Device displacement adjusting method and device

Abstract

The invention provides a device displacement adjusting device and method, and the device comprises a heat conduction structural member which is used for bearing a device; the temperature control device is used for controlling the heating or cooling of the heat conduction structural member to deform so as to drive the device to move; and the flexible heat conduction part is arranged between the heat conduction structural member and the temperature control device and is used for transmitting the temperature generated by the temperature control device to the heat conduction structural member. According to the technical scheme, device displacement can be adjusted, and alignment of parts in a precise instrument is guaranteed.

Description

Technical Field

[0001] This application relates to the field of instruments, and particularly to a method and device for adjusting the displacement of a device. Background Art

[0002] During the assembly or operation of precision instruments or equipment, there may be a situation where the device is offset. For example, in some precision equipment, the alignment and assembly of the device are completed in a non-operating state, but the thermal deformation after the equipment starts working may cause the position of the device to shift, thereby affecting the normal operation of the instrument. Summary of the Invention

[0003] This application provides a method and device for adjusting the displacement of a device, which can adjust the displacement of the device and ensure the alignment of parts in a precision instrument.

[0004] In a first aspect, a device displacement adjustment device is provided. The device includes: a heat-conducting structural member for carrying the device; a temperature control device for controlling the heat-conducting structural member to heat up or cool down so as to deform and drive the device to move; and a flexible heat-conducting component disposed between the heat-conducting structural member and the temperature control device for transferring the temperature generated by the temperature control device to the heat-conducting structural member.

[0005] This application provides a device displacement adjustment device. By adjusting the temperature of different regions of the heat-conducting structural member through the temperature control device, the resulting temperature difference causes thermal deformation, generating relative movement inside the heat-conducting structural member and driving the device carried on the heat-conducting structural member to move.

[0006] The user can, according to the displacement adjustment requirement, connect the temperature control device to a specific region of the heat-conducting structural member through the flexible heat-conducting component, causing the heat-conducting structural member to move in a specific direction inside, driving the device carried on the heat-conducting structural member to move directionally, and then moving the device to the required position.

[0007] The heat-conducting structural member is usually composed of a metal structure with good heat conductivity, such as copper, aluminum alloy, etc.

[0008] The flexible heat-conducting component is used to solve the problem that when rigidly fixed, the thermal deformation of the heat-conducting structural member is likely to cause spatial warping, and thus the displacement cannot be adjusted directionally based on the thermal deformation. While meeting the heat-conducting requirement, when the temperature of the heat-conducting structural member changes, the flexible heat-conducting component will not generate significant thermal stress on the heat-conducting structural member and its support.

[0009] The flexible heat-conducting component is a type of material or component with good heat-conducting performance and bendability and plasticity. Exemplarily, the flexible heat-conducting component can be a film, stranded wire, braided wire, filament, etc. made of high heat-conducting materials such as copper, aluminum, graphene, etc.

[0010] The temperature control device includes a heating device or a thermoelectric cooler (TEC).

[0011] It should be understood that the present application does not limit the number of the flexible heat-conducting component and the temperature control device in the device displacement adjustment device, and there can be one or more of them.

[0012] Combined with the first aspect, in some implementation manners of the first aspect, the device further includes a heat-conducting block, which is respectively connected to the temperature control device and the flexible heat-conducting component, and is used to transfer the temperature generated by the temperature control device to the flexible heat-conducting component.

[0013] The temperature generated by the temperature control device can be transferred to the heat-conducting block, and the heat-conducting block further transfers the temperature to the flexible heat-conducting component, and finally the flexible heat-conducting component transfers the temperature to the heat-conducting structural member.

[0014] The heat-conducting block has a high thermal conductivity, can effectively conduct heat, and improve the heat dissipation efficiency. At the same time, the heat-conducting block can be shaped according to the shape and size of the contact surface to fill the irregular gaps and ensure good contact and heat conduction.

[0015] The present application provides a device displacement adjustment device, which can transfer the temperature generated by the temperature control device to the flexible heat-conducting component through the heat-conducting block, and further transfer the temperature to the heat-conducting structural member, improving the heat conduction efficiency.

[0016] Combined with the first aspect, in some implementation manners of the first aspect, the temperature control device is located in the heat-conducting block or under the heat-conducting block.

[0017] Optionally, the temperature control device can be located under the heat-conducting block or in the heat-conducting block, for example, in the middle, upper or lower part of the heat-conducting block.

[0018] The present application provides a device displacement adjustment device, and the temperature control device has various setting manners, improving the flexibility of the device setting manners.

[0019] Combined with the first aspect, in some implementation manners of the first aspect, the device further includes a heat sink, which is located under the heat-conducting block or under the temperature control device.

[0020] In a possible implementation manner, the temperature controller can be located between the heat-conducting block and the heat sink.

