Circuit board golden finger manufacturing method without lead wire residues
By reserving the etching allowance in the gold finger design stage and precisely controlling the etching process, the problem of large lead residue and side etching after gold finger plating is solved, and lead-free residue and high-quality gold finger production is achieved.
Patent Information
- Application Number
- CN202510516670.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-23
- Publication Date
- 2025-07-18
AI Technical Summary
In the prior art, gold fingers have residual or large lateral corrosion when removing leads after gold plating, which affects product quality and aesthetics.
A sufficient etch margin is reserved during the design phase of the gold finger. By creating a circuit layer containing extended gold finger patterns, combined with gold-resistant ink and dry film protection, the etching process is precisely controlled to ensure that the leads are completely removed and the lateral etching is controlled within a reasonable range.
The lead-free residue is achieved, which reduces the impact of side corrosion on the target gold finger, improves the quality and service life of the gold finger, and ensures the stability and aesthetics of the electrical connection.
Smart Images
Figure CN120343812A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of circuit boards, and more particularly, to a method for manufacturing a circuit board gold finger without lead residue. Background Art
[0002] A gold finger is a row of golden conductive contacts on the edge of a circuit board. These contacts are essentially bare copper contacts, and their conductivity and corrosion resistance are enhanced by gold plating, enabling the circuit board to stably connect with other devices. When gold plating the gold finger, it needs to be conductive through a lead, and the lead needs to be removed after gold plating. In related technologies, there are usually two removal methods. The first is to cut off the lead with a tool when the gold finger is formed, and the second is to etch off the lead by etching. In the actual operation process, it is found that the first method has low precision and there will always be residual finger leads, affecting the appearance; the second method is affected by side etching, with a large amount of side etching, resulting in a high risk of detachment due to excessive gold-nickel suspension, affecting the product quality. Summary of the Invention
[0003] In view of this, the present invention provides a method for manufacturing a circuit board gold finger without lead residue. By optimizing the pre-design and reserving sufficient etching allowance in advance, the side etching amount can be controlled, reducing the side etching amount of the gold finger and controlling it within a reasonable range.
[0004] The object of the present invention is achieved through the following technical solutions: On the one hand, a method for manufacturing a gold finger without lead residue is provided, including the following steps: S1: Substrate pretreatment. Provide a substrate and form a circuit layer on the substrate, which includes an extended gold finger pattern and a conductive lead. The axial length of the extended gold finger pattern is longer than the preset length of the target gold finger. S2: Selective ink protection. Coat anti-gold plating ink on the surface of the substrate, and form an anti-plating layer after exposure and development. The anti-plating layer covers the non-gold plating areas on the surface of the substrate, and only exposes the gold plating window corresponding to the position and size of the target gold finger. S3: Gold plating. Deposit nickel-gold on the actual gold plating area to form the target gold finger. S4: Ink removal. Remove part of the anti-gold plating ink to expose the conductive lead area and the non-gold plating extension section of the extended gold finger pattern. S5: Structure shaping. Etch off the lead exposed in step S4 and the copper layer of the non-gold plating extension section.
[0005] In the above technical solution, during the original manuscript design stage of the gold finger, a circuit layer including an extended gold finger pattern is fabricated, so as to form a margin compensation mechanism during the etching stage. Finally, the copper layers of the leads and the non-gilded extension segments of the extended gold finger pattern are etched away, which not only ensures that the leads are completely etched away without residue, but also enables the side etching to only affect the copper layer of the non-gilded extension segment to reduce the impact of side etching on the copper layer at the target gold finger, and controls the side etching amount of the target gold finger within a reasonable range, such as within 20 microns. In addition, the design of the extended gold finger pattern in this application can ensure that the leads are in a completely exposed state during the etching process, that is, there is no dry film or wet film covering the leads, thereby effectively avoiding residues caused by lead misalignment.
[0006] Optionally, in a possible implementation manner, in step S5, the method for structure shaping is as follows: S5.1: Use a dry film to cover the parts on the substrate surface that do not need to be etched, and a section needs to be covered in the area where the non-gilded extension segment of the extended gold finger pattern is located; S5.2: Use an alkaline etching solution to etch the substrate.
