Circuit board assembly and electronic equipment

Abstract

The invention provides a circuit board assembly and an electronic device, the circuit board assembly comprises a board main body and at least one chip, the board main body comprises a first surface and a second surface which are opposite, the first surface comprises at least one chip area, each chip is arranged on the corresponding chip area, and a power pin of a core area of the chip is fanned out through a via hole in the corresponding chip area. A plurality of liquid cooling channels corresponding to the chips are arranged in the plate body, and heat generated by the chips is rapidly absorbed by cooling media filled in the liquid cooling channels. The problem that the high integration level and the heat dissipation design of the circuit board assembly related to the high-power chip and the electronic equipment are difficult to be compatible is solved, the integration level and the miniaturization of the circuit board assembly and the electronic equipment are improved, and the production cost is further reduced.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation, and particularly to a circuit board assembly and an electronic device. Background Art

[0002] With the development of electronic devices towards high performance and high integration, in application scenarios such as AI servers and data centers, the thermal management problem of PCB (Printed Circuit Board) has become increasingly prominent. The heat dissipation of traditional printed circuit board assemblies mainly relies on surface heat sinks or metal substrates for heat dissipation, or a fan module is set up to blow air on the printed circuit board assembly for air-cooled heat dissipation, or a metal cold plate is installed above high-power chips (such as CPUs, GPUs, power MOSFETs), and the heat is carried away by the flow of coolant in the liquid flow channels of the cold plate.

[0003] However, these existing heat dissipation methods have obvious limitations. For example, there are problems such as a single heat dissipation path, complex structure and large occupied space, making it difficult to balance the compactness of electronic devices and the efficiency of heat dissipation, and being unfavorable for the miniaturization and high-density integration design of electronic devices such as servers. Summary of the Invention

[0004] The present disclosure provides a circuit board assembly and an electronic device, and its main purpose is to meet the usage requirements of the compactness and high heat dissipation efficiency of the circuit board assembly.

[0005] To achieve the above object, the first aspect embodiment of the present application proposes a circuit board assembly, including: A plate body, the plate body includes opposite first and second surfaces, and a plurality of chip areas are included on the first surface, each chip area includes a plurality of vias extending from the first surface to one side of the second surface, and the vias are filled with metal connection parts; A plate body, the plate body includes opposite first and second surfaces, and at least one chip area is included on the first surface, each chip area includes a plurality of vias extending from the first surface to one side of the second surface, and the vias are filled with metal connection parts; At least one chip, disposed on the chip area; a power pin is provided in the core area of each chip, and the power pin is fanned out through the vias in the corresponding chip area; Wherein, a plurality of liquid cooling channels corresponding to each chip are further provided in the plate body, the liquid cooling channels are spaced from each other in a first direction, and extend in a second direction and penetrate through the plate body; wherein, the first direction is orthogonal to the second direction, and the orthogonal plane is parallel to the first surface.

[0006] Optionally, the diameters and / or the numbers of the liquid cooling channels corresponding to the chips with different power thresholds are different.

[0007] Optionally, the apertures of the vias fan-out corresponding to the power supply pins of the chips with different power thresholds are different.

[0008] Optionally, the via at least includes one of a through hole and a blind hole.

[0009] Optionally, the vertical projection of the blind hole on the first surface completely or partially overlaps with the vertical projection of the liquid cooling channel on the first surface, and the vertical projection of the through hole on the first surface does not overlap with the vertical projection of the liquid cooling channel on the first surface.

[0010] Optionally, the chip includes at least one of a first chip, a second chip, and a third chip with sequentially increasing power thresholds; wherein, the apertures of the vias fan-out corresponding to the first chip, the second chip, and the third chip increase sequentially; and / or, the diameters of the liquid cooling channels corresponding to the first chip, the second chip, and the third chip increase sequentially; and / or, the numbers of the liquid cooling channels corresponding to the first chip, the second chip, and the third chip increase sequentially.

[0011] Optionally, the aperture range of the via fan-out corresponding to the power supply pin of the first chip in the corresponding chip area is 0.2 mm to 0.25 mm; and / or, the aperture range of the via fan-out corresponding to the power supply pin of the second chip in the corresponding chip area is 0.25 mm to 0.3 mm; and / or, the aperture range of the via fan-out corresponding to the power supply pin of the third chip in the chip area is 0.3 mm to 0.35 mm.