[0021] The temperature of the heat sink does not change significantly with the change of the magnitude of the thermal energy transferred to it. It can be the atmosphere, or a radiator, a water-cooling plate, a main structural member, an equipment housing, etc.

[0022] The present application provides a device displacement adjustment device, which can set a heat sink under the heat conducting block or under the temperature control device to improve the thermal stability of the device.

[0023] In combination with the first aspect, in some implementation manners of the first aspect, the device further includes a temperature sensor disposed on the heat conducting structural member for measuring the temperature of a local part of the heat conducting structural member.

[0024] The temperature sensor includes but is not limited to a thermistor, a thermocouple, a thermal resistor, an infrared temperature sensor or a silicon-based temperature sensor.

[0025] The temperature sensor can be disposed in a target area of the heat conducting structural member for accurately measuring the temperature of the target area. The target area is an area selected in the heat conducting structural member for temperature control. Optionally, the temperature sensor can also be disposed on the heat conducting block for measuring the temperature of the heat conducting block.

[0026] The present application provides a device displacement adjustment device, which can obtain the temperature of the target area of the heat conducting structural member through the temperature sensor, and then change the temperature of the target area through the temperature control device. The temperature difference generated therefrom causes thermal deformation, resulting in relative movement inside the heat conducting structural member, driving the device carried on the heat conducting structural member to move.

[0027] In combination with the first aspect, in some implementation manners of the first aspect, the device is fixed at the central position of the heat conducting structural member.

[0028] The present application provides a device displacement adjustment device, which adjusts the temperature of different areas of the heat conducting structural member through the temperature control device. The temperature difference generated therefrom causes thermal deformation, resulting in relative movement at the central position of the heat conducting structural member, driving the device fixed on the heat conducting structural member to move.

[0029] In combination with the first aspect, in some implementation manners of the first aspect, it further includes a bracket connected to the heat conducting structural member for supporting the heat conducting structural member.

[0030] The bracket is used to support the heat conducting structural member and the device to be adjusted thereon. To reduce the influence of the bracket on the heat conducting structural member, that is, to avoid irregular deformation warping and displacement of the heat conducting structural member after heating, the bracket can be designed with a symmetric structure, and the fixation between the bracket and the heat conducting structural member can also be selected to adopt symmetric constraints.

[0031] Optionally, the bracket can also be a part of the heat conducting structural member. For example, it can be two support feet at both ends of the heat conducting structural member, as long as it can have a supporting effect. The specific implementation manner should not be construed as a limitation to the present application.

[0032] In combination with the first aspect, in some implementations of the first aspect, the brackets are symmetrically arranged on both sides of the heat-conducting structural member.

[0033] This application provides a device displacement adjustment device. Through the symmetrically designed brackets, the heat-conducting structural member can be deformed in a specific direction while reducing the possibility of torsional deformation.

[0034] In a second aspect, a device displacement adjustment method is provided, which is applied to a device displacement adjustment device. The device displacement adjustment device includes a heat-conducting structural member, a temperature control device, and a flexible heat-conducting component. The method includes: obtaining the target temperature of a target area and the first temperature of the target area at a first moment, where the target area is a part of the heat-conducting structural member; determining a first temperature difference, where the first temperature difference is the difference between the target temperature and the first temperature; controlling the temperature control device to heat or cool according to the first temperature difference, and the temperature obtained by heating or cooling is used to be transmitted to the target area of the heat-conducting structural member through the flexible heat-conducting component, controlling the target area to heat up or cool down so as to deform, thereby driving the device to move, and the device is carried by the heat-conducting structural member.

[0035] The first temperature of the target area at the first moment can be the current temperature of the target area obtained by a temperature sensor. The target area is the area in the heat-conducting structural member that is selected for temperature control.

[0036] Exemplarily, the first temperature is Ta, the target temperature is TA, and the first temperature difference T1 = TA - Ta. If T1 is positive, it means that the current temperature of the target area has not reached the target temperature, and the temperature control device needs to be controlled to heat; if T1 is negative, it means that the current temperature of the target area has exceeded the target temperature, and the temperature control device needs to be controlled to cool; if T1 is 0, it means that the current temperature of the target area just reaches the target temperature.

[0037] This application provides a device displacement adjustment method. The temperature of different areas of the heat-conducting structural member can be adjusted by a temperature control device, and the resulting temperature difference causes thermal deformation, resulting in relative movement inside the heat-conducting structural member, driving the device carried on the heat-conducting structural member to move.

[0038] In a third aspect, an embodiment of this application provides a device displacement adjustment system. The device displacement adjustment system includes a device to be adjusted and the device displacement adjustment device described in the first aspect or any possible implementation of the first aspect. The device to be adjusted is carried by the device displacement adjustment device, and the device displacement adjustment device is used to drive the device to be adjusted to move.

