Insulation composition, winding unit and inductor structure forming method

Abstract

The invention provides an insulating composition, which is used in a winding unit of an inductance structure or among different winding units, and comprises a fiber base material used for providing the strength of the insulating composition; the organic matter coats the fiber base material and is used for providing stress buffering; wherein the resistivity of the insulating composition after annealing is greater than or equal to 2Mohm. M. The insulating composition provided by the invention can provide stronger insulating property after high-temperature annealing.

Description

Technical Field

[0001] The present invention relates to the technical field of voltage regulation modules, and particularly to an insulating composition for an inductor structure of a voltage regulation module. Background Art

[0002] In recent years, with the development of technologies in fields such as data centers, artificial intelligence, and supercomputers, more and more powerful ASICs have been applied, such as CPUs, GPUs, machine learning accelerators, network switches, and servers. They consume a large amount of current, for example, the required current can reach thousands of amperes; and their current has the characteristic of rapid jump. Traditionally, a voltage regulator module (VRM, Voltage Regulator Modules, that is, the power converter module involved in the present invention) composed of a buck circuit is used to supply such a load.

[0003] In the prior art, the anti-coupled inductor technology is usually adopted to solve the above problems. The anti-coupled inductor technology has a relatively low leakage inductance value, so it has a relatively fast transient response; at the same time, the anti-coupled inductor has a relatively high steady-state equivalent inductance, which is beneficial to the improvement of efficiency; that is, the anti-coupled inductor technology can not only meet the requirements of transient performance but also take into account the improvement of efficiency. Therefore, the anti-coupled technology is the technology commonly used in VRM at present. Among them, the most important in the anti-coupled inductor technology is the design and manufacture of the inductor.

[0004] Existing inductors generally include at least one winding and a magnetic core. Existing inductors generally adopt an integrally formed inductor in which an iron powder core is directly pressed against the winding, and it is widely used because of its simple processing technology, easy realization of high automation, and mass production. However, the magnetoelectric performance of the iron powder core is poor. To obtain high-performance magnetic components, magnetic materials such as FeAlSi powder core, FeNi powder core, FeNiMo powder core, FeSi powder core, FeSiCr powder core, ferrites (such as FeNiZn, FeMnZn) are required. However, manufacturing magnetic components with these high-performance magnetic materials requires a high-temperature annealing / sintering process, and the temperature usually needs to be above 500 degrees Celsius. Especially, the annealing temperature of the FeAlSi powder core is around 700 degrees. And between the windings of the anti-coupled inductor, a voltage withstand requirement needs to be satisfied, so an insulating material needs to be filled between the two windings. The annealing / sintering process temperature of the magnetic component far exceeds the temperature resistance extreme value of general organic materials. At the same time, when the magnetic core and the winding are co-pressed, the pressure is even as high as 10 tons per square centimeter, far exceeding the compressive strength of general inorganic materials. Therefore, there is an urgent need for a material that can withstand pressure and still maintain insulation performance after high temperature. Summary of the Invention

[0005] The present invention relates to an insulating composition and an inductance structure, which meet the requirements of the insulating composition for compressive strength and high temperature resistance.

[0006] On the one hand, the present invention provides an insulating composition, which is used inside or between winding units of an inductance structure, and includes:

[0007] A fiber substrate, which is used to provide the strength of the insulating composition;

[0008] An organic substance, which coats the fiber substrate and is used to provide stress buffering;

[0009] Wherein, the resistivity of the insulating composition is greater than or equal to 2 Mohm·m after annealing.

[0010] Preferably, the melting temperature of the fiber substrate is less than the annealing temperature, and the cracking temperature of the organic substance is less than the melting temperature of the fiber substrate.

[0011] Preferably, at room temperature, the tensile strength along the stretching direction of the fiber substrate on the plane of the insulating composition is greater than or equal to 20 MPa.

[0012] Preferably, the fiber substrate is at least one of glass fiber and ceramic fiber, and the organic substance is at least one of silicone, epoxy resin, polyvinyl alcohol, polyester, polyesterimide, polyimide, and polyamideimide.

[0013] Preferably, the fiber substrate is a glass fiber fabric, and the organic substance is a silicone resin.

[0014] Preferably, the glass fiber fabric includes warp yarns formed by multiple strands of fibers and weft yarns formed by multiple strands of fibers, and the silicone resin coats the periphery of the glass fiber fabric and is formed inside the glass fiber fabric.

[0015] Preferably, at room temperature, the compressive strength of the organic substance is greater than or equal to 1.5 GPa.

[0016] The present invention also provides a method for forming a winding unit, including:

[0017] S1. Provide at least one insulating composition as described above;

[0018] S2. Form a first winding connection piece on the first surface of at least one insulating composition, and form a second winding connection piece on the second surface opposite to the first surface to form a combined connection piece;

[0019] S3. Separate the combined connection piece into at least one winding unit piece;

[0020] S4. Press and form the winding unit sheet to form the winding unit, which includes a first winding, an insulating composition, and a second winding stacked in sequence.

[0021] Preferably, in step S2, the combined connecting piece is formed by pressing.

[0022] Preferably, in step S2, after forming the combined connecting piece, a pattern is formed on the first winding connecting piece and the second winding connecting piece.

[0023] Preferably, in step S2, before forming the combined connecting piece, a pattern is formed on the first winding connecting piece and the second winding connecting piece.

[0024] Preferably, the pattern is formed by an etching process.

[0025] Preferably, in step S2, there is one insulating composition, the first winding connecting piece is only the discrete first winding, and the second winding connecting piece is only the discrete second winding.

[0026] Preferably, in step S2, forming the combined connecting piece is to assemble the first winding, the insulating composition, and the second winding.

[0027] Preferably, in step S2, the insulating composition is pressed on both the upper surface and the lower surface of the combined connecting piece.

[0028] The present invention also provides a method for forming an inductance structure, including:

[0029] S1. Provide at least one winding unit formed by the above-mentioned method for forming a winding unit; provide at least one magnetic core or magnetic core material;

[0030] S2. Co-press the at least one winding unit and the at least one magnetic core or magnetic core material to form a combined body;

[0031] S3. Perform high-temperature annealing on the combined body;

[0032] S4. Immerse the annealed combined body in an organic material;

[0033] S5. Lead out pins to form an inductance structure, which includes a top surface, a bottom surface, a first side surface, and a second side surface opposite to the first side surface.

[0034] Preferably, both the first winding and the second winding of the winding unit in step S1 include a first end and a second end, and pins are provided at both ends of the first winding and the second winding.

[0035] Preferably, the pins at both ends of the first winding and the second winding are located on the bottom surface of the inductance structure.

