An apparatus for automatically attaching double-sided adhesive tape and a PCB board

Abstract

The application discloses a kind of equipment for automatically pasting double-sided adhesive tape and PCB, including workbench, the upper surface of workbench is erected with several Y-axis linear slide rail modules, PCB positioning module, PCB turnover module and lower cavity chamber are slidably erected on Y-axis linear slide rail module, lifting plate a is arranged in lower cavity chamber, vacuum chuck b is arranged on lifting plate a, double-sided adhesive tape feeding rack is also erected on workbench;During the use of the technical solution, the PCB and double-sided adhesive tape are accurately positioned by the equipment, which facilitates the pasting of double-sided adhesive tape on small PCBs. The operation can be completed automatically by the equipment without manual operation, effectively improving the stability of processing quality and processing efficiency.

Description

Technical Field

[0001] This invention relates to the technical field of double-sided adhesive bonding equipment for PCB boards, specifically to an automatic bonding device for double-sided adhesive and PCB boards. Background Technology

[0002] Double-sided tape is widely used in the production and processing of PCBs (printed circuit boards) to fix components, including batteries and sensor modules, onto the PCB, thus avoiding the use of screws or clips. When double-sided tape is used to fix metal shielding covers on the PCB, it can effectively prevent electromagnetic interference from affecting the circuit. Using double-sided tape between the PCB and the metal casing can effectively provide insulation and shock protection, thereby effectively preventing friction or short circuits with the casing.

[0003] However, in current PCB manufacturing processes, due to the small size of PCBs and the limited amount of double-sided tape used, manual bonding is commonly employed. When using manual bonding, the small size of both the double-sided tape and the PCB makes it difficult to accurately fix the double-sided tape in the appropriate position on the PCB, resulting in poor adhesion. Furthermore, the adhesive side of the double-sided tape easily separates and detaches when the PCB is used later, causing the bonded object to fall off and affecting the proper operation of electronic devices. Therefore, it is necessary to improve and optimize the structure of the equipment used for bonding double-sided tape and PCBs to address these problems in current PCB manufacturing processes. Summary of the Invention

[0004] To solve the above-mentioned technical problems, the present invention provides an automatic device for bonding double-sided tape and PCB board, which has the characteristics of facilitating the precise application of double-sided tape to PCB board and enabling rapid and stable production of PCB board conforming to specifications.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an automatic bonding device for double-sided tape and PCB board, comprising a worktable, wherein a plurality of Y-axis linear slide rail modules are mounted on the upper surface of the worktable, and a PCB board positioning module, a PCB board turnover module, and a lower cavity are slidably mounted on the Y-axis linear slide rail modules and are capable of sliding displacement along the tracks;

[0006] The lower cavity is provided with a lifting plate a, and a vacuum suction cup b is provided on the lifting plate a. The worktable is also provided with a double-sided adhesive feeding rack that is set perpendicular to the setting direction of the Y-axis linear slide rail module.

[0007] A Z-axis lead screw module a is horizontally laid and fixed on the double-sided adhesive feeding rack. A height-adjustable double-sided adhesive rolling assembly is provided on the Z-axis lead screw module a. A Y-axis lead screw module b is horizontally laid and fixed on the surface of the double-sided adhesive feeding rack opposite to the Z-axis lead screw module a. A material conveying assembly for feeding double-sided adhesive is connected to the Y-axis lead screw module b. A material lifting assembly is provided below the material conveying assembly on the worktable.

[0008] One side of the double-sided tape feeding rack is equipped with a PCB board pressurizing upper cavity frame on the workbench. The inner side of the PCB board pressurizing upper cavity frame is connected to a height-adjustable vacuum chamber. A Y-axis lead screw module c is horizontally arranged on one side surface of the PCB board pressurizing upper cavity frame, and an auxiliary suction component is connected to the Y-axis lead screw module c.

[0009] One side of the Y-axis linear slide rail module is also equipped with a positioning and tearing guide rail on the upper surface of the workbench, and a tearing component for tearing double-sided adhesive is slidably mounted on the positioning and tearing guide rail.

[0010] One side of the positioning and tearing guide rail is also provided with a PCB board turnover guide rail on the worktable, and a PCB turnover component is provided on the PCB board turnover guide rail.

[0011] As a preferred technical solution of the automatic bonding equipment for double-sided tape and PCB board of the present invention, the PCB board positioning module includes a sliding seat that can slide and move on the Y-axis linear slide rail module. A rotary cylinder a is connected to the top of the sliding seat, a support plate is connected to the top of the rotary cylinder a, a vacuum suction plate a is provided at the top of the support plate, and a positioning push block a is also provided on the side of the vacuum suction plate a.

[0012] The PCB board turnover module is equipped with an angle adjustment cylinder, and a flipping arm is sleeved on the rotating shaft of the angle adjustment cylinder. A vacuum suction cup h is connected to the rotating arm.

[0013] The bottom of the lower cavity is provided with a horizontal adjustment guide rail a, and the sliding seat is mounted on the Y-axis linear slide rail module and can slide. The lower cavity can slide and adjust its position on the horizontal adjustment guide rail a.