[0039] Fourthly, an embodiment of the present application provides a computer device, which includes a processor for coupling with a memory, reading and executing instructions and / or program codes in the memory to execute the implementation manners of the second aspect.

[0040] Fifthly, an embodiment of the present application provides a computer-readable storage medium storing computer program codes, which, when running on a computer, cause the computer to execute the implementation manners of the second aspect.

[0041] Sixthly, an embodiment of the present application provides a computer program product, which includes computer program codes, which, when running on a computer, cause the computer to execute the implementation manners of the second aspect. Description of the Drawings

[0042] Figure 1 It is a schematic diagram of a scenario of device offset provided by the present application.

[0043] Figure 2 It is a schematic structural diagram of a device displacement adjustment device provided by an embodiment of the present application.

[0044] Figure 3 It is an exemplary flowchart of a device displacement adjustment method provided by an embodiment of the present application.

[0045] Figure 4 It is a schematic diagram of adjusting the central position of a heat conduction structural member by temperature provided by an embodiment of the present application.

[0046] Figure 5 It is a schematic structural diagram of another device displacement adjustment device provided by an embodiment of the present application.

[0047] Figure 6 It is a schematic diagram of the symmetric design of a bracket provided by an embodiment of the present application in a direction parallel to the horizontal plane.

[0048] Figure 7 It is a schematic diagram of the symmetric design of a bracket provided by an embodiment of the present application in a direction perpendicular to the horizontal plane.

[0049] Figure 8 It is a schematic structural diagram of another device displacement adjustment device provided by an embodiment of the present application.

[0050] Figure 9 It is a schematic structural diagram of another device displacement adjustment device provided by an embodiment of the present application.

[0051] Figure 10 It is a schematic structural diagram of a control system provided by an embodiment of the present application.

[0052] Figure 11 It is an exemplary flowchart of another device displacement adjustment method provided by an embodiment of the present application.

[0053] Figure 12 It is a schematic diagram of a thermo-mechanical coupling simulation result provided by an embodiment of the present application.

[0054] Figure 13 It is a schematic diagram of another thermo-mechanical coupling simulation result provided by an embodiment of the present application.

[0055] Figure 14 It is a schematic structural diagram of another device displacement adjustment device provided by an embodiment of the present application.

[0056] Figure 15 It is a schematic diagram of the arrangement of multiple device displacement adjustment devices provided by an embodiment of the present application.

[0057] Figure 16 It is a schematic structural diagram of a computer device provided by an embodiment of the present application.

[0058] Figure 17 It is a schematic structural diagram of another computer device provided by an embodiment of the present application.

[0059] Figure 18 It is a schematic diagram of a computer program product provided by an embodiment of the present application. Detailed implementation manners

[0060] Next, the technical solutions in the embodiments of the present application will be described in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the present application.

[0061] In the embodiments of the present application, words such as "exemplary" and "for example" are used to represent examples, illustrations or explanations. Any embodiment or design solution described as "exemplary" in the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of the word "exemplary" is intended to present concepts in a specific manner.

[0062] The business scenarios described in the embodiments of the present application are for more clearly illustrating the technical solutions in the embodiments of the present application, and do not constitute a limitation on the technical solutions provided by the embodiments of the present application. Those of ordinary skill in the art can know that with the emergence of new business scenarios, the technical solutions provided by the embodiments of the present application are equally applicable to similar technical problems.

[0063] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, statements such as "in one embodiment", "in some embodiments", "in other some embodiments", "in still other embodiments", etc., which appear at different places in this specification, do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized. The terms "comprising", "including", "having" and their variants all mean "including but not limited to", unless otherwise specifically emphasized.

[0064] In this application, "at least one" means one or more, and "a plurality" means two or more. "And / or" describes the association relationship of associated objects and indicates that three relationships can exist. For example, A and / or B can mean: including the case where A exists alone, where A and B exist simultaneously, and where B exists alone, where A and B can be singular or plural. The character " / " generally means that the associated objects before and after are in an "or" relationship. "At least one (item)" or its similar expression means any combination of these items, including any combination of single item (item) or plural items (items). For example, at least one (item) of a, b, or c can mean: a, b, c, a - b, a - c, b - c, or a - b - c, where a, b, c can be single or multiple.

[0065] To facilitate the understanding of the embodiments of the present application, some definitions involved in the present application are briefly described first.

[0066] 1. Heat sink: The temperature does not change significantly with the magnitude of the thermal energy transferred to it, and it can be the atmosphere, or a radiator, a water cooling plate, a main structural member, an equipment housing, etc.

[0067] 2. Thermal stress: The stress generated inside an object due to temperature changes. When the temperature of an object changes, its different parts will undergo dimensional changes due to thermal expansion or thermal contraction, resulting in internal stress.