[0036] Preferably, the projections of the pins at the same end of the first winding and the second winding do not overlap in the thickness direction of the winding unit.

[0037] Preferably, the winding unit includes opposite first and second main surfaces, and also includes opposite first and second side surfaces which are respectively disposed on the sides of the main surfaces, and further includes opposite first and second end surfaces which are respectively disposed on the end surfaces of the main surfaces.

[0038] Preferably, the ends of the pins of the first winding are provided with bending portions; the ends of the pins of the second winding are provided with bending portions.

[0039] Preferably, the first winding of the winding unit is a first main winding, the second winding of the winding unit is a first auxiliary winding, and the first main winding, the insulating composition and the first auxiliary winding are laminated in the width direction of the inductance structure, and the pins at both ends of the first main winding and the first auxiliary winding are both located on the bottom surface of the inductance structure.

[0040] Preferably, at least one winding unit includes a first winding unit and a second winding unit; the first winding of the first winding unit is a first main winding, and the second winding of the first winding unit is a first auxiliary winding; the first winding of the second winding unit is a second main winding, and the second winding of the second winding unit is a second auxiliary winding;

[0041] The first main winding, the insulating composition and the first auxiliary winding are laminated in the width direction of the inductance structure; the second main winding, the insulating composition and the second auxiliary winding are laminated in the width direction of the inductance structure;

[0042] The first auxiliary winding and the second auxiliary winding are adjacent to each other at intervals in the width direction of the inductance structure;

[0043] In step 2, the first winding unit and the second winding unit are arranged at intervals in the width direction of the inductance structure.

[0044] Preferably, the first main winding and the second main winding have the same shape and extension direction, and the first auxiliary winding and the second auxiliary winding have the same shape and extension direction.

[0045] Preferably, the pins at both ends of the first main winding and the first auxiliary winding are both located on the bottom surface of the inductance structure; the pins at both ends of the second main winding and the second auxiliary winding are both located on the bottom surface of the inductance structure.

[0046] Preferably, the pins at both ends of the main winding are respectively located on the top surface and the bottom surface of the inductance structure, and the pins at both ends of the first auxiliary winding and the second auxiliary winding are both located on the bottom surface of the inductance structure.

[0047] Preferably, the first main winding, the insulating composition, and the second winding are laminated in the width direction of the inductance structure. The insulating composition serves as a non-magnetic air-gap material between the first winding and the second winding, and the coupling coefficient between the first winding and the second winding is adjusted by adjusting the thickness of the insulating composition.

[0048] Preferably, the pin at one end of the first winding extends from the first side surface of the inductance structure to the bottom surface, and the pin at the other end of the first winding extends from the second side surface of the inductance structure to the top surface; the pin at one end of the second winding extends from the first side surface of the inductance structure to the top surface, and the pin at the other end of the second winding extends from the second side surface of the inductance structure to the bottom surface.

[0049] Preferably, the insulating composition has a width, and the width of the insulating composition is greater than the spacing between the first winding and the second winding in the width direction.

[0050] Preferably, an insulating composition is further provided at the interval between the first winding unit and the second winding unit. The insulating composition serves as a non-magnetic air-gap material between the first winding unit and the second winding unit, and the coupling coefficient between the first winding unit and the second winding unit is adjusted by adjusting the thickness of the insulating composition.

[0051] Preferably, the first auxiliary winding and the second auxiliary winding have the same shape and extending direction; the pin at one end of the first main winding extends from the first side surface of the inductance structure to the bottom surface, and the pin at the other end of the first main winding extends from the second side surface of the inductance structure to the top surface; the pin at one end of the second main winding extends from the first side surface of the inductance structure to the top surface, and the pin at the other end of the second main winding extends from the second side surface of the inductance structure to the bottom surface.

[0052] Preferably, in the step S1, at least one magnetic core provided includes a first magnetic core and a second magnetic core, or magnetic powder is provided as the magnetic core material; in the step S2, the co-pressing of the winding unit and the magnetic core or magnetic powder to form a combined body is as follows: the first magnetic core, the winding unit, and the second magnetic core are assembled in sequence and then placed in a mold, and the mold is pressed to form a combined body; or the winding unit is placed in the mold, magnetic powder is filled, and then directly pressed to form a combined body.

[0053] Preferably, grooves adapted to the shape of the winding unit are provided on both the first magnetic core and the second magnetic core.

[0054] The present invention also provides a method for forming an inductance structure, including:

[0055] S1. Providing at least one insulation composition as described above, at least one first winding, and at least one second winding;

[0056] S2. Integrating the first winding and the insulation composition, and then pressing and molding to form an integrated body; pressing and molding the second winding;

[0057] S3. Bonding the pressed and molded integrated body and the second winding with an organic material to form a winding unit, where the insulation composition of the winding unit is located between the first winding and the second winding; the organic material is at least one of silicone, epoxy resin, polyvinyl alcohol, polyester, polyesterimide, polyimide, and polyamideimide.

[0058] S4. Co - pressing at least one of the winding units and at least one magnetic core or magnetic core material to form a combined body;

[0059] S5. Performing high - temperature annealing on the combined body;

[0060] S6. Impregnating the annealed combined body with an organic material;

[0061] S7. Leading out pins to form an inductance structure, where the inductance structure includes a top surface, a bottom surface, a first side surface, and a second side surface opposite to the first side surface.

[0062] Preferably, both the first winding and the second winding of the winding unit in step S4 include a first end and a second end, and pins are provided at both ends of the first winding and the second winding.

[0063] Preferably, the pins at both ends of the first winding and the second winding are located on the bottom surface of the inductance structure; the main bodies of the first winding and the second winding cross each other.

[0064] Preferably, the pin at one end of the first winding is located on the bottom surface of the inductance structure, and the pin at the other end of the first winding is located on the top surface of the inductance structure; the pin at one end of the second winding is located on the top surface of the inductance structure, and the pin at the other end of the second winding is located on the bottom surface of the inductance structure.

[0065] Preferably, the pins at both ends of the first winding and the second winding are located on the bottom surface of the inductance structure; the main bodies of the first winding, the insulation composition, and the second winding are stacked in sequence.

[0066] Preferably, the pins of the first winding and the second winding at the same end extend away from each other, and the pins at both ends of the first winding and the second winding do not cover the insulating composition, and the insulating composition only extends along the bent portion of the first winding.

[0067] Compared with the prior art, the present invention has the following advantages:

[0068] The insulating composition provided by the present invention is used between the windings or within the windings of an inductor, and still maintains good insulating properties after undergoing high-temperature annealing, and at the same time has good tensile strength and compressive properties at room temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0069] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention, and those of ordinary skill in the art can also obtain other drawings based on these drawings without creative efforts.

