Multi-layer structure with local 3D (three-dimensional) patterns and preparation method of multi-layer structure

Abstract

The invention relates to the technical field of multi-layer structures, and discloses a multi-layer structure with local 3D patterns and a preparation method of the multi-layer structure. The multilayer structure with the local 3D patterns comprises the following steps: coating a transparent liquid coating on one side of a transparent bearing film; pressing the three-dimensional convex pattern of the transfer printing mold on the liquid coating, curing the liquid coating, and separating the cured liquid coating from the transfer printing mold to form a three-dimensional concave perspective layer with a three-dimensional concave pattern; printing ink on the surface of one side, far away from the transparent bearing film, of the three-dimensional concave perspective layer except the three-dimensional concave pattern through a planographic printing process to form a covering layer with a first avoiding part at a position corresponding to the three-dimensional concave pattern; electroplating is conducted on the side, away from the transparent bearing film, of the covering layer, an electroplating material enters the three-dimensional concave pattern through the first avoiding part, and a three-dimensional linear pattern layer is formed in the three-dimensional concave pattern; stripping the plating layer and the three-dimensional linear pattern layer covering the plating layer; forming a first decorative layer on one side, far away from the transparent bearing film, of the three-dimensional concave perspective layer and on the three-dimensional linear pattern layer; and forming a cover bottom layer on one side, away from the transparent bearing film, of the first decorative layer to obtain a multi-layer structure. The implementation process is simple, the cost is low and the production efficiency is high.

Description

Technical Field

[0001] The present invention relates to the technical field of manufacturing multi-layer structures, and particularly to a multi-layer structure with a local 3D stereoscopic pattern and a preparation method thereof. Background Art

[0002] With the improvement of the overall consumption level, users' requirements for the aesthetic standards of multi-layer structure design are becoming increasingly strict. They not only pursue the visual beauty of patterns but also expect to incorporate local 3D stereoscopic decorative elements. Taking the design of the back cover of a smart phone as an example, designers need to skillfully arrange slightly raised metal lines on the base pattern texture to achieve a delicate artistic effect similar to inlaid jade or cloisonné enamel, making the metal lines harmonious and complementary to the overall pattern of the back cover. Through this embedded metal line design method, not only the aesthetic value of the product is significantly enhanced, but also its added value is greatly improved, meeting users' expectations for high-end and beautiful designs.

[0003] In the prior art, the integration of modern decoration and functional applications has promoted the rapid development of real material embedding technology. By skillfully integrating local 3D stereoscopic materials into the multi-layer decorative pattern structure, this technology effectively combines aesthetic design and practicality and is widely used in fields such as smart home devices, automotive interiors, home accessories, and electronic product casings. However, traditional 3D metal and material embedding technologies face two core challenges: one is that the complex and cumbersome structure design leads to high manufacturing process costs; the other is that traditional printing processes are limited by technical barriers and cannot directly achieve the construction of 3D stereoscopic patterns. Advanced processes such as inlaying metal wires, although they can achieve a certain degree of three-dimensional effect, are accompanied by high costs, low production efficiency, and low repeatability, seriously hindering the pace of large-scale industrial applications. On the other hand, the silk-screen mirror ink technology, although relatively low in cost, is difficult to meet the market's pursuit of high-end aesthetics due to the lack of 3D stereoscopic structure, and the pattern expressiveness is poor. In summary, in the prior art, while pursuing beauty and functionality, there are generally bottleneck problems of high production costs and low production efficiency. Summary of the Invention

[0004] The main object of the present invention is to provide a multi-layer structure with a local 3D stereoscopic pattern and a preparation method thereof, aiming to solve the technical problems of high cost, complex process, and low production efficiency in the existing preparation of multi-layer structures with local 3D stereoscopic patterns.

[0005] To achieve the above object, the present invention provides a preparation method for a multi-layer structure with a local 3D stereoscopic pattern. The preparation method includes: providing a transparent carrier film, and coating a transparent liquid coating on one side of the transparent carrier film;

[0006] Provide a transfer mold with a preset three-dimensional raised pattern, press the three-dimensional raised pattern of the transfer mold on the liquid coating, cure the liquid coating, and separate the cured liquid coating from the transfer mold, so that the cured liquid coating forms a three-dimensional recessed perspective layer with a three-dimensional recessed pattern that matches the concavity and convexity of the three-dimensional raised pattern;

[0007] Print ink on the surface of the three-dimensional recessed perspective layer away from the transparent carrier film except for the three-dimensional recessed pattern through a lithography process to form a masking layer with a first avoidance portion at the position corresponding to the three-dimensional recessed pattern;

[0008] Electroplate on the side of the masking layer away from the transparent carrier film, and the electroplating material enters the three-dimensional recessed pattern through the first avoidance portion, so as to form a three-dimensional linear pattern layer in the three-dimensional recessed pattern;

[0009] Peel off the masking layer and the three-dimensional linear pattern layer covering the masking layer;

[0010] Form a first decorative layer on the side of the three-dimensional recessed perspective layer away from the transparent carrier film and on the three-dimensional linear pattern layer;

[0011] Form a cover bottom layer on the side of the first decorative layer away from the transparent carrier film to obtain a multi-layer structure.