[0007] In the above technical solution, the covering method of the dry film can accurately define the area to be etched, making the etching process more precise and enabling the more accurate etching of the unnecessary leads and the copper layers of the non-gilded extension segments. Among them, when the dry film covers the non-gilded extension segment, at this time, the copper layer of the non-gilded extension segment is affected by side etching, and the leads are etched comprehensively. Therefore, the copper layer of the non-gilded extension segment will be etched away instead of the copper layer under the gold finger, thereby effectively reducing the impact of side etching on the copper layer under the gold finger.
[0008] Optionally, in a possible implementation manner, in step S5.1, the length of the dry film covering the surface of the non-gilded extension segment of the extended gold finger pattern is determined according to the thickness of the copper layer on the substrate.
[0009] In the above technical solution, determining the length of the dry film covering the surface of the non-gilded extension segment of the extended gold finger according to the copper layer thickness can achieve targeted protection of the non-gilded extension segment. Different copper layer thicknesses may cause different degrees of influence on the non-gilded extension segment during the etching process. Therefore, the side etching amount of the copper layer of the non-gilded extension segment can be further controlled according to the data during actual processing.
[0010] Optionally, in a possible implementation manner, the thickness of the copper layer is 35 - 105 microns, and the length of the dry film covering the corresponding surface of the non-gilded extension segment is 60 - 140 microns.
[0011] In the above technical solution, the clear correspondence between the thickness of the copper layer and the length of the covering dry film ensures the stability of the protection performance and facilitates the process operation. For example, when the thickness of the copper layer is 35 microns, using a dry film to cover the non-gilded extension section with a thickness of 60 microns can provide sufficient protection, and the target side etching amount of the gold finger can be controlled within 20 microns.
[0012] Optionally, in a possible implementation manner, the axial length of the extended gold finger pattern is 508 - 762 microns longer than the preset length of the target gold finger.
[0013] In the above technical solution, the extended section of the extended gold finger pattern relative to the target gold finger is controlled within a reasonable range, which will neither be too short to cause excessive etching of the copper layer under the target gold finger during subsequent side etching, nor be too long to cause copper layer residue in the non-gilded extension section.
[0014] Optionally, in a possible implementation manner, in the step S1, the method for substrate pretreatment includes the following steps: S1.1: Attach the dry film to the copper plate after electroless copper plating and electroplating, and obtain the outer layer circuit pattern after exposure and development; S1.2: Outer layer etching, etch away the copper that is not covered by the dry film; S1.3: Solder mask, print a solder mask layer on the surface of the copper plate.
[0015] In the above technical solution, the substrate makes the outer layer circuit pattern, and at the same time makes the extended gold finger pattern and the lead, which can effectively improve the processing efficiency of the circuit board. In addition, the solder mask layer can effectively protect the surface of the circuit board and prevent solder from flowing to places where welding is not required during subsequent assembly, such as when welding components, to avoid the occurrence of short circuit phenomena.
[0016] Optionally, in a possible implementation manner, when there are other copper surfaces on the copper plate surface that do not need to be gilded, use an anti-gold plating dry film to protect the copper surfaces that do not need to be gilded, and remove the anti-gold plating dry film before the step S5.
[0017] In the above technical solution, using an anti-gold plating dry film to protect the copper surfaces that do not need to be gilded can ensure that during the gold plating process, the gold plating solution will only act on areas that need to be gilded, such as the target gold fingers. The anti-gold plating dry film and the anti-gold plating ink are used in combination, and this protection measure can achieve highly precise gold plating operations, avoiding the misplating of the gold plating solution onto copper surfaces that do not need to be gilded, thereby ensuring the accuracy of gold plating.
[0018] Optionally, in a possible implementation manner, the substrate is provided with a plurality of board output units, and alignment pads with a diameter of 1 - 3 mm are provided at the four corners of each board output unit.