[0068] Figure 1 It is a schematic diagram of a scenario of device offset provided by the present application.

[0069] During the assembly or operation of precision instruments or equipment, there may be a situation of device offset. For example, during the alignment and assembly of device A and device B of a certain precision equipment in a non - operating state, but the thermal deformation after the equipment starts working may cause the position of device B to shift by a distance of Δx, thus affecting the normal operation of the instrument.

[0070] In the existing technology, temperature control of a device is usually based on a known target temperature to try to ensure temperature stability as much as possible, but displacement adjustment cannot be actively performed. This application provides a device displacement adjustment device and method. By controlling the temperature of different regions of a heat-conducting structural member, a temperature difference is generated, causing the structural member to deform, generating relative movement inside the structural member, and driving the device carried on this structural member to move.

[0071] The device displacement adjustment method and device provided by this application can be applied to aspects such as precision optical systems, imaging devices, precision measurement and detection devices, precision moving parts, precision machining devices, and semiconductor devices.

[0072] Figure 2 It is a schematic structural diagram of a device displacement adjustment device provided by an embodiment of this application.

[0073] This device displacement adjustment device includes a heat-conducting structural member 210, a temperature control device 220, and a flexible heat-conducting component 230.

[0074] The heat-conducting structural member 210 is used to carry the device to be adjusted 240.

[0075] The temperature control device 220 is used to control the heat-conducting structural member 210 to heat up or cool down so as to deform, thereby driving the device to be adjusted 240 to move.

[0076] The flexible heat-conducting component 230 is arranged between the heat-conducting structural member 210 and the temperature control device 220, and is used to transfer the temperature generated by the temperature control device 220 to the heat-conducting structural member 210.

[0077] Figure 3 It is an exemplary flowchart of a device displacement adjustment method provided by an embodiment of this application.

[0078] 310, Obtain the target temperature and the first temperature of the target area.

[0079] Obtain the target temperature of the target area and the first temperature of this target area at the first moment. The target area is a part of the heat-conducting structural member 210. This target area can be the area in the heat-conducting structural member 210 that is selected for temperature control.

[0080] Exemplarily, the first temperature of the target area at the first moment can be the current temperature of the target area obtained by a temperature sensor.

[0081] 320, Determine the first temperature difference.

[0082] The first temperature difference is the difference between the target temperature and the first temperature. Exemplarily, the first temperature is Ta, the target temperature is TA, and the first temperature difference T1 = TA - Ta.

[0083] 330, heat or cool according to the first temperature difference control device.

[0084] Heat or cool according to the first temperature difference control temperature controller device. The temperature obtained by heating or cooling is used to be transmitted to the target area of the heat conduction structure member 210 through the flexible heat conduction member 230, and the temperature of the target area is controlled to rise or fall, so as to cause deformation, thereby driving the device 240 to be adjusted to move.

[0085] If T1 is a positive value, it means that the current temperature of the target area has not reached the target temperature, and it is necessary to heat by controlling the temperature controller device; if T1 is a negative value, it means that the current temperature of the target area has exceeded the target temperature, and it is necessary to cool by controlling the temperature controller device; if T1 is 0, it means that the current temperature of the target area just reaches the target temperature.

[0086] Figure 4 It is a schematic diagram of adjusting the central position of the heat conduction structure member by temperature provided by an embodiment of the present application.

[0087] Based on the thermal deformation generated by the temperature change difference in different regions of the heat conduction structure member, the internal directional movement of the heat conduction structure member can be driven to achieve precise adjustment of the device position. Exemplarily, by adjusting the temperatures T1 and T2 at both ends of the heat conduction structure member, the movement of the central position of the heat conduction structure member can be realized, and then the device to be adjusted fixed on the heat conduction structure member is driven to move. When the temperatures T1 and T2 at both ends of the heat conduction structure member are equal, the center of the heat conduction structure member does not move; when the temperature T1 at one end of the heat conduction structure member is greater than the temperature T2 at the other end, the center of the heat conduction structure member deviates towards the end with the temperature T2; when the temperature T1 at one end of the heat conduction structure member is less than the temperature T2 at the other end, the center of the structure member deviates towards the end with the temperature T1.

[0088] Figure 5 It is a schematic structural diagram of another device displacement adjustment device provided by an embodiment of the present application.

[0089] The device displacement adjustment device includes a heat conduction structure member 510, a bracket 520, a flexible heat conduction member 530, a heat conduction block 540, a temperature controller device 550, a heat sink 560 and a temperature sensor 580. The device 570 to be adjusted is carried by the heat conduction structure member 510, for example, it can be fixed on the heat conduction structure member 510. The device displacement adjustment device and the device 570 to be adjusted can form a device displacement adjustment system.

