Packaging base, composition board and electronic device

Abstract

The invention relates to the technical field of electronic packaging, and discloses a packaging base, a composition board and an electronic device.The packaging base comprises an insulating substrate, a main body part and a frame body which are arranged in the first direction, the end, away from the frame body, of the main body part is provided with a first end face, and the first end, away from the main body part, of the frame body is provided with a second end face; the main body part and the peripheral side of the frame body are provided with connected outer side surfaces, and an accommodating cavity is defined between the frame body and the main body part; the ring surface metal layer is arranged on the second end surface and surrounds the accommodating cavity; a plurality of external connection terminals; an electrode pad; a conductive wiring; wiring for ring surface interconnection; the pads are interconnected by wiring. The method has the advantages that a through hole conductor does not need to be arranged in the frame body, the frame body is prevented from cracking, the method can be suitable for preparing the packaging base through a single packaging insulating film layer, the size of the packaging base is further reduced, the electroplating wiring structure is simplified, and the coating uniformity is kept when the size of the packaging base is small.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic packaging, and particularly to a packaging base, a combined board and an electronic device. Background Art

[0002] The packaging base is usually used for packaging electronic components such as quartz crystals and semiconductor chips. The packaged components (such as semiconductor devices, temperature-compensated crystal oscillators TCXO, tuning fork resonators, thermosensitive resonators, automotive components, ordinary oscillators OSC, voltage-controlled crystal oscillators VCXO, etc.) are widely used in various electronic devices. A common packaging base is composed of an insulating substrate and a conductive pattern provided on the insulating substrate. The insulating substrate includes a main body portion and a frame body. The main body portion and the frame body together define a receiving cavity for placing electronic components. After the electronic components are placed in the receiving cavity, a cover plate is sealed over the opening of the receiving cavity by a soldering method to achieve the packaging of the electronic components.

[0003] The preparation of the packaging base is usually carried out on a large-sized insulating substrate to obtain a combined board of packaging bases arranged in a plurality, and the conductive patterns on adjacent two packaging bases are connected through the electroplating wiring on the combined board of packaging bases to achieve electroplating of all the packaging bases. After electroplating is completed, the combined board can be divided into individual packaging bases by using a preset dividing groove.

[0004] Traditional electroplating wiring schemes require printing electroplating wiring on multiple insulating film layers and then laminating the multiple insulating film layers to prepare the required packaging base, and use through-hole conductors provided in the frame body to achieve the conduction between the toroidal metal layer on the upper surface of the frame body and other electroplating wiring in the base. As the volume of electronic devices becomes more and more miniaturized, the packaging base also needs to develop towards miniaturization and thinness to meet the application requirements. However, in a miniaturized and thin packaging base, due to the reduction of the overall volume of the packaging base, the mechanical strength at the frame body decreases. If the traditional electroplating wiring scheme is adopted, the thermal expansion difference between the through-hole conductors in the frame body and the insulator inside the frame body will cause thermal stress cracking of the frame body; secondly, traditional electroplating wiring requires the packaging base to be composed of multiple laminated insulating film layers and cannot be applied to the case of preparing a packaging base with a single insulating film layer, which limits the further reduction of the size of the packaging base; at the same time, due to the complex circuit, the traditional electroplating wiring scheme is likely to cause poor plating uniformity when applied to a packaging base with a small volume (miniaturized and thin). Summary of the Invention

[0005] The object of the present invention is to provide a packaging base, a combined board and an electronic device, which do not require through-hole conductors to be provided in the frame, avoid cracking of the frame, are applicable to preparing a packaging base with a single insulating film layer, further reduce the size of the packaging base, simplify the electroplating wiring structure, and maintain the plating uniformity when the volume of the packaging base is small.

