Intelligent temperature management method and system for integrated circuit

Abstract

The invention discloses an intelligent temperature management method and system for an integrated circuit, which are used for performing different temperature control on functional modules in different areas, improving the heat distribution uniformity in the integrated circuit and reducing the aging condition caused by non-uniform heat. The method comprises the following steps: acquiring temperature measurement point data of a plurality of different positions of a to-be-measured chip; calculating temperature value change rates of a plurality of different temperature measuring points in a preset time according to the temperature measuring point data, and determining a high-dynamic hot spot region set in combination with a preset threshold value; calculating a temperature gradient value of each high-dynamic hot spot region and an adjacent region by utilizing spatial heterogeneity so as to generate a heat distribution path; controlling the heat dissipation equipment to execute a heat transfer action based on the heat distribution path, and calculating a heat transfer index of each high-dynamic hot spot region; determining the high-dynamic hot spot area with the heat transfer index not reaching the standard as a target area; and performing parameter adjustment on the function module in the target area to adjust the heating value of the function module.

Description

Technical Field

[0001] This application relates to the field of integrated circuit technology, and particularly to an intelligent temperature management method and system for integrated circuits. Background Art

[0002] An integrated circuit is a microelectronic device or component. It integrates many electronic components, such as transistors, resistors, capacitors, etc., on a tiny semiconductor chip through semiconductor manufacturing processes to form an electronic circuit system with specific functions. An integrated circuit can be a single functional module or a combination of multiple functional modules to achieve more complex electronic functions. As the core pillar of modern electronic technology, the performance and reliability of integrated circuits directly determine the development lifeline of the information industry. With the continuous improvement of chip integration and the sharp increase in power consumption density, thermal management has become a key bottleneck affecting the lifespan and operating efficiency of integrated circuits. Effective temperature control is not only a necessary condition for improving chip performance but also an indispensable foundation for ensuring the stable operation of the system. However, existing thermal management usually relies on global cooling means, such as air cooling or liquid cooling. However, when the number of functional modules integrated on the chip is large and the working temperature differences are significant, global cooling means cannot dynamically adjust for different regions, resulting in uneven heat distribution inside the integrated circuit, which further exacerbates the aging of the integrated circuit. Summary of the Invention

[0003] This application provides an intelligent temperature management method and system for integrated circuits, which are used to perform different temperature controls on functional modules in different regions, improve the uniformity of heat distribution inside the integrated circuit, and reduce the aging caused by uneven heat.

[0004] In the first aspect of this application, an intelligent temperature management method for integrated circuits is provided, including: Obtain temperature measurement point data at multiple different positions of the chip to be measured, where the temperature measurement point data includes the temperature values and spatial coordinates of different temperature measurement points; Calculate the temperature value change rate of the multiple different temperature measurement points within a preset time according to the temperature measurement point data, and determine a set of high-dynamic hot spot regions in combination with a preset threshold; Use spatial heterogeneity to calculate the temperature gradient values between each high-dynamic hot spot region and its adjacent regions to generate a heat distribution path; Based on the heat distribution path, control the heat dissipation device to perform a heat transfer action, and calculate the heat transfer index of each high-dynamic hot spot region; Determine the high-dynamic hot spot regions where the heat transfer index fails to meet the standard as target regions; Adjust the parameters of the functional modules in the target regions to adjust the heat generation of the functional modules.

[0005] Optionally, calculating the rate of change of the temperature values of the multiple different temperature measurement points within a preset time according to the temperature measurement point data, and determining a high-dynamic hot spot area set in combination with a preset threshold value, includes: Judging whether the temperature value of each temperature measurement point is greater than the temperature threshold value; If so, generating a potential hot spot area set according to the spatial coordinates corresponding to the temperature measurement points; Calculating the rate of change of the temperature values of each potential hot spot area within a preset time; Determining that the potential hot spot area with a rate of change of temperature value greater than the preset threshold value is a high-dynamic hot spot area, and obtaining a high-dynamic hot spot area set.

