Substrate post-processing device of biological chip and working method of substrate post-processing device

Abstract

The invention relates to the technical field of automatic manufacturing of biochips, in particular to a biochip substrate post-processing device and a working method thereof.The biochip substrate post-processing device comprises a top frame and a workbench, a three-axis module II is arranged on the top frame, and a soaking mechanism, a cleaning mechanism and a spin-drying mechanism are arranged on the workbench; the soaking mechanism comprises at least one soaking box, the cleaning mechanism comprises at least one cleaning tank, the spin-drying mechanism comprises at least one spin-drying machine, and the substrate is driven by the three-axis module II to be transferred in the soaking box, the cleaning tank and the spin-drying machine in sequence. A plurality of automatic process positions are arranged, and the substrate or other materials are moved among the process positions through the three-axis module, so that the manufacturing efficiency is greatly improved, the full automation of the substrate post-processing process is realized, and manual intervention is not needed.

Description

Technical Field

[0001] The present invention relates to the technical field of automated manufacturing of biochips, and particularly to a post-treatment device for the substrate of a biochip and its working method. Background Art

[0002] A biochip integrates specific biomolecules (such as proteins, DNA, etc.) on a carrier, and realizes high-throughput detection or function simulation through specific interactions between biomolecules. Such as protein chips, gene chips, etc. Taking a protein chip as an example, its working principle is to immobilize antibodies or protein probes on a carrier (i.e., a substrate), bind to the target protein in a sample, and detect signals through fluorescence or chemiluminescence, and can be applied to disease biomarker screening, drug target research, etc.

[0003] Taking a protein chip as an example, the main manufacturing processes mainly include surface treatment of the substrate (i.e., the carrier, also called the substrate sheet) (such as chemical modification of amino groups, carboxyl groups, etc.), protein molecule immobilization on the substrate using a PDMS layer (such as the covalent binding method), post-treatment of the substrate, and quality control, etc. Commonly used materials for the substrate include glass slides, silicon wafers, etc. Among them, the post-treatment process of the substrate usually refers to the blocking process of the substrate, aiming to prevent non-specific adsorption and improve the specificity during the detection of biochips. Currently, the commonly used blocking methods are mainly protein blocking method, polymer blocking method, and sugar molecule blocking method. No matter which method, the substrate needs to be soaked, cleaned, and spun dry. In addition, the post-treatment process of the substrate can also integrate the previous film peeling (peeling the PDMS layer from the substrate, and the PDMS layer is discarded after the biomolecules are immobilized on the substrate) and the subsequent fence bonding together. Currently, the post-treatment of the substrate is mostly manual operation. Due to the high cleanliness requirements of the operation environment, the staff needs to wear protective clothing for a long time to work, which is time-consuming and laborious, and the manufacturing efficiency is extremely low, and it cannot meet the market demand of biochips in time. Summary of the Invention

[0004] In order to solve the above problems, the present invention provides a post-treatment device for the substrate of a biochip, which can automatically complete the post-treatment process of the substrate without manual intervention, greatly improving the manufacturing efficiency. The technical solution adopted by the present invention is as follows: A post-treatment device for the substrate of a biochip, comprising a top frame and a workbench. A three-axis module II is provided on the top frame, and a soaking mechanism, a cleaning mechanism, and a spinning mechanism are provided on the workbench. The soaking mechanism includes at least one soaking tank, the cleaning mechanism includes at least one cleaning tank, and the spinning mechanism includes at least one spin dryer. The substrate is driven by the three-axis module II to be sequentially transported in the soaking tank, the cleaning tank, and the spin dryer.

[0005] The above-mentioned substrate post-processing device is further provided with a film peeling mechanism on the workbench, and the film peeling mechanism includes a clamping jaw assembly III for peeling off the film and a placement table for placing the film. The bottom of the placement table is configured with a negative pressure assembly for adsorbing or releasing the film. The workbench is provided with a waste port, and the clamping jaw assembly III can slide vertically on the workbench to peel off the film and slide horizontally to the waste port; the top frame is provided with a three-axis module I which can transfer the substrate on the placement table to the immersion box.

[0006] In the above substrate post-processing device, the workbench is also provided with a material table for storing membranes, and the three-axis module I is used to transfer the membranes on the material table to the placement table.

