Connector

Abstract

Provided is a novel connector that does not require a fitting operation. A connector having a first plane with respect to an object to be connected is provided on a device substrate including a transmission path for a high-frequency signal, and causes the transmission path to be electrically connected to a high-frequency signal contact portion of the object to be connected. The connector has a first plane on which a ground pattern is provided so as to surround at least the periphery of a lead-out wiring pattern from a high-frequency signal contact portion with a predetermined gap, and comprises: a main body in which an upper surface portion functioning as a ground is formed in a planar shape; a through hole provided in the upper surface portion; and a movable electrode member positioned within the main body and elastically contacting a high-frequency signal contact portion of a connection object via the through-hole, the connector being configured so that a first plane of the connection object is in contact with or substantially parallel to an upper surface portion of the main body at a predetermined distance or less, and a second plane of the connection object is in contact with or substantially parallel to the upper surface portion of the main body. Thus, the movable electrode member can be electrically connected to the high-frequency signal contact portion, and the ground pattern to be connected can be electrically connected to the upper surface portion.

Description

Technical Field

[0001] The present invention relates to a connector for passing high-frequency signals. Background Art

[0002] Since before, there has been an expectation for a connector that can prevent noise and the like from mixing into high-frequency signals and transmit the signals without degrading the signals. As an example, a connector that can switch the signal path of high-frequency signals has been proposed. For example, in Patent Document 1, a high-frequency connector 10 is disclosed, which is mounted on a circuit board of a communication terminal such as a mobile phone. As shown in Figure 4 (b) thereof, by installing a coaxial plug 100, the signal path of high-frequency signals can be switched. In addition, in Patent Document 2, a coaxial connector 1 with a switch that can switch the signal path incorporated in a mobile communication device such as a mobile phone is disclosed (refer to Figure 3 、 Figure 4 ) of Patent Document 2), and a communication device including the connector.

[0003] What is disclosed in FIG. 8 of Patent Document 2 is a high-frequency circuit 120 of a mobile communication device such as a mobile phone, which is provided with a common antenna element 122 for transmitting and receiving connected via the connector 125. The high-frequency circuit 120 is configured to connect a diplexer 123 connected to the connector 125, a reception-side signal path connected to the diplexer 123, and a transmission-side signal path including an isolator.

[0004] The connector 125 is, for example, a so-called switch connector that switches the connection between the antenna element 122 and the high-frequency circuit to the connection between the high-frequency circuit and a measurement device for inspection in the assembly process of a mobile phone in a set maker. If a probe 40 connected to a measuring machine is fitted into the connector 125, the signal path from the high-frequency circuit 120 to the antenna element 122 can be switched to the measuring device side.

[0005] Prior Art Documents

[0006] Patent Documents

[0007] Patent Document 1: Japanese Patent Application Laid-Open No. 2013-239363

[0008] Patent Document 2: Japanese Patent Application Laid-Open No. 2004-281179 Summary of the Invention

[0009] Problems to be Solved by the Invention

[0010] Here, in order to transmit the signal with as little degradation as possible of the high-frequency signal from the high-frequency circuit 120, the characteristic impedance in the transmission path is matched to a specified value (usually 50 Ω in the case of a mobile phone or the like) to prevent the mixing in of noise and the like and to prevent the generation of reflected waves. Therefore, a coaxial cable is used in the transmission path, and the fitting of the connector 125 and the probe 40 also requires the same attention.

[0011] Therefore, it is necessary for the coaxial plug to fit perfectly with the outer periphery of the cylindrical connector 125 and for the plug to be inserted into a specified portion of the connector 125. However, since such a fitting operation requires precision, there is a problem of poor work efficiency. At the same time, there is also a problem of increased cost in the production of such precise connectors or coaxial plugs.

[0012] In view of the above problems, an object of the present invention is to provide a completely novel connector that does not require the fitting operation as described above. Another object is to provide a connector that can also reduce the manufacturing cost.

[0013] Technical means for solving the problem

[0014] The connector of the present invention is provided on a device-side substrate including a transmission path for a high-frequency signal, and conducts the transmission path and a contact portion for a high-frequency signal of a connection object. The connector is a connector having a first plane with respect to the connection object, and a ground pattern is provided on the first plane at least so as to surround the lead wiring pattern from the contact portion for the high-frequency signal with a specified gap. The connector includes: a main body, the upper surface portion that functions as a ground is formed in a planar shape; a through hole provided in the upper surface portion; and a movable electrode member located inside the main body and elastically contacting the contact portion for the high-frequency signal of the connection object via the through hole. The connector is configured such that by setting the first plane of the connection object to contact or approach and correspond to the upper surface portion of the main body, the movable electrode member can be electrically connected to the contact portion for the high-frequency signal, and the ground pattern of the connection object can be electrically connected to the upper surface portion.

[0015] According to this structure, a novel connector that does not require a coaxial plug or a fitting operation and can connect high-frequency circuits without degrading the high-frequency signal can be provided.

[0016] As the structure, more specifically, it may also be configured such that a conductive portion connected to the ground pattern is formed on the opposite surface of the first plane of the connection object. As the structure, more specifically, it may also be configured such that a fixed electrode member is provided in the main body, and the fixed electrode member has an end portion that can contact and separate from the free end portion of the movable electrode member. In a state where the movable electrode member is electrically connected to the high-frequency signal contact portion, the free end portion of the movable electrode member is in a state of being separated from the fixed electrode member.

[0017] As the structure, more specifically, it may also be configured such that the movable electrode member forms a leaf spring portion connected to the transmission path at the fixed end side using a series of strip-shaped metal plates, and a contact portion that contacts the high-frequency signal contact portion is formed at the free end side, and the contact portion protrudes more upward than the upper surface portion.

[0018] As the structure, more specifically, it may also be configured such that a stopper portion that forms a predetermined gap between the upper surface portion and the connection object is provided. As the structure, more specifically, it may also be configured such that the stopper portion is a plurality of protruding portions that protrude upward from the upper surface portion. As the structure, more specifically, it may also be configured such that the protruding portions penetrate through the upper surface portion from a resin material provided in the main body and protrude.

[0019] As the structure, more specifically, it may also be configured such that a ground connection spring portion that protrudes more upward than the upper end of the protruding portion is provided on the upper surface portion, and the ground connection spring portion is brought into electrical contact with the ground of the connection object.

[0020] As the structure, more specifically, it may also be configured such that ground plate-like members whose surfaces face each other with the leaf spring portion interposed therebetween are respectively arranged on both sides in the width direction of the leaf spring portion, and the ground plate-like members are exposed in a manner that can be welded to the device substrate.

[0021] As the structure, more specifically, it may also be configured such that the upper surface portion of the main body is formed of a metal plate, and the ground connection spring portion formed on the upper surface portion has: a parallel extension portion that extends in parallel with the leaf spring portion above the leaf spring portion; and a protruding portion that is formed by bending upward from the end portion of the parallel extension portion and protrudes more upward than the upper ends of the plurality of protruding portions. By pressing with the first plane of the connection object, the parallel extension portion is deflected in the same direction as the leaf spring portion.

[0022] As the structure, more specifically, it may also be configured as follows: the movable electrode member has an extending portion extending upward from the end of the leaf spring portion, the contact portion is provided above the extending portion, the distance between the protruding portion and the extending portion is the same as the distance between the parallel extending portion and the leaf spring portion, and the distance between the protruding portion and the extending portion and the distance between the parallel extending portion and the leaf spring portion are the same regardless of whether there is pressing by the first plane of the connection object. Additionally, as the structure, more specifically, it may also be set as follows: the connection object constitutes at least a part of the inspection device used in the inspection of high-frequency signals.

[0023] Effect of the Invention

[0024] With the connector of the present invention, fitting operation is not required, the operability is easy, and the manufacturing cost can be reduced. Description of the Drawings

[0025] Figure 1 is a perspective view of the connector SC of the first embodiment.

[0026] Figure 2 is a structural view of the connector SC when viewed from above.

[0027] Figure 3 is a structural view of the connector SC when viewed from below.

[0028] Figure 4 is Figure 2 the sectional arrow view of A-A shown.

[0029] Figure 5 is Figure 2 the sectional arrow view of B-B shown.

[0030] Figure 6A is an explanatory view related to the manufacturing process of the connector SC.

[0031] Figure 6B is a perspective view of the second intermediate M2 of the first embodiment.

[0032] Figure 7 is related to Figure 6B the explanatory view of the arrangement state of the movable electrode member, etc. in

[0033] Figure 8A is an explanatory view of the state of mounting the connector SC on the substrate X.

[0034] Figure 8B is an explanatory view of the state of mounting the connector SC on the substrate X.

[0035] Figure 9 ​​​​​​​​​​​is an explanatory diagram showing the state in which the inspection substrate Y is connected to the connector SC.

[0036] Figure 10A is an explanatory diagram showing the schematic structure of the main part of the inspection substrate Y.

[0037] Figure 10B is an explanatory diagram showing the state just before the inspection substrate Y comes into contact with the connector SC.

[0038] Figure 11 is a perspective view of the connector SCa of the second embodiment.

[0039] Figure 12 is an explanatory diagram showing the state in which the inspection substrate Y is connected to the connector SCa.

[0040] Figure 13 is a perspective view of the connector SCb of the third embodiment.

[0041] Figure 14 is a structural diagram of the second intermediate M2 of the third embodiment.

[0042] Figure 15 is Figure 14 an explanatory diagram of the arrangement state of the movable electrode member and the ground bar in

[0043] Figure 16 is an explanatory diagram showing the state in which another substrate Z is connected to the connector SCb provided in the target device.