[0006] Optionally, calculating the temperature gradient between each high-dynamic hot spot area and its adjacent areas by using spatial heterogeneity to generate a heat distribution path, includes: Selecting several adjacent areas adjacent to the high-dynamic hot spot area as an analysis window; Calculating the distance and temperature difference between each grid point in the analysis window and the center point of the high-dynamic hot spot area, and determining that the quotient of the temperature difference and the distance is the temperature gradient value; Calculating the heat flux density vector according to the temperature gradient value and in combination with Fourier's law; Determining a heat distribution path according to the heat flux density vector.

[0007] Optionally, controlling a heat dissipation device to perform a heat transfer action based on the heat distribution path, includes: Generating a heat transfer instruction based on the heat distribution path; Sending the heat transfer instruction to the heat dissipation device to instruct the heat dissipation device to perform the heat transfer action in the heat transfer instruction.

[0008] Optionally, calculating the heat transfer index of each high-dynamic hot spot area, includes: Determining the total heat generation of each high-dynamic hot spot area; Calculating the heat dissipation of each high-dynamic hot spot area on the corresponding heat distribution path; Calculating the heat transfer index according to the total heat generation and the heat dissipation and in combination with a heat extraction rate algorithm.

[0009] Optionally, the heat transfer index includes a heat extraction rate, a heat flux, and a heat transfer efficiency.

[0010] A second aspect of the present application provides a temperature intelligent management system for an integrated circuit, including: An acquisition unit, configured to acquire temperature measurement point data of multiple different positions of a chip to be measured, where the temperature measurement point data includes temperature values and spatial coordinates of different temperature measurement points; A first calculation unit, configured to calculate the rate of change of the temperature values of the multiple different temperature measurement points within a preset time according to the temperature measurement point data, and determine a high-dynamic hot spot area set in combination with a preset threshold; A second calculation unit, configured to calculate the temperature gradient values between each high-dynamic hot spot area and its adjacent areas by using spatial heterogeneity to generate a heat distribution path; A control unit, configured to control a heat dissipation device to perform a heat transfer action based on the heat distribution path, and calculate the heat transfer index of each high-dynamic hot spot area; A determination unit, configured to determine a high-dynamic hot spot area with an unqualified heat transfer index as a target area; An adjustment unit, configured to adjust the parameters of the functional modules within the target area to adjust the heat generation amount of the functional modules.

[0011] Optionally, the first calculation unit is specifically configured to: Determine whether the temperature value of each temperature measurement point is greater than a temperature threshold; If so, generate a set of potential hot spot areas according to the spatial coordinates corresponding to the temperature measurement points; Calculate the rate of change of the temperature values of each potential hot spot area within a preset time; Determine a potential hot spot area with a rate of change of temperature value greater than a preset threshold as a high-dynamic hot spot area to obtain a high-dynamic hot spot area set.

[0012] Optionally, the second calculation unit is specifically configured to: Select several adjacent areas adjacent to the high-dynamic hot spot area as an analysis window; Calculate the distance and temperature difference between each grid point and the center point of the high-dynamic hot spot area within the analysis window, and determine the quotient of the temperature difference and the distance as the temperature gradient value; Calculate the heat flux density vector according to the temperature gradient value and in combination with Fourier's law; Determine the heat distribution path according to the heat flux density vector.

[0013] Optionally, the control unit is specifically configured to: Generate a heat transfer instruction based on the heat distribution path; Send the heat transfer instruction to the heat dissipation device to instruct the heat dissipation device to perform the heat transfer action in the heat transfer instruction.

[0014] It can be seen from the above technical solutions that the present application has the following effects: First, obtain the temperature measurement point data at multiple different positions of the chip to be measured. The temperature measurement point data includes the temperature values and spatial coordinates of different temperature measurement points. Then, calculate the temperature change rate of multiple different temperature measurement points within a preset time according to the temperature measurement point data, and determine the high-dynamic hot spot area set in combination with a preset threshold. Next, calculate the temperature gradient values between each high-dynamic hot spot area and its adjacent areas using spatial heterogeneity to generate a heat distribution path. Further, based on the heat distribution path, control the heat dissipation device to perform heat transfer actions, and calculate the heat transfer index of each high-dynamic hot spot area. Then, further determine the high-dynamic hot spot areas with unqualified heat transfer indices as target areas. Finally, adjust the parameters of the functional modules within the target areas to adjust the heat generation of the functional modules. In this way, by real-time monitoring of high-dynamic hot spot areas, a heat distribution path can be obtained based on each high-dynamic hot spot area to achieve heat transfer between different areas, and the preliminary temperature control of different functional modules can be completed. When the heat transfer relying on the heat distribution path cannot meet the cooling requirements, the self-parameters of each functional module within the target area can be adjusted to change the heat generation of the functional module itself to achieve further temperature control. Thus, different temperature controls can be performed on the functional modules in different areas, improving the uniformity of heat distribution inside the integrated circuit and reducing the aging caused by uneven heat. Description of the Drawings