[0014] As a preferred technical solution of the automatic bonding equipment for double-sided tape and PCB board according to the present invention, the double-sided tape rolling assembly includes a connecting frame sleeved on the Z-axis lead screw module a and capable of displacement and sliding along the Z-axis lead screw module a. The bottom end of the connecting frame is provided with a vacuum suction cup c for adsorbing the PCB with double-sided tape. A rolling cylinder is mounted on one end of the connecting frame, and a rolling roller is connected to the output shaft of the rolling cylinder. An adjustable height auxiliary pressure vacuum plate is also provided at one end of the vacuum suction cup c.

[0015] As a preferred technical solution of the automatic double-sided tape and PCB board bonding equipment of the present invention, the material conveying component includes a slider a that slides and is fitted on the Y-axis lead screw module b. A pressing cylinder a is fixedly connected to the slider a. A slider b is connected to the output shaft of the pressing cylinder a via a connecting block. A feeding cylinder is connected to the output shaft of the slider b. A double-sided tape suction block is provided at the output end of the feeding cylinder.

[0016] The material lifting assembly includes a material rack mounted and fixed on a workbench. A lifting motor is located below the material rack, and a material lifting screw is connected to the output shaft of the lifting motor. A sliding and height-adjustable lifting platform is fitted inside the material rack. Double-sided adhesive tape is placed on the lifting platform for lifting. The bottom end of the lifting platform is threadedly connected to the material lifting screw via a connector. When the lifting motor drives the material lifting screw to rotate, it causes the lifting platform to adjust its height, thereby making the double-sided adhesive tape on the lifting platform contact the bottom surface of the double-sided adhesive tape suction block at the bottom of the feeding cylinder.

[0017] As a preferred technical solution of the device for automatically bonding double-sided tape and PCB board according to the present invention, a plurality of protective covers are fitted inside the upper cavity frame of the PCB board pressure, and the vacuum chamber is fitted inside the protective covers and can move up and down. A height adjustment cylinder a is provided on the protective cover via a bracket. The output shaft of the height adjustment cylinder a passes through the protective cover and pushes the vacuum chamber to move up and down. An auxiliary suction cylinder is also provided inside the vacuum chamber. A vacuum suction cup z is connected to the bottom end of the auxiliary suction cylinder. The end of the vacuum chamber can contact the top of the lower cavity and complete the cavity sealing.

[0018] As a preferred technical solution of the device for automatically bonding double-sided tape and PCB board according to the present invention, the auxiliary suction component includes a slider c that can be fitted into the Y-axis lead screw module c and slide to move. The slider c is vertically connected to the Z-axis lead screw module c. The slider of the Z-axis lead screw module c is connected to a height adjustment cylinder c. A vacuum suction plate d is connected to the output end of the height adjustment cylinder c.

[0019] As a preferred technical solution of the automatic double-sided adhesive and PCB board bonding device of the present invention, the film peeling assembly includes a driven slider that is fitted on the positioning film peeling guide rail and can slide along the positioning film peeling guide rail. A vacuum suction plate f is fixed on the driven slider. A rotary cylinder b is provided on one side of the vacuum suction plate f on the positioning film peeling guide rail. A rotary adhesive wheel is connected to the output shaft of the rotary cylinder b through a bracket. A pressing cylinder f is also provided on the bracket. The rotary adhesive wheel is connected to the output shaft of the pressing cylinder f. The rotary adhesive wheel can change position under the push of the output shaft of the pressing cylinder f.

[0020] As a preferred technical solution of the automatic bonding equipment for double-sided tape and PCB board of the present invention, the PCB turnover assembly includes a PCB board lifting frame that is fitted and slidably mounted on the PCB board turnover guide rail. A servo motor is also provided at one end of the PCB board turnover guide rail. The servo motor drives the lead screw inside the PCB board turnover guide rail to rotate. The bottom end of the PCB board lifting frame is sleeved on the lead screw and is displaced by the rotation of the lead screw.

[0021] The PCB board support frame is respectively provided with a vacuum suction plate e and a vacuum suction plate g. The PCB board support frame is also fitted with a number of protruding positioning blocks for limiting the position of the vacuum suction plate e and the vacuum suction plate g.

[0022] As a preferred technical solution of the automatic bonding equipment for double-sided tape and PCB board of the present invention, the worktable is provided with a plurality of Y-axis linear slide rail modules, each Y-axis linear slide rail module is provided with a vacuum chamber above it, and a material collection basket is embedded on one side of each Y-axis linear slide rail module on the worktable. A waste collection basket is embedded on one side of the vacuum suction plate f on the upper surface of the worktable.

[0023] As a preferred technical solution of the automatic double-sided tape and PCB board bonding equipment of the present invention, a shielding frame is also provided on the workbench, and a number of dust removal fans are fixedly installed on the shielding frame. A guide rail a is also provided on one side of the dust removal fan on the shielding frame, and a sliding arm a is slidably provided on the guide rail a. A central control screen is connected to the bottom end of the sliding arm a.

[0024] The shield frame is also equipped with a material inlet, and the sides of the shield frame are all equipped with sealed doors.

[0025] Compared with the prior art, the beneficial effects of the present invention are:

[0026] 1. This technical solution uses equipment to precisely position the PCB board and double-sided adhesive during use, facilitating the application of double-sided adhesive on small PCBs. The process can be automated by the equipment, eliminating the need for manual operation, effectively improving the stability of processing quality and increasing processing efficiency.