[0006] To achieve the above object, the present invention provides a packaging base, including

[0007] An insulating substrate, including a main body portion and a frame provided in a first direction, a first end face is provided at one end of the main body portion away from the frame, a second end face is provided at a first end of the frame away from the main body portion, an outer side face connecting the main body portion and the frame is provided on the periphery, the outer side face is provided between the first end face and the second end face, and an accommodation cavity is formed by the frame and the main body portion surrounding together;

[0008] A toroidal metal layer, provided on the second end face and arranged around the accommodation cavity;

[0009] A plurality of external connection terminals, provided on the first end face;

[0010] An electrode pad, provided in the accommodation cavity and capable of being connected to one of the external connection terminals through a through-hole conductor;

[0011] A conductive wiring, one end of which is located in the frame and connected to the toroidal metal layer, and the other end extends to the main body portion and is connected to another external terminal;

[0012] A toroidal interconnection wiring, provided in the frame, and one end thereof is connected to the toroidal metal layer, and the other end extends to the outer side face and is exposed to form a first exposed portion;

[0013] A pad interconnection wiring, located in the insulating substrate, one end of which extends in the main body portion and is connected to the electrode pad, and the other end extends in the frame and is exposed on the outer side face to form a second exposed portion.

[0014] Furthermore, one end of the toroidal interconnection wiring connected to the toroidal metal layer is connected to one end of the conductive wiring connected to the toroidal metal layer.

[0015] Furthermore, the first end face is connected to one end of the outer side face through a dividing inclined plane, and the second end face is connected to the other end of the outer side face through a dividing inclined plane;

[0016] The first exposed portion and / or the second exposed portion are / is arranged away from the dividing inclined plane.

[0017] Furthermore, the insulating substrate includes a first corner region and a third corner region that are diagonally arranged, and a second corner region and a fourth corner region that are diagonally arranged. There is an edge region between adjacent corner regions.

[0018] Furthermore, wiring for pad interconnection is provided in both the second corner region and the fourth corner region.

[0019] Furthermore, wiring for toroidal surface interconnection is provided in both the first corner region and the third corner region.

[0020] Furthermore, the conductive wiring is provided in the first corner region and / or the third corner region.

[0021] Furthermore, the electrode pad includes a first pad and a second pad, and the first pad and the second pad are diagonally arranged in the accommodation cavity.

[0022] The present invention also provides a package base combined board, which is formed by arranging the above-mentioned package bases. The insulating substrate has a first corner region and a third corner region that are diagonally arranged, and a second corner region and a fourth corner region that are diagonally arranged; there is an edge region between adjacent corner regions;

[0023] The wiring for toroidal surface interconnection and the wiring for pad interconnection are provided on the edge region. There is the wiring for toroidal surface interconnection for mutual electrical connection between the package bases adjacent to opposite sides, and there is the wiring for pad interconnection for mutual electrical connection between the package bases adjacent to opposite sides;

[0024] Or,

[0025] The wiring for toroidal surface interconnection is provided in the edge region, and the wiring for pad interconnection is respectively provided in the second corner region and the third corner region;

[0026] There is the wiring for toroidal surface interconnection for mutual electrical connection between the package bases adjacent to opposite sides, and there is the wiring for pad interconnection for mutual electrical connection between the package bases adjacent to opposite sides;

[0027] Or,

[0028] The wiring for toroidal surface interconnection is provided in both the first corner region and the third corner region, and the wiring for pad interconnection is provided in both the second corner region and the fourth corner region;

[0029] There is the wiring for toroidal surface interconnection for mutual electrical connection between the package bases adjacent to opposite corners, and there is the wiring for pad interconnection for mutual electrical connection between the package bases adjacent to opposite corners.

[0030] The present invention also provides an electronic device, which includes the encapsulation base described in any one of the above, an electronic component disposed in the accommodation cavity, and a cover plate for sealing the accommodation cavity.

