Component mounting apparatus

Abstract

A component mounting apparatus includes a first transfer line, a second transfer line, and a surface mounting apparatus on the first transfer line and the second transfer line. The surface mounting apparatus includes a first mounting head, a second mounting head, and a controller. The controller is configured to control the surface mounting apparatus such that the surface mounting apparatus performs continuous mounting. The surface mounting apparatus is configured to perform either individual mounting or collaborative mounting in continuous mounting, while individual mounting is prioritized. By means of the component mounting apparatus, continuous mounting and forward mounting can be automatically performed based on the order of substrates detected on the first transfer line and the second transfer line, thereby reducing delay and blockage in the mounting operation.

Description

Technical Field

[0001] The inventive concept relates to component mounting equipment. Background Art

[0002] Surface mount technology (SMT) refers to a technology commonly used during printed circuit board (PCB) processes. PCBs tend to become smaller, thinner, and lighter, and when PCBs are densely packaged and highly functional, a technology is needed to quickly and accurately mount various electronic components on the PCBs. Therefore, in the assembly of semiconductor products, SMT, which enables surface-mounted components to be placed and joined on the surface of the PCB, is becoming increasingly important. Summary of the Invention

[0003] The inventive concept aims to improve the productivity of component mounting operations by using component mounting equipment.

[0004] The technical problems to be solved by the inventive concept are not limited to the above description, and those of ordinary skill in the art can clearly understand other technical problems from the description provided below.

[0005] According to an exemplary embodiment of the inventive concept, a component mounting apparatus may include: a first transfer line; a second transfer line spaced apart from the first transfer line; a first surface mounting device positioned on the first transfer line and the second transfer line, wherein the first surface mounting device includes a first mounting head adjacent to the first transfer line, a second mounting head adjacent to the second transfer line, and a first controller configured to control the first mounting head and the second mounting head, the first controller further configured to control the first surface mounting device to perform continuous mounting, the first surface mounting device configured to perform either individual mounting or cooperative mounting in continuous mounting, with individual mounting having priority, individual mounting being an operation in which each of the first mounting head and the second mounting head is configured to perform a main mounting operation on a main substrate; cooperative mounting being an operation in which one of the first mounting head and the second mounting head is configured to perform a main mounting operation on a single substrate while the other of the first mounting head or the second mounting head is configured to simultaneously perform a sub-mounting operation on the single substrate, the main mounting operation being an operation in which the first mounting head is configured to perform an operation on a main substrate placed on the first transfer line or the second mounting head is configured to perform an operation on a main substrate placed on the second transfer line, the sub-mounting operation being an operation in which the first mounting head is configured to perform an operation on a sub-substrate placed on the second transfer line or the second mounting head is configured to perform an operation on a sub-substrate placed on the first transfer line, the main substrate including a substrate placed on the first transfer line relative to the first mounting head or a substrate placed on the second transfer line relative to the second mounting head, and the sub-substrate including a substrate placed on the second transfer line relative to the first mounting head or a substrate placed on the first transfer line relative to the second mounting head.

[0006] According to an exemplary embodiment of the inventive concept, a component mounting device may include: a first transfer line; a second transfer line parallel to the first transfer line and spaced apart from the first transfer line in a lateral direction; a first surface mounting device positioned on the first transfer line and the second transfer line; and a second surface mounting device disposed on the first transfer line and the second transfer line and located beside the first surface mounting device, wherein the first surface mounting device includes a first mounting head adjacent to the first transfer line, a second mounting head adjacent to the second transfer line, and a first controller configured to control the first mounting head and the second mounting head of the first surface mounting device, the second surface mounting device includes a first mounting head adjacent to the first transfer line, a second mounting head adjacent to the second transfer line, and a second controller configured to control the first mounting head and the second mounting head of the second surface mounting device, and the first controller is further configured to control the first surface mounting device to perform a forward mounting when the second surface mounting device stops operating, the forward mounting being performed by the first mounting head of the first surface mounting device as a main mounting operation, wherein the main mounting operation of the first mounting head of the second surface mounting device is added, and the main mounting operation includes an operation in which the first mounting head of the first surface mounting device or the first mounting head of the second surface mounting device performs an operation on a main substrate placed on the first transfer line, or an operation in which the second mounting head of the first surface mounting device or the second mounting head of the second surface mounting device performs an operation on a main substrate placed on the second transfer line.

[0007] According to an exemplary embodiment of the inventive concept, a component mounting device may include: a first transfer line; a second transfer line parallel to the first transfer line and spaced apart from the first transfer line in a lateral direction; a first surface mounting device located on the first transfer line and the second transfer line; and a second surface mounting device located on the first transfer line and the second transfer line, the second surface mounting device being located beside the first surface mounting device, wherein the first surface mounting device includes a first mounting head adjacent to the first transfer line, a second mounting head adjacent to the second transfer line, and a first controller configured to control the first mounting head and the second mounting head of the first surface mounting device, the second surface mounting device includes a first mounting head adjacent to the first transfer line, a second mounting head adjacent to the second transfer line, and a second controller configured to control the first mounting head and the second mounting head of the second surface mounting device, the first controller is further configured to control the first surface mounting device such that the first surface mounting device performs an operation including continuous mounting, the first controller is further configured to control the first surface mounting device to perform forward mounting when the second surface mounting device stops working, the first surface mounting device is configured to perform either individual mounting or cooperative mounting in continuous mounting, but individual mounting takes precedence, individual mounting is an operation in which each of the first mounting head and the second mounting head is configured to perform a main mounting operation on a main substrate, cooperative mounting is an operation in which one of the first mounting head and the second mounting head is configured to perform a main mounting operation on the main substrate while the other of the first mounting head and the second mounting head is configured to simultaneously perform a sub-mounting operation on a sub-substrate, forward mounting is performed by the first mounting head of the first surface mounting device as a main mounting operation, wherein the main mounting operation of the first mounting head of the second surface mounting device is added, and the main mounting operation is an operation in which the first mounting head of the first surface mounting device or the first mounting head of the second surface mounting device is configured to perform an operation on the main substrate placed on the first transfer line, or the second mounting head of the first surface mounting device or the second mounting head of the second surface mounting device is configured to perform an operation on the main substrate placed on the second transfer line, the sub-mounting operation is an operation in which the first mounting head of the first surface mounting device or the second mounting head of the second surface mounting device is configured to perform an operation on the sub-substrate placed on the second transfer line, or the second mounting head of the first surface mounting device or the second mounting head of the second surface mounting device is configured to perform an operation on the sub-substrate placed on the first transfer line, the main substrate includes a substrate placed on the first transfer line relative to the first mounting head or placed on the second transfer line relative to the second mounting head, and the sub-substrate includes a substrate placed on the second transfer line relative to the first mounting head or placed on the first transfer line relative to the second mounting head. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Example embodiments of the inventive concept will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which: Figure 1 is a conceptual diagram of a component mounting device according to an example embodiment; Figure 2 illustrates a component mounting device according to an example embodiment; Figure 3 illustrates a component mounting device according to an example embodiment; Figure 4 illustrates a component mounting device according to an example embodiment; Figure 5 illustrates a component mounting device according to an example embodiment; Figure 6 is a conceptual diagram of a component mounting device according to an example embodiment; and Figures 7A to 7E is a diagram illustrating a forward mounting process of a component mounting device according to an example embodiment. DETAILED DESCRIPTION

[0009] As used herein, when preceding a list of elements, expressions such as "one of" and "at least one of" modify the entire list of elements and not individual elements of the list. Thus, for example, both "at least one of A, B, or C" and "at least one of A, B, and C" refer to A, B, C, or any combination thereof. Similarly, A and / or B refers to A, B, or A and B.

[0010] Hereinafter, one or more example embodiments of the inventive concept will be described in detail with reference to the accompanying drawings.

[0011] One or more example embodiments are provided so that this disclosure will convey the scope of the example embodiments to those of ordinary skill in the art. The following example embodiments are embodied in many different forms and should not be construed as limited to the example embodiments described herein. Rather, these example embodiments are provided so that this disclosure will be thorough and complete and will convey the scope of the example embodiments to those of ordinary skill in the art. In addition, for clarity and convenience of illustration, the dimensions and thicknesses of layers in the drawings are exaggerated.

[0012] Figure 1 is a conceptual diagram of a component mounting device 1 according to an example embodiment. Figure 2 illustrates a component mounting device 1 according to an example embodiment.

