Combined heat dissipation device capable of switching air cooling mode and liquid cooling mode and combined heat dissipation method

Abstract

The invention provides a combined heat dissipation device capable of switching an air cooling mode and a liquid cooling mode and a combined heat dissipation method, and relates to the technical field of chip heat dissipation, the combined heat dissipation device comprises a cold plate heat exchanger and a cooling liquid pump, the cold plate heat exchanger comprises a cold plate and a cooling liquid pump, and the cold plate is provided with a cooling liquid inlet and a cooling liquid outlet; the cooling liquid pump is connected with the cooling liquid outlet through a first liquid conveying pipeline, and an electronic valve is arranged on the first liquid conveying pipeline; the air-cooled heat exchanger comprises a fan blade frame, a fan blade group and a driving motor, the fan blade frame is arranged on the cold plate, the fan blade group and the driving motor are mounted on the fan blade frame, and the driving motor drives the fan blade group to rotate; the temperature controller comprises a controller, an intelligent prediction module and a plurality of temperature sensors, the temperature sensors are arranged on the cold plate at intervals, and the controller is electrically connected with the cooling liquid pump, the electronic valve, the driving motor and the temperature sensors. According to the combined heat dissipation device and method for switching the air cooling mode and the liquid cooling mode, the temperature adjustment range is larger, and the application range is wider.

Description

Technical Field

[0001] The present invention relates to the technical field of chip heat dissipation, and particularly relates to a combined heat dissipation device and a combined heat dissipation method for switching between air cooling and liquid cooling modes. Background Art

[0002] A chip is a core component of electrical, power, control, feedback and other systems, and plays a crucial role in industries such as communication, electricity, energy, and power. Thermal failure is one of the main ways of chip damage and will bring serious consequences. With the improvement of chip integration performance, the chip heating power also increases. Therefore, chip heat dissipation has become one of the key points for improving chip performance.

[0003] In the prior art, the radiators for chips are divided into liquid-cooled radiators and air-cooled radiators. Among them, the air-cooled radiator dissipates heat by the rotation of a fan to let air take away the heat, but its heat dissipation capacity is low. The liquid-cooled radiator dissipates the heat of the device by continuously circulating the cold source to cool down. However, the heat dissipation contact area of the liquid-cooled radiator is limited, and it is unable to effectively transfer a large amount of heat, resulting in low heat dissipation efficiency. How to reasonably design the chip radiator has also become an important part of chip research and development, and some patents have proposed chip heat dissipation structures.

[0004] For example, Patent CN118231361A provides a multi-shunt layer chip air-cooled radiator for solving the problem of low heat dissipation efficiency of fins in the prior art. The radiator includes fins, a substrate, a heat conduction bar, a chip, a chip base, and a radiator bottom plate arranged in sequence from top to bottom. Multiple air ducts are formed between the multiple fins, so that the heat exchange between the fluid and the fins is uniform, improving the heat dissipation efficiency of the fins. However, such radiators use the heat dissipation area of the fins themselves and the airflow generated by the fan to take away heat, and the heat dissipation capacity is low.

[0005] Patent CN118591161A provides a microchannel liquid-cooled radiator, including a fluid inlet, a fluid outlet, and a cold plate body. The liquid working medium enters the microchannel area from the center after passing through a throttling structure, and then is divided into the microchannel partition areas outward. The liquid working medium entering the liquid separation cavity from the throttling structure forms a jet at high speed, enhancing the heat exchange in the central area. However, such microchannel liquid-cooled radiators use liquid circulation to dissipate the heat of electronic devices, and the applicable temperature range is relatively narrow, making it difficult to meet the heat dissipation requirements of servers working in complex temperature environments.

[0006] Patent CN109192711B provides an air-cooled and liquid-cooled combined thermosuperconducting plate radiator, which includes: a thermosuperconducting plate, a sealed channel communicating with each other is formed in the thermosuperconducting plate, a heat transfer working medium is filled in the sealed channel, a liquid-cooled radiator is provided with a liquid inlet and a liquid outlet connected to the liquid channel, heat dissipation fins are located on the surface of the thermosuperconducting plate, and a plurality of parallel heat dissipation channels are formed in the heat dissipation fins. A fan is located at one end of the heat dissipation fins, the air outlet surface of the fan faces the heat dissipation fins and is perpendicular to the extending direction of the heat dissipation channels. The forced heat dissipation method is flexible, the heat dissipation capacity is significantly enhanced, and it has high reliability. However, such radiators have complex structures and are too large in size and are not suitable for microchips.