[0015] Figure 1 Schematic diagram of an embodiment of a temperature intelligent management method for an integrated circuit in the present application; Figure 2-1 and Figure 2-2 Schematic diagram of another embodiment of a temperature intelligent management method for an integrated circuit in the present application; Figure 3 Schematic diagram of an embodiment of a temperature intelligent management system for an integrated circuit in the present application. Detailed Embodiments

[0016] The present application provides a temperature intelligent management method and system for an integrated circuit, which are used to perform different temperature controls on functional modules in different areas, improve the uniformity of heat distribution inside the integrated circuit, and reduce the aging caused by uneven heat.

[0017] The implementation described in the present application is executed on a system or server. Please refer to Figure 1 As shown, an embodiment of the temperature intelligent management method for an integrated circuit in the present application includes: 101. Obtain the temperature measurement point data at multiple different positions of the chip to be measured. The temperature measurement point data includes the temperature values and spatial coordinates of different temperature measurement points; An integrated circuit is a miniature electronic device or component that integrates many electronic components, such as transistors, resistors, capacitors, etc., on a tiny semiconductor chip through semiconductor manufacturing processes to form an electronic circuit system with specific functions. An integrated circuit can be a single functional module or a combination of multiple functional modules to achieve more complex electronic functions. A chip usually refers to the carrier of an integrated circuit, which is a thin sheet made of semiconductor material with a large number of electronic components and circuits integrated on it. A chip is the physical manifestation of an integrated circuit. It is a concrete object that can be installed on a circuit board and together with other electronic components form a complete electronic device. In this embodiment, a plurality of different types of functional modules are arranged on the chip to be tested, so temperature sensors are arranged at multiple different positions of the chip to be tested to obtain the temperature values of multiple temperature measurement points. At the same time, a position sensor is arranged near the temperature measurement point, and the real-time position of the temperature measurement point or the temperature sensor is detected by the position sensor to obtain the spatial coordinates of the temperature measurement point. By reasonably arranging temperature sensors and position sensors, the temperature distribution and spatial position of each functional module of the chip can be fully and accurately monitored. For example, temperature sensors and position sensors can be set in key positions such as the core area of the chip to be tested or near functional modules that are prone to generate heat.

[0018] 102. Calculate the temperature value change rate of multiple different temperature measurement points within a preset time according to the temperature measurement point data, and determine the high dynamic hot spot area set in combination with the preset threshold; In this embodiment, the temperature value change rate can reflect the temperature change speed of each temperature measurement point. By analyzing the temperature value change rate, it can be determined which areas have more drastic temperature changes, and then a preset threshold is set to screen out areas with more drastic temperature changes as high dynamic hot spots. Among them, the preset threshold can be set according to factors such as the type of chip to be tested, performance requirements, and actual application scenarios. When the temperature value change rate of a certain temperature measurement point exceeds the preset threshold, the area where the temperature measurement point is located can be determined as a high dynamic hot spot area.

[0019] 103. Use spatial heterogeneity to calculate the temperature gradient values of each high dynamic hot spot area and adjacent areas to generate a heat distribution path; Spatial heterogeneity refers to the phenomenon that there are differences in ecosystems, environmental factors, or other relevant variables at different positions within a specific spatial range. Spatial heterogeneity emphasizes the non-uniformity and variability in space. In ecology, it can be reflected in multiple aspects, such as the composition of biological communities, species distribution, soil properties, climate conditions, etc., which are different at different locations. This heterogeneity is a basic characteristic of natural ecosystems and has an important impact on ecological processes and biodiversity. In this embodiment, spatial heterogeneity can be used to visually display the temperature gradient distribution results in the form of a map. Different colors, symbols, or contour lines can be used to represent the magnitude and change trend of the temperature gradient, so as to more intuitively observe the temperature gradient distribution characteristics between hot spots and adjacent areas. For example, red represents the area with a larger temperature gradient, and blue represents the area with a smaller temperature gradient. Then, according to the specific temperature gradient values, determine the heat transfer path from the high-dynamic hot spot area to the adjacent low-temperature area, so as to determine the heat distribution path of each high-dynamic hot spot area.