[0090] The heat conduction structure member 510 is usually composed of a metal structure with good heat conduction, such as copper, aluminum alloy, etc.

[0091] The bracket 520 is used to support the heat-conducting structural member 510 and the regulated device 570 thereon. To reduce the influence of the bracket 520 on the heat-conducting structural member 510, that is, to prevent the heat-conducting structural member 510 from undergoing irregular deformation, warping, and displacement after heating, the bracket 520 can be designed with a symmetric structure, and the fixation between the bracket 520 and the heat-conducting structural member 510 can also be selected to adopt symmetric constraints. Figure 6 It is a schematic diagram of the symmetric design of the bracket provided by the embodiment of the present application in the direction parallel to the horizontal plane. Figure 7 It is a schematic diagram of the symmetric design of the bracket provided by the embodiment of the present application in the direction perpendicular to the horizontal plane. The symmetrically designed bracket can allow the heat-conducting structural member to undergo deformation in a specific direction while reducing the possibility of torsional deformation.

[0092] Optionally, the bracket 520 can also be a part of the heat-conducting structural member 510. For example, it can be two support feet at both ends of the heat-conducting structural member 510, as long as it can have a supporting function. The specific implementation method should not be construed as a limitation to the present application. The bracket 520 adopting a symmetric structure is only one possible implementation method, and the asymmetric structure should also be within the protection scope of the present application.

[0093] The flexible heat-conducting component 530 is a type of material or component with good heat-conducting performance and bendability and plasticity. Exemplarily, the flexible heat-conducting component 530 can be a film, stranded wire, braided wire, filament, etc. made of high heat-conducting materials such as copper, aluminum, and graphene.

[0094] The flexible heat-conducting component 530 is used to solve the problem that when the heat-conducting structural member 510 is rigidly fixed, thermal deformation is likely to cause spatial warping, and thus the displacement cannot be directionally adjusted based on thermal deformation. While meeting the heat-conducting requirements, when the temperature of the heat-conducting structural member 510 changes, the flexible heat-conducting component 530 will not generate significant thermal stress on the heat-conducting structural member 510 and its bracket 520.

[0095] The temperature control device 550 can be a heating device or a thermoelectric cooler (TEC). The assembly composed of the temperature control device 550 and the heat-conducting block 540 is fixed on the heat sink 560.

[0096] The temperature of the heat sink 560 does not change significantly with the magnitude of the thermal energy transferred to it. It can be the atmosphere, or a radiator, a water-cooled plate, a main structural member, an equipment housing, etc.

[0097] The regulated device 570 can be fixed on the heat-conducting structural member 510 and can move along with the heat-conducting structural member 510 when the heat-conducting structural member 510 moves.

[0098] The temperature sensor 580 includes, but is not limited to, a thermistor, a thermocouple, a resistance temperature detector, an infrared temperature sensor, or a silicon-based temperature sensor.

[0099] Figure 8 It is a schematic structural diagram of another device displacement adjustment device provided by an embodiment of the present application.

[0100] In addition to Figure 5 being able to be located between the heat conducting block 540 and the heat sink 560 as shown, the temperature control device 550 can also be located in the heat conducting block 540, for example, in the middle, upper, or lower part of the heat conducting block 540.

[0101] Figure 9 It is a schematic structural diagram of another device displacement adjustment device provided by an embodiment of the present application.

[0102] The temperature sensors 580 are usually symmetrically arranged. In addition to Figure 5 being able to be located on the heat conducting structure member 510 as shown, they can also be located on the heat conducting block 540.

[0103] Figure 10 It is a schematic structural diagram of a control system provided by an embodiment of the present application.

[0104] Figure 10 The control system shown includes a temperature control module 800, a temperature sensor 580a, a temperature sensor 580b, a temperature control device 550a, and a temperature control device 550b. The temperature sensors 580a and 580b are respectively the temperature sensors 580 located at both ends of the heat conducting structure member 510. The temperature control devices 550a and 550b are respectively the temperature control devices 550 located on both sides of the heat conducting structure member 510. The temperature control module 800 can obtain the temperatures in the areas where the temperature sensors 580a and 580b are located, and by comparing with the target temperature, control the temperature control devices 550a and 550b to adjust the temperature of the heat conducting block 540, thereby changing the temperature of the target area in the heat conducting structure member 510.

[0105] Figure 11 It is an exemplary flowchart of another device displacement adjustment method provided by an embodiment of the present application.

[0106] 1110. Compare the target temperature with the sensor temperature.

[0107] Region 1 includes the area in the heat conducting structure member 510 where the temperature sensor 580a is located, and region 2 includes the area in the heat conducting structure member 510 where the temperature sensor 580b is located. The target temperature of region 1 is TA, and the target temperature of region 2 is TB.