[0007] The above-mentioned substrate post-processing device, the workbench is also provided with a bonding mechanism for bonding the fence and the substrate to form a finished chip, the bonding mechanism includes a clamp seat, a suction cup assembly Ⅶ, a visual camera and a three-axis slide, the clamp seat and the three-axis slide are respectively installed on the workbench, the fence and the substrate are placed on the clamp seat, the suction cup assembly Ⅶ and the visual camera are driven by the three-axis slide to approach the clamp seat for bonding or move away, the suction cup assembly Ⅶ is used to adsorb and move the fence; the top frame is provided with a three-axis module III, which can transfer the substrate from the spin dryer to the clamp seat or move the finished chip out of the clamp seat.

[0008] The above-mentioned substrate post-processing device, the clamping seat includes an L-shaped card plate and two retractable top blocks, the substrate is clamped in the card plate and tightened or loosened by the two top blocks, the fence is placed outside the card plate and is calibrated by a visual camera and then adsorbed by a suction cup assembly Ⅶ for bonding.

[0009] The above-mentioned substrate post-processing device, the workbench is also provided with a fence station for storing fence racks, the fence station includes a storage area, a working area and a finishing area, and the fence racks at the fence station are transported by the three-axis module III.

[0010] The above-mentioned substrate post-processing device also has a transfer guide rail assembly II and a feeding mechanism on the workbench, and a horizontally sliding transfer table II for placing finished chips is installed on the transfer guide rail assembly II. The feeding mechanism includes a feeding guide rail assembly and a rotating clamp assembly, and the rotating clamp assembly can slide horizontally and vertically on the feeding guide rail assembly; the finished chip is first transferred from the clamping seat to the transfer table II by the suction cup assembly V and then clamped and removed by the rotating clamp assembly.

[0011] The above-mentioned substrate post-processing device also has a transfer guide rail assembly I on the workbench, and a horizontally slidable transfer platform I is installed on the transfer guide rail assembly I. The dried substrate is first placed on the transfer platform I by the three-axis module II and then transferred to the clamping seat by the three-axis module III.

[0012] The above-mentioned substrate post-processing device, the soaking mechanism further includes an inner guide rail, an outer guide rail, a synchronous belt assembly and a sliding seat. The soaking tank is provided with two soaking tanks, namely an upper soaking tank and a lower soaking tank. The lower soaking tank is slidably installed on the inner guide rail, the sliding seat is slidably installed on the outer guide rail, the upper soaking tank is fixedly installed on the sliding seat, the lower soaking tank is located below the sliding seat, and the lower soaking tank and the sliding seat are respectively connected to both sides of the synchronous belt of the synchronous belt assembly to slide alternately.

[0013] The present invention also provides a working method for the above-mentioned substrate post-processing device, and the technical solution is as follows: For the working method of the above-mentioned substrate post-processing device of the biochip, a suction cup assembly I and a suction cup assembly II are provided on the three-axis module I, a jaw assembly I, a suction cup assembly III and a suction cup assembly IV are provided on the three-axis module II, and a jaw assembly II and a suction cup assembly V are provided on the three-axis module III; The working method includes the following steps: S1) A plurality of wafers are placed on the loading table, and a plurality of fence racks are in the storage area of the fence station. The jaw assembly II clamps a fence rack and places it in the working area of the fence station. The suction cup assembly I adsorbs and transports the wafers on the loading table to the placement table of the film peeling mechanism; S2) The negative pressure assembly on the placement table adsorbs the substrate of the wafer. The jaw assembly III peels off the PDMS layer of the wafer and discards it. The substrate of the wafer is adsorbed and transported by the suction cup assembly II into the soaking tank of the soaking mechanism; S3) After soaking, the jaw assembly I clamps and transports the substrate in the soaking tank to the cleaning tank, and several cleaning liquids are sequentially introduced into the cleaning tank to wash the substrate; S4) After cleaning, the suction cup assembly III adsorbs and transports the substrate to the spin dryer; S5) The spin dryer centrifugally dries the substrate. The suction cup assembly IV adsorbs and transports the substrate to the transfer guide rail assembly I or the chuck of the bonding mechanism; the substrate on the transfer guide rail assembly I is transported to the chuck of the bonding mechanism by the suction cup assembly V; S6) The suction cup assembly V adsorbs and transports the fence on the fence rack to the chuck of the bonding mechanism. The vision camera and the suction cup assembly VII cooperate to identify and correct the fence to an accurate position. The suction cup assembly VII adsorbs the fence to the substrate for bonding to obtain a finished chip; S7) The suction cup assembly V adsorbs and transports the finished chip to the transfer guide rail assembly II, and the feeding mechanism clamps the finished chip and removes it.