[0031] Compared with the prior art, an encapsulation base, a combined plate and an electronic device according to an embodiment of the present invention have the following beneficial effects: There are conductive wirings, wirings for toroidal interconnection and pad interconnection wirings. One end of the conductive wiring is located inside the frame and connected to the toroidal metal layer, and the other end extends to the main body part and is connected to another external terminal; the wiring for toroidal interconnection is disposed inside the frame, and one end is connected to the toroidal metal layer, and the other end extends to the outer side surface and is exposed to form a first exposed part; the pad interconnection wiring is located inside the insulating substrate, one end extends inside the main body part and is connected to the electrode pad, and the other end extends inside the frame to the outer side surface and is exposed to form a second exposed part. By providing the first exposed part and the second exposed part, an electroplating conduction line is formed in a plurality of combined plates arranged by the encapsulation base, and electroplating conduction connection can be realized between adjacent encapsulation bases. At the same time, electroplating conduction connection can also be realized between different conductive layers inside a single encapsulation base. And, by providing conductive wirings instead of through-hole conductors in the frame, cracking of the frame due to thermal expansion differences is avoided, and the structural stability of the encapsulation base is improved. In addition, the electroplating wiring circuit is simplified, and when applied to a relatively small encapsulation base, the uniformity of the plating layer can be ensured, and it can also be applicable to the case of preparing an encapsulation base with a single insulating film layer, and the versatility is good. Description of the Drawings

[0032] Figure 1 is a perspective view of the encapsulation base according to an embodiment of the present invention;

[0033] Figure 2 is a structural schematic diagram of the encapsulation base according to an embodiment of the present invention;

[0034] Figure 3 is a perspective view of the encapsulation base from a top-down perspective according to an embodiment of the present invention;

[0035] Figure 4 is Figure 3 a cross-sectional view taken along line B-B in

[0036] Figure 5 is Figure 3 a cross-sectional view taken along line C-C in

[0037] Figure 6 is Figure 3 a cross-sectional view taken along line D-D in

[0038] Figure 7 is a top view of the encapsulation base according to an embodiment of the present invention;

[0039] Figure 8 is a schematic diagram of the encapsulation base according to an embodiment of the present invention without including the insulating substrate;

[0040] Figure 9 It is a schematic diagram of a partial structure of the encapsulation base composite board according to an embodiment of the present invention;

[0041] Figure 10 It is a schematic diagram of the encapsulation base composite board according to an embodiment of the present invention without including an insulating substrate;

[0042] Figure 11 It is a schematic diagram of the encapsulation base composite board according to an embodiment of the present invention without including an insulating substrate and an annular metal layer;

[0043] Figure 12 It is a partial top perspective view of the encapsulation base composite board according to an embodiment of the present invention;

[0044] Figure 13 It is Figure 12 A cross-sectional view taken along line E-E in

[0045] Figure 14 It is Figure 12 A cross-sectional view taken along line F-F in

[0046] Figure 15 It is Figure 12 A cross-sectional view taken along line G-G in

[0047] In the figure: 1. Insulating substrate; 100. Outer side surface; 101. Accommodating cavity; 102. Dividing inclined surface; 103. First corner region; 104. Second corner region; 105. Third corner region; 106. Fourth corner region; 107. Edge region; 11. Main body portion; 12. Frame body; 111. First end face; 121. Second end face; 2. Annular metal layer; 3. External connection terminal; 4. Electrode pad; 41. First pad; 42. Second pad; 5. Through-hole conductor; 6. Conductive wiring; 7. Wiring for annular interconnection; 71. First exposed portion; 8. Wiring for pad interconnection; 81. Second exposed portion; 9. Wiring for terminal interconnection; X. First direction; Y. Second direction; Z. Third direction; K. Dividing groove. Detailed implementation manners

[0048] The following will further describe in detail the specific implementation manners of the present invention in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present invention, but are not used to limit the scope of the present invention.

[0049] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "inner", "outer", etc. in the present invention is based on the positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device and element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0050] In the description of the present invention, it should be understood that the terms "first", "second", etc. are used in the present invention to describe various information, but this information should not be limited to these terms, and these terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, the "first" information may also be referred to as the "second" information, and similarly, the "second" information may also be referred to as the "first" information.