[0019] In the above technical solution, the above alignment pads are used for segmented alignment. The alignment pads help to quickly achieve precise alignment, ensure the accuracy of exposure alignment, and avoid situations such as line offset and dislocation.
[0020] Optionally, in a possible implementation manner, during the etching process of step S5, a dynamic monitoring device is adopted, and the etching thickness of the copper layer is detected in real time through an optical sensor, and the etching parameters are feedback-adjusted.
[0021] In the above technical solution, real-time monitoring can accurately master the progress of etching and ensure that the etching thickness matches the preset value. Since different circuit boards have different copper thicknesses, and the dynamic monitoring device can adjust the etching parameters according to the real-time feedback, the technical solution can well adapt to various etching requirements.
[0022] On the other hand, a circuit board is provided, and the circuit board is obtained by the above method for manufacturing a gold finger.
[0023] In the above technical solution, since the gold finger of the circuit board is obtained by the above manufacturing method, during the manufacturing process of the gold finger, steps such as extending the axial length of the gold finger pattern, precise etching, and precise gold plating ensure the quality of the gold finger. The length of the gold finger is appropriate, the shape is precise, and the gold plating layer is uniform, which can provide stable physical and electrical connections, reduce the risk of wear and deformation of the gold finger during plugging and unplugging, and thus improve the service life and reliability of the gold finger. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.
[0025] Figure 1 It is a schematic diagram of the overall process of an embodiment.
[0026] Figure 2 It is one of the schematic diagrams of the principle of the gold finger etching method in the embodiment.
[0027] Figure 3 It is the second of the schematic diagrams of the principle of the gold finger etching method in the embodiment.
[0028] Reference numerals: 1 - extended gold finger pattern; 11 - non-gold-plated extension section; 2 - lead; 3 - target gold finger; 4 - dry film. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0029] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the following will clearly and completely describe the technical solutions in the embodiments of this application with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are some, but not all, of the embodiments of this application. Usually, the components of the embodiments of this application described and shown in the accompanying drawings here can be arranged and designed in various different configurations.
[0030] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of this application that is claimed, but merely represents selected embodiments of this application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in this application without creative efforts belong to the scope of protection of this application.
[0031] Please refer to Figure 1 , this embodiment provides a method for manufacturing a gold finger without lead residues, including the following steps: S1: Substrate pretreatment. Provide a substrate, and form a circuit layer including an extended gold finger pattern 1 and a conductive lead 2 on the substrate. The axial length of the extended gold finger pattern 1 is longer than the preset length of the target gold finger 3; among them, the width of the extended gold finger pattern 1 is wider than the width of the conductive lead 2, and the extended gold finger pattern 1 and the conductive lead 2 are multiple parallel and spaced apart. S2: Selective ink protection. As Figure 2 shown, apply anti-gold plating ink on the surface of the substrate, and form an anti-plating layer after exposure and development; the anti-plating layer covers the non-gold plating areas on the surface of the substrate, and only exposes the gold plating windows corresponding to the position and size of the target gold finger 3; taking the rectangular area including the extended gold finger pattern 1 and the conductive lead 2 as an example, in this area, the gold plating window only exposes the area where the target gold finger 3 is located, that is, only the copper layer where the target gold finger 3 is located is gold plated during gold plating. S3: Gold plating. Plate nickel-gold on the actual gold plating area to form the target gold finger 3, that is, plate a layer of nickel-gold on the surface of the copper layer where the target gold finger 3 is located to protect the copper surface; after this step, in the extended gold finger pattern 1 and the conductive lead 2, the extended gold finger pattern 1 has a gold-plated section, that is, the target gold finger 3, and a non-gold-plated extended section 11. S4: Ink removal. Remove part of the anti-gold plating ink to expose the conductive lead 2 area and the non-gold-plated extended section 11 of the extended gold finger pattern 1. S5: Structure shaping. Etch away the lead 2 exposed in step S4 and the copper layer of the non-gold-plated extended section 11.