[0013] Reference Figure 1, the first surface mount device SMT1 may include a first mounting head MH11 and a second mounting head MH12. The first surface mount device SMT1 may include a driver that manages operations, including operations where the first mounting head MH11 and the second mounting head MH12 pick up components to be mounted on a substrate and operations where the first mounting head MH11 and the second mounting head MH12 mount the components on the substrate. A first controller CTR1 may be included in the first surface mount device SMT1. The first controller CTR1 may control the overall operations and functions of the first surface mount device SMT1.

[0014] The first mounting head MH11 and the second mounting head MH12 may each be operated by three or more programs. For example, the first mounting head MH11 and the second mounting head MH12 may each be operated by up to three programs. The first mounting head MH11 may be operated based on a first program PGM1, a second program PGM2, and a third program PGM3. As Figure 1 shown, the first program PGM1 may be an A1 program, and the second program PGM2 may be a B1 program. The third program PGM3 may not include an operation program or may not specify the third program PGM3. The term "operation program" refers to a program for performing component mounting operations on a substrate.

[0015] Programs may be stored in the controller of the surface mount device. For example, the first program PGM1, the second program PGM2, and the third program PGM3 of the first mounting head MH11 may be stored in the first controller CTR1. Such a description may also apply to the second mounting head MH12 described below, the second controller CTR2 of the second surface mount device SMT2, and the third controller CTR3 of the third surface mount device SMT3.

[0016] Programs enable the mounting head to perform component mounting operations on a target substrate. Through this program, the mounting head can perform component mounting operations by arranging specific components at designated positions on the substrate. When mounting components on different substrates, the mounting head may use different programs.

[0017] Moreover, even when the mounting head targets substrates with the same final result, when the stages of the component mounting operations are different, the programs applied to the mounting head may also be different. For example, on a substrate that requires ten component mounting operations, the program for the third component mounting operation may be different from the program for the fourth component mounting operation.

[0018] In addition, even if the substrates with the same final result are targeted for component mounting, the programs applied to the mounting head can vary depending on whether the target is the front surface of the substrate or the back surface opposite to the front surface of the substrate. In summary, when different programs are applied to the mounting head, the mounting head performs different operations. Furthermore, depending on the program applied to the mounting head, the operations performed by the mounting head vary.

[0019] Reference Figure 2 , the component mounting device 1 can perform individual mounting and collaborative mounting. The term "individual mounting" refers to the process in which the mounting head performs the component mounting operation alone. That is, the first mounting head MH11 and the second mounting head MH12 of the first surface mounting device SMT1 perform the mounting operations on the substrate respectively. Collaborative mounting is described below.

[0020] During individual mounting, for example, as Figure 2 shown, the first mounting head MH11 can perform the component mounting operation on the A0 substrate by using the A1 program. In this specification, for example, after the component mounting operation, the A0 substrate can be changed to the A1 substrate, and the program that the mounting head runs to achieve this change can be the A1 program. That is, the A0 substrate can be converted to the A1 substrate through the component mounting process using the A1 program.

[0021] As described above, each mounting head can be equipped with three or more programs. For example, the first mounting head MH11 and the second mounting head MH12 can each be equipped with up to three programs. As Figure 3 shown, for example, the first mounting head MH11 can be equipped with up to three programs, and two programs (for example, the A1 program and the B1 program) can be loaded into the first mounting head MH11. In addition, the second mounting head MH12 can be equipped with up to three programs, and two programs (for example, the A1 program and the B1 program) can be loaded into the second mounting head MH12. In other words, since each of the first mounting head MH11 and the second mounting head MH12 is equipped with the A1 program and the B1 program, the first mounting head MH11 and the second mounting head MH12 can perform the component mounting operations on the A0 substrate and the B0 substrate respectively.

[0022] The first surface mounting device SMT1 can include substrate sensors corresponding to the first mounting head MH11 and the second mounting head MH12 respectively. The substrate sensors can identify whether the substrate is located at the positions where the first mounting head MH11 and the second mounting head MH12 perform the component mounting operations, and can also identify the type of the substrate.

[0023] In Figure 2 are shown the shapes and positions of the first substrate sensor D11 and the second substrate sensor D12 for understanding. Figure 2The O - mark or X - mark on the first substrate sensor D11 and the second substrate sensor D12 is a simplified indication showing whether the substrate has reached each substrate sensor. In addition, Figure 2 Marks such as A0 or B0 inside the O - mark on the first substrate sensor D11 and the second substrate sensor D12 clearly indicate the type of substrate identified by the first substrate sensor D11 and the second substrate sensor D12.

[0024] For example, as Figure 2 shown, the first substrate sensor D11, which is used to sense the substrate that has reached the working area of the first mounting head MH11 when the substrate has reached the working area where the first mounting head MH11 can operate, can be included in the first surface - mounting device SMT1. In other words, the first substrate sensor D11 can detect that the substrate has reached the working area of the first mounting head MH11 and identify that the substrate is an A0 substrate. The first substrate sensor D11 can send information to Figure 1 the first controller CTR1 of the first surface - mounting device SMT1 as shown, where the information indicates that the substrate that has reached the working area of the first mounting head MH11 is an A0 substrate. The substrate sensor can identify the identification unit marked on each substrate and recognize the substrate. The identification unit marked on each substrate can include, for example, a QR code or a bar code.

[0025] In this specification, the working area of the first mounting head MH11 refers to the position on the first conveyor line L1 relatively close to the first mounting head MH11 where component - mounting operations can be performed on the substrate. In addition, the working area of the second mounting head MH12 refers to the position on the second conveyor line L2 relatively close to the second mounting head MH12 where component - mounting operations can be performed on the substrate.

[0026] The first substrate sensor D11 can send information indicating that the substrate that has reached the first working area is an A0 substrate to at least one or all of the first controller CTR1 of the first surface - mounting device SMT1 and the integrated controller for collectively controlling multiple component - mounting devices. The information about the substrate identified by the first substrate sensor D11 can record and track the progress of the operations performed on the substrate in at least one of the above - mentioned controllers.

[0027] The first mounting head MH11 of the first surface - mounting device SMT1 can mount components onto the A0 substrate that has reached the first working area by using the A1 program selected from the A1 program and the B1 program.

[0028] The substrates in the working areas close to the first mounting head MH11 and the second mounting head MH12 can be called main substrates, while the substrates in the distant working areas can be called sub - substrates. For example, asFigure 2 As shown, the A0 substrate relatively close to the first mounting head MH11 can be the main substrate of the first mounting head MH11, and the B0 substrate relatively far from the first mounting head MH11 can be the sub-substrate of the first mounting head MH11. On the other hand, the B0 substrate close to the second mounting head MH12 can be the main substrate of the second mounting head MH12, and the A0 substrate relatively far from the second mounting head MH12 can be the sub-substrate of the second mounting head MH12. That is to say, the separate mounting involves performing component mounting on the main substrate of the first mounting head MH11 and then performing component mounting on the main substrate of the second mounting head MH12.

[0029] In addition, in this specification, the main mounting program is defined as a program for the operation of the mounting head on the main substrate. For example, in Figure 2 the separate mounting shown, since the program for processing the A0 substrate which is the main substrate of the first mounting head MH11 is the A1 program, the A1 program is the main mounting program of the first mounting head MH11. Since the program for processing the B0 substrate which is the main substrate of the second mounting head MH12 is the B1 program, the B1 program is the main mounting program of the second mounting head MH12.

[0030] In addition, the term "main mounting operation" used in this specification means that the mounting head performs a component mounting operation on the main substrate. For example, in Figure 2 the separate mounting shown, the main substrate of the first mounting head MH11 is the A0 substrate, and the process in which the first mounting head MH11 performs a component mounting operation on the A0 substrate using the A1 program can be called the main mounting operation.

[0031] Therefore, separate mounting refers to the process in which each of the two mounting heads performs its own main mounting operation. When such a definition is applied to Figure 2 the separate mounting, the main mounting operation is performed on the A0 substrate which is the main substrate of the first mounting head MH11 by using the A1 program which is the main mounting program of the first mounting head MH11, and the main mounting operation is performed on the B0 substrate which is the main substrate of the second mounting head MH12 by using the B1 program which is the main mounting program of the second mounting head MH12.