[0051] As Figures 1 to 15 shown, a packaging base of a preferred embodiment of the present invention includes an insulating substrate 1, a toroidal metal layer 2, a plurality of external connection terminals 3, electrode pads 4, conductive wirings 6, toroidal interconnection wirings 7, and pad interconnection wirings 8. For the convenience of description, refer to Figure 1 , define the height direction of the packaging base as the first direction X, the length direction as the second direction Y, and the width direction as the third direction Z. Specifically, refer to Figure 1 , Figure 4 , Figure 5 , Figure 6 , the insulating substrate 1 includes a main body portion 11 and a frame body 12 provided in the first direction X. Among them, a first end face 111 is provided at one end of the main body portion 11 away from the frame body 12, a second end face 121 is provided at the first end of the frame body 12 away from the main body portion 11, an outer side face 100 connected to the periphery of the main body portion 11 and the frame body 12 is provided, the outer side face 100 is provided between the first end face 111 and the second end face 121, and the frame body 12 and the main body portion 11 jointly enclose a receiving cavity 101 for placing electronic components. The toroidal metal layer 2 is provided on the second end face 121 and surrounds the receiving cavity 101. The plurality of external connection terminals 3 are provided on the first end face 111 and can be connected to external electronic components. The electrode pads 4 are provided in the receiving cavity 101 and can be connected to an external connection terminal 3 through a via conductor 5, so as to realize the electrical connection between the internal electronic components of the packaging base and the external electronic components.

[0052] In order to achieve electrical connection between the toroidal metal layer 2 and other conductive layers in the encapsulation base, a conductive wiring 6 is provided in the encapsulation base of the present invention. One end of the conductive wiring 6 is located within the frame 12 and is connected to the toroidal metal layer 2, and the other end extends to the main body portion 11 and is connected to another external terminal through a via conductor 5, thereby achieving electrical connection between the toroidal metal layer 2 and other conductive layers in the encapsulation base. Compared with the traditional solution of using via conductors provided within the frame 12 to achieve electrical connection between the toroidal metal layer 2 and other conductive layers in the encapsulation base, the provision of the conductive wiring 6 can effectively reduce the thermal expansion difference between different materials in the frame area of the encapsulation base, greatly reducing the risk of thermal stress cracking in the frame portion. At the same time, in order to facilitate electrical connection of the conductive wirings between the encapsulation bases within the encapsulation base composite board, the encapsulation base of the present invention includes a toroidal connection wiring 7 and a pad connection wiring 8. The toroidal connection wiring 7 is provided within the frame 12, with one end connected to the toroidal metal layer 2 and the other end extending to the outer side surface 100 and exposed to form a first exposed portion 71. The pad connection wiring 8 is located within the insulating substrate 1, with one end extending within the main body portion 11 and connected to the electrode pad 4, and the other end extending within the frame 12 to the outer side surface 100 and exposed to form a second exposed portion 81.

[0053] For the convenience of describing the encapsulation base in the present invention, the manufacturing method of the encapsulation base in the present invention includes the following steps:

[0054] S1. Processing the ceramic slurry into a ceramic green body;

[0055] S2. According to the structure of the via conductor 5 in the main body portion 11 of the insulating substrate 1, opening vias in the ceramic green body and printing and filling the via conductor 5 in the vias;

[0056] S3. According to the conductive pattern structure of the insulating substrate 1, forming a conductive coating and a ceramic slurry layer covering part of the conductive coating on the ceramic green body obtained in step S2 through multiple printings;

[0057] S4. According to the accommodation cavity 101 and the conductive pattern structure, using a mold to heat and press the ceramic green body obtained in step S3 into shape, forming an insulating substrate composite board green body with internal conductive wirings, toroidal connection wirings 7 and other wiring structures;

[0058] S5. Debinding and sintering the insulating substrate composite board green body to obtain a semi-finished encapsulation base composite board;

[0059] S6. Electroplating a metal coating on the semi-finished encapsulation base composite board to obtain a finished encapsulation base composite board;

[0060] S7. Using a dividing groove to cut the encapsulation base composite board into individual encapsulation bases.

