Electronic device

Abstract

An electronic device includes a sensor layer including a sensing area and a peripheral area adjacent to the sensing area, the sensing area and the peripheral area defined in the sensor layer. The sensor layer includes a plurality of first electrodes, a plurality of second electrodes, a plurality of first traces electrically connected to the plurality of first electrodes in a one-to-one correspondence manner, a plurality of second traces electrically connected to the plurality of second electrodes in a one-to-one correspondence manner, and a first loop trace electrically connected to one of the plurality of second electrodes. The first closed loop includes one of a plurality of second traces connected to one of the second electrodes, and the first loop trace may be defined in the sensor layer.

Description

[0001] Cross - reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10 - 2024 - 0007504, filed on January 17, 2024, the entire contents of which are incorporated herein by reference. Technical field

[0003] The present disclosure relates to an electronic device having improved sensing sensitivity. Background art

[0004] Multimedia electronic devices such as televisions, mobile phones, tablet computers, laptop computers, navigation systems, and game consoles include a display device for displaying images. An electronic device may include a sensor layer (or input sensor) capable of providing a touch - based input method in addition to typical input methods such as buttons, keyboards, and mice, which allows a user to easily, intuitively, and conveniently input information or commands. The sensor layer can sense a user's touch or pressure. There is an increasing demand for the use of a pen for users accustomed to inputting information by using a writing tool or for detailed touch input for a specific application (e.g., an application for sketching or drawing). Summary of the invention

[0005] The present disclosure may provide an electronic device having improved sensing sensitivity.

[0006] Embodiments of the inventive concept provide an electronic device including a sensor layer including a sensing area and a peripheral area adjacent to the sensing area, the sensing area and the peripheral area being defined in the sensor layer, wherein the sensor layer includes: a plurality of first electrodes disposed in the sensing area and arranged along a first direction; a plurality of second electrodes disposed in the sensing area and arranged along a second direction crossing the first direction; a plurality of first traces electrically connected to the plurality of first electrodes in a one - to - one correspondence; a plurality of second traces electrically connected to the plurality of second electrodes in a one - to - one correspondence; and a first loop trace electrically connected to one of the plurality of second electrodes, wherein a first closed loop includes one of the plurality of second traces connected to one of the second electrodes, and the first loop trace may be defined in the sensor layer.

[0007] In an embodiment, one of the second traces and the first loop trace may be electrically connected to one pad.

[0008] In an embodiment, one of the second traces may be disposed in the peripheral area, and the first loop trace may be disposed in the sensing area.

[0009] In an embodiment, a second trace and a first loop trace may be disposed in the peripheral region.

[0010] In an embodiment, a second trace may be spaced apart from the sensing region, and the first loop trace may be interposed between the second trace and the sensing region.

[0011] In an embodiment, a second trace may be spaced apart from the first loop trace, and the sensing region may be interposed between the second trace and the first loop trace.

[0012] In an embodiment, the sensor layer may further include a second loop trace electrically connected to another second electrode among the plurality of second electrodes, and the second closed loop may be defined by the second trace connected to the other second electrode among the plurality of second traces, the other second electrode, and the second loop trace.

[0013] In an embodiment, the sensor layer may further include a plurality of pads electrically connected to the plurality of first traces and the plurality of second traces, wherein the plurality of pads may be arranged along a first direction.

[0014] In an embodiment, a second electrode may extend along the first direction.

[0015] In an embodiment, the sensor layer may further include a plurality of pads electrically connected to the plurality of first traces and the plurality of second traces, wherein a second electrode may extend in a direction intersecting the arrangement direction of the plurality of pads.

[0016] In an embodiment, the first loop trace may be disposed on a layer different from the layer of the plurality of second traces.

[0017] In an embodiment, the electronic device may further include a display layer disposed below the sensor layer and a charging coil disposed below the display layer, wherein the charging coil may overlap with the first closed loop.

[0018] In an embodiment of the inventive concept, an electronic device includes: a display panel including a display layer and a sensor layer, the display layer configured to display an image, the sensor layer disposed on the display layer and including a sensing region and a peripheral region adjacent to the sensing region, the sensing region and the peripheral region being defined in the sensor layer; and a charging coil disposed below the display panel, wherein the sensor layer includes: a plurality of first electrodes disposed in the sensing region and arranged along a first direction; a plurality of second electrodes disposed in the sensing region and arranged along a second direction intersecting the first direction; and a plurality of traces connected to the plurality of first electrodes and the plurality of second electrodes in a one-to-one correspondence, wherein a closed loop including one of the plurality of traces may be defined in the sensor layer.

[0019] In an embodiment, the closed loop may overlap with the charging coil.

[0020] In an embodiment, the sensor layer may further include a loop trace electrically connected to a trace, and the closed loop may include the loop trace.

[0021] In an embodiment, a trace may be disposed in the peripheral region, and the loop trace may be disposed in the sensing region.

[0022] In an embodiment, a trace may be spaced apart from the sensing region, and the loop trace may be interposed between the trace and the sensing region.

[0023] In an embodiment, a trace may be spaced apart from the loop trace, and the sensing region may be interposed between the trace and the loop trace.

[0024] In an embodiment of the inventive concept, an electronic device includes a display panel and a charging coil disposed under the display panel. The display panel includes a display layer and a sensor layer disposed on the display layer. The sensor layer includes: a plurality of first electrodes arranged along a first direction; a plurality of second electrodes arranged along a second direction intersecting the first direction; and a loop trace electrically connected to one of the plurality of first electrodes and the plurality of second electrodes. A closed loop overlapping with the charging coil may be defined in the sensor layer, and the closed loop may include the loop trace.

[0025] In an embodiment, the sensor layer may further include a plurality of first traces electrically connected to the plurality of first electrodes in a one-to-one correspondence and a plurality of second traces electrically connected to the plurality of second electrodes in a one-to-one correspondence, and the closed loop may further include a trace electrically connected to one electrode among the plurality of first traces and the plurality of second traces. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings are included to provide a further understanding of the inventive concept, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the inventive concept and, together with the description, serve to explain the principles of the inventive concept. In the drawings:

[0027] Figure 1A is a perspective view of an electronic device according to an embodiment of the inventive concept;

[0028] Figure 1B is a perspective view of the rear surface of an electronic device according to an embodiment of the inventive concept;

[0029] Figure 2 is a perspective view of an electronic device according to an embodiment of the inventive concept;

[0030] Figure 3A is a schematic cross-sectional view of an electronic device according to an embodiment of the inventive concept;

[0031] Figure 3B is a schematic cross-sectional view of an electronic device according to an embodiment of the inventive concept;

[0032] Figure 4A describes the operation of an electronic device according to an embodiment of the inventive concept;

[0033] Figure 4B describes the operation of an electronic device according to an embodiment of the inventive concept;

[0034] Figure 5 shows a pen according to an embodiment of the inventive concept;

[0035] Figure 6A is a cross-sectional view of a display panel according to an embodiment of the inventive concept;

[0036] Figure 6B is a cross-sectional view of a sensor layer according to an embodiment of the inventive concept;

[0037] Figure 7 is a plan view of a sensor layer according to an embodiment of the inventive concept;

[0038] Figure 8 shows a partial configuration of a sensor layer and a charging coil according to an embodiment of the inventive concept;

[0039] Figure 9 is a plan view of a sensor layer according to an embodiment of the inventive concept;

[0040] Figure 10 is a plan view of a sensor layer according to an embodiment of the inventive concept;

[0041] Figure 11 is a plan view of a sensor layer according to an embodiment of the inventive concept;

[0042] Figure 12 is a plan view of a sensor layer according to an embodiment of the inventive concept;

[0043] Figure 13 is a plan view of a sensor layer according to an embodiment of the inventive concept;

[0044] Figure 14 is a plan view of a sensor layer according to an embodiment of the inventive concept; and

[0045] Figure 15 is a plan view of a sensor layer according to an embodiment of the inventive concept. Detailed Description

[0046] In this specification, it will be understood that when an element (or region, layer, portion, etc.) is referred to as being "on," "connected to," or "coupled to" another element, it can be directly on, directly connected to, or directly coupled to the other element, or there can be intervening elements between them.

[0047] Like reference numerals always denote like elements. Further, in the drawings, the thickness, ratios, and dimensions of elements are exaggerated for the purpose of effective description of the technical content. As used herein, the word "or" means a logical "or," and thus the statement "A, B, or C" means "A and B and C," "A and B but not C," "A and C but not B," "B and C but not A," "A but not B and not C," "B but not A and not C," and "C but not A and not B" unless the context indicates otherwise.

[0048] It will be understood that although terms such as first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of the present invention, a first element may be referred to as a second element. Similarly, a second element may also be referred to as a first element. Unless otherwise stated, the singular forms of terms include the plural forms.