[0027] 2. In this technical solution, the PCB board is transferred using a vacuum suction cup without damaging the PCB board. During the bonding process between the PCB board and the double-sided adhesive, a negative pressure vacuum processing environment is set up, and a heating component is also set up in it to facilitate further melting and softening of the contact surface between the double-sided adhesive and the PCB for bonding. In addition, the vacuum environment effectively reduces air bubbles between the PCB and the double-sided adhesive, improving the stability of the double-sided adhesive on the PCB board. Attached Figure Description

[0028] To make the content of this invention easier to understand, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0029] Figure 1 This is a schematic diagram of the structure of the present invention;

[0030] Figure 2 In this invention Figure 1 A schematic diagram of the structure of the covered body;

[0031] Figure 3 In this invention Figure 2 A top-view structural diagram;

[0032] Figure 4 In this invention Figure 1 A schematic diagram of a local structure in the image;

[0033] Figure 5 In this invention Figure 4 A top-view structural diagram;

[0034] Figure 6 This is a schematic diagram of the double-sided tape feeding rack structure in this invention;

[0035] Figure 7 In this invention Figure 6 Another perspective structural diagram;

[0036] Figure 8 This is a schematic diagram of the PCB board pressure upper cavity frame structure in this invention;

[0037] Figure 9 In this invention Figure 8 Another perspective structural diagram;

[0038] Figure 10 In this invention Figure 4 A partial structural diagram;

[0039] Figure 11 In this invention Figure 10 Enlarged structural diagram at point A in the diagram;

[0040] Figure 12 In this invention Figure 10 Enlarged structural diagram at point B in the diagram;

[0041] In the diagram: 1. Workbench; 11. Material collection basket;

[0042] 2. Shielding frame; 21. Dust removal fan; 22. Guide rail a; 23. Sliding arm a; 24. Central control screen; 25. Material feeding port; 26. Sealing door;

[0043] 3. Y-axis linear slide rail module; 31. PCB board positioning module; 311. Sliding seat; 312. Rotary cylinder a; 313. Support plate; 314. Vacuum suction plate a; 315. Positioning push block a; 32. PCB board turnover module; 33. Lower cavity; 331. Horizontal adjustment guide rail a; 332. Lifting plate a; 333. Vacuum suction cup b;

[0044] 4. Double-sided tape feeding rack; 41. Z-axis lead screw module a; 411. Connecting frame; 412. Vacuum suction cup c; 413. Rolling cylinder; 414. Rolling roller; 415. Auxiliary lowering vacuum plate; 42. Y-axis lead screw module b; 421. Slider a; 422. Lowering cylinder a; 423. Slider b; 424. Feeding cylinder; 425. Material rack; 426. Lifting platform; 427. Material lifting lead screw; 428. Lifting motor;

[0045] 5. PCB board pressurizing upper cavity frame; 51. Height adjustment cylinder a; 52. Protective cover; 53. Vacuum chamber; 54. Y-axis lead screw module c; 55. Slider c; 56. Z-axis lead screw module c; 57. Height adjustment cylinder c; 58. Vacuum suction plate d;

[0046] 6. Positioning tear-off guide rail; 61. Driven slider; 62. Vacuum suction plate f; 63. Positioning push block f; 64. Rotary cylinder b; 65. Rotary rubber wheel; 66. Pressing cylinder f; 67. Waste collection basket;

[0047] 7. PCB board turnover guide rail; 71. PCB board lifting frame; 72. Servo motor; 73. Vacuum suction plate e; 74. Vacuum suction plate g; 75. Positioning block. Detailed Implementation

[0048] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0049] Example

[0050] like Figure 1-12 As shown, the device for automatically bonding double-sided tape and PCB board disclosed in this invention includes a workbench 1. Several Y-axis linear slide rail modules 3 are mounted on the upper surface of the workbench 1. In the actual solution provided in this embodiment, two Y-axis linear slide rail modules 3 are laid. The Y-axis linear slide rail modules 3 are all electrically driven. A PCB board positioning module 31, a PCB board turnover module 32, and a lower cavity chamber 33 are slidably mounted on the Y-axis linear slide rail modules 3 and can slide and move along the track.

[0051] A lifting plate a332 is provided in the lower cavity 33, and a vacuum suction cup b333 is provided on the lifting plate a332. In this technical solution, each vacuum suction plate and / or vacuum suction cup is connected to the vacuum negative pressure device through a pipe. Multiple vacuum negative pressure suction holes are evenly opened on the surface of the vacuum suction plate and / or vacuum suction cup.

[0052] The workbench 1 is also equipped with a double-sided tape feeding rack 4, which is set perpendicular to the Y-axis linear slide rail module 3, for feeding double-sided tape. The double-sided tape used in this technical solution is a strip-shaped sheet structure, and the specific size is adjusted according to the needs of the PCB on site.

[0053] A Z-axis lead screw module a41 is horizontally laid and fixed on the double-sided adhesive feeding rack 4. A height-adjustable double-sided adhesive rolling assembly is installed on the Z-axis lead screw module a41. A Y-axis lead screw module b42 is horizontally laid and fixed on the side surface of the double-sided adhesive feeding rack 4 away from the Z-axis lead screw module a41. A material conveying assembly for feeding double-sided adhesive is connected to the Y-axis lead screw module b42. A material lifting assembly is installed below the material conveying assembly on the worktable 1.