[0032] As Figure 2As shown, a second substrate sensor D12 for sensing a substrate that has reached the working area of a second mounting head MH12 when the substrate has reached the working area where the second mounting head MH12 can operate may be included in the first surface mounting device SMT1. The second substrate sensor D12 may identify that the substrate that has reached the working area of the second mounting head MH12 is a B0 substrate. The second mounting head MH12 of the first surface mounting device SMT1 may mount components on the B0 substrate that has reached the working area of the second mounting head MH12 by using the B1 program selected from the A1 program and the B1 program.

[0033] According to an example embodiment, the component mounting device 1 may perform cooperative mounting. Cooperative mounting refers to a process in which when a substrate as a work target is located only in one of the working areas of the first mounting head MH11 and the second mounting head MH12, both the first mounting head MH11 and the second mounting head MH12 work together to mount components on the target substrate. As Figure 2 shown, for example, when the first substrate sensor D11 detects that the A0 substrate is located in the first working area and the second substrate sensor D12 does not find a substrate in the second working area, the first mounting head MH11 and the second mounting head MH12 may simultaneously mount components on the A0 substrate that has reached the first working area.

[0034] The A0 substrate may reach the working area of the first mounting head MH11 and be positioned therein by the first transfer line L1 adjacent to the first mounting head MH11. In this case, the first mounting head MH11 and the second mounting head MH12 may respectively perform component mounting on the A0 substrate by using the A1 program. However, the moving distance of the first mounting head MH11 during component loading and mounting is less than the moving distance of the second mounting head MH12 during component loading and mounting. Therefore, the travel time of the first mounting head MH11 during component loading and mounting is less than the travel time of the second mounting head MH12 during component loading and mounting.

[0035] In this specification, a sub-mounting program refers to a program used by a mounting head to process a sub-substrate. For example, in Figure 2 the cooperative mounting, since the program for processing the B0 substrate as the sub-substrate of the first mounting head MH11 is the B1 program, the B1 program is the sub-mounting program of the first mounting head MH11. Since the program for processing the A0 substrate as the sub-substrate of the second mounting head MH12 is the A1 program, the A1 program is the sub-mounting program of the second mounting head MH12.

[0036] In addition, the term "sub-mounting operation" used in this specification means that a mounting head performs a component mounting operation on a sub-substrate. For example, inFigure 2 In the co-installation, the sub-substrate of the first mounting head MH11 is the B0 substrate, and the process in which the first mounting head MH11 performs component mounting operations on the B0 substrate by using the B1 program can be referred to as the sub-mounting operation.

[0037] Therefore, co-installation refers to the process in which two mounting heads simultaneously perform the main mounting operation and the sub-mounting operation separately. In addition, the mounting head for performing the main mounting operation performs operations by using the main mounting program, and the mounting head for performing the sub-mounting operation performs operations by using the sub-mounting program.

[0038] When this definition is applied to Figure 2 the co-installation, the first mounting head MH11 performs operations on the A0 substrate, which is the main substrate of the first mounting head MH11, by using the A1 program, which is the main mounting program of the first mounting head MH11, and the second mounting head MH12 performs operations on the A0 substrate, which is the sub-substrate of the second mounting head MH12, by using the A1 program, which is the sub-mounting program of the second mounting head MH12.

[0039] In this specification, the term "main mounting head" refers to the mounting head that performs the main mounting operation, and the term "sub-mounting head" indicates the mounting head that performs the sub-mounting operation.

[0040] Figure 3 FIG. shows a component mounting device 1 according to an exemplary embodiment.

[0041] Referring to Figure 3 , the component mounting device 1 according to the exemplary embodiment can perform continuous mounting. Continuous mounting refers to the process in which two mounting heads selectively perform individual mounting and co-installation, but individual mounting takes precedence over co-installation. Therefore, when the two mounting heads cooperate for co-installation, one of the two mounting heads can stop co-installation and switch to performing individual mounting.

[0042] In other words, each of the two mounting heads can selectively perform the main mounting operation and the sub-mounting operation, but the main mounting operation takes precedence over the sub-mounting operation. When the two mounting heads are performing the main mounting operation and the sub-mounting operation, when the sub-mounting head is capable of performing the main mounting operation, that is, when the main substrate of the sub-mounting head has reached the working area of the sub-mounting head, the sub-mounting head can suspend the sub-mounting operation and start the main mounting operation.

[0043] For example, as in Stage 1, each of the first mounting head MH11 and the second mounting head MH12 can use the A1 program to perform component mounting on the A0 substrate located in the working area of the first mounting head MH11. As in Stage 2, the substrate to be processed can reach the working area of the second mounting head MH12 through the second transfer line L2. The second substrate sensor D12 can identify the arriving substrate and detect that the B0 substrate has reached the working area of the second mounting head MH12.

[0044] According to the signal from the second substrate sensor D12, the second mounting head MH12, which is currently processing the A0 substrate in the working area of the first mounting head MH11, can stop the operation on the A0 substrate and move to the working area of the second mounting head MH12 to start the operation on the B0 substrate. That is to say, the second mounting head MH12 can stop the co-installation being executed and perform individual installation on the B0 substrate in the working area of the second mounting head MH12, which is relatively close to the second mounting head MH12.

[0045] However, in Stage 1, the second mounting head MH12 can perform operations on the A0 substrate by using the A1 program, which is the first program PGM1. In Stage 2, the second mounting head MH12 can switch to the B1 program, which is the second program PGM2, to perform operations on the B0 substrate located in the working area of the second mounting head MH12. The program transition from the A1 program to the B1 program in the second mounting head MH12 is intuitively shown by an arrow.

[0046] However, since the sub-mounting head interrupted the operation on the sub-substrate and moved to perform the main mounting operation, the sub-mounting operation has not been completed and has stopped. The following is a description with reference to Figure 4 this.

[0047] As in Figure 3 Stage 3 shown, after the co-installation operation on the A0 substrate is completed by the first mounting head MH11 and the second mounting head M12 in Stage 1, the A0 substrate can be transferred to the next working area as the A1 substrate via the first transfer line L1. Due to the co-installation and individual installation, the operation on the A0 substrate in the working area of the first mounting head MH11 can be completed faster than the operation on the B0 substrate in the working area of the second mounting head MH12. That is to say, because the operation on the A0 substrate adjacent to the first mounting head MH11 is completed earlier, the first mounting head MH11 can perform co-installation on the B0 substrate, where the component mounting operation on the B0 substrate starts later than on the A0 substrate.

[0048] However, in stage 2, the first mounting head MH11 performs operations on the A0 substrate by using the A1 program as the first program PGM1. After completing the component mounting operations on the A0 substrate, the first mounting head MH11 can switch to the B1 program as the second program PGM2 in stage 3 to perform operations on the B0 substrate processed by the second mounting head MH12. The program transition from the A1 program to the B1 program in the first mounting head MH11 is intuitively shown by an arrow.

[0049] In stage 3, since the second mounting head MH12 has already performed component mounting operations on the B0 substrate, the stage of the operation using the B1 program can be sent to the first mounting head MH11 to prevent task overlap or conflict between the second mounting head MH12 and the first mounting head MH11. The stage of the component mounting operation of the second mounting head MH12 using the B1 program can be identified in units of cycles, and the detailed method of this identification is provided as follows for reference. Figure 4 Provided.

[0050] Continuous mounting involves the following process: Initially, when a substrate is inside the first surface mounting device SMT1, two mounting heads perform main mounting operations and sub-mounting operations on the substrate respectively. When an additional substrate is transferred into the first surface mounting device SMT1, the mounting heads perform main mounting operations on the two substrates respectively. And subsequently, when the component mounting operations on one substrate are completed while leaving the other, the mounting heads perform main mounting operations and sub-mounting operations on the remaining substrate respectively.

[0051] By performing continuous mounting in the component mounting device 1, the time period during which the mounting heads in the component mounting device 1 do not perform component mounting operations can be reduced. Therefore, the component mounting device 1 according to the exemplary embodiment can improve the productivity of the component mounting operations.

[0052] Figure 4 Fig. shows the component mounting device 1 according to the exemplary embodiment. Figure 5 Fig. shows the component mounting device 1 according to the exemplary embodiment.

