Computer electronic device surface tin removing device

Abstract

The invention relates to the technical field of tin removing devices, and discloses a computer electronic device surface tin removing device which comprises a cylindrical shell, a separation chamber is fixedly arranged on the surface of the shell in a penetrating mode from inside to outside, a collecting cover is detachably connected to the bottom end of the separation chamber, and supporting protrusions are symmetrically and fixedly arranged on the outer wall of the collecting cover; a separation layer is fixedly arranged on the inner wall of the separation chamber, an upper connector body and a lower connector body are arranged on one side of the separation chamber, a connector body is arranged on the side, close to the tin suction pipe, of the separation chamber, the connector body comprises an extrusion ring, and a tin slag separation assembly is installed in the separation chamber. And the tin slag separating assembly is used for automatically separating tin slag in the collecting cylinder. The driver drives the rotating chamber to rotate by 180 degrees to adjust the positions of the two sets of collecting barrels, when the collecting barrels rotate to the lower side, the filter screen plate in the collecting barrel on the lower side is pushed to slide under the pushing action of gas exhausted by the vacuum pump, and tin slag filtered in the filter screen plate is pushed and discharged.

Description

Technical Field

[0001] The invention relates to the technical field of tin removal devices, in particular to a tin removal device on the surface of computer electronic devices. Background Art

[0002] When computer electronic devices (such as chips, capacitors, resistors, etc. on the motherboard) are damaged, they need to be removed from the circuit board for replacement. The pins of these components are fixed to the circuit board by welding (usually soldering). In order to remove the components safely and completely, the tin around the pins must be removed first. For example, if the power management chip on the motherboard fails, to remove it, you need to first remove the tin from the chip pin solder joints, otherwise forced removal may damage the chip pins or the pads on the circuit board. When disassembling electronic components on the computer motherboard, for chips with more pins, such as some control chips around the CPU socket, using a solder sucker can effectively remove the tin on the pin solder joints. This method is more accurate and can avoid excessive damage to surrounding components and circuits.

[0003] The existing desoldering device does not have corresponding protection measures after heating the desoldering tube. After use, it is placed on the desktop without support, which is easy to cause harm to the device and the equipment.

[0004] After searching, the announcement number CN220902128U discloses a detinning gun for equipment maintenance, including a gun body, a side of the gun body is rotatably connected to an anti-scalding sleeve, and the side of the gun body is located below the anti-scalding sleeve and is damped and connected to a protective bracket, and the inside of the gun body is slidably connected to a collecting cylinder on the side away from the detinning gun barrel. The vacuum regulating valve is adjusted to the required suction force as needed, and the heating temperature is adjusted to the required temperature. The lighting lamp can be turned on and used according to environmental requirements. After the tin is melted by the detinning gun barrel, the tin liquid is sucked into the storage collecting cylinder, and the sucked gas is filtered through the filter chamber and discharged through the air outlet of the vacuum pump. The protective bracket is stretched to prevent the detinning gun barrel from contacting other objects, and the opening and closing plate is opened to remove the collecting cylinder from the inside of the gun body to clean the waste tin. Compared with the prior art, the detinning gun has the effects of preventing accidental touching of the heated gun head, facilitating the removal of the collecting cylinder, and controlling the suction and temperature of the device.

[0005] In the above application, the tin slag is stored inside the collection tube. If it cannot be cleaned in time, it will block the filter chamber under the action of suction and hinder the flow of gas, thereby affecting the adsorption effect of subsequent tin liquid. Frequent cleaning is time-consuming. Summary of the invention

[0006] In view of the deficiencies in the prior art, the present invention provides a device for removing tin from the surface of computer electronic components, which solves the problems of lack of protection measures for the heated desoldering tube and the influence of the adsorption effect of the desoldering gun when the tin liquid is stored.

[0007] To achieve the above objectives, the present invention is realized through the following technical solutions: A tin removal device for the surface of a computer electronic device, including a cylindrical housing, on the surface of which a separation chamber is fixedly arranged penetrating from the inside to the outside. At the bottom end of the separation chamber, a collection cover is detachably connected. On the outer wall of the collection cover, support protrusions are symmetrically fixedly arranged. At one end of the housing close to the collection cover, a soldering iron suction tube with a heating element inside is fixedly arranged. On the inner wall of the separation chamber, a partition layer is fixedly arranged. On the upper side wall of the partition layer, a circular rotating chamber is rotatably connected. On the upper and lower side walls of the rotating chamber, two collection cylinders are respectively fixedly connected. One end of the collection cylinder is fixedly connected to the inner wall of the partition layer. Inside the collection cylinder, a filter mesh plate is slidably connected. On the inner wall of the housing, a vacuum pump is fixedly connected. On one side of the separation chamber close to the vacuum pump, there are two sets of connection joint bodies arranged up and down. On one side of the separation chamber close to the soldering iron suction tube, there is a set of connection joint bodies. The intake end and the exhaust end of the vacuum pump are respectively fixedly connected to one end of two adjacent connection joint bodies through pipelines. The end of the soldering iron suction tube located inside the housing is fixedly connected to one end of the adjacent connection joint body. The connection joint body includes a squeezing ring. Inside the separation chamber, a tin slag separation component is installed, and the tin slag separation component is used to automatically separate the tin slag in the collection cylinder.

