Welding device and solder paste

Abstract

The invention discloses a welding device and solder paste, and relates to the technical field of welding, the welding device comprises a processing unit, an image acquisition unit, a patch unit, a solder paste smearing unit and a heating unit; the image acquisition unit is fixed on the surface of the patch unit; the surface mounting unit grabs the electronic device; the image acquisition unit is used for acquiring depth images of a bonding pad of a circuit board and an electronic device; the processing unit controls the patch unit to move the position of the electronic device according to the depth image; the solder paste smearing unit smears solder paste to the bonding pad; the surface mounting unit attaches the electronic device to the bonding pad coated with the solder paste; the heating unit heats the solder paste between the bonding pad and the electronic device, so that the electronic device is welded to the bonding pad. The position of the electronic device moved by the patch unit is controlled according to the depth image, so that the electronic device is accurately aligned with the bonding pad, the pins of the device are accurately welded with the bonding pad after subsequent solder paste smearing and welding, and the yield of the device is increased.

Description

Technical Field

[0001] This application relates to the field of welding technology, and particularly to a welding device and solder paste. Background Art

[0002] In the process of printed circuit board assembly, surface mount welding is one of the core processes. This process has extremely high requirements for the positioning accuracy of component mounting, component size control, and the quality and printing accuracy of solder paste.

[0003] With the development of the miniaturization trend in the manufacturing industry and the widespread application of micro-devices such as 0201 and 01005, even a slight deviation during the welding process of the devices will result in a decrease in the yield and quality of the devices, and even the problem of being unusable. Summary of the Invention

[0004] This application provides a welding device and solder paste to at least solve the problem in the related art that even a slight deviation during the welding process will result in a decrease in the yield and quality of the devices, and even the problem of being unusable.

[0005] This application provides a welding device, including: a processing unit, an image acquisition unit, a chip mounting unit, a solder paste application unit, and a heating unit; the image acquisition unit is fixed on the surface of the chip mounting unit and faces the direction of the electronic device grabbed by the chip mounting unit; the chip mounting unit grabs the electronic device; the image acquisition unit is used to acquire the depth images of the pads on the circuit board and the electronic device; the processing unit controls the position of the electronic device moved by the chip mounting unit according to the depth images; the solder paste application unit applies solder paste to the pads; the chip mounting unit attaches the electronic device to the pads coated with solder paste; the heating unit heats the solder paste between the pads and the electronic device to solder the electronic device to the pads.

[0006] This application also provides a solder paste applied to the welding device in the first aspect, including: a tin-silver-copper solder, titanium nitride nanowires doped in the tin-silver-copper solder, and graphene quantum dots doped in the tin-silver-copper solder, wherein the weight of the titanium nitride nanowires accounts for 0.6% to 1.2% of the weight of the solder paste, and the weight of the graphene quantum dots accounts for 0.1% to 0.4% of the weight of the solder paste.

[0007] The depth images of the electronic device and the pads are acquired by the image acquisition unit fixed on the surface of the chip mounting unit in this application, and the position of the electronic device moved by the chip mounting unit is controlled according to the depth images, so that the electronic device and the pads are accurately aligned. Thus, after subsequent application of solder paste and welding, the pins of the device are accurately soldered to the pads, increasing the yield and quality of the device after welding. Description of the Drawings

[0008] To more clearly illustrate the embodiments of the present application, the accompanying drawings required for the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0009] Figure 1 Structural schematic of the welding device provided by the embodiment of the present application Figure 1 ;

[0010] Figure 2 Structural schematic diagram of the chip mounting unit provided by the embodiment of the present application;

[0011] Figure 3 Structural schematic of the welding device provided by the embodiment of the present application Figure 2 ;

[0012] Figure 4 Structural schematic of the heating unit provided by the embodiment of the present application Figure 1 ;

[0013] Figure 5 Structural schematic of the heating unit provided by the embodiment of the present application Figure 2 ;

[0014] Figure 6 Structural schematic of the heating unit provided by the embodiment of the present application Figure 3 .