[0049] In addition, for convenience of description, terms such as "below," "beneath," "above," "on," etc. are used herein to describe the relationship of one element to another (other) element as shown in the drawings. The above terms are relative concepts and are described based on the directions indicated in the drawings.

[0050] It will be understood that when used in this specification, the terms "comprises," "comprising," and "has" (and their variants, such as "comprising of") specify the presence of the stated features, integers, steps, operations, elements, components, or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof.

[0051] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formalized sense unless expressly so defined herein.

[0052] The terms "part" or "unit" refer to a software component or a hardware component that performs a specific function. A hardware component may include, for example, a field-programmable gate array (FPGA) or an application-specific integrated circuit (ASIC). A software component may refer to executable code or data used by the executable code in an addressable storage medium. Thus, a software component may be, for example, an object-oriented software component, a class component, and a task component, and may include a process, a function, a property, a procedure, a subroutine, a program code segment, a driver, firmware, microcode, data, a database, a data structure, a table, an array, or a variable.

[0053] Hereinafter, embodiments of the inventive concept will be described with reference to the accompanying drawings.

[0054] Figure 1A is a perspective view of an electronic device 1000 according to an embodiment of the inventive concept. Figure 1B is a perspective view of a rear surface of the electronic device 1000 according to an embodiment of the inventive concept.

[0055] Reference Figure 1A and Figure 1B , the electronic device 1000 may be activated according to an electrical signal. For example, the electronic device 1000 may display an image and sense an input applied from the outside. The external input may be a user input. The user input may include various types of external inputs such as a part of a user's body, a pen PN, light, heat, or pressure.

[0056] The electronic device 1000 may include a first display panel DP1 and a second display panel DP2. The first display panel DP1 and the second display panel DP2 may be separate panels. The first display panel DP1 may be referred to as a main display panel, and the second display panel DP2 may be referred to as an auxiliary display panel or an external display panel.

[0057] The first display panel DP1 may include a first display portion DA1-F, and the second display panel DP2 may include a second display portion DA2-F. The area of the second display panel DP2 may be smaller than the area of the first display panel DP1. For the first display portion DA1-F and the second display portion DA2-F corresponding to the sizes of the first display panel DP1 and the second display panel DP2, the area of the first display portion DA1-F may be larger than the area of the second display portion DA2-F.

[0058] When the electronic device 1000 is unfolded, the first display portion DA1-F may have a plane that is substantially parallel to the first direction DR1 and the second direction DR2. The thickness direction of the electronic device 1000 may be parallel to a third direction DR3 that intersects the first direction DR1 and the second direction DR2. Accordingly, the front (or upper) surface and the rear (or lower) surface of the components constituting the electronic device 1000 may be defined based on the third direction DR3.

[0059] The first display panel DP1 or the first display portion DA1-F may include a folding region FA that folds and unfolds, and a plurality of non-folding regions NFA1 and NFA2 that are spaced apart from each other and between which the folding region FA is interposed. The second display panel DP2 may overlap one of the plurality of non-folding regions NFA1 and NFA2. For example, the second display panel DP2 may overlap the first non-folding region NFA1.

[0060] The display direction of the first image IM1a displayed on a part of the first display panel DP1 (e.g., the first non-folding region NFA1) and the display direction of the second image IM2a displayed on the second display panel DP2 may be opposite to each other. For example, the first image IM1a may be displayed in the third direction DR3, and the second image IM2a may be displayed in a fourth direction DR4 that is opposite to the third direction DR3.

[0061] In an embodiment of the inventive concept, the folding region FA may be bent based on a folding axis extending in a direction parallel to the long side of the electronic device 1000 (e.g., in a direction parallel to the second direction DR2). When the electronic device 1000 is folded, the folding region FA has a predetermined curvature and a predetermined radius of curvature. The first non-folding region NFA1 and the second non-folding region NFA2 may face each other, and the electronic device 1000 may be folded inwardly such that the first display portion DA1-F is not exposed to the outside.

[0062] In an embodiment of the inventive concept, the electronic device 1000 may be folded outwardly such that the first display portion DA1-F is exposed to the outside. In an embodiment of the inventive concept, the electronic device 1000 may be capable of being folded inwardly or outwardly in an unfolded state, but embodiments of the inventive concept are not limited thereto.

[0063] Figure 1A Exemplarily, one folding region FA is defined in the electronic device 1000, but embodiments of the inventive concept are not limited thereto. For example, a plurality of folding axes and corresponding plurality of folding regions may be defined in the electronic device, and the electronic device may be folded inwardly or outwardly in each of the plurality of folding regions in an unfolded state.

[0064] According to an embodiment of the inventive concept, the electronic device 1000 may be provided (defined, include, or form) with a storage slot PN-AC for storing the pen PN. The pen PN may be inserted and stored in the storage slot PN-AC. In this case, the user may easily carry the pen PN by storing it in the electronic device 1000. In an embodiment of the inventive concept, the electronic device 1000 may further include a charging coil for charging the pen PN or a charging coil for wirelessly charging the electronic device 1000.

[0065] Figure 2 is a perspective view of an electronic device 1000-1 according to an embodiment of the inventive concept.

[0066] Figure 2 Exemplarily, the electronic device 1000-1 is shown as a bar-type mobile phone (or tablet), and the electronic device 1000-1 may include a display panel DP.

[0067] In an embodiment of the inventive concept, the display panel DP may sense an input applied from the outside. The external input may be an input of a user. The input of the user may include various types of external inputs such as a part of the user's body, the pen PN (see Figure 1A ), light, heat, or pressure.

[0068] According to an embodiment of the inventive concept, the electronic device 1000-1 may be provided with a storage slot PN-AC to store the pen PN. The pen PN may be inserted and stored in the storage slot PN-AC. When the pen PN is stored in the storage slot PN-AC, the pen PN may be charged through a charging coil included in the electronic device 1000-1.

[0069] Figure 1A Exemplarily, a foldable-type electronic device 1000 is shown, and Figure 2 exemplarily, a bar-type electronic device 1000-1 is shown, but the inventive concept described below is not limited thereto. For example, the description provided below may be applied to various electronic devices such as a rollable-type electronic device, a slide-type electronic device, and a stretchable-type electronic device.

[0070] Figure 3A is a schematic cross-sectional view of an electronic device 1000 according to an embodiment of the inventive concept.

[0071] Referring to Figure 3A , the electronic device 1000 may include a display panel DP, a first charging coil CC-P, and a second charging coil CC-M.

[0072] The display panel DP may include a display layer 100 and a sensor layer 200.

[0073] The display layer 100 can be configured to substantially generate an image. The display layer 100 can be a light-emitting display layer. For example, the display layer 100 can include an organic light-emitting display layer, an inorganic light-emitting display layer, an organic-inorganic light-emitting display layer, a quantum dot display layer, a micro-LED display layer, or a nano-LED display layer. The display layer 100 can include a base layer 110, a circuit layer 120, a light-emitting element layer 130, and a packaging layer 140.

[0074] The base layer 110 can be a member that provides a base surface on which the circuit layer 120 is disposed. The base layer 110 can have a multi-layer structure or a single-layer structure. The base layer 110 can be a glass substrate, a metal substrate, a silicon substrate, or a polymer substrate, but embodiments of the inventive concept are not particularly limited thereto.

[0075] The circuit layer 120 can be disposed on the base layer 110. The circuit layer 120 can include an insulating layer, a semiconductor pattern, a conductive pattern, signal lines, etc. The insulating layer, the semiconductor layer, and the conductive layer can be formed on the base layer 110 by coating, deposition, etc., and the insulating layer, the semiconductor layer, and the conductive layer can be selectively patterned by a plurality of lithography processes.

[0076] The light-emitting element layer 130 can be disposed on the circuit layer 120. The light-emitting element layer 130 can include light-emitting elements. For example, the light-emitting element layer 130 can include an organic light-emitting material, an inorganic light-emitting material, an organic-inorganic light-emitting material, quantum dots, quantum rods, micro-LEDs, or nano-LEDs.

[0077] The packaging layer 140 can be disposed on the light-emitting element layer 130. The packaging layer 140 can protect the light-emitting element layer 130 from moisture, oxygen, and foreign substances such as dust particles.

[0078] The sensor layer 200 can be disposed on the display layer 100. The sensor layer 200 can sense an external input applied from the outside. The sensor layer 200 can be an integrated sensor continuously formed during the manufacturing process of the display layer 100, or the sensor layer 200 can be an external sensor attached to the display layer 100. The sensor layer 200 can be referred to as a sensor, an input sensing layer, an input sensing panel, or an electronic device for sensing input coordinates.

[0079] According to an embodiment of the inventive concept, the sensor layer 200 may sense an input of a passive input method such as a user's finger and an input of an input device that generates a magnetic field having a predetermined resonance frequency. The input device may be referred to as a pen, input pen, magnetic pen, stylus, or electromagnetic resonance pen. However, this is merely an example, and embodiments of the inventive concept are not particularly limited thereto. The sensor layer 200 may sense an input of a passive input method such as a user's finger, and the electronic device 1000 may further include a digitizer for sensing an input of an input device that generates a magnetic field having a predetermined resonance frequency.

