Semiconductor device screening and testing device

Abstract

The invention belongs to the technical field of semiconductor testing devices, and particularly relates to a semiconductor device screening and testing device which comprises a water collecting mechanism, a testing box is mounted on the upper surface of the water collecting mechanism, a testing mechanism is mounted in the testing box, a pin detecting mechanism is mounted in the testing mechanism, and the pin detecting mechanism is connected with the testing box. The testing mechanism comprises a semiconductor body arranged in the testing box, the surface of the semiconductor body is connected with a wire body, and the surface of the wire body is fixedly connected with a moving plate through a bolt; through the above structural cooperation, based on the mutual cooperation of the testing mechanism and the pin testing mechanism, the semiconductor body is inserted into the testing box, based on the driving mechanism, the striking rod repeatedly strikes the semiconductor body through the guide cylinder, and meanwhile purified water in the water collecting tank is injected into the testing box. Therefore, not only can the hardness of the packaging device of the semiconductor body be tested, but also the air tightness of the packaging device can be tested.

Description

Technical Field

[0001] The present invention belongs to the technical field of testing devices, and specifically relates to a semiconductor device screening and testing device. Background Art

[0002] A semiconductor device is an electronic device with electrical conductivity between that of a good conductor and an insulator. It uses the special electrical properties of semiconductor materials to perform specific functions, and can be used to generate, control, receive, transform, amplify signals, and perform energy conversion. The semiconductor materials of semiconductor devices are silicon, germanium, or gallium arsenide, and can be used as rectifiers, oscillators, light emitters, amplifiers, photodetectors, etc. To distinguish it from integrated circuits, it is sometimes also called a discrete device. The basic structure of most two-terminal devices (i.e., crystal diodes) is a PN junction. Semiconductor devices usually use different semiconductor materials, adopt different processes and geometric structures, and have developed a wide variety of crystal diodes with different functions and uses. The frequency coverage range of crystal diodes can range from low frequency, high frequency, microwave, millimeter wave, infrared to light wave.

[0003] A patent with the Chinese invention patent publication number CN114047420B discloses a semiconductor package device testing device. The key points of its technical solution are: including a base, a second plate is fixedly connected to the top surface of the base, a third plate is fixedly connected to one side of the second plate, a moving column is slidably connected to the third plate, the moving column penetrates the third plate, a stop rod and an L-shaped rod are fixedly connected to one side of the moving column, the stop rod is located above the third plate, the L-shaped rod is located below the third plate, a ninth column is rotatably connected to one side of the second plate close to the moving column, a sixth rod is fixedly connected to one end of the ninth column, a seventh column is fixedly connected to one side of the sixth rod close to the moving column, an eighth column is fixedly connected to one side of the L-shaped rod, the seventh column cooperates with the eighth column, a first spring is sleeved outside the moving column, the first spring is located between the L-shaped rod and the third plate, and a striking block is fixedly connected to the bottom end of the moving column. The present invention achieves the purpose of testing the firmness of the outside of the package device.

[0004] However, the above technologies often have the following defects: Although through the mutual cooperation of the driving motor and the ninth column and other structures, the striking block drops to strike the outside of the package device, repeating the above process, and judging according to the damage condition of the outside of the package device, so as to achieve the purpose of testing the firmness of the outside of the package device, but when testing the connection performance between the wire and the package device, it is impossible to simultaneously test the connection between the wire and the package device and the air tightness of the package device, which may cause external dust and other impurities to enter the inside of the package device during the use of the semiconductor device, affecting the semiconductor device.

[0005] Therefore, the present invention provides a semiconductor device screening and testing device. Summary of the Invention

[0006] To make up for the deficiencies of the prior art and solve at least one technical problem proposed in the background art.