[0070] Figures 1a to 1c Schematic diagram of the formation of the winding unit;

[0071] Figure 2a Schematic diagram of the winding unit structure, Figure 2b is Figure 2a Corresponding inductor structure schematic diagram;

[0072] Figure 3a and Figure 3c Schematic diagram of the winding unit structure, Figure 3b is Figure 3a Bottom view of the corresponding inductor structure;

[0073] Figure 4a Schematic diagram of the winding unit structure, Figure 4b is Figure 4a Corresponding inductor structure schematic diagram;

[0074] Figure 5 Schematic diagram of the winding unit structure;

[0075] Figure 6 Schematic diagram of the winding unit structure;

[0076] Figure 7 Schematic diagram of the winding unit structure;

[0077] Figure 8a Schematic diagram of the inductor structure, Figure 8b is Figure 8a Corresponding exploded view;

[0078] Figure 9a Schematic diagram of the inductor structure,Figure 9b For Figure 9a the corresponding exploded view;

[0079] Figure 10a is a schematic diagram of the inductance structure, Figure 10b For Figure 10a the corresponding exploded view;

[0080] Figure 11a is a schematic diagram of the inductance structure, Figure 11b For Figure 11a the corresponding exploded view;

[0081] Figure 11c is a schematic diagram of another inductance structure of Embodiment IX, Figure 11d For Figure 11c the corresponding exploded view;

[0082] Figure 12a is a schematic diagram of the inductance structure, Figure 12b For Figure 12a the corresponding exploded view;

[0083] Figure 13a is a schematic diagram of the winding unit structure, Figure 13b For Figure 13a the corresponding inductance structure schematic diagram;

[0084] Figure 14a is a schematic diagram of the winding unit structure, Figure 14b For Figure 14a the corresponding inductance structure schematic diagram;

[0085] Figure 15 is a schematic diagram of the winding unit structure. Specific Embodiments

[0086] The present invention provides an insulating composition, which is used in the winding on the one hand and can be used between different windings on the other hand. After undergoing high-temperature annealing, the insulating composition of the present invention still maintains good insulating properties, and at the same time has good tensile strength and compressive properties at room temperature (i.e., before annealing).

[0087] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0088] Figures 1a - 1c is a schematic diagram of the formation of the winding unit. As Figure 1cAs shown, the winding unit 100 includes a first winding 121, a second winding 122, and an insulating composition 131, and the first winding 121, the insulating composition 131, and the second winding 122 are stacked in sequence.

[0089] Among them, the insulating composition 131 is used inside the winding unit of the inductive structure or between different winding units. The insulating composition 131 includes: a fiber substrate 137 and an organic substance 135. The fiber substrate 137 is used to provide the strength of the insulating composition at room temperature; the organic substance 135 coats the fiber substrate 137 to provide stress buffering. Preferably, the organic substance coats the fiber substrate by impregnating the fiber substrate with the organic substance.

[0090] Preferably, the compressive strength of the organic substance at room temperature is greater than or equal to 1.5 GPa, and the resistivity of the insulating composition after annealing (the annealing temperature is generally greater than 500 degrees Celsius) is greater than or equal to 2 Mohm·m. The insulating composition provided by the present invention can provide excellent tensile strength and compressive performance at room temperature, and at the same time has outstanding insulating performance after undergoing high-temperature annealing treatment.

[0091] The melting temperature of the fiber substrate is less than the annealing temperature, and the cracking temperature of the organic substance is less than the annealing temperature. Further, the cracking temperature of the organic substance is less than the melting temperature of the fiber substrate. Generally speaking, the annealing temperature is above 500 °C, and the annealing temperature is related to the selection of the core material. Among them, the cracking temperature is the temperature corresponding to when the organic substance undergoes cracking and loses 5% of its weight.

[0092] At room temperature, the tensile strength along the extension direction of the fiber substrate on the plane of the insulating composition is greater than or equal to 20 MPa.

[0093] Optionally, the fiber substrate is at least one of glass fiber and ceramic fiber, and the organic substance is at least one of silicone, epoxy resin, polyvinyl alcohol, polyester, polyesterimide, polyimide, and polyamideimide. Further preferably, the fiber substrate is a glass fiber fabric, and the organic substance is a silicone resin. Preferably, the glass fiber fabric is at least one of E glass fiber and S glass fiber with a melting temperature of about 650 degrees. The glass fiber fabric includes warp yarns formed by multiple strands of fibers and weft yarns formed by multiple strands of fibers, and the silicone resin coats the periphery of the glass fiber fabric and is formed inside the glass fiber fabric.

[0094] The present invention uses a glass fiber fabric as a supporting base material, which greatly improves the strength at room temperature; a tensile strength greater than or equal to 20 MPa along the stretching direction of the fiber can ensure the structural integrity of the winding during the forming process; the glass fiber fabric has warp and weft threads, which improves toughness and strength, and is coated with an organic substance to provide stress buffering during subsequent pressing, maximizing the protection of the integrity of the glass fiber. Impregnating the glass fiber fabric with an organic substance can greatly increase the content of glass fiber. This is mainly because the impregnation method can easily and completely fill the organic substance inside the glass fiber fabric, and only a very thin layer of organic substance on the surface of the glass fiber fabric is required to provide the adhesion between the insulating composition and the winding. Moreover, the increase in the glass fiber content can greatly improve the insulation performance and mechanical properties between windings after high-temperature annealing. In the case of using a glass particle mixed with an organic material to form an insulating material, the filling amount of glass particles will affect the viscosity and mechanical strength of the insulating layer at room temperature, resulting in poor processability. And during the inductance pressing, misalignment between glass particles may cause the risk of insulation failure.

[0095] The present invention also provides a method for forming the above-mentioned winding unit, including:

[0096] S1. Provide at least one of the above-mentioned insulating compositions 131;

[0097] Optionally, as Figure 1a shown, the insulating composition 131 in step S1 is an insulating composition layer, which includes opposite first and second surfaces.

[0098] S2. Form a first winding connecting piece on the first surface of at least one insulating composition 131, and form a second winding connecting piece on the second surface opposite to the first surface to form a combined connecting piece;

[0099] Optionally, in step S2, the combined connecting piece is formed by pressing, for example, laminating the first winding connecting piece, at least one insulating composition 131, and the second winding connecting piece and then pressing. Specifically, the first winding connecting piece and the second winding connecting piece are copper foils, and forming the combined connecting piece is pressing copper foils on both sides of at least one insulating composition 131. After forming the combined connecting piece, a pattern is formed on the first winding connecting piece and the second winding connecting piece. Of course, optionally, before forming the combined connecting piece, a pattern is formed on the first winding connecting piece and the second winding connecting piece, and the pattern is formed by an etching process. Figure 1b Exemplarily shows the pattern after the etching process. Among them, the first winding connecting piece is a connecting piece formed by connecting the heads and tails of several first windings, and the second winding connecting piece is a connecting piece formed by connecting the heads and tails of several second windings. Figure 1a Only shows the case of a combined connecting piece formed by one insulating composition 131, one first winding 121, and one second winding 122.