[0012] Further, in an embodiment, the step of peeling off the masking layer and the three-dimensional linear pattern layer covering the masking layer includes: peeling off the masking layer and the three-dimensional linear pattern layer covering the masking layer through a release peeling process.

[0013] Further, in an embodiment, the step of forming the first decorative layer on the side of the three-dimensional recessed perspective layer away from the transparent carrier film and on the three-dimensional linear pattern layer is formed in three steps, including:

[0014] Print ink on the surface of the three-dimensional recessed perspective layer away from the transparent carrier film except for the three-dimensional recessed pattern through a lithography process to form a semi-transparent pattern layer or a semi-transparent color layer;

[0015] Transfer an optical texture layer on the side of the semi-transparent pattern layer or the semi-transparent color layer away from the transparent carrier film and on the three-dimensional linear pattern layer;

[0016] Electroplate on the side of the optical texture layer away from the transparent carrier film to form an electroplated layer.

[0017] Further, in one embodiment, the step of printing ink on the surface of the three-dimensional recessed perspective layer away from the transparent carrier film except for the three-dimensional recessed pattern by lithography to form a masking layer with a first avoidance portion corresponding to the position of the three-dimensional recessed pattern is formed in three steps, including:

[0018] Provide a printing plate with preset graphic information, and coat ink on the side of the printing plate with graphic information;

[0019] Transfer the ink to a rubber blanket;

[0020] Cover the side of the rubber blanket with the ink on the side of the three-dimensional recessed perspective layer away from the transparent carrier film, and apply pressure so that the ink is transferred from the rubber blanket to the surface of the three-dimensional recessed perspective layer except for the three-dimensional recessed pattern, forming a masking layer with a first avoidance portion.

[0021] The present invention also provides a multi-layer structure with a local 3D stereoscopic pattern, which is made by the above preparation method, and the multi-layer structure includes:

[0022] A transparent carrier film;

[0023] A three-dimensional recessed perspective layer, which is arranged on one side of the transparent carrier film;

[0024] A three-dimensional linear pattern layer, which is arranged in the three-dimensional recessed pattern of the three-dimensional recessed perspective layer;

[0025] A first decorative layer, which is arranged on the side of the three-dimensional recessed perspective layer away from the transparent carrier film and on the three-dimensional linear pattern layer;

[0026] A cover bottom layer, which is arranged on the side of the first decorative layer away from the transparent carrier film.

[0027] Further, in one embodiment, the first decorative layer includes at least one semi-transparent layer and one optical texture layer.

[0028] The present invention also provides a preparation method for a multi-layer structure with a local 3D stereoscopic pattern. The preparation method includes: providing a transparent carrier film, and coating a transparent liquid coating on one side of the transparent carrier film;

[0029] Provide a transfer mold with a preset three-dimensional convex pattern, press the three-dimensional convex pattern of the transfer mold on the liquid coating, cure the liquid coating, and separate the cured liquid coating from the transfer mold, so that the cured liquid coating forms a three-dimensional recessed perspective layer with a three-dimensional recessed pattern that matches the convex and concave of the three-dimensional convex pattern;

[0030] Print ink on the surface of the three-dimensional concave perspective layer away from the transparent carrier film except for the three-dimensional concave pattern by lithography, so as to form a second decorative layer with a second avoidance part at the position corresponding to the three-dimensional concave pattern.

[0031] Electroplate on the side of the second decorative layer away from the transparent carrier film, and the electroplating material enters the three-dimensional concave pattern through the second avoidance part, so as to form a three-dimensional linear pattern layer in the three-dimensional concave pattern.

[0032] Prepare a cover bottom layer on the side of the three-dimensional linear pattern layer away from the transparent carrier film to obtain a multi-layer structure.

[0033] Further, in an embodiment, the second decorative layer can be one or more of a non-transparent pattern layer or a non-transparent color layer.