[0108] Compare the temperature Ta of the temperature sensor 580a with the target temperature TA of area 1, and calculate the difference T1 = TA - Ta. Compare the temperature Tb of the temperature sensor 580b with the target temperature TB of area 2, and calculate the difference T2 = TB - Tb.

[0109] 1120, adjust the temperature through the temperature control device.

[0110] If T1 is positive, it means that the current temperature of area 1 has not reached the target temperature, and heating is required by controlling the temperature control device 550a; if T1 is negative, it means that the current temperature of area 1 has exceeded the target temperature, and cooling is required by controlling the temperature control device 550a; if T1 is 0, it means that the current temperature of area 1 just reaches the target temperature.

[0111] If T2 is positive, it means that the current temperature of area 2 has not reached the target temperature, and heating is required by controlling the temperature control device 550b; if T2 is negative, it means that the current temperature of area 2 has exceeded the target temperature, and cooling is required by controlling the temperature control device 550b; if T2 is 0, it means that the current temperature of area 2 just reaches the target temperature.

[0112] Exemplarily, the temperature of the side heat conducting block 540 can be adjusted by changing the power of the heater or TEC, and then the temperatures of area 1 and area 2 in the heat conducting structure 510 can be changed. When there is a temperature difference between area 1 and area 2 in the heat conducting structure 510, the resulting difference in thermal deformation will cause an offset inside the heat conducting structure 510 (such as the central position), and then drive the regulated device 570 fixed on the heat conducting structure 510 to move directionally.

[0113] 1130, re - compare the target temperature and the sensor temperature.

[0114] After adjusting the temperature through the temperature control device 550a, re - compare the temperature Ta of the temperature sensor 580a with the target temperature TA of area 1, and calculate the difference T1 = TA - Ta. Continuously adjust the temperature through the temperature control device 550a until the temperature Ta of area 1 reaches the target temperature TA.

[0115] After adjusting the temperature through the temperature control device 550b, re - compare the temperature Tb of the temperature sensor 580b with the target temperature TB of area 2, and calculate the difference T2 = TB - Tb. Continuously adjust the temperature through the temperature control device 550b until the temperature Tb of area 2 reaches the target temperature TB.

[0116] It should be understood that if the temperature Ta in the adjustment area 1 reaches the target temperature TA and the temperature Tb in the adjustment area 2 reaches the target temperature TB, and the device to be adjusted does not reach the ideal position, the target temperature TA and the target temperature TB can be reset, and the temperatures of the area 1 and the area 2 can continue to be adjusted through the temperature control device 550a and the temperature control device 550b until the device to be adjusted reaches the ideal position. The target temperature TA and the target temperature TB when the device to be adjusted reaches the ideal position can be used as temperature control parameters. By controlling the temperature control device 550a, the temperature of the area 1 can be kept at the temperature control parameter TA all the time, and by controlling the temperature control device 550b, the temperature of the area 2 can be kept at the temperature control parameter TB all the time, so that the device to be adjusted is kept at the ideal position without moving.

[0117] 1140, adjust the temperature by the temperature difference of the sensor.

[0118] Optionally, in a possible implementation, the temperature of the area 2 can also be adjusted according to the temperature Ta of the temperature sensor 580a, and the temperature of the area 1 can be adjusted according to the temperature Tb of the temperature sensor 580b. The thermal deformation caused by the temperature difference between the area 1 and the area 2 in the heat conduction structure 510 will cause the internal part (such as the central position) of the heat conduction structure 510 to shift, and then can drive the device 570 to be adjusted fixed on the heat conduction structure 510 to move in a specific direction.

[0119] Figure 12 and Figure 13 is a schematic diagram of the thermal-mechanical coupling simulation result provided by the embodiment of the present application, showing the offset phenomenon of the central position of the heat conduction structure 510 affected by the temperature change. Figure 12 is a schematic diagram of the left shift of the central position when the temperature at the left end of the heat conduction structure 510 is lower than the temperature at the right end. Figure 13 is a schematic diagram of the right shift of the central position when the temperature at the right end of the heat conduction structure 510 is lower than the temperature at the left end.

[0120] Figure 14 is a schematic structural diagram of another device displacement adjustment device provided by the embodiment of the present application.

[0121] This device displacement adjustment device is similar to Figure 5 the device displacement adjustment device shown, the difference is that flexible heat conduction components 530, heat conduction blocks 540 and temperature control devices 550 are connected to the upper, lower, left and right sides of the heat conduction structure 510, so as to be able to control the central position of the heat conduction structure 510 to move in four directions, and then drive the device 570 to be adjusted fixed on the heat conduction structure 510 to move in four directions.