[0100] In other embodiments, a connecting body is disposed between adjacent windings of the winding connecting piece, and the connecting body is removed when separated into winding unit pieces in the subsequent step S3.

[0101] S3. Separating the combined connecting piece into at least one winding unit piece;

[0102] Optionally, in the step S3, separating the combined connecting piece into at least one winding unit piece is achieved by at least one of mechanical cutting or laser cutting. The winding unit piece is exemplified as Figure 1b as shown.

[0103] S4. Pressing and shaping the winding unit piece to form the winding unit 100, and the winding unit includes a first winding 121, an insulating composition 131, and a second winding 122 that are stacked in sequence. Optionally, the shape of the pressed and shaped winding unit is determined according to the design requirements of the inductance structure. The winding unit can be pressed into a "[" shape, or can be pressed into a "Z" shape; or any combination of the "[" shape and the "Z" shape; Figure 1c Only the case of the "[" shape is exemplarily shown.

[0104] In another embodiment, in the step S2, there is one insulating composition, the first winding connecting piece is only a discrete first winding, and the second winding connecting piece is only a discrete second winding, that is, the combined connecting piece is formed by assembling the first winding, the insulating composition, and the second winding. In this embodiment, each winding unit is independently formed instead of in the form of a connecting piece, so the above step S3 can be omitted.

[0105] In other embodiments, as Figure 7 shown, in the step S2, an insulating composition is further pressed on the upper surface and the lower surface of the combined connecting piece. Specifically, an insulating composition 131b is disposed on the upper surface of the combined connecting piece, and an insulating composition 131a is disposed on the lower surface of the combined connecting piece. The insulating compositions 131a and 131b can wrap the winding unit, so as to isolate the winding unit from the magnetic core according to the insulation performance requirements of the magnetic core body, forming a more complete insulation.

[0106] Any shape of winding unit can be formed according to the above method for forming a winding unit.

[0107] The present invention further provides a method for forming an inductance structure 200, including:

[0108] S1. Providing at least one winding unit 100 formed by the above method for forming a winding unit; providing at least one magnetic core 210 or magnetic core material;

[0109] Optionally, at least one provided magnetic core includes a first magnetic core and a second magnetic core, or magnetic powder is provided as the magnetic core material. The number of magnetic cores is selected according to the design of the inductance structure.

[0110] Optionally, the shape of the winding unit 100 is selected according to the design requirements of the inductance structure 200, such as a "[-]" shape, a "Z" shape, or any combination of a "[-]" shape and a "Z" shape, etc.

[0111] S2. Co-press the at least one winding unit 100 with the at least one magnetic core 210 or the magnetic core material to form a combined body;

[0112] Optionally, co-pressing the winding unit with the magnetic core or the magnetic core material to form a combined body means assembling the first magnetic core, the winding unit, and the second magnetic core in sequence and then placing them in a mold, and pressing the mold to form a combined body; or placing the winding unit in the mold, filling it with magnetic powder, and then directly pressing to form a combined body.

[0113] S3. Perform high-temperature annealing on the combined body;

[0114] S4. Immerse the annealed combined body in an organic material;

[0115] S5. Lead out pins to form the inductance structure 200, and the inductance structure includes a top surface 211, a bottom surface 213, a first side surface 214, and a second side surface 216 opposite to the first side surface 214. Optionally, the inductance structure 200 is a cuboid.

[0116] Among them, in step S3, during the annealing process, at least part of the organic matter in the insulating composition undergoes cracking, and the glass fiber melts to fill the gaps generated by the cracking of the organic matter, forming a microscopically porous but macroscopically continuous insulating structure. In the subsequent step S4, the organic material impregnation can not only fill the gaps but also fill the above-mentioned microscopically porous structure.

[0117] Optionally, in step S3, the cracking temperature of the organic matter is lower than the melting temperature of the glass fiber, so as to ensure that the melting of the glass fiber to repair the micropores between the cracking products of the organic matter is not affected by the exhaust gas from the cracking of the organic matter.

[0118] Optionally, in step S5, the pins can be led out by laser windowing and then electroplating, or a sintered conductive paste can be set after windowing, and materials such as copper and tin are plated on the conductive paste to form pins.

[0119] Any inductor structure 200 can be formed according to the method for forming the inductor structure described above. The insulation method between the first winding and the second winding or between winding units disclosed in the present invention can provide good insulation for the winding units, and is also applicable to the insulation between turns in a winding. The present invention will be described only by taking the following inductor structure 200 as an example, but is not limited thereto.

[0120] Embodiment 1

[0121] Figure 2a is a schematic structural diagram of an embodiment of the winding unit, Figure 2b is a schematic structural diagram of an embodiment of the inductor structure 200. Referring simultaneously to Figures 2a to 2b, the inductance structure 200 includes a magnetic core 210 and a winding unit 100. The winding unit 100 includes a first winding 121, a second winding 122, and an insulating composition 131. The first winding 121, the insulating composition 131, and the second winding 122 are stacked in sequence. The first winding 121 of the winding unit 100 includes a first end 145b and a second end 147a. The first winding is provided with a lead 121a at the first end and a lead 121b at the second end. The second winding 122 of the winding unit 100 includes a first end 145a and a second end 147b. The second winding is provided with a lead 122a at the first end and a lead 122b at the second end. Specifically, in the step S5, the leads are formed by leading both the first end and the second end of the first winding 121 out of the magnetic core 210, and leading both the first end and the second end of the second winding 122 out of the magnetic core 210. The winding unit (or the first winding, the second winding, the insulating composition) includes opposite first main surface 141 and second main surface 142. The winding unit further includes opposite first side surface 143 and second side surface. The first side surface 143 and the second side surface are respectively disposed on the sides of the main surfaces (the first main surface, the second main surface). The winding unit 100 further includes opposite first end surface and second end surface. The first end surface and the second end surface are respectively disposed on the end surfaces of the main surfaces (the first main surface, the second main surface), that is, the first end surface is the end surface of the first end, and the second end surface is the end surface of the second end. Optionally, the insulating composition 131 may extend beyond the range of the first winding 121 or the second winding 122. For example, the insulating composition 131 extends outward from the first side surface 143 and the second side surface, and / or extends outward on the first end surface and the second end surface to further resist variations such as deformation caused by tolerances and pressures during the processing, and improve the safety of insulation. The main surface is the surface formed by the length direction L and the width direction W. Optionally, the winding unit 100 is in the shape of "[", and the leads at both ends (the first end and the second end) of the first winding 121 and the second winding 122 are both located on the bottom surface 213 of the inductance structure 200. The insulating composition 131 can form good insulation performance between the first winding 121 and the second winding 122.