[0061] When preparing the encapsulation base by thermocompression molding, the formation process of the electroplated wiring (conductive wiring, wiring for terminal interconnection, wiring for torus interconnection, etc.) inside the encapsulation base and the accommodation cavity 11 is as follows: A conductive coating and a ceramic slurry coating covering part or all of the conductive coating are sequentially printed on the upper surface / lower surface of the insulating substrate, and then hot press molding is performed using a mold. The insulating matrix and the coating provided thereon will deform according to the mold structure and fill the mold cavity, so that the ceramic slurry layer originally protruding from the surface of the insulating substrate sinks due to pressure to be flush with the surface of the insulating substrate, thereby forming the accommodation cavity 11 and the structure where the conductive coating is inside the encapsulation base.

[0062] Further, in this embodiment, one end of the wiring 7 for torus interconnection connected to the torus metal layer 2 is connected to one end of the conductive wiring 6 connected to the torus metal layer 2. Specifically, when one end of the wiring 7 for torus interconnection connected to the torus metal layer 2 is not connected to one end of the conductive wiring 6 connected to the torus metal layer 2, the torus metal layer 2 is respectively connected to the wiring 7 for torus interconnection and the conductive wiring 6 to form two connection points. The increase in the number of connection points will result in poor resistance uniformity of the electroplated wiring, affecting the thickness uniformity of the electroplated layer in step S6 of the encapsulation base. Moreover, a parasitic capacitance may be generated between the conductive wiring 6 and the wiring 7 for torus interconnection, causing the encapsulation base to be interfered by its own signals during actual application, affecting the normal function of the encapsulation base.

[0063] Therefore, in this embodiment, the conductive wiring 6 is connected to the wiring 7 for torus interconnection, and there is only one connection point between the conductive wiring 6 and the torus metal layer 2, reducing the number of connection points, improving the resistance uniformity of the electroplated wiring, making the symmetry of the overall electroplated wiring of the encapsulation base better, improving the current uniformity, and further ensuring the thickness uniformity of the electroplated layer of the encapsulation base. At the same time, the generation of parasitic capacitance between the conductive wiring 6 and the wiring 7 for torus interconnection is avoided, reducing the signal interference during the actual use of the encapsulation base.

[0064] Further, when the encapsulation base composite plate needs to be provided with a dividing groove K to be cut into multiple encapsulation bases, the dividing inclined surfaces 102 of adjacent encapsulation bases arranged opposite to each other cooperate to form the dividing groove K. If the electroplated wiring structure is exposed in the dividing groove K, the adjacent encapsulation bases will stick together due to the exposure of the electroplated wiring during electroplating. Therefore, in this embodiment, the first end face 111 is connected to one end of the outer side face 100 through the dividing inclined surface 102, and the second end face 121 is connected to the other end of the outer side face 100 through the dividing inclined surface 102; the first exposed portion 71 and / or the second exposed portion 81 are arranged away from the dividing inclined surface 102, that is, the first exposed portion 71 and / or the second exposed portion 81 are not exposed in the dividing inclined surface 102.

[0065] Further, in order to facilitate the layout of the wiring structure in the insulating substrate 1, the insulating substrate 1 is divided into regions. In this embodiment, the outer shape of the insulating substrate 1 is a cuboid structure. Therefore, referring to Figure 1 , Figure 7 , the insulating substrate 1 includes a first corner region 103 and a third corner region 105 that are diagonally arranged, and a second corner region 104 and a fourth corner region 106 that are diagonally arranged. There is a side region 107 between adjacent corner regions. Further, there is a wiring 8 for pad interconnection in both the second corner region 104 and the fourth corner region 106. One end of the wiring 8 for pad interconnection extending in the main body portion 11 is connected to the electrode pad 4. Specifically, the electrode pad 4 includes a first pad 41 and a second pad 42. The first pad 41 and the second pad 42 are diagonally arranged in the accommodation cavity 101. The first pad 41 and the second pad 42 are connected to the external connection terminal 3 through the via conductor 5. One pad corresponds to one external connection terminal, and each single pad corresponds to at least one wiring 8 for pad interconnection.