[0080] According to an embodiment of the inventive concept, the first charging coil CC-P and the second charging coil CC-M may be disposed under the display panel DP. For example, the first charging coil CC-P may transmit power required to charge the pen PN (see Figure 1A ). The second charging coil CC-M may receive power required to charge the electronic device 1000. However, embodiments of the inventive concept are not particularly limited thereto, and the second charging coil CC-M may also operate as a coil for transmitting power required to charge other electronic devices. That is, the second charging coil CC-M may be a coil for transmitting and receiving power. Wireless power may be transmitted by an electromagnetic resonance method or an electromagnetic induction method, but embodiments of the inventive concept are not particularly limited thereto.

[0081] According to an embodiment of the inventive concept, the sensor layer 200 may have a structure for attenuating or eliminating noise caused by the first charging coil CC-P and the second charging coil CC-M. In this case, as the signal-to-noise ratio increases, the electronic device 1000 having improved sensing sensitivity may be provided.

[0082] Figure 3B is a schematic cross-sectional view of an electronic device 1000a according to an embodiment of the inventive concept.

[0083] Reference Figure 3B , the electronic device 1000a may include a display panel DPa, a first charging coil CC-P, and a second charging coil CC-M. The display panel DPa may include a display layer 100a and a sensor layer 200a.

[0084] The display layer 100a may include a base layer 110, a circuit layer 120, a light-emitting element layer 130, a package substrate 140a, and a coupling member SEL.

[0085] The encapsulation substrate 140a may be disposed on the light-emitting element layer 130. The encapsulation substrate 140a may be coupled to the circuit layer 120 or the base layer 110 through a coupling member SEL to protect the light-emitting element layer 130 from moisture, oxygen, and foreign substances such as dust particles. The encapsulation substrate 140a may be a rigid substrate or a glass substrate. However, embodiments of the inventive concept are not particularly limited thereto. For example, the encapsulation substrate 140a may include a light-transmissive material.

[0086] The sensor layer 200a may be disposed on the encapsulation substrate 140a. After the sensor layer 200a is formed on the encapsulation substrate 140a, the encapsulation substrate 140a may be coupled to the circuit layer 120 or the base layer 110. However, embodiments of the inventive concept are not particularly limited thereto. For example, the sensor layer 200a may be formed after the encapsulation substrate 140a is coupled to the circuit layer 120 or the base layer 110.

[0087] According to an embodiment of the inventive concept, the sensor layer 200a may have a structure that attenuates or eliminates noise caused by the first charging coil CC-P and the second charging coil CC-M. In this case, as the signal-to-noise ratio increases, an electronic device 1000a with improved sensing sensitivity may be provided.

[0088] Figure 4A The operation of the electronic device 1000 according to an embodiment of the inventive concept is described.

[0089] Reference Figure 4A , the electronic device 1000 may include a display layer 100, a sensor layer 200, a digitizer 300, a display driver 100C, a sensor driver 200C, a digitizer driver 300C, a main driver 1000C, and a power circuit 1000P.

[0090] The sensor layer 200 may sense a first input 2000 applied from the outside. The first input 2000 may be an input method capable of providing a change in capacitance of the sensor layer 200. For example, the first input 2000 may be a passive input method such as a user's finger.

[0091] The digitizer 300 may sense a second input 3000 applied from the outside. The second input 3000 may be an input method that can cause an induced current in the digitizer 300. The second input 3000 may be an input of a pen PN or an RFIC tag. For example, the pen PN may be a passive type pen or an active type pen.

[0092] In an embodiment of the inventive concept, the pen PN may generate a magnetic field having a predetermined resonance frequency. The pen PN may be configured to transmit an output signal based on an electromagnetic resonance method. The pen PN may be referred to as an input device, an input pen, a magnetic pen, a stylus, or an electromagnetic resonance pen.

[0093] The pen PN may include an RLC resonant circuit, and the RLC resonant circuit may include an inductor L and a capacitor C. In an embodiment of the inventive concept, the RLC resonant circuit may be a variable resonant circuit that varies a resonant frequency. In this case, the inductor L may be a variable inductor, or the capacitor C may be a variable capacitor, but the embodiments of the inventive concept are not particularly limited thereto.

[0094] The inductor L generates a current by a magnetic field formed in the electronic device 1000 (e.g., the digitizer 300). However, the embodiments of the inventive concept are not particularly limited thereto. For example, when the pen PN operates as an active type, the pen PN may generate a current even though the pen PN does not receive a magnetic field from the outside. The generated current is transmitted to the capacitor C. The capacitor C charges with the current input from the inductor L and discharges the charged current to the inductor L. Thereafter, the inductor L may emit a magnetic field of a resonant frequency. Due to the magnetic field emitted by the pen PN, an induced current may flow in the sensor layer 200 or the digitizer 300, and the induced current may be transmitted to the sensor driver 200C as a received signal (or a sensed signal).

[0095] The main driver 1000C may control the overall operation of the electronic device 1000. For example, the main driver 1000C may control the operations of the display driver 100C and the sensor driver 200C. The main driver 1000C may include at least one microprocessor and may also include a graphics controller. The main driver 1000C may be referred to as an application processor, a central processing unit, or a main processor.

[0096] The display driver 100C may drive the display layer 100. The display driver 100C may receive image data and a control signal from the main driver 1000C. The control signal may include various signals. For example, the control signal may include an input vertical synchronization signal, an input horizontal synchronization signal, a main clock signal, a data enable signal, etc.

[0097] The sensor driver 200C may drive the sensor layer 200. The sensor driver 200C may receive a control signal from the main driver 1000C. The control signal may include a clock signal of the sensor driver 200C. The digitizer driver 300C may drive the digitizer 300.

[0098] Each of the sensor driver 200C and the digitizer driver 300C may be implemented as an integrated circuit (IC) and electrically connected to the sensor layer 200 and the digitizer 300. For example, each of the sensor driver 200C and the digitizer driver 300C may be directly mounted on a predetermined area of the display panel or mounted on a separate printed circuit board by a chip - on - film (COF) method so as to be electrically connected to the sensor layer 200.

[0099] The sensor driver 200C may calculate input coordinate information based on signals received from the sensor layer 200 and may provide a coordinate signal including the coordinate information to the main driver 1000C. In addition, the digitizer driver 300C may calculate input coordinate information based on signals received from the digitizer 300 and provide a coordinate signal including the coordinate information to the main driver 1000C.

[0100] The main driver 1000C performs an operation corresponding to a user's input based on the coordinate signal. For example, the main driver 1000C may operate the display driver 100C to display a new application image on the display layer 100.

[0101] The power circuit 1000P may include a power management integrated circuit (PMIC). The power circuit 1000P may generate a plurality of driving voltages for driving the display layer 100, the sensor layer 200, the display driver 100C, and the sensor driver 200C. For example, the plurality of driving voltages may include a gate high voltage, a gate low voltage, a first driving voltage (e.g., ELVSS voltage), a second driving voltage (e.g., ELVDD voltage), an initialization voltage, etc., but embodiments of the inventive concept are not limited to the above examples.

[0102] Figure 4B The operation of the electronic device 1000b according to an embodiment of the inventive concept is described. In the description Figure 4B When, the same reference numerals will be assigned to the same components as those Figure 4A described in and the description thereof will be omitted.

[0103] Referring to Figure 4B the electronic device 1000b may include a display layer 100, a sensor layer 200b, a display driver 100C, a sensor driver 200Ca, a main driver 1000C, and a power circuit 1000P.

[0104] The sensor layer 200b can sense a first input 2000 or a second input 3000 applied from the outside. Each of the first input 2000 and the second input 3000 can be an input method capable of providing a change in the capacitance of the sensor layer 200b or an input method capable of inducing a current in the sensor layer 200b. For example, the first input 2000 can be a passive input method such as a user's finger. The second input 3000 can be an input of a pen PN or an RFIC tag. For example, the pen PN can be a passive pen or an active pen.

[0105] According to Figure 4B an embodiment of the inventive concept shown in, the electronic device 1000b can sense the input of the pen PN even though it does not include a digitizer. Therefore, since the digitizer for sensing the pen PN is omitted, an increase in the thickness and weight of the electronic device 1000b and deterioration of its flexibility due to the addition of the digitizer may not occur.

[0106] The sensor driver 200Ca and the sensor layer 200b can be selectively operated in a first mode or a second mode. For example, the first mode can be a mode for sensing a touch input (e.g., the first input 2000). The second mode can be a mode for sensing a pen PN input (e.g., the second input 3000). The first mode can be referred to as a touch sensing mode, and the second mode can be referred to as a pen sensing mode.