[0008] Preferably, the top ends of the two upper squeezing rings are rotatably connected to the inner top wall of the separation chamber through shafts, and the bottom end of the lower squeezing ring is rotatably connected to the outer wall of the partition layer through shafts. One end of the squeezing ring facing the collection cylinder is fixedly connected with a sealing ring. One end of the telescopic tube is fixedly connected to the end of the squeezing ring away from the collection cylinder. The telescopic tube is fixedly connected with a funnel-shaped connecting head at the end away from the squeezing ring, and the outer wall of the connecting head is fixedly connected to the inner wall of the separation chamber.

[0009] Preferably, the tin slag separation component includes a connecting rod that penetrates the rotating chamber, and the outer wall of the connecting rod is fixedly connected to the inner wall of the rotating chamber. One end of the connecting rod is fixedly connected to the inner wall of the separation chamber. On one side of the connecting rod close to the vacuum pump, there is a first connecting plate. On one side of the connecting rod close to the soldering iron suction tube, there is a second connecting plate. On the upper and lower surfaces of the first connecting plate, two first telescopic rods are respectively rotatably connected through shafts. The two upper first telescopic rods are rotatably connected to the outer wall of the upper squeezing ring through shafts, and the two lower first telescopic rods are rotatably connected to the outer wall of the lower squeezing ring through shafts. On the upper surface of the second connecting plate, two second telescopic rods are rotatably connected through shafts, and the top ends of the second telescopic rods are rotatably connected to the outer wall of the adjacent squeezing ring through shafts.

[0010] Preferably, a driver is fixedly connected to the outer wall of the separation chamber. The driving end of the driver penetrates the separation chamber and is fixedly connected to one end of a connecting rod. The connecting rod includes a first rod body at the center. Two ends of the first rod body are respectively fixedly connected with a reciprocating lead screw. One end of the reciprocating lead screw away from the first rod body is fixedly connected with a second rod body. The two reciprocating lead screws are respectively in threaded connection with the adjacent first connecting plate and second connecting plate.

[0011] Preferably, the solder dross separation assembly further includes two tension springs and a magnetic ring. The tension springs are located inside the collection cylinder. Two ends of the tension springs are respectively fixedly connected with the inner wall of the collection cylinder and the outer wall of the filter screen plate. The magnetic ring is located at the mouth of the lower collection cylinder. The outer wall of the magnetic ring is fixedly connected with the inner side wall of the separation chamber. The filter screen plate is made of a ferromagnetic material.

[0012] Preferably, the solder dross separation assembly further includes a rotating shaft. The outer wall of the rotating shaft is rotationally connected to the center of the inner wall of the filter screen plate. One end of the rotating shaft is fixedly connected with an impeller. The other end of the rotating shaft is fixedly connected with a plurality of scraping blades.

[0013] Preferably, a threaded cylinder is fixedly connected to the bottom wall of the partition layer. A connection hole is formed in the lower surface of the collection cover. A bolt is inserted into the connection hole and is in threaded connection with the threaded cylinder. An air outlet hole is formed in the lower surface of the collection cover. Two partition plates are fixedly connected to the inner wall of the collection cover. A circulation port is formed in the surface of the partition plates. A semi-circular upper fixing chamber and a lower fixing chamber are arranged on the opposite sides of the two partition plates. An activated carbon filter element is arranged between the upper fixing chamber and the lower fixing chamber. The bottom wall of the lower fixing chamber is fixedly connected with the inner wall of the collection cover. A connecting column is fixedly connected to the upper surface of the upper fixing chamber. The top end of the connecting column is fixedly connected with the bottom wall of the partition layer. A slot is formed in the bottom wall of the partition layer corresponding to the partition plate. The collection cover is made of a transparent material.

[0014] Preferably, a protection assembly is installed on the outer side of the solder suction pipe. The protection assembly includes a fixed cylinder body. One end of the fixed cylinder body is fixedly connected with the outer wall of the shell. An inner cylinder body is fixedly connected to the inner wall of the fixed cylinder body. A movable cylinder body is slidably connected to the inner wall of the inner cylinder body. A plurality of clamping grooves are formed at one end of the inner cylinder body.

[0015] Preferably, a groove is formed in the surface of the movable cylinder body. A first spring is sleeved outside the groove. An annular outer limiting layer and an inner convex layer are respectively fixedly arranged on the inner and outer walls of the inner cylinder body near the first spring from outside to inside. A counterweight ring is slidably connected to the outer wall of the inner cylinder body. A plurality of balls are nested on the inner wall of the counterweight ring. A plurality of connecting ropes are fixedly connected to the outer wall of the counterweight ring. The other ends of the connecting ropes penetrate the outer limiting layer and are connected to one end of the movable cylinder body.

[0016] Preferably, the inner cylinder body includes a convex main cylinder body. A receiving groove is formed on the outer surface of the main cylinder body. A clamping block is slidably connected inside the receiving groove. A plurality of second springs are fixedly connected to the outer wall of the clamping block, and the other ends of the second springs are fixedly installed on the inner bottom wall of the receiving groove. A connecting protrusion is fixedly connected to the inner wall of the receiving groove. One end of the connecting rope sequentially passes through the main cylinder body and the connecting protrusion and is fixedly connected to the inner wall of the clamping block.

[0017] Working principle: When desoldering the electronic components of a computer motherboard, the motherboard is fixed on the desktop by a fixture. First, preheat the desoldering tube. After running the vacuum pump and the desoldering tube is preheated, melt the solder and suck it into the upper collecting cylinder through the desoldering tube, and intercept it through the filter screen plate, so that the solder slag stays in the upper collecting cylinder to prevent the solder slag from entering the vacuum pump and damaging the vacuum pump. The inhaled gas enters the collecting hood through the lower collecting cylinder and is discharged from the air outlet after being purified by the activated carbon filter element, preventing the harmful gases generated when the solder melts from polluting the air.