[0053] Refer together Figure 3 and Figure 4 , the two mounting heads of the component mounting device are capable of performing continuous mounting as described above. During continuous mounting, the method of component mounting performed by the two mounting heads changes. For example, when the sub-substrate is transferred through the transfer line during co-mounting, the mounting head that previously performed the sub-mounting operation stops the sub-mounting operation and switches to the main mounting operation. On the other hand, in separate mounting where each mounting head performs the main mounting operation, when any one mounting head finishes its operation first, this mounting head performs the sub-mounting operation on the other substrate that is still performing the main mounting operation.

[0054] During co-installation, when any one of the mounting heads switches to single installation, the sub-mounting head stops the ongoing sub-mounting operation to perform the main mounting operation, and thus, the sub-mounting operation of the sub-mounting head can be stopped.

[0055] In addition, for a single substrate, when the single installation of each mounting head changes to co-installation, while one mounting head performs the main mounting operation, another mounting head that has already performed the main mounting operation can join in midway and perform the sub-mounting operation, ensuring that the sub-mounting operation and the main mounting operation are performed in parallel on the same substrate.

[0056] For the convenience of continuous installation, as Figure 4 shown, the components to be mounted on the substrate can be organized into multiple cycles, thus allowing the tracking and management of the component mounting operation. The sub-mounting operation during co-installation can be stopped in cycle units instead of component units, and the sub-mounting operation during single installation can start in cycle units instead of component units.

[0057] Refer to Figure 4 and exemplarily describe the component mounting operation performed in cycle units. As Figure 4 shown, the first mounting head MH11 of the surface mount device SMT1 can perform the main mounting operation on the A0 substrate as the main substrate. The second mounting head MH12 can perform the sub-mounting operation on the A0 substrate as the sub-substrate. Figure 4 is an enlarged view of the co-installation operation in stage 1 of the continuous installation shown in Figure 3 centered around the substrate.

[0058] For example, the number of components that should be loaded during the component mounting operation performed on the A0 substrate by using the A1 program can be 100. The mounting head can organize 100 components into multiple cycles and mount them. For example, the 100 components that should be mounted on the A0 substrate can be grouped into ten cycles from the first cycle C1 to the tenth cycle C10, where each cycle includes ten components. That is to say, the A1 program can be a program that enables the component mounting operation to be performed on the A0 substrate in the first cycle C1 to the tenth cycle C10.

[0059] Components 1 to 10 are grouped into the first cycle C1, components 11 to 20 are grouped into the second cycle C2, and similarly, each cycle from the third cycle C3 to the tenth cycle C10 can include ten components. The components can include components mounted on the substrate, such as passive components, semiconductor chips, diodes, transistors, and circuits.

[0060] Based on the above ten cycles, the component mounting operation can be started or stopped. During the process of switching from collaborative mounting to individual mounting by a separate mounting head, the sub-mounting operation of the sub-mounting head can be stopped. Using Figure 4 as an example, the component mounting operation can be performed on the A0 substrate, where the first mounting head MH11 is used as the main mounting head and the second mounting head MH12 is used as the sub-mounting head. The first mounting head MH11 mounts components 1 to 10 included in the first cycle C1, and after completing the component mounting in the first cycle C1, continuously mounts components 11 to 20 included in the second cycle C2. In the above order, these operations can be performed in units of cycles.

[0061] When two mounting heads simultaneously perform the component mounting operation on the substrate, one of the two mounting heads can perform the main mounting operation for the cycles with earlier numbers among multiple cycles. On the other hand, the other mounting head can perform the sub-mounting operation for the cycles with later numbers among multiple cycles. This situation corresponds to collaborative mounting.

[0062] The component mounting operation is tracked in units of cycles, and when the sub-mounting head exits during collaborative mounting, any cycles completed by the sub-mounting head are tracked and sent to the main mounting head. In addition, the component mounting operation is tracked in units of cycles, and when switching from individual mounting to collaborative mounting and the sub-mounting head joins, any cycles completed by the sub-mounting head are tracked and sent to the main mounting head.

[0063] In the component tray, a series of processes including picking up components by the mounting head, moving the mounting head that picks up the components, performing component mounting by the mounting head, and transferring the mounting head to its original position on the component tray can be the above-mentioned component mounting operation in units of cycles. In other words, a series of processes including picking up components by the mounting head and returning the mounting head to its original position in the component tray can be the mounting operation in one cycle. Therefore, when ten components are picked up and mounted during the process of the mounting head picking up components and returning to its original position on the component tray, the number of components in one cycle can be ten. In this case, when 100 components are to be mounted on a single substrate, the component mounting operation of the substrate can include ten cycles, each cycle including ten components.

[0064] Since the component mounting operation of the mounting head is fast-paced, it may be challenging to track the component mounting operation in units of components. Even if the component mounting operation is tracked in units of components, it may not be easy to switch between individual mounting and collaborative mounting in units of components.

[0065] By managing the component mounting operations in terms of cycles, it is possible to smoothly track the progress of such component mounting operations during individual mounting, collaborative mounting, and continuous mounting on a cycle-by-cycle basis, thereby reducing the idle time of the two mounting heads. Therefore, the component mounting apparatus 1 that tracks the component mounting operations in terms of cycles can perform the component mounting operations more efficiently. In addition, when differentiating cycles based on the positions of components, interference between the main mounting head and the sub-mounting head during collaborative mounting can be reduced.

[0066] When the sub-mounting head is separated from the sub-substrate during the sub-mounting operation, the number of completed cycles can be sent to the controller of the surface mounting device. Based on the received information, the main mounting head can perform the main mounting operation. Therefore, the main mounting head does not have to perform the main mounting operation in all cycles; instead, under the control of the controller, the main mounting head can perform the main mounting operation in cycles other than the cycles in which the sub-mounting head performs the sub-mounting operation. In other words, the tracking of the cycles of the main mounting device or the sub-mounting device can be performed by the controller of the surface mounting device.

[0067] In Figure 4 In the collaborative mounting shown, the second mounting head MH12 can perform the sub-mounting operation while the first mounting head MH11 starts the component mounting operation. For example, while the first mounting head MH11 performs the component mounting operation of the component in the first cycle C1, the second mounting head MH12 can simultaneously perform the component mounting operation of the component in the tenth cycle C10. In this case, the first mounting head MH11 and the second mounting head MH12 respectively perform the component mounting operations for a similar number of cycles (e.g., five cycles), and thus, the first mounting head MH11 and the second mounting head MH12 can complete the component mounting operation on the substrate at nearly similar time points.

[0068] In some exemplary embodiments, the second mounting head MH12 can join the component mounting operation of the first mounting head MH11 midway to start the sub-mounting operation. For example, after the first mounting head MH11 performs the component mounting operation of the component in the first cycle C1 to the second cycle C2, the second mounting head MH12 can start the component mounting operation of the component in the tenth cycle C10.

[0069] The main mounting head that performs the main mounting operation can perform sequential mounting in terms of cycles, and the sub-mounting head that performs the sub-mounting operation can perform reverse mounting in terms of cycles, where the mounting operation of the cycle with a lower number is performed during sequential mounting, and the mounting operation of the cycle with a higher number is performed during reverse mounting. As described above, the first mounting head MH11 that performs the main mounting operation can perform sequential mounting from the first cycle C1 to the second cycle C2, while the second mounting head MH12 that performs the sub-mounting operation can perform reverse mounting from the tenth cycle C10 to the ninth cycle C9.

[0070] When the second mounting head MH12 performs the mounting operation in the tenth cycle C10, the components 91 to 100 in the tenth cycle C10 can be mounted in ascending order from component 91 to component 100 or in descending order from component 100 to component 91. The order can be determined based on the configuration of the component mounting device, the layout of the components on the substrate, and the selection made by the operator.

[0071] When the individual mounting by a separate mounting head is changed to a cooperative mounting for a single substrate, the sub-mounting head performs a sub-mounting operation midway during the individual mounting, and thus, the sub-mounting operation by the sub-mounting head starts simultaneously with the main mounting operation.

[0072] For example, after the first mounting head MH11, which is the main mounting head, mounts the components up to the second cycle C2, the second mounting head MH12, which is the sub-mounting head, can join the operation to perform a cooperative mounting. The first controller CTR1 can control the second mounting head MH12 to start the sub-mounting operation from the tenth cycle C10 and continue to perform the sub-mounting operation until the seventh cycle C7. Moreover, since the second mounting head MH12 has joined the sub-mounting operation after the first mounting head MH11 has completed the main mounting operation up to the second cycle C2, the first mounting head MH11 can be controlled by the first controller CTR1 to continue the main mounting operation until the sixth cycle C6 instead of until the tenth cycle C10.