[0034] Further, in an embodiment, after preparing a cover bottom layer on the side of the three-dimensional linear pattern layer away from the transparent carrier film to obtain a multi-layer structure, it further includes:

[0035] Form a surface treatment layer on the side of the transparent carrier film away from the cover bottom layer.

[0036] Further, in an embodiment, the step of printing ink on the surface of the three-dimensional concave perspective layer away from the transparent carrier film except for the three-dimensional concave pattern by lithography to form a second decorative layer with a second avoidance part at the position corresponding to the three-dimensional concave pattern is formed in three steps, including:

[0037] Provide a printing plate with preset graphic information, and coat ink on the side of the printing plate provided with graphic information.

[0038] Transfer the ink to a rubber blanket.

[0039] Cover the side of the rubber blanket with the ink on the side of the three-dimensional concave perspective layer away from the transparent carrier film, and apply pressure so that the ink is transferred from the rubber blanket to the surface of the three-dimensional concave perspective layer except for the three-dimensional concave pattern, forming a second decorative layer with a second avoidance part.

[0040] The present invention also provides a multi-layer structure with a local 3D stereoscopic pattern. The multi-layer structure is made by the preparation method described above, and the multi-layer structure includes

[0041] A transparent carrier film;

[0042] A three-dimensional concave perspective layer, and the three-dimensional concave perspective layer is arranged on the transparent carrier film;

[0043] A second decorative layer, the second decorative layer being disposed on a surface of the three-dimensional recessed perspective layer on a side away from the transparent carrier film except for the three-dimensional recessed pattern of the three-dimensional recessed perspective layer;

[0044] A three-dimensional linear pattern layer, the three-dimensional linear pattern layer is disposed on the second decorative layer and in the three-dimensional recessed pattern of the three-dimensional recessed perspective layer;

[0045] The cover bottom layer is arranged on a side of the three-dimensional linear pattern layer away from the transparent carrier film.

[0046] In the technical solution provided by the present invention, a transparent liquid coating is first coated on a transparent carrier film, and then the three-dimensional convex pattern of the transfer mold is pressed on the liquid coating, the liquid coating is cured, and the cured liquid coating and the transfer mold are separated to form a three-dimensional recessed perspective layer with a three-dimensional recessed pattern, and then a surface ink is printed on the side of the three-dimensional recessed perspective layer away from the carrier film except for the three-dimensional recessed pattern through a flat printing process to form a shielding layer with a first avoidance portion at a position corresponding to the three-dimensional recessed pattern, and then the shielding layer is electroplated on the side away from the transparent carrier film, and the electroplating material Enter the three-dimensional concave pattern through the first avoidance portion to form a three-dimensional linear pattern layer in the three-dimensional concave pattern, then peel off the three-dimensional concave perspective layer from the shielding layer and the three-dimensional linear pattern layer covering the shielding layer, and then form a first decorative layer on the side of the three-dimensional concave perspective layer away from the transparent carrier film and on the three-dimensional linear pattern layer, and the metal edge of the three-dimensional linear pattern layer and the first decorative layer are combined to form a gold inlaid jade or cloisonné enamel effect, making the multi-layer structure more gorgeous and richer in appearance; a cover bottom layer is formed on the side of the first decorative layer away from the transparent carrier film, so that the appearance effect of the multi-layer structure is displayed more clearly. The process is simple, the cost is low, and the production efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] One or more embodiments are exemplarily described by corresponding drawings, which do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and the figures in the drawings do not constitute proportional limitations unless otherwise stated.

[0048] Figure 1 It is a schematic diagram of a first embodiment of a method for preparing a multilayer structure having a local 3D stereoscopic pattern in an embodiment of the present invention;

[0049] Figure 2 is a schematic diagram of a second embodiment of a method for preparing a multilayer structure having a local 3D stereoscopic pattern in an embodiment of the present invention;

[0050] Figure 3Schematic diagram of the first visual effect of the multi-layer structure prepared in the first or second embodiment of the present invention;

[0051] Figure 4 Schematic diagram of the second visual effect of the multi-layer structure prepared in the first or second embodiment of the present invention;

[0052] Figure 5 Schematic diagram of the structure of the multi-layer structure with a local 3D stereoscopic pattern in the first or second embodiment of the present invention;

[0053] Figure 6 Schematic diagram of the third embodiment of the preparation method of the multi-layer structure with a local 3D stereoscopic pattern in the embodiment of the present invention;

[0054] Figure 7 Schematic diagram of the fourth embodiment of the preparation method of the multi-layer structure with a local 3D stereoscopic pattern in the embodiment of the present invention;

[0055] Figure 8 Schematic diagram of the visual effect of the multi-layer structure prepared in the third or fourth embodiment of the present invention;

[0056] Figure 9 Schematic diagram of the structure of the multi-layer structure with a local 3D stereoscopic pattern in the third or fourth embodiment of the present invention.