[0044] Figure 17 is a perspective view of the connector SCc of the fourth embodiment.

[0045] Figure 18 is a structural diagram of the second intermediate M2 of the fourth embodiment. Detailed Embodiments

[0046] Hereinafter, each embodiment of the present invention will be described with reference to the respective drawings. The up, down, left, right, front, and back directions (directions defined as orthogonal to each other for convenience) in the following description are as Figure 1 shown, for example. In addition, the connectors of each embodiment have a bilaterally symmetric structure. For each component arranged symmetrically left and right, an "L" is added at the end of the symbol of the component on the left side, and an "R" is added at the end of the symbol of the component on the right side. Sometimes, the structure of the component on the left side is described, and the description of the structure of the component on the right side is omitted.

[0047] 1. First Embodiment

[0048] ​​​​​​​​​​First, the structure of a connector that can also be used as a switch connector will be described as the first embodiment of the present invention. Figure 1 It is a perspective view of the connector SC of the first embodiment. Figure 2 It is a structural diagram when the connector SC is viewed from above.

[0049] Figure 3 It is a structural diagram when the connector SC is viewed from below. Figure 4 It is Figure 2 The sectional arrow view of A-A shown (the sectional view when cut by the symmetry plane). Figure 5 It is Figure 2 The sectional arrow view of B-B shown.

[0050] The connector SC includes: a cover member 1, which is in a rectangular parallelepiped shape, and as shown in Figure 1 and Figure 4 , the periphery of the rectangular upper surface portion 11 is bent downward to form a front surface portion 12, a rear surface portion 13, left and right first side surface portions 14L, first side surface portions 14R, and left and right second side surface portions 15L, second side surface portions 15R; a resin member 2, as shown in Figure 4 and Figure 5 , is provided inside the cover member 1; a movable electrode member 3; a fixed electrode member 5; and a left ground bar 4L and a right ground bar 4R, as shown in Figure 7 , stand opposite to each other with the movable electrode member 3 and the fixed electrode member 5 interposed therebetween. The cover member 1, the movable electrode member 3, each ground bar 4L, 4R, and the fixed electrode member 5 are formed by performing cutting processing or bending processing on a metal plate made of a conductive material (in this embodiment, as an example, a 0.1 mm thick plate of stainless steel (SUS304)). The resin member 2 is formed of a heat-resistant resin made of an insulating material.

[0051] Regarding the manufacturing process of the connector SC, in this embodiment, cutting processing or bending processing is performed on a single metal plate, and as shown in Figure 6A (a), a first intermediate body M1 in which the movable electrode member 3, the left and right ground bars 4L, the ground bar 4R, the fixed electrode member 5, and the carrier Ca are integrated is formed. The first intermediate body M1 is integrated with the resin member 2 by insert molding using a resin (raw material of the resin member 2) to become the state shown in Figure 6A (b), and then unnecessary parts such as the carrier Ca of the first intermediate body M1 are cut off to form the second intermediate body M2 shown in Figure 6B . Then, the cover member 1 is fixed to the second intermediate body M2, thereby forming the connector SC. In addition, Figure 7 represents Figure 6BThe arrangement state of the movable electrode member 3, the left and right grounding rods 4L and 4R, and the fixed electrode member 5 (the resin member 2 is not shown).

[0052] As Figure 6B shown, etc., the resin member 2 has: a housing portion 21, left and right front protruding portions 22L and 22R, and left and right rear protruding portions 23L and 23R.

[0053] The housing portion 21 has a generally cylindrical structure with a space 21a provided inside a rectangular parallelepiped having upper, lower, left, right, front, and rear outer surfaces. The space 21a is open at the top and bottom and is surrounded by the front, rear, left, and right inner walls of the housing portion 21 in a direction orthogonal to the up and down directions, forming a substantially rectangular parallelepiped space. In addition, in the example of the present embodiment, the distance between the front and rear inner walls of the housing portion 21 (the front-rear dimension of the space 21a) is 2.74 mm, and the distance between the left and right inner walls (the left-right dimension of the space 21a) is 0.90 mm.

[0054] The left front protruding portion 22L is formed to protrude upward from near the left front corner of the upper surface of the housing portion 21. The left rear protruding portion 23L is formed to protrude upward from near the left rear corner of the upper surface of the housing portion 21. The protruding amounts of the front protruding portion 22L and the rear protruding portion 23L are the same.

[0055] As Figure 7 shown, etc., the movable electrode member 3 is formed of a strip-shaped metal plate having a width direction coinciding with the left-right direction and a constant dimension in the width direction, and has a form in which a first flat portion 3a, a second flat portion 3b, a third flat portion 3c, a fourth flat portion 3d, a folded-back portion 3e, a fifth flat portion 3f, and a sixth flat portion 3g are connected in sequence from the front side.

[0056] The first flat portion 3a is in the shape of a rectangular flat plate with a surface orthogonal to the up and down directions. The second flat portion 3b is in the shape of a rectangular flat plate bent upward at a right angle from the rear edge of the first flat portion 3a. The third flat portion 3c is in the shape of a rectangular flat plate bent backward at a right angle from the upper edge of the second flat portion 3b. The fourth flat portion 3d is in the shape of a flat plate bent upward at a right angle from the rear edge of the third flat portion 3c.

[0057] The folded-back portion 3e is bent in a U-turn backward from the upper edge of the fourth flat portion 3d, and the surface is formed into a curved surface shape. That is, the folded-back portion 3e is formed in the shape of a semicircular arc when viewed from the left side. The fifth flat portion 3f is in the shape of a rectangular flat plate with its upper edge connected to the lower edge of the folded-back portion 3e. The sixth flat portion 3g is in the shape of a rectangular flat plate bent backward at a right angle from the lower edge of the fifth flat portion 3f.

[0058] In the movable electrode member 3 of the structure, the vicinity of the upper end of the folded-back portion 3e is a portion that contacts the conductor pattern Ya of the inspection substrate Y to be described later (hereinafter, sometimes referred to as "contact portion Q1") (see Figure 9 ). In addition, the portion of the third flat portion 3c that protrudes from the housing portion 21 (the portion housed in the space 21a) functions as a leaf spring that is deflected downward by the inspection substrate Y and applies a force upward to the contact portion Q1 (hereinafter, sometimes referred to as "leaf spring portion Q2") (see Figure 9 ). In addition, the upper surface portion of the sixth flat portion 3g is a portion that switches the presence or absence of connection to the fixed electrode member 5 (tenth flat portion 5c) (hereinafter, sometimes referred to as "movable switch portion Q3") (see Figure 9 ).

[0059] The left ground bar 4L has a side plate portion 41L, a front lower bent portion 42L, a rear lower bent portion 43L, a front upper bent portion 44L, and a rear upper bent portion 45L. The side plate portion 41L is formed in a flat plate shape with a surface orthogonal to the left-right direction (a substantially rectangular flat plate shape with the front-rear direction as the long side direction). Near the center of the side plate portion 41L, a hole 46L is provided for allowing resin to enter to strengthen the bonding between the left ground bar 4L and the resin member 2. However, when the required bonding strength can be obtained even without the hole 46L, the setting of the hole 46L can be omitted.

[0060] The front lower bent portion 42L is formed by bending leftward at a right angle from the lower edge near the front end of the side plate portion 41L. The rear lower bent portion 43L is formed by bending leftward at a right angle from the lower edge near the rear end of the side plate portion 41L. The front upper bent portion 44L is formed by bending leftward at a right angle from the upper edge on the front side of the side plate portion 41L. The rear upper bent portion 45L is formed by bending leftward at a right angle from the upper edge on the rear side of the side plate portion 41L.

[0061] The fixed electrode member 5 is formed of a strip-shaped metal plate having a width direction that coincides with the left-right direction and a constant dimension in the width direction, and has a form in which the eighth flat portion 5a, the ninth flat portion 5b, and the tenth flat portion 5c are sequentially connected from the rear side. In addition, the dimension of the fixed electrode member 5 in the width direction is the same as the dimension of the movable electrode member 3 in the width direction. In the example of the present embodiment, the dimension of the movable electrode member 3 and the fixed electrode member 5 in the width direction is set to 0.5 mm.

[0062] The eighth flat portion 5a is in a rectangular flat plate shape with a surface orthogonal to the up-down direction. The ninth flat portion 5b is in a rectangular flat plate shape bent upward at a right angle from the front edge of the eighth flat portion 5a. The tenth flat portion 5c is in a rectangular flat plate shape bent forward at a right angle from the upper edge of the ninth flat portion 5b.

[0063] The movable electrode member 3, the left and right ground rods 4L and 4R, and the fixed electrode member 5 are fixed by the resin member 2 in such a manner as to define the positional relationship shown. As Figure 6B shown, with respect to the movable electrode member 3, the entire second flat portion 3b and a portion near the front end of the third flat portion 3c are fixed by a portion of the housing portion 21 that is more forward than the space 21a. Further, a forward portion of the first flat portion 3a protrudes more forward than the front surface of the housing portion 21, and the entire lower surface of the first flat portion 3a is exposed downward. Figure 4 A portion of the movable electrode member 3 that is more rearward than the fixed portion is substantially housed in the space 21a. Among them, the vicinity of the contact portion Q1 of the movable electrode member 3 (the folded-back portion 3e and the upper portions of the fourth flat portion 3d and the fifth flat portion 3f) protrudes more upward than the upper opening of the space 21a. In addition, the front-rear direction position of the folded-back portion 3e is more rearward than the front-rear direction position at the center of the space 21a, and accordingly, the length of the leaf spring portion Q2 in the front-rear direction can be sufficiently ensured.