[0018] During desoldering, in the initial state, the first connecting plate and the second connecting plate are located at one end of the reciprocating lead screw close to the collecting cylinder, so that the pressing ring pushes the sealing ring to tightly press against the mouth of the collecting cylinder, realizing the sealing fit between the connecting joint body and the collecting cylinder to prevent air leakage. When the vacuum pump stops, the controller controls the driver to operate, and the driver drives the rotating chamber to rotate 180° to swap the positions of the two groups of collecting cylinders. When rotating, the first connecting plate and the second connecting plate move along the reciprocating lead screw to the end far from the mouth of the collecting cylinder and then return to their original positions again, so that the pressing ring rotates first and then rotates in the reverse direction to return to its original position and seal the mouth of the cylinder again. After the collecting cylinder storing the solder slag rotates to the lower side, when the device is used again, the gas discharged by the vacuum pump pushes the filter screen plate to slide, so that the filter screen plate moves to the mouth of the right side of the collecting cylinder, cleaning the inner wall of the collecting cylinder and pushing the solder slag in the collecting cylinder into the collecting hood at the same time, so as to automatically discharge the solder slag from the collecting cylinder, avoiding the accumulation of solder slag in the collecting cylinder from affecting the flow of gas and reducing the adsorption effect of the desoldering tube. At the same time, when the air flow flows in the lower collecting cylinder, it drives the impeller to rotate, the impeller drives the rotating shaft to rotate, and the rotating shaft drives the scraping blade to rotate, so as to clean the surface of the filter screen plate, thereby reducing the adhesion and residue of the solder slag. The upper collecting cylinder can be separated from the collecting hood by the partition layer to prevent the debris from flowing back into the collecting cylinder again and affecting the separation effect.

[0019] When desoldering the main board, the solder sucker is used with the nozzle facing downwards. When the suction tube tilts downwards, the counterweight ring slides downwards, pulling the movable cylinder upwards through the connecting rope, causing the movable cylinder to be received inside the fixed cylinder, thereby exposing the suction tube for desoldering. After use, place the support protrusion against the table or place the device horizontally on the table. At this time, when the suction tube is horizontal or tilted upwards, the pulling force exerted by the gravity of the counterweight ring itself will weaken, and the movable cylinder will extend through the resilience of the first spring, thereby cooperating with the fixed cylinder to provide all-round protection for the suction tube, preventing the user from accidentally touching the hot suction tube, improving the safety during use, and achieving automatic protection without manual operation through different angles of the suction tube.

[0020] When the movable cylinder is fully extended by the elastic force of the first spring, the locking block moves to the card slot, and the locking block extends through the elastic force of the second spring and inserts into the inside of the card slot, thereby locking the movable cylinder, preventing the movable cylinder from sliding due to a thrust force and exposing the suction tube, affecting the protection effect of the protection component, improving the stability and protection effect of the protection component during protection. Moreover, when the suction tube is tilted downwards for use, the counterweight ring and the connecting rope cooperate to exert a longitudinal pulling force on the locking block, causing the locking block to automatically withdraw from the card slot, enabling the movable cylinder to be automatically received, and realizing the automatic adjustment of the protection component.

[0021] The present invention provides a device for desoldering the surface of computer electronic devices. It has the following beneficial effects:

[0022] 1. In the present invention, the drive rotates the rotating chamber by 180° to adjust the positions of the two collecting cylinders. When the lower side of the collecting cylinder rotates, the filter screen plate inside the lower collecting cylinder is pushed to slide under the pushing action of the gas discharged by the vacuum pump, and the tin slag filtered inside is pushed out, thereby preventing the tin slag from obstructing the gas flow and reducing the suction force of the suction tube.

[0023] 2. When the filter screen plate slides to the mouth of the collecting cylinder, the filter screen plate is adsorbed by the magnetic force of the magnetic ring, so that it still stays at the mouth of the cylinder after the vacuum pump stops operating, thereby preventing the tin slag in the collecting cover from entering the collecting cylinder again, causing the problem of incomplete cleaning.

[0024] 3. The protection component of the present invention is adjusted according to the use state of the device. When the suction tube is used with the nozzle facing downwards, the movable cylinder contracts to expose the nozzle of the suction tube. When the suction tube is placed upwards or horizontally, the movable cylinder extends to block the nozzle of the suction tube, thereby realizing anti-scald protection through cooperation with the fixed cylinder, and no manual adjustment is required, which is convenient to use.

[0025] 4. When the movable cylinder is fully extended, the movable cylinder is locked by inserting the locking block into the card slot, preventing the movable cylinder from sliding due to an external force and exposing the nozzle of the suction tube, and improving the stability of the protection component during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a perspective view of the present invention;

[0027] Figure 2 is a schematic sectional view of the housing of the present invention;

[0028] Figure 3 is a schematic sectional view of the separation chamber of the present invention;

[0029] Figure 4 is a schematic structural view of the solder dross separation assembly of the present invention;

[0030] Figure 5 is an unfolded schematic view of the inner wall structure of the collection cylinder of the present invention;

[0031] Figure 6 is a partial schematic view of the connecting rod of the present invention;

[0032] Figure 7 is a schematic structural view of the main body of the connection joint of the present invention;

[0033] Figure 8 is an unfolded structural schematic view of the collection hood of the present invention;

[0034] Figure 9 is a schematic sectional view of the fixed cylinder and the inner cylinder of the present invention;

[0035] Figure 10 is a schematic sectional view of the movable cylinder of the present invention;

[0036] Figure 11 of the present invention Figure 10 is an enlarged view of part A;

[0037] Figure 12 is a schematic structural view of the counterweight ring of the present invention.