[0073] After the cooperative mounting starts, the first mounting head MH11 performs the main mounting operations in the third cycle C3 to the sixth cycle C6, while the second mounting head MH12 performs the sub-mounting operations in the seventh cycle C7 to the tenth cycle C10. That is, after the cooperative mounting starts, each of the first mounting head MH11 and the second mounting head MH12 performs the mounting operation for four cycles. Therefore, the cooperative mounting of the first mounting head MH11 and the second mounting head MH12 can terminate at nearly the same time point.

[0074] The specific setting of how much the sub-mounting head operating together with the main mounting head should perform the component mounting is determined by considering, for example, user or task characteristics, the shape of the substrate, and the characteristics of the mounting device.

[0075] For example, as Figure 4As shown, the method of grouping components into cycles may include: classifying components based on a first virtual center line CTL1 extending in the same direction as the first transfer line L1, and grouping components relatively close to the first mounting head MH11 as the main mounting head into the first cycle C1 to the fifth cycle, i.e., the cycles with earlier numbers. In addition, by classifying components based on the first virtual center line CTL1, components relatively close to the second mounting head MH12 as the sub-mounting head can be grouped into the sixth cycle to the tenth cycle C10, i.e., the cycles with later numbers.

[0076] By arranging the cycles with later numbers to be relatively close to the second mounting head MH12 as the sub-mounting head and operating starting from the tenth cycle C10, the travel distance for the second mounting head MH12 to perform component mounting in reverse order can be reduced. In addition, interference between the two mounting heads can be reduced or prevented by dividing the cycles and performing component mounting operations.

[0077] In some example embodiments, to facilitate component mounting operations, multiple cycles can be generated by dividing them at the component positions on the substrate. The main mounting head can start the mounting operation from the cycle relatively close to the main mounting head among the cycles, and the sub-mounting head can also start the mounting operation from the cycle relatively close to the sub-mounting head among the cycles. On the substrate, components relatively close to the main mounting head can be grouped into cycles with earlier numbers, and components relatively close to the sub-mounting head can be grouped into cycles with later numbers, thereby generating multiple cycles.

[0078] For example, as Figure 4 shown, on the A0 substrate, components 1 to 10 close to the first mounting head MH11 as the main mounting head can be grouped into the first cycle C1, and components 11 to 20 secondarily close to the first mounting head MH11 can be grouped into the second cycle C2. Similarly, on the A0 substrate, components 91 to 100 near the second mounting head MH12 as the sub-mounting head can be grouped into the tenth cycle C10, and components 81 to 90 secondarily close to the second mounting head MH12 can be grouped into the ninth cycle C9.

[0079] On the A0 substrate, the first mounting head MH11 as the main mounting head can start the component mounting operation from the first cycle C1 relatively close to the first mounting head MH11. In addition, on the A0 substrate, the second mounting head MH12 as the sub-mounting head can start the component mounting operation from the tenth cycle C10 relatively close to the second mounting head MH12.

[0080] Referring together to Figure 3 and Figure 5 with Figure 4Differently, the method of grouping components into cycles may include, for example, dividing the components based on a second virtual center line CTL2 that passes through the center of the substrate and extends perpendicular to the first transfer line L1. Based on the second virtual center line CTL2, the components arranged at the rear of the A0 substrate can be grouped into the first cycle C1 to the fifth cycle C5, i.e., the cycles with earlier numbers among the ten cycles. In addition, by classifying the components based on the second virtual center line CTL2, the components in front of the A0 substrate can be grouped into the sixth cycle C6 to the tenth cycle C10, i.e., the cycles with later numbers among the ten cycles.

[0081] In this specification, the front of the substrate refers to the part of the substrate facing the direction of the mounting operation process and the direction in which the substrate is transferred, while the rear of the substrate refers to the part facing away from the direction in which the substrate is transferred. That is, in Figure 5 , based on the second virtual center line CTL2, the left side can be the rear of the substrate, and the right side can be the front of the substrate.

[0082] Figure 6 is a conceptual diagram of the component mounting device 1 according to an exemplary embodiment.

[0083] Referring to Figure 6 , the first surface mounting device SMT1 may include a first mounting head MH11 and a second mounting head MH12. The first surface mounting device SMT1 may include a driver (not shown) that manages operations, which include the operations of the first mounting head MH11 and the second mounting head MH12 picking up components to be mounted on the substrate and the operations of the first mounting head MH11 and the second mounting head MH12 mounting the components on the substrate.

[0084] The first mounting head MH11 and the second mounting head MH12 may each operate through three or more programs. For example, the first mounting head MH11 and the second mounting head MH12 may each operate through at most three programs. As Figure 6 shown, the first program PGM1 may be the A1 program and the second program PGM2 may be the B1 program. The third program PGM3 may not be stored or specified.

[0085] Similar to the first surface mounting device SMT1, the second surface mounting device SMT2 may include a driver (not shown) that manages operations, which include the operations of the first mounting head MH21 and the second mounting head MH22 picking up components to be mounted on the substrate and the operations of the first mounting head MH21 and the second mounting head MH22 mounting the components on the substrate. The second controller CTR2 may be included in the second surface mounting device SMT2. The second controller CTR2 may control the overall operations and functions of the second surface mounting device SMT2.

[0086] The first mounting head MH21 and the second mounting head MH22 can each be operated by three or more programs. As Figure 6 shown, the first program PGM1 can be an A2 program and the second program PGM2 can be a B2 program. The third program PGM3 may not be stored or specified.

[0087] Similar to the first surface mounting device SMT1, the third surface mounting device SMT3 can include a driver (not shown) that manages operations, including the operations of the first mounting head MH31 and the second mounting head MH32 picking up components to be mounted on a substrate and the operations of the first mounting head MH31 and the second mounting head MH32 mounting the components on the substrate. The third controller CTR3 can control the overall operations and functions of the third surface mounting device SMT3.

[0088] The first mounting head MH31 and the second mounting head MH32 can each be operated by three or more programs. As Figure 6 shown, the first program PCM1 can be an A3 program and the second program PGM2 can be a B3 program. The third program PGM3 may not be stored or specified.

[0089] Each program can include the mounting process required for the mounting head to mount components on a target substrate. Therefore, when different programs are applied to the mounting head, the mounting head performs different tasks. In addition, depending on the program applied to the mounting head, the tasks performed by the mounting head are different.

[0090] As Figure 6 shown, an integrated controller CTR can be included to collectively control the first surface mounting device SMT1, the second surface mounting device SMT2, and the third surface mounting device SMT3. The first surface mounting device SMT1, the second surface mounting device SMT2, and the third surface mounting device SMT3 can respectively include a first controller CTR1, a second controller CTR2, and a third controller CTR3.

[0091] Figures 7A to 7E is a diagram illustrating the forward mounting process of the component mounting device 1 according to an exemplary embodiment.

[0092] Refer to Figure 7A and Figure 7B , the first mounting head MH11 and the second mounting head MH12 of the first surface mounting device SMT1, the first mounting head MH21 and the second mounting head MH22 of the second surface mounting device SMT2, and the first mounting head MH31 and the second mounting head MH32 of the third surface mounting device SMT3 can respectively perform the main mounting operations.

[0093] The substrates that receive the main mounting operations of the first mounting head MH11 and the second mounting head MH12 are the A0 substrate and the B0 substrate, respectively. The substrates that receive the main mounting operations of the first mounting head MH21 and the second mounting head MH22 are the A1 substrate and the B1 substrate, respectively. The substrates that receive the main mounting operations of the first mounting head MH31 and the second mounting head MH32 are the A2 substrate and the B2 substrate, respectively. When the main mounting operation is completed on each substrate, the substrate can then be moved to the next mounting device via the first transfer line L1 and the second transfer line L2.

[0094] For example, after the main mounting operation using the A1 program by the first mounting head MH11 of the first surface mounting device SMT1 is completed on the A0 substrate and the A0 substrate is converted into the A1 substrate, the A1 substrate can be moved via the first transfer line L1 to the next workstation in front of the first mounting head MH21 of the second surface mounting device SMT2.