[0012] Optionally, the number of the liquid cooling channels corresponding to the first chip is 2 to 3, and the diameter of each liquid cooling channel is 1 mm to 1.3 mm; and / or, the number of the liquid cooling channels corresponding to the second chip is 2 to 3, and the diameter of each liquid cooling channel is 1.3 mm to 1.7 mm; and / or, the number of the liquid cooling channels corresponding to the third chip is not less than 3, and the diameter of each liquid cooling channel is 1.7 mm to 2 mm.

[0013] Optionally, the distance between the centers of adjacent liquid channels in the first direction is not less than 4 mm.

[0014] Optionally, both ends of multiple said liquid cooling channels penetrate through the board body in the second direction and extend a first preset length away from the board body, and the range of the first preset length is not less than 100 mm.

[0015] Optionally, both sides of the board body along the second direction further include a liquid inlet pipe and a liquid outlet pipe extending along the first direction respectively. The liquid inlet pipe is communicated with the inlet end of each liquid cooling channel, and the liquid outlet pipe is communicated with the outlet end of each liquid cooling channel.

[0016] To achieve the above object, an embodiment of the second aspect of the present application provides an electronic device, including the circuit board assembly described in any one of the above.

[0017] The circuit board assembly and the electronic device provided by the present application at least include the following excellent effects: The present application provides a circuit board assembly and an electronic device, including a board body and at least one chip. The board body includes opposite first and second surfaces. At least one chip area is included on the first surface, and each chip is arranged on the corresponding chip area. The power pins of its core area are fan out through vias in the corresponding chip area. A plurality of liquid cooling channels corresponding to the chips are provided in the board body to utilize the cooling medium filled in the liquid cooling channels to quickly absorb the heat generated by the chips. Compared with the prior art, the present application eliminates the need for externally installing an air-cooled radiator, a fan module or a liquid cooling plate on the circuit board assembly, not only reduces the overall body assembly size, improves the integration and miniaturization of the circuit board assembly and the electronic device, but also further reduces the production cost of the circuit board assembly and the electronic device, and solves the technical problem that it is difficult to be compatible with the high integration and heat dissipation design of high-power chip-related electronic devices.

[0018] The additional aspects and advantages of the present application will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present application. Description of the Drawings

[0019] The above and / or additional aspects and advantages of the present application will become obvious and easy to understand from the following description of the embodiments in conjunction with the drawings, where: Figure 1 FIG. is a top view structural schematic diagram of a circuit board assembly shown according to an embodiment of the present application; Figure 2 FIG. is a three-dimensional structural schematic diagram of a circuit board assembly shown according to an embodiment of the present application; Figure 3 For Figure 2 a longitudinal cross-sectional structural schematic diagram of a circuit board assembly intercepted along the AA intercepting line in; Figure 4 For Figure 2Schematic cross-sectional structure diagram of another circuit board assembly intercepted by the AA intercepting line; Figure 5 It is a schematic top view structure diagram of another circuit board assembly shown according to an embodiment of the present application.

[0020] Figure 6 It is a schematic structure diagram of an integral liquid cooling assembly shown according to an embodiment of the present application.

[0021] 100 Plate body; 101 Chip area; 110 Via hole; 120 Liquid cooling channel; 130 Liquid inlet pipe; 140 Liquid outlet pipe; 200 Power chip; 201 Core area; 210 First chip; 220 Second chip; 230 Third chip. Detailed implementation manners

[0022] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present application, and should not be construed as a limitation of the present application.

[0023] As electronic devices develop towards high performance and high integration, the heat dissipation design of circuit board assemblies is a key link to ensure the operating performance, reliability, and service life of their high-power chips. Especially in high-power density scenarios (such as AI servers, data centers, etc.), the power of semiconductor chips is getting higher and the volume is getting smaller, resulting in the traditional circuit board assembly structure being difficult to meet the heat dissipation requirements of semiconductor chips and electronic products, which also limits the application requirements of electronic devices in high-power density scenarios.

[0024] Existing circuit board assemblies mainly rely on surface heat sinks or metal substrates for heat dissipation, or a fan module is arranged outside the circuit board assembly to blow air to the circuit board assembly for air-cooled heat dissipation, or a metal cold plate is installed above the high-power chip, and the heat is taken away by the flow of coolant in the liquid flow channel in the cold plate. However, these existing heat dissipation methods have obvious limitations. First, for the heat dissipation method that relies on surface heat sinks or metal substrates for heat dissipation, the heat dissipation path is generally relatively single, which easily leads to the inability to quickly dissipate heat, resulting in low heat dissipation efficiency. Second, the heat dissipation efficiency of conventional air-cooled heat dissipation is relatively limited, and the fan noise is relatively large, which not only occupies a large space in the whole machine system but is also greatly affected by the environment. In addition, the method of liquid cooling cold plate heat dissipation generally has high costs, and the whole machine heat dissipation system is relatively complex, unable to take into account the heat dissipation requirements between different power chips on the whole board, and there is also a risk of leakage of the heat-conducting liquid.