[0007] In view of this, based on years of production design experience in this field and related fields, the inventor has designed a combined heat dissipation device and a combined heat dissipation method for switching between air-cooled and liquid-cooled methods through repeated tests, in order to solve the problems existing in the prior art. Summary of the Invention

[0008] The purpose of the present invention is to provide a combined heat dissipation device and a combined heat dissipation method for switching between air-cooled and liquid-cooled methods, with a larger temperature adjustment range and a wider application range.

[0009] To achieve the above object, the present invention proposes a combined heat dissipation device for switching between air-cooled and liquid-cooled methods, wherein the combined heat dissipation device includes:

[0010] A cold plate heat exchanger, including a cold plate and a coolant pump, the cold plate is provided with a coolant inlet and a coolant outlet, the coolant pump is connected to the coolant outlet through a first liquid delivery pipeline, and an electronic valve is provided on the first liquid delivery pipeline;

[0011] An air-cooled heat exchanger, including a fan blade frame, a fan blade group and a driving motor, the fan blade frame is arranged on the cold plate, the fan blade group and the driving motor are installed on the fan blade frame, and the driving motor drives the fan blade group to rotate;

[0012] A temperature controller, including a control element, an intelligent prediction module and a plurality of temperature sensors, the plurality of temperature sensors are arranged on the cold plate at intervals, the control element is electrically connected to the coolant pump, the electronic valve, the driving motor and the plurality of temperature sensors respectively; the intelligent prediction module is electrically connected to the control element, and the intelligent prediction module predicts the future temperature rise trend of the cold plate based on the historical temperature data collected by the plurality of temperature sensors, and adjusts the operating states of the coolant pump, the electronic valve and the driving motor in advance to improve the temperature control response speed and reduce the system energy consumption.

[0013] The present invention provides a combined heat dissipation method for switching between air cooling and liquid cooling, and uses the combined heat dissipation device as described above to dissipate heat from the chip. Among them, the combined heat dissipation method includes:

[0014] The cold plate is stacked on one side of the chip, and the temperature of the chip is measured in real time by each temperature sensor and temperature data is obtained;

[0015] The intelligent prediction module predicts the future temperature rise trend of the cold plate based on the historical temperature data collected by multiple temperature sensors, and adjusts the operating states of the coolant pump, electronic valve and drive motor in advance;

[0016] Based on the positions of the temperature sensors, first weight values are respectively assigned to the temperature data obtained by the temperature sensors;

[0017] The control element calculates the weighted average temperature of the chip according to the temperature data and its corresponding first weight value;

[0018] The control element adjusts the operating parameters of the drive motor, electronic valve and coolant pump according to the weighted average temperature.

[0019] Compared with the prior art, the present invention has the following characteristics and advantages:

[0020] For the combined heat dissipation device and heat dissipation method provided by the present invention, temperature data is transmitted to the control element and the intelligent prediction module in real time through multiple temperature sensors. The intelligent prediction module predicts the future temperature rise trend of the cold plate based on the historical temperature data collected by multiple temperature sensors, and adjusts the operating states of the coolant pump, electronic valve and drive motor in advance; at the same time, the control element adjusts the weights according to the actual positions of the temperature sensors and the environmental conditions they are in, and then starts the air-cooled heat exchanger or the cold plate heat exchanger according to the heat generation amount and heat dissipation requirements during the operation of the chip and the server. When the heat dissipation amount of the chip is low, only the air-cooled heat exchanger is turned on, and at the same time the coolant pump is turned off. When the heat dissipation amount of the chip is high, the cold plate heat exchanger is turned on. It has the characteristics of large temperature adjustment range, wide application range, energy saving and high efficiency, and can meet the heat dissipation requirements of variable power electronic devices.

[0021] For the combined heat dissipation device and heat dissipation method provided by the present invention, liquid cooling and air cooling are combined, and the complementarity of the two cooling technologies is utilized to improve the cooling efficiency. And it is flexibly adjusted according to the actual heat dissipation situation of the chip. The combination of liquid cooling and air cooling can be adjusted and optimized in different application scenarios to achieve more efficient thermal management. Description of the Drawings

[0022] The accompanying drawings described herein are for illustrative purposes only and are not intended to limit the scope of the disclosure of the present invention in any way. Additionally, the shapes and proportional dimensions of the various components in the figures are merely schematic and are used to assist in understanding the present invention, rather than specifically defining the shapes and proportional dimensions of the various components of the present invention. Those skilled in the art can, under the teachings of the present invention, select various possible shapes and proportional dimensions according to specific circumstances to implement the present invention.