[0095] After the main mounting operation using the A2 program by the first mounting head MH21 of the second surface mounting device SMT2 is completed on the A1 substrate and the A1 substrate is converted into the A2 substrate, the A2 substrate can be moved via the first transfer line L1 to the next workstation in front of the first mounting head MH31 of the third surface mounting device SMT3. Similarly, after the main mounting operation using the A3 program by the first mounting head MH31 of the third surface mounting device SMT3 is completed on the A2 substrate and the A2 substrate is converted into the A3 substrate, the A3 substrate can be moved via the first transfer line L1 for the next operation.

[0096] The description regarding the second mounting head MH12 of the first surface mounting device SMT1, the second mounting head MH22 of the second surface mounting device SMT2, and the second mounting head MH32 of the third surface mounting device SMT3 is similar to the description provided above, and those of ordinary skill in the art will easily understand these similarities.

[0097] The second surface mounting device SMT2 may include a first substrate sensor D21 and a second substrate sensor D22, and the third surface mounting device SMT3 may include a first substrate sensor D31 and a second substrate sensor D32. Since their descriptions are similar to those of the first substrate sensor D11 and the second substrate sensor D12 of the first surface mounting device SMT1, those of ordinary skill in the art will easily understand these similarities.

[0098] Reference Figure 7C and Figure 7D, a surface mounting device may stop working due to a malfunction or error. For example, the third surface mounting device SMT3 may stop working. The first mounting head MH31 and the second mounting head MH32 of the third surface mounting device SMT3 can be configured to perform mounting operations by using Program A3 and Program B3. However, since the third surface mounting device SMT3 has stopped working, the main mounting operation of the first mounting head MH31 using Program A3 and the main mounting operation of the second mounting head MH32 using Program B3 may not be executed.

[0099] According to an example embodiment, the component mounting device 1 can transfer the main mounting operation program of the aborted surface mounting device to another component mounting device, so that the main mounting operation of the suspended surface mounting device can be executed as a main mounting operation in the component mounting device.

[0100] The detection of the aborted surface mounting device can be enabled when a substrate on which the operation has been completed within one minute is transferred. The duration of not transporting the substrate can be appropriately set according to the user. For example, as Figure 7C shown, since the operation of the third surface mounting device SMT3 has stopped, even if the A2 substrate reaches in front of the first mounting head MH31, the composite mounting operation will not be executed. When the third surface mounting device SMT3 has not completed the operation after one minute, the main mounting program of the third surface mounting device SMT3 can be sent for forward mounting.

[0101] For example, as Figure 7C shown, Program A3, which is the main mounting program of the first mounting head MH31 of the third surface mounting device SMT3, can be transferred to Program PGM3 of the first mounting head MH21 of the second surface mounting device SMT2. That is, the first mounting head MH21 can be equipped with the first program PGM1, the second program PGM2, and the third program PGM3, where the first program PGM1 is Program A2 as the main mounting program, the second program PGM2 is Program B2 as the sub-mounting program, and the third program PGM3 is Program A3 as the additional main mounting program.

[0102] When the A1 substrate reaches the first mounting head MH21, the first substrate sensor D21 can identify that the A1 substrate has arrived. On the A1 substrate, the first mounting head MH21 can perform a component mounting operation by using Program A2 as the main mounting program, and thus, the A1 substrate can be converted into an A2 substrate.

[0103] As Figure 7D shown, the first mounting head MH21 may not transfer the A2 substrate to the next workstation and may continuously perform an additional main mounting operation on it by using Program A3 as the additional main mounting program. Therefore, asFigure 7E As shown, after the main installation operation using the A3 program, the A2 substrate can be converted into an A3 substrate. The A3 substrate was originally manufactured by the first mounting head MH31 of the third surface mounting device SMT3. However, since the third surface mounting device SMT3 stopped working, the main mounting program of the third surface mounting device SMT3 was sent to the second surface mounting device SMT2, and thus, the operations originally for the third surface mounting device SMT3 were performed in the second surface mounting device SMT2.

[0104] Therefore, the main mounting programs of the two mounting heads of the aborted surface mounting device are sent and loaded onto the previous surface mounting device, and the previous surface mounting device can be configured to perform the main mounting operation of the aborted surface mounting device. The component mounting device 1 can continue the entire operation without interruption even when some surface mounting devices stop working. Therefore, the component mounting device 1 according to this exemplary embodiment can improve the productivity of the component mounting operation.

[0105] No operations are performed on the substrate that has reached the third surface mounting device SMT3, and the A2 substrate that has reached in front of the first mounting head MH31 and the B2 substrate that has reached in front of the second mounting head MH32 can be conveyed via the first conveyor line and the second conveyor line L2, respectively.

[0106] The first mounting head MH21 of the second surface mounting device SMT2 can not only perform the operation using the A2 program, but also perform the A3 program operation of the first mounting head MH31 of the third surface mounting device SMT3. When there are only two programs for the main mounting operation in the second surface mounting device SMT2, in other surface mounting devices, for example, in the first surface mounting device SMT1, there is one program for the main mounting operation, and thus, the time taken for the operation in the second surface mounting device SMT2 can be longer than the time taken for the operation in the first surface mounting device SMT1.

[0107] When assuming that the time required for the surface mounting operation using each program is approximately the same, the second surface mounting device SMT2 performs two main mounting operations, and thus, the operation time in the second surface mounting device SMT2 can be nearly twice as long as the time taken for the main mounting operation performed once in the first surface mounting device SMT1. Therefore, a bottleneck may occur in the component mounting operation on the substrate in the second surface mounting device SMT2.

[0108] To alleviate the bottleneck of the second surface mounting device SMT2 caused by the suspension of the third surface mounting device SMT3, the main mounting program of the second surface mounting device SMT2 can be transferred to the first surface mounting device SMT1 and loaded onto it. That is to say, although the second surface mounting device SMT2 does not stop working, the main mounting program of the second surface mounting device SMT2 can be transferred to the first surface mounting device SMT1 and loaded onto it, similar to the situation where the suspension of the third surface mounting device SMT3 leads to the transfer and loading of the main mounting program of the third surface mounting device SMT3 onto the second surface mounting device SMT2.

[0109] As Figure 7C shown, for example, similar to the situation where the A3 program, which is the main mounting program of the first mounting head MH31 of the third surface mounting device SMT3, is transferred to and loaded onto the first mounting head MH21 of the second surface mounting device SMT2, the A2 program, which is the main mounting program of the first mounting head MH21 of the second surface mounting device SMT2, can be transferred to and loaded onto the first surface mounting device SMT1.

[0110] When the A2 program is loaded onto the first mounting head MH11 as the third program PGM3, the first mounting head MH11 can perform the main mounting operation on the A0 substrate using the A1 program as the first program PGM1 to manufacture the A1 substrate, and can additionally use the A2 program as the third program PGM3 to perform the main mounting operation on the A1 substrate to manufacture the A2 substrate.

[0111] It is described that since two programs are used in the second surface mounting device SMT2 to convert the A1 substrate into the A3 substrate, a bottleneck may occur during the component mounting operation in the second surface mounting device SMT2. However, when the main mounting program is not only transferred from the suspended surface mounting device but also transferred from the previous surface mounting device and loaded onto it, the occurrence of bottlenecks during the component mounting operation can be reduced (for example, bottlenecks that may occur in the previous surface mounting device rather than the suspended surface mounting device).

[0112] For example, when the A2 program, which is the main installation program of the second surface mount device SMT2, is transferred to and loaded on the first surface mount device SMT1, the A0 substrate can be converted into the A2 substrate using the A1 program and the A2 program in the first surface mount device SMT1, while the A1 substrate is changed into the A3 substrate using the A2 program and the A3 program in the second surface mount device SMT2. While the second surface mount device SMT2 performs component mounting operations on the substrate using two programs, the first surface mount device SMT1 can also perform component mounting operations on the substrate using two programs, and thus, there may be no significant difference in the operation times of the second surface mount device SMT2 and the first surface mount device SMT1. Therefore, bottlenecks in component mounting operations (e.g., bottlenecks that may occur in the surface mount device immediately before the aborted surface mount device) may be reduced.

[0113] The component mounting device 1 can transfer and load the main installation program of the aborted surface mount device to the previous surface mount device. For this, even if the surface mount device stops working, production losses can be reduced and component mounting operations can continue. Therefore, with the component mounting device 1 according to the exemplary embodiment, the productivity of component mounting operations can be improved.