[0038] Among them, 1. housing; 2. separation chamber; 3. collection hood; 4. solder suction pipe; 5. partition layer; 6. collection cylinder; 7. filter screen plate; 8. solder slag separation component; 81. connecting rod; 82. connecting plate one; 83. connecting plate two; 84. tension spring; 85. magnetic ring; 86. rotating shaft; 87. scraping blade; 88. impeller; 811. rod body one; 812. reciprocating lead screw; 813. rod body two; 9. protection component; 91. fixed cylinder body; 92. inner cylinder body; 93. movable cylinder body; 94. first spring; 95. outer limiting layer; 96. inner convex layer; 97. counterweight ring; 98. connecting rope; 99. clamping groove; 921. main cylinder body; 922. storage groove; 923. clamping block; 924. second spring; 925. connecting projection; 10. vacuum pump; 11. activated carbon filter element; 12. connecting joint body; 121. extrusion ring; 122. sealing ring; 123. telescopic pipe; 124. connecting head; 13. rotating chamber; 14. driver; 15. threaded cylinder; 16. connecting hole; 17. partition board; 18. upper fixed chamber; 19. lower fixed chamber; 20. air outlet; 21. supporting projection; 22. ball; 23. first telescopic rod; 24. second telescopic rod. Specific embodiments

[0039] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0040] Please refer to the attached Figure 1 - attached Figure 3The embodiment of the present invention provides a device for removing tin from the surface of computer electronic devices, comprising a cylindrical shell 1, a separation chamber 2 is fixedly provided on the surface of the shell 1 from the inside to the outside, a collecting cover 3 is detachably connected to the bottom end of the separation chamber 2, and a supporting protrusion 21 is symmetrically fixedly provided on the outer wall of the collecting cover 3, a tin suction tube 4 with a built-in heating element is fixedly provided on one end of the shell 1 close to the collecting cover 3, a partition layer 5 is fixedly provided on the inner wall of the separation chamber 2, the partition layer 5 is Z-shaped as a whole, and a circular rotating chamber 13 is rotatably connected to the upper side wall of the partition layer 5, and two collecting cylinders 6 are fixedly connected to the upper and lower side walls of the rotating chamber 13 respectively, one end of the collecting cylinder 6 is fixedly connected to the inner wall of the partition layer 5, and a filter screen plate 7 is slidably connected to the inside of the collecting cylinder 6, a vacuum pump 10 is fixedly connected to the inner wall of the shell 1, and an upper and lower set of connecting joint bodies 12 are provided on the side of the separation chamber 2 close to the vacuum pump 10, and a set of connecting joint bodies 12 are provided on the side of the separation chamber 2 close to the tin suction tube 4, and the air inlet and air outlet of the vacuum pump 10 are connected by The pipelines are fixedly connected to one end of two adjacent connecting joint bodies 12 respectively, one end of the tin suction tube 4 located inside the shell 1 is fixedly connected to one end of the adjacent connecting joint body 12, the connecting joint body 12 includes an extrusion ring 121, a tin slag separation component 8 is installed inside the separation chamber 2, the tin slag separation component 8 is used to automatically separate the tin slag in the collecting tube 6, the outer wall of the shell 1 is fixedly provided with an anti-slip sleeve, the anti-slip sleeve is used to have an anti-slip effect when the user holds it, the inner wall of the shell 1 is fixedly provided with a controller and an indicator light, the controller is electrically connected to the indicator light and the vacuum pump 10, the indicator light is electrically connected to the heating element, and the temperature range of the tin suction tube 4 can be displayed when the indicator light is on or off, a control button module is fixedly provided on the front side of the outer wall of the shell 1, and a power interface module is fixedly provided on the rear side of the outer wall of the shell 1, the controller is electrically connected to the control button module and the power interface module, the power interface module is used to plug in the power cord to power the device, and the control button module is used to control the heating element and the vacuum pump 10.

[0041] Specifically, the shell 1 is used for the user to hold, the raised separation chamber 2 and the collecting cover 3 block the user's hands to reduce the chance of the user's hands slipping and accidentally touching the tin suction tube 4, the support protrusion 21 is used to press against the desktop to make the shell 1 tilt upward, the tin suction tube 4 is connected to the vacuum pump 10 through the right connecting joint body 12, the upper collecting tube 6, and the upper left connecting joint body 12. When the vacuum pump 10 is running, suction is generated at the tin suction tube 4. When the tin suction tube 4 is heated, it is used to melt the tin around the pins of the electronic device and suck the tin into the upper collecting tube 6. The filter plate 7 is used to intercept tin slag to prevent the tin slag from entering the vacuum pump 10 and causing damage to the vacuum pump 10. The tin slag separation component 8 is used to discharge the tin slag collected in the lower collecting tube 6.

[0042] Please refer to the attached Figure 7, the tops of the two upper pressing rings 121 are rotatably connected to the inner top wall of the separation chamber 2 by a shaft, and the bottom ends of the lower pressing rings 121 are rotatably connected to the outer wall of the partition layer 5 by a shaft. One end of the pressing ring 121 facing the collection cylinder 6 is fixedly connected with a sealing ring 122, and one end of the pressing ring 121 away from the collection cylinder 6 is fixedly connected with a telescopic pipe 123. One end of the telescopic pipe 123 away from the pressing ring 121 is fixedly connected with a funnel-shaped connecting head 124, and the outer wall of the connecting head 124 is fixedly connected with the inner wall of the separation chamber 2.