[0054] A PCB board pressurizing upper cavity frame 5 is mounted on one side of the double-sided tape feeding rack 4 on the workbench 1. A height-adjustable vacuum chamber 53 is connected to the inside of the PCB board pressurizing upper cavity frame 5. The vacuum chamber 53 is connected to an external vacuum negative pressure device through a pipe. A Y-axis lead screw module c54 is horizontally mounted on one side surface of the PCB board pressurizing upper cavity frame 5. An auxiliary suction component is connected to the Y-axis lead screw module c54. The auxiliary suction component is used to transfer the workpiece.

[0055] On one side of the Y-axis linear slide rail module 3, on the upper surface of the worktable 1, a positioning and tearing guide rail 6 is also mounted, and a tearing component for tearing double-sided adhesive is slidably mounted on the positioning and tearing guide rail 6.

[0056] On one side of the positioning and film-peeling guide rail 6, a PCB board turnover guide rail 7 is also provided on the worktable 1. A PCB turnover component is provided on the PCB board turnover guide rail 7. Through the operation of the above components, the PCB board can be accurately positioned and transported, which facilitates the bonding of double-sided adhesive on the PCB board.

[0057] Specifically, the PCB board positioning module 31 includes a sliding seat 311 that can slide and move on the Y-axis linear slide rail module 3. A rotary cylinder a312 is connected to the top of the sliding seat 311, a support plate 313 is connected to the top of the rotary cylinder a312, a vacuum suction plate a314 is provided at the top of the support plate 313, and a positioning push block a315 is also provided on the side of the vacuum suction plate a314.

[0058] An angle adjustment cylinder is provided on the PCB board turnover module 32. A flipping arm is sleeved on the rotating shaft of the angle adjustment cylinder. A vacuum suction cup h is connected to the rotating arm. In this embodiment, a film-tearing clamp can also be connected to the rotating arm. The film-tearing clamp is driven to rotate by a rotating cylinder installed on the rotating arm. When the film-tearing clamp is rotated to one side of the vacuum suction cup h, the film-tearing clamp runs and tears off the protective film on the bottom surface of the PCB board on the vacuum suction cup h.

[0059] The bottom of the lower cavity 33 is provided with a horizontal adjustment guide rail a331, and the sliding seat 311 is mounted on the Y-axis linear slide rail module 3 and can slide. The lower cavity 33 can slide and adjust its position on the horizontal adjustment guide rail a331. In this embodiment, the horizontal adjustment guide rail a331 at the bottom of the lower cavity 33 is more convenient to adjust the position of the lower cavity 33 and facilitates the precise positioning of the lower cavity 33.

[0060] Specifically, the double-sided adhesive rolling assembly includes a connecting frame 411 sleeved on the Z-axis lead screw module a41 and capable of sliding and displacing along the Z-axis lead screw module a41. The bottom end of the connecting frame 411 is provided with a vacuum suction cup c412 for adsorbing the PCB with double-sided adhesive. A rolling cylinder 413 is mounted on one end of the connecting frame 411. A rolling roller 414 is connected to the output shaft of the rolling cylinder 413. One end of the vacuum suction cup c412 is also provided with an adjustable height auxiliary pressing vacuum plate 415. In this embodiment, the rolling roller 414 is adjusted in height under the push of the rolling cylinder 413 and rolls the PCB with double-sided adhesive, so that the double-sided adhesive strip and the PCB are initially bonded and fused together.

[0061] Specifically, the material conveying assembly includes a slider a421 that slides and moves on the Y-axis lead screw module b42. A pressing cylinder a422 is fixedly connected to the slider a421. A slider b423 is connected to the output shaft of the pressing cylinder a422 via a connecting block. A feeding cylinder 424 is connected to the output shaft of the slider b423. A double-sided adhesive suction block is provided at the output end of the feeding cylinder 424.

[0062] The material lifting assembly includes a material rack 425 fixed on the workbench 1. A lifting motor 428 is installed below the material rack 425, and a material lifting screw 427 is connected to the output shaft of the lifting motor 428. A sliding and height-adjustable lifting platform 426 is fitted inside the material rack 425. Double-sided adhesive is placed on the lifting platform 426 for lifting. The bottom end of the lifting platform 426 is threadedly connected to the material lifting screw 427 through a connector. When the lifting motor 428 drives the material lifting screw 427 to rotate, it drives the lifting platform 426 to adjust its height, thereby making the double-sided adhesive on the lifting platform 426 contact the bottom surface of the double-sided adhesive suction block at the bottom of the feeding cylinder 424. In this embodiment, the material lifting assembly lifts the double-sided adhesive to be processed to a higher height during operation, thereby completing the material feeding. The double-sided adhesive sucked by the negative pressure is transferred to the PCB board by the material conveying assembly.

[0063] Specifically, several protective covers 52 are fitted inside the upper cavity frame 5 of the PCB board pressure. The vacuum chamber 53 is fitted inside the protective cover 52 and can slide up and down. A height adjustment cylinder a51 is installed on the protective cover 52 through a bracket. The output shaft of the height adjustment cylinder a51 passes through the protective cover 52 and pushes the vacuum chamber 53 to move up and down. An auxiliary suction cylinder is also installed inside the vacuum chamber 53. A vacuum suction cup z is connected to the bottom end of the auxiliary suction cylinder. The end of the vacuum chamber 53 can contact the top of the lower cavity 33 and complete the cavity sealing. In this embodiment, in order to avoid air bubbles remaining between the double-sided adhesive and the PCB board bonding contact surface and further improve the bonding stability, a cavity that can be sealed and vacuumed is provided in this technical solution, so that the gas between the air bubbles can be effectively discharged when the double-sided adhesive is bonded to the PCB board.