[0107] The conversion between the first mode and the second mode can be performed in various ways. For example, the sensor driver 200Ca and the sensor layer 200b can be driven time-divisionally in the first mode and the second mode, and the first input 2000 and the second input 3000 can be sensed. Alternatively, the conversion between the first mode and the second mode can occur due to a user's selection or a specific action (or input), or any one of the first mode and the second mode can be activated or deactivated or converted into another mode by the activation or deactivation of a specific application. Alternatively, when the sensor driver 200Ca and the sensor layer 200b alternately operate in the first mode and the second mode, the first mode can be maintained when the first input 2000 is sensed, or the second mode can be maintained when the second input 3000 is sensed.

[0108] Figure 5 A pen PN according to an embodiment of the inventive concept is shown.

[0109] Reference Figure 5, the pen PN may include a housing PN-H, a nib PN-T, an inductor L, a capacitor C, a resistor R, an elastomer PN-ED, a pressure capacitor C-P, a switch SW-B, a button capacitor C-B, a power supply circuit PN-BT, and a controller PN-IC. The components included in the pen PN are not limited to the above components. At least some of the above components may be omitted, and other components may be added.

[0110] In an embodiment of the inventive concept, the nib PN-T may include a non-conductive material. The nib PN-T may have a structure protruding from the housing PN-H. The nib PN-T may be detachably coupled to the housing PN-H and may be a replaceable component.

[0111] In an embodiment of the inventive concept, the resistor R, the inductor L, and the capacitor C may be connected in series with each other. Accordingly, the pen PN may have a structure including a resonance frequency and selectivity, which are characteristics of an RLC series circuit. In this case, during a charging operation of the digitizer 300 (see Figure 4A ) or the sensor layer 200b (see Figure 4B ), the frequency of a signal provided to the digitizer 300 (see Figure 4A ) or the sensor layer 200b (see Figure 4B ) may correspond to the resonance frequency of the pen PN. The capacitor C, the pressure capacitor C-P, and the button capacitor C-B may have a structure in which they are connected in parallel with each other. As a reference, when the switch SW-B is turned on, the button capacitor C-B may be connected in parallel with the capacitor C.

[0112] In an embodiment of the inventive concept, as the switch SW-B is turned on and off, the button capacitor C-B may be electrically connected to the capacitor C or disconnected from the capacitor C. That is, by turning the switch SW-B on and off, the pen PN may be set to respond to different resonance frequencies. For example, a button may be provided on an outer circumferential surface of the housing PN-H. When the button is pressed, the switch SW-B is turned on, and the button capacitor C-B is electrically connected to the capacitor C, thereby increasing the capacitance of the entire pen PN.

[0113] In an embodiment of the inventive concept, the capacitor C may be provided by cutting some of a plurality of capacitors connected in parallel with each other. For example, in order to match a target resonance frequency during a process of manufacturing the pen PN, the pen PN may tune the capacitor C by cutting some of the plurality of capacitors.

[0114] In an embodiment of the inventive concept, when the pen tip PN-T is partially inserted into the housing PN-H by a pen pressure, the area, distance, or both the area and distance that form the capacitance of the pressure capacitor C-P may change. Accordingly, the capacitance of the pressure capacitor C-P may change. For example, when a pen pressure is applied to the pen PN, the capacitance of the pressure capacitor C-P may increase, and correspondingly, the resonance frequency of the pen PN may decrease. Thereafter, when the pen pressure disappears, the capacitance of the pressure capacitor C-P may be restored to its original state by the elastomer PN-ED.

[0115] According to an embodiment of the inventive concept, the power supply circuit PN-BT may include a battery or a large-capacity capacitor. When the pen PN is stored in the electronic device 1000 (see Figure 1A ), the power supply circuit PN-BT may be charged by the first charging coil CC-P (see Figure 3A ). The controller PN-IC may receive power from the power supply circuit PN-BT and adjust the frequency of the signal output from the pen PN. In addition, the pen PN may receive power from the power supply circuit PN-BT and perform Bluetooth communication with the electronic device 1000 (see Figure 1A ) or another external device.

[0116] According to an embodiment of the inventive concept, since the pen PN includes an RLC resonance circuit, a power supply circuit PN-BT, and a controller PN-IC, the pen PN may operate as both an active type and a passive type. Accordingly, although a magnetic field is not provided from the sensor layer 200 (see Figure 4A ), the pen PN may emit a magnetic field. In this case, the sensor layer 200 (see Figure 4A ) may sense the input from the pen PN that outputs the magnetic field without forming a charging pattern of the magnetic field.

[0117] Figure 6A is a cross-sectional view of a display panel DP according to an embodiment of the inventive concept.

[0118] Referring to Figure 6A , at least one buffer layer BFL is formed on the upper surface of the base layer 110. The buffer layer BFL may improve the bonding strength between the base layer 110 and the semiconductor pattern. The buffer layer BFL may be formed of multiple layers. Optionally, the display layer 100 may further include a barrier layer. The buffer layer BFL may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. For example, the buffer layer BFL may include a structure in which a silicon oxide layer and a silicon nitride layer are alternately stacked.

[0119] Semiconductor patterns SC, AL, DR, and SCL may be disposed on the buffer layer BFL. The semiconductor patterns SC, AL, DR, and SCL may include polysilicon. However, not limited thereto, the semiconductor patterns SC, AL, DR, and SCL may include amorphous silicon, low-temperature polysilicon, or an oxide semiconductor.

[0120] Figure 6A Only some of the semiconductor patterns SC, AL, DR, and SCL are shown, and additional semiconductor patterns may be disposed in other regions. The semiconductor patterns SC, AL, DR, and SCL may be arranged across pixels according to a specific rule. The semiconductor patterns SC, AL, DR, and SCL may have different electrical characteristics depending on whether they are doped. The semiconductor patterns SC, AL, DR, and SCL may include a first region SC, DR, and SCL having a high conductivity and a second region AL having a low conductivity. The first region SC, DR, and SCL may be doped with an N-type dopant or a P-type dopant. The P-type transistor may include a doped region doped with a P-type dopant, and the N-type transistor may include a doped region doped with an N-type dopant. The second region AL may be an undoped region or a region doped at a concentration lower than that of the first region SC, DR, and SCL.

[0121] The conductivity of the first region SC, DR, and SCL may be greater than that of the second region AL, and the first region SC, DR, and SCL may substantially serve as electrodes or signal lines. The second region AL may substantially correspond to the active region AL (or channel) of the transistor 100PC. In other words, a part AL of the semiconductor patterns SC, AL, DR, and SCL may be the active region AL of the transistor 100PC, another part SC and DR thereof may be the source region SC or the drain region DR of the transistor 100PC, and still another part SCL thereof may be a connection electrode or a connection signal line SCL.

[0122] Each of the pixels may have an equivalent circuit including a plurality of transistors, at least one capacitor, and at least one light-emitting element, and the equivalent circuit diagram of the pixel may be modified in various forms. Figure 6A Exemplarily, one transistor 100PC and one light-emitting element 100PE included in the pixel are shown.

[0123] The source region SC, the active region AL, and the drain region DR of the transistor 100PC may be formed of the semiconductor patterns SC, AL, DR, and SCL. The source region SC and the drain region DR may extend in opposite directions from the active region AL in cross section. Figure 6AShows a part of the connection signal line SCL formed by the semiconductor patterns SC, AL, DR, and SCL. Although not shown separately, the connection signal line SCL may be connected to the drain region DR of the transistor 100PC on a plane.

[0124] The first insulating layer 10 may be disposed on the buffer layer BFL. The first insulating layer 10 may commonly overlap with a plurality of pixels and cover the semiconductor patterns SC, AL, DR, and SCL. The first insulating layer 10 may be an inorganic layer or an organic layer and may have a single-layer or multi-layer structure. The first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. In this embodiment, the first insulating layer 10 may be a single-layer silicon oxide. Not only the first insulating layer 10 but also the insulating layers of the circuit layer 120 to be described later may be an inorganic layer or an organic layer and may have a single-layer or multi-layer structure. The inorganic layer may include at least one of the above materials, but the embodiments of the inventive concept are not limited thereto.

[0125] The gate GT of the transistor 100PC is disposed on the first insulating layer 10. The gate GT may be a part of a metal pattern. The gate GT overlaps with the active region AL. In the process of doping or reducing the semiconductor patterns SC, AL, DR, and SCL, the gate GT may act as a mask.

[0126] The second insulating layer 20 may be disposed on the first insulating layer 10 and cover the gate GT. The second insulating layer 20 may commonly overlap with the pixels. The second insulating layer 20 may be an inorganic layer or an organic layer and may have a single-layer or multi-layer structure. The second insulating layer 20 may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. In this embodiment, the second insulating layer 20 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0127] The third insulating layer 30 may be disposed on the second insulating layer 20. The third insulating layer 30 may have a single-layer or multi-layer structure. For example, the third insulating layer 30 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0128] The first connection electrode CNE1 may be disposed on the third insulating layer 30. The first connection electrode CNE1 may be connected to the connection signal line SCL through a contact hole CNT-1 passing through the first insulating layer 10, the second insulating layer 20, and the third insulating layer 30.