[0007] The technical solution adopted by the present invention to solve its technical problems is as follows: A semiconductor device screening and testing device described in the present invention includes a water collecting mechanism, on the upper surface of which a testing box is installed. Inside the testing box, a testing mechanism is installed, and inside the testing mechanism, a pin detection mechanism is installed. The testing mechanism includes a semiconductor body disposed inside the testing box. A wire body is connected to the surface of the semiconductor body. A moving plate is fixedly connected to the surface of the wire body by bolts. A linkage toothed plate is fixedly connected to the surface of the moving plate. A driving gear meshes with the surface of the linkage toothed plate. One side of the semiconductor body is in contact with a guiding cylinder fixedly connected inside the testing box. A striking rod is slidably inserted into the guiding cylinder. A movable plate is fixedly connected to the surface of the striking rod. A driving toothed plate corresponding to the driving gear is fixedly connected to the upper surface of the movable plate. A driving mechanism is installed on one side of the striking rod.

[0008] As a further scheme of the present invention: The pin detection mechanism includes pins fixedly connected to one side of the semiconductor body in a rectangular array. A fixing plate is sleeved on the surfaces of several pins. A sealing box corresponding to the semiconductor body is slidably sleeved on the surface of the fixing plate. A sealing cover is fixedly connected to the surface of the sealing box by bolts. A plugging groove corresponding to the pins is formed on one side of the fixing plate. A moving rod is fixedly connected to one side of the fixing plate by bolts.

[0009] As a further scheme of the present invention: The pin detection mechanism further includes a communicating pipe fixedly connected to the surface of the fixing plate and communicating with the plugging groove. One end of the communicating pipe is fixedly connected to a water collecting box with glue inside. The water collecting box is fixedly connected to the moving rod. An extrusion plate is slidably connected inside the water collecting box. A threaded rod is threadedly connected to the surface of the extrusion plate and rotatably connected to the water collecting box. One end of the threaded rod is fixedly connected to a servo motor with an output end fixedly connected to the threaded rod.

[0010] As a further scheme of the present invention: The pin detection mechanism further includes a pushing plate fixedly connected to one end of the moving rod. An iron plate corresponding to the movable plate is fixedly connected to one side of the pushing plate. A supporting plate is fixedly connected inside the testing box. An electromagnetic coil is fixedly connected inside the supporting plate. An adsorption plate corresponding to the electromagnetic coil and the iron plate is fixedly connected to one side of the supporting plate.

[0011] As a further solution of the present invention: The testing mechanism further includes a support rod fixedly connected to one side of the support plate. A magnet block is rotatably sleeved on the surface of the support rod. A connecting frame fixedly connected to the sealing cover is fixedly connected to the surface of the magnet block. A guide plate slidably connected to the linkage toothed plate is fixedly connected to the surface of the connecting frame. The driving gear is rotatably connected to the connecting frame through a bearing seat.

[0012] As a further solution of the present invention: The driving mechanism includes a driving motor fixedly connected to the inside of the testing box. The output end of the driving motor is fixedly connected to a rotating rod. One end of the rotating rod is fixedly connected to a rotating disc rotatably connected to the inside of the testing box. A turning plate rotatably connected to the striking rod is rotatably connected to the surface of the rotating disc through a pin shaft. Limiting tubes fixedly connected to the testing box are sleeved on the surfaces of the rotating rod and the guiding tube.

[0013] As a further solution of the present invention: A return spring is fixedly connected to the upper surface of the sealing cover. One end of the return spring is fixedly connected to a hook. A limiting ring fixedly connected to the adsorption plate is attached to the surface of the hook. The fixing plate and the moving rod both slide inside the sealing box.

[0014] As a further solution of the present invention: The water collection mechanism includes a support bottom plate. A water collection tank is fixedly connected to the upper surface of the support bottom plate. A hollow box is fixedly connected to the upper surface of the water collection tank. The testing box is fixedly connected to the inside of the hollow box. A water inlet pipe communicating with the hollow box is fixedly connected to one side of the water collection tank. The pure water provided inside the water collection tank is pumped into the inside of the testing box through the mutual cooperation of an existing water pump and the water inlet pipe.