[0023] Figure 1 It is a schematic structural diagram of the combined heat dissipation device proposed by the present invention;

[0024] Figure 2 It is a schematic structural diagram of the cold plate in the present invention.

[0025] Description of the reference numerals

[0026] 100, combined heat dissipation device; 10, cold plate heat exchanger;

[0027] 11, cold plate; 111, coolant inlet;

[0028] 112, coolant outlet; 113, cold plate frame;

[0029] 114, fin; 12, coolant pump;

[0030] 13, electronic valve; 14, cooler;

[0031] 20, air-cooled heat exchanger; 21, fan blade frame;

[0032] 22, fan blade group; 23, drive motor;

[0033] 30, temperature controller; 31, control element;

[0034] 311, temperature sensor input interface; 312, power input interface;

[0035] 313, coolant pump control interface; 314, drive motor control interface;

[0036] 32, temperature sensor; 33, intelligent prediction module. Specific embodiments

[0037] Combined with the accompanying drawings and the description of the specific embodiments of the present invention, the details of the present invention can be more clearly understood. However, the specific embodiments of the present invention described herein are only for the purpose of explaining the present invention and should not be construed in any way as a limitation of the present invention. Under the teachings of the present invention, those skilled in the art can conceive of any possible variations based on the present invention, and these should all be regarded as belonging to the scope of the present invention.

[0038] Unless otherwise indicated by a separately defined direction, the up, down, left, right and other directions involved in this article are based on the up, down, left, right and other directions shown in the present invention, which is hereby explained together. Figure 1 The up, down, left, right and other directions in it shall prevail, and this is hereby explained together.

[0039] As Figure 1 , Figure 2 shown, the present invention provides a combined heat dissipation device 100, which includes a cold plate heat exchanger 10, an air-cooled heat exchanger 20 and a temperature controller 30. The cold plate heat exchanger 10 includes a cold plate 11 and a coolant pump 12. The cold plate 11 is provided with a coolant inlet 111 and a coolant outlet 112. The coolant pump 12 is connected to the coolant outlet 111 through a first liquid delivery pipeline, and an electronic valve 13 is arranged on the first liquid cooling pipeline; the air-cooled heat exchanger 20 includes a fan blade frame 21, a fan blade group 22 and a driving motor 23. The fan blade frame 21 is arranged on the cold plate 11, and the fan blade group 22 and the driving motor 23 are installed on the fan blade frame 21. The driving motor 23 drives the fan blade group 22 to rotate; the temperature controller 30 includes a control element 31, a plurality of temperature sensors 32 and an intelligent prediction module 33. The plurality of temperature sensors 32 are arranged on the cold plate 11 at intervals. The control element 31 is electrically connected to the intelligent prediction module 33, the coolant pump 12, the electronic valve 13, the driving motor 23 and the plurality of temperature sensors 32 respectively.

[0040] For the combined heat dissipation device 100 proposed by the present invention, the plurality of temperature sensors 32 arranged on the cold plate 11 transmit temperature data to the control element 31 and the intelligent prediction module 33 in real time. The control element 31 controls the coolant pump 12, the electronic valve 13 and the driving motor 23 according to the temperature data obtained in real time, so that the combined heat dissipation device 100 can switch between liquid cooling mode and air cooling mode according to the actual environment, and improve the temperature adjustment range of the combined heat dissipation device 100;

[0041] At the same time, the intelligent prediction module 33 predicts the future temperature rise trend of the cold plate based on the historical temperature data collected by the plurality of temperature sensors 32, and adjusts the operating states of the coolant pump 12, the electronic valve 13 and the driving motor 23 in advance, meeting the requirements of heat dissipation for chips and servers working in a complex temperature environment, ensuring that the combined heat dissipation device 100 works efficiently, stably and safely and prolonging its service life.

[0042] The present invention also provides a combined heat dissipation method, which uses the combined heat dissipation device 100 as described above to dissipate heat from a chip (not shown in the figure). The combined heat dissipation method includes:

[0043] The cold plate 11 is stacked on one side of the chip, and the temperature of the chip is measured in real time by each temperature sensor 32 and the corresponding temperature data is obtained;

[0044] The intelligent prediction module 33 predicts the future temperature rise trend of the cold plate based on the historical temperature data collected by multiple temperature sensors 32, and adjusts the operating states of the coolant pump 12, the electronic valve 13, and the drive motor 23 in advance; assigns first weight values to the temperature data obtained by each temperature sensor 32 based on the positions of the temperature sensors 32;

[0045] The control element 31 calculates the weighted average temperature T of the chip in real time according to each temperature data and its corresponding first weight value;

[0046] The control element 31 adjusts the operating parameters of the drive motor 23, the electronic valve 13, and the coolant pump 12 according to the weighted average temperature T.