[0129] The fourth insulating layer 40 may be disposed on the third insulating layer 30. The fourth insulating layer 40 may be a single-layer silicon oxide. The fifth insulating layer 50 may be disposed on the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer.

[0130] The second connection electrode CNE2 may be disposed on the fifth insulating layer 50. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 through a contact hole CNT-2 that penetrates through the fourth insulating layer 40 and the fifth insulating layer 50.

[0131] The sixth insulating layer 60 may be disposed on the fifth insulating layer 50 and at least partially cover the second connection electrode CNE2. The sixth insulating layer 60 may be an organic layer.

[0132] The light-emitting element layer 130 may be disposed on the circuit layer 120. The light-emitting element layer 130 may include a light-emitting element 100PE. For example, the light-emitting element layer 130 may include an organic light-emitting material, an inorganic light-emitting material, an organic-inorganic light-emitting material, quantum dots, quantum rods, micro LEDs, or nano LEDs. Hereinafter, the light-emitting element 100PE will be exemplarily described as an organic light-emitting element, but embodiments of the inventive concept are not particularly limited thereto.

[0133] The light-emitting element 100PE may include a first electrode AE, a light-emitting layer EL, and a second electrode CE.

[0134] The first electrode AE may be disposed on the sixth insulating layer 60. The first electrode AE may be connected to the second connection electrode CNE2 through a contact hole CNT-3 that penetrates through the sixth insulating layer 60.

[0135] The pixel defining film 70 may be disposed on the sixth insulating layer 60 and cover a part of the first electrode AE. An opening 70-OP is defined in the pixel defining film 70. The opening 70-OP of the pixel defining film 70 exposes at least a part of the first electrode AE.

[0136] The first display portion DA1-F (see Figure 1A ) may include a light-emitting region PXA and a non-light-emitting region NPXA adjacent to the light-emitting region PXA. The non-light-emitting region NPXA may surround the light-emitting region PXA. In this embodiment, the light-emitting region PXA is defined to correspond to a partial region of the first electrode AE exposed by the opening 70-OP.

[0137] The light-emitting layer EL may be disposed on the first electrode AE. The light-emitting layer EL may be disposed in a region corresponding to the opening 70-OP. Figure 6A Exemplarily, the light-emitting layer EL is shown disposed in the opening 70-OP, but embodiments of the inventive concept are not particularly limited thereto. For example, the light-emitting layer EL may extend to cover a side surface of the pixel defining film 70 that defines the opening 70-OP and a part of an upper surface of the pixel defining film 70.

[0138] In an embodiment of the inventive concept, the light-emitting layer EL may be separately formed in each of the pixels. When the light-emitting layer EL is separately formed in each of the pixels, each light-emitting layer EL may emit light of at least one of blue, red, and green. However, embodiments of the inventive concept are not limited thereto, and the light-emitting layer EL may be connected to the pixels to be commonly included in the pixels. In this case, the light-emitting layer EL may provide blue light or white light.

[0139] The second electrode CE may be disposed on the light-emitting layer EL. The second electrode CE may have an integral shape and be commonly included in a plurality of pixels.

[0140] In an embodiment of the inventive concept, a hole control layer may be disposed between the first electrode AE and the light-emitting layer EL. The hole control layer may be commonly disposed in the light-emitting region PXA and the non-light-emitting region NPXA. The hole control layer may include a hole transport layer and may further include a hole injection layer. An electron control layer may be disposed between the light-emitting layer EL and the second electrode CE. The electron control layer may include an electron transport layer and may further include an electron injection layer. The hole control layer and the electron control layer may be commonly formed in a plurality of pixels by using an aperture mask or an inkjet process.

[0141] The encapsulation layer 140 may be disposed on the light-emitting element layer 130. The encapsulation layer 140 may include an inorganic layer, an organic layer, and an inorganic layer stacked in sequence, but the layers constituting the encapsulation layer 140 are not limited thereto. The inorganic layer may protect the light-emitting element layer 130 from moisture and oxygen, and the organic layer may protect the light-emitting element layer 130 from foreign substances such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, an aluminum oxide layer, etc. The organic layer may include an acrylic-based organic layer, but embodiments of the inventive concept are not limited thereto.

[0142] The sensor layer 200 may include a base layer 201, a first conductive layer 202, an intermediate insulating layer 203, a second conductive layer 204, and a covering insulating layer 205.

[0143] The base layer 201 may be an inorganic layer including at least any one of silicon nitride, silicon oxynitride, and silicon oxide. Alternatively, the base layer 201 may be an organic layer including an epoxy resin, an acrylic resin, or an imide-based resin. The base layer 201 may have a single-layer structure or a multi-layer structure in which layers are stacked along a third direction DR3. In an embodiment of the inventive concept, the sensor layer 200 may not include the base layer 201.

[0144] Each of the first conductive layer 202 and the second conductive layer 204 may have a single-layer structure or a multi-layer structure in which layers are stacked along a third direction DR3.

[0145] Each of the first conductive layer 202 and the second conductive layer 204 having a single-layer structure may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO). In addition, the transparent conductive layer may include a conductive polymer such as poly(3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, graphene, etc.

[0146] Each of the first conductive layer 202 and the second conductive layer 204 including a multi-layer structure may include a metal layer. The metal layer may have a three-layer structure such as titanium / aluminum / titanium, for example. The multi-layer conductive layer may include at least one metal layer and at least one transparent conductive layer.

[0147] In an embodiment of the inventive concept, the thickness of the first conductive layer 202 may be greater than or equal to the thickness of the second conductive layer 204. When the thickness of the first conductive layer 202 is greater than the thickness of the second conductive layer 204, the resistance of components (e.g., electrodes, sensing patterns, bridging patterns, etc.) included in the first conductive layer 202 may be reduced. In addition, since the first conductive layer 202 is disposed below the second conductive layer 204, the probability that components included in the first conductive layer 202 are visible due to reflection of external light may be lower than the probability that components included in the second conductive layer 204 are visible due to reflection of external light, even though the thickness of the first conductive layer 202 increases.

[0148] At least any one of the intermediate insulating layer 203 and the covering insulating layer 205 may include an inorganic film. The inorganic film may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0149] At least any one of the intermediate insulating layer 203 and the covering insulating layer 205 may include an organic film. The organic film may include at least any one of an acrylic-based resin, a methacrylic-based resin, polyisoprene, an ethylene-based resin, an epoxy-based resin, a urethane-based resin, a cellulose-based resin, a siloxane-based resin, a polyimide-based resin, a polyamide-based resin, and a perylene-based resin.

[0150] Previously, it has been exemplarily described that the sensor layer 200 includes the first conductive layer 202 and the second conductive layer 204, that is, a total of two conductive layers, but the embodiments of the inventive concept are not particularly limited thereto. For example, the sensor layer 200 may include three or more conductive layers.

[0151] Figure 6BA cross-sectional view of a sensor layer 200 according to an embodiment of the inventive concept.

[0152] Reference Figure 6A and Figure 6B , a second width 204wt of a second grid line MS2 included in a second conductive layer 204 may be greater than or equal to a first width 202wt of a first grid line MS1 included in a first conductive layer 202. When a user USR views the first grid line MS1 and the second grid line MS2 from a side, the first grid line MS1 has a smaller width than the second grid line MS2, and thus, a probability that the first grid line MS1 is viewed by the user USR may be reduced.

[0153] Each of the first grid line MS1 and the second grid line MS2 may include a first metal layer M1 and a second metal layer M2 disposed between the first metal layers M1. For example, the first metal layer M1 may include titanium (Ti), and the second metal layer M2 may include aluminum (Al). However, this is merely an example, and embodiments of the inventive concept are not particularly limited thereto.

[0154] In an embodiment of the inventive concept, a first thickness TK1 of the second metal layer M2 of the first grid line MS1 and a second thickness TK2 of the second metal layer M2 of the second grid line MS2 may be substantially the same as each other, but embodiments of the inventive concept are not particularly limited thereto. For example, the first thickness TK1 may be greater than the second thickness TK2. Alternatively, the second thickness TK2 may be greater than the first thickness TK1. In an embodiment of the inventive concept, each of the first thickness TK1 and the second thickness TK2 may be about 1000 angstroms or greater, for example, about 6000 angstroms.

[0155] Figure 7 A plan view of a sensor layer 200 according to an embodiment of the inventive concept.

[0156] Reference Figure 7 , a sensing area 200A and a peripheral area 200NA adjacent to the sensing area 200A may be defined in the sensor layer 200.

[0157] The sensor layer 200 may include a plurality of first electrodes 210 and a plurality of second electrodes 220 disposed in the sensing area 200A.