[0066] Specifically, since the upper surface of the insulating substrate needs to form a concave cavity through a hot pressing process, the deformation degree of the upper surface is high during the hot pressing process. At the same time, the corner regions of the insulating substrate share a corner with three other adjacent insulating substrates in the combined plate structure. Compared with the side region that only shares a side with one adjacent insulating substrate, the corner regions require more fillers for filling. Otherwise, the corner regions of the formed encapsulation base will show depressions, resulting in poor flatness. In the present invention, by arranging the wiring for pad interconnection in the corner regions, the filling volume of the corner regions can be effectively increased, so that the filling in the corner regions is sufficient during the hot pressing process, and the finally formed encapsulation base has excellent flatness.

[0067] In some other embodiments, the wiring 8 for pad interconnection can also be arranged in the side region 107 and the adjacent corner regions (such as the second corner region 104 and the third corner region 105), and can be correspondingly arranged according to the position of the electrode pad 4, and the position of the wiring 8 for pad interconnection is optimized. When the electrode pads 4 are diagonally arranged, for example, the first pad 41 is arranged in the second corner region 104 and the second pad 42 is arranged in the fourth corner region 106. At this time, it is preferred that the wirings 8 for pad interconnection are respectively arranged in the second corner region 104 and the fourth corner region 106. For example, when the first pad 41 and the second pad 42 are respectively arranged in adjacent corner regions. Specifically, the first pad 41 is arranged in the second corner region 104 and the second pad 42 is arranged in the third corner region 105. At this time, the wirings 8 for pad interconnection are respectively arranged in the second corner region 104 and the third corner region 105, or the wiring 8 for pad interconnection is arranged in the side region 107 between the second corner region 104 and the third corner region 105. The arrangement region of the wiring 8 for pad interconnection can be adjusted according to actual design requirements.

[0068] Furthermore, in the present embodiment, the toroidal interconnection wirings 7 are provided in both the first corner region 103 and the third corner region 105. In some other embodiments, the toroidal interconnection wirings 7 may also be provided in the side region 107. In step S4, since the insulating substrate 1 forms the accommodation cavity 101 through the die hot pressing process, one side of the insulating substrate 1 near the frame portion is formed to a higher degree. At the same time, since one corner region of the insulating substrate 1 shares a corner with the other three adjacent insulating substrates 1 under the structure of the composite board, compared with the side region 107 of the insulating substrate 1 which is only adjacent to the side region 107 of another insulating substrate 1, the corner region requires more fillers (such as coatings or ceramic green blanks) for filling. Otherwise, depressions will appear in the corner region of the packaged base after molding, resulting in poor flatness. In the present embodiment, by providing the toroidal interconnection wirings 7 in the corner region, the filling volume of the corner region can be effectively increased, so that the filling in the corner region is sufficient during the hot pressing process, and the packaged base has better flatness.

[0069] Similarly, in order to avoid depressions in the corner region of the packaged base after molding, resulting in poor flatness. Conductive wirings 6 are provided in the first corner region 103 and / or the third corner region 105. One end of the conductive wiring 6 located in the main body portion 11 is connected to the external connection terminal 3 through the via conductor 5. The specific reason is the same as that of the toroidal interconnection wiring 7 and will not be elaborated here.

[0070] Furthermore, in some other embodiments, in order to facilitate the connection between the external connection terminals 3 in adjacent packaged bases, refer to Figures 1 to 11 There is also a terminal interconnection wiring 9. Specifically, the terminal interconnection wiring 9 can be provided in the corner region or the side region 107, and can be correspondingly adjusted according to the number and position of the external connection terminals 3.

[0071] The present invention also provides a composite board of packaged bases, which is composed of the packaged bases described in any one of the above. Specifically, refer to Figures 9 to 15 The insulating substrate 1 has a first corner region 103 and a third corner region 105 arranged diagonally, and a second corner region 104 and a fourth corner region 106 arranged diagonally; side regions 107 are provided between adjacent corner regions. For the convenience of description, the composite board of packaged bases includes adjacent first packaged base A1, second packaged base A2, third packaged base A3, and fourth packaged base A4. Among them, the first packaged base A1 and the second packaged base A2, the third packaged base A3 and the fourth packaged base A4 are adjacent in the third direction Z, and the first packaged base A1 and the fourth packaged base A4, the second packaged base A2 and the third packaged base A3 are adjacent in the second direction Y.