[0015] Among them, the above accompanying drawings include the following reference numerals:

[0016] 100 - Welding device;

[0017] 101 - Processing unit;

[0018] 102 - Image acquisition unit;

[0019] 103 - Chip mounting unit;

[0020] 104 - Solder paste application unit;

[0021] 105 - Heating unit;

[0022] 1031 - Piezoelectric ceramic micro - motion platform;

[0023] 1032 - Displacement module and;

[0024] 1033 - Mounting head;

[0025] 1051 - Transmission unit;

[0026] 1052 - Vacuum pump;

[0027] 1053 - Low - pressure bin;

[0028] 1054 - Infrared heating unit;

[0029] 531 - First inlet hatch;

[0030] 532 - First isolation bin;

[0031] 533 - Second inlet hatch;

[0032] 534 - Heating bin;

[0033] 535 - First outlet hatch;

[0034] 536 - Second isolation bin;

[0035] 537 - Second outlet hatch;

[0036] 106 - Temperature detection unit;

[0037] 107 - Laser - assisted heating unit;

[0038] 1055 - Electric heating wire;

[0039] 1056 - Heat insulation layer;

[0040] 1057 - Fan. Detailed implementation manners

[0041] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present application.

[0042] It should be noted that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application. The terms "mounted", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. The terms "parallel", "perpendicular", "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurement being discussed and the errors associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, where the acceptable deviation range of approximate parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximate perpendicular, where the acceptable deviation range of approximate perpendicular can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range of approximate equality can be, for example, that the difference between the two equal ones is less than or equal to 5% of any one of them. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0043] In order to enable those skilled in the art of the present technology to better understand the solution of the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0044] Figure 1 The structural schematic of the welding device provided by the embodiment of the present application Figure 1 As Figure 1 shown, the welding device 100 includes: a processing unit 101, an image acquisition unit 102, a chip mounting unit 103, a solder paste application unit 104, and a heating unit 105.

[0045] The image acquisition unit 102 is fixed on the surface of the chip mounting unit 103 and faces the direction of the electronic device grabbed by the chip mounting unit 103.

[0046] Among them, the image acquisition unit can be fixed on the surface of the chip mounting unit by bolts / screws, or can be fixed on the surface of the chip mounting unit through a card slot / clasp, or can also be welded / glued on the surface of the chip mounting unit. The image acquisition unit 102 can be fixed on the side surface of the chip mounting unit, or can be fixed on the surface of the chip mounting unit close to the electronic device.

[0047] The chip mounting unit 103 grasps the electronic device.

[0048] Among them, the chip mounting unit 103 can include a displacement module and a mounting head connected to the displacement module. The displacement module can be composed of a motor and a slide rail, or can be a robotic arm. The mounting head can be composed of a suction cup or a gripper.

[0049] The image acquisition unit 102 is used to acquire the depth images of the pads on the circuit board and the electronic device. The image acquisition unit is a depth camera, and can also integrate near-infrared and visible light imaging to obtain a three-dimensional image containing depth information through multi-spectral confocal imaging.

[0050] Among them, the image acquisition unit acquires the depth image in response to receiving an instruction from the processing unit, or periodically acquires the depth image.

[0051] The processing unit 101 controls the position of the electronic device moved by the chip mounting unit 103 according to the depth image.

[0052] Among them, the processing unit judges whether the electronic device is aligned with the pad according to the depth image, and controls the chip mounting unit to move the position in the case of misalignment so that the electronic device is aligned with the pad. Judging whether the electronic device is aligned with the pad according to the depth image can be realized by using the Proportional Integral Derivative (PID) algorithm and the neural network model.

[0053] The solder paste application unit 104 applies solder paste to the pads.

[0054] Among them, the solder paste application unit can include a solder paste storage tank, a paste adding pump, a squeegee, etc. The solder paste storage tank is used to store solder paste, the paste adding pump is used to pump out the solder paste in the solder paste storage tank, and the squeegee is used to apply the solder paste on the surface of the pad.

[0055] The chip mounting unit 103 attaches the electronic device to the pad coated with solder paste.

[0056] Among them, the chip mounting unit moves the position to press or place the electronic device on the pad coated with solder paste, and releases the gripper or suction cup to make the device remain on the surface of the pad.