[0064] With respect to the left ground rod 4L, substantially the entire side plate portion 41L (except for the region where the front-rear direction position coincides with the front upper bent portion 44L and the rear upper bent portion 45L) is fixed by a portion of the housing portion 21 that is more to the left than the space 21a. With respect to the fixed electrode member 5, the entire ninth flat portion 5b and a portion near the rear end of the tenth flat portion 5c are fixed by a portion of the housing portion 21 that is more rearward than the space 21a. Further, a rearward portion of the eighth flat portion 5a protrudes more rearward than the rear surface of the housing portion 21, and the entire lower surface of the eighth flat portion 5a is exposed downward.

[0065] In the connector SC shown in

[0066] In Figure 4 shown, the movable switch portion Q3 presses the lower surface (fixed switch portion) of the tenth flat portion 5c by the elastic force of the leaf spring portion Q2. In addition, the left and right ground rods 4L and 4R are arranged so as to sandwich the movable electrode member 3 and the fixed electrode member 5 in the width direction (left-right direction) and the surfaces thereof face each other (the surfaces on the left-right direction inner sides of the side plate portions 41L and 41R). Further, the movable electrode member 3 and the fixed electrode member 5 are arranged at the center portion in the left-right direction of the connector SC, and the distance from the left ground rod 4L is the same as the distance from the right ground rod 4R.

[0067] The front - rear direction positions of the front ends of the left and right side plate portions 41L and 41R are approximately the same as the front - rear direction position of the second flat plate portion 3b, and the front - rear direction positions of the rear ends of the left and right side plate portions 41L and 41R are approximately the same as the front - rear direction position of the ninth flat plate portion 5b. In addition, the upper edges of the left and right side plate portions 41L and 41R are located above the upper surfaces of the third flat plate portion 3c and the tenth flat plate portion 5c. Thus, the left and right side plate portions 41L and 41R sandwich, in the left - right direction, all of the portion of the movable electrode member 3 that is more rearward than the first flat plate portion 3a (except for the vicinity of the folded - back portion 3e), and all of the portion of the fixed electrode member 5 that is more forward than the eighth flat plate portion 5a. In the example of the present embodiment, the left - right direction distance between the inner surfaces of the left and right side plate portions 41L and 41R is set to 1.44 mm.

[0068] In addition, as Figures 1 - 5 shown, etc., the cover member 1 has: an upper surface portion 11, a front surface portion 12, a rear surface portion 13, left and right first side surface portions 14L and 14R, left and right second side surface portions 15L and 15R, left and right first ground connection spring portions 16L and 16R, and left and right second ground connection spring portions 17L and 17R.

[0069] The upper surface portion 11 is generally a rectangular flat plate shape having front, rear, left, and right sides and orthogonal to the up - down direction, and is provided with a first through - hole 11a, left and right second through - holes 11bL and 11bR, and left and right third through - holes 11cL and 11cR. The first through - hole 11a is formed so that the folded - back portion 3e (a part of the movable electrode member 3) protrudes upward more than the upper surface portion 11. A proper gap is provided between the edge of the first through - hole 11a and the movable electrode member 3 in such a way as to completely and reliably prevent the movable electrode member 3 from contacting the upper surface portion 11.

[0070] The left and right second through - holes 11bL and 11bR are formed so that the left and right front protrusion portions 22L and 22R (parts of the resin member 2) protrude upward more than the upper surface portion 11. The gaps between the edges of the left and right second through - holes 11bL and 11bR and the left and right front protrusion portions 22L and 22R are set as small as possible. The left and right third through - holes 11cL and 11cR are formed so that the left and right rear protrusion portions 23L and 23R (parts of the resin member 2) protrude upward more than the upper surface portion 11. The gaps between the edges of the left and right third through - holes 11cL and 11cR and the left and right rear protrusion portions 23L and 23R are set as small as possible.

[0071] The front surface portion 12 is substantially a rectangular flat plate shape that bends downward at a right angle from the front edge of the upper surface portion 11. Near the lower edge of the left end of the front surface portion 12, a front-side claw portion 12aL on the left side that bends forward at a right angle from the edge is formed. In addition, near the center in the left-right direction of the lower side of the front surface portion 12, a notch 12b for preventing contact with the first flat plate portion 3a is provided.

[0072] The rear surface portion 13 is substantially a rectangular flat plate shape that bends downward at a right angle from the rear edge of the upper surface portion 11. Near the lower edge of the left end of the rear surface portion 13, a rear-side claw portion 13aL on the left side that bends backward at a right angle from the edge is formed. In addition, near the center in the left-right direction of the lower side of the rear surface portion 13, a notch 13b for preventing contact with the eighth flat plate portion 5a described later is provided.

[0073] The left first side surface portion 14L is substantially a rectangular flat plate shape that bends downward at a right angle from the front region of the left edge of the upper surface portion 11. In a part of the lower edge region of the first side surface portion 14L, a first side claw portion 14aL that bends leftward at a right angle from the region is formed.

[0074] The left second side surface portion 15L is substantially a rectangular flat plate shape that bends downward at a right angle from the rear region of the left edge of the upper surface portion 11. In a part of the lower edge region of the second side surface portion 15L, a second side claw portion 15aL that bends leftward at a right angle from the region is formed. In addition, a gap is provided between the rear edge of the first side surface portion 14L and the front edge of the second side surface portion 15L.

[0075] The left first ground connection spring portion 16L is formed by bending after making a cutout in the contour of a part of the upper surface portion 11, and is formed in a strip shape that extends obliquely forward and upward from a position approximately in the center in the front-rear direction and on the left side of the upper surface portion 11. In addition, the bending process in the present embodiment may also be a cutout bending without making a cutout in the contour.

[0076] The left second ground connection spring portion 17L is formed to extend from the lower edge near the front end of the left second side surface portion 15L, and is in a form in which a U-shaped turning portion 17aL, a first extending portion 17bL, a second extending portion 17cL, a third extending portion 17dL, and a fourth extending portion 17eL are connected in sequence from the edge.

[0077] The U-turn part 17aL is bent in a way that it makes a left U-turn from the lower edge near the front end of the second side surface part 15L on the left, and its surface is formed into a curved surface. That is, the U-turn part 17aL is formed into a shape of a semi-circular arc when observed from the front. The first extension part 17bL is in the shape of a rectangular flat plate whose lower edge is connected to the upper edge of the U-turn part 17aL.

[0078] The second extension part 17cL is in the shape of a rectangular flat plate whose front edge is connected to the rear edge near the upper end of the first extension part 17bL. The third extension part 17dL is in the shape of a rectangular flat plate whose lower edge is connected to the upper edge near the rear end of the second extension part 17cL. The fourth extension part 17eL is in the shape of a rectangular flat plate that bends at a right angle to the right from the upper edge of the third extension part 17dL. In addition, the first extension part 17bL, the second extension part 17cL, and the third extension part 17dL are flat plates whose surfaces are orthogonal to the left-right direction, and the fourth extension part 17eL is a flat plate whose surface is orthogonal to the up-down direction.

[0079] The cover member 1 is arranged so as to cover substantially the whole except the lower side of the intermediate body M. The upper surface part 11 contacts or is close to the upper surface of the housing part 21, the front surface part 12 contacts or is close to the front surface of the housing part 21, the rear surface part 13 contacts or is close to the rear surface of the housing part 21, and the first side surface part 14L and the second side surface part 15L on the left contact or are close to the left surface of the housing part 21. In addition, the forward part of the first flat plate part 3a passes through the cutout 12b and protrudes more forward than the front surface part 12, and the rearward part of the eighth flat plate part 5a passes through the cutout 13b and protrudes more rearward than the rear surface part 13.

[0080] In addition, the front upper bent part 44L and the rear upper bent part 45L of the grounding bar 4L on the left are connected and fixed to the upper surface part 11 of the cover member 1 by welding. Figure 5 The arrow α in roughly indicates the connection and fixing position based on the welding of the rear upper bent part 45L on the left, the rear upper bent part 45R and the upper surface part 11. The welding can be achieved by the following method: after arranging the cover member 1 in a way that it covers the intermediate body M, heating the lower surfaces of the front upper bent part 44L and the rear upper bent part 45L using a welding jig or the like.

[0081] In addition, with respect to a total of eight claw portions 12aL to 15aL, claw portions 12aR to 15aR of the cover member 1, the lower surface of the first flat portion 3a of the movable electrode member 3, the lower edges of the side plate portions 41L and 41R of the left and right ground bars 4L, the lower surfaces of the left and right front lower bent portions 42L and 42R, the lower surfaces of the left and right rear lower bent portions 43L and 43R, and the lower surface of the eighth flat portion 5a of the fixed electrode member 5, the vertical positions are consistent with the lower end of the connector SC. Therefore, the connector SC can be disposed on the surface of the planar substrate, and these portions can be fixed in contact with the substrate surface by welding.

[0082] In addition, in the example of the present embodiment, the front-back direction distance between the outer surfaces of the front surface portion 12 and the rear surface portion 13 of the cover member 1 ( Figure 2 the distance D1 shown) is 4.00 mm, and the left-right direction distance between the outer surfaces of the left and right first side surface portions 14L and 14R of the cover member 1 ( Figure 2 the distance D2 shown, and the left-right direction distance between the outer surfaces of the second side surface portions 15L and 15R is the same) is 2.80 mm.