[0025] That is to say, the heat dissipation design of the current circuit board assembly structure often has difficulty in taking into account both the compactness of the electronic device structure and the high efficiency of heat dissipation, which is not conducive to the miniaturization and high-density integration design of electronic devices such as servers. Therefore, the heat dissipation problem of high-power chips (such as DCDC power conversion chips, LDO linear voltage regulator chips, CPU chips, GPU chips, power MOSFETs, etc.) has become the focus and difficulty in the research of the current circuit board assembly structure design.

[0026] Based on the above problems, the present application provides a circuit board assembly and an electronic device, which can adjust the size of the power pin fan-out vias of the chips on the board body according to the heat dissipation requirements of the chips with different power thresholds on the circuit board assembly, so as to meet the heat dissipation requirements of the chips with different power thresholds. At the same time, the present application also correspondingly sets liquid cooling channels with different sizes and / or quantities inside the circuit board assembly according to the chips with different power thresholds.

[0027] In addition, compared with the prior art during the whole machine assembly process, the circuit board assembly and the electronic device provided by the present application eliminate the installation requirements of the external air-cooled radiator and fan or the liquid cooling plate of the circuit board, which not only reduces the assembly size of the whole machine body, improves the integration of the circuit board assembly and the electronic device, promotes the miniaturization of the circuit board assembly and the electronic device, but also further reduces the production cost of the circuit board assembly and the electronic device, and solves the technical problem that it is difficult to be compatible between the high integration and the heat dissipation design of the current high-power chips and related electronic devices.

[0028] According to one aspect of the present application, there is provided a circuit board assembly, as Figure 1 shown, including a board body 100 and at least one chip 200. The board body 100 includes opposite first and second surfaces. The first surface includes at least a chip area 101. Each chip area 101 further includes a plurality of vias 110 extending from the first surface to one side of the second surface, and the vias 110 are filled with metal connection parts (not shown in the figure). Each chip 200 is disposed on the corresponding chip area 101 on the first surface. An array of power pins is provided in the core area 201 thereof. The power pins are fanned out through the vias in the corresponding chip area, and the apertures of the vias corresponding to the fanned-out power pins of the chips 200 with different power thresholds are different.

[0029] The board body 100 is usually made by laminating a plurality of circuit boards. A plurality of circuits are provided on each circuit board to realize the connection of a plurality of circuits and form a variety of network structures. The variety of network structures includes a conductive layer connected to the vias. The chip 200 is disposed on the board body 100, and its power pins are connected to the vias on the board body 100, so that the conductive layer can supply power to the chip 200 through the vias and the chip 200 generates heat during operation.

[0030] It can be understood that since the power of the chip 200 is positively correlated with the heat generated thereby, chips 200 with different power thresholds generate different amounts of heat in a unit time, and the greater the power of the chip 200, the more heat it generates per unit time. Therefore, according to the actual power threshold of the chip 200, the present application adapts the aperture of the vias 110 in different chip regions 101 to the actual power threshold of the chip 200, and makes the apertures of the vias 110 corresponding to the fan-out of the power pins of chips 200 with different power thresholds different, so as to meet the heat dissipation requirements of chips 200 with different power thresholds.

[0031] Since each via 110 is filled with a conductive metal connection portion therein, for example, by using an electroplating filling process to fully fill the inside of the via 110 to form solid copper metal, the metal connection portion composed of the solid copper metal enables the power pins of the chip 200 to be electrically connected to the conductive layer of the board body 100 through the via 110, and enables the chip 200 to conduct electricity and generate heat. At the same time, since the heat generated by the operation of the chip 200 can be quickly transferred to the inside of the board body 100 or the second surface of the board body 100 through the solid copper metal in the via 110, heat accumulation does not occur between the chip 200 and the first surface. The larger the aperture of the via 110, the larger the size of the solid copper metal filled in the via 110, and the stronger its heat conduction ability to the chip 200, thus ensuring the heat dissipation requirements of the chip 200.

[0032] It should be noted that taking the solid copper metal filled in the via 110 as the metal connection portion is only an example for illustration. In other embodiments, the metal connection portion may also be other metals or their alloys with excellent electrical conductivity and heat dissipation ability, including but not limited to metal elements or alloys such as gold, silver, aluminum, platinum, and tin.