[0057] The heating unit 105 heats the solder paste between the pad and the electronic device to solder the electronic device to the pad.

[0058] Among them, the heating unit can heat the solder paste by means of infrared radiation, hot air, etc., to melt the solder paste, and complete the soldering of the electronic device after the solder paste cools. The heating unit can be fixed on the surface of the chip mounting unit or independent of the chip mounting unit.

[0059] As can be seen from the description of the above embodiments, in the embodiments of the present disclosure, the depth images of the electronic device and the pad are collected by the image acquisition unit fixed on the surface of the chip mounting unit, and the position of the electronic device is controlled to move by the chip mounting unit according to the depth images, so that the electronic device and the pad are accurately aligned. Therefore, after the subsequent application of the solder paste and soldering, the pins of the device and the pads are accurately soldered, increasing the yield and quality of the device after soldering.

[0060] In a possible implementation, the processing unit 101 inputs the depth image into the position control model to obtain the displacement signal output by the position control model.

[0061] Among them, the position control model can be obtained by a staff member training a convolutional neural network model with experimental data.

[0062] Control the position of the electronic device to move by the chip mounting unit 103 according to the displacement signal.

[0063] Specifically, it may include sending the displacement signal to the displacement module in the chip mounting unit, so that the displacement module of the chip mounting unit drives the placement head to move a corresponding distance.

[0064] As can be seen from the description of the above embodiments, in the embodiments of the present disclosure, the displacement signal is output by using the position control model, making the position control of the chip mounting unit more accurate, so that the soldering effect is better and the probability of false soldering is reduced.

[0065] Figure 2 This is a schematic structural diagram of the chip mounting unit provided by the embodiment of the present application. In a possible implementation, the chip mounting unit 103 includes a piezoelectric ceramic micro motion platform 1031, and may further include a displacement module 1032 and a placement head 1033 connected to the displacement module.

[0066] The piezoelectric ceramic micro motion platform 1031 moves the position of the electronic device according to the instruction of the processing unit 101.

[0067] Among them, it is installed at the rear side of the placement head 1032. The piezoelectric ceramic micro motion platform 1031 can be composed of at least one piezoelectric ceramic element. The processing unit applies a voltage to the piezoelectric ceramic element, causing the piezoelectric ceramic element to deform, resulting in a position change of the placement head of the chip mounting unit, thereby changing the position of the electronic device.

[0068] As can be seen from the description of the above embodiments, in the embodiments of the present disclosure, a piezoelectric ceramic micro-motion platform is provided in the patch unit to move the electronic device with higher precision, making the soldering process of the electronic device more accurate.

[0069] Figure 3 Structural schematic of the soldering device provided by the embodiments of the present application Figure 2 As Figure 3 shown, the heating unit 105 includes: a transmission unit 1051, at least one vacuum pump 1052, a low-pressure chamber 1053, and an infrared heating unit 1054.

[0070] Among them, the transmission unit 1051 can be composed of a conveyor belt and an electric motor, and is used to move the circuit board and the electronic device placed on the circuit board into the low-pressure chamber 1053. The infrared heating unit 1054 can be an infrared lamp tube or a focused infrared emitter, etc., and is used to heat the solder paste between the electronic device and the solder pad in the low-pressure chamber.

[0071] The infrared heating unit 1054 is installed in the low-pressure chamber 1053.

[0072] Among them, the infrared heating unit 1054 can be installed on the inner wall of the low-pressure chamber 1053, or fixed to the inside of the low-pressure chamber by other components.

[0073] The vacuum pump 1052 is connected to the low-pressure chamber 1053 and is used to pump out the gas in the low-pressure chamber 1053.

[0074] Among them, the vacuum pump can be a rotary vane vacuum pump, a scroll vacuum pump, a screw vacuum pump, etc.

[0075] The transmission unit 1051 transports the circuit board with the electronic device attached to the low-pressure chamber 1053.

[0076] Among them, the transmission unit can transport the circuit board into the low-pressure chamber according to the signal sent by the processing unit, or rotate continuously or intermittently, so that the electronic device and the circuit board placed on the transmission unit move towards the low-pressure chamber continuously or intermittently. The transmission unit is also used to transport the circuit board that has been soldered in the low-pressure chamber out of the low-pressure chamber.