[0122] Embodiment 2

[0123] Figure 3a is a schematic structural diagram of another embodiment of the winding unit, Figure 3c is a schematic structural diagram of another embodiment of the winding unit, Figure 3b is a schematic structural diagram of another embodiment of the inductance structure. Referring to Figures 3a to 3c, the difference between this embodiment and the first embodiment is that: the projections of the pins at the same end (such as the first end or the second end) of the first winding 121 and the second winding 122 in the thickness direction T of the winding unit do not overlap each other. That is: an avoidance area 129 is provided between the pins at the same end of the first winding 121 and the second winding 122 in the width direction W of the winding unit, and there are no pins in the avoidance area 129. This embodiment can provide better insulation. Figure 3c The situation where the insulating compositions 131a and 131b are further laminated on the upper and lower surfaces of the winding unit 100 is shown, thereby improving the insulation between the winding unit and the magnetic core.

[0124] Embodiment Three

[0125] Figure 4a is a schematic structural diagram of another embodiment of the winding unit, Figure 4b is a schematic structural diagram of another embodiment of the inductor structure. Referring to Figures 4a to 4b , the difference between this embodiment and the first embodiment is that: the pins at both ends (the first end and the second end) of the first winding 121 are respectively located on the opposite sides of the winding unit, the pins at both ends (the first end and the second end) of the second winding 122 are respectively located on the opposite sides of the winding unit, and the pins at the same end of the first winding and the second winding are respectively located on the opposite sides of the winding unit. That is: the pin 121a at the first end of the first winding 121 is located on the first side 141 of the first winding 121, and the pin 121b at the second end of the first winding 121 is located on the second side of the first winding 121; the pin 122a at the first end of the second winding 122 is located on the second side of the second winding 122, and the pin 122b at the second end of the second winding 122 is located on the first side of the second winding 122. The insulating composition 131 extends in the width direction W on the first side 141 and the second side to form a side extension portion 128a; the insulating composition 131 extends in the length direction on the first end face and the second end face to form an end face extension portion 128b. The pin 121a and the pin 122b are arranged on the top surface 211 of the inductor structure 200, and the pin 122a and the pin 121b are arranged on the bottom surface 213 of the inductor structure 200. The winding unit is horizontally arranged in the magnetic core 210. Optionally, the winding unit 100 is in a "C" shape. The side extension portion 128a and the end face extension portion 128b can provide good insulation.

[0126] Embodiment Four

[0127] Figure 5 is a schematic structural diagram of another embodiment of the winding unit. Referring to Figure 5, the difference between this embodiment and the third embodiment is that: the insulating composition also extends along the pins of the first winding and the second winding to form a pin extension portion 128c. Optionally, the pin extension portion 128c is provided on all the pins of the first winding and the second winding, thereby providing better insulation.

[0128] Embodiment Five

[0129] Figure 6 is a schematic structural diagram of another embodiment of the winding unit. Refer to Figure 6 , the difference between this embodiment and the third embodiment is that: a bending portion 128d is provided at the end of the pin of the first winding; a bending portion 128d is provided at the end of the pin of the second winding. And the extending directions of the bending portions are the same. The setting of the bending portion can increase the area of the pin. Since the winding unit is usually relatively thick, the pin lead-out position can be adjusted with a lower impedance.

[0130] Embodiment Six

[0131] Figure 8a is a schematic structural diagram of an embodiment of the inductor structure. Figure 8b is an exploded view of the inductor structure. At the same time, refer to Figures 8a to 8b , the inductor structure 200 includes a magnetic core 210 and a winding unit 100. The winding unit 100 includes a first winding 121, a second winding 122, and an insulating composition 131. Among them, the first winding 121 of the winding unit is the first main winding 121, the second winding 122 of the winding unit is the first auxiliary winding 121f. The first main winding 121, the insulating composition 131, and the first auxiliary winding 121f are laminated (arranged in parallel) in the width direction W of the inductor structure 200. The pins at both ends of the first main winding and the first auxiliary winding are both located on the bottom surface of the inductor structure. The insulating composition 131 is provided between the winding bodies of the first main winding 121 and the first auxiliary winding 121f; the geometric shapes of the first main winding and the first auxiliary winding are the same, thereby improving the coupling coefficient between the main winding and the auxiliary winding. Optionally, the winding unit is in the shape of "[". The insulating composition is provided between the first main winding and the first auxiliary winding to provide insulation and prevent short circuits; the smaller the width of the insulating composition, the higher the coupling coefficient between the first main winding and the first auxiliary winding.

[0132] Optionally, the magnetic core includes a first magnetic core 210a and a second magnetic core 210b; in the step S2, co-pressing the winding unit and the magnetic core to form an assembly means assembling the first magnetic core 210a, the winding unit and the second magnetic core 210b in sequence and then placing them in a mold, and pressing the mold to form an assembly. Wherein, grooves adapted to the shape of the winding unit are provided on both the first magnetic core and the second magnetic core. Specifically, for example, first manufacture a magnetic core preform (or called magnetic core blank), that is Figure 8b the first magnetic core 210a and the second magnetic core 210b in Figure 8b ; then after assembling the magnetic core blank (i.e., the first magnetic core 210a and the second magnetic core 210b) and the winding unit, place them in a mold and press them into shape.

[0133] Of course, optionally, co-pressing and forming can also be to place the winding unit in a mold, fill it with magnetic powder, and then directly press it to form an assembly; it can also be to place the winding unit and at least one magnetic core (such as a magnetic core blank) in a mold, fill it with magnetic powder, and then directly press it to form an assembly. Specifically, for example, first manufacture a magnetic core blank (such as the second magnetic core 210b), then sequentially place the magnetic core blank 210b and the winding unit in a mold, and then fill the cavities of the mold with magnetic powder and press them together into shape.

[0134] Wherein, the grooves on the magnetic core blank are for limiting the winding unit to ensure that the relative position of the winding unit remains unchanged during the mold pressing process.