[0072] Further, in some embodiments, wiring 7 for torus interconnection and wiring 8 for pad interconnection are provided on the edge region 107. There is wiring 7 for torus interconnection that electrically connects the opposite-edge adjacent package bases to each other, and there is wiring 8 for pad interconnection that electrically connects the opposite-edge adjacent package bases to each other.

[0073] In some embodiments, wiring 7 for torus interconnection (not shown in the figure) is provided in the edge region 107, and wiring 8 for pad interconnection is respectively provided in the second corner region 104 and the third corner region 105. There is wiring 7 for torus interconnection that electrically connects the opposite-edge adjacent package bases to each other, and there is wiring 8 for pad interconnection that electrically connects the opposite-edge adjacent package bases to each other. Specifically, the wiring 7 for torus interconnection of the opposite-edge adjacent in the first package base and the second package base is electrically connected, and the wiring 8 for pad interconnection of the opposite-edge adjacent is electrically connected.

[0074] In some other embodiments, wiring 7 for torus interconnection is provided in both the first corner region 103 and the third corner region 105, and wiring 8 for pad interconnection is provided in both the second corner region 104 and the fourth corner region 106. There is wiring 7 for torus interconnection that electrically connects the diagonally adjacent package bases to each other, and there is wiring 8 for pad interconnection that electrically connects the diagonally adjacent package bases to each other. Specifically, referring to Figures 9 to 11 , among the first package base A1, the second package base A2, the third package base A3, and the fourth package base A4, the wiring 7 for torus interconnection provided diagonally between the first package base A1 and the third package base A3 is connected, and the wiring 8 for pad interconnection provided diagonally between the second package base A2 and the fourth package base A4 is connected. As Figures 12 to 15 shown, the wiring 7 for torus interconnection in the first package base A1 is electrically connected to the wiring 7 for torus interconnection in the third package base A3 through the wiring 8 for pad interconnection in the fourth package base A4; the wiring 8 for pad interconnection in the fourth package base A4 is electrically connected to the wiring 8 for pad interconnection in the second package base A2 through the wiring 7 for torus interconnection of the first package base A1.

[0075] The present invention also provides an electronic device, including the package base described in any one of the above, further including an electronic component disposed in the accommodation cavity 101, and a cover plate for sealing the accommodation cavity 101.

[0076] In summary, the embodiments of the present invention provide a packaging base, a combined board, and an electronic device, which are provided with a conductive wiring 6, an annular surface interconnection wiring 7, and a pad interconnection wiring. One end of the conductive wiring 6 is located inside the frame 12 and connected to the annular surface metal layer 2, and the other end extends to the main body 11 and is connected to another external terminal; the annular surface interconnection wiring 7 is disposed inside the frame 12, and one end is connected to the annular surface metal layer 2, and the other end extends to the outer side surface 100 and is exposed to form a first exposed portion 71; the pad interconnection wiring 8 is located inside the insulating substrate 1, one end extends inside the main body 11 and is connected to the electrode pad 4, and the other end extends inside the frame 12 to the outer side surface 100 and is exposed to form a second exposed portion 81. By providing the first exposed portion 71 and the second exposed portion 81, an electroplating conduction line is formed in a plurality of combined boards arranged by the packaging bases, and electroplating conduction connection can be achieved between adjacent packaging bases. At the same time, electroplating conduction connection can also be achieved between different conductive layers inside a single packaging base. Moreover, by providing the conductive wiring 6 instead of providing a through-hole conductor 5 in the frame 12, cracking of the frame 12 due to thermal expansion difference is avoided, and the structural stability of the packaging base is improved. In addition, the electroplating wiring circuit is simplified, the uniformity of the plating layer can be ensured when applied to a packaging base with a small volume, and it can also be applied to the case of preparing a packaging base with a single insulating film layer, and the versatility is good.