[0043] Specifically, the separation chamber 2 is used to fixedly connect the connecting head 124. The three connecting heads 124 are respectively used to connect the intake end and the outlet end of the vacuum pump 10 and the solder suction pipe 4. The telescopic pipe 123 is used to connect the pressing rings 121 and the pressing rings 121. The sealing ring 122 is used to seal the gap between the pressing ring 121 and the collection cylinder 6 when the pressing ring 121 abuts against the collection cylinder 6 to prevent air leakage when the gas flows. When the pressing ring 121 rotates, it drives the sealing ring 122 to move. When the pressing ring 121 is inclined, the sealing ring 122 does not tightly abut against the collection cylinder 6. When the pressing ring 121 is vertical, the sealing ring 122 tightly abuts against the collection cylinder 6.

[0044] Please refer to the appendix Figure 4 - appendix Figure 6 , the solder dross separation assembly 8 includes a connecting rod 81. The connecting rod 81 passes through the rotating chamber 13, and the outer wall of the connecting rod 81 is fixedly connected with the inner wall of the rotating chamber 13. One end of the connecting rod 81 is fixedly connected with the inner wall of the separation chamber 2. A first connecting plate 82 is arranged on one side of the connecting rod 81 close to the vacuum pump 10, and a second connecting plate 83 is arranged on one side of the connecting rod 81 close to the solder suction pipe 4. The upper surface and the lower surface of the first connecting plate 82 are respectively rotatably connected with two first telescopic rods 23 by a shaft. The two upper first telescopic rods 23 are rotatably connected with the outer wall of the upper pressing ring 121 by a shaft, and the two lower first telescopic rods 23 are rotatably connected with the outer wall of the lower pressing ring 121 by a shaft. The upper surface of the second connecting plate 83 is rotatably connected with two second telescopic rods 24 by a shaft. The top ends of the second telescopic rods 24 are rotatably connected with the outer wall of the adjacent pressing ring 121 by a shaft. The outer wall of the separation chamber 2 is fixedly connected with a driver 14. The driving end of the driver 14 passes through the separation chamber 2 and is fixedly connected with one end of the connecting rod 81. The connecting rod 81 includes a rod body one 811 at the center. Both ends of the rod body one 811 are respectively fixedly connected with a reciprocating lead screw 812. One end of the reciprocating lead screw 812 away from the rod body one 811 is fixedly connected with a rod body two 813. The left reciprocating lead screw 812 is threadedly connected with the first connecting plate 82, and the right reciprocating lead screw 812 is threadedly connected with the second connecting plate 83.

[0045] Specifically, the telescopic rod 1-23 is used to connect the extrusion ring 121 and the first connecting plate 82, and the telescopic rod 2-24 is used to connect the extrusion ring 121 and the second connecting plate 83. The telescopic rod 1-23 and the telescopic rod 2-24 automatically expand, contract and rotate when the extrusion ring 121 rotates to avoid motion interference. When the first connecting plate 82 and the second connecting plate 83 rotate, the extrusion ring 121 is pushed to rotate through the telescopic rod 1-23 and the telescopic rod 2-24. The connecting rod 81 is used to connect the rotating chamber 13. The driver 14 rotates 180° once to drive the connecting rod 81 to rotate. The rotation of the connecting rod 81 drives the rotating chamber 13 to rotate. The rotation of the rotating chamber 13 is used to adjust the positions of the upper and lower collecting cylinders 6. The reciprocating lead screw 812 rotates to drive the first connecting plate 82 and the second connecting plate 83 to move. The movement of the first connecting plate 82 drives the connected extrusion ring 121 to rotate through the telescopic rod 1-23. The movement of the second connecting plate 83 drives the connected extrusion ring 121 to rotate through the telescopic rod 2-24. The time required for the first connecting plate 82 and the second connecting plate 83 to move the total stroke length during a single movement of the reciprocating lead screw 812 is the same as the time required for the connecting rod 81 to rotate 90°. Therefore, when the connecting rod 81 drives the rotation and rotates 180 degrees, the first connecting plate 82 and the second connecting plate 83 respectively move two stroke lengths. The extrusion ring 121 first rotates obliquely and then rotates vertically. After the position of the collecting cylinder 6 is adjusted, the extrusion ring 121 abuts against the mouth of the collecting cylinder 6 again for sealing. Thus, when the collecting cylinder 6 rotates, the extrusion ring 121 drives the sealing ring 122 to rotate synchronously, reducing the resistance exerted by the sealing ring 122 when the collecting cylinder 6 rotates and reducing the wear on the sealing ring 122 at the same time.

[0046] Please refer to the attached Figure 4 - attached Figure 5 The solder slag separation assembly 8 further includes two tension springs 84 and a magnetic ring 85. The tension springs 84 are located inside the collecting cylinder 6. The two ends of the tension springs 84 are respectively fixedly connected to the inner wall of the collecting cylinder 6 and the outer wall of the filter screen plate 7. The magnetic ring 85 is located at the mouth of the lower collecting cylinder 6. The outer wall of the magnetic ring 85 is fixedly connected to the inner side wall of the separation chamber 2. The filter screen plate 7 is made of a ferromagnetic material.