[0020] 104. Based on the heat distribution path, control the heat dissipation device to perform heat transfer actions, and calculate the heat transfer index of each high-dynamic hot spot area; In this embodiment, the heat dissipation device may include heat sinks, fans, heat pipes, etc. By adjusting the operating parameters of the heat dissipation device, such as the rotation speed of the fan and the heat dissipation efficiency of the heat sink, guide the heat to transfer along the heat distribution path. During the heat transfer process, calculate the heat transfer index of each high-dynamic hot spot area. The heat transfer index can reflect the efficiency of heat transfer from the high-dynamic hot spot area, and its calculation method can comprehensively consider factors such as temperature change and time.

[0021] 105. Determine the high-dynamic hot spot area where the heat transfer index fails to meet the standard as the target area; In this embodiment, set the heat transfer standard according to the actual heat dissipation requirements of the integrated circuit. After obtaining the heat transfer index, compare the heat transfer index with the heat transfer standard. If the heat transfer index is less than the heat transfer standard, it means that the heat transfer index fails to meet the standard, and the heat transfer efficiency of the corresponding high-dynamic hot spot area is relatively low. At this time, this high-dynamic hot spot area can be determined as the target area.

[0022] 106. Adjust the parameters of the functional modules in the target area to adjust the heat generation of the functional modules.

[0023] After screening out the target area, it is necessary to adjust the parameters of the functional modules in the target area, such as reducing the operating frequency of the functional modules or adjusting the working mode, to reduce the heat generation of the functional modules, so that while heat transfer is carried out, the heat generation of the functional modules can be further reduced, realizing dual temperature control and improving the reliability of temperature control.

[0024] In this embodiment, first, temperature measurement point data at multiple different positions of the chip to be measured is obtained. The temperature measurement point data includes the temperature values and spatial coordinates of different temperature measurement points. Then, based on the temperature measurement point data, the temperature value change rates of multiple different temperature measurement points within a preset time are calculated, and a set of high-dynamic hot spot regions is determined in combination with a preset threshold. Next, the temperature gradient values between each high-dynamic hot spot region and its adjacent regions are calculated using spatial heterogeneity to generate a heat distribution path. Further, based on the heat distribution path, a heat dissipation device is controlled to perform a heat transfer action, and the heat transfer index of each high-dynamic hot spot region is calculated. Still further, the high-dynamic hot spot regions with unqualified heat transfer indices are determined as target regions. Finally, the parameters of the functional modules within the target regions are adjusted to regulate the heat generation of the functional modules. In this way, by real-time monitoring of high-dynamic hot spot regions, a heat distribution path is obtained based on each high-dynamic hot spot region to achieve heat transfer between different regions, and the preliminary temperature control of different functional modules is completed. When the heat transfer relying on the heat distribution path cannot meet the cooling requirement, the self-parameters of each functional module within the target region can be adjusted to change the self-heat generation of the functional module to achieve further temperature control. Thus, different temperature controls can be performed on the functional modules in different regions, improving the uniformity of the heat distribution inside the integrated circuit and reducing the aging caused by uneven heat.

[0025] Please refer to Figure 2-1 and Figure 2-2 As shown, another embodiment of the temperature intelligent management method for the integrated circuit in this application includes: 201. Obtain temperature measurement point data at multiple different positions of the chip to be measured, where the temperature measurement point data includes the temperature values and spatial coordinates of different temperature measurement points; Step 201 in this embodiment is similar to step 101 in the foregoing Figure 1 shown embodiment, and will not be elaborated here.

