Surface mounting method of magnetic component

Abstract

The invention discloses a mounting method of a magnetic component, and relates to the field of semiconductor mounting. The mounting method of the magnetic component comprises the following steps: step 1, endowing a suction nozzle with weak magnetism; 2, the magnetic attraction force generated by the suction nozzle meets the condition that the magnetic attraction force of the suction nozzle is smaller than or equal to the gravity of the magnetic component; meanwhile, the resultant force of the magnetic attraction force generated by the suction nozzle and the vacuum adsorption force meets the condition that the suction nozzle magnetic attraction force + the vacuum adsorption force is larger than or equal to the magnetic attraction force of external iron on the magnetic component + the gravity of the magnetic component. According to the method for adjusting the magnetic attraction force of the suction nozzle, the magnetic attraction force of the suction nozzle can counteract the magnetic attraction force of external iron on the magnetic component, and meanwhile the problem that the magnetic component is attracted in advance and deviates when the suction nozzle does not make contact with the magnetic component is solved; in addition, the control of the suction nozzle on the chip can be enhanced so as to ensure that the suction nozzle can stably suck the magnetic component in the process of transferring the magnetic component.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging, and particularly to a method for packaging magnetic components. Background Art

[0002] In the prior art, a nozzle picks up and mounts magnetic components by vacuum adsorption. However, since magnetic components have magnetism, external iron will generate a magnetic attraction force on the magnetic components, resulting in a shift in the position of the magnetic components to be picked up. When the vacuum adsorption force is less than the external magnetic attraction force, it is difficult for the nozzle to stably pick up the magnetic components.

[0003] By using a magnetic nozzle, the magnetic interference of the magnetic components can be offset, facilitating the picking up of the magnetic components. However, if the magnetic attraction force of the nozzle is too large, the magnetic attraction force of the nozzle will attract the magnetic components before the nozzle reaches the magnetic components, resulting in a shift in the position of the magnetic components and thus the problem of inaccurate picking up by the nozzle; if the magnetic attraction force of the nozzle is too small, there will be a problem that the nozzle cannot firmly hold the magnetic components. Summary of the Invention

[0004] The purpose of this application is to achieve the dynamic balance between the magnetic adsorption force of the nozzle and the magnetic interference force of the magnetic components, avoiding premature adsorption before contact while ensuring stable retention after picking up.

[0005] To solve the above technical problems, this application provides a method for packaging magnetic components, including the following steps: Step 1: Endow the nozzle with weak magnetism; Step 2: Make the magnetic attraction force generated by the nozzle satisfy: nozzle magnetic attraction force ≤ gravity of the magnetic component; at the same time, make the resultant force of the magnetic attraction force generated by the nozzle and the vacuum adsorption force satisfy: nozzle magnetic attraction force + vacuum adsorption force ≥ magnetic attraction force of external iron on the magnetic component + gravity of the magnetic component.

[0006] Preferably, Step 2 includes: S101: Optionally select a nozzle that has not been selected before, turn off the vacuum adsorption function of the nozzle, gradually move the nozzle closer to the magnetic component, and observe whether the position of the magnetic component shifts during the process of the nozzle moving to the target position; if so, repeat Step S101; if not, perform Step S102; S102: Turn on the vacuum adsorption function of the nozzle, make the nozzle pick up and transfer the magnetic component, and observe whether the nozzle stably picks up the magnetic component during the movement of the magnetic component; if so, use the current nozzle for subsequent picking up operations of the magnetic components; if not, repeat S101.

[0007] Preferably, when the magnitude of the magnetic attraction force of the nozzle is known, Step 2 includes: S201: Turn off the vacuum adsorption function of the nozzle, gradually move the nozzle closer to the magnetic component, and observe whether the position of the magnetic component shifts during the movement of the nozzle to the target position; if so, execute step S202; if not, execute step S203; S202: After replacing the nozzle with a smaller magnetic suction force, repeat S201; S203: Turn on the vacuum adsorption function of the nozzle, make the nozzle suck and transfer the magnetic component, and observe whether the nozzle stably sucks the magnetic component during the movement of the magnetic component; if so, use the current nozzle for subsequent suction operations of the magnetic component; if not, determine whether step S202 has been executed. If step S202 has not been executed, replace the nozzle with a larger magnetic suction force and repeat S201. If step S202 has been executed, it is determined that there is no nozzle meeting the requirements currently.