[0047] Specifically, the tension springs 84 are used to limit the position of the filter screen plate 7 so that it remains in the central area inside the collecting cylinder 6 when not subjected to external forces, achieving the effect of restoring the position of the filter screen plate 7. The filter screen plate 7 inside the lower collecting cylinder 6 is pushed by the gas discharged by the vacuum pump 10 and slides to the mouth of this collecting cylinder 6 to the right, thereby pushing the solder slag inside the lower collecting cylinder 6 out of this collecting cylinder 6. Moreover, when the filter screen plate 7 moves to the right mouth of the collecting cylinder 6, it approaches the magnetic ring 85. The magnetic ring 85 exerts a magnetic suction force on the filter screen plate 7, causing the filter screen plate 7 to stay at the mouth for blocking, preventing the solder slag from entering the collecting cylinder 6 again and affecting the discharge effect of the solder slag.

[0048] Please refer to the attached Figure 5, the dross separation component 8 further includes a rotating shaft 86. The outer wall of the rotating shaft 86 is rotatably connected to the center of the inner wall of the filter mesh plate 7. One end of the rotating shaft 86 is fixedly connected with an impeller 88, and the other end of the rotating shaft 86 is fixedly connected with a plurality of scraping blades 87.

[0049] Specifically, one side of the scraping blade 87 facing the filter mesh plate 7 is attached to the outer wall of the filter mesh plate 7. When the air flow flows inside the lower collecting cylinder 6, it cooperates with the blades on the surface of the impeller 88 to drive the rotating shaft 86 to rotate. The rotation of the rotating shaft 86 drives the scraping blade 87 to rotate, and the rotation of the scraping blade 87 cleans the side of the filter mesh plate 7 facing the dross, thereby reducing the adhesion and residue of the dross.

[0050] Please refer to the appendix Figure 8 , a threaded cylinder 15 is fixedly connected to the bottom wall of the separation layer 5. A connection hole 16 is opened on the lower surface of the collecting cover 3. A bolt is inserted into the connection hole 16, and the bolt is threadedly connected to the threaded cylinder 15. An air outlet hole 20 is opened on the lower surface of the collecting cover 3. Two partition plates 17 are fixedly connected to the inner wall of the collecting cover 3. A circulation port is opened on the surface of the partition plate 17. A semi-circular upper fixing chamber 18 and a lower fixing chamber 19 are arranged on the opposite sides of the two partition plates 17. An activated carbon filter element 11 is arranged between the upper fixing chamber 18 and the lower fixing chamber 19. The bottom wall of the lower fixing chamber 19 is fixedly connected to the inner wall of the collecting cover 3. A connection column is fixedly connected to the upper surface of the upper fixing chamber 18, and the top end of the connection column is fixedly connected to the bottom wall of the separation layer 5. Slots are opened on the bottom wall of the separation layer 5 corresponding to the partition plates 17. The collecting cover 3 is made of a transparent material.

[0051] Specifically, the transparent collecting cover 3 facilitates the user to observe the storage amount of dross in the collecting cover 3 so as to clean it in time. By connecting the bolt to the threaded cylinder 15, the detachable connection of the collecting cover 3 is realized. After the collecting cover 3 is installed, the partition plate 17 is inserted into the inside of the slot to form a partition on both sides of the activated carbon filter element 11, so that the gas discharged by the vacuum pump 10 passes through the activated carbon filter element 11 through the circulation port for filtration, reducing the harmful gas in the gas. The filtered gas is discharged from the air outlet hole 20. The upper fixing chamber 18 and the lower fixing chamber 19 are used to fix the activated carbon filter element 11 after the collecting cover 3 is installed. By rotating the bolt to open the collecting cover 3, the dross can be cleaned or the activated carbon filter element 11 can be replaced, which is convenient to use.

[0052] Please refer to the appendix Figure 9 - appendix Figure 10, a protective component 9 is installed on the outer side of the solder suction pipe 4. The protective component 9 includes a fixed cylinder 91. One end of the fixed cylinder 91 is fixedly connected to the outer wall of the housing 1. An inner cylinder 92 is fixedly connected to the inner wall of the fixed cylinder 91. A movable cylinder 93 is slidably connected to the inner wall of the inner cylinder 92. A plurality of card slots 99 are opened at one end of the inner cylinder 92. The fixed cylinder 91 and the movable cylinder 93 are made of ceramic materials or thermoplastic materials such as polyimide, which blocks the heat transfer around the solder suction pipe 4 and has an anti-scalding effect. There are gaps between the inner walls of the fixed cylinder 91, the inner cylinder 92 and the movable cylinder 93 and the outer wall of the solder suction pipe 4.

[0053] Specifically, the fixed cylinder 91 is used to provide anti-scalding protection for a part of the solder suction pipe 4, and when the movable cylinder 93 extends out, it can cover the nozzle position of the solder suction pipe 4, so as to provide comprehensive anti-scalding protection for the solder suction pipe 4.

[0054] Please refer to the appendix Figure 9 - appendix Figure 12 , grooves are opened on the surface of the movable cylinder 93. A first spring 94 is sleeved outside the grooves. An annular outer limiting layer 95 and an inner protruding layer 96 are fixedly arranged on the inner and outer walls of one end of the inner cylinder 92 close to the first spring 94 from outside to inside. A counterweight ring 97 is slidably connected to the outer wall of the inner cylinder 92. A plurality of connecting ropes 98 are fixedly connected to the outer wall of the counterweight ring 97. The other ends of the connecting ropes 98 penetrate through the outer limiting layer 95 and are connected to one end of the movable cylinder 93. A plurality of balls 22 are nested on the inner wall of the counterweight ring 97. The balls 22 are used to reduce the friction when the counterweight ring 97 moves, so that it can slide along the inner cylinder 92 more smoothly. The gravity of the counterweight ring 97 is greater than the pulling force of the first spring 94. Threaded through holes are opened at the outer edge of the solder suction pipe 4 near the nozzle. By connecting a locking bolt in the threaded through hole, the locking bolt tightly abuts against the counterweight ring 97 for limiting, so that the movable cylinder 93 always remains in the fixed cylinder 91 and the nozzle of the solder suction pipe 4 is exposed, so that the solder suction pipe 4 can be rotated and used at other angles except downward, increasing the flexibility during use.