[0064] Specifically, the auxiliary suction component includes a slider c55 that can slide and move on the Y-axis lead screw module c54. A Z-axis lead screw module c56 is vertically connected to the slider c55. A height adjustment cylinder c57 is connected to the slider of the Z-axis lead screw module c56. A vacuum suction plate d58 is connected to the output end of the height adjustment cylinder c57. In this embodiment, the auxiliary suction component can transfer and transport the bonded PCB board.

[0065] Specifically, the film-peeling assembly includes a driven slider 61 that is fitted onto the positioning film-peeling guide rail 6 and can slide along the positioning film-peeling guide rail 6. A vacuum suction plate f62 is fixedly mounted on the driven slider 61. A rotary cylinder b64 is mounted on one side of the vacuum suction plate f62 on the positioning film-peeling guide rail 6. A rotary rubber wheel 65 is mounted on the output shaft of the rotary cylinder b64 via a bracket. A pressing cylinder f66 is also mounted on the bracket. The rotary rubber wheel 65 is connected to the output shaft of the pressing cylinder f66. The rotary rubber wheel 65 can change position under the push of the output shaft of the pressing cylinder f66 and peel off the cover film on the double-sided adhesive on the PCB board.

[0066] Specifically, the PCB turnover assembly includes a PCB board lifting frame 71 that is fitted and slidably mounted on the PCB board turnover guide rail 7. A servo motor 72 is also provided at one end of the PCB board turnover guide rail 7. The servo motor 72 drives the lead screw inside the PCB board turnover guide rail 7 to rotate. The bottom end of the PCB board lifting frame 71 is sleeved on the lead screw and displaced by the rotation of the lead screw. Vacuum suction plates e73 and g74 are respectively provided on the PCB board lifting frame 71. Several protruding positioning blocks 75 are also fitted and penetrated on the PCB board lifting frame 71 to limit the positioning of the vacuum suction plates e73 and g74.

[0067] Specifically, the workbench 1 is equipped with several Y-axis linear slide rail modules 3, each Y-axis linear slide rail module 3 is equipped with a vacuum chamber 53 above it, and a material collection basket 11 is embedded on one side of each Y-axis linear slide rail module 3 on the workbench 1. A waste collection basket 67 is embedded on one side of the vacuum suction plate f62 on the upper surface of the workbench 1.

[0068] Specifically, the workbench 1 is also equipped with a shield frame 2, and several dust removal fans 21 are fixedly installed on the shield frame 2. A guide rail a22 is also installed on one side of the dust removal fan 21 on the shield frame 2. A sliding arm a23 is slidably installed on the guide rail a22. A central control screen 24 is connected to the bottom end of the sliding arm a23. A material feeding port 25 is also opened on the shield frame 2. Sealing doors 26 are provided on the sides of the shield frame 2 to facilitate the isolation of external dust.

[0069] The working principle and usage process of this invention: In actual use, the shielding frame 2 covers the workbench 1 to seal the components above the workbench 1. The sliding arm a23 slides on the guide rail a22 and adjusts the position of the central control screen 24 in sync. The operator operates the components on the workbench 1 through the central control screen 24 from outside the equipment to process the PCB board.

[0070] During equipment operation, the operator places the PCB board to be processed into the PCB board positioning module 31 above the workbench 1 at the material inlet 25. The vacuum suction plate a314 adsorbs the PCB board during operation. The positioning push block a315 is driven by the drive cylinder below the vacuum suction plate a314 to position and limit the PCB board placed on the vacuum suction plate a314 during operation, so that the PCB board above it maintains accurate and stable positioning. In this technical solution, a rotary cylinder a312 is set below the vacuum suction plate a314. During operation, the rotary cylinder a312 adjusts the angle of the vacuum suction plate a314 to facilitate accurate alignment of the PCB board on the vacuum suction plate a314. The sliding seat 311 slides on the Y-axis linear slide rail module 3 to horizontally transport the workpiece to be processed on the vacuum suction plate a314.

[0071] During the displacement of the PCB board positioning module 31, the material conveying component and the material lifting component operate synchronously.

[0072] During the operation of the material lifting assembly, the lifting motor 428 runs and drives the material lifting screw 427 to rotate, thereby pushing the lifting platform 426 to a higher height. During the height lifting of the lifting platform 426, the double-sided tape placed on it is lifted. When the bottom surface of the feeding cylinder 424 comes into contact with the double-sided tape, it adsorbs the double-sided tape. The height lifting is completed by the pressing cylinder a422. Then the slider a421 slides on the mask frame 2, moving the bottom end of the feeding cylinder 424 to above the PCB board positioning module 31, placing the double-sided tape to be pasted on the PCB board. Under the action of the adhesive, the double-sided tape is initially bonded to the upper surface of the PCB board.

[0073] Then, the PCB positioning module 31 continues to transport the PCB board with double-sided adhesive, i.e., the workpiece. When the workpiece is transported to the bottom of the vacuum chuck c412, the Z-axis lead screw module a41 runs and adjusts the height of the connecting frame 411, pushing the height of the connecting frame 411 down, which drives the height of the vacuum chuck c412 to drop synchronously. The vacuum chuck c412 can apply pressure to the workpiece. The rolling cylinder 413 pushes the height of the rolling roller 414 down, so that the bottom end of the rolling roller 414 contacts the upper surface of the workpiece. The rolling roller 414 applies pressure to the workpiece, so that the double-sided adhesive is tightly bonded to the surface of the PCB.