[0032] In this embodiment, a circuit layer containing the extended finger pattern 1 is fabricated during the original design stage of the gold finger, thereby forming a margin compensation mechanism during the etching stage. Finally, the copper layers of the lead 2 and the non-gilded extension segment 11 of the extended finger pattern 1 are etched away, ensuring that the lead 2 is completely etched away without residue and that the side etching only affects the copper layer of the non-gilded extension segment 11 to reduce the impact of etching on the copper layer at the target gold finger 3, and controlling the side etching amount of the target gold finger 3 within a reasonable range, such as within 20 microns.
[0033] In addition, the design of the extended finger pattern 1 in this embodiment can ensure that the lead 2 is completely exposed during the etching process, that is, there is no dry film or wet film covering the lead 2, thereby effectively avoiding residues caused by the offset of the lead 2. It should be noted that due to the narrow width of the lead 2, problems such as offset are likely to occur during the exposure or printing alignment process.
[0034] Please refer to Figure 3 , in step S5 of this embodiment, the method for structure shaping is as follows: S5.1: Use a dry film 4 to cover the parts on the substrate surface that do not need to be etched, and an additional section needs to be covered in the area where the non-gilded extension segment 11 of the extended finger pattern 1 is located; for example, in the rectangular area containing the extended finger pattern 1 and the conductive lead 2 in this embodiment, the dry film 4 covers the target gold finger 3 and a part of the non-gilded extension segment 11 of the extended finger pattern 1, so as to reduce the side etching of the copper layer under the target gold finger 3; S5.2: Use an alkaline etching solution to etch the substrate. The etching speed can be adjusted according to the copper thickness, and the hanging gold amount at the target gold finger 3 can be controlled within 20 microns without residual copper.
[0035] The covering method of the dry film 4 in this embodiment can accurately define the area to be etched, making the etching process more precise and enabling more accurate etching of the copper layers of the unnecessary lead 2 and non-gilded extension segment 11. Among them, when the dry film 4 covers the non-gilded extension segment 11, the copper layer of the non-gilded extension segment 11 is affected by side etching at this time, and the lead 2 is etched comprehensively. Therefore, the copper layer of the non-gilded extension segment 11 will be etched away instead of the copper layer under the gold finger, effectively reducing the impact of side etching on the copper layer under the gold finger.
[0036] In step S5.1 of this embodiment, the length of the dry film 4 covering the surface of the non-gilded extension segment 11 of the extended finger pattern 1 is determined according to the copper layer thickness on the substrate. Different copper layer thicknesses are affected by different side etching amounts. For example, the thicker the copper thickness, the greater the side etching amount. Therefore, the length of the dry film 4 covering the non-gilded extension segment 11 needs to be determined according to the actual copper thickness.
[0037] Therefore, determining the length of the dry film 4 covering the non-gilded extension section 11 of the extended gold finger according to the thickness of the copper layer can achieve targeted protection of the non-gilded extension section 11. Different copper layer thicknesses may have different degrees of impact on the non-gilded extension section 11 during the etching process. Therefore, the coverage amount of the dry film 4 on the copper layer of the non-gilded extension section 11 can be further controlled according to the data during actual processing.
[0038] In this embodiment, the thickness of the copper layer is 35 - 105 microns, and the length of the dry film 4 covering the surface of the corresponding non-gilded extension section 11 is 60 - 140 microns. Specifically, the different copper layer thicknesses are 35 microns, 50 microns, 70 microns, and 105 microns respectively, and the corresponding coverage lengths of the dry film 4 are 60 microns, 75 microns, 90 microns, and 140 microns respectively. Through actual production tests, etching according to the above data can control the hanging gold amount at the target gold finger 3 within 20 microns.
[0039] The clear corresponding relationship between the copper layer thickness and the coverage length of the dry film 4 ensures the stability of the protection performance and facilitates process operations. For example, when the copper layer thickness is 35 microns, covering the non-gilded extension section 11 with a 60-micron-thick dry film 4 can provide sufficient protection and control the side etching amount of the copper layer under the target gold finger 3 within 20 microns.