[0158] Each of the first electrodes 210 may cross a second electrode 220. Each of the first electrodes 210 may extend along a second direction DR2, and the first electrodes 210 may be arranged to be spaced apart from each other in a first direction DR1. Each of the second electrodes 220 may extend along the first direction DR1, and the second electrodes 220 may be arranged to be spaced apart from each other in the second direction DR2. Figure 7Exemplarily, four first electrodes 210 and six second electrodes 220 are shown, but the numbers of the first electrodes 210 and the second electrodes 220 are not limited thereto.

[0159] Each of the first electrodes 210 may include a plurality of patterns 211 and a plurality of bridging patterns 212, and each of the second electrodes 220 may include a plurality of pattern portions 221 and a plurality of bridging portions 222. The pattern portions 221 and the bridging portions 222 included in one second electrode 220 may be connected to each other to have an integral shape.

[0160] In an embodiment of the inventive concept, the plurality of patterns 211, the plurality of pattern portions 221, and the plurality of bridging portions 222 may be disposed on the same layer as each other. For example, the plurality of patterns 211, the plurality of pattern portions 221, and the plurality of bridging portions 222 may be included in a second conductive layer 204 (see Figure 6A ). The plurality of bridging patterns 212 may be included in a first conductive layer 202 (see Figure 6A ).

[0161] In an embodiment of the inventive concept, two patterns 211 spaced apart from each other in a second direction DR2 may be electrically connected by two bridging patterns 212. However, the embodiments of the inventive concept are not particularly limited thereto. For example, two patterns 211 may be connected to each other by one bridging pattern, or two patterns 211 may be connected to each other by three or more bridging patterns. One bridging portion 222 may be insulated from and cross two overlapping bridging patterns 212.

[0162] The sensor layer 200 may further include a plurality of first traces 210t, a plurality of first pads PD1 connected to the first traces 210t in a one-to-one correspondence, a plurality of second traces 220t, and a plurality of second pads PD2 connected to the second traces 220t in a one-to-one correspondence, which are disposed in a peripheral region 200NA. The first traces 210t may be electrically connected to the first electrodes 210 in a one-to-one correspondence, respectively. The second traces 220t may be electrically connected to the second electrodes 220 in a one-to-one correspondence, respectively.

[0163] According to an embodiment of the inventive concept, the sensor layer 200 may have a closed loop C-LP defined in the sensor layer 200 and including one second trace 220t1 of the first traces 210t and the second traces 220t. For example, the sensor layer 200 may further include a loop trace RTL electrically connected to one second trace 220t1 to define the closed loop C-LP.

[0164] In an embodiment of the inventive concept, the sensor layer 200 may further include a loop trace RTL electrically connected to one of the plurality of second electrodes 220, i.e., 220-1. Accordingly, the sensor layer 200 may have a closed loop C-LP defined in the sensor layer 200 and including a part of one of the second electrodes 220-1, a second trace 220t1 electrically connected to one of the second electrodes 220-1, and the loop trace RTL. The second trace 220t1 and the loop trace RTL may be electrically connected to a second pad PD2c.

[0165] In an embodiment of the inventive concept, a second trace 220t1 may be disposed in the peripheral region 200NA, and the loop trace RTL may be disposed in the sensing region 200A. Accordingly, the closed loop C-LP may overlap at least a part of the peripheral region 200NA and at least a part of the sensing region 200A.

[0166] In an embodiment of the inventive concept, the position of the loop trace RTL may be changed in various ways in the sensing region 200A. Accordingly, the size of the closed loop C-LP may be adjusted according to the position of the loop trace RTL. The loop trace RTL may be disposed on the same layer as the bridging pattern 212. For example, the loop trace RTL may be disposed on the first conductive layer 202 (see Figure 6A ).

[0167] In an embodiment of the inventive concept, the first pad PD1 and the second pad PD2 may be arranged along a first direction DR1. The first pad PD1 may be referred to as a first plurality of pads, and the second pad PD2 may be referred to as a second plurality of pads. In addition, one of the second electrodes 220-1 may extend along the first direction DR1. That is, a closed loop C-LP electrically connected to one of the second electrodes 220-1 extending in a direction parallel to the arrangement direction of the first pad PD1 and the second pad PD2 may be defined.

[0168] Figure 8 A partial configuration of the sensor layer 200 (see Figure 7 ) and the charging coil CC according to an embodiment of the inventive concept is shown.

[0169] Reference Figure 7 and Figure 8 , an example shows one of the first electrodes 210-1 and one of the second electrodes 220-1.

[0170] The sensor driver 200C may output a transmission signal Tx through a first electrode 210-1. A mutual capacitance Cm may be formed between a first electrode 210-1 and a second electrode 220-1. By adding a first received signal Rxa and a second received signal Rxb received from the second electrode 220-1, the sensor driver 200C may sense a change in the mutual capacitance Cm and may sense coordinates.

[0171] According to an embodiment of the inventive concept, a closed loop C-LP may be defined in the sensor layer 200. The closed loop C-LP may include a second trace 220t1 and a loop trace RTL. The closed loop C-LP may overlap with a charging coil CC. The charging coil CC may be a first charging coil CC-P (see Figure 3A ) or a second charging coil CC-M (see Figure 3A ).

[0172] According to an embodiment of the inventive concept, the closed loop C-LP may be set in various shapes or sizes. For example, the shape, position, or size of the closed loop C-LP may be adjusted by adjusting the position of the loop trace RTL and the position of the electrode to which the loop trace RTL is connected. In this case, the degree of freedom regarding the position of the charging coil CC may be ensured.

[0173] The magnetic field generated by the charging coil CC may generate electromagnetic induction interference noise in the sensor layer 200. According to an embodiment of the inventive concept, a noise current NS generated by electromagnetic induction of the charging coil CC may circulate in the closed loop C-LP and may be dissipated as heat. That is, the noise current NS may not be transmitted to the sensor driver 200C. When the charging coil CC and the closed loop C-LP overlap each other, even when the electronic device 1000 (see Figure 1A ) is wirelessly charged or the pen PN (see Figure 1A ) is wirelessly charged, the noise current NS is also dissipated as heat by the closed loop C-LP. Accordingly, interference noise caused by an external magnetic field may be reduced. As a result, as the signal-to-noise ratio increases, an electronic device 1000 (see Figure 1A ) having improved sensing sensitivity may be provided.

[0174] Figure 8Exemplarily, it is illustrated that the signal-to-noise ratio increases when a change in the mutual capacitance Cm between a first electrode 210-1 and a second electrode 220-1 is sensed. However, embodiments of the inventive concept are not particularly limited thereto. For example, even when a change in the self-capacitance of each of a first electrode 210-1 and a second electrode 220-1 is sensed, the noise current NS can be dissipated as heat by the closed loop C-LP. Accordingly, interference noise caused by an external magnetic field can be reduced. As a result, as the signal-to-noise ratio increases, an electronic device 1000 having improved sensing sensitivity can be provided (see Figure 1A ).

[0175] Figure 9 is a plan view of a sensor layer 200-1 according to an embodiment of the inventive concept. In the description Figure 9 , the same reference numerals will be assigned to the same components as those described in Figure 7 , and a description thereof may be omitted.

[0176] Referring to Figure 8 and Figure 9 , a closed loop C-LPa may be defined in the sensor layer 200-1. The sensor layer 200-1 may further include a loop trace RTL-1 electrically connected to a second trace 220t1 to define the closed loop C-LPa.

[0177] In an embodiment of the inventive concept, a second trace 220t1 and the loop trace RTL-1 may be disposed in the peripheral region 200NA. Accordingly, the closed loop C-LPa may overlap at least a part of the peripheral region 200NA. The second trace 220t1 may be spaced apart from the sensing region 200A, and the loop trace RTL-1 may be interposed between the second trace 220t1 and the sensing region 200A.

[0178] In an embodiment of the inventive concept, the loop trace RTL-1 may overlap at least some of the second traces 220t. For example, the second traces 220t may be included in a second conductive layer 204 (see Figure 6A ), and the loop trace RTL-1 may be included in a first conductive layer 202 (see Figure 6A ). However, this is merely an example, and embodiments of the inventive concept are not particularly limited thereto. For example, each of the second traces 220t may have a multilayer structure including sub-lines, the sub-lines being included in each of the first conductive layer 202 and the second conductive layer 204 (see Figure 6A ), and each of the second traces 220t may also have a single-layer structure only in a portion overlapping the loop trace RTL-1. That is, the loop trace RTL-1 may be insulated from and cross the overlapping second traces 220t.

[0179] According to an embodiment of the inventive concept, the closed loop C-LPa may include a second trace 220t1 and a loop trace RTL-1. A first charging coil (CC-P, see Figure 3A ) may overlap with the closed loop C-LPa. In this case, a noise current NS generated by electromagnetic induction of the first charging coil (CC-P, see Figure 3A ) may circulate in the closed loop C-LPa and be dissipated as heat. That is, the noise current NS may not be transmitted to the sensor driver 200C. Accordingly, interference noise caused by an external magnetic field may be reduced. As a result, as the signal-to-noise ratio increases, an electronic device 1000 (see Figure 1A ) having improved sensing sensitivity may be provided.