[0074] The PCB positioning module 31 continues to transport the workpiece to slide on the Y-axis linear slide rail module 3, so that the PCB positioning module 31 is transported to one side of the PCB turnover module 32. The vacuum suction cup h connected to the rotating arm of the PCB turnover module 32 is flipped to above the PCB positioning module 31 under the action of the rotating arm. At this time, the vacuum of the vacuum suction plate a314 is released, and the workpiece on the PCB positioning module 31 is adsorbed onto the vacuum suction cup h through the vacuum suction cup h. At the bottom of the rotating arm, a film tearing clamp is also connected to the rotating cylinder. The film tearing clamp can be flipped to one side of the vacuum suction cup h through the rotating cylinder. The film tearing clamp is used to tear off the film on the bottom surface of the PCB board. When the film tearing clamp is flipped again by the rotating cylinder, it opens and releases the film. At this time, the film falls to the material collection basket 11 below and is collected.

[0075] When the PCB board turnover module 32 is conveyed to the area below the PCB board pressurizing upper cavity frame 5, the height adjustment cylinder a51 operates and pushes the vacuum chamber 53 to sink. The auxiliary suction cylinder set inside the vacuum chamber 53 sinks synchronously, so that the bottom end of the vacuum suction cup z connected to its bottom end contacts the upper surface of the workpiece. At this time, the vacuum suction cup z sucks up the workpiece with negative pressure. Then, the height adjustment cylinder a51 drives the vacuum chamber 53 to rise. At this time, the bottom surface of the workpiece separates from the upper surface of the PCB board turnover module 32.

[0076] Then the PCB board turnover module 32 slides toward the PCB board positioning module 31, and the lower cavity chamber 33 slides toward the bottom end of the PCB board pressure upper cavity frame 5 through the horizontal adjustment guide rail a331, so that the lower cavity chamber 33 is directly below the PCB board pressure upper cavity frame 5. Then the height adjustment cylinder a51 continues to drive the vacuum chamber 53 to sink, so that the vacuum chamber 53 and the lower cavity chamber 33 remain in contact and are sealed.

[0077] The lower chamber 33 is connected to the external vacuum negative pressure device through a pipe. The vacuum negative pressure device evacuates the air between the lower chamber 33 and the vacuum chamber 53, so that there is no air in the gap area between the double-sided tape and the PCB board. When the auxiliary suction cylinder drives the vacuum suction cup z and the workpiece is pressed down and sinks, the workpiece is tightly placed on the lifting plate a332. When the vacuum suction cup b333 is running, it can keep the workpiece to be processed stable above it.

[0078] A heating plate can be installed below the lifting plate a332 and above the vacuum suction cup z. The heating plate contains a heating resistance wire. When the heating resistance wire is energized, the heating plate is heated, and the heat is transferred to the lifting plate a332, the vacuum suction cup b333, and the vacuum suction cup z, and then to the PCB board and the double-sided tape. Under the action of high temperature, the contact surface between the double-sided tape and the PCB board melts slightly, so that the contact surface maintains good adhesion. At the same time, the sealed environment formed by the lower cavity chamber 33 and the vacuum chamber 53 is evacuated by the external vacuum negative pressure device, so that there are no air bubbles on the contact surface between the double-sided tape and the PCB board, further improving the adhesion stability between the double-sided tape and the PCB board.

[0079] Once the double-sided adhesive on the PCB board is firmly bonded, the vacuum is released, and the vacuum chamber 53 separates from the lower chamber 33. The workpiece is placed on the upper surface of the vacuum chuck b333. The slider c55 slides on the Y-axis lead screw module c54 and adjusts its position, so that the vacuum suction plate d58 is transported above the vacuum chuck b333. When the Z-axis lead screw module c56 runs, it adjusts the height of the height adjustment cylinder c57. When the height adjustment cylinder c57 runs, it adjusts the height of the vacuum suction plate d58. When the vacuum suction plate d58 contacts the surface of the workpiece, the vacuum chuck b333 makes negative pressure contact, and the workpiece is vacuumed by the vacuum suction plate d58. The position of the vacuum suction plate d58 with the workpiece is adjusted synchronously by the displacement of the slider c55 on the Y-axis lead screw module c54.

[0080] When the vacuum suction plate d58 is transported above the PCB board lifting frame 71, the Z-axis lead screw module c56, in conjunction with the height adjustment cylinder c57, causes the vacuum suction plate d58 to place the workpiece on the vacuum suction plate e73 and / or the vacuum suction plate g74. The vacuum suction plates e73 and g74 hold the workpiece in a vacuum, maintaining stable adsorption. The design drawings of this technical solution disclose two Y-axis linear slide rail modules 3. Therefore, the vacuum suction plate e73 and the vacuum suction plate g74 are designed simultaneously on the PCB board turnover guide rail 7 to hold the processed workpiece, i.e., the PCB board with double-sided adhesive.

[0081] After the processed workpiece is placed on the PCB board lifting frame 71, the servo motor 72 runs and drives the PCB board lifting frame 71 to slide on the PCB board turnover guide rail 7 and transport the PCB board lifting frame 71 to the material feeding port 25. The staff can then take the processed workpiece from the material feeding port 25.