[0135] Embodiment Seven

[0136] Figure 9a is a schematic structural diagram of an embodiment of the inductor structure, Figure 9b is an exploded view of the inductor structure. Refer to Figures 9a to 9b, the difference between this embodiment and Embodiment Six is as follows: The inductance structure 200 includes a magnetic core 210 and a winding unit. The winding unit 100 includes a first winding unit and a second winding unit. The first winding of the first winding unit is the first main winding 125, and the second winding of the first winding unit is the first auxiliary winding 125f. The first winding of the second winding unit is the second main winding 126, and the second winding of the second winding unit is the second auxiliary winding 126f. The first main winding 125, the insulating composition 131, and the first auxiliary winding 125f are laminated in the width direction W of the inductance structure 200. The second main winding 126, the insulating composition 131, and the second auxiliary winding 126f are laminated in the width direction W of the inductance structure 200. The first auxiliary winding and the second auxiliary winding are adjacent to each other at intervals in the width direction of the inductance structure. Specifically, in Step 2, the first winding unit and the second winding unit are arranged at intervals in the width direction of the inductance structure to form an interval. The shapes and extension directions of the first main winding 125 and the second main winding 126 are the same, and the shapes and extension directions of the first auxiliary winding 125f and the second auxiliary winding 126f are the same. The pins at both ends of the first main winding and the first auxiliary winding are located at the bottom surface of the inductance structure. The pins at both ends of the second main winding and the second auxiliary winding are located at the bottom surface of the inductance structure. The cross-sectional area of the main winding is larger than that of the auxiliary winding, reducing the DC loss of the main winding.

[0137] Embodiment Eight

[0138] Figure 10a is a schematic structural diagram of an embodiment of the inductance structure, Figure 10b is an exploded view of the inductance structure. Referring simultaneously to Figures 10a to 10b , the difference between this embodiment and Embodiment Seven is as follows: The pins at both ends (the first end and the second end) of the main windings (the first main winding 125 and the second main winding 126) are respectively located on the top surface and the bottom surface of the inductance structure, and the pins at both ends of the first auxiliary winding 125f and the second auxiliary winding 126f are both located on the bottom surface of the inductance structure. Such a setting expands the application range of the inductance structure.

[0139] Embodiment Nine

[0140] Figure 11a is a schematic structural diagram of an embodiment of the inductance structure, Figure 11b is an exploded view of the inductance structure. Referring simultaneously to Figures 11a to 11b, the difference between this embodiment and the first embodiment is that: the first main winding 121, the insulating composition 131 and the second winding 122 are laminated in the width direction W of the inductance structure. The insulating composition serves as a non-magnetic air-gap material between the first winding 121 and the second winding 122, and the coupling coefficient between the first winding and the second winding is adjusted by adjusting the thickness of the insulating composition. The insulating composition 131 is disposed between the winding bodies of the first winding 121 and the second winding 122. The lead of one end (the first end) of the first winding 121 extends from the first side surface 214 of the inductance structure towards the bottom surface, and the lead of the other end (the second end) of the first winding 121 extends from the second side surface 216 of the inductance structure towards the top surface; the lead of one end (the first end) of the second winding 122 extends from the first side surface 214 of the inductance structure towards the top surface, and the lead of the other end (the second end) of the second winding extends from the second side surface 216 of the inductance structure towards the bottom surface. The insulating composition 131 is used as an air-gap material to realize the air-gap production of the sintered inductor. Since the insulating composition has good compatibility with the sintered magnetic material, the problem that the magnetic core is prone to crack during the air-gap process of the sintered magnetic core can be solved.

[0141] In another implementation manner of this embodiment, as Figures 11c - 11d shown, the difference between it and the ninth embodiment is that: the insulating composition 131 is disposed between the winding bodies of the first winding 121 and the second winding 122 and has a width D; the width W of the insulating composition 131 is greater than the spacing d between the two windings in the width direction; therefore, during the inductor manufacturing process, it can be ensured that the insulating composition 131 completely covers the spacing part between the two windings (the first winding 121 and the second winding 122); the purpose of such a setting is to prevent Figure 11a during the pressing process of the inductance structure, the magnetic powder extrudes the insulating material 131 and the two windings, causing the magnetic powder to pass through the combined part between the winding and the insulating composition, resulting in the problem of magnetic short circuit.

[0142] Embodiment Ten

[0143] Figure 12a is a schematic structural diagram of an embodiment of the inductance structure, Figure 12b is an exploded view of the inductance structure. Referring simultaneously to Figures 12a to 12b, the difference between this embodiment and the eighth embodiment is that: an insulating composition 131 is further provided at the interval between the first winding unit and the second winding unit. The insulating composition 131 serves as a non-magnetic air-gap material between the first winding unit and the second winding unit, and the coupling coefficient between the first winding unit and the second winding unit is adjusted by adjusting the thickness of the insulating composition. The shapes and extending directions of the first auxiliary winding 125f and the second auxiliary winding 126f are the same; the pin at one end of the first main winding 125 extends from the first side surface of the inductance structure towards the bottom surface, and the pin at the other end of the first main winding 125 extends from the second side surface of the inductance structure towards the top surface; the pin at one end of the second main winding 126 extends from the first side surface of the inductance structure towards the top surface, and the pin at the other end of the second main winding 126 extends from the second side surface of the inductance structure towards the bottom surface. The insulating composition 131 is used as an air-gap material to realize the air-gap production of the sintered inductor. Since the insulating composition has good compatibility with the sintered magnetic material, the problem that the magnetic core is prone to crack during the air-gap process of the sintered magnetic core can be solved.

[0144] Embodiment XI

[0145] As Figures 13a - 13b shown, the present invention further provides a method for forming an inductance structure 200, including:

[0146] S1. Provide at least one of the above-mentioned insulating compositions 131, at least one first winding 121, and at least one second winding 122;

[0147] S2. Integrate the first winding 121 and the insulating composition 131, and then press and mold them to form an integrated body; press and mold the second winding 122;

[0148] S3. Bond the pressed and molded integrated body and the second winding 122 with an organic material to form a winding unit 100, and the insulating composition 133 of the winding unit is located between the first winding and the second winding;

[0149] The organic material is at least one of silicone, epoxy resin, polyvinyl alcohol, polyester, polyesterimide, polyimide, and polyamideimide.

[0150] S4. Co-press at least one of the winding units and at least one magnetic core 210 to form a combined body;

[0151] S5. Perform high-temperature annealing on the combined body;

[0152] S6. Immerse the annealed combined body in an organic material;

[0153] S7. Lead out pins to form an inductance structure, where the inductance structure includes a top surface, a bottom surface, a first side surface, and a second side surface opposite to the first side surface.

[0154] The method of this embodiment is different from the method of forming the inductance structure above in steps S2 and S3. In this embodiment, the first winding 121 and the insulating composition 131 are first pressed together and then combined with the second winding 122. Additionally, the difference between the inductance structure of this embodiment and that of Embodiment 1 is that the pins at both ends of the first winding and the second winding are both located on the bottom surface of the inductance structure; the main bodies of the first winding 121 and the second winding 122 intersect with each other. Optionally, the angle at which the main bodies intersect with each other is 90°.