[0047] For the combined heat dissipation method proposed by the present invention, the control element 31 adjusts the weights according to the actual positions of the temperature sensors 32, performs weighted average processing on each temperature data to obtain the weighted average temperature T, and then adjusts the operating parameters of the drive motor 23, the electronic valve 13, and the coolant pump 12 according to the weighted average temperature T, realizing real-time and rapid switching between the liquid cooling mode and the air cooling mode, so as to better cope with factors such as the complexity of the chip operating environment and the change of equipment load, avoid the error caused by simple arithmetic average, and help the cooling system to be adjusted and optimized more precisely.

[0048] For the combined heat dissipation method proposed by the present invention, the control element 31 adjusts the weights according to the actual positions of the temperature sensors 32, dynamically adjusts the weights of each temperature sensor 32 by means of weighted average, thereby improving the accuracy of temperature data, and then adjusts the operating parameters of the drive motor 23, the electronic valve 13, and the coolant pump 12 based on the weighted average temperature, so that the combined heat dissipation device 100 can better cope with factors such as environmental complexity and equipment load change, avoid the error caused by the different positions of the temperature sensors 32, and help the combined heat dissipation device 100 to be adjusted and optimized more precisely.

[0049] In an optional example of the present invention, the intelligent prediction module 33 predicts the future temperature rise trend of the cold plate based on the historical temperature data collected by multiple temperature sensors 32, including: the intelligent prediction module 33 caches the temperature data in the recent period of time, calculates the temperature change amount ∆T of this period of time ∆t (i.e., the temperature change time), calculates the temperature change rate from the temperature change amount ∆T and the temperature change time ∆t, and judges whether there is a continuous temperature rise trend according to the temperature change rate. If the temperature change rate increases continuously for multiple times, it is judged that the temperature rise trend is established.

[0050] Further, when the intelligent prediction module 33 judges that the temperature rise trend is established, it adjusts the operating states of the coolant pump 12, the electronic valve 13, and the drive motor 23 in advance.

[0051] In an optional embodiment of the present invention, the cold plate 11 includes a cold plate frame 113 and a plurality of fins 114. The cold plate frame 113 includes two cross beams and two longitudinal beams. The two cross beams are arranged in parallel and spaced apart. The two longitudinal beams are respectively arranged at both ends of the cross beams, and the two ends of each longitudinal beam are respectively fixedly connected to the two cross beams. The two cross beams and the two longitudinal beams enclose a hollow section. The plurality of fins 114 are arranged in the hollow section, and the two ends of each fin 114 are respectively fixedly connected to the two cross beams. With the above structure, the cold plate frame 113 plays the role of connecting the chip and supporting the fins 114, so that the fins 114 can be stably installed on the chip to better cool the chip.

[0052] In an optional example of this embodiment, the fan blade frame 21 is fixedly connected to the cold plate frame 113, and the fan blade group 22 is aligned with the hollow area. With the above structure, after the fan blade group 22 is started, the chip can be cooled through the hollow area, and at the same time, each fin 114 can be quickly cooled, thereby improving the cooling effect on the chip.

[0053] In an optional example, a first cooling channel is provided in the cold plate frame 113, and the two ends of the first cooling channel are respectively a coolant inlet 111 and a coolant outlet 112, and a second cooling channel is provided in each fin 114, and the two ends of each second cooling channel are respectively connected to the first cooling channel. In the above structure, liquid channels are provided in each cross beam and longitudinal beam, and the liquid channels are connected end to end to form the first cooling channel; the two ends of the fin 114 are respectively fixedly connected to the two cross beams, and the two ends of the second cooling channel in the fin 114 are respectively connected to the liquid channel in the cross beam. After the coolant enters the first cooling channel from the coolant inlet 111, it is divided into multiple second cooling channels, and finally flows out through the coolant outlet 112.

[0054] In an optional example, the fins 114 are in the shape of long strips, and the fins 114 are arranged in parallel and at intervals.

[0055] In an optional embodiment of this embodiment, the cold plate frame 113 and the fins 114 are respectively made of thermally conductive materials.

[0056] In an optional example of this embodiment, the cold plate frame 113 is made of phase change material or liquid-cooled metal material, which can further optimize the cooling performance and improve the heat exchange efficiency.

