Stepped plate-shaped formation lamp conductive coating structure and preparation method thereof

Abstract

The invention discloses a stepped plate-shaped formation lamp conductive coating structure and a preparation method thereof. The step-plate-shaped formation lamp conductive coating structure comprises an adhesion layer, a silver nanowire conductive film layer and a protective layer which cover the upper step position and the lower step position of a formation lamp plate. The shading layer and the conducting layer cover the lower step position of the protective layer. The invention has the beneficial effects that the silver nanowire conductive film layer is used for replacing the ITO conductive film layer, so that the problem of material cracking does not exist, and the silver nanowire conductive film layer can be well attached to the combination position of the upper step and the lower step.

Description

Technical Field

[0001] The present invention relates to the coating of conductive stealth films for formation lights, and particularly to a stepped plate-shaped formation light conductive coating structure and a preparation method thereof. Background Art

[0002] Airborne formation lights are effective safety devices for ensuring the formation flight of aircraft groups and approaching targets stealthily. Considering the stealth design, there is a step difference of 0.4 - 0.8 mm in the formation light plates of most current airborne formation lights, which poses high requirements for the coating process of conductive stealth films for formation lights. The existing coating process is that the conductive stealth film system selects ITO material and deposits the film by magnetron sputtering. The disadvantages are as follows: 1. ITO material belongs to ceramic material and has ceramic brittleness, being prone to bending and cracking; 2. It is difficult for ITO material to adhere at the upper and lower step joint positions. Summary of the Invention

[0003] The object of the present invention is to solve the problems of the ITO conductive film layer in the stepped plate-shaped formation light in the prior art, and to provide a novel stepped plate-shaped formation light conductive coating structure and a preparation method thereof.

[0004] To achieve the above object, the technical solution provided by the present invention is: a stepped plate-shaped formation light conductive coating structure, including: an adhesion layer, a silver nanowire conductive film layer, and a protective layer covering the upper and lower step positions of the formation light plate; and a light-shielding layer and a conductive layer covering the lower step position of the protective layer.

[0005] The silver nanowires in the silver nanowire conductive film layer are one-dimensional silver wire structures with a diameter in the nanometer scale, an unlimited length, and an aspect ratio greater than 100, having excellent electrical conductivity, light transmittance, and flexural resistance.

[0006] As a preferred scheme of the stepped plate-shaped formation light conductive coating structure, the formation light plate is selected from epoxy glass cloth board or aviation-grade polycarbonate, having processability and structural strength.

[0007] As a preferred scheme of the stepped plate-shaped formation light conductive coating structure, the adhesion layer is selected from modified polyurethane polymer mixture, modified epoxy resin, or phosphating primer, having elasticity and adhesiveness.

[0008] As a preferred scheme of the stepped plate-shaped formation light conductive coating structure, the silver nanowire conductive film layer is selected from a composite material of silver nanowires and polyurethane. Adding polyurethane to the silver nanowires aims to increase the adhesion force between the silver nanowire conductive film layer and the adhesion layer.

[0009] As a preferred scheme of the stepped plate-shaped formation light conductive coating structure, the protective layer is selected from modified acrylic resin, modified epoxy resin, or modified silicone resin, meeting high hardness and high environmental adaptability.

[0010] As a preferred solution for the conductive coating structure of the stepped plate-shaped formation lamp, the light-shielding layer is selected as black paint, and the black paint is polyurethane-based.

[0011] As a preferred solution for the conductive coating structure of the stepped plate-shaped formation lamp, the thickness of the adhesion layer is 200 - 400 nm, the thickness of the silver nanowire conductive film layer is 50 - 250 nm, the thickness of the protective layer is 10 - 20 μm, the thickness of the light-shielding layer is 20 - 30 μm, and the thickness of the conductive layer is 20 - 30 μm.

[0012] The present invention also provides a preparation method for the conductive coating structure of the stepped plate-shaped formation lamp, including:

[0013] Step S1: Provide the formation lamp plate material, and process the upper and lower steps of the formation lamp plate material by mechanical processing or laser cutting.

[0014] Step S2: Adopt a slot coating process to form the adhesion layer on the upper and lower steps of the formation lamp plate material.

[0015] Step S3: Adopt a slot coating process to form the silver nanowire layer conductive coating on the adhesion layer.

[0016] Step S4: Adopt a slot coating process to form the protective layer on the silver nanowire conductive layer.

[0017] Step S5: Perform plasma treatment on the protective layer.

[0018] Step S6: Perform insulation treatment on the upper step position of the protective layer.

[0019] Step S7: Adopt a spraying process or a screen printing process to form the light-shielding layer at the lower step position of the protective layer; and,

[0020] Step S8: Adopt a spraying process or a screen printing process to form the conductive layer on the light-shielding layer.

[0021] Compared with the prior art, the beneficial effects of the present invention are at least as follows: replacing the ITO conductive film layer with a silver nanowire conductive film layer, there is no problem of material cracking and it can be better attached to the combined position of the upper and lower steps. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic structural diagram of the present invention.

[0023] Figure 2 It is a flowchart of the method of the present invention.

[0024] Reference numerals in the figure:

[0025] 1. Formation lamp plate material; 2. Adhesion layer; 3. Silver nanowire conductive film layer; 4. Protective layer; 5. Light-shielding layer; 6. Conductive layer. Detailed implementation mode

[0026] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the following will clearly describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present invention.

[0027] Embodiment 1:

[0028] Please refer to Figure 1 , what is shown in the figure is a stepped plate-shaped formation lamp conductive coating structure.

[0029] For the formation lamp plate material of the conductive coating structure, an epoxy glass cloth plate with a thickness of 1.2 mm is selected. The top surface of the formation lamp plate material is a stepped surface.