[0057] Among them, 100, multi-layer structure; 10, transparent carrier film; 20, three-dimensional concave perspective layer; 30, three-dimensional linear pattern layer; 40, first decorative layer; 401, optical texture layer; 402, electroplated layer; 403, semi-transparent pattern layer; 50, cover bottom layer; 60, second decorative layer. Detailed implementation manners

[0058] For ease of understanding the present invention, the present invention will be described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is expressed as "fixed to" another element, it can be directly on the other element, or there can be one or more intermediate elements therebetween. When an element is expressed as "connected to" another element, it can be directly connected to the other element, or there can be one or more intermediate elements therebetween. The terms "vertical", "horizontal", "left", "right", "inner", "outer" and similar expressions used in this specification are only for the purpose of illustration. In the description of the present invention, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating relative importance or implicitly indicating the quantity of the indicated technical features. Thus, unless otherwise specified, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features; the meaning of "a plurality" is two or more. The term "comprising" and any deformation thereof mean inclusive but not exclusive, and there may be or be added one or more other features, integers, steps, operations, units, components and / or their combinations.

[0059] In addition, unless otherwise clearly specified and defined, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or the communication inside two elements. All technical and scientific terms used in this specification have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the description of the present invention are only for the purpose of describing specific embodiments and are not used to limit the present invention. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.

[0060] In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0061] It is worth noting that the multi-layer structure of the present application can be applied to multiple fields including but not limited to electronic product casings, automotive interiors, smart home devices, etc.

[0062] For ease of understanding, the specific process of the embodiments of the present invention will be described below. Please refer to Figure 1 , the first embodiment of the preparation method of a multi-layer structure with a local 3D stereoscopic pattern in the embodiments of the present invention includes:

[0063] S1. Provide a transparent carrier film, and coat a transparent liquid coating on one side of the transparent carrier film;

[0064] In this step, the transparent carrier film is a transparent polymer material with high transparency and suitable for decoration, such as materials like PET (polyethylene terephthalate) or PC (polycarbonate). The transparent carrier film is used to support and carry the liquid coating. First, prepare a transparent carrier film, and then coat a layer of transparent liquid coating on one surface of the transparent carrier film. Of course, through the release technology, the liquid coating can also be coated on the release film. After the subsequent processes are completed to form a multi-layer structure, the release film is peeled off, and then the multi-layer structure after peeling off the release film is transferred to metals, plastics, glass, glass fiber, carbon fiber, aramid fiber, bamboo fiber, wood, leather, PU leather or silicone leather through a transfer process, making the applicable base materials of the multi-layer structure more extensive.

[0065] Specifically, the material of the liquid coating is a curable liquid polymer, for example, a transparent resin.

[0066] S2. Provide a transfer mold with a preset three-dimensional raised pattern, press the three-dimensional raised pattern of the transfer mold on the liquid coating, cure the liquid coating, and separate the cured liquid coating from the transfer mold, so that the cured liquid coating forms a three-dimensional concave perspective layer with a three-dimensional concave pattern that matches the convex and concave of the three-dimensional raised pattern.

[0067] In this step, the line shape, line thickness, and line depth of the three-dimensional raised pattern of the transfer mold can all be designed according to actual needs. The three-dimensional raised pattern is set through UV lithography or machining technology to form a transfer mold with a three-dimensional raised pattern. Then, the three-dimensional raised pattern of the transfer mold is pressed on the liquid coating. Since the liquid coating is in a liquid state, the transfer mold can easily be pressed into the liquid coating. After pressing to the preset depth, the liquid coating is cured through photocuring, thermal curing processes or two-component curing. After the liquid coating is cured, the transfer mold in the liquid coating is peeled off. After peeling, the cured liquid coating forms a three-dimensional concave pattern, and the three-dimensional concave pattern matches the convex and concave of the three-dimensional raised pattern, obtaining a three-dimensional concave perspective layer. By transferring the three-dimensional raised pattern of the transfer mold onto the three-dimensional concave perspective layer, the three-dimensional concave perspective layer has a three-dimensional concave pattern with the same line shape, line thickness, and line depth. The process is simple and efficient, and because it is directly processed by the transfer mold, the positional accuracy and repeatability of the product can be highly guaranteed, and the mass production performance is greatly improved.