[0026] 202. Determine whether the temperature value of each temperature measurement point is greater than the temperature threshold. If so, execute step 203; 203. Generate a set of potential hot spot regions according to the spatial coordinates corresponding to the temperature measurement points; 204. Calculate the temperature value change rate of each potential hot spot region within a preset time; 205. Determine the potential hot spot regions with a temperature value change rate greater than the preset threshold as high-dynamic hot spot regions to obtain a set of high-dynamic hot spot regions; Optionally, in this embodiment, the temperature values corresponding to multiple temperature measurement points arranged in the integrated circuit are first obtained, and the temperature measurement points that may be hot spots are preliminarily screened out by comparing the current temperature value of each temperature measurement point with the temperature threshold. Then, based on the spatial coordinates corresponding to the temperature measurement point whose current temperature value is greater than the temperature threshold, and combined with the physical structure and layout information of the integrated circuit, other temperature measurement points adjacent to it can be determined, and the area covered by these temperature measurement points is defined as a potential hot spot area. Among them, the temperature threshold is a temperature value pre-set according to the performance and reliability requirements of the integrated circuit, and is not specifically limited here.

[0027] The preset time is a unit time period pre-set according to actual needs and the working characteristics of the integrated circuit. For each potential hot spot area in the potential hot spot area concentration, the relationship between the change of its temperature value and time within the preset time is calculated to obtain the temperature value change rate. It should be noted that the temperature value change rate can be obtained by dividing the temperature value difference of all temperature measurement points in the potential hot spot area at the start and end of the preset time by the preset time. After obtaining the temperature value change rate of each potential hot spot area, the temperature value change rate of each potential hot spot area is compared with the preset threshold. When the temperature value change rate of a potential hot spot area is greater than the preset threshold, it means that the temperature change of the potential hot spot area is more drastic, and it is determined as a high dynamic hot spot area. By identifying the high dynamic hot spot area in the integrated circuit, the monitoring accuracy of the local temperature change of the integrated circuit can be improved, the thermal stress of the integrated circuit can be effectively reduced, the performance and reliability of the integrated circuit can be improved, and its service life can be extended.

[0028] 206. Selecting a number of adjacent areas adjacent to the high dynamic hot spot area as analysis windows; 207. Calculate the distance and temperature difference between each grid point and the center point of the high dynamic hot spot area in the analysis window, and determine the quotient of the temperature difference and the distance as the temperature gradient value; 208. Calculate the heat flux density vector based on the temperature gradient value and in combination with Fourier's law; 209. Determine a heat distribution path according to a heat flux density vector; Optionally, in this embodiment, with the high dynamic hot spot area as the center, an area of a certain size adjacent to or close to it is selected as the analysis window. The selection of the analysis window can be determined according to actual needs, for example, a grid area directly adjacent to the high dynamic hot spot area can be selected, or an adjacent area within a certain radius can be selected. The size and shape of the analysis window can be reasonably selected according to the specific application scenario, and are not limited here.

[0029] When calculating the temperature gradient value, first divide the analysis window into several grid points, and each grid point represents a small area. Then, calculate the distance between each grid point and the center point of the high-dynamic hot spot area. The Euclidean distance formula can be used for the calculation, that is, for two points and , the distance between them . Next, calculate the temperature difference between each grid point and the center point of the high-dynamic hot spot area, and divide the temperature difference by the distance between the two points to obtain the temperature gradient value. Fourier's law states that the heat flux density vector is proportional to the temperature gradient vector. Therefore, the heat flux density vector of each grid point can be calculated according to Fourier's law. It should be noted that the direction of the heat flux density vector is opposite to the direction of the temperature gradient vector, that is, heat always flows from the high-temperature area to the low-temperature area. The heat flux density vector represents the flow direction and intensity of heat at each grid point. By analyzing and integrating the heat flux density vectors of all grid points within the analysis window, the distribution path of heat flowing from the high-dynamic hot spot area to the surrounding areas can be determined. Among them, methods such as streamline tracing can be used to determine the heat distribution path. Specifically, starting from the center point of the high-dynamic hot spot area, trace along the direction of the heat flux density vector until reaching the boundary of the analysis window or other specific areas. During the tracing process, record the grid points passed through, and the path composed of these grid points is the heat distribution path.