[0014] The beneficial effects of the present invention are: Firstly, multiple automated process positions are set, and the substrate or other materials are moved between the process positions by the three-axis module, greatly improving the manufacturing efficiency and realizing the complete automation of the substrate post-processing process without manual intervention.

[0015] Secondly, suction cup assemblies and clamping claw assemblies are set on the three-axis module corresponding to different process positions, and the transfer of substrates or other materials is realized in conjunction with the mechanisms used in the process, which is convenient for automatic control, greatly reduces the probability of damage to the substrate during transfer, and improves the qualified rate of finished chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 and Figure 2 It is a schematic diagram of the general assembly structure of an embodiment of the present invention; Figure 3 A schematic top view of the general assembly structure of an embodiment of the present invention; Figure 4 Schematic diagram of the Z-axis structure of the three-axis module I according to an embodiment of the present invention; Figure 5 Schematic diagram of the Z-axis structure of the three-axis module II according to an embodiment of the present invention; Figure 6 Schematic diagram of the Z-axis structure of the three-axis module III of an embodiment of the present invention; Figure 7 and Figure 8 It is a schematic diagram of the structure of the film peeling mechanism according to an embodiment of the present invention; Figure 9 It is a schematic diagram of the structures of the soaking mechanism, the cleaning mechanism and the drying mechanism of an embodiment of the present invention; Figure 10 This is a schematic diagram of the structure of the soaking mechanism according to an embodiment of the present invention; Figure 11 and Figure 12 A schematic diagram of the cleaning tank structure according to an embodiment of the present invention; Figure 13 A schematic diagram of the structure of a drying machine according to an embodiment of the present invention; Figure 14 This is a schematic diagram of the structure of a drying tray according to an embodiment of the present invention; Figure 15 It is a schematic diagram of the structure of the fence station and the bonding mechanism of an embodiment of the present invention; Figure 16 and Figure 17 It is a schematic diagram of the bonding mechanism structure of an embodiment of the present invention; Figure 18 Schematic diagram of the clamping seat structure according to an embodiment of the present invention.

[0017] In the figure: 1 is a material table; 2 is a film peeling mechanism, 21 is a mounting seat, 22 is a film peeling guide rail assembly, 23 is a clamping claw assembly III, 24 is a placement table, and 25 is a waste opening; 3 is a soaking mechanism, 31 is an upper soaking box, 32 is a lower soaking box, 33 is an inner guide rail, 34 is an outer guide rail, 35 is a synchronous belt assembly, and 36 is a slide seat; 4 is the cleaning tank, 41 is the liquid inlet A, 42 is the liquid spraying port, 43 is the liquid discharge port, and 44 is the support block; 5 is the spin dryer, 51 is the casing, 52 is the rotating plate, 53 is the baffle plate, and 54 is the liquid discharge tank; 6 is the transfer guide rail assembly I, and 61 is the transfer table I; 7 is the bonding mechanism, 71 is the clamping seat, 72 is the suction cup assembly VII, 73 is the vision camera, 74 is the three-axis slide table, 711 is the clamping plate, and 712 is the top block; 8 is the transfer guide rail assembly II, and 81 is the transfer table II; 9 is the feeding mechanism, 91 is the feeding guide rail assembly, and 92 is the rotating gripper assembly; 11 is the suction cup assembly I, 12 is the suction cup assembly II, 13 is the gripper assembly I, 14 is the suction cup assembly III, 15 is the suction cup assembly IV, 16 is the gripper assembly II, 17 is the suction cup assembly V, and 18 is the suction cup assembly VI; 10 is the substrate, 20 is the PDMS layer, 30 is the fence, and 40 is the fence frame. Specific embodiments

[0018] The technical solutions of the present invention will be described in detail below with reference to the accompanying drawings. The following embodiments are all illustrative and are intended to provide specific descriptions for the present application. Unless otherwise specified, various slide table assemblies, guide rail assemblies, lifting assemblies, frame profiles, air pumps, electrical control systems, etc. required to implement the functions in this embodiment are all existing technologies and commercially available conventional products in the art. For example, a guide rail assembly generally includes a guide rail, transmission elements (such as synchronous belts, gears, etc.), drive components (such as motors, etc.), and electrical components. Terms such as "movable" and "slidable" generally indicate the configuration of a guide rail assembly or a lifting assembly, and the travel limit of the movement or sliding can be configured with conventional limit switches or sensors. Such conventional technologies will not be elaborated in this embodiment, and the technical terms used have the same meanings and functions as those commonly understood by those skilled in the technical field to which the present application belongs. It should be noted that the terms used are only for describing specific embodiments and are not intended to limit the present application.