[0077] The infrared heating unit 1054 heats the solder paste between the electronic device and the solder pad in the low-pressure chamber 1053, and after the solder paste cools, the electronic device is soldered to the solder pad.

[0078] Among them, the infrared heating unit can be controlled by the processing unit to heat the electronic device in the low-pressure chamber, or can heat the space in the low-pressure chamber in segments according to a preset temperature.

[0079] From the description of the above embodiments, it can be seen that the embodiments of the present disclosure achieve welding in a low-pressure environment by arranging a vacuum pump, a low-pressure chamber and an infrared heating unit in the heating unit, thereby suppressing solder joint oxidation and bubble generation.

[0080] Figure 4 A schematic diagram of the structure of the heating unit provided in the embodiment of the present application Figure 1 .like Figure 4 As shown, the low-pressure chamber 1053 includes: a first inlet door 531 , a first isolation chamber 532 , a second inlet door 533 , a heating chamber 534 , a first outlet door 535 , a second isolation chamber 536 and a second outlet door 537 .

[0081] The processing unit 101 controls the first loading hatch 531 to open.

[0082] The first entry hatch may include a hatch and a motor, the motor is in transmission connection with the hatch, and the motor is used to control the hatch to be opened or closed. The processing unit may notify the first entry hatch to open when the circuit board needs to enter the heating unit according to the position of the electronic device and the circuit board.

[0083] The transfer unit 1051 transfers the circuit board with the electronic components attached thereto into the first isolation chamber 532 .

[0084] The transmission unit transports the circuit board to the first isolation bin by rolling the conveyor belt.

[0085] The processing unit 101 controls the first entry door 531 to close, and the vacuum pump 1052 extracts the gas between the first entry door 531 and the second entry door 533 .

[0086] Among them, the processing unit can determine whether the circuit board enters the first isolation chamber according to the transmission distance of the transmission unit, control the first input hatch to close, and the vacuum pump starts working to extract the gas.

[0087] The processing unit 101 controls the second input door 533 to open.

[0088] After the vacuum pump works for a preset time, the processing unit controls the second entry hatch 533 to open. In a possible implementation, pressure sensors can be added to the first isolation chamber, the second isolation chamber, and the heating chamber, and the processing unit determines whether the hatch can be opened based on the pressure detected by the pressure sensor.

[0089] The transfer unit 1051 transfers the circuit board with the electronic components attached thereto to the heating chamber 534 , and moves the circuit board in the heating chamber 534 .

[0090] The transmission unit may transmit the circuit board at a uniform speed, or may transmit the circuit board at a variable speed according to a preset speed curve.

[0091] The infrared heating unit 1054 heats the solder paste between the electronic components and the pads in the heating chamber 534.

[0092] Among them, the infrared heating unit can be composed of multiple parts, so that the heating rates of each section in the heating chamber are different to meet the welding requirements.

[0093] The processing unit 101 controls the first output hatch 535 to open.

[0094] Among them, the processing unit can control the first output hatch to open after the transfer unit has transferred a preset distance.

[0095] The transfer unit 1051 transfers the circuit board with electronic components attached thereto to the second isolation chamber 536.

[0096] Among them, after the first output hatch is opened, the transfer unit transfers the circuit board to the second isolation chamber according to the instruction of the processing unit, or continues to transfer it so that the circuit board is transferred to the second isolation chamber.

[0097] The processing unit 101 controls the first output hatch 535 to close.

[0098] Among them, the processing unit can send a signal to the motor of the first output hatch to make the motor of the first output hatch rotate and close the first output hatch.

[0099] The vacuum pump 1052 extracts the gas in the second isolation chamber 536.

[0100] Among them, the vacuum pump can extract the gas in the second isolation chamber 536 according to the instruction received from the processing unit, or can extract the gas after detecting that the first output hatch 535 is closed.

[0101] The processing unit 101 controls the second output hatch 537 to open.