[0155] Embodiment Twelve

[0156] Figure 14a is a schematic structural diagram of an embodiment of the inductance structure, Figure 14b is an exploded view of the inductance structure. Referring to Figures 14a to 14b , the difference between this embodiment and Embodiment Eleven is that the pin at one end of the first winding 121 is located on the bottom surface of the inductance structure, and the pin at the other end of the first winding 121 is located on the top surface of the inductance structure; the pin at one end of the second winding 122 is located on the top surface of the inductance structure, and the pin at the other end of the second winding 122 is located on the bottom surface of the inductance structure.

[0157] Embodiment Thirteen

[0158] Figure 15 is a schematic structural diagram of an embodiment of the inductance structure. Referring to Figure 15 , the difference between this embodiment and Embodiment Eleven is that the pins at both ends of the first winding 121 and the second winding 122 are both located on the bottom surface of the inductance structure 200; the main bodies of the first winding, the insulating composition, and the second winding are stacked in sequence. The pins at the same end of the first winding 121 and the second winding 122 extend away from each other, and the pins at both ends of the first winding 121 and the second winding 122 do not cover the insulating composition 131, and the insulating composition 131 only extends along the bent portion of the first winding.

[0159] As described in the above embodiments, the inductance structure 200 can not only be applied to an independent voltage regulation module but also be a part of an electronic device as long as it meets the technical features and advantages disclosed in the present invention.

[0160] As used in this invention, the terms "equal", "identical", or "equivalent" must take into account the parameter distribution in the engineering, with the error distribution within ±30%. The definition of "parallel" for two line segments or two straight lines is that the included angle between the two line segments or two straight lines is less than or equal to 45 degrees. The definition of "perpendicular" for two line segments or two straight lines is that the included angle between the two line segments or two straight lines is within the range of [60, 120] degrees. The definition of "phase shift" in the phase also needs to consider the parameter distribution in the engineering, with the error distribution of the phase shift degree within ±30%. Additionally, in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including", or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article, or device that comprises a series of elements includes not only those elements but also other elements not expressly listed, or elements that are inherent to such process, method, article, or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the existence of additional identical elements in the process, method, article, or device that comprises the element.

[0161] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. For the same or similar parts among the embodiments, reference can be made to each other.

[0162] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An insulating composition, which is used inside a winding unit of an inductive structure or between different winding units, is characterized in that Comprising: A fiber substrate for providing the strength of the insulating composition; An organic substance that coats the fiber substrate for providing stress buffering; Wherein, the resistivity of the insulating composition is greater than or equal to 2 Mohm·m after annealing.

2. The insulating composition according to claim 1, wherein The melting temperature of the fiber substrate is less than the annealing temperature, and the cracking temperature of the organic substance is less than the melting temperature of the fiber substrate.

3. The insulating composition according to claim 1, characterized in that, At room temperature, the tensile strength along the stretching direction of the fiber substrate on the plane of the insulating composition is greater than or equal to 20 MPa.

4. The insulating composition according to claim 1, characterized in that, The fiber substrate is at least one of glass fiber and ceramic fiber, and the organic substance is at least one of silicone, epoxy resin, polyvinyl alcohol, polyester, polyesterimide, polyimide, and polyamideimide.

5. The insulating composition according to claim 1, characterized in that The fiber substrate is a glass fiber fabric, and the organic substance is a silicone resin.

6. The insulating composition according to claim 5, wherein The glass fiber fabric includes warp yarns formed by multiple strands of fibers and weft yarns formed by multiple strands of fibers. The silicone resin coats the periphery of the glass fiber fabric and is formed inside the glass fiber fabric.

7. The insulating composition according to claim 1, wherein At room temperature, the compressive strength of the organic substance is greater than or equal to 1.5 GPa.

8. A method for forming a winding unit, characterized in that, Comprising: S1. Provide at least one insulating composition as described in any one of claims 1-7; S2. Form a first winding connecting piece on the first surface of at least one insulating composition, and form a second winding connecting piece on the second surface opposite to the first surface to form a combined connecting piece; S3. Separate the combined connecting piece into at least one winding unit piece; S4. Press and mold the winding unit piece to form the winding unit, and the winding unit includes a first winding, an insulating composition, and a second winding stacked in sequence.

9. A method for forming a winding unit according to claim 8, characterized in that, In step S2, the combined connecting piece is formed by pressing.

10. A method for forming a winding unit according to claim 8, characterized in that, In step S2, after forming the combined connecting piece, form a pattern on the first winding connecting piece and the second winding connecting piece.

11. A method for forming a winding unit according to claim 8, characterized in that, In step S2, before forming the combined connecting piece, form a pattern on the first winding connecting piece and the second winding connecting piece.

12. A method for forming a winding unit according to claim 10 or 11, characterized in that, The pattern is formed by an etching process.

13. A method for forming a winding unit according to claim 8, characterized in that, In step S2, there is one insulating composition, the first winding connecting piece is only a discrete first winding, and the second winding connecting piece is only a discrete second winding.

14. A method for forming a winding unit according to claim 13, characterized in that, In step S2, forming the combined connecting piece is to assemble the first winding, the insulating composition, and the second winding.

15. A method for forming a winding unit according to claim 8, characterized in that, In step S2, insulating compositions are pressed on both the upper surface and the lower surface of the combined connecting piece.

16. A method for forming an inductance structure, characterized in that, Comprising: S1. Provide at least one winding unit formed by the formation method of the winding unit as described in any one of claims 8-15; Provide at least one magnetic core or magnetic core material; S2. Co-press the at least one winding unit and the at least one magnetic core or magnetic core material to form a combined body; S3. Perform high-temperature annealing on the combined body; S4. Immerse the annealed combined body in an organic material; S5. Lead out pins to form an inductor structure, and the inductor structure includes a top surface, a bottom surface, a first side surface, and a second side surface opposite to the first side surface.

17. A method for forming an inductance structure according to claim 16, characterized in that, The first winding and the second winding of the winding unit in step S1 both include a first end and a second end, and pins are provided at both ends of the first winding and the second winding.

18. A method for forming an inductance structure according to claim 17, wherein The pins at both ends of the first winding and the second winding are both located on the bottom surface of the inductance structure.

19. A method for forming an inductance structure according to claim 17, characterized in that The projections of the pins at the same end of the first winding and the second winding in the thickness direction of the winding unit do not overlap each other.