[0057] Preferably, the phase change material can be paraffin waxes (such as n-dodecane, n-hexadecane), metal salts (such as hydrated salts), or composite phase change materials to utilize their characteristics of absorbing and releasing a large amount of heat energy during the phase change process, thereby balancing temperature fluctuations and improving thermal management efficiency. The liquid-cooled metal material can be high thermal conductivity aluminum alloy (such as 6061 aluminum alloy), copper alloy (such as C1100 pure copper), or liquid metal (such as gallium-based alloy) to utilize their excellent heat conduction performance, enhance the cooling capacity and reduce the thermal resistance.

[0058] In an alternative example, the cold plate frame 113 does not need to entirely use the phase change material or the liquid-cooled material, and the phase change material or the liquid-cooled material is only applied to the coolant flow channel or the heat conduction area.

[0059] In an alternative embodiment of the present invention, the cold plate heat exchanger 10 further includes a cooler 14 and a liquid storage tank (not shown in the figure). The outlet of the liquid storage tank is connected to the coolant inlet 111 through a second liquid delivery pipeline, the cooler 14 is connected in series on the second liquid delivery pipeline, and the inlet of the liquid storage tank is connected to the coolant pump 12 through a third liquid delivery pipeline. With the above structure, the liquid storage tank is used to store the coolant. The coolant enters the cooler 14 from the outlet of the liquid storage tank for cooling, and the cooled coolant enters the cold plate 11 and exchanges heat with the chip in the cold plate 11.

[0060] In the present invention, the first weight value corresponding to the temperature data measured by each temperature sensor 32 is dynamically set according to the position change of the temperature sensor 32 to improve the accuracy of the temperature data.

[0061] In an alternative embodiment of the present invention, the chip has a high function consumption area and a low function consumption area. The first weight value corresponding to the temperature sensor 32 measuring the high function consumption area is 0.3 - 0.5, and the first weight value corresponding to the temperature sensor 32 monitoring the low function consumption area is 0.1 - 0.3.

[0062] The high function consumption area of the chip generally refers to the part responsible for the core computing tasks in the chip, and the low function consumption area generally refers to the part responsible for the basic functions. The heat dissipation of the chip is usually uneven, and the temperature of the high function consumption area is usually higher. Therefore, a higher weight needs to be assigned to the temperature data of the high function consumption area; while the temperature sensor 32 in the low function consumption area may measure a lower temperature, so generally a lower weight is assigned to the temperature data of the low function consumption area.

[0063] In an alternative example of the present invention, four temperature sensors 32 are provided on the cold plate frame 113. The four temperature sensors 32 are respectively arranged at the four corners of the cold plate frame 113. The temperature data measured by the four temperature sensors 32 are T1, T2, T3, and T4 respectively, and the first weight values of the corresponding four temperature sensors 32 are W1, W2, W3, and W4 respectively. Then the calculation formula for the weighted average temperature T of the chip is:

[0064] ;

[0065] Thus, the weighted average temperature T is calculated from the temperature data weighted by the first weight value, and can more accurately represent the overall ambient or chip temperature value.

[0066] In this embodiment, the four temperature sensors 32 are arranged at the four corners of the cold plate frame 113, which can effectively reflect the temperature distribution and heat dissipation effect of the entire cold plate 11. Moreover, since the four corners are located at relatively marginal positions, it can also avoid the situation where the temperature data is inaccurately collected when the surface temperature distribution of the cold plate 11 is uneven, and prevent the control element 31 from issuing incorrect instructions. The four temperature sensors 32 arranged at the four corners of the cold plate frame 113 can also balance the temperature monitoring of the entire cold plate area and avoid the over-concentration and repeated measurement of the temperature sensors 32, ensuring the heat dissipation efficiency of the cold plate 11. In addition, arranging the temperature sensors 32 at the four corners of the cold plate frame 113 facilitates the installation of the temperature sensors 32 and the subsequent maintenance of the temperature sensors 32.

[0067] It should be noted that there is no special requirement for the position setting of the temperature sensors 32, as long as it is not affected by the uneven temperature distribution of the cold plate 11. The temperature sensors 32 can be adjusted according to different situations of the chip. The position of the temperature sensors can be adjusted according to several factors such as the heat source position (the high-function area of the chip), the cooling design (the specific positions of the first cooling channel and the second cooling channel in the cold plate 11), and the balanced distribution (ensuring that the four temperature sensors 32 can cover the entire cold plate 11 as evenly as possible to avoid neglecting local overheating areas).