[0180] Figure 10 is a plan view of a sensor layer 200-2 according to an embodiment of the inventive concept. In the description Figure 10 , the same reference numerals will be assigned to the same components as those described in Figure 7 , and a description thereof may be omitted.

[0181] Referring to Figure 8 and Figure 10 , a closed loop C-LPb may be defined in the sensor layer 200-2. The sensor layer 200-2 may further include a loop trace RTL-2 electrically connected to a second trace 220t1 to define the closed loop C-LPb.

[0182] In an embodiment of the inventive concept, a second trace 220t1 and a loop trace RTL-2 may be disposed in the peripheral region 200NA. Accordingly, the closed loop C-LPb may overlap with at least a portion of the peripheral region 200NA. The loop trace RTL-2 may be spaced apart from the sensing region 200A, and a second trace 220t1 may be interposed between the loop trace RTL-2 and the sensing region 200A.

[0183] In an embodiment of the inventive concept, the loop trace RTL-2 may not overlap with the second trace 220t. Accordingly, the loop trace RTL-2 may be disposed on the same layer as the second trace 220t, may be disposed on a layer different from the layer of the second trace 220t, or may have the same stacked structure as the second trace 220t, such as a multi-layer structure.

[0184] In an embodiment of the inventive concept, the loop trace RTL-2 may overlap with a second trace 220t1. For example, the loop trace RTL-2 may be included in a first conductive layer 202 (see Figure 6A ), and a second trace 220t1 may be included in a second conductive layer 204 (seeFigure 6A ) In this case, the closed loop can be defined in a cross-section parallel to the second direction DR2 and the third direction DR3, rather than being defined in a plane as shown in Figure 10 .

[0185] According to an embodiment of the inventive concept, the first charging coil CC-P (see Figure 3A ) may overlap with the closed loop C-LPb. In this case, the noise current NS generated by the electromagnetic induction of the first charging coil CC-P (see Figure 3A ) may circulate in the closed loop C-LPb and be dissipated as heat. That is, the noise current NS may not be transmitted to the sensor driver 200C. Therefore, the interference noise caused by the external magnetic field can be reduced. As a result, as the signal-to-noise ratio increases, an electronic device 1000 (see Figure 1A ) with improved sensing sensitivity can be provided.

[0186] Figure 11 is a plan view of the sensor layer 200-3 according to an embodiment of the inventive concept. In the description Figure 11 , the same reference numerals will be given to the same components as those described in Figure 7 , and the description thereof may be omitted.

[0187] Referring to Figure 8 and Figure 11 , a closed loop C-LPc may be defined in the sensor layer 200-3. The sensor layer 200-3 may further include a loop trace RTL-3 electrically connected to a second trace 220t1 to define the closed loop C-LPc.

[0188] In an embodiment of the inventive concept, a second trace 220t1 and the loop trace RTL-3 may be disposed in the peripheral region 200NA. The second trace 220t1 may be spaced apart from the loop trace RTL-3, and the sensing region 200A may be interposed between the second trace 220t1 and the loop trace RTL-3. Therefore, the closed loop C-LPc may overlap at least a part of the peripheral region 200NA and at least a part of the sensing region 200A.

[0189] According to an embodiment of the inventive concept, the first charging coil CC-P (see Figure 3A ) and the second charging coil CC-M (see Figure 3A ) may overlap with the closed loop C-LPc. In this case, the noise current NS generated by the first charging coil CC-P and the second charging coil CC-M (see Figure 3A) The noise current NS generated by electromagnetic induction can circulate in the closed loop C-LPc and be dissipated as heat. That is, the noise current NS can be prevented from being transmitted to the sensor driver 200C. Therefore, the interference noise caused by the external magnetic field can be reduced. As a result, as the signal-to-noise ratio increases, an electronic device 1000 with improved sensing sensitivity can be provided (see Figure 1A ).

[0190] Figure 12 is a plan view of a sensor layer 200-4 according to an embodiment of the inventive concept. In the description Figure 12 thereof, the same reference numerals will be assigned to the same components as those described in Figure 7 , and the description thereof may be omitted.

[0191] Referring to Figure 8 and Figure 12 , in the sensor layer 200-4, a closed loop C-LP (hereinafter referred to as the first closed loop) and a second closed loop C-LPd may be defined.

[0192] The sensor layer 200-4 may further include a loop trace RTL (hereinafter referred to as the first loop trace) electrically connected to one second trace 220t1 to define the first closed loop C-LP and a second loop trace RTL-4 electrically connected to the other second trace 220t2 to define the second closed loop C-LPd. The first loop trace RTL may be electrically connected to a second electrode 220-1, and the second loop trace RTL-4 may be electrically connected to another second electrode 220-2.

[0193] The first loop trace RTL and the second loop trace RTL-4 may be disposed in the sensing region 200A and on the same layer as the bridging pattern 212. The first closed loop C-LP may include a part of one second electrode 220-1 among the second electrodes 220 that can form the largest closed loop and are routed to the left. The second closed loop C-LPd may include a part of the other second electrode 220-2 among the second electrodes 220 that can form the largest closed loop and are routed to the right.

[0194] In an embodiment of the inventive concept, the first closed loop C-LP and the second closed loop C-LPd may not overlap with each other, but the embodiments of the inventive concept are not particularly limited thereto. For example, the first closed loop C-LP and the second closed loop C-LPd may at least partially overlap with each other.

[0195] According to an embodiment of the inventive concept, a first charging coil CC-P (see Figure 3A ) and a second charging coil CC-M (see Figure 3AEach of them can overlap with at least one of the first closed loop C-LP and the second closed loop C-LPd. In this case, the noise current NS generated by the electromagnetic induction of the first charging coil CC-P and the second charging coil CC-M (see Figure 3A ) can circulate in the first closed loop C-LP and the second closed loop C-LPd and be dissipated as heat. That is, the noise current NS can not be transmitted to the sensor driver 200C. Therefore, the interference noise caused by the external magnetic field can be reduced. As a result, as the signal-to-noise ratio increases, the electronic device 1000 with improved sensing sensitivity can be provided (see Figure 1A ).

[0196] Figure 13 is a plan view of the sensor layer 200-5 according to an embodiment of the inventive concept. In the description Figure 13 when, the same reference numerals will be given to the same components as those described in Figure 7 , and the description thereof may be omitted.

[0197] Referring to Figure 8 and Figure 13 , in the sensor layer 200-5, a closed loop C-LP (hereinafter referred to as the first closed loop) and a second closed loop C-LPe may be defined. The second closed loop C-LPe may have a larger size than the second closed loop C-LPd shown in Figure 12 . For example, the second electrodes 220 may be alternately wired one by one to the left and right. For example, among the second electrodes 220, one second electrode 220-1 located at the top and capable of forming the largest closed loop may be wired to the left and connected to a second trace 220t1. Among the second electrodes 220, another second electrode 220-2a located second from the top and capable of forming the second largest closed loop may be wired to the right and connected to another second trace 220t2a.

[0198] In an embodiment of the inventive concept, the first closed loop C-LP and the second closed loop C-LPe may not overlap with each other, but the embodiments of the inventive concept are not particularly limited thereto. For example, the first closed loop C-LP and the second closed loop C-LPe may at least partially overlap with each other.

[0199] In an embodiment of the inventive concept, the sensor layer 200-5 may further include a loop trace RTL (hereinafter referred to as a first loop trace) electrically connected to one second trace 220t1 to define a first closed loop C-LP and a second loop trace RTL-5 electrically connected to another second trace 220t2a to define a second closed loop C-LPe. The first loop trace RTL may be electrically connected to one second electrode 220-1, and the second loop trace RTL-5 may be electrically connected to another second electrode 220-2a. The first loop trace RTL and the second loop trace RTL-5 may be disposed in the sensing area 200A and on the same layer as the bridging pattern 212.

[0200] According to an embodiment of the inventive concept, each of the first charging coil CC-P (see Figure 3A ) and the second charging coil CC-M (see Figure 3A ) may overlap at least one of the first closed loop C-LP and the second closed loop C-LPe. In this case, the noise current NS generated by electromagnetic induction of the first charging coil CC-P and the second charging coil CC-M (see Figure 3A ) may circulate in the first closed loop C-LP and the second closed loop C-LPe and be dissipated as heat. That is, the noise current NS may not be transmitted to the sensor driver 200C. Accordingly, interference noise caused by an external magnetic field may be reduced. As a result, as the signal-to-noise ratio increases, the electronic device 1000 (see Figure 1A ) having improved sensing sensitivity may be provided.