[0033] In order to facilitate the heat generated by the chip 200 to be better exported through the via 110, during the design of the circuit board assembly, the fan-out of the power pins of the chip 200 can also adopt the process of plating on via, so that the power pins of the chip 200 can directly transfer heat to other areas of the board body 100 through the metal connection portion in the via 110, further improving the heat dissipation efficiency of the chip 200.

[0034] Such as Figures 1 to 3As shown, on one side of the plate body 100 close to the first surface, a plurality of liquid cooling channels 120 corresponding to each chip 200 are further provided. By injecting a cooling medium flowing in a specific direction into each liquid cooling channel 120, the cooling medium continuously conducts the heat transferred by the chip 200 to the inside of the plate body 100, better improving the heat dissipation effect of the chip and enabling the electronic device to have better electrical stability. Among them, the cooling medium may include, but is not limited to, cooling water, cooling oil or liquid refrigerant with a relatively low temperature (such as 1°C to 5°C, etc.). The specific type of the cooling medium in the embodiments of the present application may not be limited.

[0035] For the convenience of description, one side of the first surface of the plate body 100 along the horizontal direction can be set as the first direction, and one side of the first surface along the vertical direction can be set as the second direction. The first direction is orthogonal to the second direction, and the orthogonal plane is parallel to the first surface.

[0036] Therefore, in the present application, a plurality of liquid cooling channels 120 that are spaced apart from each other in the first direction and extend and penetrate the plate body 100 in the second direction are provided in the plate body 100 corresponding to each chip area 101, so as to increase the contact area between the liquid cooling channels 120 and the plate body 100. When the heat generated by the chip 200 mounted on each chip area 101 is transferred to the plate body 100, it can be quickly absorbed and conducted out by the cooling medium flowing in a specific direction in the liquid cooling channels 120, thereby ensuring the temperature stability inside the plate body 100.

[0037] To improve the heat conduction efficiency of the liquid cooling channels 120 in the plate body 100, the installation position of the liquid cooling channels 120 in the plate body 100 is set on the side close to the first surface of the plate body 100, so that the liquid cooling channels 120 are closer to the chip 200 mounted on the corresponding chip area 101. At the same time, on the premise of ensuring a certain thickness of the plate body 100, the larger the diameter of the liquid cooling channels 120 and the more the number of them set in the corresponding range of the chip area 101, the stronger the heat conduction ability to the chip 200, and the more capable of ensuring the heat dissipation requirements of the chip 200.

[0038] To facilitate the better absorption and conduction of the heat generated by the chip 200 by the liquid cooling channels 120, in the present application, according to the actual power threshold of the chip 200, the diameter and number of each liquid cooling channel 120 corresponding to different chips are adapted to the actual power threshold of the chip 200, and the diameters of the liquid cooling channels 120 corresponding to different chips 200 are different, and the set numbers are the same or different. For example, the set number of the liquid cooling channels 120 increases adaptively with the increase of the power threshold of the chip 200, so as to meet the heat dissipation requirements of different chips 200.

[0039] As an example, such as Figures 1 to 4As shown, the chip 200 with different power thresholds includes at least one of the first chip 210, the second chip 220, and the third chip 230. Among them, the power threshold of the first chip 210 is 20W - 50W, the power threshold of the second chip 220 is 50W - 100W, and the power threshold of the third chip 230 is greater than 100W.

[0040] As Figure 1 shown, since the power thresholds of the first chip 210, the second chip 220, and the third chip 230 increase in sequence, and the power of the chip 200 is positively correlated with the heat generated by the chip 200, the aperture diameters of the vias 110 fanned out from the power pins of the first chip 210, the second chip 220, and the third chip 230 also increase in sequence. For example, the aperture diameter range of the via 110 fanned out from the power pin of the first chip 210 is 0.2mm - 0.25mm, preferably 0.2mm; the aperture diameter range of the via 110 fanned out from the power pin of the second chip 220 is 0.25mm - 0.3mm, preferably 0.25mm; the aperture diameter range of the via 110 fanned out from the power pin of the third chip 230 is 0.3mm - 0.35mm, preferably 0.3mm.

[0041] Similarly, as Figure 1 and Figure 3 shown, since the power thresholds of the first chip 210, the second chip 220, and the third chip 230 increase in sequence, and the power of the chip 200 is positively correlated with the heat generated by the chip 200, the number and / or diameter of the liquid cooling channels 120 correspondingly set for the first chip 210, the second chip 220, and the third chip 230 are different. For example, the number of the liquid cooling channels 120 corresponding to the first chip 210 is 2 - 3, and the diameter range of each liquid cooling channel 120 is 1mm - 1.3mm, preferably 1mm; the number of the liquid cooling channels 120 corresponding to the second chip 220 is 2 - 3, and the diameter range of each liquid cooling channel 120 is 1.3mm - 1.7mm, preferably 1.5mm; the number of the liquid cooling channels 120 corresponding to the third chip 230 is not less than 3, and the diameter range of each liquid cooling channel 120 is 1.7mm - 2mm, preferably 2mm.