[0068] In the present invention, by providing multiple temperature sensors 32, it can be ensured that even if one or more of the temperature sensors 32 fail, the other temperature sensors 32 can still provide effective temperature data, avoiding the failure of the entire system caused by the failure of a single temperature sensor 32, and enhancing the fault tolerance and safety of the system.

[0069] In an alternative embodiment of the present invention, the control element 31 includes a temperature sensor input interface 311, a power input interface 312, a coolant pump control interface 313, an electronic valve control interface, and a drive motor control interface 314.

[0070] In an alternative embodiment of the present invention, the control element 31 adjusts the operating parameters of the drive motor 23, the electronic valve 13, and the coolant pump 12 according to the weighted average temperature, including:

[0071] Set the upper limit temperature for air cooling operation and the upper limit temperature for liquid cooling operation, and make the upper limit temperature for liquid cooling operation higher than the upper limit temperature for air cooling operation;

[0072] When the weighted average temperature T is lower than the upper limit temperature for air cooling operation, the control element 31 controls the electronic valve 13 and the coolant pump 12 to close and the drive motor 23 to start;

[0073] When the weighted average temperature T is higher than the upper limit temperature for air cooling operation and lower than the upper limit temperature for liquid cooling operation, the control element 31 controls the electronic valve 13 and the coolant pump 12 to open and the drive motor 23 to close;

[0074] When the weighted average temperature is higher than the upper limit temperature for liquid cooling operation, the control element 31 controls the electronic valve 13, the coolant pump 12, and the drive motor 23 to start.

[0075] Specifically, when the weighted average temperature T is lower than the upper limit temperature for air cooling operation or the load is light, the control element 31 controls the electronic valve 13 to close and simultaneously starts the drive motor 23 through the fan control interface. The drive motor 23 drives the fan blade group 22 to rotate, accelerating the heat dissipation of the heat transferred to the fin 114, realizing air cooling. When the weighted average temperature T is higher than the upper limit temperature for air cooling operation and lower than the upper limit temperature for liquid cooling operation, or the load is high, the control element 31 starts the coolant pump 12 through the coolant pump control interface and simultaneously opens the electronic valve 13, enabling the coolant in the cooler 14 to flow in the cold plate 11, dissipating the heat transferred to the fin 114, realizing liquid cooling. When the weighted average temperature T is higher than the upper limit temperature for air cooling operation and the upper limit temperature for liquid cooling operation, or the load is too high, and the separate operation of the air-cooled heat exchanger 20 or the cold plate heat exchanger 10 cannot meet the heat dissipation requirements, the control element 31 controls the electronic valve 13 to open and starts the air-cooled heat exchanger 20 through the drive motor 23 control interface, realizing the combined operation of air cooling and liquid cooling.

[0076] In an alternative embodiment of the present invention, monitor the fluctuations of each temperature data and assign a second weight value to each temperature data based on the fluctuations; the control element 31 corrects the weighted average temperature T based on each second weight value.

[0077] Specifically, the degree of fluctuation of the temperature data measured by each temperature sensor 32 can be reflected by measuring the temperature differences at several recent time points:

[0078] ;

[0079] The calculation formula for the second weight value is as follows:

[0080] ;

[0081] where k is the adjustment coefficient, taking 0.1; w adj,i is the second weight value; w i is the first weight value.

[0082] Based on the calculated second weight value w adj,i , the weighted average temperature is re-corrected:

[0083] ;

[0084] In the formula, T avg is the corrected weighted average temperature; T1, T2, T3, and T4 are the temperature data measured by 4 temperature sensors respectively; w adj,1 , w adj,2 , w adj,3 , and w adj,4 are the second weight values corresponding to the 4 temperature sensors respectively.

[0085] By introducing the second weight value based on temperature fluctuations, the influence degree of each sensor in the calculation of the weighted average temperature can be dynamically adjusted, the accuracy of temperature calculation can be improved, and it is ensured that the system can better cope with a data environment with large fluctuations.