[0068] Among them, thermal curing needs to be heated within a specific temperature range (for example, epoxy resin: 80°C - 150°C; polyurethane: 60°C - 120°C); the curing time of thermal curing shortens with the increase of temperature (for example, it may take 30 minutes at 150°C and several hours at 80°C); catalysts / initiators for thermal curing can accelerate the reaction, such as peroxides or amines.

[0069] The light source for photocuring is ultraviolet light (UV-A: 315 - 400 nm, UV-B: 280 - 315 nm) or visible light (such as LED light source); the light intensity for photocuring usually needs to be 50 - 1000 mW / cm 2 (High light intensity can shorten the curing time); the photoinitiator for photocuring needs to match the light source wavelength (such as TPO for long-wave UV, 184 for short-wave UV); the oxygen inhibition in photocuring can reduce surface oxygen inhibition, for example, inert gases such as nitrogen.

[0070] Two-component curing requires precise proportioning (such as epoxy resin A:B = 1:1 or 10:1) and needs to be used within a specified time after mixing (such as 30 minutes to several hours). The curing conditions for two-component curing may require heating or standing at room temperature (such as two-component polyurethane glue curing at room temperature for 24 hours).

[0071] S3. Print ink on the surface of the three-dimensional concave perspective layer away from the transparent carrier film except for the three-dimensional concave pattern through a lithographic printing process, to form a masking coating layer with a first avoidance portion at the position corresponding to the three-dimensional concave pattern;

[0072] In this step, the principle of lithographic printing is to utilize the property that water and oil are immiscible, establish an oleophilic and hydrophobic graphic area and a hydrophilic and oleophobic blank area on the surface of the printing plate, and perform printing through the principle of oil-water repulsion. The lithographic printing process has the advantages of fast printing speed, high printing quality, and low printing cost. Because the lithographic printing process makes the surface of the three-dimensional concave perspective layer away from the transparent carrier film contact the blanket, and then through pressure, the ink is transferred from the blanket to the surface of the three-dimensional concave perspective layer away from the transparent carrier film. So, the flat part of the surface of the three-dimensional concave perspective layer with the three-dimensional concave pattern has contact and pressure when contacting the blanket, while the three-dimensional concave pattern, due to being concave, has no contact and no pressure. Therefore, it is realized that the three-dimensional concave pattern is not covered and filled by the ink, and at the same time, the position of the masking coating layer corresponding to the three-dimensional concave pattern is not covered by the ink. Thus, a first avoidance portion communicating with the three-dimensional concave pattern is formed. The first avoidance portion is hollowed out at the position corresponding to the three-dimensional concave pattern, which is convenient for materials to enter the three-dimensional concave pattern through the hollow during subsequent electroplating or silk screening, so as to form a three-dimensional linear pattern layer.

[0073] The masking coating layer is used to prevent the three-dimensional linear pattern layer from being directly electroplated on the surface of the three-dimensional concave perspective layer away from the transparent carrier film except for the three-dimensional concave pattern, and to avoid the subsequent added first decorative layer being covered by the three-dimensional linear pattern layer, resulting in a single appearance effect of the multi-layer structure.

[0074] Specifically, the masking layer is fabricated through the following six steps of the lithographic process. First, plate making: the preset graphic information is transferred onto the printing plate through techniques such as photography and electronic color separation. The printing plate is usually made of materials such as aluminum plates and zinc plates, and its surface is treated to form an ink - loving and water - repellent graphic area and a water - loving and ink - repellent blank area. Ink application: the ink is coated on the graphic area of the printing plate so that the graphic area adsorbs the ink. Dampening: the blank area of the printing plate is wetted with a dampening solution to form a water film on the blank area. Transfer: a rubber blanket is covered on the printing plate, making the rubber blanket contact the printing plate, and then the ink is transferred from the printing plate to the rubber blanket. Printing: the side of the rubber blanket with ink is brought into contact with the surface of the three - dimensional concave perspective layer away from the transparent carrier film. Under the action of pressure, the ink is transferred from the rubber blanket to the surface of the three - dimensional concave perspective layer, completing the graphic printing of the masking layer. Drying: the ink on the three - dimensional concave perspective layer is dried to fix it on the three - dimensional concave perspective layer, forming the masking layer. Printing the masking layer through the lithographic process not only has a high printing speed, improving production efficiency, but also results in high printing quality and low printing costs.

[0075] S4. Electroplate on the side of the masking layer away from the transparent carrier film, and the electroplating material enters the three - dimensional concave pattern through the first avoidance portion, so as to form a three - dimensional linear pattern layer in the three - dimensional concave pattern.