[0030] An adhesion layer with a thickness of 200 nm is formed on the top surface of the formation lamp plate material. The top surface of the adhesion layer is a stepped surface. The adhesion layer is made of modified polyurethane resin.

[0031] A silver nanowire conductive film layer with a thickness of 50 nm is formed on the top surface of the adhesion layer. The top surface of the silver nanowire conductive film layer is a stepped surface. The silver nanowire conductive film layer is made of a composite material of silver nanowires and polyurethane.

[0032] A protective layer with a thickness of 10 μm is formed on the top surface of the silver nanowire conductive film layer. The top surface of the protective layer is a stepped surface. The protective layer is made of modified UV acrylic resin.

[0033] A light-shielding layer with a thickness of 20 μm is formed at the lower step position on the top surface of the protective layer. The top surface of the light-shielding layer is a flat surface. The light-shielding layer can be made of black paint. The black paint among them is polyurethane-based.

[0034] A conductive layer with a thickness of 20 μm is formed on the top surface of the light-shielding layer.

[0035] Please refer to Figure 2 , what is shown in the figure is the preparation method of the stepped plate-shaped formation lamp conductive coating structure. The preparation method includes:

[0036] Step S1, provide the formation lamp plate material. Prepare the top surface of the formation lamp plate material by mechanical processing or laser cutting.

[0037] Step S2: Adopt a slot coating process to coat a modified acrylic resin mixture on the top surface of the formation lamp plate to form the adhesion layer.

[0038] Step S3: Adopt a slot coating process to coat a composite material of silver nanowires and polyurethane on the top surface of the adhesion layer to form the silver nanowire layer conductive coating.

[0039] Step S4: Adopt a slot coating process to coat a modified UV acrylic resin on the top surface of the silver nanowire conductive layer to form the protective layer.

[0040] Step S5: Perform plasma treatment on the protective layer.

[0041] Step S6: Insulate the upper step position on the top surface of the protective layer.

[0042] Step S7: Adopt a spraying process to spray black paint on the lower step position on the top surface of the protective layer to form the light-shielding layer.

[0043] Step S8: Adopt a spraying process to spray conductive paint on the top surface of the light-shielding layer to form the conductive layer.

[0044] Perform adhesion tests on the conductive system in Example 1, including cross-cut test and pull-off test: The cross-cut test result is grade 0 both above and below the step, and the adhesion on the step in the pull-off test is 50.095 Mpa, and the adhesion below the step is 21 Mpa, both meeting the requirement of ≥15 Mpa. Perform sheet resistance test on the conductive system in Example 1, and the sheet resistance is 5 - 6 Ω / sq. Perform transmittance test on the example, and the transmittance ≥50%. Perform environmental adaptability test on the example, and the results are shown in the following table.

[0045]

[0046] The results show that the adhesion, sheet resistance, transmittance and environmental adaptability of the stepped plate-shaped formation lamp conductive coating in Example 1 meet the requirements of the aviation formation lamp.

[0047] The above only expresses the implementation manners of the present invention, and its description is relatively specific and detailed, but it cannot be understood as a limitation to the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the appended claims.

Claims

1. A conductive coating structure for a stepped plate-shaped formation lamp, characterized in that, Including: An adhesion layer, a silver nanowire conductive film layer and a protective layer covering the upper and lower stepped positions of the formation lamp plate; And a light-shielding layer and a conductive layer covering the lower stepped position of the protective layer.

2. The stepped plate-shaped formation lamp conductive coating structure according to claim 1, wherein The formation lamp plate is selected from an epoxy glass cloth plate or an aviation-grade polycarbonate.

3. The stepped plate-shaped formation lamp conductive coating structure according to claim 1, wherein, The adhesion layer is selected from a modified polyurethane polymer mixture, a modified epoxy resin or a phosphating primer.

4. The stepped plate-shaped formation lamp conductive coating structure according to claim 1, characterized in that, The silver nanowire conductive film layer is selected from a composite material of silver nanowires and polyurethane.

5. The stepped plate-shaped formation lamp conductive coating structure according to claim 1, characterized in that, The protective layer is selected from a modified acrylic resin, a modified epoxy resin or a modified silicone resin.

6. The stepped plate-shaped formation lamp conductive coating structure according to claim 1, characterized in that, The light-shielding layer is selected from black paint, and the black paint is of the polyurethane type.

7. The stepped plate-shaped formation lamp conductive coating structure according to claim 1, characterized in that, The thickness of the adhesion layer is 200 - 400 nm, the thickness of the silver nanowire conductive film layer is 50 - 250 nm, the thickness of the protective layer is 10 - 20 μm, the thickness of the light-shielding layer is 20 - 30 μm, and the thickness of the conductive layer is 20 - 30 μm.

8. The preparation method of the stepped plate-shaped formation lamp conductive coating structure according to any one of claims 1 to 7, characterized in that, Including: Step S1: Provide the formation lamp plate and process the upper and lower steps of the formation lamp plate by a machining method or a laser cutting method; Step S2: Adopt a slot coating process to form the adhesion layer on the upper and lower steps of the formation lamp plate; Step S3: Adopt a slot coating process to form the silver nanowire layer conductive coating on the adhesion layer; Step S4: Adopt a slot coating process to form the protective layer on the silver nanowire conductive layer; Step S5: Perform plasma treatment on the protective layer; Step S6: Perform insulation treatment on the upper stepped position of the protective layer; Step S7: Adopt a spraying process or a screen printing process to form the light-shielding layer on the lower stepped position of the protective layer; And, Step S8: Adopt a spraying process or a screen printing process to form the conductive layer on the light-shielding layer.

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