[0083] In addition, the vertical distance from the lowermost portion of the connector SC (the positions of the lower surface of the first flat portion 3a and the lower surface of the eighth flat portion 5a) to the top end portions 16aL and 16aR of the left and right first ground connection spring portions 16L and 16R ( Figure 4 the distance D3 shown) is 1.22 mm, and the vertical distance from the lowermost portion to the upper end of the contact portion Q1 ( Figure 4 the distance D4 shown) is 1.21 mm, and the vertical distance from the lowermost portion to the outer surface of the upper surface portion 11 of the cover member 1 ( Figure 4 the distance D5 shown) is 0.75 mm. In addition, the vertical distance between the lower surface of the upper surface portion 11 and the upper surface of the leaf spring portion Q2 ( Figure 4 the distance D6 shown) is 0.31 mm, and the front-back direction distance from the front end of the leaf spring portion Q2 to the center of the contact portion Q1 ( Figure 4 the distance D7 shown) is 2.04 mm. In addition, the front-back direction distance from the front end of the leaf spring portion Q2 to the front surface of the fourth flat portion 3d is 1.84 mm, and the vertical distance from the upper surface of the third flat portion 3c to the upper end of the folded-back portion 3e is 0.87 mm.

[0084] Next, the usage form of the connector SC will be described. The connector SC is mounted on a substrate of various devices that process high-frequency signals as electrical signals (for example, a transmitter equivalent to a remote control signal as a high-frequency signal, a device that receives the remote control signal and operates, or various communication terminals, etc., hereinafter, conveniently referred to as target devices). More specifically, the connector SC is connected and fixed to the substrate X (device substrate) in the target device that includes a transmission path of a high-frequency signal having a separation portion by soldering.

[0085] Figure 8A An example of the state of mounting the connector SC on the substrate X is illustrated. Figure 8A (a) shows the situation before the connector SC is about to be mounted on the substrate X (the situation where the connector SC is located above the substrate X). Figure 8A (b) shows the situation where the connector SC is mounted on the substrate X. Figure 8B The state of mounting the connector SC on the substrate X is illustrated from another viewpoint. In addition, Figure 8B (as described later Figure 9 and Figure 12 are the same) is shown in the form of a cross-sectional view when cutting along the symmetry plane of the left-right symmetric connector SC. In the example shown in Figure 8B , on the substrate X having a front-stage side signal transmission pattern Xa1, a rear-stage side signal transmission pattern Xa2, and a ground pattern Xb, the connector SC is provided and fixed by soldering.

[0086] The front-stage side signal transmission pattern Xa1 and the rear-stage side signal transmission pattern Xa2 are patterns that function as transmission paths for high-frequency signals. These patterns Xa1 and Xa2 are separated from each other and not electrically connected, but when electrically connected through the connector SC, high-frequency signals can be transmitted from the front-stage side signal transmission pattern Xa1 side to the rear-stage side signal transmission pattern Xa2 side. In addition, the ground pattern Xb is a pattern that functions as a ground.

[0087] In the connector SC, the first flat plate portion 3a of the movable electrode member 3 is connected and fixed to the front-stage side signal transmission pattern Xa1 by welding, and the eighth flat plate portion 5a of the fixed electrode member 5 is connected and fixed to the rear-stage side signal transmission pattern Xa2 by welding. Further, in the connector SC, all or part of each of the claw portions 12aL to 15aL, the claw portions 12aR to 15aR, the lower edges of the side plate portions 41L and 41R of the left and right ground bars 4L, the lower surfaces of the left and right front lower bent portions 42L and 42R, and the lower surfaces of the left and right rear lower bent portions 43L and 43R are connected and fixed to the ground pattern Xb by welding. In addition, in order to strengthen the grounding of the connector SC, it is desirable to connect and fix as many parts as possible (preferably all) of the above-mentioned parts to the ground pattern Xb.

[0088] Thus, in Figure 8B the normal state shown (the state where the movable electrode member 3 is in conduction with the fixed electrode member 5), the front-stage side signal transmission pattern Xa1 is in conduction with the rear-stage side signal transmission pattern Xa2 via the movable electrode member 3 and the fixed electrode member 5. Therefore, in the target device, high-frequency signals can be transmitted from the front-stage side signal transmission pattern Xa1 side to the rear-stage side signal transmission pattern Xa2 side, and the high-frequency signals can be processed as usual. In addition, in the present embodiment, the tenth flat plate portion 5c of the fixed electrode member 5 is provided above the movable switch portion Q3, so that deterioration of high-frequency signals can be suppressed as compared with the case where the tenth flat plate portion 5c is provided below the movable switch portion Q3.

[0089] On the other hand, when inspecting the high-frequency signals of the target device, the inspection can be easily performed using the flat inspection substrate Y (one form of the connection object). Figure 9 The state of connecting the inspection substrate Y to the connector SC is illustrated, Figure 9 (a) shows the state where the inspection substrate Y is placed above the connector SC, Figure 9 (b) shows the state where the inspection substrate Y is connected to the connector SC by moving the inspection substrate Y in the state downward (in the direction indicated by the hollow arrow in Figure 9 ).

[0090] Here, Figure 10A shows the schematic structure of the main part of the inspection substrate Y placed above the connector SC, Figure 10A (a) and Figure 10A (b) respectively show the above structure when observed from different viewpoints. In addition, Figure 10B shows the state before the inspection substrate Y comes into contact with the connector SC, Figure 10B (a) and Figure 10B(b) respectively represent the states when observed from different viewpoints. As Figure 10A and Figure 10B shown, on the planar lower surface of the inspection substrate Y, a conductor pattern Ya and a ground pattern Yb are provided. Regarding these patterns, they are appropriately formed mainly from the viewpoint of matching the characteristic impedance of the transmission path of high-frequency signals in the state where the inspection substrate Y is connected to the connector SC with a specified value F (in this embodiment, 50Ω as an example).

[0091] If described more specifically, the conductor pattern Ya is a pattern formed over the inner region of a circle C1 with a diameter of 1.2 mm, and is connected to an inspection device (not shown) for inspecting high-frequency signals via a via hole Yh and a conductor pattern Yc described later. The inspection device and the inspection substrate Y are components of the inspection equipment used in the inspection of the high-frequency signals, and the inspection substrate Y constitutes a part of the inspection equipment. The ground pattern Yb is a pattern formed over the outer region of a circle C2 with a diameter of 3.2 mm having the same center as the circle C1, and is a pattern that functions as a ground. In addition, in the region Yd between the conductor pattern Ya and the ground pattern Yb, no pattern is arranged, and the region Yd is in an insulating state.

[0092] The conductor pattern Ya is connected to a conductor pattern Yc for high-frequency signal transmission arranged on the upper surface side of the inspection substrate Y via a via hole Yh provided at its center. The conductor pattern Yc is arranged to extend rearward from a position above the conductor pattern Ya. The rear end of the conductor pattern Yc is connected to an inspection device for high-frequency signals via, for example, a coaxial cable not shown. The width (dimension in the left-right direction) of the conductor pattern Yc is, for example, the same size as the diameter 1.2 mm of the circle C1 and is constant. In addition, on the upper surface side of the inspection substrate Y, in the region Ye from the outer edge of the conductor pattern Yc to a specified distance (for example, 1.0 mm), no pattern is arranged, and the region Ye is in an insulating state. Furthermore, a ground pattern Yf is formed over the region outside the region Ye. Although not shown, the ground pattern Yf is electrically connected to the ground pattern Yb through a through hole.

[0093] In the example of the present embodiment, a part of the conductor pattern Ya corresponds to the high-frequency signal contact portion that contacts the contact portion Q1, and the other part of the conductor pattern Ya and the conductor pattern Yc correspond to the lead wiring pattern from the high-frequency signal contact portion (the wiring pattern led out to the side of the high-frequency signal inspection device). On the lower surface of the inspection substrate Y, a ground pattern Yb is provided so as to surround a part of the lead wiring pattern (the part other than the high-frequency signal contact portion of the conductor pattern Ya) with a predetermined gap. On the upper surface of the inspection substrate Y, a ground pattern Yf is provided so as to surround a part of the lead wiring pattern (the conductor pattern Yc) with a predetermined gap. In addition, in Figure 9 (as will be described later Figure 12 similarly), the via holes and the components arranged on the upper surface side of the inspection substrate Y are not shown.

[0094] In Figure 9 the example shown in (a), the inspection substrate Y is placed such that the conductor pattern Ya is directly above the contact portion Q1, and the ground pattern Yb is directly above the top ends 16aL and 16aR of the left and right first ground connection spring portions 16L and 16R and the fourth extension portions 17eL and 17eR of the left and right second ground connection spring portions 17L and 17R. In addition, the upper ends of the folded-back portion 3e, the top ends 16aL and 16aR of the left and right first ground connection spring portions 16L and 16R, and the fourth extension portions 17eL and 17eR of the left and right second ground connection spring portions 17L and 17R are located above the vertical position P1 of the upper ends of the left and right front protrusion portions 22L and 22R and the left and right rear protrusion portions 23L and 23R.

[0095] If the inspection substrate Y is moved downward from the placed state until it contacts the upper ends of the left and right front protrusion portions 22L and 22R and the left and right rear protrusion portions 23L and 23R, it becomes Figure 9 the state shown in (b). When moving in this way, the contact portion Q1, the top ends 16aL and 16aR of the left and right first ground connection spring portions 16L and 16R, and the fourth extension portions 17eL and 17eR of the left and right second ground connection spring portions 17L and 17R are pressed downward by the inspection substrate Y. In addition, at this time, the left and right front protrusion portions 22L and 22R and the left and right rear protrusion portions 23L and 23R function as stoppers that prevent the inspection substrate Y from approaching the upper surface portion 11 too closely and set a predetermined gap between them.