[0042] As Figure 1 、 Figure 3 and 4As shown, in order to further improve the heat dissipation capacity of the first chip 210, the second chip 220, and the third chip 230, while the aperture diameters of the power pin fan-out vias 110 of the first chip 210, the second chip 220, and the third chip 230 increase in sequence, the number and / or diameter of the liquid cooling channels 120 correspondingly arranged within the board body 100 are set to increase in sequence. Thus, the solid copper material metal connection parts within different vias 110 rapidly conduct the heat generated by the corresponding power devices, and while continuously transferring the heat to the inside of the board body 100, the liquid cooling channels 120 within the corresponding position areas further absorb and conduct the heat transferred into the board body through the cooling medium moving directionally inside them, thereby also ensuring the continuous stability of the internal temperature of the board body 100.

[0043] That is to say, the above heat dissipation method of arranging the liquid cooling channels 120 within the board body 100, and the above heat dissipation method of differentially designing the sizes of the power pin fan-out vias 110 of the chips 200 on the board body, these two heat dissipation methods can be independently applied to the circuit board assembly to improve the heat dissipation efficiency of the chips 200, or the two methods can be combined with each other to further enhance the heat dissipation effect of the chips 200. The present application does not make specific limitations on the design selection of the specific heat dissipation method for the circuit board assembly.

[0044] Meanwhile, since the present application arranges the liquid cooling channels 120 within the board body 100, and / or differentially designs the sizes of the internal power pin fan-out vias 110 of the chips 200 on the board body 100, it can greatly improve the overall heat dissipation effect of the circuit board assembly, and thus there is no need to additionally arrange a fan module outside the circuit board assembly for air-cooled heat dissipation, avoiding the increase in the size of the electronic device, which is conducive to the miniaturization and compact design of the circuit board assembly and the corresponding electronic device.

[0045] Since the liquid cooling channels 120 are embedded within the board body 100, the number and diameter of the liquid cooling channels 120 corresponding to each chip area 101 need to be restricted to a certain extent. An overly dense arrangement of the liquid cooling channels 120 will affect the normal fan-out of the power or signal traces of the chips 200, and a liquid cooling channel 120 with too large a diameter will also cause an increase in the thickness of the board body 100, or make it difficult to press the board body 100, resulting in a reduction in the production yield of the board body 100.

[0046] Thus, the outer diameter of the liquid cooling channel 120 can be set to no more than 2 mm, so that the finished thickness of the plate body 100 can be about 3 mm, in order to improve the production yield of the plate body 100 and reduce the production cost. At the same time, the wall thickness of the liquid cooling channel 120 can be set to 0.3 mm. This design can avoid the liquid cooling channel 120 being too large and causing the liquid cooling channel 120 to rupture and the plate body 100 to bulge when the liquid cooling medium flows in the subsequent liquid cooling channel 120.

[0047] In addition, the number of liquid cooling channels 120 corresponding to the chip area 101 can also be flexibly set according to the spacing distance of adjacent liquid cooling channels 120 in the first direction. For example, the center distance between adjacent liquid cooling channels 120 in the first direction can be set to not less than 4 mm to ensure the electrical connection or signal connection between the chip 200 and the plate body 100.

[0048] It should be noted that the above-mentioned setting methods with different aperture diameters of the vias 110 within the chip area 101 are only for the power vias fanned out from the power pins of the chip 200, rather than other signal vias outside the power pins of the chip 200. That is to say, the aperture diameters of the signal vias corresponding to the signal areas outside the power pins of the chip 200 in the chip area 101 remain unchanged. For example, signal via fan-out traces with a diameter of 0.2 mm are all used.

[0049] Since the liquid cooling channel 120 penetrates the plate body 100 along the second direction and corresponds to the setting position of the chip area 101 in the direction perpendicular to the first surface, it may cause the drilling positions of some vias 110 to overlap with the setting positions of the liquid cooling branch pipes. If the drilling depth of the vias 110 is not restricted, the liquid cooling channel 120 pre-embedded in the plate body 100 will be drilled through during the drilling process of the vias 110, resulting in leakage of the cooling medium in the liquid cooling channel 120 or a short-circuit risk of the chip 200 due to the contact between the vias 110 and the pipe body or the cooling medium of the liquid cooling channel 120 during the application of the subsequent circuit board assembly.