[0030] 210. Generate a heat transfer instruction based on the heat distribution path; 211. Send the heat transfer instruction to the heat dissipation device to instruct the heat dissipation device to perform the heat transfer action in the heat transfer instruction; Optionally, in this embodiment, after determining the heat distribution path, a corresponding heat transfer instruction may be generated according to the heat distribution path. The heat transfer instruction includes specific heat transfer actions that the heat dissipation device needs to execute. The heat transfer actions may include information such as the direction, speed, and target temperature of heat transfer. For example, when the heat distribution path shows that a certain part of the integrated circuit has excessive heat, it is necessary to transfer the heat of this part to other parts with better heat dissipation. Then the generated heat transfer instruction will instruct the heat dissipation device to transfer the heat of this part in a specified direction and set an appropriate transfer speed to ensure that the temperature of this part is reduced to the target temperature within a certain time. After generating the heat transfer instruction, the heat transfer instruction can be sent to the heat dissipation device through wired communication or wireless communication. After receiving the heat transfer instruction, the heat dissipation device will execute the heat transfer action according to the specific requirements in the heat transfer instruction. For example, if the instruction requires transferring heat from the upper part of the device to the lower part, the heat dissipation device will activate the corresponding heat dissipation devices (such as heat sinks, fans, and heat pipes), and adjust their working states to achieve effective heat transfer. In this way, the heat dissipation device can perform precise heat transfer according to actual needs, avoiding unnecessary energy consumption, and thus reducing energy waste.

[0031] 212. Determine the total heat generation of each high-dynamic hot spot area; 213. Calculate the heat dissipation of each high-dynamic hot spot area on the corresponding heat distribution path; 214. Calculate the heat transfer index according to the total heat generation and heat dissipation and in combination with the heat extraction rate algorithm; Optionally, in this embodiment, the total heat generation of the high-dynamic hot spot area refers to the total heat generated by all functional modules in this area within a certain time. Since different types of functional modules have different power consumption characteristics, such as the power consumption differences between processor cores and memory modules during operation are very large. Therefore, the power consumption data of each functional module can be obtained by querying the technical manual of the functional module or through actual measurement. In addition, the working state of the functional module also affects its heat generation. For example, the heat generation of the processor during high-load operation is much higher than that during low-load operation. Therefore, it is necessary to monitor the working state of the functional module in real time and adjust its power consumption data according to different working states. After obtaining the heat generation of each functional module, the heat generations of all functional modules in the high-dynamic hot spot area are summed to obtain the total heat generation of this area. The heat transfer on the heat distribution path is realized through heat dissipation devices such as heat sinks, fans, and heat pipes. Therefore, the heat dissipation of each high-dynamic hot spot area on the corresponding heat distribution path can be calculated according to the heat dissipation efficiency of the heat dissipation device and the thermal resistance of the heat distribution path. , and specifically, the following formula can be used for calculation: Among them, represents the temperature difference value between the high-dynamic hot spot area and the surrounding environment or the heat dissipation device, represents the thermal resistance of the heat distribution path, represents the heat dissipation efficiency of the heat dissipation component.

[0032] Finally, substitute the calculated total heat generation and heat dissipation into the heat extraction rate calculation formula to obtain the heat extraction rate , and this heat extraction rate can be used as the heat transfer index. In another implementable manner, the heat flux and the heat transfer efficiency can also be used as the heat transfer index to improve the comprehensiveness and reliability of the heat transfer index.

[0033] 215. Determine the high-dynamic hot spot area where the heat transfer index fails to meet the standard as the target area; 216. Adjust the parameters of the functional modules in the target area to adjust the heat generation of the functional modules.

[0034] Steps 215 and 216 in this embodiment are similar to steps 105 and 106 in the foregoing Figure 1 shown embodiment, and will not be elaborated here.