[0076] In this step, the electroplating process includes but is not limited to evaporation deposition, sputtering deposition, ion plating, pulsed laser deposition (PLD), cathodic arc deposition, and ion beam assisted deposition (IBAD).

[0077] Among them, evaporation deposition is to heat the material to make it evaporate or sublimate, and the vapor condenses into a film on the surface of the substrate. The advantage of evaporation deposition is a high - purity thin film, but the adhesion is relatively weak, which is suitable for optical coating and electronic devices. Evaporation deposition includes but is not limited to thermal evaporation by resistance heating or induction heating, electron beam evaporation by bombarding the material target with high - energy electron beams, and molecular beam epitaxy (MBE) for precisely controlling the growth of single - crystal thin films with atomic beams under ultra - high vacuum.

[0078] Exemplarily, electron beam evaporation: the substrate is placed in the coating equipment, the air in the coating equipment is pumped to a vacuum, and the material is directly heated and evaporated by using an electron beam, so that the evaporated material is vaporized and transported to the texture surface of the substrate, and a color thin film layer is formed by condensation on the texture surface. (According to the product color and performance requirements, multiple electroplating materials can be superimposed), and the coating material is a metal target.

[0079] Sputtering deposition utilizes high-energy ions to bombard a target material, causing target atoms to be ejected and deposited on a substrate. The advantages of sputtering deposition are that the thin film is dense and has strong adhesion, making it suitable for hard coatings and semiconductor metallization. Sputtering deposition includes, but is not limited to, direct current sputtering applicable to conductive target materials, radio frequency sputtering that can sputter insulating materials, magnetron sputtering that enhances plasma density through a magnetic field and improves deposition rate and uniformity, reactive sputtering that adds reactive gases (such as nitrogen and oxygen) to the sputtering gas to form compound thin films (such as titanium nitride and aluminum oxide), and plasma sputtering.

[0080] Exemplarily, for plasma sputtering: Place the substrate in a coating device, evacuate the air in the coating device to a vacuum, use ions to bombard the surface of the target material, and then use gas discharge to generate gas ionization. The positive ions are accelerated by an electric field to bombard the cathode target at high speed, ejecting cathode target atoms or molecules, which fly towards the surface area of the substrate texture to form a colored thin film layer (multiple electroplating materials can be stacked according to the color and performance requirements of the product).

[0081] Ion plating combines evaporation and sputtering, and improves the thin film properties through ion bombardment during deposition. Its advantages are that the thin film has extremely strong adhesion and can deposit high-hardness and wear-resistant coatings. Ion plating includes, but is not limited to, arc ion plating that uses an arc to evaporate the target material to generate a highly ionized plasma, and hollow cathode ion plating that generates plasma through hollow cathode discharge.

[0082] Pulsed laser deposition (PLD) uses high-energy laser pulses to bombard a target material to generate a plasma for depositing a thin film, which is suitable for materials with complex compositions (such as high-temperature superconducting thin films).

[0083] Cathodic Arc Deposition is to evaporate the target material through arc discharge to form a highly ionized metal plasma (used for diamond-like carbon coatings and tool coatings).

[0084] Ion beam assisted deposition (IBAD) bombards the substrate with an ion beam during deposition to improve the thin film structure and properties.

[0085] Since the electroplating process vaporizes the electroplating material or ejects electroplating material atoms or molecules, it can enter the three-dimensional concave pattern to deposit and form a three-dimensional linear pattern layer. Therefore, by electroplating on one surface of the mask layer away from the transparent carrier film, the electroplating material enters the three-dimensional concave pattern through the first avoidance portion, so that a three-dimensional linear pattern layer is formed in the three-dimensional concave pattern, and a three-dimensional linear pattern layer with a three-dimensional linear pattern is obtained. And the electroplating material can be a metal material of colors such as gold, silver, and purplish red. Therefore, a perspective effect of a metal edge is formed on the three-dimensional linear pattern layer.

[0086] S5. Peel off the mask layer and the three-dimensional linear pattern layer covering the mask layer;

[0087] In this step, the masking coating layer and the three-dimensional linear pattern layer covering the masking coating layer are separated by a release stripping process, so that the first decorative layer prepared on the surface other than the three-dimensional concave pattern on the side of the three-dimensional concave perspective layer away from the transparent carrier film can be seen later, making the multi-layer structure more gorgeous and the appearance more rich.