[0086] In an alternative embodiment of the present invention, the control element 31 adjusts the operating parameters of the drive motor 23, the electronic valve 13, and the coolant pump 12 according to the corrected weighted average temperature, including:

[0087] Set the upper limit temperature for air cooling and the upper limit temperature for liquid cooling, and make the upper limit temperature for liquid cooling higher than the upper limit temperature for air cooling;

[0088] When the corrected weighted average temperature T avg is lower than the upper limit temperature for air cooling, the control element 31 controls the electronic valve 13 and the coolant pump 12 to close and the drive motor 23 to start;

[0089] When the corrected weighted average temperature T avg is higher than the upper limit temperature for air cooling and lower than the upper limit temperature for liquid cooling, the control element 31 controls the electronic valve 13 and the coolant pump 12 to open and the drive motor 23 to close;

[0090] When the corrected weighted average temperature T avg is higher than the upper limit temperature for liquid cooling, the control element 31 controls the electronic valve 13, the coolant pump 12, and the drive motor 23 to start.

[0091] Specifically, when the corrected weighted average temperature T avg is lower than the upper limit temperature of air cooling operation or the load is relatively light, the control element 31 controls the electronic valve 13 to close, and at the same time starts the drive motor 23 through the fan control interface. The drive motor 23 drives the fan blade group 22 to rotate, accelerating the heat dissipation of the heat transferred to the fin 114, and realizing air cooling. When the corrected weighted average temperature T avg is higher than the upper limit temperature of air cooling operation and lower than the upper limit temperature of liquid cooling operation, or the load is relatively high, the control element 31 starts the coolant pump 12 through the coolant pump control interface, and at the same time opens the electronic valve 13, so that the coolant in the cooler 14 flows in the cold plate 11, dissipating the heat transferred to the fin 114, and realizing liquid cooling. When the corrected weighted average temperature T avg is higher than the upper limit temperatures of both air cooling operation and liquid cooling operation, or the load is too high, and the single operation of the air-cooled heat exchanger 20 or the cold plate heat exchanger 10 cannot meet the heat dissipation requirements, the control element 31 controls the electronic valve 13 to open, and starts the air-cooled heat exchanger 20 through the drive motor 23 control interface, realizing the combined operation of air cooling and liquid cooling.

[0092] For the combined heat dissipation device 100 and heat dissipation method proposed by the present invention, multiple temperature sensors 32 transmit temperature data to the control element 31 and the intelligent prediction module 33 in real time. The intelligent prediction module 33 caches the temperature data of the most recent period based on the historical temperature data collected by the multiple temperature sensors 32, calculates the temperature change rate from the temperature change amount ∆T and the temperature change time ∆t, and determines whether there is a continuous temperature rising trend. If the temperature change rate increases continuously for multiple times, it is determined that the temperature rising trend is established. At this time, the operating states of the coolant pump 12, the electronic valve 13 and the drive motor 23 are adjusted in advance. At the same time, the control element 31 adjusts the weights according to the actual positions of the temperature sensors 32 and their environmental conditions, and then starts the air-cooled heat exchanger 20 or the cold plate heat exchanger 10 according to the heat generation amount and heat dissipation requirements during the operation of the chip and the server. When the heat dissipation of the chip is relatively low, only the air-cooled heat exchanger 20 is turned on, and the coolant pump 12 is turned off at the same time. When the heat dissipation of the chip is relatively high, the cold plate heat exchanger 10 is turned on. It has the characteristics of large temperature adjustment range, wide application range, energy saving and high efficiency, and can meet the heat dissipation requirements of variable power electronic devices.

[0093] For the combined heat dissipation device 100 and heat dissipation method proposed by the present invention, air cooling and liquid cooling are combined, and the complementary nature of the two cooling technologies is utilized to improve the cooling efficiency. And the combined heat dissipation device 100 and heat dissipation method are flexibly adjusted according to the actual heat dissipation situation of the chip. The combination of liquid cooling and air cooling can be adjusted and optimized in different application scenarios to achieve more efficient thermal management.

[0094] The detailed explanations of the above embodiments are only for the purpose of explaining the present invention so as to better understand the present invention. However, these descriptions cannot be construed as a limitation of the present invention for any reason. In particular, the various features described in different embodiments can be arbitrarily combined with each other to form other embodiments. Unless there is a clear contrary description, these features should be understood to be applicable to any one of the embodiments and not limited to the described embodiments only.