[0040] In this embodiment, the axial length of the extended gold finger pattern 1 is 508 - 762 microns longer than the preset length of the target gold finger 3, that is, the length of the non-gilded extension section 11 of the extended gold finger pattern 1 is 508 - 762 microns. Controlling the dry film 4 covering the non-gilded extension section 11 within a reasonable range will neither be too short to cause excessive etching of the copper layer under the subsequent target gold finger 3 during side etching, nor be too long to cause copper layer residue on the subsequent non-gilded extension section 11. It can be known from actual production verification that within this length range, in cooperation with the copper layer thickness and the length of the dry film 4 covering the non-gilded extension section 11, the side etching amount of the target gold finger 3 can be ensured within 20 microns, and at the same time, no lead 2 is ensured, making the shaping of the gold finger more beautiful and improving the product competitiveness.
[0041] In step S1 of this embodiment, the method for substrate pretreatment includes the following steps: S1.1: Attach the dry film to the copper plate after electroless copper plating and electroplating, and obtain the outer layer circuit pattern after exposure and development; in this step, while the outer layer circuit pattern is formed, the extended gold finger pattern 1 and the lead 2 are also formed synchronously; 1.2: Outer layer etching, etch away the copper that is not covered by the dry film; in this step, the copper foil circuit required for the actual circuit board can be obtained, and acid etching can be used for processing; S1.3: Solder resist, print a solder resist layer on the surface of the copper plate to protect the copper foil circuit on the circuit board from the influence of the external environment.
[0042] When fabricating the outer - layer circuit pattern on the substrate, the gold - finger pattern 1 and the lead 2 are extended and formed simultaneously, which can effectively improve the processing efficiency of the circuit board. In addition, the solder mask layer can effectively protect the surface of the circuit board, preventing solder from flowing to the places where soldering is not required during subsequent assembly processes, such as when soldering components, thus avoiding the occurrence of short - circuit phenomena.
[0043] It should be noted that when there are other copper surfaces on the copper - plate surface that do not need to be gold - plated, an anti - gold - plating dry film is used to protect the copper surfaces that do not need to be gold - plated, and the anti - gold - plating dry film is removed before step S5. Specifically, during the processing of the circuit board, when the outer - layer circuit is formed and covered with a solder mask layer, it is usually necessary to perform solder - mask openings to facilitate the installation and connection of electronic components. And some places where solder - mask openings are made do not need to be gold - plated. Therefore, at this time, the places that do not need to be gold - plated are covered by the anti - gold - plating dry film. That is, through the combined cooperation of the anti - gold - plating ink and the anti - gold - plating dry film, it is convenient for operation and the accuracy of subsequent gold - plating. Of course, if all places where solder - mask openings are made need to be gold - plated, then the anti - gold - plating dry film does not need to be covered.
[0044] In this embodiment, the anti - gold - plating dry film is used to protect the copper surfaces that do not need to be gold - plated, which can ensure that during the gold - plating process, the gold - plating solution only acts on the target areas that need to be gold - plated, such as the gold finger 3. The anti - gold - plating dry film and the anti - gold - plating ink are used in combination, and this protection measure can achieve highly precise gold - plating operations, avoiding the mis - plating of the gold - plating solution onto the copper surfaces that do not need to be gold - plated, thus ensuring the accuracy of gold - plating.
[0045] In this embodiment, the substrate is provided with a plurality of board - output units, and alignment pads with a diameter of 1 - 3 mm are provided at the four corners of each board - output unit and used for split alignment. The alignment pads help to achieve precise alignment, ensure the accuracy of exposure alignment, and avoid situations such as line offset and dislocation.
[0046] It should be noted that during the etching process of step S5 in this embodiment, a dynamic monitoring device is adopted, and the etching thickness of the copper layer is detected in real - time through an optical sensor, and the etching parameters are feedback - adjusted.
[0047] Adopting real - time monitoring can accurately master the progress of etching and ensure that the etching thickness highly coincides with the preset value. Since different circuit boards are designed with different copper thicknesses, and the dynamic monitoring device can adjust the etching parameters according to the real - time feedback, this technical solution can well adapt to various etching requirements.