[0015] As a further solution of the present invention: The water collection mechanism further includes a drain pipe fixedly connected to one side of the testing box. A solenoid valve is installed on the surface of the drain pipe. The testing box communicates with the hollow box through the drain pipe. An electric heating plate is fixedly connected to the inner bottom wall of the testing box. A water adding pipe is fixedly connected to one side of the water collection tank.

[0016] The beneficial effects of the present invention are as follows: 1. For a semiconductor device screening and testing device of the present invention, based on the mutual cooperation of structures such as the testing mechanism and the pin testing mechanism, the semiconductor body is inserted into the inside of the testing box. Based on the driving mechanism, the striking rod repeatedly impacts the semiconductor body through the guiding tube. At the same time, the pure water inside the water collection tank is injected into the inside of the testing box. Thus, it is possible to not only test the hardness of the encapsulation device of the semiconductor body, but also test the airtightness of the encapsulation device. 2. The semiconductor device screening and testing device described in the present invention, based on the mutual cooperation of structures such as the testing mechanism and the pin testing mechanism, during the movement of the striking rod, simultaneously drives the striking rod, the movable plate, and the driving tooth plate to move, causing the driving tooth plate to mesh with the driving gear automatically, driving the linkage tooth plate to rotate, causing the linkage tooth plate to drive the moving plate to move, and thus causing the moving plate to drive the wire body to move, pulling the wire body to test the connection performance and airtightness at the connection between the wire body and the semiconductor body. Therefore, while testing the airtightness and firmness of the packaging device of the semiconductor body, the semiconductor device screening and testing device also tests the connection point; 3. The semiconductor device screening and testing device described in the present invention, based on the setting of structures such as the pin detection mechanism, when the movable plate and the striking rod move, while the movable plate pushes the iron plate to move, the electromagnetic coil is energized, causing the adsorption plate to generate magnetic force to adsorb the iron plate, causing the fixing plate to apply a pulling force to the pin to test the tensile performance of the pin. Therefore, the semiconductor device screening and testing device can simultaneously test the pins, and screen the semiconductor devices according to the tests of the packaging device of the semiconductor body, the connection point, and the tensile performance of the pins, and select semiconductor devices of different specifications; 4. The semiconductor device screening and testing device described in the present invention, through the mutual cooperation of structures such as the electric heating plate and the return spring, based on the water pump injecting pure water inside the water collection tank into the test box, and simultaneously starting the electric heating plate to heat the pure water, enables the semiconductor device screening and testing device to test the packaging device of the semiconductor body at different temperatures. And through the elasticity of the return spring, after the pin test is completed, the electromagnetic coil is powered off, and the return spring drives the moving rod to reset, facilitating the multiple use of the pin detection mechanism. And through the setting of the bolts, the sealing cover and the sealing box are more convenient to disassemble, facilitating the replacement of the components inside the sealing box. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention will be further described below with reference to the accompanying drawings.

[0018] Figure 1 is the structural schematic diagram of the present invention; Figure 2 is the structural schematic diagram of the second perspective of the present invention; Figure 3 is the structural schematic diagram of the water collection mechanism and the test box of the present invention; Figure 4 is the structural schematic diagram of the test box and the electric heating plate of the present invention; Figure 5 is the structural schematic diagram of the driving mechanism and the testing mechanism of the present invention; Figure 6 is the structural schematic diagram of the semiconductor body, the striking rod, and the driving tooth plate of the present invention; Figure 7 is a schematic structural diagram of the pin detection mechanism in the present invention; Figure 8 is a schematic structural diagram of the sealed box, moving rod and magnet block in the present invention; Figure 9 is the present invention Figure 8 magnified structural diagram at position A; Figure 10 is a schematic structural diagram of the insertion slot, moving rod and water collecting box in the present invention; Figure 11 is the present invention Figure 2 magnified structural diagram at position B.

