperature will decrease accordingly. Therefore, in the fields of chemical production, hydraulic systems, etc., the control of the liquid pressure is also one of the key means to achieve temperature adjustment. Therefore, the liquid temperature is positively correlated with the liquid flow rate and the liquid pressure.

[0036] In some embodiments of the present application, based on the flow rate and pressure of the eluent, the operating state of the pump is set according to the flow rate adjustment amount and the pressure adjustment amount, including: determining the required flow rate of the eluent according to the flow rate of the eluent and the flow rate adjustment amount; determining the required pressure of the eluent according to the pressure of the eluent and the pressure adjustment amount; setting the operating state of the pump according to the required flow rate and the required pressure.

[0037] In this embodiment, there is a close relationship between the flow rate and pressure of the pump and the rotational speed of the pump motor. A pump is a mechanical device that drives a liquid from a lower place to a higher place through a motor. In this process, the rotational speed of the motor directly determines the rotational speed of the pump, and the rotational speed of the pump further affects the flow rate and pressure of the liquid. When the rotational speed of the motor increases, the rotational speed of the pump also increases, which causes the flow rate of the liquid inside the pump to accelerate. The acceleration of the flow rate means that the amount of liquid passing through the pump per unit time increases, thus improving the conveying capacity of the pump. At the same time, the increase in the flow rate also brings about an increase in pressure. This is because the liquid is affected by friction and resistance during the flow process. When the flow rate accelerates, these forces increase, resulting in an increase in pressure. Therefore, the operating state of the pump, that is, the rotational speed of the motor, is determined by determining the required flow rate and the required pressure.

[0038] In some embodiments of the present application, setting the operating state of the pump according to the required flow rate and the required pressure includes: determining the initial motor rotational speed of the pump according to the required flow rate; presetting a first preset required flow rate, a second preset required flow rate, and a third preset required flow rate, and the first preset required flow rate, the second preset required flow rate, and the third preset required flow rate increase in sequence; setting the initial motor rotational speed of the pump according to the relationship between the required flow rate and the first preset required flow rate, the second preset required flow rate, and the third preset required flow rate; if the required flow rate is less than the first preset required flow rate, setting the initial motor rotational speed of the pump as the first preset motor rotational speed N1; if the required flow rate is greater than or equal to the first preset required flow rate and less than the second preset required flow rate, setting the initial motor rotational speed of the pump as the second preset motor rotational speed N2; if the required flow rate is greater than or equal to the second preset required flow rate and less than the third preset required flow rate, setting the initial motor rotational speed of the pump as the third preset motor rotational speed N3; if the required flow rate is greater than or equal to the third preset required flow rate, setting the initial motor rotational speed of the pump as the fourth preset motor rotational speed N4; where N1 < N2 < N3 < N4.

[0039] In some embodiments of the present application, setting the operating state of the pump according to the required flow rate and the required pressure further includes: after setting the initial motor speed of the pump to the i-th preset motor speed Ni according to the relationship between the required flow rate and the first preset required flow rate, the second preset required flow rate, and the third preset required flow rate, where i = 1, 2, 3, 4, adjusting the i-th preset motor speed Ni according to the required pressure to obtain the final motor speed of the pump; presetting a first preset required pressure, a second preset required pressure, and a third preset required pressure, and the first preset required pressure, the second preset required pressure, and the third preset required pressure increase in sequence; adjusting the i-th preset motor speed Ni according to the relationship between the required pressure and the first preset required pressure, the second preset required pressure, and the third preset required pressure to obtain the final motor speed of the pump; if the required pressure is less than the first preset required pressure, selecting a first speed correction coefficient m1 to adjust the i-th preset motor speed Ni to obtain the final motor speed of the pump as Ni × m1; if the required pressure is greater than or equal to the first preset required pressure and less than the second preset required pressure, selecting a second speed correction coefficient m2 to adjust the i-th preset motor speed Ni to obtain the final motor speed of the pump as Ni × m2; if the required pressure is greater than or equal to the second preset required pressure and less than the third preset required pressure, selecting a third speed correction coefficient m3 to adjust the i-th preset motor speed Ni to obtain the final motor speed of the pump as Ni × m3; if the required pressure is greater than or equal to the third preset required pressure, selecting a fourth speed correction coefficient m4 to adjust the i-th preset motor speed Ni to obtain the final motor speed of the pump as Ni × m4; where m1 < m2 < m3 < m4.