[0096] Thus, in the state shown in Figure 9 (b), the contact portion Q1 is brought into close contact with the conductor pattern Ya by the elastic force generated by the flexure of the leaf spring portion Q2. In this way, the contact portion Q1 can be reliably brought into contact with the conductor pattern Ya by the elastic force of the leaf spring portion Q2, and thus the high-frequency signal can be stably transmitted to the conductor pattern Ya.

[0097] In addition, the left and right top portions 16aL and 16aR can be reliably brought into contact with the ground pattern Yb by the elastic forces of the left and right first ground connection spring portions 16L and 16R, so that the left and right first ground connection spring portions 16L and 16R can stably function as a ground. Furthermore, the left and right fourth extension portions 17eL and 17eR can be reliably brought into contact with the ground pattern Yb by the elastic forces of the left and right second ground connection spring portions 17L and 17R, so that the left and right second ground connection spring portions 17L and 17R can stably function as a ground.

[0098] In Figure 9 (b), the pre-stage side signal transmission pattern Xa1 is electrically connected to the conductor pattern Ya via the movable electrode member 3. Therefore, the high-frequency signal can be transmitted from the pre-stage side signal transmission pattern Xa1 side to the inspection device side, and the high-frequency signal can be inspected in the inspection device. In addition, as Figure 9 (b) shows, by pressing the contact portion Q1 downward, the movable switch portion Q3 is separated from the tenth flat portion 5c (fixed switch portion) of the fixed electrode member 5, so that the high-frequency signal is not transmitted to the post-stage side signal transmission pattern Xa2. Therefore, the high-frequency signal reaching the pre-stage side signal transmission pattern Xa1 can be sent to the inspection device as it is as much as possible, and the high-frequency signal can be inspected with high precision in the inspection device.

[0099] The connector SC of the present embodiment is designed in such a way that, in order to transmit the signal with as little deterioration of the high-frequency signal as possible, a ground is provided around the transmission path of the high-frequency signal to prevent noise from mixing in, and the characteristic impedance in the transmission path is matched with a specified value F. In addition, the basic structure of the connector SC is considered for the following purpose: it is easy to match the characteristic impedance in the transmission path with the specified value F. Regarding these aspects, the following will be specifically described.

[0100] First, regarding the movable electrode member 3 and the fixed electrode member 5 corresponding to a part of the transmission path of the high-frequency signal, by arranging the ground rods 4L and 4R that function as a ground on the left and right sides, and arranging the upper surface portion 11 of the cover member 1 that functions as a ground on the upper side, noise intrusion is prevented.

[0101] Furthermore, by making the width-direction dimensions of the movable electrode member 3 and the fixed electrode member 5 the same and constant, arranging the side plate portions 41L and 41R of the flat left and right ground rods 4L and 4R in parallel with the movable electrode member 3 and the fixed electrode member 5, and arranging the upper surface portion 11 in parallel with the leaf spring portion Q2, it is easy to make the distance between the transmission path of the high-frequency signal (movable electrode member 3 and fixed electrode member 5) and the ground (ground rods 4L, 4R, and upper surface portion 11) as constant as possible, and to match the characteristic impedance with the specified value F.

[0102] In addition, since the left and right ground rods 4L and 4R are plate-shaped, the distance from them can be changed while maintaining the parallel state with the movable electrode member 3 and the fixed electrode member 5, and adjustment can be performed with good accuracy so that the characteristic impedance becomes the specified value F. Furthermore, the connector SC is in the following form: the left and right ground rods 4L and 4R and the fixed ends of the leaf spring portion Q2 are fixed by a series of resin members 2. Therefore, from the viewpoint of matching the characteristic impedance, the positional relationship between the left and right ground rods 4L and 4R and the leaf spring portion Q2 can be appropriately adjusted, and then they can be positioned and fixed with resin. In this regard, the characteristic impedance can also be made to match the specified value F with good accuracy.

[0103] In addition, since the left and right ground rods 4L and 4R are connected and fixed to the cover member 1 by welding, they function as a ground integrally. Furthermore, the integrated ground can be connected to both the ground pattern Xb of the substrate X and the ground pattern Yb of the inspection substrate Y at multiple positions, so it can function as a very high-quality ground.

[0104] As described above, the connector SC is provided on the substrate X including the transmission path of the high-frequency signal, and can be in a first state ([ Figure 8B the state shown) in which the front-stage side (front-stage side signal transmission pattern Xa1) and the rear-stage side (rear-stage side signal transmission pattern Xa2) of the separation part of the transmission path are conducted, and a second state ([ Figure 9 (b) the state shown) in which the front-stage side signal transmission pattern Xa1 is conducted to the inspection substrate Y.

[0105] In addition, the connector SC includes: a main body (a component including the cover member 1), with at least the upper surface portion 11 formed into a planar shape having conductivity; a movable electrode member 3, which has a leaf spring portion Q2 within the main body and is connected to the front-stage side signal transmission pattern Xa1; and a fixed electrode member 5, which is connected to the rear-stage side signal transmission pattern Xa2. The first state is a state in which the movable electrode member 3 and the fixed electrode member 5 are maintained in contact by the elastic force of the leaf spring portion Q2, and the second state is a state in which the movable electrode member 3 is separated from the fixed electrode member 5 by pressing against the elastic force by bringing the lower surface of the inspection substrate Y close to the upper surface portion 11. Furthermore, in the connector SC, there are provided stoppers (in the example of this embodiment, the left and right front protrusions 22L, the front protrusion 22R, the rear protrusions 23L, and the rear protrusion 23R) for providing a predetermined gap between the lower surface, which is in a planar shape having conductivity, and the upper surface portion 11 in the second state.

[0106] Thus, the connector SC does not require a fitting operation, is easy to operate, and can reduce manufacturing costs. That is, for example, in the connector 125 of Patent Document 2, as described above, it is necessary to perfectly fit a coaxial plug to the outer periphery of the cylindrical connector 125 and insert the plug into a predetermined portion of the connector 125. Since this fitting operation requires precision, the operation efficiency may deteriorate. Furthermore, there is also a problem of high cost in manufacturing such precise connectors or coaxial plugs.

[0107] In this regard, for the connector SC according to this embodiment, it is only necessary to bring the lower surface of the inspection substrate Y close to the upper surface portion 11, and no fitting operation is required. Therefore, it is easy to operate, the operation efficiency is improved, and compared with the case of manufacturing precise connectors or coaxial plugs, the manufacturing cost can be reduced.

[0108] In addition, in this embodiment, since there are provided stoppers, in the second state, a predetermined size of gap can be reliably and easily provided between the lower surface of the inspection substrate Y and the upper surface portion 11 of the cover member 1. Furthermore, when it is assumed that there is almost no such gap (that is, when the lower surface of the inspection substrate Y is in contact with or very close to the upper surface portion 11), due to the capacitive coupling between the inspection substrate Y side and the upper surface portion 11 side, the degree of characteristic impedance matching will not reach the level when there is the predetermined gap. In this regard, in the case where stoppers are provided as in this embodiment, the gap can be reliably provided, this problem can be solved, and the signal can be transmitted with as little degradation of the high-frequency signal as possible.

[0109] Furthermore, in the connector SC, in the first state, the contact between the movable electrode member 3 and the fixed electrode member 5 is reliably maintained by the elastic force of the leaf spring portion Q2, and the movable electrode member 3 is pressed against the elastic force by the inspection substrate Y, so that it can become the second state, and the signal path of the high-frequency signal can be switched with high reliability.

[0110] In addition, the upper surface portion 11 functions as a ground configured to face the leaf spring portion Q2 with its surface on the upper side of the leaf spring portion Q2. The connector SC includes a cover member 1 (conductive member) including such an upper surface portion 11. The movable electrode member 3 is formed of a series of strip-shaped metal plates and has a leaf spring portion Q2 and a contact portion Q1 whose fixed end side is connected to the signal transmission pattern Xa1 on the front stage side. The second state is a state in which the contact portion Q1 is pressed downward against the elastic force of the leaf spring portion Q2 by the inspection substrate Y, thereby separating the movable electrode member 3 from the fixed electrode member 5, and the contact portion Q1 protrudes upward more than the cover member 1. Therefore, it is possible to more reliably prevent noise from mixing into the high-frequency signal at the leaf spring portion Q2, and the contact portion Q1 is exposed from the cover member 1 to contact the inspection substrate Y.

[0111] Furthermore, ground plate-like members (left and right ground rods 4L and 4R) whose surfaces face each other with the leaf spring portion Q2 interposed therebetween are respectively arranged on both sides in the width direction (left and right direction) of the leaf spring portion Q2 of the connector SC. The upper sides of the left and right ground rods 4L and 4R are connected to the cover member 1, and the lower sides are exposed so as to be weldable to the substrate X.

[0112] Therefore, by forming a ground integrated with the cover member 1 by the left and right ground rods 4L and 4R and being welded to the ground pattern of the substrate X, it is possible to form a ground surrounding the periphery (top, bottom, left, and right) of the leaf spring portion Q2. In addition, cover members 1 (left and right first side faces 14L, first side faces 14R, second side faces 15L, and second side faces 15R) are provided on both sides of the leaf spring portion Q2, thereby preventing noise from mixing into the leaf spring portion Q2 from both sides. However, in the present embodiment, by further providing the left and right ground rods 4L and 4R, a structure that is also advantageous for characteristic impedance matching is achieved. That is, as described above, it is possible to appropriately adjust the positional relationship between the left and right ground rods 4L and 4R and the leaf spring portion Q2 from the viewpoint of matching the characteristic impedance, and then position and fix them with resin. Therefore, it is possible to match the characteristic impedance with the specified value F with good accuracy and transmit the signal with as little deterioration of the high-frequency signal as possible. In addition, the connector of the present invention can also be configured without using a ground plate-like member. For example, in the connector SC of the present embodiment, it is also possible to omit the setting of one or both of the left and right ground rods 4L and 4R.