[0019] In the figure: 1. Water collecting mechanism; 101. Support bottom plate; 102. Water collecting tank; 103. Hollow box; 104. Water inlet pipe; 105. Drain pipe; 106. Solenoid valve; 107. Electric heating plate; 2. Test box; 3. Test mechanism; 301. Semiconductor body; 302. Conductor body; 303. Moving plate; 304. Linkage tooth plate; 305. Driving gear; 306. Guide cylinder; 307. Striking rod; 308. Movable plate; 309. Driving tooth plate; 310. Support rod; 311. Magnet block; 312. Connecting frame; 313. Guide plate; 4. Pin detection mechanism; 401. Pin; 402. Fixed plate; 403. Sealed box; 404. Insertion slot; 405. Moving rod; 406. Connecting pipe; 407. Water collecting box; 408. Extrusion plate; 409. Threaded rod; 410. Servo motor; 411. Pushing plate; 412. Iron plate; 413. Support plate; 414. Electromagnetic coil; 415. Adsorption plate; 416. Sealing cover; 5. Driving mechanism; 501. Driving motor; 502. Rotating rod; 503. Rotating disc; 504. Flipping plate; 6. Return spring; 7. Hook. Detailed implementation manners

[0020] In order to make the technical means, creative features, achieved purposes and functions of the present invention easy to understand, the present invention will be further described below in conjunction with specific implementation manners.

[0021] The present invention provides a semiconductor device screening and testing device. Referring to Figures 1-11 , the present invention provides three embodiments: Embodiment

[0022] The semiconductor device screening and testing device includes a water collecting mechanism 1, a test box 2 is installed on the upper surface of the water collecting mechanism 1, the water collecting mechanism 1 includes a support bottom plate 101, and a test mechanism 3 is installed inside the test box 2; The testing mechanism 3 includes a semiconductor body 301 disposed inside the testing chamber 2. A wire body 302 is connected to the surface of the semiconductor body 301. Through the arrangement of bolts, the wire body 302 is fixedly connected to the surface of the moving plate 303, so that the moving plate 303 drives the wire body 302 to move, and tests the connection part between the wire body 302 and the packaged device of the semiconductor body 301. At the same time, through the arrangement of pure water, the airtightness of the connection part is tested; A moving plate 303 is fixedly connected to the surface of the wire body 302 through bolts. A linkage toothed plate 304 is fixedly connected to the surface of the moving plate 303. A driving gear 305 meshes with the surface of the linkage toothed plate 304. A guide cylinder 306 fixedly connected to the inside of the testing chamber 2 is attached to one side of the semiconductor body 301. A striking rod 307 is slidably inserted into the inside of the guide cylinder 306. A movable plate 308 is fixedly connected to the surface of the striking rod 307. A driving toothed plate 309 corresponding to the driving gear 305 is fixedly connected to the upper surface of the movable plate 308; During the movement of the striking rod 307, the movable plate 308 is synchronously driven to move, so that the movable plate 308 drives the driving toothed plate 309 to move, and the driving toothed plate 309 meshes with the driving gear 305 by itself, so that the driving gear 305 meshes and rotates, driving the linkage toothed plate 304 and the driving toothed plate 309 to move in the opposite direction, driving the moving plate 303 to move; The testing mechanism 3 further includes a support rod 310 fixedly connected to one side of the support plate 413. Through the arrangement of the support rod 310, the magnet block 311 drives the semiconductor body 301 to rotate more stably. A magnet block 311 is rotatably sleeved on the surface of the support rod 310. A connection frame 312 fixedly connected to the sealing cover 416 is fixedly connected to the surface of the magnet block 311. The sealing box 403, the sealing cover 416 and the magnet block 311 are fixedly connected through the connection frame 312. A guide plate 313 slidably connected to the linkage toothed plate 304 is fixedly connected to the surface of the connection frame 312. Through the arrangement of the guide plate 313, not only can the linkage toothed plate 304 be limited, but also the linkage toothed plate 304 can be guided, so that the linkage toothed plate 304 moves more stably; The driving gear 305 is rotatably connected to the connection frame 312 through a bearing seat. A driving mechanism 5 is installed on one side of the striking rod 307. The driving mechanism 5 includes a driving motor 501 fixedly connected to the inside of the testing chamber 2. The output end of the driving motor 501 is fixedly connected to a rotating rod 502. One end of the rotating rod 502 is fixedly connected to a rotating disc 503 rotatably connected to the inside of the testing chamber 2. A turning plate 504 rotatably connected to the striking rod 307 is rotatably connected to the surface of the rotating disc 503 through a pin shaft. Limiting tubes fixedly connected to the testing chamber 2 are sleeved on the surfaces of the rotating rod 502 and the guide cylinder 306. Through the arrangement of the limiting tubes, the rotating rod 502 and the guide cylinder 306 are more stable during use; Start the drive motor 501, and its output end drives the rotating rod 502 to rotate, so that the rotating disk 503 drives the flipping plate 504 to move through the pin shaft, so that the striking rod 307 reciprocates inside the guide cylinder 306, so that the striking rod 307 strikes one side of the semiconductor body 301 to test the firmness of the semiconductor body 301 packaging device. At the same time, through the setting of pure water, observe whether bubbles are generated in the pure water to test the airtightness of the semiconductor body 301 packaging device.