[0122] It should be understood that the number and positions of the flexible heat-conducting components 530, heat-conducting blocks 540, and temperature control devices 550 connected to the periphery of the heat-conducting structure 510 can be set according to actual requirements. The number can be from 1 to N, where N is an integer greater than 1. The flexible heat-conducting components 530, heat-conducting blocks 540, and temperature control devices 550 at different positions can drive the regulated device 570 fixed on the heat-conducting structure 510 to move in different directions.

[0123] Figure 15 is a schematic diagram of the setting of a multi-device displacement adjustment device provided by an embodiment of the present application.

[0124] When there are multiple regulated devices stacked in a direction perpendicular to the horizontal plane, multiple device displacement adjustment devices can be set according to the actual displacement direction requirements to achieve multi-directional displacement adjustment of the multiple regulated devices.

[0125] An embodiment of the present application also provides a computer storage medium, in which program instructions are stored. When the program is executed, it may include some or all of the steps of the device displacement adjustment method in Figure 3 , Figure 11 the corresponding embodiment.

[0126] Figure 16 is a structural example diagram of a computer device 1100 provided by an embodiment of the present application. The computer device 1100 includes an acquisition module 1110 and a temperature control module 800. The acquisition module 1110 and the temperature control module 800 can be implemented by software, hardware, or a combination of both.

[0127] Among them, the acquisition module 1110 is used to acquire the target temperature of the target area and the first temperature of the target area at the first moment, so as to execute Figure 3 310 in the method and Figure 11 1130 in

[0128] The temperature control module 800 is used to determine the first temperature difference and control the temperature control device to heat or cool according to the first temperature difference, and execute Figure 3 and Figure 11 some or all of the steps in the method of

[0129] Figure 17 is a structural example diagram of another computer device 1200 provided by an embodiment of the present application. The computer device 1200 includes a processor 1202, a communication interface 1203, and a memory 1204. An example of the computer device 1200 is a computing device.

[0130] The method disclosed in the embodiments of the present application can be applied to or implemented by the processor 1202. The processor 1202 may be a central processing unit (CPU), or may also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor, etc. During implementation, the steps of the above method may be completed by the integrated logic circuit in the hardware of the processor 1202 or by instructions in the form of software. The various methods, steps, and logic block diagrams disclosed in the embodiments of the present application may be implemented or executed. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc. The steps of the method disclosed in combination with the embodiments of the present application may be directly embodied as being executed and completed by the hardware decoding processor, or may be executed and completed by a combination of the hardware and software modules in the decoding processor.

[0131] The memory 1204 can be a volatile memory, a non-volatile memory, or can include both volatile and non-volatile memories. Among them, the non-volatile memory can be a read-only memory (ROM), a programmable ROM (PROM), an erasable PROM (EPROM), an electrically erasable PROM (EEPROM), or a flash memory. The volatile memory can be a random access memory (RAM), which is used as an external cache. By way of example but not limitation, many forms of RAM are available, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchlink DRAM (SLDRAM), and direct rambus RAM (DRRAM). It should be noted that the memory of the methods described herein is intended to include, but is not limited to, these and any other suitable types of memory.

[0132] Communication can occur between the processor 1202, the memory 1204, and the communication interface 1203 via a bus. Executable code is stored in the memory 1204, and the processor 1202 reads the executable code in the memory 1204 to execute the corresponding method. Other software modules required for other running processes, such as an operating system, can also be included in the memory 1204. The operating system can be LINUX TM , UNIX TM , WINDOWS TM and so on.

[0133] For example, the executable code in the memory 1204 is used to implement Figure 3 and Figure 11 the methods shown. The processor 1202 reads the executable code in the memory 1204 to execute Figure 3 and Figure 11 the methods shown.

[0134] In some embodiments of the present application, the disclosed method may be implemented as computer program instructions encoded in a machine-readable format on a computer-readable storage medium or encoded on other non-transitory media or articles. Figure 18 Schematically shows a conceptual partial view of an example computer program product arranged according to at least some of the embodiments presented herein, the example computer program product including a computer program for performing a computer process on a computing device. In one embodiment, the example computer program product 1300 is provided using a signal-bearing medium 1301. The signal-bearing medium 1301 may include one or more program instructions 1302 which, when run by one or more processors, may provide the functions or portions of the functions described above for Figure 3 and Figure 11 the methods described in the figures. Thus, for example, referring to the embodiments shown in Figure 3 and Figure 11 one or more of the features therein may be carried out by one or more instructions associated with the signal-bearing medium 1301.