[0019] This embodiment is a post-processing device for the substrate of a biochip, including a top frame and a workbench. Refer to Figures 1 to 3, the top frame is provided with a three-axis module I, a three-axis module II and a three-axis module III, the workbench is provided with a material table 1, a film peeling mechanism 2, a closing component, a fence station for storing a fence frame 40, a bonding mechanism 7, a transfer guide assembly II8 and a feeding mechanism 9, wherein the closing assembly refers to a mechanism for performing a sealing process on the substrate, including a soaking mechanism 3, a cleaning mechanism, and a drying mechanism. Furthermore, in order to cooperate with the three-axis module II and the three-axis module III and facilitate the transfer of the substrate 10, a transfer guide assembly I6 is also provided on the workbench. The three-axis module I, the three-axis module II and the three-axis module III are used to transfer materials (such as diaphragms, substrates 10, fences 30, etc.) between various process mechanisms. The process beat and mobile positioning control of each three-axis module are set according to the position of the process mechanism, etc., and conventional control principles are adopted. Those skilled in the art can realize corresponding control in combination with conventional technologies based on the description of this embodiment, and there are no technical obstacles.

[0020] Specifically, refer to Figure 4 The three-axis module I is provided with a suction cup assembly I11 and a suction cup assembly II12, that is, the suction cup assembly I11 and the suction cup assembly II12 are each provided with a Z-axis system (i.e., they move vertically respectively) and share the X-axis system and Y-axis system of the three-axis module I, which can not only meet the transfer function and save space, but also facilitate control and ensure process rhythm and efficiency. Figure 5 and Figure 6 The three-axis module II is provided with a clamping claw assembly I 13, a suction cup assembly III 14 and a suction cup assembly IV 15, and the three-axis module III is provided with a clamping claw assembly II 16 and a suction cup assembly V 17. The functions of each suction cup assembly and the clamping claw assembly will be specifically described below in conjunction with the mechanism of each process. A diaphragm air pump can be selected as the power in the suction cup assembly, and a clamping cylinder can be selected as the actuator in the clamping claw assembly.

[0021] This substrate post-processing device is used to carry out the process after antibody extraction on the biochip. For the antibody extraction process and mechanism, reference can be made to the antibody extraction equipment in Chinese patent application CN116693661A. The "biochip carrier" in the patent application can be transferred and placed on the material table 1 after the antibody extraction process is completed. Several membranes are placed on the "biochip carrier". The "membrane" described in this embodiment refers to a product structure in which the upper layer is the PDMS layer 20 + the lower layer is the substrate 10. The purpose of antibody extraction is to fix the protein molecules to the substrate along the flow channel of the PDMS layer 20 through chemical coupling. After the antibody extraction is completed, the PDMS layer 20 is discarded. The function of the membrane peeling component 2 is to peel off and separate the PDMS layer 20 from the substrate 10, discard the PDMS layer 20 and retain the substrate 10.

[0022] Specifically, refer to Figure 1 , Figure 7 and Figure 8, the film peeling mechanism 2 includes a mounting seat 21, a film peeling rail assembly 22, a clamping claw assembly III 23 and a placement table 24 for placing the film. The bottom of the placement table 24 is configured with a negative pressure assembly for adsorbing or releasing the substrate 10, and the suction cup assembly I 11 is used to transfer the film on the material table 1 to the placement table 24. It should be explained that due to the material properties, the PDMS layer 20 is similar to a soft rubber material and has a large electrostatic adsorption force, especially after the body extraction process, it has a greater adsorption force with the substrate 10, so the suction cup assembly I 11 can completely adsorb the film without causing the PDMS layer 20 to separate from the substrate 10. The negative pressure assembly can use a commercially available vacuum generator assembly, which has uniform and stable adsorption and will not damage the substrate 10. For more detailed structure and function of the film peeling mechanism, please refer to patent application 2025207177006.

[0023] The film peeling rail assembly 22 is installed on a workbench, and the workbench is provided with a waste opening 25. The clamping jaw assembly III 23 is vertically slidably installed on the mounting seat 21. Figure 8 The clamping jaw assembly III 23 is provided with a clamping jaw for peeling and clamping the PDMS layer 20, and the mounting seat 21 is horizontally slidably mounted on the film peeling rail assembly 22 to transfer the PDMS layer 20 to the waste port 25 and discard it. The suction cup assembly II 12 is used to absorb and transfer the substrate 10 on the placement table 24 to the soaking mechanism 3. There is a margin on both sides of the substrate 10, that is, there are no biological molecules, so the suction head of the suction cup assembly II 12 is set to absorb both sides of the substrate 10 without destroying the biological molecules already fixed on the substrate 10. The horizontal sliding of the mounting seat 21 and the vertical sliding of the clamping jaw assembly III 23 can be controlled by conventional photoelectric limiters respectively.