[0023] Embodiment 2, based on Embodiment 1, further, a pin detection mechanism 4 is installed inside the testing mechanism 3. The pin detection mechanism 4 includes pins 401 fixedly connected to one side of the semiconductor body 301 in a rectangular array. A fixing plate 402 is sleeved on the surfaces of several pins 401. A sealing box 403 corresponding to the semiconductor body 301 is slidably sleeved on the surface of the fixing plate 402. A sealing cover 416 is fixedly connected to the surface of the sealing box 403 by bolts. A reset spring 6 is fixedly connected to the upper surface of the sealing cover 416. Through the setting of the reset spring 6, after the tensile performance test of the pins 401 by the moving rod 405 and the fixing plate 402, the moving rod 405 can automatically reset, which facilitates the multiple use of the pin detection mechanism 4. One end of the reset spring 6 is fixedly connected to a hook 7. A limiting ring fixedly connected to the adsorption plate 415 is attached to the surface of the hook 7. Through the mutual cooperation of the hook 7 and the limiting ring, when replacing the fixing plate 402, the hook 7 and the push plate 411 are detachable, avoiding the movement obstruction caused by the reset spring 6 to the disassembly of the push plate 411. A plugging groove 404 corresponding to the pins 401 is formed on one side of the fixing plate 402. A moving rod 405 is fixedly connected to one side of the fixing plate 402 by bolts. Both the fixing plate 402 and the moving rod 405 are slidably connected inside the sealing box 403; The pin detection mechanism 4 further includes a communicating pipe 406 fixedly connected to the surface of the fixing plate 402 and communicating with the plugging groove 404. One end of the communicating pipe 406 is fixedly connected to a water collecting box 407 with glue inside. The water collecting box 407 is fixedly connected to the moving rod 405. An extrusion plate 408 is slidably connected inside the water collecting box 407. A threaded rod 409 rotatably connected to the water collecting box 407 is threadedly connected to the surface of the extrusion plate 408. One end of the threaded rod 409 is fixedly connected to a servo motor 410 with an output end fixedly connected to the threaded rod 409. Start the servo motor 410, and its output end drives the threaded rod 409 to rotate, so that the threaded rod 409 drives the extrusion plate 408 to move inside the water collecting box 407, extruding the glue inside the water collecting box 407, so that the glue enters the inside of the plugging groove 404 through the communicating pipe 406, so that the pins 401 are fixedly connected to the fixing plate 402; The pin detection mechanism 4 further includes a push plate 411 fixedly connected to one end of the moving rod 405. One side of the push plate 411 is fixedly connected with an iron plate 412 corresponding to the movable plate 308. When the movable plate 308 moves, the movable plate 308 slides inside the moving plate 303, so that the movable plate 308 is in contact with the iron plate 412, pushing the iron plate 412 to move, so that the iron plate 412 drives the moving rod 405 and the fixed plate 402 to move, applying a pulling force to the pin 401. Inside the test box 2, there is a support plate 413 fixedly connected. Inside the support plate 413, there is an electromagnetic coil 414 fixedly connected. One side of the support plate 413 is fixedly connected with an adsorption plate 415 corresponding to the electromagnetic coil 414 and the iron plate 412. When the electromagnetic coil 414 is energized, the adsorption plate 415 generates a magnetic force to adsorb the iron plate 412, so that the fixed plate 402 pulls the pin 401 to maintain it in a fixed position, and the tensile performance of the pin 401 is tested.