[0135] In some examples, the signal-bearing medium 1301 may include a computer-readable medium 1303, such as, but not limited to, a hard disk drive, a compact disc (CD), a digital video disc (DVD), a digital tape, a memory, a read-only memory (ROM), or a random access memory (RAM), and so on. In some embodiments, the signal-bearing medium 1301 may include a computer-recordable medium 1304, such as, but not limited to, a memory, a read / write (R / W) CD, an R / W DVD, and so on. In some embodiments, the signal-bearing medium 1301 may include a communication medium 1305, such as, but not limited to, a digital and / or analog communication medium (e.g., an optical fiber cable, a waveguide, a wired communication link, a wireless communication link, and so on). Thus, for example, the signal-bearing medium 1301 may be conveyed by a wireless form of the communication medium 1305 (e.g., a wireless communication medium compliant with the IEEE 802.11 standard or other transmission protocols). One or more program instructions 1302 may be, for example, computer-executable instructions or logic implementation instructions. In some examples, the foregoing computing device may be configured to provide various operations, functions, or actions in response to the program instructions 1302 communicated to the computing device via one or more of the computer-readable medium 1303, the computer-recordable medium 1304, and / or the communication medium 1305. It should be understood that the arrangements described herein are for illustrative purposes only. Thus, those skilled in the art will understand that other arrangements and other elements (e.g., machines, interfaces, functions, sequences, and groups of functions, etc.) can be used instead, and some elements may be omitted altogether depending on the desired results. Additionally, many of the elements described can be implemented as discrete or distributed components, or as functional entities combined with other components in any suitable combination and location.

[0136] Those of ordinary skill in the art can realize that the units and method steps of the examples described in conjunction with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of this application.

[0137] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the devices and units described above can refer to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0138] In several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed couplings or direct couplings or communication connections to each other can be through some interfaces. The indirect couplings or communication connections of the devices or units can be in electrical, mechanical or other forms.

[0139] The units described as separate components may or may not be physically separated. The components displayed as units may or may not be physical units, that is, they can be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0140] In addition, in each embodiment of the present application, each functional unit can be integrated in a processing unit, or each unit can exist physically alone, or two or more units can be integrated in one unit.

[0141] If the above functions are implemented in the form of software function units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art or a part of this technical solution can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in each embodiment of the present application. The foregoing storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical discs that can store program codes.

[0142] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present application, and all should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A device displacement adjustment device, characterized in that, Comprising: A heat-conducting structural member for carrying the device; A temperature control device for controlling the heat-conducting structural member to increase or decrease in temperature so as to deform, thereby driving the device to move; A flexible heat-conducting component disposed between the heat-conducting structural member and the temperature control device for transferring the temperature generated by the temperature control device to the heat-conducting structural member.

2. The device according to claim 1, characterized in that, Further comprising: A heat-conducting block respectively connected to the temperature control device and the flexible heat-conducting component for transferring the temperature generated by the temperature control device to the flexible heat-conducting component.

3. The device according to claim 2, characterized in that, The temperature control device is located in or under the heat-conducting block.

4. The device according to claim 2 or 3, characterized in that Further comprising: A heat sink located under the heat-conducting block or under the temperature control device.

5. The device according to any one of claims 1 to 4, characterized in that Further comprising: A temperature sensor disposed on the heat-conducting structural member for measuring the local temperature of the heat-conducting structural member.

6. The device according to any one of claims 1 to 5, characterized in that The device is fixed at the central position of the heat-conducting structural member.

7. The device according to any one of claims 1 to 6, characterized in that Further comprising: A bracket connected to the heat-conducting structural member for supporting the heat-conducting structural member.

8. The device according to claim 7, characterized in that, The brackets are symmetrically arranged on both sides of the heat-conducting structural member.

9. A method for adjusting the displacement of a device, characterized in that, Applied to a device displacement adjustment device, the device displacement adjustment device includes a heat-conducting structural member, a temperature control device and a flexible heat-conducting component, the method comprising: Obtaining a target temperature of a target area and a first temperature of the target area at a first moment, the target area being a part of the heat-conducting structural member; Determining a first temperature difference, the first temperature difference being the difference between the target temperature and the first temperature; Controlling the temperature control device to heat or cool according to the first temperature difference, the temperature obtained by the heating or cooling being used to be transferred to the target area of the heat-conducting structural member through the flexible heat-conducting component, controlling the target area to increase or decrease in temperature so as to deform, thereby driving the device to move, the device being carried by the heat-conducting structural member.

10. A device displacement adjustment system, characterized in that, Comprising a device to be adjusted and the device displacement adjustment device according to any one of claims 1 to 8, the device to be adjusted being carried by the device displacement adjustment device, the device displacement adjustment device being used to drive the device to be adjusted to move.

11. A computer device, characterized in that, Comprising: A processor, the processor being used to be coupled with a memory, read and execute instructions and / or program codes in the memory to execute the method according to claim 9.

12. A computer-readable medium, characterized in that, The computer-readable medium stores computer program codes, and when the computer program codes run on a computer, the computer is caused to execute the method according to claim 9.

13. A computer program product, characterized in that, The computer program product includes computer program codes, and when the computer program codes run on a computer, the computer is caused to execute the method according to claim 9.

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