Rapid cap sealing process and cap sealing structure

Abstract

The invention discloses a rapid cap sealing process and a cap sealing structure. The rapid cap sealing process comprises the following steps in sequence: step S1, coating a plurality of glue on a slide glass; s2, heating the slide glass to enable the glue coated at each part of the slide glass to form a semi-cured glue cover semi-finished product, so as to obtain a sealing cover assembly comprising the slide glass and a plurality of glue cover semi-finished products; s3, abutting the sealing cover assembly against the lead frame plate, so that each rubber cover semi-finished product of the sealing cover assembly covers the opening of each tube shell of the lead frame plate and is bonded with each tube shell of the lead frame plate; s4, heating the sealing cover assembly and the lead frame plate together, so that each rubber cover semi-finished product of the sealing cover assembly is cured to form a rubber cover which is respectively adhered to each tube shell of the lead frame plate; and S5, separating the slide glass of the sealing cover assembly from the lead frame plate. The cap sealing efficiency can be effectively improved.

Description

Technical Field

[0001] The present invention relates to the field of chip packaging, and particularly to a rapid capping process and a capping structure. Background Art

[0002] In the field of chip packaging, currently, after die bonding and wire bonding are completed for each shell of the entire lead frame board, capping is generally performed. Capping means connecting a cover plate to the shell, and the cover plate is injection molded. The existing capping processes cap each shell of the entire lead frame board one by one, with low capping efficiency, which greatly affects the chip packaging efficiency.

[0003] The existing operation method for capping the shell is as follows: First, apply a circle of glue evenly along the peripheral edge of the opening of the shell, then place the cover plate on the opening of the shell, and apply a pressure to the cover plate so that the cover plate is combined with the shell through the glue; this capping operation method is also rather troublesome. In addition, after capping each shell of the entire lead frame board, it generally needs to be sent into a drying oven for heating to ensure the curing of the glue.

[0004] In view of the existence of the above problems, it is necessary to study a rapid capping process and a capping structure, which can effectively improve the capping efficiency. Summary of the Invention

[0005] The purpose of the present invention is to provide a rapid capping process and a capping structure, which can effectively improve the capping efficiency.

[0006] To achieve the above purpose, the solution of the present invention is: A rapid capping process includes the following steps in sequence: Step S1: Coat multiple places of glue on a carrier sheet according to each shell of the lead frame board; Step S2: Heat the carrier sheet so that the glue coated at each place on the carrier sheet forms a semi-cured state of glue cover semi-finished products, thereby obtaining a capping assembly including the carrier sheet and multiple glue cover semi-finished products; Step S3: Oppose the capping assembly to the lead frame board, so that each glue cover semi-finished product of the capping assembly respectively opposes each shell of the lead frame board, so that each glue cover semi-finished product of the capping assembly respectively covers the opening of each shell of the lead frame board and bonds with each shell of the lead frame board; Step S4: Heat the capping assembly and the lead frame board together so that each glue cover semi-finished product of the capping assembly cures to form a glue cover bonded to each shell of the lead frame board respectively; Step S5: Separate the carrier sheet of the capping assembly from the lead frame board.

[0007] The method of coating multiple places of glue on a carrier sheet according to each shell of the lead frame board includes: Step S11: placing a printing plate on the carrier, the printing plate having a plurality of printing holes corresponding to each tube shell of the lead frame plate; Step S12: applying glue on the printing plate by a printing device, and the glue passes through each printing hole of the printing plate and adheres to the carrier; Step S13: Remove the printing plate from the carrier.

[0008] The method of heating the carrier sheet is as follows: the carrier sheet and the glue coated on various places of the carrier sheet are sent into a drying box for heating.

[0009] The method of abutting the cover assembly against the lead frame plate includes: Step S31: Fit the cover assembly to the lower half mold of the positioning mold, and make the semi-finished rubber cover of the cover assembly face the opening of the lower half mold; Step S32: Fit the lead frame plate to the lower half mold of the positioning mold, so that each tube shell of the lead frame plate is respectively aligned with each semi-finished rubber cover of the cover assembly; Step S33: docking the upper half mold of the positioning mold with the lower half mold, so that the positioning mold covers the cover assembly and the lead frame plate.

[0010] The lower half mold is provided with at least two positioning posts, the carrier of the cover assembly is provided with carrier positioning holes for plugging and matching with the positioning posts, and the lead frame plate is provided with frame positioning holes for plugging and matching with the positioning posts.

[0011] The upper half mold and the lower half mold of the positioning mold are detachably connected through a latch.

[0012] The method of heating the cover assembly and the lead frame plate together is: sending the positioning mold and the cover assembly covered by the positioning mold and the lead frame plate into a drying box for heating.