[0024] Embodiment 3, based on Embodiment 1 and Embodiment 2, further, a water collecting tank 102 is fixedly connected to the upper surface of the support bottom plate 101. A hollow box 103 is fixedly connected to the upper surface of the water collecting tank 102. The test box 2 is fixedly connected inside the hollow box 103. One side of the water collecting tank 102 is fixedly connected with a water inlet pipe 104 communicating with the hollow box 103. The pure water set inside the water collecting tank 102 is pumped into the inside of the test box 2 through the cooperation of an existing water pump and the water inlet pipe 104; Insert the semiconductor body 301 into the inside of the sealing box 403, so that the pin 401 is inserted into the inside of the insertion slot 404 on the fixed plate 402. Rotate the magnet block 311 to drive the semiconductor body 301 to rotate into the inside of the test box 2, so that one side of the semiconductor body 301 is in contact with one side of the guide cylinder 306. Based on the existing water pump, the pure water inside the water collecting tank 102 enters the inside of the test box 2 through the water inlet pipe 104, so that the pure water submerges the semiconductor body 301; The water collection mechanism 1 further includes a drain pipe 105 fixedly connected to one side of the test box 2. An electromagnetic valve 106 is installed on the surface of the drain pipe 105. The test box 2 is connected to the hollow box 103 through the drain pipe 105. Through the mutual cooperation of the drain pipe 105 and the electromagnetic valve 106, when it is necessary to adjust the temperature inside the test box 2, the hot water inside the test box 2 is drained into the hollow box 103, and the test box 2 is refilled with water through the water inlet pipe 104, so that cold and hot water alternate, quickly reducing the temperature and improving the efficiency of testing the semiconductor body 301. The inner bottom wall of the test box 2 is fixedly connected with an electric heating plate 107. Starting the electric heating plate 107 to heat the pure water inside the test box 2 can not only enable the semiconductor body 301 to adjust the temperature according to requirements during testing, so that the semiconductor body 301 can be tested at different temperatures, but also heat the glue, making the glue fix the pin 401 and the fixing plate 402 more quickly. A water adding pipe is fixedly connected to one side of the water collection tank 102.