[0102] Among them, the processing unit can send a control signal to the motor of the second output hatch after the vacuum pump has worked for a preset duration to make the motor rotate, thereby opening the second output hatch.

[0103] The transfer unit 1051 transfers the circuit board with the electronic components soldered thereto out of the second isolation chamber 536.

[0104] Among them, the transfer unit transports the circuit board that has completed soldering out of the second isolation chamber.

[0105] As can be seen from the description of the above embodiments, the embodiments of the present disclosure add four hatches in the low-pressure chamber to achieve maintaining the low-pressure environment in the low-pressure chamber, reducing the working duration of the vacuum pump, and increasing the welding efficiency.

[0106] In a possible implementation, it further includes: a temperature detection unit 106 and a laser-assisted heating unit 107.

[0107] Among them, the temperature detection unit can be an infrared temperature sensor or an infrared camera to detect the temperature of the solder paste in a non-contact manner. The laser-assisted heating unit can be any type of laser and can also include a robotic arm.

[0108] The temperature detection unit is used to detect the temperature of the solder paste between the solder pads and the electronic devices and send the temperature to the processing unit 101.

[0109] If the processing unit 101 determines that the temperature has not reached the preset temperature, it controls the laser-assisted heating unit to assist in heating.

[0110] Among them, when the processing unit 101 determines that the solder paste on the circuit board has not reached the preset temperature according to the temperature data transmitted by the temperature detection unit, it controls the laser-assisted heating unit to face the area with a lower solder paste temperature and output laser light.

[0111] As can be seen from the description of the above embodiments, the embodiments of the present disclosure add a temperature detection unit and a laser-assisted heating unit to heat the solder with a lower temperature, so that the solder can accurately reach the required temperature, avoiding the problem of false soldering caused by insufficient heating temperature.

[0112] In a possible implementation, the processing unit 101 is used to determine the dense area of electronic devices according to the depth image.

[0113] Among them, the processing unit can use a pre-trained neural network model to identify the dense area of electronic devices.

[0114] The laser-assisted heating unit 107 assists in heating the solder paste of the electronic devices in the dense area of electronic devices.

[0115] Among them, the laser-assisted heating unit can heat the solder paste in the dense area of electronic devices according to the instruction of the processing unit.

[0116] As can be seen from the description of the above embodiments, the embodiments of the present disclosure heat the solder paste in the dense area of electronic devices through the laser-assisted heating unit, increasing the heating rate of the component dense area, reducing the thermal stress difference between the component dense area and the component sparse area, avoiding thermal stress damage, and increasing the reliability of the circuit board after welding.

[0117] Figure 5 Structural schematic of the heating unit provided by the embodiments of the present application Figure 2 In a possible implementation, the laser-assisted heating unit 107 and the temperature detection unit 106 are installed in the heating chamber 534.

[0118] The temperature detection unit 106 detects the temperature of the solder paste in each area between the electronic device and the pad.

[0119] The processing unit 101 obtains the positions of the electronic device and the pad. Based on the temperature and the positions, it determines whether there is a target area that needs auxiliary heating for the solder paste. If auxiliary heating is required, it controls the laser-assisted heating unit 107 to irradiate the target area so that the target area reaches the preset temperature corresponding to the position.

[0120] Among them, the processing unit can determine the positions of the electronic device and the pad according to the infrared image captured by the temperature detection unit, and judge whether the solder paste needs auxiliary heating based on the temperature of the solder paste between the electronic device and the pad in the infrared image.

[0121] For example, currently there are 5 electronic devices to be soldered, and the solder paste temperature of 1 of the electronic devices is lower than the preset temperature. Then the processing unit controls the laser-assisted heating unit 107 to irradiate the solder paste of this device to increase the temperature of the solder paste of this electronic device. Another example is that currently 1 square electronic device needs to be soldered, and the solder paste forms four sides, and the temperature of one side is lower than the preset temperature. Then the processing unit controls the laser-assisted heating unit 107 to irradiate this side so that the temperature of this side increases to the preset temperature.