[0008] Preferably, the method for mounting the magnetic component further includes: Step 3: Place the carrier on the loading table, and the loading table drives the carrier to move to the loading position; Step 4: The nozzle sucks the magnetic component on the carrier and moves the magnetic component to the target position.

[0009] Preferably, the target position is the chip accommodation position of the rotating mechanism, and the rotating mechanism can fix the magnetic component and drive the magnetic component to rotate.

[0010] Preferably, the rotating mechanism fixes the magnetic component through vacuum adsorption.

[0011] Preferably, the method for mounting the magnetic component further includes: Step 5: The rotating mechanism drives the magnetic component to rotate so that the mounting surface of the magnetic component faces downward.

[0012] Preferably, the method for mounting the magnetic component further includes: Step 6: Perform a mounting operation on the rotated magnetic component, and determine whether it is the last magnetic component on the carrier; if not, repeat steps 3 - 6; if so, stop the operation.

[0013] Preferably, step 1 includes: The nozzle body is made of austenitic stainless steel, and a magnetically adjustable region is formed at the end of the nozzle through cold deformation processing.

[0014] Preferably, the process parameter combination of the geometric dimensions of the austenitic stainless steel nozzle, the cold working feed rate, and the cutting speed is synergistically regulated to control the strength of the magnetic force of the nozzle.

[0015] One or more technical solutions provided in this application have at least the following technical effects or advantages: A method for adjusting the magnetic suction force of a suction nozzle is provided, so that the magnetic suction force of the suction nozzle can cancel the magnetic suction force of external iron on the magnetic component, and at the same time, avoid the problem that the magnetic component is adsorbed and shifted in advance when the suction nozzle does not contact the magnetic component. In addition, it can strengthen the control of the suction nozzle on the chip to ensure that the suction nozzle can stably suck the magnetic component during the process of transferring the magnetic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0017] Figure 1 is a flowchart of a method for mounting a magnetic component provided by an embodiment of the present application; Figure 2 is a schematic diagram of a suction nozzle provided by an embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings of the present application. Obviously, the described embodiments of the present application are only some embodiments of the present application, rather than all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0019] Please refer to Figure 1 , the method for mounting a magnetic component includes the following steps: Step 1: Endow the suction nozzle with weak magnetism. Please refer to Figure 2 , Figure 2 is a schematic diagram of the suction nozzle. The suction nozzle uses austenitic stainless steel to prepare the suction nozzle body, and a magnetically adjustable area is formed at the end of the suction nozzle through cold deformation processing. Further, the strength of the magnetism of the suction nozzle can be controlled by synergistically regulating the process parameter combination of the geometric dimensions of the austenitic stainless steel suction nozzle, the cold working feed rate, and the cutting speed; Among them, magnetic components generally refer to electronic components that rely on magnetic materials or magnetic field characteristics to achieve functions, such as isolators, inductors, transformers, magnetic beads, magnetic sensors, etc.; weak magnetism means that the magnetism of the nozzle can use the magnetic suction force of the nozzle to offset the magnetic suction force of external iron on the magnetic component, and at the same time will not cause the position of the magnetic component to shift due to excessive magnetism generated by the nozzle; Austenitic stainless steel, such as 304 stainless steel, is non-magnetic itself, but cold deformation processing, such as stamping, stretching, etc., will induce partial transformation of austenite to martensite, thus generating magnetism; the size of the end of the nozzle directly affects the stress distribution during cold deformation processing, and thus affects the martensite transformation ratio; a high feed rate combined with a low cutting speed can increase the depth of plastic deformation, extend the strain aging time in the processing area, and promote martensite phase transformation; a low feed rate combined with a high cutting speed can weaken the work hardening effect, reduce the martensite conversion rate, but can reduce surface burrs.