[0025] Working principle: Insert the semiconductor body 301 into the sealing box 403, so that the pin 401 is inserted into the inside of the insertion slot 404 on the fixing plate 402. Rotate the magnet block 311 to drive the semiconductor body 301 to rotate into the test box 2, so that one side of the semiconductor body 301 is attached to one side of the guide cylinder 306. Based on the existing water pump, the pure water inside the water collection tank 102 enters the test box 2 through the water inlet pipe 104, so that the pure water submerges the semiconductor body 301. Start the drive motor 501, and its output end drives the rotating rod 502 to rotate, so that the rotating disk 503 drives the flipping plate 504 to move through the pin shaft, so that the striking rod 307 reciprocates inside the guide cylinder 306, and the striking rod 307 strikes one side of the semiconductor body 301 to test the firmness of the semiconductor body 301 packaging device. At the same time, through the setting of the pure water, observe whether bubbles are generated in the pure water to test the air tightness of the semiconductor body 301 packaging device; At the same time, during the movement of the striking rod 307, the movable plate 308 is synchronously driven to move, so that the movable plate 308 drives the driving rack 309 to move, so that the driving rack 309 meshes with the driving gear 305 self-engagingly, so that the driving gear 305 meshes and rotates, driving the linkage rack 304 and the driving rack 309 to move in the opposite direction, driving the moving plate 303 to move. And through the setting of the bolt, the wire body 302 is fixedly connected to the surface of the moving plate 303, so that the moving plate 303 drives the wire body 302 to move, testing the connection between the wire body 302 and the semiconductor body 301 packaging device. At the same time, through the setting of the pure water, the air tightness of the connection is tested; Start the servo motor 410, and let its output end drive the threaded rod 409 to rotate, so that the threaded rod 409 drives the pressing plate 408 to move inside the water collecting box 407, squeezing the glue inside the water collecting box 407, so that the glue enters the inside of the insertion slot 404 through the communication pipe 406, making the pin 401 fixedly connected to the fixing plate 402. When the movable plate 308 moves, the movable plate 308 slides inside the moving plate 303, making the movable plate 308 fit against the iron plate 412, pushing the iron plate 412 to move, so that the iron plate 412 drives the moving rod 405 and the fixing plate 402 to move, applying a pulling force to the pin 401. At the same time, the electromagnetic coil 414 is energized, so that the adsorption plate 415 generates a magnetic force to adsorb the iron plate 412, making the fixing plate 402 pull the pin 401 to maintain it in a fixed position, and testing the tensile property of the pin 401; When testing the semiconductor body 301, according to the requirements, start the electric heating plate 107 to heat the pure water inside the test box 2. This can not only enable the semiconductor body 301 to adjust the temperature according to the requirements during testing, so that the semiconductor body 301 can be tested at different temperatures, but also heat the glue, making the glue fix the pin 401 and the fixing plate 402 more quickly.

[0026] The above front, back, left, right, up, and down are all based on Figure 1 the description in the specification drawings. Taking the perspective of the person observing as the standard, the side of the device facing the observer is defined as the front, the left side of the observer is defined as the left, and so on.

[0027] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "lateral", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the protection scope of the present invention.

[0028] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor device screening and testing device, characterized in that: It includes a water collection mechanism (1), a test box (2) is installed on the upper surface of the water collection mechanism (1), a test mechanism (3) is installed inside the test box (2), and a pin detection mechanism (4) is installed inside the test mechanism (3); The test mechanism (3) includes a semiconductor body (301) arranged inside the test box (2), a wire body (302) is connected to the surface of the semiconductor body (301), a moving plate (303) is fixedly connected to the surface of the wire body (302) by bolts, a linkage toothed plate (304) is fixedly connected to the surface of the moving plate (303), a driving gear (305) is meshed with the surface of the linkage toothed plate (304), a guide cylinder (306) fixedly connected to the inside of the test box (2) is attached to one side of the semiconductor body (301), a striking rod (307) is slidably inserted into the inside of the guide cylinder (306), a movable plate (308) is fixedly connected to the surface of the striking rod (307), a driving toothed plate (309) corresponding to the driving gear (305) is fixedly connected to the upper surface of the movable plate (308), and a driving mechanism (5) is installed on one side of the striking rod (307).

2. The semiconductor device screening and testing apparatus according to claim 1, wherein: The pin detection mechanism (4) includes pins (401) fixedly connected to one side of the semiconductor body (301) in a rectangular array, a fixing plate (402) is sleeved on the surfaces of several pins (401) together, a sealing box (403) corresponding to the semiconductor body (301) is slidably sleeved on the surface of the fixing plate (402), a sealing cover (416) is fixedly connected to the surface of the sealing box (403) by bolts, a plugging groove (404) corresponding to the pins (401) is opened on one side of the fixing plate (402), and a moving rod (405) is fixedly connected to one side of the fixing plate (402) by bolts.