[0113] Furthermore, in the connector SC, the left and right ground bars 4L, the ground bar 4R, the fixed ends of the leaf spring portions Q2, and the fixed electrode member 5 are fixed by a series of resin members 2, and the cover member 1 is provided so as to cover the upper surface of the resin member 2 (housing portion 21). Therefore, it is possible to easily form the connector SC in a form in which the movable electrode member 3 and the fixed electrode member 5 are fixed in a state insulated from the left and right ground bars 4L, the ground bar 4R, and the cover member 1.

[0114] In addition, the resin member 2 has a plurality of protrusions (left and right front protrusions 22L, front protrusions 22R, rear protrusions 23L, and rear protrusions 23R) protruding upward from the upper surface of the housing portion 21 as stopper portions. By bringing the lower surface of the planar inspection substrate Y into contact with the plurality of protrusions, the connector SC can be brought into the second state.

[0115] In addition, regarding the size of the gap between the lower surface of the inspection substrate Y and the upper surface portion 11 of the cover member 1 in the second state, if the gap is made too large, the transmission path of the high-frequency signal becomes correspondingly longer. Therefore, it is desirable to set the gap to an appropriate size. Research was conducted on this aspect, and as a result, the applicant found that it is desirable to set the size of the gap ( Figure 9 the distance Dx shown) to be the same as the distance between the leaf spring portion Q2 and the upper surface portion 11 (the distance D6) and to be 0.31 mm. Therefore, in the present embodiment, the vertical distance from the upper surface of the upper surface portion 11 to the upper ends of the respective protrusions (left and right front protrusions 22L, front protrusions 22R, rear protrusions 23L, and rear protrusions 23R) is set to 0.31 mm so that the size of the gap becomes 0.31 mm.

[0116] In addition, the cover member 1 has through holes (left and right second through holes 11bL, second through holes 11bR, third through holes 11cL, and third through holes 11cR) at positions corresponding to the plurality of protrusions (left and right front protrusions 22L, front protrusions 22R, rear protrusions 23L, and rear protrusions 23R), and the plurality of protrusions respectively pass through the corresponding through holes and protrude upward. Thus, even in a form in which the upper surface of the housing portion 21 is covered by the cover member 1, it is possible to easily provide the respective protrusions protruding from the upper surface.

[0117] In the SC connector, the cover member 1 is formed of a series of metal plates in such a manner as to include a plurality of ground connection spring portions (left and right first ground connection spring portions 16L and 16R, and second ground connection spring portions 17L and 17R). Further, the plurality of ground connection spring portions respectively protrude upward more than the upper ends of the plurality of protrusions (left and right front protrusions 22L and 22R, and rear protrusions 23L and 23R), and in the second state, the protruding portions are brought into close contact with the inspection substrate Y by the elastic force generated by the flexure of at least a part thereof.

[0118] In addition, in the SC connector, the cover member 1 has an upper surface portion 11 that covers the upper surface of the resin member 2 (housing portion 21), and side surface portions (second side surface portions 15L and 15R) that extend downward from the edge of the upper surface portion 11 and cover the left and right side surfaces of the resin member 2. The left and right second ground connection spring portions 17L and 17R are provided so as to extend from the edges of the side surface portions. Therefore, the left and right second ground connection spring portions 17L and 17R can be arranged at positions where it is difficult to achieve in the cut bending of a part of the upper surface portion 11.

[0119] Here, Figure 2 The two circles (circle C1 and circle C2) shown represent the positions of circle C1 and circle C2 when viewed from above in a state where the inspection substrate Y (see FIG. 10) is connected to the SC connector. The joints of the respective ground connection spring portions for connecting the cover member 1 to the ground pattern Yb of the inspection substrate Y are preferably arranged as little deviated as possible outside the Figure 2 circle C2 shown. As a result, in the present embodiment, this can be achieved by arranging the left and right second ground connection spring portions 17L and 17R in a form extending from the edges of the second side surface portions 15L and 15R.

[0120] In addition, in the present embodiment, the first ground connection spring portions 16L and 16R are formed by the cut bending of a part of the upper surface portion 11, but instead of this, for example, they may be arranged so as to extend from the edges of the first side surface portions 14L and 14R. In this case, since the cut bending is not required, the holes formed in the upper surface portion 11 can be reduced. Thus, according to the connector of the first embodiment, it is possible to effectively prevent the mixing of noise and the like in the transmission between the high-frequency circuits provided on another substrate, and the operation when introducing the inspection of the high-frequency signal into the inspection device is also simplified.

[0121] 2. Second Embodiment

[0122] Next, a second embodiment of the present invention will be described. In addition, the second embodiment is basically the same as the first embodiment except that the third ground connection spring portion 11x is provided to replace the left and right first ground connection spring portions 16L and the first ground connection spring portion 16R, and the related aspects. In the following description, the description of matters different from the first embodiment is focused on, and the description of matters common to the first embodiment is sometimes omitted.

[0123] Figure 11 : is a perspective view of the connector SCa of the second embodiment. Figure 12 The example shows a state in which the inspection substrate Y is connected to the connector SCa provided in the target device. Figure 12 (a) shows the state where the inspection substrate Y is placed above the connector SCa. Figure 12 (b) shows that the inspection substrate Y in the above state is turned downward (at Figure 12 The inspection substrate Y is moved in the direction indicated by the hollow arrow in the figure to connect the inspection substrate Y to the connector SCa.

[0124] like Figure 11 As shown, the connector SCa omits the left and right first ground connection spring portions 16L and the first ground connection spring portion 16R (see Figure 1 etc.), and a third ground connection spring portion 11x is provided instead.

[0125] The third ground connection spring portion 11x is in the shape of a strip having a constant dimension in the width direction that coincides with the left-right direction and has a parallel extension portion 11x1 extending from Figure 11 The imaginary line L1 shown extends backward; and the protrusion 11x2 is formed in a manner that bends upward from the rear end of the parallel extension portion 11x1 and protrudes upward. The upper end of the protrusion 11x2 is gently bent toward the front side in a manner that describes an arc when viewed from the left. The width direction dimension of the third ground connection spring portion 11x is the same as the width direction dimension of the third flat plate portion 3c of the movable electrode member 3, which is 0.5mm, and the front-to-back direction position of the imaginary line L1 coincides with the front-to-back direction position of the inner wall of the front side of the space 21a of the shell portion 21.

[0126] On the left and right sides of the parallel extension portion 11x1 of the cover member 1, fourth through holes 11dL and 11dR extending forward and backward are provided in a manner that the parallel extension portion 11x1 and the edge of the upper surface portion 11 do not contact each other. The rear sides of the fourth through holes 11dL and 11dR are connected to the first through hole 11a. The parallel extension portion 11x1 is formed so as to extend parallel to the leaf spring portion on the upper side of the leaf spring portion of the movable electrode member 3.

[0127] exist Figure 12In the example shown in (a), the inspection substrate Y is arranged such that the conductor pattern Ya is located directly above the folded-back portion 3e, and the ground pattern Yb is located directly above the protruding portion 11x2 of the third ground connection spring portion 11x and the fourth extension portions 17eL and 17eR of the left and right second ground connection spring portions 17L and 17R. Further, the upper ends of the folded-back portion 3e, the protruding portion 11x2 of the third ground connection spring portion 11x, and the fourth extension portions 17eL and 17eR of the left and right second ground connection spring portions 17L and 17R are located at a position higher than the vertical position P1 of the upper ends of the left and right front protruding portions 22L and 22R and the left and right rear protruding portions 23L and 23R.

[0128] When the inspection substrate Y is moved downward from the arranged state until it comes into contact with the upper ends of the left and right front protruding portions 22L and 22R and the left and right rear protruding portions 23L and 23R, it becomes Figure 12 the state shown in (b). When moving in this way, the folded-back portion 3e, the protruding portion 11x2 of the third ground connection spring portion 11x, and the fourth extension portions 17eL and 17eR of the left and right second ground connection spring portions 17L and 17R are pressed downward by the inspection substrate Y.

[0129] Thereby, in Figure 12 the state shown in (b), the contact portion Q1 is brought into close contact with the conductor pattern Ya by the elastic force generated by the flexure of the leaf spring portion Q2. In this way, the contact portion Q1 can be reliably brought into contact with the conductor pattern Ya by the elastic force of the leaf spring portion Q2 of the movable electrode member 3, and the high-frequency signal can be stably transmitted to the conductor pattern Ya.

[0130] In addition, the upper end of the protruding portion 11x2 is brought into close contact with the ground pattern Yb by the elastic force generated by the flexure of the parallel extension portion 11x1 in the same direction as the leaf spring portion Q2. In this way, the protruding portion 11x2 is reliably brought into contact with the ground pattern Yb by the elastic force of the third ground connection spring portion 11x, and the third ground connection spring portion 11x can stably function as a ground. Further, the left and right fourth extension portions 17eL and 17eR are reliably brought into contact with the ground pattern Yb by the elastic forces of the left and right second ground connection spring portions 17L and 17R, and the left and right second ground connection spring portions 17L and 17R can stably function as a ground.