[0013] A sealing cap structure comprises a tube shell and a glue cover formed by curing glue, wherein the glue cover covers an opening of the tube shell and is directly bonded to the tube shell.

[0014] After adopting the above scheme, a quick capping process of the present invention can cap all the caps of the lead frame plate at one time, thereby greatly improving the capping efficiency. In addition, the rubber cover of the present invention is formed by curing glue, so the cost of the rubber cover is lower than that of the existing injection molded cover, thereby helping to reduce production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic structural diagram of the slide of the present invention.

[0016] Figure 2 It is a schematic structural diagram of the lead frame plate of the present invention.

[0017] Figure 3 It is a schematic structural diagram of the printed circuit board of the present invention.

[0018] Figure 4 It is a schematic structural diagram of the upper half mold of the present invention.

[0019] Figure 5 It is a schematic structural diagram of the lower half mold of the present invention.

[0020] Figure 6 It is a schematic diagram of step S3 of the present invention.

[0021] Figure 7 It is a schematic diagram of a kind of capping structure of the present invention.

[0022] Label description: Capping component A, Carrier 1, carrier positioning hole 11, Glue cover 2, glue cover semi-finished product 2', Lead frame board 3, package 31, frame positioning hole 32, Printed circuit board 4, printing hole 41, Positioning mold 5, upper half mold 51, lower half mold 52, positioning post 521, plug pin 53. Specific embodiments

[0023] In order to further explain the technical solution of the present invention, the present invention will be elaborated in detail through specific embodiments below.

[0024] As Figures 1 to 7 shown, the present invention discloses a rapid capping process, which includes the following steps in sequence: Step S1: Coat multiple places of glue on the carrier 1 according to each package 31 of the lead frame board 3; Step S2: Heat the carrier 1 so that the glue coated on each place of the carrier 1 forms a semi-cured glue cover semi-finished product 2', thereby obtaining a capping component A including the carrier 1 and multiple glue cover semi-finished products 2'; Step S3: Oppose the capping component A to the lead frame board 3 so that each glue cover semi-finished product 2' of the capping component A respectively opposes each package 31 of the lead frame board 3, so that each glue cover semi-finished product 2' of the capping component A respectively covers the openings of each package 31 of the lead frame board 3 and adheres to each package 31 of the lead frame board 3; Step S4: Heat the capping component A and the lead frame board 3 together so that each glue cover semi-finished product 2' of the capping component A cures to form a glue cover 2 adhesively bonded to each package 31 of the lead frame board 3; Step S5: Separate the carrier 1 of the capping component A from the lead frame board 3.

[0025] As can be seen from the above, the rapid capping process of the present invention can cap all the caps of the lead frame plate 3 at one time, thereby greatly improving the capping efficiency. By comparison, the capping efficiency of the rapid capping process of the present invention can be improved by dozens of times compared with the existing capping process.

[0026] In an embodiment of the present invention, the method of applying glue at multiple locations on the carrier 1 according to each tube shell 31 of the lead frame plate 3 can specifically adopt a printing process, so that glue can be applied to multiple locations on the carrier 1 quickly and accurately. Specifically, the method of applying glue at multiple locations on the carrier 1 according to each tube shell 31 of the lead frame plate 3 includes: Step S11: placing a printing plate on the carrier, the printing plate having a plurality of printing holes corresponding to each tube shell of the lead frame plate; Step S12: applying glue on the printing plate by a printing device, and the glue passes through each printing hole of the printing plate and adheres to the carrier; Step S13: removing the printing plate from the carrier, which can be done manually or by automatic equipment.

[0027] It should be noted that the method of applying glue at multiple locations on the carrier 1 according to the respective tube shells 31 of the lead frame plate 3 is not limited to the printing process, and a dispensing process may also be used.

[0028] In the embodiment of the present invention, the carrier sheet 1 is heated by sending the carrier sheet 1 and the glue applied at various places of the carrier sheet 1 into a drying oven for heating. By controlling the heating temperature and heating time of the drying oven, the glue applied at various places of the carrier sheet 1 can form a semi-cured glue cover semi-finished product 2'.

[0029] In an embodiment of the present invention, the method of abutting the cover assembly A against the lead frame plate 3 includes: Step S31: Fit the cover assembly A to the lower half mold 52 of the positioning mold 5, and make the rubber cover semi-finished product 2' of the cover assembly A face the opening of the lower half mold 52; Step S32: Fit the lead frame plate 3 to the lower half mold 52 of the positioning mold 5, so that each tube shell 31 of the lead frame plate 3 is respectively abutted against each semi-finished rubber cover 2' of the cover assembly A; Step S33 : docking the upper half mold 51 of the positioning mold 5 with the lower half mold 52 , so that the positioning mold 5 covers the cover assembly A and the lead frame plate 3 .