[0088] S6. A first decorative layer is formed on the side of the three-dimensional concave perspective layer away from the transparent carrier film and on the three-dimensional linear pattern layer;

[0089] In this step, a first decorative layer is prepared on the surface of the three-dimensional concave perspective layer away from the transparent carrier film and on the three-dimensional linear pattern layer. The metal edge of the three-dimensional linear pattern layer is combined with the first decorative layer to form a gold-inlaid-jade or cloisonné enamel effect, making the multi-layer structure more gorgeous and the appearance more rich.

[0090] S7. A cover bottom layer is formed on the side of the first decorative layer away from the transparent carrier film to obtain a multi-layer structure.

[0091] In this step, ink is screen-printed on the surface of the first decorative layer away from the transparent carrier film by a screen printing process to form a cover bottom layer. The cover bottom layer is used to enhance and reflect the color of the first decorative layer, so that the first decorative layer is displayed more clearly, and a multi-layer structure with a local 3D stereoscopic pattern is obtained.

[0092] It should be noted that: the local 3D stereoscopic pattern refers to a stereoscopic pattern with a hollowed-out area.

[0093] In this embodiment, a transparent liquid coating is first coated on the transparent carrier film, and then the three-dimensional convex pattern of the transfer mold is pressed on the liquid coating, the liquid coating is cured, and the cured liquid coating is separated from the transfer mold to form a three-dimensional concave perspective layer with a three-dimensional concave pattern. Then, ink is printed on the surface of the three-dimensional concave perspective layer away from the carrier film except for the three-dimensional concave pattern by a flat printing process to form a masking coating layer with a first avoidance portion at the position corresponding to the three-dimensional concave pattern. Then, electroplating is carried out on the side of the masking coating layer away from the transparent carrier film, and the electroplating material enters the three-dimensional concave pattern through the first avoidance portion, so that a three-dimensional linear pattern layer is formed in the three-dimensional concave pattern. Then, the masking coating layer and the three-dimensional linear pattern layer covering the masking coating layer are peeled off from the three-dimensional concave perspective layer, and a first decorative layer is formed on the side of the three-dimensional concave perspective layer away from the transparent carrier film and on the three-dimensional linear pattern layer. The metal edge of the three-dimensional linear pattern layer is combined with the first decorative layer to form a gold-inlaid-jade or cloisonné enamel effect, making the multi-layer structure more gorgeous and the appearance more rich; a cover bottom layer is formed on the side of the first decorative layer away from the transparent carrier film, so that the appearance effect of the multi-layer structure is displayed more clearly. The process is simple, the cost is low, and the production efficiency is high.

[0094] Please refer to Figure 2 As shown, a second embodiment of a method for preparing a multi-layer structure with a local 3D stereoscopic pattern is also disclosed in an embodiment of the present invention:

[0095] S10. Provide a transparent carrier film, and coat a transparent liquid coating on one side of the transparent carrier film;

[0096] In this step, the description of the above step S10 refers to S1 of the first embodiment, and this step will not be elaborated here.

[0097] S11. Provide a transfer mold with a preset three-dimensional convex pattern, press the three-dimensional convex pattern of the transfer mold on the liquid coating, cure the liquid coating, and separate the cured liquid coating from the transfer mold, so that the cured liquid coating forms a three-dimensional concave perspective layer with a three-dimensional concave pattern that matches the convex and concave of the three-dimensional convex pattern;

[0098] In this step, the description of the above step S11 refers to S2 of the first embodiment, and this step will not be elaborated here.

[0099] Among them, the step of printing ink on the surface of the three-dimensional concave perspective layer away from the transparent carrier film except for the three-dimensional concave pattern by a lithographic process to form a shielding layer with a first avoidance portion at a position corresponding to the three-dimensional concave pattern is formed in three steps, including the following steps 12 - S14.

[0100] S12. Provide a printing plate with preset graphic information, and coat ink on the side of the printing plate provided with the graphic information;

[0101] The steps of S12 include:

[0102] 1) Transfer the preset graphic information to the printing plate by photography or electronic color separation, and the printing plate has an oil-loving and water-repellent graphic area and a water-loving and oil-repellent blank area, where the first graphic information includes one or more of patterns or characters;

[0103] 2) Coat the ink on the graphic area of the printing plate to make the graphic area adsorb the ink;

[0104] 3) Moisten the blank area of the printing plate with a wetting liquid to form a water film on the blank area.

[0105] In this step, first, determine the style of the graphic to be printed. The graphic style can be just a pattern or a combination of a pattern and text. Then, transfer the designed graphic style to the printing plate by taking a photo or electronic color separation. The printing plate is usually made of materials such as aluminum plates or zinc plates, and its surface is treated to form an ink - loving and water - hating graphic area and a water - loving and oil - hating blank area. Then, coat the ink on the printed graphic area so that the graphic area adsorbs the ink, and moisten the blank area of the printing plate with a dampening solution to form a water film on the blank area. Then, perform printing based on the principle of oil - water repulsion.