[0122] Among them, the preset temperature can correspond to the position of the circuit board in the heating unit, Figure 5 taking as an example, the circuit board passes through the heating unit from left to right, successively going through the preheating stage, the heat preservation stage, the soldering stage, and the cooling stage. Different stages correspond to different temperatures. Therefore, the processing unit can determine the corresponding preset temperature according to the position of the circuit board in the infrared image.

[0123] It can be seen from the description of the above embodiments that the embodiments of the present disclosure add a laser-assisted heating unit and a temperature detection unit in the heating unit to heat the area where the temperature does not reach the standard, so that the heating temperature meets the requirements, and the yield and quality of the circuit board after soldering are increased.

[0124] Figure 6 This is the structural schematic diagram of the heating unit provided by the embodiment of the present application Figure 3 . As Figure 6 shown, the heating unit 105 includes a heating wire 1055, a heat insulation layer 1056, and a blower 1057.

[0125] Among them, the heating wire can be made of materials such as nickel-chromium alloy and iron-chromium aluminum alloy. The heat insulation layer can be made of ceramic fiber or a combination of aerogel and fiberglass cloth. The blower can adopt an alloy impeller combined with a water-cooled motor to avoid overheating of the motor.

[0126] The heating wire 1055 is installed inside the heat insulation layer 1056, and the blower 1057 is installed behind the heating wire 1055.

[0127] Among them, behind the heating wire, it can be the direction opposite to the air flow direction of the fan.

[0128] As can be seen from the description of the above embodiments, the embodiments of the present disclosure can heat the solder paste with hot air by using a heating wire, a heat insulation layer and a fan to form a heating unit, without establishing low-pressure soldering conditions, reducing the manufacturing cost of the soldering device.

[0129] The embodiments of the present application also provide a solder paste applied to the soldering device in any of the above embodiments, including: tin-silver-copper solder, titanium nitride nanowires doped in the tin-silver-copper solder, and graphene quantum dots doped in the tin-silver-copper solder, wherein the weight of the titanium nitride nanowires accounts for 0.6% to 1.2% of the weight of the solder paste, and the weight of the graphene quantum dots accounts for 0.1% to 0.4% of the weight of the solder paste.

[0130] Among them, the graphene quantum dots can be graphene fragments with a diameter less than 100 nanometers and a number of layers less than 10.

[0131] As can be seen from the description of the above embodiments, the embodiments of the present disclosure improve the soldering strength by doping titanium nitride nanowires and graphene quantum dots in the tin-silver-copper solder.

[0132] In a possible implementation, the weight of the titanium nitride nanowires accounts for 0.8% of the weight of the solder paste, and the weight of the graphene quantum dots accounts for 0.2% of the weight of the solder paste. In the case of using this component, the tensile strength of the solder joint is increased by 35%, the thermal conductivity is increased by 40%, and the fluidity of the solder is optimized, and the void ratio is <0.3%.

[0133] The above has introduced in detail a soldering device and a solder paste provided by the present application. Specific examples are used herein to elaborate on the principles and implementation manners of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A welding device, characterized in that, Including: A processing unit (101), an image acquisition unit (102), a chip mounting unit (103), a solder paste application unit (104), and a heating unit (105); The image acquisition unit (102) is fixed on the surface of the chip mounting unit (103), and the image acquisition unit (102) faces the direction of the electronic device grabbed by the chip mounting unit (103); The chip mounting unit (103) grabs the electronic device; The image acquisition unit (102) is used to acquire the depth images of the pads on the circuit board and the electronic device; The processing unit (101) controls the chip mounting unit (103) to move the position of the electronic device according to the depth image; The solder paste application unit (104) applies solder paste to the pads; The chip mounting unit (103) attaches the electronic device to the pads smeared with solder paste; The heating unit (105) heats the solder paste between the pads and the electronic device to solder the electronic device to the pads.

2. The welding device according to claim 1, characterized in that, The processing unit (101) inputs the depth image into the position control model to obtain the displacement signal output by the position control model; According to the displacement signal, control the chip mounting unit (103) to move the position of the electronic device.

3. The welding device according to claim 1, characterized in that, The chip mounting unit (103) includes a piezoelectric ceramic micro-motion platform (1031); The piezoelectric ceramic micro-motion platform (1031) moves the position of the electronic device according to the instruction of the processing unit (101).