3. The semiconductor device screening and testing apparatus according to claim 2, wherein: The pin detection mechanism (4) further includes a communicating pipe (406) fixedly connected to the surface of the fixing plate (402) and communicating with the plugging groove (404), a water collection box (407) with glue inside is fixedly connected to one end of the communicating pipe (406), the water collection box (407) is fixedly connected to the moving rod (405), a pressing plate (408) is slidably connected to the inside of the water collection box (407), a threaded rod (409) rotatably connected to the water collection box (407) is threadedly connected to the surface of the pressing plate (408), and a servo motor (410) with an output end fixedly connected to the threaded rod (409) is fixedly connected to one end of the threaded rod (409).

4. The semiconductor device screening and testing apparatus according to claim 3, wherein: The pin detection mechanism (4) further includes a push plate (411) fixedly connected to one end of the moving rod (405). One side of the push plate (411) is fixedly connected with an iron plate (412) corresponding to the movable plate (308). Inside the test box (2), a support plate (413) is fixedly connected. Inside the support plate (413), an electromagnetic coil (414) is fixedly connected. One side of the support plate (413) is fixedly connected with an adsorption plate (415) corresponding to the electromagnetic coil (414) and the iron plate (412).

5. The screening and testing device for a semiconductor device according to claim 4, wherein: The test mechanism (3) further includes a support rod (310) fixedly connected to one side of the support plate (413). The surface of the support rod (310) is rotatably sleeved with a magnet block (311). The surface of the magnet block (311) is fixedly connected with a connecting frame (312) fixedly connected to the sealing cover (416). The surface of the connecting frame (312) is fixedly connected with a guide plate (313) slidably connected to the linkage tooth plate (304). The driving gear (305) is rotatably connected to the connecting frame (312) through a bearing seat.

6. The screening and testing device for a semiconductor device according to claim 1, wherein: The driving mechanism (5) includes a driving motor (501) fixedly connected to the inside of the test box (2). The output end of the driving motor (501) is fixedly connected with a rotating rod (502). One end of the rotating rod (502) is fixedly connected with a rotating disk (503) rotatably connected to the inside of the test box (2). The surface of the rotating disk (503) is rotatably connected with a turning plate (504) rotatably connected to the striking rod (307) through a pin shaft. The surfaces of the rotating rod (502) and the guide cylinder (306) are both sleeved with a limiting tube fixedly connected to the test box (2).

7. A semiconductor device screening and testing apparatus according to claim 4, characterized in that: The upper surface of the sealing cover (416) is fixedly connected with a return spring (6). One end of the return spring (6) is fixedly connected with a hook (7). The surface of the hook (7) is in contact with a limiting ring fixedly connected to the adsorption plate (415). Both the fixing plate (402) and the moving rod (405) are slidably connected to the inside of the sealing box (403).

8. A semiconductor device screening and testing apparatus according to claim 7, characterized in that: The water collecting mechanism (1) includes a support bottom plate (101). The upper surface of the support bottom plate (101) is fixedly connected with a water collecting tank (102). The upper surface of the water collecting tank (102) is fixedly connected with a hollow box (103). The test box (2) is fixedly connected to the inside of the hollow box (103). One side of the water collecting tank (102) is fixedly connected with a water inlet pipe (104) communicated with the hollow box (103). The pure water provided inside the water collecting tank (102) is pumped into the inside of the test box (2) through the cooperation of an existing water pump and the water inlet pipe (104).

9. A semiconductor device screening and testing apparatus according to claim 8, characterized in that: The water collection mechanism (1) further includes a drain pipe (105) fixedly connected to one side of the test box (2). An electromagnetic valve (106) is installed on the surface of the drain pipe (105). The test box (2) is communicated with the hollow box (103) through the drain pipe (105). An electric heating plate (107) is fixedly connected to the inner bottom wall of the test box (2). One side of the water collection tank (102) is fixedly connected to an external water supply pipe.

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