[0050] Thus, according to the setting position of the liquid cooling channel 120, the actual type of the vias 110 within each chip area 101 can include blind vias. When the vertical projection of the power pins of the chip 200 in the direction perpendicular to the first surface may completely overlap or partially overlap with the vertical projection of the liquid cooling channel 120 on the first surface, thus, the power pins in this part need to be fanned out using blind vias with a relatively shallow depth. Among them, the blind vias can adopt a depth-controlled drilling process to precisely control the depth of the blind vias and drill holes at the corresponding positions on the first surface to avoid the blind vias penetrating the liquid cooling channel 120. Correspondingly, the vertical projection of the blind vias in the direction perpendicular to the first surface also completely overlaps or partially overlaps with the vertical projection of the liquid cooling channel 120 on the first surface.

[0051] According to the location of the liquid cooling channel 120, the actual type of the via 110 within each chip area 101 also includes a through hole. Since the vertical projection of the through hole in the direction perpendicular to the first surface does not overlap with the vertical projection of the liquid cooling channel 120 on the first surface, the through hole can extend from the first surface of the plate body 100 to the second surface, and vertically penetrate the plate body 100. As a result, the heat emitted by the chip 200 can be conducted to the second surface of the plate body 100 through the metal connection portion filled in the through hole, and exposed to the outside air, which is more conducive to convection heat dissipation with the air.

[0052] Furthermore, a thermally conductive copper sheet (not shown in the figure) is provided on the second surface corresponding to the position of the chip area 101. The thermally conductive copper sheet is in contact with the bottom of the through hole, so that the heat generated by the subsequent chip 200 can also be conducted to the thermally conductive copper sheet through the metal connection portion filled in the through hole. The heat is conducted to the air by the thermally conductive copper sheet with a larger surface area, which further improves the heat dissipation efficiency of the via 110 for the chip.

[0053] In addition, since the plate body 100 is usually formed by pressing together multiple circuit boards, during the design and preparation process of the plate body 100, liquid cooling channels 120 of different sizes need to be pressed between two relative circuit boards according to the designed coordinate positions, so that different chip areas 101 of the pressed plate body 100 can correspond to liquid cooling channels 120 of different sizes.

[0054] Before the liquid cooling channel 120 is pressed together with the circuit board to form the board body 100, the interfaces at both ends of the liquid cooling channel 120 need to be sealed to prevent chemical liquids in the etching and electroplating processes from entering the liquid cooling channel 120 during the PCB board manufacturing process, causing problems such as blockage of the liquid cooling channel 120. After the liquid cooling channel 120 is pressed together with the circuit board to form the board body 100, the via 110 is drilled into the board body 100 according to the designed coordinate position.

[0055] Furthermore, if Figure 5 As shown, the two sides of the plate body 100 along the second direction also include a liquid inlet pipe 130 and a liquid outlet pipe 140 extending along the first direction, and the liquid inlet pipe 130 is connected to the inlet end of each liquid cooling channel 120, and the liquid outlet pipe 140 is connected to the outlet end of each liquid cooling channel 120. The liquid cooling medium can flow into each liquid cooling channel 120 through the liquid inlet pipe 130 in turn, and then flow out through the liquid outlet pipe 140, so that the cooling medium can flow in a direction in the liquid cooling channel 120, and the heat transferred to the plate body 100 can be quickly discharged.

[0056] To ensure the normal connection between the inlet end of the liquid cooling channel 120 and the liquid inlet pipe 130, and between the outlet end of the liquid cooling channel 120 and the liquid outlet pipe 140, after each liquid cooling channel 120 extends through the plate body 100 at both ends along the second direction, it should also extend a first preset length away from the plate body 100 respectively, so that the liquid inlet pipe 130 and the liquid outlet pipe 140 can be connected to the inlet end and the outlet end of each liquid cooling channel 120 respectively.

[0057] As an example, the range of the preset length that the inlet end and the outlet end of each liquid cooling channel 120 extend away from the plate body 100 respectively is between 80 mm and 120 mm.

[0058] As an example, a brazing process can be used to weld and connect the inlet end and the outlet end of each liquid cooling channel 120 with different pipe diameters to the liquid inlet pipe 130 and the liquid outlet pipe 140. Since the welding temperature range of the brazing process is 700 °C to 750 °C, which exceeds the welding temperature of other devices on the circuit board assembly during wave soldering or reflow soldering. Therefore, in order to prevent components from falling off the circuit board assembly during the welding process of the liquid cooling channel 120 to the liquid inlet pipe 130 and the liquid outlet pipe 140 respectively, during the preparation of the circuit board assembly, the liquid inlet pipe 130 and the liquid outlet pipe 140 must be welded and connected to each liquid cooling channel 120 first, and then other devices on the circuit board assembly are welded.