[0020] Step 2: Make the magnetic suction force generated by the nozzle satisfy: nozzle magnetic suction force ≤ the gravity of the magnetic component; at the same time, make the resultant force of the magnetic suction force generated by the nozzle and the vacuum adsorption force satisfy: nozzle magnetic suction force + vacuum adsorption force ≥ the magnetic suction force of external iron on the magnetic component + the gravity of the magnetic component; The specific steps of Step 2 include: S101: Arbitrarily select an unselected nozzle, turn off the vacuum adsorption function of the nozzle, and gradually move the nozzle closer to the magnetic component. During the process of the nozzle moving to the target position, observe whether the position of the magnetic component shifts; if so, repeat Step S101; if not, execute Step S102; S102: Turn on the vacuum adsorption function of the nozzle, make the nozzle suck and transfer the magnetic component, and observe whether the nozzle stably sucks the magnetic component during the movement of the magnetic component; if so, use the current nozzle for subsequent sucking operations of the magnetic component; if not, repeat S101; Among them, the target position is the end position corresponding to the nozzle material taking route, that is, each material taking route corresponds to a magnetic component, and the magnetic component is usually set on the rotating loading table through a carrier; stable suction means that during the process of the nozzle sucking and transferring the magnetic component, the magnetic component will not have abnormal situations such as falling or shifting.

[0021] When the magnitude of the magnetic suction force of the nozzle is known, Step 2 can be replaced by: S201: Turn off the vacuum adsorption function of the nozzle, and gradually move the nozzle closer to the magnetic component. During the process of the nozzle moving to the target position, observe whether the position of the magnetic component shifts; if so, execute Step S202; if not, execute Step S203; S202: After replacing the nozzle with a smaller magnetic suction force, repeat S201; S203: Activate the vacuum adsorption function of the suction nozzle to make the suction nozzle pick up and transfer magnetic components. Observe whether the suction nozzle can stably pick up the magnetic components during the movement of the magnetic components. If so, use the current suction nozzle for subsequent suction operations of magnetic components. If not, determine whether step S202 has been executed. If step S202 has not been executed, replace the suction nozzle with a larger magnetic suction force and repeat S201. If step S202 has been executed, it is determined that there is no suction nozzle meeting the requirements currently.

[0022] Among them, when the magnitude of the magnetic suction force of the suction nozzle is known, steps S201 - S203 can be used as an alternative to steps S101 and S102. When the initially selected suction nozzle is the one with the largest suction force, if it is still impossible to stably pick up the magnetic components during step S203, it is directly determined that there is no suction nozzle meeting the requirements currently.

[0023] Step 3: Place the carrier on the loading platform, and the loading platform drives the carrier to move to the loading position. Among them, the loading position refers to the position suitable for the suction nozzle to pick up materials after the carrier moves with the loading platform. The suction nozzle is driven by a displacement mechanism to move, and the moving range of the displacement mechanism is limited. Therefore, when the carrier is in the loading position, it is at least necessary to ensure that the carrier is completely within the moving range of the displacement mechanism, so as to ensure that the suction nozzle can fully pick up materials from the carrier.

[0024] Step 4: The suction nozzle picks up the magnetic components on the carrier and moves the magnetic components to the target position. Among them, the target position is the chip accommodating position of the rotating mechanism. The rotating mechanism can fix the magnetic components and drive the magnetic components to rotate. The rotating mechanism fixes the magnetic components through vacuum adsorption.

[0025] Step 5: The rotating mechanism drives the magnetic components to rotate so that the mounting surface of the magnetic components faces downward. Step 6: Perform a mounting operation on the rotated magnetic components and determine whether it is the last magnetic component on the carrier. If not, repeat steps 3 - 6. If so, stop the operation. Stopping the operation means that all the magnetic components on the current carrier have been taken away, and stop taking materials from the current carrier, rather than indicating stopping all subsequent operations.