[0040] In this embodiment, the speed of the pump is positively correlated with the liquid flow rate and the liquid pressure. Therefore, by determining the ranges of the required flow rate and the required pressure, the corresponding initial motor speed and correction coefficient are selected to obtain the final motor speed.

[0041] The present invention also discloses a temperature control system for a solid-phase collection device, which is used to apply the temperature control method for the solid-phase collection device as Figure 2 shown. The system includes: a temperature adjustment module for adjusting the temperature of the sample to be processed.

[0042] An acquisition module for acquiring a first temperature value of the sample to be processed at the inlet of the column tube, and acquiring the flow rate, pressure value, and a second temperature value of the eluent at the inlet of the column tube after the adsorbent in the column tube has completed the adsorption of the sample to be processed.

[0043] A processing module, configured to determine an adjustment amount of the sample temperature of the sample to be processed according to the first temperature value, determine an adjustment amount of the eluent temperature of the eluent according to the second temperature value, and determine an adjustment amount of the flow rate and a pressure adjustment amount of the eluent according to the adjustment amount of the eluent temperature.

[0044] A setting module, configured to set an operating state of the pump based on the flow rate and pressure of the eluent according to the adjustment amount of the flow rate and the pressure adjustment amount.

[0045] A control module, configured to control a temperature adjustment module to adjust the temperature of the sample to be processed according to the adjustment amount of the sample temperature, and control the pump according to the operating state of the pump, so as to achieve temperature control of the solid-phase collection device.

[0046] By precisely controlling the temperatures of the sample to be processed and the eluent, the present invention can optimize the adsorption and desorption processes of the target analyte on the adsorbent, thereby improving the separation efficiency, enabling high-precision and rapid-response temperature control, and thus improving the product quality and production efficiency; by controlling the temperature and maintaining the temperature constant, it is possible to reduce sample degradation or structural changes caused by temperature fluctuations and ensure the stability of the analyte.

[0047] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that they can still modify or equivalently replace the technical solutions of the present invention, and these modifications or equivalent replacements do not enable the modified technical solutions to deviate from the spirit and scope of the technical solutions of the present invention.

[0048] For the system provided by the above embodiments, only the division of the above functional modules is used for illustration. In actual applications, the above functions can be allocated to different functional modules according to needs, that is, the modules or steps in the embodiments of the present invention can be further decomposed or combined. For example, the modules in the above embodiments can be combined into one module, or further split into multiple sub-modules to complete all or part of the functions described above. The names of the modules and steps involved in the embodiments of the present invention are only used to distinguish each module or step, and are not regarded as an improper limitation of the present invention.

[0049] Those skilled in the art should be able to realize that the modules and method steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, computer software, or a combination of the two. The programs corresponding to the software modules and method steps can be placed in a random access memory (RAM), internal memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the technical field. To clearly illustrate the interchangeability of electronic hardware and software, the composition and steps of each example have been generally described according to functions in the above description. Whether these functions are executed in the form of electronic hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present invention.

Claims

1. A temperature control method for a solid-phase collection device, characterized in that, Applied to a solid-phase collection device, the solid-phase collection device includes a column tube, an adsorbent, an eluent container, a pump, and a control module. The column tube is filled with the adsorbent. The eluent container is connected to the column tube. The pump is disposed between the eluent container and the column tube. The pump is used to control the flow rate and pressure of the eluent. The control module is connected to the pump and is used to control the working state of the pump; The method includes: Obtaining a first temperature value of a sample to be processed at the inlet of the column tube, and determining a sample temperature adjustment amount of the sample to be processed according to the first temperature value; After the adsorbent in the column tube completes the adsorption of the sample to be processed, obtaining the flow rate, pressure value, and a second temperature value of the eluent at the inlet of the column tube; Determining an eluent temperature adjustment amount of the eluent according to the second temperature value; Determining a flow rate adjustment amount and a pressure adjustment amount of the eluent according to the eluent temperature adjustment amount; Based on the flow rate and pressure of the eluent, setting the working state of the pump according to the flow rate adjustment amount and the pressure adjustment amount; Controlling a temperature adjustment module to adjust the temperature of the sample to be processed according to the sample temperature adjustment amount, and controlling the pump according to the working state of the pump to achieve temperature control of the solid-phase collection device.