[0059] At the same time, in order to meet the total flow rate requirement of the liquid cooling medium in the liquid cooling channel 120 in the plate body 100, and at the same time, to facilitate the minimization of the system assembly thickness of the subsequent circuit board assembly and take into account the structural compactness of the circuit board assembly, the outer diameter dimensions of the liquid inlet pipe 130 and the liquid outlet pipe 140 arranged at both ends of the plate body 100 along the second direction need to be greater than the plate thickness of the plate body 100 and less than the sum of the plate thickness of the plate body 100 and the maximum thickness (height) of the components connected to the plate body 100.

[0060] As an example, when the thickness of the plate body 100 is 3 mm and the maximum thickness (height) of the components on the plate body 100 is 4 mm, the outer diameter dimension range of the liquid inlet pipe 130 and the liquid outlet pipe 140 is 3 mm to 7 mm.

[0061] As an example, such as Figure 5 and 6As shown, in order to save the subsequent welding process of the liquid inlet pipe 130 and the liquid outlet pipe 140, according to the design requirements of the circuit board assembly, the liquid inlet pipe 130, the liquid outlet pipe 140 and each liquid cooling channel 120 with different pipe diameters can also be designed and manufactured into an integral liquid cooling component; then the liquid cooling component is integrally pressed inside the plate body 100, and finally a milling cutter is used to mill away the plate body 100 corresponding to the liquid inlet pipe 130 and the liquid outlet pipe 140 to expose the liquid inlet pipe 130 and the liquid outlet pipe 140. This design does not affect the subsequent welding and assembly of other devices on the circuit board assembly, reduces one welding process, and can achieve the purpose of reducing the manufacturing cost of the circuit board assembly.

[0062] It should be noted that in the above example, for the integral liquid cooling component, the outer diameter dimensions of the corresponding liquid inlet pipe 130 and the liquid outlet pipe 140 should not be greater than the plate thickness of the plate body 100 to avoid the situation that the plate body 100 is difficult to press, or to avoid the deformation of the liquid inlet pipe 130 and the liquid outlet pipe 140 during pressing. At the same time, due to the relatively small outer diameter dimensions of the liquid inlet pipe 130 and the liquid outlet pipe 140, there may be a risk of insufficient total flow rate of the liquid cooling medium in the liquid cooling component or a relatively thick circuit board design.

[0063] Therefore, if the liquid cooling medium in the liquid inlet pipe 130 and the liquid outlet pipe 140 is less than the sum of the liquid cooling medium flow rates of all the liquid cooling channels 120 in the circuit board, the liquid inlet pipe 130 and the liquid outlet pipe 140 can be further designed into a pipe structure with an elliptical or rectangular interface, and the total liquid cooling medium flow rate of the liquid inlet pipe 130 and the liquid outlet main pipe meets the sum of the liquid cooling medium flow rates of all the liquid cooling channels 120 in the circuit board, that is, the inner diameter cross-sectional area of the liquid inlet main pipe and / or the liquid outlet pipe 140 is not less than the sum of the inner diameter cross-sectional areas of each liquid cooling channel 120 in the plate body 100.

[0064] The second aspect of the present application also provides an electronic device, including the circuit board assembly described in any of the above embodiments.

[0065] In summary, the present application provides a circuit board assembly and an electronic device, including a board body 100 and at least one chip 200. The board body 100 includes opposite first and second surfaces. The first surface includes at least one chip area 101. Each chip area 101 includes a plurality of vias 110 extending from the first surface to one side of the second surface. The vias are filled with metal connection parts. Each chip 200 corresponds to each chip area 101 on the first surface, and the power pins of each chip 200 are fanned out through the vias 110 in the corresponding chip area 101. Based on different power thresholds of different chips 200, the present application specifically adjusts the sizes of the power fanning vias 110 in the chip areas on the board body 100, so that the apertures of the vias 110 corresponding to the fanned-out power pins of chips 200 with different power thresholds are different, to meet the heat dissipation requirements of power chips 200 with different power thresholds and improve the operating stability of the power chips 200 and their corresponding electronic devices.