[0114] Then, as Figure 7E shown, the A2 substrate and the B2 substrate on which component mounting has been completed in the first surface mount device SMT1 can be transferred to the second surface mount device SMT2, and the A3 substrate and the B3 substrate on which component mounting has been completed in the second surface mount device SMT2 can pass through the third surface mount device SMT3 and can be moved to the next surface mount device or a different device.

[0115] In other words, forward installation includes transferring and loading the main installation program of the aborted surface mount device onto the previous surface mount device to continue the main installation operation performed in the aborted surface mount device.

[0116] Only three surface mount devices are shown in the drawings, but three or more surface mount devices can be used for surface mounting operations of components. For example, the surface mounting operations can be continuously performed by ten surface mount devices. Since each surface mount device processes different mounting operations, when one surface mount device stops, the operations of all surface mount devices may not be implemented and may be blocked.

[0117] With the component mounting device 1 according to the exemplary embodiment, even if a surface mount device aborts, the component mounting operation of the aborted surface mount device can be continued in other surface mount devices through the transfer of programs. Therefore, the component mounting device 1 according to the exemplary embodiment can have improved productivity of component mounting operations.

[0118] For example, when the third surface mount device SMT3 stops, the second surface mount device SMT2 and the first surface mount device SMT1 can perform continuous mounting simultaneously with forward mounting.

[0119] In other words, since the main mounting operation of the third surface mount device SMT3 is performed as an additional main mounting operation in the second surface mount device SMT2, when all the main mounting operations and additional main mounting operations of the first mounting head MH21 of the second surface mount device SMT2 have been completed, the first mounting head MH21 can join the main mounting operation of the second mounting head MH22 as a sub-mounting head to perform a sub-mounting operation.

[0120] Since the main mounting operation of the second mounting head MH22 is performed using the B2 program, the first mounting head MH21 can join the second mounting head MH22 by using the B2 program as the sub-mounting program of the first mounting head MH21 to perform a sub-mounting operation. Similarly, the second mounting head MH22 as the main mounting head performs sequential mounting in units of cycles, and the first mounting head MH21 as the sub-mounting head performs reverse mounting in units of cycles.

[0121] However, since the additional main mounting operation added to the second mounting head MH22 is a mounting operation using the B3 program, when the second mounting head MH22 performs the additional main mounting operation using the B3 program, the first mounting head MH21 may not perform cooperative mounting. This is because the first mounting head MH21 is equipped with the A2 program as the main mounting program, the B2 program as the sub-mounting program, and the A3 program as the additional main mounting program.

[0122] Similarly, since the main mounting operation of the third surface mount device SMT3 is performed as an additional main mounting operation in the second surface mount device SMT2, when all the main mounting operations and additional main mounting operations of the second mounting head MH22 of the second surface mount device SMT2 have been completed, the second mounting head MH22 can join the main mounting operation of the first mounting head MH21 as a sub-mounting head to perform a sub-mounting operation. However, those of ordinary skill in the art will easily understand that based on the above description, the second mounting head MH22 may not join the additional main mounting operation of the first mounting head MH21.

[0123] Any functional block shown in the drawings and described above may be implemented in processing circuitry, such as hardware including logic circuits, a hardware / software combination such as a processor executing software, or a combination thereof. For example, processing circuitry may more specifically include, but is not limited to, a central processing unit (CPU), an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field programmable gate array (FPGA), a system on chip (SoC), a programmable logic unit, a microprocessor, an application specific integrated circuit (ASIC), and the like.

[0124] Although the inventive concept has been specifically shown and described with reference to some example embodiments in accordance with the inventive concept, it will be understood that various changes in form and detail may be made herein without departing from the spirit and scope of the appended claims.

Claims

1. A component mounting device, the component mounting device comprising: A first conveyor line; A second conveyor line, the second conveyor line being spaced apart from the first conveyor line; And A first surface mounting device, the first surface mounting device being located on the first conveyor line and the second conveyor line, Wherein, the first surface mounting device includes a first mounting head adjacent to the first conveyor line, a second mounting head adjacent to the second conveyor line, and a first controller configured to control the first mounting head and the second mounting head, The first controller is further configured to control the first surface mounting device to perform either individual mounting or cooperative mounting in consecutive mountings, with individual mounting taking precedence, The individual mounting is an operation in which the first mounting head and the second mounting head are each configured to perform a main mounting operation on a main substrate; The cooperative mounting is an operation in which one of the first mounting head or the second mounting head is configured to perform a main mounting operation on a single substrate, and the other of the first mounting head or the second mounting head is configured to simultaneously perform a sub-mounting operation on the single substrate, The main mounting operation is an operation in which the first mounting head is configured to perform an operation on a main substrate placed on the first conveyor line or the second mounting head is configured to perform an operation on a main substrate placed on the second conveyor line, The sub-mounting operation is an operation in which the first mounting head is configured to perform an operation on a sub-substrate placed on the second conveyor line or the second mounting head is configured to perform an operation on a sub-substrate placed on the first conveyor line, The main substrate includes a substrate placed on the first conveyor line relative to the first mounting head or a substrate placed on the second conveyor line relative to the second mounting head, and The sub-substrate includes a substrate placed on the second conveyor line relative to the first mounting head or a substrate placed on the first conveyor line relative to the second mounting head.

2. The component mounting device according to claim 1, wherein, The first surface mounting device further includes a first substrate sensor and a second substrate sensor, The first substrate sensor is configured to identify a substrate that has reached the working area of the first mounting head on the first conveyor line, and The second substrate sensor is configured to identify a substrate that has reached the working area of the second mounting head on the second conveyor line.

3. The component mounting device according to claim 1, wherein, Each of the first mounting head and the second mounting head is equipped with at least two programs for performing component mounting operations, The first mounting head is equipped with a main mounting program and a sub-mounting program, and the second mounting head is equipped with a main mounting program and a sub-mounting program, The main mounting program of the first mounting head includes a program that enables the first mounting head to perform the main mounting operation on the main substrate, The main mounting program of the second mounting head includes a program that enables the second mounting head to perform the main mounting operation on the main substrate, The sub-mounting program of the first mounting head includes a program that enables the first mounting head to perform the sub-mounting operation on the sub-substrate, and The sub-installation program of the second mounting head includes a program that enables the second mounting head to perform the sub-mounting operation on the sub-substrate.

4. The component mounting device according to claim 3, wherein, The main installation program of the first mounting head and the sub-installation program of the second mounting head target the same substrate, and The sub-installation program of the first mounting head and the main installation program of the second mounting head target the same substrate.

5. The component mounting device according to claim 4, wherein, The continuous installation includes an operation where, when another substrate is introduced during the co-installation on an existing substrate, the main mounting head configured to perform the main mounting operation on the another substrate is configured to stop the sub-mounting operation on the existing substrate and perform the main mounting operation on the another substrate.

6. The component mounting device according to claim 5, wherein, The continuous installation includes an operation where, when the main mounting operation of any one of the first mounting head and the second mounting head is completed during the separate installation, the mounting head that has completed the main mounting operation is configured to join the main mounting operation of the other one of the first mounting head and the second mounting head and perform the sub-mounting operation.

7. The component mounting device according to claim 5, wherein, The main mounting operation and the sub-mounting operation are configured to be executed in units of cycles, and A cycle is one of a plurality of cycles used to group components when performing the main mounting operation or the sub-mounting operation on a specific substrate by using one program.

8. The component mounting device according to claim 7, wherein, The main mounting head is configured to perform sequential installation in units of cycles starting from a cycle with a smaller number among the plurality of cycles, The sub-mounting head is configured to perform reverse installation in units of cycles starting from a cycle with a larger number among the plurality of cycles, and The order of the cycles for performing the reverse installation is opposite to the order of the cycles for performing the sequential installation.

9. The component mounting device according to claim 8, wherein, The way of grouping components into the plurality of cycles includes dividing the components based on a first virtual center line in the same direction as the first transfer line or the second transfer line, and relative to the first virtual center line, the components relatively closer to the main mounting head are grouped into the cycle with a smaller number and the components relatively closer to the sub-mounting head are grouped into the cycle with a larger number.

10. The component mounting device according to claim 7, wherein, The main mounting head is configured to perform the mounting operation starting from a cycle relatively closer to the main mounting head among the plurality of cycles, and the sub-mounting head configured to perform the sub-mounting operation is configured to perform the mounting operation starting from a cycle relatively closer to the sub-mounting head among the plurality of cycles.