Claims

1. A combined heat dissipation device for switching between air cooling and liquid cooling modes, characterized in that The combined heat dissipation device comprises: A cold plate heat exchanger, comprising a cold plate and a coolant pump, wherein the cold plate is provided with a coolant inlet and a coolant outlet, the coolant pump is connected to the coolant outlet via a first infusion pipeline, and an electronic valve is provided on the first infusion pipeline; The air-cooled heat exchanger comprises a fan blade frame, a fan blade group and a driving motor, wherein the fan blade frame is arranged on the cold plate, the fan blade group and the driving motor are mounted on the fan blade frame, and the driving motor drives the fan blade group to rotate; The temperature controller includes a control element, an intelligent prediction module and multiple temperature sensors, wherein the multiple temperature sensors are arranged on the cold plate at intervals, and the control element is electrically connected to the coolant pump, the electronic valve, the drive motor and the multiple temperature sensors respectively; the intelligent prediction module is electrically connected to the control element, and the intelligent prediction module predicts the future temperature rise trend of the cold plate based on the historical temperature data collected by the multiple temperature sensors, and adjusts the operating status of the coolant pump, the electronic valve and the drive motor in advance to improve the temperature control response speed and reduce the system energy consumption.

2. The combined heat dissipation device for switching between air cooling and liquid cooling modes according to claim 1, wherein The cold plate includes a cold plate frame and a plurality of fins. The cold plate frame includes two cross beams and two longitudinal beams. The two cross beams are arranged in parallel and spaced apart. Two ends of each longitudinal beam are respectively fixedly connected to the two cross beams. The two cross beams and the two longitudinal beams enclose a hollow section. The plurality of fins are arranged in the hollow section. Two ends of each fin are respectively fixedly connected to the two cross beams.

3. The combined heat dissipation device for switching between air cooling and liquid cooling modes according to claim 2, wherein, The fan blade frame is fixedly connected to the cold plate frame, and the fan blade group is aligned with the hollow section.

4. The combined heat dissipation device for switching between air cooling and liquid cooling modes according to claim 2, wherein A first cooling channel is provided in the cold plate frame, a second cooling channel is provided in each of the fins, and each of the second cooling channels is connected to the first cooling channel.

5. The combined heat dissipation device for switching between air cooling and liquid cooling modes according to claim 2, wherein, The cold plate frame and the fins are respectively made of heat conductive materials.

6. The combined heat dissipation device for switching between air cooling and liquid cooling modes according to claim 1, wherein The cold plate heat exchanger also includes a heat exchanger and a liquid storage tank, the outlet of the liquid storage tank is connected to the coolant inlet through a second infusion pipeline, the heat exchanger is connected in series to the second infusion pipeline, and the inlet of the liquid storage tank is connected to the coolant pump through a third infusion pipeline.

7. A combined heat dissipation method for switching between air cooling and liquid cooling modes, which uses the combined heat dissipation device as described in any one of claims 1 to 6 to dissipate heat from the chip, characterized in that, The combined heat dissipation method comprises: A cold plate is stacked on one side of the chip, and the temperature of the chip is measured in real time through each temperature sensor to obtain temperature data; The intelligent prediction module predicts the future temperature rise trend of the cold plate based on the historical temperature data collected by the plurality of temperature sensors, and adjusts the operating status of the coolant pump, the electronic valve and the drive motor in advance; assigning a first weight value to the temperature data acquired by each temperature sensor based on the position of each temperature sensor; The control element calculates the weighted average temperature of the chip according to the temperature data and the first weight value corresponding thereto; The control element adjusts the operating parameters of the drive motor, the electronic valve and the coolant pump according to the weighted average temperature.

8. The combined heat dissipation method for switching between air cooling and liquid cooling modes according to claim 7, characterized in that, The chip has a high functional consumption area and a low functional consumption area. The first weight value of the temperature sensor monitoring the high functional consumption area is 0.3 to 0.5, and the first weight value of the temperature sensor monitoring the low functional consumption area is 0.1 to 0.

3.

9. The combined heat dissipation method for switching between air cooling and liquid cooling modes according to claim 7, characterized in that, The control element adjusts the operating parameters of the drive motor, the electronic valve, and the coolant pump according to the weighted average temperature, including: Setting the upper limit temperature for air cooling operation and the upper limit temperature for liquid cooling operation, When the weighted average temperature is lower than the upper limit temperature for air cooling operation, the control element controls the electronic valve and the coolant pump to close and controls the drive motor to start; When the weighted average temperature is higher than the upper limit temperature for air cooling operation and lower than the upper limit temperature for liquid cooling operation, the control element controls the electronic valve and the coolant pump to open and controls the drive motor to close; When the weighted average temperature is higher than the upper limit temperature for liquid cooling operation, the control element controls the electronic valve, the coolant pump, and the drive motor to open.

10. The combined heat dissipation method for switching between air cooling and liquid cooling according to claim 7, characterized in that, Monitoring the fluctuations of each of the temperature data and respectively assigning second weight values to each of the temperature data based on the fluctuations; the control element corrects the weighted average temperature based on each of the second weights.

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