[0077] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and replacements can be made, and these improvements and replacements should also be regarded as the protection scope of the present invention.

Claims

1. An encapsulation base, characterized in that: Comprising An insulating substrate, including a main body portion and a frame body arranged in a first direction. One end of the main body portion away from the frame body is provided with a first end face, and one end of the frame body away from the main body portion is provided with a second end face. The outer side surfaces connecting the main body portion and the frame body are arranged on the circumferential side, and the outer side surfaces are arranged between the first end face and the second end face. The frame body and the main body portion jointly enclose a receiving cavity; An annular metal layer, arranged on the second end face and surrounding the receiving cavity; A plurality of external connection terminals, arranged on the first end face; Electrode pads, arranged in the receiving cavity and capable of being connected to one of the external connection terminals through a via conductor; Conductive wirings, one end of which is located in the frame body and connected to the annular metal layer, and the other end extends to the main body portion and is connected to another external terminal; Annular surface interconnecting wirings, arranged in the frame body, and one end is connected to the annular metal layer, and the other end extends to the outer side surface and is exposed to form a first exposed portion; Pad interconnecting wirings, located within the insulating substrate, one end extends within the main body portion and is connected to the electrode pad, and the other end extends within the frame body and is exposed on the outer side surface to form a second exposed portion.

2. The encapsulation base according to claim 1, wherein: One end of the annular surface interconnecting wiring connected to the annular metal layer is connected to one end of the conductive wiring connected to the annular metal layer.

3. The encapsulation base according to claim 1, characterized in that: The first end face is connected to one end of the outer side surface through a dividing inclined surface, and the second end face is connected to the other end of the outer side surface through a dividing inclined surface; The first exposed portion and / or the second exposed portion are arranged away from the dividing inclined surface.

4. The encapsulation base according to claim 1, wherein: The insulating substrate includes a first corner region and a third corner region arranged diagonally, and a second corner region and a fourth corner region arranged diagonally. There are edge regions between adjacent corner regions.

5. The encapsulation base according to claim 4, wherein: The pad interconnecting wirings are arranged in both the second corner region and the fourth corner region.

6. The encapsulation base according to claim 4, wherein: The annular surface interconnecting wirings are arranged in both the first corner region and the third corner region.

7. The encapsulation base according to claim 4, wherein: The conductive wiring is arranged in the first corner region and / or the third corner region.

8. The encapsulation base according to claim 1, wherein: The electrode pads include a first pad and a second pad, and the first pad and the second pad are arranged diagonally in the receiving cavity.

9. An encapsulation base combined board, which is formed by arranging a plurality of encapsulation bases described in any one of claims 1-8, and is characterized in that: The insulating substrate has a first corner region and a third corner region arranged diagonally, and a second corner region and a fourth corner region arranged diagonally; there are edge regions between adjacent corner regions; The annular surface interconnecting wirings and the pad interconnecting wirings are arranged on the edge regions. There are mutually electrically connected annular surface interconnecting wirings between the package bases adjacent to opposite sides, and there are mutually electrically connected pad interconnecting wirings between the package bases adjacent to opposite sides; Or, The annular surface interconnecting wirings are arranged in the edge regions, and the pad interconnecting wirings are respectively arranged in the second corner region and the third corner region; There are mutually electrically connected annular surface interconnecting wirings between the package bases adjacent to opposite sides, and there are mutually electrically connected pad interconnecting wirings between the package bases adjacent to opposite sides; Or, The toroidal interconnection wirings are provided in both the first corner region and the third corner region, and the pad interconnection wirings are provided in both the second corner region and the fourth corner region. The toroidal interconnection wirings that are electrically connected to each other are provided between the package bases that are diagonally adjacent, and the pad interconnection wirings that are electrically connected to each other are provided between the package bases that are diagonally adjacent.

10. An electronic device, comprising the encapsulation base according to any one of claims 1-8, characterized in that: It further includes an electronic component disposed in the accommodation cavity and a cover plate for sealing the accommodation cavity.

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