[0026] In summary, the present application provides a mounting method for magnetic components, which realizes the dynamic balance between the magnetic adsorption force of the suction nozzle and the magnetic interference force of the magnetic components, and ensures stable holding after picking up while avoiding premature adsorption without contact.

[0027] It should also be noted that in this specification, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising said element.

Claims

1. A method for mounting magnetic components, characterized in that, Mount magnetic components using a weakly magnetic nozzle, including the following steps: Step 1: Endow the nozzle with weak magnetism; Step 2: Make the magnetic suction force generated by the nozzle satisfy: nozzle magnetic suction force ≤ gravity of the magnetic component; at the same time, make the resultant force of the magnetic suction force and the vacuum adsorption force generated by the nozzle satisfy: nozzle magnetic suction force + vacuum adsorption force ≥ magnetic suction force of external iron on the magnetic component + gravity of the magnetic component.

2. The method for mounting a magnetic component according to claim 1, wherein, Step 2 includes: S101: Select an unselected nozzle at random, turn off the vacuum adsorption function of the nozzle, gradually move the nozzle closer to the magnetic component, and observe whether the position of the magnetic component shifts during the process of the nozzle moving to the target position; if so, repeat step S101; if not, execute step S102; S102: Turn on the vacuum adsorption function of the nozzle, make the nozzle suck and transfer the magnetic component, and observe whether the nozzle stably sucks the magnetic component during the movement of the magnetic component; if so, use the current nozzle for subsequent suction operations of magnetic components; if not, repeat S101.

3. The method for mounting the magnetic component according to claim 1, wherein When the magnitude of the magnetic suction force of the nozzle is known, step 2 includes: S201: Turn off the vacuum adsorption function of the nozzle, gradually move the nozzle closer to the magnetic component, and observe whether the position of the magnetic component shifts during the process of the nozzle moving to the target position; if so, execute step S202; if not, execute step S203; S202: After replacing the nozzle with a smaller magnetic suction force, repeat S201; S203: Turn on the vacuum adsorption function of the nozzle, make the nozzle suck and transfer the magnetic component, and observe whether the nozzle stably sucks the magnetic component during the movement of the magnetic component; if so, use the current nozzle for subsequent suction operations of magnetic components; if not, judge whether step S202 has been executed. If step S202 has not been executed, replace the nozzle with a larger magnetic suction force and repeat S201. If step S202 has been executed, it is determined that there is no nozzle meeting the requirements currently.

4. The mounting method of the magnetic component according to claim 1, wherein, It also includes: Step 3: Place the carrier on the loading platform, and the loading platform drives the carrier to move to the loading position; Step 4: The nozzle sucks the magnetic component on the carrier and moves the magnetic component to the target position.

5. The mounting method of the magnetic component according to claim 4, characterized in that, The target position is the chip accommodating position of the rotating mechanism, and the rotating mechanism can fix the magnetic component and drive the magnetic component to rotate.

6. The method for mounting a magnetic component according to claim 5, characterized in that, The rotating mechanism fixes the magnetic component through vacuum adsorption.

7. The method for mounting a magnetic component according to claim 5 or 6, characterized in that, It also includes: Step 5: The rotating mechanism drives the magnetic component to rotate so that the mounting surface of the magnetic component faces downwards.

8. The method for mounting a magnetic component according to claim 7, wherein, It also includes: Step 6: Perform a mounting operation on the rotated magnetic component, and judge whether it is the last magnetic component on the carrier; if not, repeat steps 3 - 6; if so, stop the operation.

9. The method for mounting a magnetic component according to claim 1, wherein Step 1 includes: Use austenitic stainless steel to prepare the nozzle body, and form a magnetism adjustable area at the end of the nozzle through cold deformation processing.

10. The method for mounting a magnetic component according to claim 9, wherein, Cooperatively regulate the process parameter combination of the geometric dimension of the nozzle, the cold working feed rate, and the cutting speed to control the strength of the nozzle magnetism.

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