[0035] Please refer to Figure 3 shown. An embodiment of the temperature intelligent management system of the integrated circuit in the present application includes: An acquisition unit 301, configured to acquire temperature measurement point data at multiple different positions of the chip to be measured, and the temperature measurement point data includes the temperature values and spatial coordinates of different temperature measurement points; A first calculation unit 302, configured to calculate the temperature value change rate of multiple different temperature measurement points within a preset time according to the temperature measurement point data, and determine a set of high-dynamic hot spot areas in combination with a preset threshold; A second calculation unit 303, configured to calculate the temperature gradient values between each high-dynamic hot spot area and its adjacent area by using spatial heterogeneity to generate a heat distribution path; A control unit 304, configured to control the heat dissipation device to perform a heat transfer action based on the heat distribution path, and calculate the heat transfer index of each high-dynamic hot spot area; A determination unit 305, configured to determine the high-dynamic hot spot area where the heat transfer index fails to meet the standard as the target area; An adjustment unit 306, configured to adjust the parameters of the functional modules in the target area to adjust the heat generation of the functional modules.

[0036] In this embodiment, the acquisition unit 301 acquires temperature measurement point data at multiple different positions of the chip to be measured. The temperature measurement point data includes the temperature values and spatial coordinates of different temperature measurement points. The first calculation unit 302 calculates the temperature value change rates of multiple different temperature measurement points within a preset time according to the temperature measurement point data, and determines a set of high-dynamic hot spot regions in combination with a preset threshold. The second calculation unit 303 calculates the temperature gradient values between each high-dynamic hot spot region and its adjacent regions by using spatial heterogeneity to generate a heat distribution path. The control unit 304 controls the heat dissipation device to perform a heat transfer action based on the heat distribution path, and calculates the heat transfer index of each high-dynamic hot spot region. The determination unit 305 determines the high-dynamic hot spot regions with unqualified heat transfer indexes as target regions. The adjustment unit 306 adjusts the parameters of the functional modules in the target regions to adjust the heat generation amount of the functional modules. In this way, by monitoring high-dynamic hot spot regions in real time and obtaining a heat distribution path based on each high-dynamic hot spot region to achieve heat transfer between different regions, the preliminary temperature control of different functional modules can be completed. When the heat transfer relying on the heat distribution path cannot meet the cooling requirement, the self-parameters of each functional module in the target region can be adjusted to change the self-heat generation amount of the functional module to achieve further temperature control. Thus, different temperature controls can be performed on the functional modules in different regions, improving the uniformity of the heat distribution inside the integrated circuit and reducing the aging caused by uneven heat.

[0037] Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the above-described systems, devices, and units can refer to the corresponding processes in the foregoing method embodiments and will not be elaborated herein.

[0038] In several embodiments provided in the present application, it should be understood that the disclosed systems, devices, and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the units is only a logical function division, and there may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed couplings or direct couplings or communication connections to each other can be through some interfaces. The indirect couplings or communication connections of devices or units can be in electrical, mechanical, or other forms.

[0039] The units described as separate components may or may not be physically separated. The components displayed as units may or may not be physical units, that is, they can be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0040] In addition, in each embodiment of the present application, each functional unit can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of a software functional unit.

[0041] If the above-mentioned integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present application. The foregoing storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memories (ROM, read-only memory), random access memories (RAM, random access memory), magnetic disks, or optical discs that can store program codes.

Claims

1. A method for intelligent temperature management of an integrated circuit, characterized in that, Including: Obtain temperature measurement point data at multiple different positions of the chip to be measured, where the temperature measurement point data includes temperature values and spatial coordinates of different temperature measurement points; Calculate the temperature value change rate of the multiple different temperature measurement points within a preset time according to the temperature measurement point data, and determine a set of high-dynamic hot spot regions in combination with a preset threshold; Calculate the temperature gradient values between each high-dynamic hot spot region and adjacent regions using spatial heterogeneity to generate a heat distribution path; Based on the heat distribution path, control the heat dissipation device to perform a heat transfer action, and calculate the heat transfer index of each high-dynamic hot spot region; Determine the high-dynamic hot spot regions where the heat transfer index fails to meet the standard as target regions; Adjust the parameters of the functional modules within the target regions to adjust the heat generation of the functional modules.

2. The temperature intelligent management method of the integrated circuit according to claim 1, characterized in that The calculating the temperature value change rate of the multiple different temperature measurement points within a preset time according to the temperature measurement point data, and determining a set of high-dynamic hot spot regions in combination with a preset threshold includes: Judge whether the temperature value of each temperature measurement point is greater than the temperature threshold; If so, generate a set of potential hot spot regions according to the spatial coordinates corresponding to the temperature measurement points; Calculate the temperature value change rate of each potential hot spot region within a preset time; Determine the potential hot spot regions with a temperature value change rate greater than the preset threshold as high-dynamic hot spot regions to obtain a set of high-dynamic hot spot regions.