4. The welding device according to claim 1, characterized in that, The heating unit (105) includes: a transmission unit (1051), at least one vacuum pump (1052), a low-pressure chamber (1053), and an infrared heating unit (1054); The infrared heating unit (1054) is installed in the low-pressure chamber (1053); The vacuum pump (1052) is connected to the low-pressure chamber (1053) and is used to pump out the gas in the low-pressure chamber (1053); The transmission unit (1051) transports the circuit board with the attached electronic device to the low-pressure chamber (1053); The infrared heating unit (1054) heats the solder paste between the electronic device and the pads in the low-pressure chamber (1053), and after the solder paste cools, the electronic device is soldered to the pads.

5. The welding device according to claim 4, characterized in that, The low-pressure chamber (1053) includes a first component inlet hatch (531), a first isolation chamber (532), a second component inlet hatch (533), a heating chamber (534), a first component outlet hatch (535), a second isolation chamber (536), and a second component outlet hatch (537); The processing unit (101) controls the first component inlet hatch (531) to open; The transmission unit (1051) transports the circuit board with the attached electronic device into the first isolation chamber (532); The processing unit (101) controls the first component inlet hatch (531) to close, and the vacuum pump (1052) pumps out the gas between the first component inlet hatch (531) and the second component inlet hatch (533); The processing unit (101) controls the second component inlet hatch (533) to open; The transfer unit (1051) transfers the circuit board with the electronic device attached thereto to the heating chamber (534) and moves within the heating chamber (534); The infrared heating unit (1054) heats the solder paste between the electronic device and the pads within the heating chamber (534); The processing unit (101) controls the opening of the first component output hatch (535); The transfer unit (1051) transfers the circuit board with the electronic device attached thereto to the second isolation chamber (536); The processing unit (101) controls the closing of the first component output hatch (535); The vacuum pump (1052) extracts the gas within the second isolation chamber (536); The processing unit (101) controls the opening of the second component output hatch (537); The transfer unit (1051) transfers the circuit board with the electronic device soldered thereon out of the second isolation chamber (536).

6. The welding device according to any one of claims 1 to 4, characterized in that, Further comprising: A temperature detection unit (106) and a laser-assisted heating unit (107); The temperature detection unit is used to detect the temperature of the solder paste between the pads and the electronic device and send the temperature to the processing unit (101); If the processing unit (101) determines that the temperature has not reached the preset temperature, it controls the laser-assisted heating unit to assist in heating.

7. The welding device according to claim 6, characterized in that, The processing unit (101) is used to determine the dense area of electronic devices according to the depth image; The laser-assisted heating unit (107) assists in heating the solder paste of the electronic devices within the dense area of electronic devices.

8. The welding device according to claim 5, characterized in that Further comprising: A temperature detection unit (106) and a laser-assisted heating unit (107); The laser-assisted heating unit (107) and the temperature detection unit (106) are installed within the heating chamber (534); The temperature detection unit (106) detects the temperature of the solder paste in each area between the electronic device and the pads; The processing unit (101) obtains the positions of the electronic device and the pads; according to the temperature and the positions, determines whether there is a target area that requires assisted heating for the solder paste; if assisted heating is required, it controls the laser-assisted heating unit (107) to irradiate the target area so that the target area reaches the preset temperature corresponding to the positions.

9. The welding device according to any one of claims 1 to 3, characterized in that, The heating unit (105) includes a heating wire (1055), a heat insulation layer (1056) and a blower (1057); The heating wire (1055) is installed within the heat insulation layer (1056), and the blower (1057) is installed behind the heating wire (1055).

10. A solder paste, characterized in that, Applied to the soldering device according to any one of claims 1 to 9, comprising: a tin-silver-copper solder, titanium nitride nanowires doped in the tin-silver-copper solder, and graphene quantum dots doped in the tin-silver-copper solder, wherein the weight of the titanium nitride nanowires accounts for 0.6% to 1.2% of the weight of the solder paste, and the weight of the graphene quantum dots accounts for 0.1% to 0.4% of the weight of the solder paste.

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