[0055] Specifically, the outer limiting layer 95 is used to prevent the counterweight ring 97 from disengaging from the movable cylinder 93 and limit the connecting ropes 98. The inner protruding layer 96 is used to prevent the first spring 94 from disengaging from the grooves. The first spring 94 is used to apply an elastic force to the movable cylinder 93 so that it extends out for protection when the solder suction pipe 4 is horizontal or tilted upward. When the solder suction pipe 4 is tilted downward for use, the counterweight ring 97 pulls the movable cylinder 93 to slide upward through the connecting ropes 98 for storage, so that the nozzle of the solder suction pipe 4 is exposed for use. Thus, the position of the movable cylinder 93 is automatically adjusted according to the use state of the device, so as to automatically block or expose the nozzle of the solder suction pipe 4 without manual adjustment.

[0056] Please refer to the appendix Figure 10 - appendix Figure 11, the inner cylinder 92 includes a convex main cylinder 921. A storage groove 922 is formed on the outer surface of the main cylinder 921. A clamping block 923 is slidably connected inside the storage groove 922. A plurality of second springs 924 are fixedly connected to the outer wall of the clamping block 923, and the other ends of the second springs 924 are fixedly installed on the inner bottom wall of the storage groove 922. A connecting protrusion 925 is fixedly connected to the inner wall of the storage groove 922. One end of the connecting rope 98 sequentially penetrates through the main cylinder 921 and the connecting protrusion 925 and is fixedly connected to the inner wall of the clamping block 923.

[0057] Specifically, the inner cylinder 92 presses against the clamping block 923 to receive it into the storage groove 922. When the movable cylinder 93 is fully extended, the storage groove 922 moves to align with the card slot 99. At this time, the clamping block 923 extends out through the elastic force of the second spring 924 and inserts into the inside of the card slot 99, thereby locking the movable cylinder 93 to prevent the movable cylinder 93 from sliding under the action of an external force, resulting in the exposure of the nozzle of the solder suction tube 4 and improving the stability of the protection component 9 during use. The connecting protrusion 925 is used to convert the lateral tension applied by the counterweight ring 97 to the connecting rope 98 into a longitudinal tension, so that when the clamping block 923 is pulled by the gravity of the counterweight ring 97 through the connecting rope 98, it slides into the storage groove 922, thereby automatically canceling the fixation of the movable cylinder 93.

[0058] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made in these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A tin removal device for the surface of a computer electronic device, comprising a cylindrical housing (1), characterized in that: The surface of the housing (1) is fixedly provided with a separation chamber (2) penetrating from the inside to the outside. The bottom end of the separation chamber (2) is detachably connected with a collection cover (3). Symmetrically fixed on the outer wall of the collection cover (3) are support protrusions (21). One end of the housing (1) close to the collection cover (3) is fixedly provided with a soldering iron suction tube (4) with a heating element built therein. Fixed on the inner wall of the separation chamber (2) is a partition layer (5). Rotatably connected to the upper side wall of the partition layer (5) is a circular rotating chamber (13). Fixedly connected to the upper and lower side walls of the rotating chamber (13) are two collection cylinders (6) respectively. One end of the collection cylinder (6) is fixedly connected to the inner wall of the partition layer (5). Slidably connected inside the collection cylinder (6) is a filter screen plate (7). Fixedly connected to the inner wall of the housing (1) is a vacuum pump (10). On one side of the separation chamber (2) close to the vacuum pump (10) are arranged two sets of connection joint bodies (12) up and down. On one side of the separation chamber (2) close to the soldering iron suction tube (4) is arranged a set of connection joint bodies (12). The air inlet end and the air outlet end of the vacuum pump (10) are fixedly connected to one end of two adjacent connection joint bodies (12) respectively through pipelines. The end of the soldering iron suction tube (4) located inside the housing (1) is fixedly connected to one end of the adjacent connection joint body (12). The connection joint body (12) includes a pressing ring (121). Inside the separation chamber (2) is installed a tin slag separation component (8), and the tin slag separation component (8) is used for automatically separating the tin slag in the collection cylinder (6).

2. The surface tin removal device for computer electronic devices according to claim 1, characterized in that: The top ends of the two upper pressing rings (121) are rotatably connected to the inner top wall of the separation chamber (2) through shafts. The bottom end of the lower pressing ring (121) is rotatably connected to the outer wall of the partition layer (5) through shafts. Fixedly connected to one end of the pressing ring (121) facing the collection cylinder (6) is a sealing ring (122). Fixedly connected to one end of the pressing ring (121) away from the collection cylinder (6) is an expansion tube (123). Fixedly connected to the end of the expansion tube (123) away from the pressing ring (121) is a funnel-shaped connection head (124), and the outer wall of the connection head (124) is fixedly connected to the inner wall of the separation chamber (2).