[0201] Figure 14 is a plan view of a sensor layer 200-6 according to an embodiment of the inventive concept. In the description Figure 14 , the same reference numerals will be assigned to the same components as those described in Figure 7 , and the description thereof may be omitted.

[0202] Referring to Figure 8 and Figure 14 , a plurality of closed loops C-LPal may be defined in the sensor layer 200-6. For example, the number of the closed loops C-LPal may correspond to the number of the second electrodes 220al. The sensor layer 200-6 may include a plurality of loop traces RTL-al connected to each of the second electrodes 220al in a one-to-one correspondence.

[0203] In an embodiment of the inventive concept, the loop trace RTL-al may be arranged to overlap with the sensing area 200A. The plurality of closed loops C-LPal may have different sizes and overlap with each other. However, this is merely an example, and embodiments of the inventive concept are not particularly limited thereto. For example, each of the loop traces RTL-al may be arranged in the peripheral area 200NA, as shown in Figure 9 , Figure 10 and Figure 11 . In this case, at least some of the plurality of closed loops C-LPal may not overlap with each other.

[0204] According to an embodiment of the inventive concept, each of the first charging coil CC-P (see Figure 3A ) and the second charging coil CC-M (see Figure 3A ) may overlap with at least one of the plurality of closed loops C-LPal. In this case, the noise current NS generated by electromagnetic induction of the first charging coil CC-P and the second charging coil CC-M (see Figure 3A ) may circulate in each of the plurality of closed loops C-LPal and be dissipated as heat. That is, the noise current NS may not be transmitted to the sensor driver 200C. Accordingly, interference noise caused by an external magnetic field may be reduced. As a result, as the signal-to-noise ratio increases, the electronic device 1000 (see Figure 1A ) having improved sensing sensitivity may be provided.

[0205] Figure 15 is a plan view of the sensor layer 200-7 according to an embodiment of the inventive concept. In the description Figure 15 , the same reference numerals will be assigned to the same components as those described in Figure 7 , and the description thereof may be omitted.

[0206] Referring to Figure 15 , in the sensor layer 200-7, a closed loop C-LPf including a first trace 210t1 among the first trace 210t and the second trace 220t may be defined. For example, the sensor layer 200-7 may further include a loop trace RTL-6 electrically connected to one first trace 210t1 to define the closed loop C-LPf.

[0207] In an embodiment of the inventive concept, the sensor layer 200-7 may further include a loop trace RTL-6 electrically connected to one of the plurality of first electrodes 210, i.e., a first electrode 210-1. Accordingly, a closed loop C-LPf including one first electrode 210-1, a first trace 210t1 electrically connected to the one first electrode 210-1, and the loop trace RTL-6 may be defined in the sensor layer 200-7. The first trace 210t1 and the loop trace RTL-6 may be electrically connected to a first pad PD1c.

[0208] In an embodiment of the inventive concept, the first pad PD1 and the second pad PD2 may be arranged along a first direction DR1. In addition, one first electrode 210-1 may extend along a second direction DR2. That is, a closed loop C-LPf electrically connected to one first electrode 210-1 extending in a direction crossing the arrangement direction of the first pad PD1 and the second pad PD2 may be defined.

[0209] According to an embodiment of the inventive concept, a first charging coil CC-P (see Figure 3A ) may overlap with the closed loop C-LPf. In this case, a noise current generated by electromagnetic induction of the first charging coil CC-P (see Figure 3A ) may circulate in the closed loop C-LPf and be dissipated as heat. That is, the noise current may not be transmitted to the sensor driver. Accordingly, interference noise caused by an external magnetic field may be reduced. As a result, an electronic device 1000 (see Figure 1A ) having improved sensing sensitivity may be provided as the signal-to-noise ratio increases.

[0210] According to the above description, a closed loop may be defined in the sensor layer, and the closed loop may overlap with a charging coil of an electronic device. In this case, a noise current caused by the charging coil may circulate in the closed loop and be dissipated as thermal energy. Accordingly, interference noise caused by an external magnetic field may be reduced. As a result, an electronic device having improved sensing sensitivity may be provided as the signal-to-noise ratio increases.

[0211] Although embodiments of the inventive concept have been described, various modifications and similar arrangements will be apparent to those of ordinary skill in the art. Accordingly, the inventive concept is not limited to these embodiments, but is limited to the scope and spirit of the appended claims.

Claims

1. An electronic device, comprising: A sensor layer, including a sensing region defined in the sensor layer and a peripheral region adjacent to the sensing region, wherein the sensor layer includes: A plurality of first electrodes, disposed in the sensing region and arranged along a first direction; A plurality of second electrodes, disposed in the sensing region and arranged along a second direction intersecting the first direction; A plurality of first traces, electrically connected to the plurality of first electrodes in a one-to-one correspondence; A plurality of second traces, electrically connected to the plurality of second electrodes in a one-to-one correspondence; and A first loop trace, electrically connected to one of the plurality of second electrodes, wherein a first closed loop includes one of the plurality of second traces connected to the one second electrode, and wherein the first loop trace is defined in the sensor layer.

2. The electronic device according to claim 1, wherein, The one second trace and the first loop trace are electrically connected to a pad.

3. The electronic device according to claim 1, wherein, The one second trace is disposed in the peripheral region, and the first loop trace is disposed in the sensing region.

4. The electronic device according to claim 1, wherein The one second trace and the first loop trace are disposed in the peripheral region.

5. The electronic device according to claim 1, wherein, The one second trace is spaced apart from the sensing region, and the first loop trace is interposed between the one second trace and the sensing region.

6. The electronic device according to claim 1, wherein, The one second trace is spaced apart from the first loop trace, and the sensing region is interposed between the one second trace and the first loop trace.

7. The electronic device according to claim 1, wherein: The sensor layer further includes a second loop trace electrically connected to another one of the plurality of second electrodes; and A second closed loop is defined by a second trace of the plurality of second traces connected to the another second electrode, the another second electrode, and the second loop trace.

8. The electronic device according to claim 1, wherein, The sensor layer further includes a plurality of pads electrically connected to the plurality of first traces and the plurality of second traces, wherein the plurality of pads are arranged along the first direction.

9. The electronic device according to claim 1, wherein The one second electrode extends along the first direction.

10. The electronic device according to claim 1, wherein, The sensor layer further includes a plurality of pads electrically connected to the plurality of first traces and the plurality of second traces, wherein the one second electrode extends in a direction intersecting the arrangement direction of the plurality of pads.

11. The electronic device according to claim 1, wherein, The first loop trace is disposed on a layer different from the layer of the plurality of second traces.

12. The electronic device according to claim 1, further comprising: A display layer, disposed below the sensor layer; and A charging coil, disposed below the display layer, wherein the charging coil overlaps with the first closed loop.

13. An electronic device, comprising: A display panel, including a display layer and a sensor layer, the display layer configured to display an image, the sensor layer disposed on the display layer and including a sensing region and a peripheral region adjacent to the sensing region, the sensing region and the peripheral region being defined in the sensor layer; and A charging coil, disposed below the display panel, wherein the sensor layer includes: A plurality of first electrodes, disposed in the sensing region and arranged along a first direction; A plurality of second electrodes, disposed in the sensing region and arranged along a second direction intersecting the first direction; and A plurality of traces, connected to the plurality of first electrodes and the plurality of second electrodes in a one-to-one correspondence, wherein a closed loop including one of the plurality of traces is defined in the sensor layer.

14. The electronic device according to claim 13, wherein, The closed loop overlaps with the charging coil.

15. The electronic device according to claim 13, wherein: The sensor layer further includes a loop trace electrically connected to the one trace; and The closed loop includes the loop trace.

16. The electronic device according to claim 15, wherein: The one trace is disposed in the peripheral region; and The loop trace is disposed in the sensing region.

17. The electronic device according to claim 15, wherein, The one trace is spaced apart from the sensing region, and the loop trace is interposed between the one trace and the sensing region.

18. The electronic device according to claim 15, wherein, The one trace is spaced apart from the loop trace, and the sensing region is interposed between the one trace and the loop trace.

19. An electronic device, comprising: A display panel, including a display layer and a sensor layer disposed on the display layer; And A charging coil, disposed below the display panel, wherein the sensor layer includes: A plurality of first electrodes, arranged along a first direction; A plurality of second electrodes, arranged along a second direction intersecting the first direction; and A loop trace, electrically connected to one of the plurality of first electrodes and the plurality of second electrodes, wherein: A closed loop overlapping with the charging coil is defined in the sensor layer; and The closed loop includes the loop trace.

20. The electronic device according to claim 19, wherein: The sensor layer further includes a plurality of first traces electrically connected to the plurality of first electrodes in a one-to-one correspondence and a plurality of second traces electrically connected to the plurality of second electrodes in a one-to-one correspondence; and The closed loop further includes the traces among the plurality of first traces and the plurality of second traces that are electrically connected to the one electrode.

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