2. The temperature control method for the solid-phase collection device according to claim 1, wherein Determining the sample temperature adjustment amount of the sample to be processed according to the first temperature value includes: Presetting a sample preset temperature in advance; Determining a sample temperature difference between the first temperature value and the sample preset temperature; Determining the sample temperature adjustment amount of the sample to be processed according to the sample temperature difference; The sample temperature adjustment amount is ∆T1 = |Ty1 - Ty0|, where Ty1 is the first temperature value and Ty0 is the sample preset temperature.

3. The temperature control method for the solid-phase collection device according to claim 2, characterized in that, Determining the sample temperature adjustment amount of the sample to be processed according to the first temperature value further includes: When the first temperature value is greater than the sample preset temperature, performing a cooling adjustment on the sample to be processed; When the first temperature value is less than the sample preset temperature, performing a heating adjustment on the sample to be processed.

4. The temperature control method for the solid-phase collection device according to claim 1, wherein, Determining the eluent temperature adjustment amount of the eluent according to the second temperature value includes: Determining an eluent temperature difference between the second temperature value and an eluent preset temperature; Presetting a first eluent temperature difference, a second eluent temperature difference, and a third eluent temperature difference, and the first eluent temperature difference, the second eluent temperature difference, and the third eluent temperature difference increase in sequence; Setting the eluent temperature adjustment amount of the eluent according to the relationship between the eluent temperature difference and the first eluent temperature difference, the second eluent temperature difference, and the third eluent temperature difference; If the eluent temperature difference is less than the first eluent temperature difference, setting the eluent temperature adjustment amount of the eluent to a first preset temperature adjustment amount Ts1; If the eluent temperature difference is greater than or equal to the first eluent temperature difference and the eluent temperature difference is less than the second eluent temperature difference, setting the eluent temperature adjustment amount of the eluent to a second preset temperature adjustment amount Ts2; If the temperature difference of the eluent is greater than or equal to the second temperature difference of the eluent and less than the third temperature difference of the eluent, set the temperature adjustment amount of the eluent to the third preset temperature adjustment amount Ts3; If the temperature difference of the eluent is greater than or equal to the third temperature difference of the eluent, set the temperature adjustment amount of the eluent to the fourth preset temperature adjustment amount Ts4; where Ts1 < Ts2 < Ts3 < Ts4.

5. The temperature control method for the solid-phase collection device according to claim 4, wherein Determine the flow rate adjustment amount and pressure adjustment amount of the eluent according to the temperature adjustment amount of the eluent, including: If the temperature adjustment amount of the eluent is the first preset temperature adjustment amount Ts1, set the flow rate adjustment amount to the first preset flow rate adjustment amount V1 and set the pressure adjustment amount to the first preset pressure adjustment amount P1; If the temperature adjustment amount of the eluent is the second preset temperature adjustment amount Ts2, set the flow rate adjustment amount to the second preset flow rate adjustment amount V2 and set the pressure adjustment amount to the second preset pressure adjustment amount P2; If the temperature adjustment amount of the eluent is the third preset temperature adjustment amount Ts3, set the flow rate adjustment amount to the third preset flow rate adjustment amount V3 and set the pressure adjustment amount to the third preset pressure adjustment amount P3; If the temperature adjustment amount of the eluent is the fourth preset temperature adjustment amount Ts4, set the flow rate adjustment amount to the fourth preset flow rate adjustment amount V4 and set the pressure adjustment amount to the fourth preset pressure adjustment amount P4; where V1 < V2 < V3 < V4, P1 < P2 < P3 < P4.