[0024] refer to Figure 9 and Figure 10 , the soaking mechanism 3 includes an upper soaking box 31, a lower soaking box 32, an inner guide rail 33, an outer guide rail 34, a synchronous belt assembly 35 and a slide 36. The upper soaking box 31 and the lower soaking box 32 are each provided with twelve soaking tanks, which contain soaking liquid, and the soaking liquid can be selected according to the substrate sealing process used. The lower soaking box 32 is slidably mounted on the inner guide rail 33, and the slide 36 is slidably mounted on the outer guide rail 34. The upper soaking box 31 is fixed on the slide 36, and the lower soaking box 32 is located below the slide 36. Arranging two soaking boxes in this way improves the efficiency of the soaking process and can cooperate with the subsequent drying and cleaning process rhythm. The lower soaking box 32 and the slide 36 are respectively connected to the two sides of the synchronous belt of the synchronous belt assembly 35 for staggered sliding, refer to Figure 10 , that is, the side of the lower soaking box 32 is connected to the inner synchronous belt, and the side of the slide 36 is connected to the outer synchronous belt to achieve staggered sliding. The sliding limit of the upper soaking box 31 and the lower soaking box 32 can be controlled by a conventional photoelectric limiter.

[0025] refer to Figure 9 and Figure 11 , Figure 12 In this embodiment, the cleaning mechanism includes three cleaning tanks 4, which can match the process rhythm of the soaking mechanism 3 and ensure efficiency. The clamping claw assembly Ⅰ13 is used to clamp the substrates 10 in the upper soaking box 31 and the lower soaking box 32 to the cleaning tank 4 one by one. In order to facilitate the clamping of the clamping claw assembly Ⅰ13, grooves for accommodating the clamping claws of the clamping claw assembly Ⅰ13 are provided on both sides of the soaking tank and the cleaning tank 4.

[0026] The cleaning tank 4 is provided with a liquid inlet, a liquid spray port 42 and a liquid discharge port 43. Generally, a plurality of cleaning liquids are required for flushing when the substrate 10 is cleaned, so a plurality of liquid inlets can be provided accordingly. In this embodiment, liquid inlets are provided on the left and right sides (the right side is the liquid inlet A41) and the bottom of the cleaning tank 4, respectively, that is, three liquid inlets can be passed into three kinds of cleaning liquids, and these three liquid inlets can share the liquid spray port 42. A one-way valve can be provided at each liquid inlet or on its corresponding pipeline to avoid backflow. The liquid discharge port 43 is provided on the bottom surface of the cleaning tank 4 for discharging waste liquid. Several support blocks 44 can also be provided on the bottom surface of the cleaning tank 4 for supporting the substrate 10 to ensure that the bottom surface of the substrate 10 can also be flushed. For the detailed structure and function of the cleaning mechanism, reference can be made to patent application 2025207251930.

[0027] refer to Figure 1 , Figure 9 and Figure 13 , Figure 14 The spin-drying mechanism is provided with three centrifugal spin-dryers 5 to match the process rhythm of the cleaning mechanism. The suction cup assembly III14 is used to transfer the substrate 10 in the cleaning tank 4 to the spin-dryer 5. The spin-dryer 5 includes a housing 51, a rotating plate 52 and a baffle 53, and the baffle 53 is provided with an I-shaped opening. The left side of the rotating plate 52 is used to place the substrate 10, and the right side is provided with a balancing sheet for balancing the substrate 10, so that the rotating plate 52 is more stable when rotating, avoiding the substrate 10 from shaking and being damaged, and improving the strength and efficiency of spin-drying. The suction cup assembly III14 absorbs the substrate 10 from the middle position of the baffle 53 and moves it to the left side of the rotating plate 52. The rotating plate 52 is provided with a plurality of drainage grooves 54, which are used to discharge excess waste liquid during spin-drying. The rotating plate 52 is driven by a stepping motor and controlled by an encoder (conventional technology), and the rotating plate 52 is ensured to stay in a fixed position before and after each spin-drying, so as to facilitate the adsorption action of the suction cup assembly III14 and the suction cup assembly IV15. For the detailed structure and function of the spin dryer 5, reference may be made to patent application 2025207258821.