20. A method for forming an inductance structure as described in claim 15, characterized in that, The winding unit includes opposite first and second main surfaces, and also includes opposite first and second side surfaces which are respectively arranged on the sides of the main surfaces, and further includes opposite first and second end surfaces which are respectively arranged on the end surfaces of the main surfaces.

21. A method for forming an inductance structure according to claim 17, characterized in that, The end of the pin of the first winding is provided with a bending portion; the end of the pin of the second winding is provided with a bending portion.

22. A method for forming an inductance structure as described in claim 16, characterized in that, The first winding of the winding unit is a first main winding, the second winding of the winding unit is a first auxiliary winding, the first main winding, the insulating composition and the first auxiliary winding are laminated in the width direction of the inductance structure, and the pins at both ends of the first main winding and the first auxiliary winding are both located on the bottom surface of the inductance structure.

23. A method for forming an inductance structure according to claim 16, characterized in that, At least one winding unit includes a first winding unit and a second winding unit; the first winding of the first winding unit is a first main winding, and the second winding of the first winding unit is a first auxiliary winding; the first winding of the second winding unit is a second main winding, and the second winding of the second winding unit is a second auxiliary winding; The first main winding, the insulating composition and the first auxiliary winding are laminated in the width direction of the inductance structure; the second main winding, the insulating composition and the second auxiliary winding are laminated in the width direction of the inductance structure; The first auxiliary winding and the second auxiliary winding are adjacent to each other at intervals in the width direction of the inductance structure; In step 2, the first winding unit and the second winding unit are arranged at intervals in the width direction of the inductance structure.

24. A method for forming an inductance structure as described in claim 23, characterized in that, The shapes and extending directions of the first main winding and the second main winding are the same, and the shapes and extending directions of the first auxiliary winding and the second auxiliary winding are the same.

25. A method for forming an inductance structure as described in claim 24, characterized in that, The pins at both ends of the first main winding and the first auxiliary winding are both located on the bottom surface of the inductance structure; the pins at both ends of the second main winding and the second auxiliary winding are both located on the bottom surface of the inductance structure.

26. The method for forming an inductance structure as described in claim 24, characterized in that, The pins at both ends of the main winding are respectively located on the top surface and the bottom surface of the inductance structure, and the pins at both ends of the first auxiliary winding and the second auxiliary winding are both located on the bottom surface of the inductance structure.

27. A method for forming an inductance structure according to claim 16, characterized in that, The first main winding, the insulating composition and the second winding are laminated in the width direction of the inductance structure, and the insulating composition serves as a non-magnetic air gap material between the first winding and the second winding, and the coupling coefficient between the first winding and the second winding is adjusted by adjusting the thickness of the insulating composition.

28. The forming method of an inductance structure as described in claim 27, wherein, The pin at one end of the first winding extends from the first side surface of the inductance structure to the bottom surface, and the pin at the other end of the first winding extends from the second side surface of the inductance structure to the top surface; the pin at one end of the second winding extends from the first side surface of the inductance structure to the top surface, and the pin at the other end of the second winding extends from the second side surface of the inductance structure to the bottom surface.

29. The method for forming an inductance structure according to claim 28, wherein The insulating composition has a width, and the width of the insulating composition is greater than the spacing in the width direction between the first winding and the second winding.

30. A method for forming an inductance structure as described in claim 24, characterized in that, An insulating composition is also provided at the interval between the first winding unit and the second winding unit. The insulating composition serves as a non-magnetic air-gap material between the first winding unit and the second winding unit, and the coupling coefficient between the first winding unit and the second winding unit is adjusted by adjusting the thickness of the insulating composition.

31. A method for forming an inductance structure as described in claim 30, characterized in that, The first auxiliary winding and the second auxiliary winding have the same shape and extending direction; the lead of one end of the first main winding extends from the first side surface of the inductance structure to the bottom surface, and the lead of the other end of the first main winding extends from the second side surface of the inductance structure to the top surface; The lead of one end of the second main winding extends from the first side surface of the inductance structure to the top surface, and the lead of the other end of the second main winding extends from the second side surface of the inductance structure to the bottom surface.

32. A method for forming an inductance structure according to any one of claims 22-31, characterized in that, In the step S1, at least one magnetic core provided includes a first magnetic core and a second magnetic core, or magnetic powder is provided as the magnetic core material; in the step S2, the winding unit and the magnetic core or magnetic powder are co-pressed to form a combined body: the first magnetic core, the winding unit and the second magnetic core are assembled in sequence and then placed in a mold, and the mold is pressed to form a combined body; or the winding unit is placed in the mold, magnetic powder is filled, and then directly pressed to form a combined body.

33. A method for forming an inductance structure according to any one of claims 22-31, characterized in that, Both the first magnetic core and the second magnetic core are provided with grooves adapted to the shape of the winding unit.

34. A method for forming an inductance structure, characterized in that Including: S1. Provide at least one insulating composition as described in any one of claims 1-7, at least one first winding and at least one second winding; S2. Integrate the first winding and the insulating composition, and then press and mold to form an integrated body; press and mold the second winding; S3. Bond the pressed and molded integrated body and the second winding with an organic material to form a winding unit, and the insulating composition of the winding unit is located between the first winding and the second winding; S4. Co-press at least one of the winding units with at least one magnetic core or magnetic core material to form a combined body; S5. Perform high-temperature annealing on the combined body; S6. Immerse the annealed combined body in an organic material; S7. Lead out leads to form an inductance structure, and the inductance structure includes a top surface, a bottom surface, a first side surface and a second side surface opposite to the first side surface.

35. The method for forming an inductance structure as described in claim 34, wherein In the step S4, both the first winding and the second winding of the winding unit include a first end and a second end, and leads are provided at both ends of the first winding and the second winding.

36. The forming method of an inductance structure as described in claim 35, wherein, The leads at both ends of the first winding and the second winding are both located on the bottom surface of the inductance structure; the main bodies of the first winding and the second winding cross each other.

37. The forming method of an inductance structure as described in claim 35, characterized in that, The lead of one end of the first winding is located on the bottom surface of the inductance structure, and the lead of the other end of the first winding is located on the top surface of the inductance structure; the lead of one end of the second winding is located on the top surface of the inductance structure, and the lead of the other end of the second winding is located on the bottom surface of the inductance structure.

38. A method for forming an inductance structure as described in claim 37, characterized in that, The pins at both ends of the first winding and the second winding are all located on the bottom surface of the inductance structure; the main bodies of the first winding, the insulating composition, and the second winding are laminated in sequence.

39. A method for forming an inductance structure as described in claim 38, characterized in that, The pins at the same end of the first winding and the second winding extend away from each other, the pins at both ends of the first winding and the second winding do not cover the insulating composition, and the insulating composition only extends along the bent portion of the first winding.

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