[0131] Furthermore, the distance D8 between the protrusion 11x2 in the first state and the fourth flat portion 3d is the same as the distance D9 between the parallel extension portion 11x1 and the leaf spring portion Q2, and is set to 0.31 mm. In addition, by changing the position of the upper end of the protrusion 11x2 (the position in contact with the inspection substrate Y), it is possible to adjust Figure 12 the degree of deflection of the parallel extension portion 11x1 in the second state shown in (b).

[0132] In the present embodiment, using the above situation, in the following manner, that is, in the second state, the parallel extension portion 11x1 deflects in the same direction as the leaf spring portion, and the parallelism between the parallel extension portion 11x1 and the leaf spring portion Q2 is maintained, and Figure 12 the distances G1 and G2 (the distances between the parallel extension portion 11x1 and the leaf spring portion Q2) shown are the same as Figure 12 the distance G3 (the distance between the protrusion 11x2 and the fourth flat portion 3d) shown is also maintained (maintained at 0.31 mm), and the position of the upper end of the protrusion 11x2 is set. Thus, when the parallel extension portion 11x1 and the leaf spring portion Q2 are pressed by the inspection substrate Y, they deflect downward while maintaining their mutual parallel state, and finally become Figure 12 the state shown in (b).

[0133] As described above, in the connector SCa of the second embodiment, the cover member 1 is formed of a series of metal plates in a manner including the third ground connection spring portion 11x. The third ground connection spring portion 11x has: a parallel extension portion 11x1 that extends in parallel with the leaf spring portion Q2 above the leaf spring portion Q2; and a protrusion 11x2 that is formed by bending upward from the end of the parallel extension portion 11x1 and protrudes more upward than the upper ends of the plurality of protrusions (the left and right front protrusions 22L, the front protrusions 22R, the rear protrusions 23L, and the rear protrusions 23R). In the second state, the protrusion 11x2 is brought into close contact with the inspection substrate Y by the elastic force generated by the deflection of the parallel extension portion 11x1 in the same direction as the leaf spring portion Q2.

[0134] Therefore, the connector SCa can suppress as much as possible the change in the distance between the parallel extension portion 11x1 that functions as a ground in the first state and the second state and the leaf spring portion Q2 that functions as a transmission path for high-frequency signals, and is excellent in terms of characteristic impedance matching.

[0135] In addition, in the connector SCa, the movable electrode member 3 has an extending portion (fourth flat portion 3d) extending upward from the end of the leaf spring portion Q2, and a contact portion Q1 is provided above the fourth flat portion 3d. Moreover, the distance between the protruding portion 11x2 and the fourth flat portion 3d is the same as the distance between the parallel extending portion 11x1 and the leaf spring portion Q2, and the distance between the protruding portion 11x2 and the fourth flat portion 3d and the distance between the parallel extending portion 11x1 and the leaf spring portion Q2 are the same in the first state and the second state.

[0136] Therefore, with respect to both the leaf spring portion Q2 and the fourth flat portion 3d that function as transmission paths for high-frequency signals in the connector SCa, changes in the distance to the ground in the first state and the second state can be suppressed, and it is more excellent in terms of characteristic impedance matching.

[0137] 3. Third Embodiment

[0138] Next, a third embodiment of the present invention will be described. The third embodiment is mainly used as a connector for transmitting high-frequency signals between a plurality of substrates in a device. In the following description, the focus will be on the description of matters different from the first embodiment, and the description of matters common to the first embodiment may sometimes be omitted. In addition, the substrate Z shown later (hereinafter, sometimes referred to as "another substrate Z" for convenience) is another substrate provided in the same device as the device on which the substrate X is provided. Figure 16 The substrate Z shown (hereinafter, sometimes referred to as "another substrate Z" for convenience) is another substrate provided in the same device as the device on which the substrate X is provided.

[0139] Figure 13 is a perspective view of the connector SCb of the third embodiment. In addition, Figure 14 is a structural diagram of the second intermediate M2 formed in the manufacturing process of the connector SCb. In addition, Figure 15 represents Figure 14 the arrangement state of the movable electrode member 3 and the left and right ground bars 4L and 4R (the illustration of the resin member 2 is omitted).

[0140] As Figures 13 - 15 shown, the connector SCb is different from the connector SC of the first embodiment in the following aspects: the fixed electrode member 5 is not provided, and further, the fifth flat portion 3f and the sixth flat portion 3g are omitted in the movable electrode member 3. In addition, the folded portion 3e of the movable electrode member 3 of the connector SCb is bent in the same manner as in the first embodiment, that is, it bends in a U shape backward from the upper edge of the fourth flat portion 3d, but the rear end face does not become a state where it faces completely downward (a completely U-shaped turn state), and the end face is in a state of facing obliquely backward and downward. In this way, by shortening the folded portion of the folded portion 3e (the portion more rearward than the portion in contact with the other substrate Z), the stub can be reduced, and the deterioration of the high-frequency signal can be prevented as much as possible.

[0141] In the third embodiment, a fixed connector SCb is provided by welding on a substrate X (a substrate provided on a target device) having a signal transmission pattern Xa and a ground pattern Xb. The signal transmission pattern Xa is a pattern that functions as a transmission path for high-frequency signals in the target device. The ground pattern Xb is a pattern that functions as a ground.

[0142] In the connector SCb, the first flat plate portion 3a of the movable electrode member 3 is connected and fixed to the signal transmission pattern Xa by welding. In addition, in the connector SCb, all or part of each of the claws 12aL to 15aL, claws 12aR to 15aR, the side plate portions 41L of the left and right grounding bars 4L, the lower edges of the side plate portions 41R, the lower surfaces of the left and right front lower bent portions 42L and the front lower bent portions 42R, and the lower surfaces of the left and right rear lower bent portions 43L and the rear lower bent portions 43R are connected and fixed to the ground pattern Xb by welding. In addition, in order to strengthen the grounding of the connector SC, it is ideal to connect and fix as many parts (preferably all) of the above parts as possible to the ground pattern Xb.

[0143] In a case where another substrate Z is not connected to the connector SCb (for example, Figure 16 (a) shows the condition), the movable electrode member 3 connected to the signal transmission pattern Xa does not contact other conductors, and the connector SCb does not play a role in passing high-frequency signals. In addition, when inspecting the high-frequency signal of the target device, the inspection substrate Y can be used to easily perform the inspection as in the first embodiment.

[0144] Figure 16 The embodiment in which another substrate Z is connected to a connector SCb provided in a target device is illustrated. Figure 16 (a) shows a state where another substrate Z is placed above the connector SCb. Figure 16 (b) shows that the other substrate Z in the above state is moved downward (in Figure 16 The state in which another substrate Z is connected to the connector SCb by moving in the direction indicated by the hollow arrow in the figure.

[0145] exist Figure 16 In the state shown in (b), the signal transmission pattern Xa is electrically connected to the conductor pattern Za provided on the other substrate Z via the movable electrode member 3. Therefore, a high-frequency signal can be transmitted from the signal transmission pattern Xa side to the other substrate Z side. Figure 16 In the state shown in (b), the tip portions 16 aL and 16 aR of the left and right first ground connection spring portions 16L and the first ground connection spring portions 16R are in contact with the ground pattern Zb provided on the other substrate Z.

[0146] 4. Fourth Implementation

[0147] Next, a fourth embodiment of the present invention will be described. In the following description, the focus will be on the description of matters different from those of the third embodiment, and the description of matters common to the third embodiment may sometimes be omitted.

[0148] Figure 17 is a perspective view of the connector SCc of the fourth embodiment. Additionally, Figure 18 is a structural diagram of the second intermediate M2 formed in the manufacturing process of the connector SCc. As Figure 17 and Figure 18 shown, in the connector SCc, two movable electrode members 3L and 3R having the same shape and size are symmetrically arranged on the left and right. The basic structures and functions of the respective movable electrode members 3L and 3R are the same as those of the movable electrode member 3 of the third embodiment.

[0149] In addition, in the fourth embodiment, the left first ground connection spring portion 16L is disposed at a position substantially directly above the left movable electrode member 3L, and the right first ground connection spring portion 16R is disposed at a position substantially directly above the right movable electrode member 3R. In addition, the first through hole 11a is formed such that the folded-back portions 3eL and 3eR of the left and right movable electrode members 3L and 3R protrude more upward than the upper surface portion 11. Further, in the fourth embodiment, the left and right ground bars 4L and 4R are not provided.

[0150] In the fourth embodiment, by arranging the two movable electrode members 3L and 3R on the left and right in parallel, it is possible to handle the working signal. That is, the connector SCc can be used in such a way that a high-frequency signal is led to one of the respective movable electrode members 3L and 3R, and a high-frequency signal having a phase opposite thereto is led to the other.

[0151] 5. Others

[0152] As described above, the connector of each embodiment is provided on a substrate X (equipment substrate) including a transmission path for a high-frequency signal, and the transmission path is electrically connected to a high-frequency signal contact portion (conductor pattern Ya or conductor pattern Za) of a connection object (inspection substrate Y or another substrate Z). In addition, the connector is a connector having a first plane with respect to the connection object, and the first plane is provided with a ground pattern at least in such a manner as to surround the lead wiring pattern from the high-frequency signal contact portion with a predetermined gap.

[0153] Furthermore, the connectors of the embodiments include: a main body, in which an upper surface portion 11 functioning as a ground is formed in a planar shape; a first through-hole 11a provided in the upper surface portion 11; and a movable electrode member 3 located within the main body and elastically contacting a contact portion for a high-frequency signal of a connection target through the first through-hole 11a. In addition, the connector is configured such that by setting a first plane of the connection target to contact or be close to and correspond to the upper surface portion 11, the movable electrode member 3 can be electrically connected to the contact portion for the high-frequency signal, and the ground pattern of the connection target can be electrically connected to the upper surface portion 11. Therefore, the connectors of the embodiments are novel connectors that do not require coaxial plugs or fitting operations and can connect high-frequency circuits without degrading high-frequency signals.