[0066] At the same time, the circuit board assembly and the electronic device provided by the present application also set corresponding liquid cooling channels 120 with different sizes and / or quantities at preset coordinate positions inside the board body 100 according to the power chips 200 with different power thresholds, and make the setting positions of the liquid cooling channels 120 correspond to the setting positions of the corresponding power chips 200, so as to quickly absorb the heat generated by the power chips 200 by using the cooling medium filled in the liquid cooling channels 120. In addition, the cooling medium is set to flow directionally in the liquid cooling channels 120 to continuously absorb the heat generated by the power chips 200, which can further improve the heat dissipation and cooling effect on the power chips 200.

[0067] During the whole machine assembly process of the circuit board assembly and the electronic device provided by the present application, compared with the prior art, the need to install an air-cooled radiator, a fan module or a liquid cooling plate outside the circuit board assembly is eliminated. This not only reduces the assembly size of the whole machine body, improves the integration and miniaturization of the circuit board assembly and the electronic device, but also further reduces the production cost of the circuit board assembly and the electronic device, and solves the technical problem that it is difficult to be compatible with the high integration and heat dissipation design of high-power chip-related electronic devices.

[0068] In the description of the foregoing embodiments, the descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0069] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present application, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically defined.

Claims

1. A circuit board assembly, characterized in that, Comprising: A plate body, the plate body includes opposite first and second surfaces, at least one chip area is included on the first surface, each chip area includes a plurality of vias extending from the first surface to one side of the second surface, and the vias are filled with metal connection parts; At least one chip, disposed on the chip area; a power pin is provided in the core area of each chip, and the power pin is fanned out through the vias in the corresponding chip area; Wherein, a plurality of liquid cooling channels corresponding to each chip are further provided in the plate body, the liquid cooling channels are spaced from each other in a first direction, and extend in a second direction and penetrate through the plate body; wherein, the first direction is orthogonal to the second direction, and the orthogonal plane is parallel to the first surface.

2. The circuit board assembly according to claim 1, wherein, The diameters and / or the numbers of the liquid cooling channels corresponding to the chips with different power thresholds are different.

3. The circuit board assembly according to claim 2, wherein The diameters of the vias corresponding to the power pins of the chips with different power thresholds are fanned out differently.

4. The circuit board assembly according to claim 1, characterized in that The via at least includes one of a through hole and a blind hole.

5. The circuit board assembly according to claim 4, wherein The vertical projection of the blind hole on the first surface completely or partially overlaps with the vertical projection of the liquid cooling channel on the first surface, and the vertical projection of the through hole on the first surface does not overlap with the vertical projection of the liquid cooling channel on the first surface.

6. The circuit board assembly according to claim 1, wherein The chip includes at least one of a first chip, a second chip and a third chip with sequentially increasing power thresholds; wherein, The diameters of the vias corresponding to the first chip, the second chip and the third chip are fanned out sequentially; And / or, the diameters of the liquid cooling channels corresponding to the first chip, the second chip and the third chip increase sequentially; And / or, the numbers of the liquid cooling channels corresponding to the first chip, the second chip and the third chip increase sequentially.

7. The circuit board assembly according to claim 6, characterized in that, The diameter range of the via corresponding to the power pin of the first chip fanned out in the corresponding chip area is 0.2 mm to 0.25 mm; And / or, the diameter range of the via corresponding to the power pin of the second chip fanned out in the corresponding chip area is 0.25 mm to 0.3 mm; And / or, the diameter range of the via corresponding to the power pin of the third chip fanned out in the chip area is 0.3 mm to 0.35 mm.

8. The circuit board assembly according to claim 6, characterized in that, The number of the liquid cooling channels corresponding to the first chip is 2 to 3, and the diameter of each liquid cooling channel is 1 mm to 1.3 mm; And / or, the number of the liquid cooling channels corresponding to the second chip is 2 to 3, and the diameter of each liquid cooling channel is 1.3 mm to 1.7 mm; And / or, the number of the liquid cooling channels corresponding to the third chip is not less than 3, and the diameter of each liquid cooling channel is 1.7 mm to 2 mm.

9. The circuit board assembly according to claim 8, wherein, The distance between the centers of adjacent liquid channels in the first direction is not less than 4 mm.

10. The circuit board assembly according to claim 2, wherein The two ends of the plurality of liquid cooling channels in the second direction respectively penetrate through the plate body and extend a first preset length to the side away from the plate body, and the range of the first preset length is not less than 100 mm.

11. The circuit board assembly according to claim 10, wherein On both sides of the plate body along the second direction, there are also a liquid inlet pipe and a liquid outlet pipe extending along the first direction respectively. The liquid inlet pipe is communicated with the inlet end of each liquid cooling channel, and the liquid outlet pipe is communicated with the outlet end of each liquid cooling channel.

12. An electronic device, characterized in that, It includes the circuit board assembly according to any one of claims 1 to 11.

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