[0048] In addition, this embodiment also provides a circuit board, which is obtained by the above - mentioned gold - finger manufacturing method.
[0049] Since the gold fingers of the circuit board are obtained by the above manufacturing method, during the manufacturing process of the gold fingers, steps such as extending the axial length of the gold finger pattern 1, precise etching, and precise gold plating ensure the quality of the gold fingers. The gold fingers have an appropriate length, precise shape, and uniform gold plating layer, which can provide stable physical and electrical connections, reduce the risk of wear and deformation of the gold fingers during plugging and unplugging, and thus improve the service life and reliability of the gold fingers.
[0050] In the description of the present invention, it should be understood that terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.
[0051] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means two or more, unless otherwise specifically defined.
[0052] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A method for manufacturing a gold finger without lead residues and a circuit board, characterized in that, It includes the following steps: S1: Substrate pretreatment. Provide a substrate, and form a circuit layer including an extended gold finger pattern and conductive leads on the substrate. The axial length of the extended gold finger pattern is longer than the preset length of the target gold finger; S2: Selective ink protection. Coating an anti-gold plating ink on the surface of the substrate, and forming an anti-plating layer after exposure and development. The anti-plating layer covers the non-gold plating areas on the surface of the substrate, and only exposes the gold plating windows corresponding to the position and size of the target gold fingers; S3: Gold plating. Plating nickel-gold on the actual gold plating areas to form the target gold fingers; S4: Ink removal. Remove part of the anti-gold plating ink to expose the conductive lead areas and the non-gold plating extension segments of the extended gold finger pattern; S5: Structure shaping. Etch away the leads and the copper layer of the non-gold plating extension segments exposed in step S4.
2. The method for manufacturing a gold finger without lead residues according to claim 1, characterized in that In step S5, the method of structure shaping is as follows: S5.1: Use a dry film to cover the parts on the surface of the substrate that do not need to be etched, and a section needs to be covered in the area where the non-gold plating extension segment of the extended gold finger pattern is located; S5.2: Etch the substrate using an alkaline etching solution.
3. The method for manufacturing a gold finger without lead residue according to claim 2, wherein In step S5.1, determine the length of the dry film covering the surface of the non-gold plating extension segment of the extended gold finger pattern according to the thickness of the copper layer on the substrate.
4. The method for manufacturing a gold finger without lead residue according to claim 3, wherein The thickness of the copper layer is 35 - 105 microns, and the corresponding length of the dry film covering the surface of the non-gold plating extension segment is 60 - 140 microns.
5. The method for manufacturing a gold finger without lead residue according to claim 1, characterized in that The axial length of the extended gold finger pattern is 508 - 762 microns longer than the preset length of the target gold finger.
6. The method for manufacturing a gold finger without lead residue according to claim 1, wherein In step S1, the method of substrate pretreatment includes the following steps: S1.1: Stick a dry film on the copper plate after electroless copper plating and electroplating, and obtain the outer layer circuit pattern after exposure and development; S1.2: Outer layer etching. Etch away the copper that is not covered by the dry film; S1.3: Solder mask. Print a solder mask layer on the surface of the copper plate.
7. The method for manufacturing a gold finger without lead residues according to claim 6, characterized in that, When there are other copper surfaces on the copper plate that do not need to be gold plated, use an anti-gold plating dry film to protect the copper surfaces that do not need to be gold plated, and remove the anti-gold plating dry film before step S5.
8. The method for manufacturing a gold finger without lead residue according to claim 1, wherein The substrate is provided with a plurality of board output units, and alignment pads with a diameter of 1 - 3 mm are provided at the four corners of each board output unit.
9. The method for manufacturing a gold finger without lead residues according to claim 1, wherein During the etching process of step S5, a dynamic monitoring device is adopted, and the etching thickness of the copper layer is detected in real time through an optical sensor, and the etching parameters are feedback adjusted.
10. A circuit board, characterized in that, The circuit board is obtained by the gold finger manufacturing method according to any one of claims 1 - 9.