[0028] like Figure 15As shown in the figure, the fence workstation includes a storage area, a working area, and a completion area. The gripper assembly II 16 is used to transfer the fence rack 40 between the storage area, the working area, and the completion area. The storage area is used to stack the fence racks 40, and the fence 30 to be used is placed inside the fence rack 40 here. The gripper assembly II 16 transfers the fences 30 in the storage area to the working area one by one. After the fences 30 on each fence rack 40 are used up in the working area, the gripper assembly II 16 transfers the fence to the completion area for stacking.

[0029] In this embodiment, since the fence workstation is arranged between the drying mechanism and the bonding mechanism 7, the distance between the two is relatively large. Refer to Figure 15 , in order to facilitate the transfer of the substrate 10, a transfer guide rail assembly I 6 is arranged on the workbench. A transfer table 61 with three workstations is installed on the slider of the transfer guide rail assembly I 6. The suction cup assembly IV 15 is used to adsorb the dried substrate 10 and transfer it from the dryer 5 to the transfer guide rail assembly I 6. After the transfer table 61 moves into place, the substrate 10 is adsorbed and transferred to the bonding mechanism 7 by the suction cup assembly V 17. If the fence workstation is arranged on one side, that is, to ensure that the distance between the drying mechanism and the bonding mechanism 7 is relatively small, the transfer guide rail assembly I 6 may not be set, and the suction cup assembly IV 15 can directly transfer the dried substrate 10 to the bonding mechanism 7.

[0030] Refer to Figures 15 to 17 , the bonding mechanism 7 is used to bond the fence 30 and the substrate 10 into a finished chip. The bonding mechanism 7 includes a clamping seat 71, a suction cup assembly VII 72, a vision camera 73, and a three-axis slide 74. The clamping seat 71 and the three-axis slide 74 are respectively installed on the workbench. The fence 30 and the substrate 10 are both placed on the clamping seat 71. The suction cup assembly VII 72 and the vision camera 73 are driven by the three-axis slide 74 to approach or move away from the clamping seat 71 for bonding. The suction cup assembly VII 72 is used to adsorb and move the fence 30; a three-axis module III is arranged on the top frame, and a suction cup assembly V 17 is arranged on the three-axis module III for transferring the substrate 10 from the dryer 5 to the clamping seat 71 or removing the finished chip from the clamping seat 71.

[0031] Specifically, refer to Figure 18 , the clamping seat 71 includes an L-shaped clamping plate 711 and two telescopic top blocks 712. The substrate 10 is clamped inside the clamping plate 711 and is tightened or loosened by the two top blocks 712. The top blocks 712 can be driven by air cylinders. The fence 30 is placed outside the clamping plate 711 and is adsorbed by the suction cup assembly VII 72 for bonding after being corrected by the vision camera 73.

[0032] Refer to Figures 15 to 17The transfer rail assembly II8 is provided with a horizontally sliding transfer table II81 for placing finished chips. The feeding mechanism 9 includes a feeding rail assembly 91 and a rotating jaw assembly 92. The rotating jaw assembly 92 is installed on the feeding rail assembly 91 for horizontal and vertical sliding. Specifically, a rotating member is provided on the rotating jaw assembly 92, and a jaw is provided at the lower end of the rotating member. A vertical guide member is installed on the slider of the feeding rail assembly 91, and the rotating member is slidably installed on the guide member to realize horizontal and vertical sliding of the rotating jaw assembly 92. The finished chip is first transferred from the clamping seat 71 to the transfer table II81 by the suction cup assembly V17, and then clamped by the rotating jaw assembly 92 and moved out of the device to the next process equipment, such as a packaging machine.