[0030] The positioning die 5 of the present invention can position the cap assembly A and the lead frame plate 3, enabling the cap assembly A and the lead frame plate 3 to accurately abut against each other, thereby ensuring that each semi-finished glue cap 2' of the cap assembly A can respectively and accurately cover the openings of the respective packages 31 of the lead frame plate 3. Among them, at least two positioning posts 521 can be provided on the lower die 52 of the positioning die 5, and the carrier 1 of the cap assembly A is provided with carrier positioning holes 11 for plugging and mating with the positioning posts 521, and the lead frame plate 3 is provided with frame positioning holes 32 for plugging and mating with the positioning posts 521. The upper die 51 and the lower die 52 of the positioning die 5 can be detachably connected by pins 53, so that the upper die 51 and the lower die 52 are convenient to disassemble and assemble.

[0031] In the embodiment of the present invention, the method of heating the cap assembly A and the lead frame plate 3 together is as follows: the positioning die 5 and the cap assembly A and the lead frame plate 3 wrapped by the positioning die 5 are sent into a drying oven for heating together. In this way, the positioning die 5 can protect the cap assembly A and the lead frame plate 3, and at the same time, by controlling the heating temperature and heating time of the drying oven, each semi-finished glue cap 2' of the cap assembly A can be cured to form a glue cap 2.

[0032] Through the above-mentioned rapid capping process, the present invention can obtain a capping structure, which is combined with Figure 7 As shown, the capping structure includes a package 31 and a glue cap 2 formed by curing glue. The glue cap 2 covers the opening of the package 31 and the glue cap 2 is directly bonded to the package 31. The glue cap 2 of the present invention is formed by curing glue, so that the cost of the glue cap 2 is lower than that of the existing injection-molded cover plate, which helps to reduce the production cost.

[0033] The above embodiments and drawings do not limit the product form and style of the present invention. Any appropriate changes or modifications made by those of ordinary skill in the art shall be regarded as not departing from the patent scope of the present invention.

Claims

1. A rapid capping process, characterized in that: It includes the following steps in sequence: Step S1: Coat glue at multiple positions on the carrier according to each shell of the lead frame board; Step S2: Heat the carrier so that the glue coated at each place on the carrier forms a semi-cured glue cover semi-finished product, thereby obtaining a capping assembly including the carrier and multiple glue cover semi-finished products; Step S3: Oppose the capping assembly to the lead frame board, so that each glue cover semi-finished product of the capping assembly respectively opposes each shell of the lead frame board, so that each glue cover semi-finished product of the capping assembly respectively covers the openings of each shell of the lead frame board and bonds with each shell of the lead frame board; Step S4: Heat the capping assembly and the lead frame board together so that each glue cover semi-finished product of the capping assembly cures to form a glue cover bonded to each shell of the lead frame board respectively; Step S5: Separate the carrier of the capping assembly from the lead frame board.

2. The rapid capping process according to claim 1, characterized in that: The method of coating glue at multiple positions on the carrier according to each shell of the lead frame board includes: Step S11: Place a printing plate on the carrier, and the printing plate has multiple printing holes respectively corresponding to each shell of the lead frame board; Step S12: Brush glue on the printing plate through a printing device, and the glue passes through each printing hole of the printing plate and adheres to the carrier; Step S13: Remove the printing plate from the carrier.

3. A rapid capping process as claimed in claim 1, characterized in that: The way of heating the carrier is: Send the carrier and the glue coated at each place on the carrier into a drying oven for heating together.

4. A rapid capping process as claimed in claim 1, wherein: The method of opposing the capping assembly to the lead frame board includes: Step S31: Fit the capping assembly onto the lower mold of the positioning mold, and make the glue cover semi-finished product of the capping assembly face the opening of the lower mold; Step S32: Fit the lead frame board onto the lower mold of the positioning mold, so that each shell of the lead frame board respectively opposes each glue cover semi-finished product of the capping assembly; Step S33: Dock the upper mold of the positioning mold with the lower mold, so that the positioning mold covers the capping assembly and the lead frame board.

5. A rapid capping process according to claim 4, characterized in that: The lower mold is provided with at least two positioning posts, the carrier of the capping assembly is provided with carrier positioning holes for plugging and mating with the positioning posts, and the lead frame board is provided with frame positioning holes for plugging and mating with the positioning posts.

6. The rapid capping process according to claim 4, wherein: The upper mold and the lower mold of the positioning mold are detachably connected by pins.

7. The rapid capping process according to claim 4, characterized in that: The way of heating the capping assembly and the lead frame board together is: Send the positioning mold and the capping assembly and the lead frame board covered by the positioning mold into a drying oven for heating together.

8. A capping structure, characterized in that: It includes a shell and a glue cover cured from glue, the glue cover covers the opening of the shell and the glue cover is directly bonded to the shell.

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