6. The temperature control method for the solid-phase collection device according to claim 1, characterized in that, Based on the flow rate and pressure of the eluent, set the working state of the pump according to the flow rate adjustment amount and pressure adjustment amount, including: Determine the required flow rate of the eluent according to the flow rate of the eluent and the flow rate adjustment amount; Determine the required pressure of the eluent according to the pressure of the eluent and the pressure adjustment amount; Set the working state of the pump according to the required flow rate and the required pressure.

7. The temperature control method for the solid-phase collection device according to claim 6, wherein Set the working state of the pump according to the required flow rate and the required pressure, including: Determine the initial motor speed of the pump according to the required flow rate; Preset the first preset required flow rate, the second preset required flow rate, and the third preset required flow rate, and the first preset required flow rate, the second preset required flow rate, and the third preset required flow rate increase in sequence; Set the initial motor speed of the pump according to the relationship between the required flow rate and the first preset required flow rate, the second preset required flow rate, and the third preset required flow rate; If the required flow rate is less than the first preset required flow rate, set the initial motor speed of the pump to the first preset motor speed N1; If the required flow rate is greater than or equal to the first preset required flow rate and less than the second preset required flow rate, set the initial motor speed of the pump to the second preset motor speed N2; If the required flow rate is greater than or equal to the second preset required flow rate and less than the third preset required flow rate, set the initial motor speed of the pump to the third preset motor speed N3; If the required flow rate is greater than or equal to the third preset required flow rate, set the initial motor speed of the pump to the fourth preset motor speed N4; where N1 < N2 < N3 < N4.

8. The temperature control method for the solid-phase collection device according to claim 7, characterized in that, Setting the operating state of the pump according to the required flow rate and the required pressure further includes: After setting the initial motor speed of the pump to the i-th preset motor speed Ni according to the relationship between the required flow rate and the first preset required flow rate, the second preset required flow rate, and the third preset required flow rate, where i = 1, 2, 3, 4, adjust the i-th preset motor speed Ni according to the required pressure to obtain the final motor speed of the pump; Preset a first preset required pressure, a second preset required pressure, and a third preset required pressure, and the first preset required pressure, the second preset required pressure, and the third preset required pressure increase in sequence; Adjust the i-th preset motor speed Ni according to the relationship between the required pressure and the first preset required pressure, the second preset required pressure, and the third preset required pressure to obtain the final motor speed of the pump; If the required pressure is less than the first preset required pressure, select the first speed correction coefficient m1 to adjust the i-th preset motor speed Ni, and the final motor speed of the pump is Ni × m1; If the required pressure is greater than or equal to the first preset required pressure and less than the second preset required pressure, select the second speed correction coefficient m2 to adjust the i-th preset motor speed Ni, and the final motor speed of the pump is Ni × m2; If the required pressure is greater than or equal to the second preset required pressure and less than the third preset required pressure, select the third speed correction coefficient m3 to adjust the i-th preset motor speed Ni, and the final motor speed of the pump is Ni × m3; If the required pressure is greater than or equal to the third preset required pressure, select the fourth speed correction coefficient m4 to adjust the i-th preset motor speed Ni, and the final motor speed of the pump is Ni × m4; where m1 < m2 < m3 < m4.

9. A temperature control system for a solid-phase collection device, which is used to apply the temperature control method for a solid-phase collection device according to any one of claims 1-8, characterized in that, The system includes: A temperature adjustment module for adjusting the temperature of the sample to be processed; An acquisition module for acquiring the first temperature value of the sample to be processed at the inlet of the column tube, and the flow rate, pressure value, and second temperature value of the eluent at the inlet of the column tube after the adsorbent in the column tube has completed the adsorption of the sample to be processed; A processing module for determining the sample temperature adjustment amount of the sample to be processed according to the first temperature value, determining the eluent temperature adjustment amount of the eluent according to the second temperature value, and determining the flow rate adjustment amount and pressure adjustment amount of the eluent according to the eluent temperature adjustment amount; A setting module for setting the operating state of the pump based on the flow rate and pressure of the eluent according to the flow rate adjustment amount and pressure adjustment amount; A control module, configured to control a temperature adjustment module to adjust the temperature of a sample to be processed according to the amount of sample temperature adjustment, and control a pump according to the operating state of the pump, so as to achieve temperature control of a solid-phase collection device.

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