[0033] refer to Figures 1 to 3 The working method of the above-mentioned biochip substrate post-processing device comprises the following steps: S1) A plurality of membranes are placed on the material table 1, and a plurality of stacked fence racks 40 are placed in the storage area of the fence station. The clamping claw assembly II 16 clamps a fence rack 40 and places it in the working area of the fence station. The suction cup assembly I 11 absorbs and transfers the membrane on the material table 1 to the placement table 24 of the film peeling mechanism 2; S2) the negative pressure assembly under the placement table 24 adsorbs the membrane, the clamping claw assembly III 23 moves to peel off the PDMS layer 20 of the membrane, and the film peeling guide assembly 22 drives the clamping claw assembly III 23 to the waste port 25 to discard the PDMS layer 20, and then the substrate 10 is adsorbed and transported to the immersion box of the immersion mechanism 3 by the suction cup assembly II 12; S3) The upper immersion box 31 and the lower immersion box 32 slide alternately into place, and the control system causes the suction cup assembly II 12 to place the substrates 10 one by one into the immersion tank; after soaking for a certain period of time, the clamping claw assembly I 13 clamps the substrates 10 one by one and transfers them to the cleaning tank 4, and several cleaning liquids are sequentially introduced into the cleaning tank 4 to rinse the substrates 10, and generally pure water is introduced for the last cleaning; S4) After the cleaning is completed, the suction cup assembly III 14 absorbs and transports the substrate 10 to the spin dryer 5; S5) the spin dryer 5 is started to centrifugally spin dry the substrate 10, and the suction cup assembly IV15 absorbs and transfers the dried substrate 10 to the transfer platform I61 of the transfer rail assembly I6 (in other embodiments, it can also be directly absorbed and transferred to the clamping seat 71 of the bonding mechanism 7), and then the suction cup assembly V17 absorbs and transfers the substrate 10 on the transfer rail assembly I6 to the bonding mechanism 7; S6) Combination Figure 18, the suction cup assembly Ⅴ17 adsorbs and transports the fence 30 on the fence frame 40 to the chuck 71 of the bonding mechanism 7, and the vision camera 73 cooperates with the suction cup assembly Ⅶ72 to identify and correct the fence 30 to an accurate position (for the technical solution of vision recognition adjustment, refer to the patent application 202510299673X, an automatic fence correction method based on image processing). The suction cup assembly Ⅶ72 adsorbs the fence 30 to the substrate 10 for bonding to obtain a finished chip; S7) The suction cup assembly Ⅴ17 adsorbs and transports the finished chip to the transfer table Ⅱ81 of the transfer guide rail assembly Ⅱ8, and the feeding mechanism 9 clamps the finished chip and moves it to the next process equipment, such as a packaging machine.

[0034] The above is only the preferred embodiment of the present application. It should be noted that for those of ordinary skill in the art of the present technology, without departing from the principle of the present application, several changes or improvements can still be made, and these changes or improvements should also be regarded as the protection scope of the present application.

Claims

1. A post-processing device for the substrate of a biochip, characterized in that: The invention comprises a top frame and a workbench, wherein a three-axis module II is arranged on the top frame, and a soaking mechanism (3), a cleaning mechanism and a spin-drying mechanism are arranged on the workbench, wherein the soaking mechanism (3) comprises at least one soaking box, the cleaning mechanism comprises at least one cleaning tank (4), and the spin-drying mechanism comprises at least one spin-drying machine (5), and the base (10) is driven by the three-axis module II to be transported in sequence in the soaking box, the cleaning tank (4) and the spin-drying machine (5).

2. The post-treatment device for the substrate of the biochip according to claim 1, wherein: The workbench is also provided with a film peeling mechanism (2), the film peeling mechanism (2) comprising a clamping jaw assembly III (23) for peeling the film and a placement table (24) for placing the film, the bottom of the placement table (24) is provided with a negative pressure assembly for adsorbing or releasing the film, the workbench is provided with a waste opening (25), the clamping jaw assembly III (23) can slide vertically on the workbench to peel the film and slide horizontally to the waste opening (25); the top frame is provided with a three-axis module I which can transfer the substrate (10) on the placement table (24) to the soaking box.

3. The post-treatment device for the substrate of the biochip according to claim 2, wherein: The workbench is also provided with a material table (1) for storing diaphragms, and the three-axis module I is used to transfer the diaphragms on the material table (1) to the placement table (24).

4. The post-processing device for the substrate of the biochip according to claim 1, wherein: The workbench is also provided with a bonding mechanism (7) for bonding the fence (30) to the substrate (10) to form a finished chip. The bonding mechanism (7) comprises a clamping seat (71), a suction cup assembly VII (72), a visual camera (73) and a three-axis slide (74). The clamping seat (71) and the three-axis slide (74) are respectively installed on the workbench. The fence (30) and the substrate (10) are both placed on the clamping seat (71). The suction cup assembly VII (72) and the visual camera (73) are driven by the three-axis slide (74) to approach the clamping seat (71) for bonding or move away. The suction cup assembly VII (72) is used to absorb and move the fence (30). The top frame is provided with a three-axis module III, which can transfer the substrate (10) from the spin dryer (5) to the clamping seat (71) or remove the finished chip from the clamping seat (71).