[0082] In this technical solution, a film-peeling component for peeling double-sided adhesive is also slidably provided on the positioning film-peeling guide rail 6. When it is necessary to peel off the covering film on the double-sided adhesive during the processing; that is, after the double-sided adhesive is pressed by the rolling roller 414, the vacuum suction cup c412 still tightly adsorbs the workpiece. The Z-axis lead screw module a41 drives the connecting frame 411 and the vacuum suction cup c412 to move, so that the vacuum suction cup c412 is transported above the positioning film-peeling guide rail 6. The driven slider 61 slides on the positioning film-peeling guide rail 6 and makes the vacuum suction plate f62 directly above the vacuum suction cup c412. The Z-axis lead screw module a41 drives the connecting frame 411 and the vacuum suction cup c412 to sink, so that the PCB board with double-sided adhesive, i.e., the workpiece, is placed on the vacuum suction plate f62.

[0083] Positioning push blocks f63 for positioning are also provided on both sides of the vacuum suction plate f62. The workpiece is placed on the vacuum suction plate f62 and fixed by vacuum adsorption. When the rotary cylinder b64 runs, it drives the bracket on the output shaft and the rotary rubber wheel 65 to rotate together, so that the rotary rubber wheel 65 contacts the upper surface of the double-sided adhesive. During this process, the pressing cylinder f66 can push its telescopic end to extend and simultaneously push the rotary rubber wheel 65 down, so that the rotary rubber wheel 65 contacts the surface of the double-sided adhesive. During the operation of the rotary rubber wheel 65, it rotates to peel off the covering film of the double-sided adhesive. After peeling, the covering film is blown into the waste collection basket 67 through the air pipe provided inside the workbench 1 and collected.

[0084] After the double-sided adhesive film on the workpiece on the upper surface of the vacuum suction plate f62 is peeled off, it continues to be adsorbed by the vacuum suction cup c412 and transferred to the upper surface of the vacuum suction plate a314 by the vacuum suction cup c412, and the above processing operation continues.

[0085] The above description is merely a preferred embodiment of the present invention and is not intended to further limit the present invention. All equivalent changes made based on the description and drawings of the present invention are within the protection scope of the present invention.

Claims

1. An automatic bonding device for double-sided adhesive tape and PCB board, characterized in that: The system includes a workbench (1), on the upper surface of which are mounted several Y-axis linear slide rail modules (3). On the Y-axis linear slide rail modules (3), there are PCB board positioning modules (31), PCB board turnover modules (32), and lower cavity chambers (33) that can slide and move along the tracks. The PCB board positioning module (31) includes a sliding seat (311) that can slide on the Y-axis linear slide rail module (3). A rotary cylinder a (312) is connected to the top of the sliding seat (311). A support plate (313) is connected to the top of the rotary cylinder a (312). A vacuum suction plate a (314) is provided at the top of the support plate (313). A positioning push block a (315) is also provided on the side of the vacuum suction plate a (314). The lower cavity (33) is provided with a lifting plate a (332), and a vacuum suction cup b (333) is provided on the lifting plate a (332). The worktable (1) is also provided with a double-sided adhesive feeding rack (4) set in a direction perpendicular to the Y-axis linear slide rail module (3). The double-sided adhesive feeding rack (4) is horizontally laid and fixed with a Z-axis screw module a (41). The Z-axis screw module a (41) is equipped with a height-adjustable double-sided adhesive rolling assembly. The double-sided adhesive feeding rack (4) is horizontally laid and fixed with a Y-axis screw module b (42) on the side surface away from the Z-axis screw module a (41). The Y-axis screw module b (42) is connected to a material conveying assembly for feeding double-sided adhesive. Below the material conveying assembly is a material lifting assembly located on the workbench (1). The material lifting assembly includes a material rack (425) mounted and fixed on a workbench (1). A lifting motor (428) is provided below the material rack (425). A material lifting screw (427) is connected to the output shaft of the lifting motor (428). A sliding and height-adjustable lifting platform (426) is fitted inside the material rack (425). Double-sided tape is placed on the lifting platform (426) for lifting. The bottom end of the lifting platform (426) is threadedly connected to the material lifting screw (427) through a connector. When the lifting motor (428) drives the material lifting screw (427) to rotate, it drives the lifting platform (426) to adjust its height, thereby making the double-sided tape on the lifting platform (426) contact the bottom surface of the double-sided tape suction block at the bottom of the feeding cylinder (424). One side of the double-sided tape feeding rack (4) is mounted on the workbench (1) with a PCB board pressurizing upper cavity rack (5). The inner side of the PCB board pressurizing upper cavity rack (5) is connected to a height-adjustable vacuum chamber (53). A Y-axis lead screw module c (54) is horizontally mounted on one side surface of the PCB board pressurizing upper cavity rack (5). An auxiliary suction component is connected to the Y-axis lead screw module c (54). The Y-axis linear slide rail module (3) is also provided with a positioning tearing guide rail (6) on the upper surface of the workbench (1) on one side. A tearing component for tearing double-sided adhesive is slidably provided on the positioning tearing guide rail (6). One side of the positioning tear-off guide rail (6) is located on the workbench (1) and a PCB board turnover guide rail (7) is also provided, and a PCB turnover component is provided on the PCB board turnover guide rail (7).