3. A tin removal device for the surface of a computer electronic device according to claim 1, characterized in that: The solder dross separation component (8) includes a connecting rod (81). The connecting rod (81) penetrates through the rotating chamber (13), and the outer wall of the connecting rod (81) is fixedly connected to the inner wall of the rotating chamber (13). One end of the connecting rod (81) is fixedly connected to the inner wall of the separation chamber (2). On the side of the connecting rod (81) close to the vacuum pump (10), there is a first connecting plate (82). On the side of the connecting rod (81) close to the solder suction pipe (4), there is a second connecting plate (83). The upper surface and the lower surface of the first connecting plate (82) are respectively rotatably connected by shafts to two first telescopic rods (23). The two upper first telescopic rods (23) are rotatably connected to the outer wall of the upper pressing ring (121) by shafts. The two lower first telescopic rods (23) are rotatably connected to the outer wall of the lower pressing ring (121) by shafts. The upper surface of the second connecting plate (83) is rotatably connected by a shaft to two second telescopic rods (24). The top ends of the second telescopic rods (24) are rotatably connected to the outer wall of the adjacent pressing ring (121) by shafts.

4. A tin removal device for the surface of a computer electronic device according to claim 3, characterized in that: A driver (14) is fixedly connected to the outer wall of the separation chamber (2). The driving end of the driver (14) penetrates through the separation chamber (2) and is fixedly connected to one end of the connecting rod (81). The connecting rod (81) includes a first rod body (811) at the center. Two ends of the first rod body (811) are respectively fixedly connected to a reciprocating lead screw (812). One end of the reciprocating lead screw (812) away from the first rod body (811) is fixedly connected to a second rod body (813). The two reciprocating lead screws (812) are respectively threadedly connected to the adjacent first connecting plate (82) and second connecting plate (83).

5. A tin removal device for the surface of a computer electronic device according to claim 1, characterized in that: The solder dross separation component (8) further includes two tension springs (84) and a magnetic ring (85). The tension springs (84) are located inside the collection cylinder (6). Two ends of the tension springs (84) are respectively fixedly connected to the inner wall of the collection cylinder (6) and the outer wall of the filter screen plate (7). The magnetic ring (85) is located at the mouth of the lower collection cylinder (6). The outer wall of the magnetic ring (85) is fixedly connected to the inner side wall of the separation chamber (2). The filter screen plate (7) is made of a ferromagnetic material.

6. The surface tin removal device for a computer electronic device according to claim 1, wherein: The solder dross separation component (8) further includes a rotating shaft (86). The outer wall of the rotating shaft (86) is rotatably connected to the center of the inner wall of the filter screen plate (7). One end of the rotating shaft (86) is fixedly connected to an impeller (88). The other end of the rotating shaft (86) is fixedly connected to a plurality of scraping blades (87).

7. The surface tin removal device for a computer electronic device according to claim 1, characterized in that: The bottom wall of the partition layer (5) is fixedly connected with a threaded cylinder (15). A connection hole (16) is formed in the lower surface of the collection cover (3). A bolt is inserted into the connection hole (16), and the bolt is in threaded connection with the threaded cylinder (15). An air outlet hole (20) is formed in the lower surface of the collection cover (3). Two partition plates (17) are fixedly connected to the inner wall of the collection cover (3). A circulation port is formed in the surface of the partition plate (17). A semi-circular upper fixing chamber (18) and a lower fixing chamber (19) are arranged on the opposite sides of the two partition plates (17). An activated carbon filter element (11) is arranged between the upper fixing chamber (18) and the lower fixing chamber (19). The bottom wall of the lower fixing chamber (19) is fixedly connected to the inner wall of the collection cover (3). A connecting column is fixedly connected to the upper surface of the upper fixing chamber (18). The top end of the connecting column is fixedly connected to the bottom wall of the partition layer (5). Slots are formed in the bottom wall of the partition layer (5) corresponding to the partition plates (17). The collection cover (3) is made of a transparent material.

8. A tin removal device for the surface of a computer electronic device according to claim 1, characterized in that: A protection component (9) is installed on the outer side of the solder suction pipe (4). The protection component (9) includes a fixed cylinder body (91). One end of the fixed cylinder body (91) is fixedly connected to the outer wall of the housing (1). An inner cylinder body (92) is fixedly connected to the inner wall of the fixed cylinder body (91). A movable cylinder body (93) is slidably connected to the inner wall of the inner cylinder body (92). A plurality of clamping grooves (99) are formed in one end of the inner cylinder body (92).

9. The surface tin removal device for a computer electronic device according to claim 8, characterized in that: A groove is formed in the surface of the movable cylinder body (93). A first spring (94) is sleeved outside the groove. An annular outer limiting layer (95) and an inner convex layer (96) are fixedly arranged on the inner and outer walls of the inner cylinder body (92) near the first spring (94) from outside to inside. A counterweight ring (97) is slidably connected to the outer wall of the inner cylinder body (92). A plurality of balls (22) are nested on the inner wall of the counterweight ring (97). A plurality of connecting ropes (98) are fixedly connected to the outer wall of the counterweight ring (97). The other ends of the connecting ropes (98) penetrate through the outer limiting layer (95) and are connected to one end of the movable cylinder body (93).

10. A tin removal device for the surface of a computer electronic device according to claim 9, characterized in that: The inner cylinder body (92) includes a convex main cylinder body (921). A storage groove (922) is formed in the outer surface of the main cylinder body (921). A clamping block (923) is slidably connected to the inside of the storage groove (922). A plurality of second springs (924) are fixedly connected to the outer wall of the clamping block (923). The other ends of the second springs (924) are fixedly installed on the inner bottom wall of the storage groove (922). A connecting protrusion (925) is fixedly connected to the inner wall of the storage groove (922). One end of the connecting rope (98) sequentially penetrates through the main cylinder body (921) and the connecting protrusion (925) and is fixedly connected to the inner wall of the clamping block (923).

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