5. The post-processing device for the substrate of the biochip according to claim 4, wherein: The clamping seat (71) comprises an L-shaped clamping plate (711) and two retractable top blocks (712); the base (10) is clamped in the clamping plate (711) and tightened or loosened by the two top blocks (712); the fence (30) is placed outside the clamping plate (711) and is calibrated by a visual camera (73) and then adsorbed by a suction cup assembly VII (72) for bonding.

6. The post-treatment device for the substrate of the biochip according to claim 4, characterized in that: The workbench is also provided with a fence station for storing fence frames (40), the fence station comprising a storage area, a work area and a completion area, and the fence frames (40) at the fence station are transferred by the three-axis module III.

7. The post-processing device for the substrate of the biochip according to claim 4, characterized in that: The workbench is also provided with a transfer rail assembly II (8) and a feeding mechanism (9). The transfer rail assembly II (8) is provided with a horizontally sliding transfer table II (81) for placing finished chips. The feeding mechanism (9) comprises a feeding rail assembly (91) and a rotating clamp assembly (92). The rotating clamp assembly (92) can slide horizontally and vertically on the feeding rail assembly (91). The finished chips are first transferred from the clamping seat (71) to the transfer table II (81) by the suction cup assembly V (17) and then clamped and removed by the rotating clamp assembly (92).

8. The post-treatment device for the substrate of the biochip according to claim 4, characterized in that: The workbench is also provided with a transfer rail assembly I (6), on which a horizontally slidable transfer platform I (61) is mounted. The dried substrate (10) is first placed on the transfer platform I (61) by the three-axis module II and then transferred to the clamping seat (71) by the three-axis module III.

9. The post-treatment device for the substrate of the biochip according to claim 1, characterized in that: The soaking mechanism (3) further comprises an inner guide rail (33), an outer guide rail (34), a synchronous belt assembly (35) and a slide seat (36); the soaking box is provided with two, namely an upper soaking box (31) and a lower soaking box (32); the lower soaking box (32) is slidably mounted on the inner guide rail (33); the slide seat (36) is slidably mounted on the outer guide rail (34); the upper soaking box (31) is fixedly mounted on the slide seat (36); the lower soaking box (32) is located below the slide seat (36); the lower soaking box (32) and the slide seat (36) are respectively connected to two sides of the synchronous belt of the synchronous belt assembly (35) to slide alternately.

10. A working method of the substrate post-processing device of a biochip according to any one of claims 1 to 9, characterized in that: The three-axis module I is provided with a suction cup assembly I (11) and a suction cup assembly II (12); the three-axis module II is provided with a clamping claw assembly I (13), a suction cup assembly III (14) and a suction cup assembly IV (15); the three-axis module III is provided with a clamping claw assembly II (16) and a suction cup assembly V (17); The working method includes the following steps: S1) A plurality of membranes are placed on the material table (1), a plurality of fence racks (40) are provided in the storage area of the fence station, the clamping claw assembly II (16) clamps a fence rack (40) and places it in the working area of the fence station, and the suction cup assembly I (11) absorbs and transfers the membrane on the material table (1) to the placement table (24) of the film peeling mechanism (2); S2) the negative pressure component on the placement table (24) adsorbs the base (10) of the membrane, the clamping claw component III (23) peels off the PDMS layer of the membrane and discards it, and the base (10) of the membrane is adsorbed and transported to the immersion box of the immersion mechanism (3) by the suction cup component II (12); S3) After the soaking is completed, the clamping claw assembly I (13) clamps the substrate (10) in the soaking box and transfers it to the cleaning tank (4), and several cleaning liquids are sequentially introduced into the cleaning tank (4) to rinse the substrate (10); S4) After the cleaning is completed, the suction cup assembly III (14) absorbs and transfers the substrate (10) to the spin dryer (5); S5) The spin dryer (5) centrifugally dries the substrate (10), and the suction cup assembly IV (15) adsorbs and transports the substrate (10) to the transfer guide rail assembly I (6) or the chuck (71) of the bonding mechanism (7); the substrate (10) on the transfer guide rail assembly I (6) is transported to the chuck (71) of the bonding mechanism (7) by the suction cup assembly V (17). S6) The suction cup assembly V (17) adsorbs and transports the fence (30) on the fence frame (40) to the chuck (71) of the bonding mechanism (7), and the vision camera (73) cooperates with the suction cup assembly VII (72) to identify and correct the fence (30) to the precise position, and the suction cup assembly VII (72) adsorbs the fence (30) to the substrate (10) for bonding to obtain the finished chip. S7) The suction cup assembly V (17) adsorbs and transports the finished chip to the transfer guide rail assembly II (8), and the feeding mechanism (9) holds and removes the finished chip.

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