2. The equipment for automatically bonding double-sided adhesive and PCB board according to claim 1, characterized in that: An angle adjustment cylinder is provided on the PCB board turnover module (32). A flipping arm is sleeved on the rotating shaft of the angle adjustment cylinder, and a vacuum suction cup h is connected to the rotating arm. The bottom end of the lower cavity (33) is provided with a horizontal adjustment guide rail a (331), and the sliding seat (311) is slidable on the Y-axis linear slide rail module (3). The lower cavity (33) can slide and adjust its position on the horizontal adjustment guide rail a (331).

3. The equipment for automatically bonding double-sided adhesive tape and PCB board according to claim 1, characterized in that: The double-sided adhesive rolling assembly includes a connecting frame (411) sleeved on the Z-axis lead screw module a (41) and capable of sliding along the Z-axis lead screw module a (41) in a set direction. The bottom end of the connecting frame (411) is provided with a vacuum suction cup c (412) for adsorbing the PCB with double-sided adhesive. A rolling cylinder (413) is mounted on one end of the connecting frame (411). A rolling roller (414) is connected to the output shaft of the rolling cylinder (413). An adjustable height auxiliary pressure vacuum plate (415) is also provided on one end of the vacuum suction cup c (412).

4. The equipment for automatically bonding double-sided adhesive and PCB board according to claim 1, characterized in that: The material conveying assembly includes a slider a (421) that slides and displaces on a Y-axis lead screw module b (42). A pressing cylinder a (422) is fixedly connected to the slider a (421). A slider b (423) is connected to the output shaft of the pressing cylinder a (422) via a connecting block. A feeding cylinder (424) is connected to the output shaft of the slider b (423). A double-sided adhesive suction block is provided on the output end of the feeding cylinder (424).

5. The equipment for automatically bonding double-sided adhesive and PCB board according to claim 1, characterized in that: The inner side of the PCB board pressurized upper cavity frame (5) is fitted with several protective covers (52). The vacuum chamber (53) is fitted inside the protective cover (52) and can slide up and down. The protective cover (52) is equipped with a height adjustment cylinder a (51) through a bracket. The output shaft of the height adjustment cylinder a (51) passes through the protective cover (52) and pushes the vacuum chamber (53) to move up and down. The vacuum chamber (53) is also equipped with an auxiliary suction cylinder. The bottom end of the auxiliary suction cylinder is connected to a vacuum suction cup z. The end of the vacuum chamber (53) can contact the top of the lower cavity chamber (33) and complete the cavity sealing.

6. The equipment for automatically bonding double-sided adhesive and PCB board according to claim 1, characterized in that: The auxiliary suction component includes a slider c (55) that can be fitted into the Y-axis lead screw module c (54) and slide. A Z-axis lead screw module c (56) is vertically connected to the slider c (55). A height adjustment cylinder c (57) is connected to the slider of the Z-axis lead screw module c (56). A vacuum suction plate d (58) is connected to the output end of the height adjustment cylinder c (57).

7. The equipment for automatically bonding double-sided adhesive tape and PCB board according to claim 1, characterized in that: The film-tearing assembly includes a driven slider (61) that is fitted onto the positioning film-tearing guide rail (6) and can slide along the positioning film-tearing guide rail (6). A vacuum suction plate f (62) is fixedly provided on the driven slider (61). A rotary cylinder b (64) is provided on one side of the vacuum suction plate f (62) on the positioning film-tearing guide rail (6). A rotary rubber wheel (65) is connected to the output shaft of the rotary cylinder b (64) via a bracket. A pressing cylinder f (66) is also provided on the bracket. The rotary rubber wheel (65) is connected to the output shaft of the pressing cylinder f (66). The rotary rubber wheel (65) can change position under the push of the output shaft of the pressing cylinder f (66).

8. The equipment for automatically bonding double-sided adhesive and PCB board according to claim 1, characterized in that: The PCB turnover assembly includes a PCB board lifting frame (71) that is fitted and slidably mounted on a PCB board turnover guide rail (7). A servo motor (72) is also provided at one end of the PCB board turnover guide rail (7). The servo motor (72) drives the lead screw inside the PCB board turnover guide rail (7) to rotate. The bottom end of the PCB board lifting frame (71) is sleeved on the lead screw and is displaced by the rotation of the lead screw. The PCB board support frame (71) is provided with a vacuum suction plate e (73) and a vacuum suction plate g (74). The PCB board support frame (71) is also fitted with a number of protruding positioning blocks (75) for limiting the vacuum suction plate e (73) and the vacuum suction plate g (74).

9. The equipment for automatically bonding double-sided adhesive and PCB board according to claim 7, characterized in that: The workbench (1) is provided with several Y-axis linear slide rail modules (3). Each Y-axis linear slide rail module (3) is provided with a vacuum chamber (53) above it. Each Y-axis linear slide rail module (3) is provided with a material collection basket (11) on one side of the workbench (1). The vacuum suction plate f (62) is provided with a waste collection basket (67) on one side of the upper surface of the workbench (1).

10. The equipment for automatically bonding double-sided adhesive and PCB board according to claim 1, characterized in that: The workbench (1) is also provided with a shield frame (2), and a number of dust removal fans (21) are fixedly installed on the shield frame (2). A guide rail (22) is also provided on one side of the dust removal fan (21) on the shield frame (2). A sliding arm (23) is slidably provided on the guide rail (22), and a central control screen (24) is connected to the bottom end of the sliding arm (23). The shield frame (2) is also provided with a material feeding port (25), and the sides of the shield frame (2) are provided with sealing doors (26).

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