11. The component mounting device according to claim 7, wherein, The number of components picked up by each of the first mounting head and the second mounting head for the mounting operation is the same as the number of components in each of the plurality of cycles.

12. The component mounting device according to claim 4, the component mounting device further comprising: A second surface mounting device, the second surface mounting device is placed on the first transfer line and the second transfer line, and the second surface mounting device is arranged beside the first surface mounting device. Among them, the second surface mounting device includes a first mounting head adjacent to the first conveyor line, a second mounting head adjacent to the second conveyor line, and a second controller configured to control the first mounting head and the second mounting head of the second surface mounting device. The first controller is configured to control the first surface mounting device to perform forward mounting when the second surface mounting device stops working, and The forward mounting is performed by the first mounting head of the first surface mounting device as the main mounting operation, and the main mounting operation of the first mounting head of the second surface mounting device is added.

13. The component mounting device according to claim 12, wherein, When the second surface mounting device stops working, the main mounting program of the first mounting head of the second surface mounting device is transferred to the first mounting head of the first surface mounting device as an additional main mounting program and is loaded into the first mounting head of the first surface mounting device.

14. The component mounting device according to claim 12, wherein, The second controller is further configured to: Determine that the second surface mounting device stops working when the output of the component mounting operation from the second surface mounting device is not transmitted within one minute; and Send the status that the second surface mounting device stops working to the first controller.

15. The component mounting device according to claim 13, wherein, The substrate on which the main mounting program and the additional main mounting program are completely executed by the first mounting head in the first surface mounting device is configured not to be processed in the second surface mounting device but to pass through the second surface mounting device.

16. The component mounting device according to claim 15, wherein, The forward mounting further includes allowing the main mounting operation of the second mounting head of the second surface mounting device to be performed by the second mounting head of the first surface mounting device as an additional main mounting operation. The main mounting program of the second mounting head of the second surface mounting device is transferred to the second mounting head of the first surface mounting device as an additional main mounting program and is loaded into the second mounting head of the first surface mounting device, and The substrate on which the main mounting operation and the additional main mounting operation are completed by the second mounting head in the first surface mounting device is configured not to be processed in the second surface mounting device but to pass through the second surface mounting device.

17. Component mounting device, the component mounting device includes: A first conveyor line; A second conveyor line, the second conveyor line is parallel to the first conveyor line, and the second conveyor line is separated from the first conveyor line in the lateral direction; A first surface mounting device, the first surface mounting device is located on the first conveyor line and the second conveyor line; And A second surface mounting device, the second surface mounting device is located on the first conveyor line and the second conveyor line, and the second surface mounting device is located beside the first surface mounting device. Among them, the first surface mounting device includes a first mounting head adjacent to the first conveyor line, a second mounting head adjacent to the second conveyor line, and a first controller configured to control the first mounting head and the second mounting head of the first surface mounting device. The second surface mounting device includes a first mounting head adjacent to the first transfer line, a second mounting head adjacent to the second transfer line, and a second controller configured to control the first mounting head and the second mounting head of the second surface mounting device. The first controller is further configured to control the first surface mounting device to perform forward mounting when the second surface mounting device stops working. The forward mounting is performed by the first mounting head of the first surface mounting device as the main mounting operation, and the main mounting operation of the first mounting head of the second surface mounting device is added, and The main mounting operation includes an operation in which the first mounting head of the first surface mounting device or the first mounting head of the second surface mounting device performs an operation on the main substrate placed on the first transfer line, or an operation in which the second mounting head of the first surface mounting device or the second mounting head of the second surface mounting device performs an operation on the main substrate placed on the second transfer line.

18. The component mounting device according to claim 17, wherein, When the second surface mounting device stops working, the main mounting program of the first mounting head of the second surface mounting device is transmitted and loaded into the first mounting head of the first surface mounting device as an additional main mounting program. The second controller is further configured to determine that the second surface mounting device has stopped working when the output of the component mounting operation from the second surface mounting device is not transmitted within one minute. The second controller is further configured to send the status that the second surface mounting device has stopped working to the first controller, and The substrate on which the main mounting operation and the additional main mounting operation are completed by the first mounting head in the first surface mounting device is not processed in the second surface mounting device but passes through the second surface mounting device.

19. The component mounting device according to claim 18, wherein, The first controller is further configured to control the first surface mounting device such that the first surface mounting device performs an operation including continuous mounting. The first surface mounting device is configured to perform either individual mounting or collaborative mounting in the continuous mounting, and the individual mounting has priority. The individual mounting is an operation in which the first mounting head and the second mounting head of the first surface mounting device are each configured to perform a main mounting operation on the main substrate. The collaborative mounting is an operation in which one of the first mounting head or the second mounting head in the first surface mounting device is configured to perform a main mounting operation on the main substrate while the other of the first mounting head or the second mounting head in the first surface mounting device is configured to perform a sub-mounting operation on the sub-substrate simultaneously. The main mounting operation is an operation in which the first mounting head of the first surface mounting device is configured to perform an operation on the main substrate placed on the first transfer line or the second mounting head of the first surface mounting device is configured to perform an operation on the main substrate placed on the second transfer line. The sub - mounting operation is an operation in which the first mounting head of the first surface - mounting device is configured to perform an operation on a sub - substrate placed on the second transfer line or the second mounting head of the first surface - mounting device is configured to perform an operation on a sub - substrate placed on the first transfer line. The main substrate includes a substrate placed on the first transfer line relative to the first mounting head of the first surface - mounting device or a substrate placed on the second transfer line relative to the second mounting head of the first surface - mounting device, and The sub - substrate includes a substrate placed on the second transfer line relative to the first mounting head of the first surface - mounting device or a substrate placed on the first transfer line relative to the second mounting head of the first surface - mounting device.

20. A component mounting device, the component mounting device comprising: A first transfer line; A second transfer line, the second transfer line being parallel to the first transfer line and being separated from the first transfer line in a lateral direction; A first surface - mounting device located on the first transfer line and the second transfer line; And A second surface - mounting device located on the first transfer line and the second transfer line, the second surface - mounting device being located beside the first surface - mounting device, wherein the first surface - mounting device includes a first mounting head adjacent to the first transfer line, a second mounting head adjacent to the second transfer line, and a first controller configured to control the first mounting head and the second mounting head of the first surface - mounting device, The second surface - mounting device includes a first mounting head adjacent to the first transfer line, a second mounting head adjacent to the second transfer line, and a second controller configured to control the first mounting head and the second mounting head of the second surface - mounting device, The first controller is further configured to control the first surface - mounting device such that the first surface - mounting device performs an operation including continuous mounting, The first controller is further configured to control the first surface - mounting device to perform forward mounting when the second surface - mounting device stops working, The first surface - mounting device is configured to perform either individual mounting or cooperative mounting in the continuous mounting, and the individual mounting has priority, The individual mounting is an operation in which the first mounting head and the second mounting head are each configured to perform a main mounting operation on a main substrate, The cooperative mounting is an operation in which one of the first mounting head and the second mounting head is configured to perform a main mounting operation on a main substrate while the other of the first mounting head and the second mounting head is configured to simultaneously perform a sub - mounting operation on a sub - substrate, The forward mounting is performed by the first mounting head of the first surface - mounting device as a main mounting operation, with the main mounting operation of the first mounting head of the second surface - mounting device added. The main mounting operation is an operation in which the first mounting head of the first surface mounting device or the first mounting head of the second surface mounting device is configured to perform an operation on the main substrate placed on the first conveyor line, or an operation in which the second mounting head of the first surface mounting device or the second mounting head of the second surface mounting device is configured to perform an operation on the main substrate placed on the second conveyor line. The sub-mounting operation is an operation in which the first mounting head of the first surface mounting device or the first mounting head of the second surface mounting device is configured to perform an operation on the sub-substrate placed on the second conveyor line, or an operation in which the second mounting head of the first surface mounting device or the second mounting head of the second surface mounting device is configured to perform an operation on the sub-substrate placed on the first conveyor line. The main substrate includes a substrate placed on the first conveyor line relative to the first mounting head or placed on the second conveyor line relative to the second mounting head, and The sub-substrate includes a substrate placed on the second conveyor line relative to the first mounting head or placed on the first conveyor line relative to the second mounting head.

Images