3. The temperature intelligent management method of the integrated circuit according to claim 1, characterized in that, The calculating the temperature gradient between each high-dynamic hot spot region and adjacent regions using spatial heterogeneity to generate a heat distribution path includes: Select several adjacent regions adjacent to the high-dynamic hot spot regions as analysis windows; Calculate the distance and temperature difference between each grid point and the center point of the high-dynamic hot spot region within the analysis window, and determine the quotient of the temperature difference and the distance as the temperature gradient value; Calculate the heat flux density vector according to the temperature gradient value and in combination with Fourier's law; Determine the heat distribution path according to the heat flux density vector.

4. The temperature intelligent management method of the integrated circuit according to claim 1, wherein The controlling the heat dissipation device to perform a heat transfer action based on the heat distribution path includes: Generate a heat transfer instruction based on the heat distribution path; Send the heat transfer instruction to the heat dissipation device to instruct the heat dissipation device to perform the heat transfer action in the heat transfer instruction.

5. The temperature intelligent management method of the integrated circuit according to claim 1, characterized in that The calculating the heat transfer index of each high-dynamic hot spot region includes: Determine the total heat generation of each high-dynamic hot spot region; Calculate the heat dissipation of each high-dynamic hot spot region on the corresponding heat distribution path; Calculate the heat transfer index according to the total heat generation and the heat dissipation and in combination with the heat extraction rate algorithm.

6. The temperature intelligent management method of the integrated circuit according to any one of claims 1 to 5, characterized in that The heat transfer index includes heat extraction rate, heat flux, and heat transfer efficiency.

7. An intelligent temperature management system for an integrated circuit, characterized in that, Including: An acquisition unit for acquiring temperature measurement point data at multiple different positions of the chip to be measured, where the temperature measurement point data includes temperature values and spatial coordinates of different temperature measurement points; A first calculation unit for calculating the temperature value change rate of the multiple different temperature measurement points within a preset time according to the temperature measurement point data, and determining a set of high-dynamic hot spot regions in combination with a preset threshold; A second calculation unit for calculating the temperature gradient values between each high-dynamic hot spot region and adjacent regions using spatial heterogeneity to generate a heat distribution path; A control unit, configured to control a heat dissipation device to perform a heat transfer action based on the heat distribution path and calculate a heat transfer index for each high-dynamic hot spot area; A determination unit, configured to determine a high-dynamic hot spot area with an unqualified heat transfer index as a target area; An adjustment unit, configured to adjust parameters of a functional module in the target area to adjust the heat generation amount of the functional module.

8. The temperature intelligent management system of the integrated circuit according to claim 7, characterized in that, The first calculation unit is specifically configured to: Judge whether the temperature value of each temperature measurement point is greater than a temperature threshold; If so, generate a set of potential hot spot areas according to the spatial coordinates corresponding to the temperature measurement points; Calculate the temperature change rate of each potential hot spot area within a preset time; Determine a potential hot spot area with a temperature change rate greater than a preset threshold as a high-dynamic hot spot area, and obtain a set of high-dynamic hot spot areas.

9. The temperature intelligent management system of the integrated circuit according to claim 7, characterized in that The second calculation unit is specifically configured to: Select several adjacent areas adjacent to the high-dynamic hot spot area as analysis windows; Calculate the distance and temperature difference between each grid point and the center point of the high-dynamic hot spot area within the analysis window, and determine the quotient of the temperature difference and the distance as the temperature gradient value; Calculate a heat flux density vector according to the temperature gradient value in combination with Fourier's law; Determine a heat distribution path according to the heat flux density vector.

10. The temperature intelligent management system of the integrated circuit according to claim 7, characterized in that, The control unit is specifically configured to: Generate a heat transfer instruction based on the heat distribution path; Send the heat transfer instruction to the heat dissipation device to instruct the heat dissipation device to perform the heat transfer action in the heat transfer instruction.

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