[0154] In addition, regarding the connectors of the first embodiment and the second embodiment, a fixed electrode member 5 is provided within the main body. The fixed electrode member 5 has an end portion that can contact and separate from a free end portion of the movable electrode member 3. In a state where the movable electrode member 3 is electrically connected to the contact portion for the high-frequency signal, the free end portion of the movable electrode member 3 is in a state of being separated from the fixed electrode member 5. In addition, in the connectors of the embodiments, the movable electrode member 3 is formed of a series of strip-shaped metal plates, a leaf spring portion Q2 connected to the transmission path is formed at the fixed end side, and a contact portion Q1 that contacts the contact portion for the high-frequency signal is formed at the free end side. The contact portion Q1 protrudes upward more than the upper surface portion 11.

[0155] In the connector of the second embodiment, the upper surface portion 11 of the main body is formed of a metal plate. The ground connection spring portion formed in the upper surface portion 11 has: a parallel extension portion 11x1 that extends in parallel with the leaf spring portion Q2 above the leaf spring portion Q2; and a protruding portion 11x2 that is formed by bending upward from an end portion of the parallel extension portion 11x1 and protrudes upward more than the upper ends of the plurality of protruding portions. By being pressed by a first planar portion of the connection target, the parallel extension portion 11x1 deflects in the same direction as the leaf spring portion Q2.

[0156] In addition, in the connector of the second embodiment, the movable electrode member 3 has an extension portion (fourth flat portion 3d) that extends upward from an end portion of the leaf spring portion Q2. A contact portion Q1 is provided above the extension portion. The distance between the protruding portion 11x2 and the extension portion is the same as the distance between the parallel extension portion 11x1 and the leaf spring portion Q2. In addition, the distance between the protruding portion 11x2 and the extension portion and the distance between the parallel extension portion 11x1 and the leaf spring portion Q2 are the same regardless of whether there is pressing by the first plane of the connection target.

[0157] In addition, various modifications can be made to the specific form of the connection object in each embodiment. As an example, the form of the lower surface of the inspection substrate Y as the connection object may be set to the same form as the upper surface of the first embodiment (as shown in Figure 10A (a), having a form with a conductor pattern Yc and a ground pattern Yf), and the conductor pattern, ground pattern, and via hole Yh on the upper surface of the inspection substrate Y may be omitted. In this case, a part near the front end of the conductor pattern on the lower surface of the inspection substrate Y functions as a contact portion for high-frequency signals, and the other part of the conductor pattern functions as an extraction wiring pattern.

[0158] In addition, in each embodiment, a predetermined gap is provided between the connection object and the upper surface portion 11 by the stopper portion, but instead of this case, the lower surface of the connection object can be made to contact the upper surface portion 11. However, in this case, in order to avoid electrical conduction between the conductor pattern (the pattern through which high-frequency signals pass) on the connection object side and the upper surface portion 11 that functions as a ground, it is necessary to apply an insulating coating or the like to at least one of the conductor pattern and the upper surface portion 11. Further, in each embodiment, whether the first plane is on the upper surface or the lower surface of the connection object, the upper surface portion 11 and the first plane of the connection object are in a corresponding positional relationship, and the ground pattern is formed on the outer periphery of the lower surface and upper surface of the connection object, but the ground pattern may also be formed within the range covering the upper surface portion 11 of the connector.

[0159] Regarding the structure of the present invention, various changes can also be made within the scope not departing from the gist of the invention in addition to the above-described embodiments. That is, the above-described embodiments are illustrative in all respects and should be considered non-limiting. It should be understood that the technical scope of the present invention is shown not by the description of the above-described embodiments but by the claims, and includes all changes belonging to the meaning and scope equivalent to the claims.

[0160] Industrial Applicability

[0161] The present invention can be used for a connector through which high-frequency signals pass.

[0162] Explanation of Reference Numerals

[0163] 1: Cover member

[0164] 11: Upper surface portion

[0165] 11a: First through hole

[0166] 11bL, 11bR: Second through holes

[0167] 11cL, 11cR: Third through holes

[0168] 12: Front surface part

[0169] 13: Rear surface part

[0170] 14L, 14R: First side surface part

[0171] 15L, 15R: Second side surface part

[0172] 16L, 16R: First ground connection spring part

[0173] 17L, 17R: Second ground connection spring part

[0174] 2: Resin member

[0175] 21: Housing part

[0176] 22L, 22R: Front side projection part

[0177] 23L, 23R: Rear side projection part

[0178] 3: Movable electrode member

[0179] 3a: First flat plate part

[0180] 3b: Second flat plate part

[0181] 3c: Third flat plate part

[0182] 3d: Fourth flat plate part

[0183] 3e: Folded-back part

[0184] 3f: Fifth flat plate part

[0185] 3g: Sixth flat plate part

[0186] 4L, 4R: Grounding rod

[0187] 41L, 41R: Side plate part

[0188] 42L, 42R: Front lower side bent part

[0189] 43L, 43R: Rear lower side bent part

[0190] 44L, 44R: Front upper side bent part

[0191] 45L, 45R: Rear upper side bent part

[0192] 46L, 46R: Hole

[0193] 5: Fixed electrode member

[0194] 5a: Eighth flat plate part

[0195] 5b: Ninth flat part

[0196] 5c: Tenth flat part

[0197] SC, SCa, SCb, SCc: Connector

[0198] X: Substrate

[0199] Xa1: Pattern for signal transmission on the pre-stage side

[0200] Xa2: Pattern for signal transmission on the post-stage side

[0201] Xb: Ground pattern

[0202] Y: Substrate for inspection

[0203] Ya, Yc: Conductor pattern

[0204] Yb, Yf: Ground pattern

[0205] Yd, Ye: Insulating region

[0206] Z: Another substrate

[0207] Za: Conductor pattern

[0208] Zb: Ground pattern

Claims

1. A connector is provided on a device-side substrate including a transmission path for high-frequency signals, and conducts the transmission path to a contact portion for high-frequency signals of a connection object. The connector is a connector with respect to a first plane of the connection object. The first plane is provided with a ground pattern at least in a manner that surrounds the periphery of a lead wiring pattern from the contact portion for high-frequency signals with a predetermined gap. The connector is characterized by including: A main body having an upper surface portion that functions as a ground formed in a planar shape; A through-hole provided in the upper surface portion; And a movable electrode member located within the main body and elastically contacting the contact portion for high-frequency signals of the connection object via the through-hole. The connector is configured such that by setting the first plane of the connection object to contact or approach and correspond to the upper surface portion of the main body, the movable electrode member can be electrically connected to the contact portion for high-frequency signals, and the ground pattern of the connection object can be electrically connected to the upper surface portion.

2. The connector according to claim 1, wherein: A conductive portion connected to the ground pattern is formed on the opposite surface of the first plane of the connection object.

3. The connector according to claim 1, wherein: Within the main body, a fixed electrode member is provided. The fixed electrode member has an end portion that can contact and separate from the free end portion of the movable electrode member. In a state where the movable electrode member is electrically connected to the contact portion for high-frequency signals, the free end portion of the movable electrode member is in a state of being separated from the fixed electrode member.

4. The connector according to claim 1, characterized in that: The movable electrode member is formed of a series of strip-shaped metal plates. A leaf spring portion connected to the transmission path is formed on the fixed end side, and a contact portion that contacts the contact portion for high-frequency signals is formed on the free end side. The contact portion protrudes upward more than the upper surface portion.

5. The connector according to claim 1, wherein: A stopper portion is provided to form a predetermined gap between the upper surface portion and the connection object.

6. The connector according to claim 5, wherein: The stopper portion is a plurality of protrusions protruding upward from the upper surface portion.

7. The connector according to claim 6, wherein: The protrusions protrude through the upper surface portion from a resin material provided within the main body.

8. The connector according to any one of claims 5 to 7, characterized in that: On the upper surface portion, a ground connection spring portion protruding upward more than the upper end of the protrusions is provided, and The ground connection spring portion is brought into electrical contact with the ground of the connection object.

9. The connector according to claim 4, wherein: On both sides in the width direction of the leaf spring portion, ground plate-like members with their surfaces facing each other across the leaf spring portion are arranged. The ground plate-like members are exposed in a manner that enables welding to the device substrate.

10. The connector according to claim 8, characterized in that: The upper surface portion of the main body is formed of a metal plate. The ground connection spring portion formed on the upper surface portion has: a parallel extension portion extending parallel to the leaf spring portion above the leaf spring portion; and a protruding portion formed by bending upward from the end portion of the parallel extension portion and protruding upward more than the upper end of the plurality of protrusions. By pressing by the first plane portion of the connection object, the parallel extension portion deflects in the same direction as the leaf spring portion.

11. The connector according to claim 10, wherein: The movable electrode member has an extension portion extending upward from the end portion of the leaf spring portion, and the contact portion is provided above the extension portion. The distance between the protruding portion and the extending portion is the same as the distance between the parallel extending portion and the leaf spring portion. The distance between the protruding portion and the extending portion and the distance between the parallel extending portion and the leaf spring portion are the same regardless of whether there is pressing by the first plane of the connection object.

12. The connector according to claim 1, wherein: The connection object constitutes at least a part of an inspection device used in the inspection of the high-frequency signal.

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