[0106] S13. Transfer the ink to the blanket.

[0107] In this step, cover the blanket on the ink surface of the printing plate so that the ink on the printing plate is transferred to the blanket; that is, cover the blanket on the ink surface of the printing plate so that the blanket contacts the ink on the printing plate, thereby enabling the ink on the printing plate to be transferred from the printing plate to the blanket. The operation is simple and the cost is low.

[0108] S14. Cover the side of the blanket with the ink on the side of the three - dimensional concave perspective layer away from the transparent carrier film, and apply pressure so that the ink is transferred from the blanket to the surface of the three - dimensional concave perspective layer except for the three - dimensional concave pattern, forming a shielding coating layer with a first avoidance portion.

[0109] In this step, cover the side of the blanket with ink on the surface of the three - dimensional concave perspective layer away from the transparent carrier film. The surface of the three - dimensional concave perspective layer away from the transparent carrier film is the surface with the three - dimensional concave pattern of the three - dimensional concave perspective layer, so that the ink directly contacts the plane of the surface of the three - dimensional concave perspective layer with the three - dimensional concave pattern, but does not contact the three - dimensional concave pattern because the three - dimensional concave pattern is lower than the plane. When pressure is applied to the blanket, the pressure acts on the plane of the three - dimensional concave perspective layer, causing the ink to be transferred from the blanket to the plane of the three - dimensional concave perspective layer, forming a shielding coating layer. The shielding coating layer is used to prevent the three - dimensional linear pattern layer from being directly electroplated on the surface of the three - dimensional concave perspective layer away from the transparent carrier film except for the three - dimensional concave pattern, avoiding the subsequent added decorative layer being covered by the three - dimensional linear pattern layer. And because the three - dimensional concave pattern is lower than the plane, the pressure cannot act on the three - dimensional concave pattern. Therefore, the three - dimensional concave pattern is not filled and covered with ink, and a hollow first avoidance portion is formed at the position of the shielding coating layer corresponding to the three - dimensional concave pattern. Since offset printing is to make the printing sheet contact the blanket and then transfer the ink from the blanket to the printing sheet through pressure, by setting the three - dimensional concave pattern on the printing surface, the position of the three - dimensional concave pattern is not filled with ink, preparing for the subsequent preparation of the three - dimensional linear pattern.

[0110] S15. Electroplate on the side of the shielding coating layer away from the transparent carrier film, and the electroplating material enters the three-dimensional concave pattern through the first avoidance portion, so as to form a three-dimensional linear pattern layer in the three-dimensional concave pattern;

[0111] In this step, the description of the above step S15 refers to S4 of the first embodiment, and this step will not be elaborated here.

[0112] S16. Peel off the shielding coating layer and the three-dimensional linear pattern layer covering the shielding coating layer through a release and peeling process;

[0113] In this step, by pasting a high-adhesion film or bonding resin glue on the surface of the three-dimensional linear pattern layer away from the transparent carrier film, and then forcefully peeling off the high-adhesion film or resin glue, while peeling off the high-adhesion film or resin glue, the shielding coating layer and the three-dimensional linear pattern layer covering the shielding coating layer are peeled off, so that only the part of the three-dimensional linear pattern layer located in the three-dimensional concave pattern is retained, so that the first decorative layer prepared on the surface other than the three-dimensional concave pattern on the side of the three-dimensional concave perspective layer away from the transparent carrier film can be seen subsequently, making the multi-layer structure more gorgeous and the appearance more rich.

[0114] Among them, the step of forming the first decorative layer on the side of the three-dimensional concave perspective layer away from the transparent carrier film and on the three-dimensional linear pattern layer is formed in three steps, including the following steps S17-S19.

[0115] S17. Print ink on the surface of the three-dimensional concave perspective layer away from the transparent carrier film except for the three-dimensional concave pattern through a flat printing process to form a semi-transparent pattern layer or a semi-transparent color layer;

[0116] In this step, a semi-transparent pattern layer or a semi-transparent color layer is made through six steps of plate making, inking, wetting, transferring, printing and drying of the flat printing process. It is not only simple and easy to operate, but also has a fast printing speed, reduces production costs and improves production efficiency, and also makes the multi-layer structure more gorgeous and the appearance more rich.

[0117] Since the position of the semi-transparent pattern layer or the semi-transparent color layer corresponding to the three-dimensional concave pattern of the three-dimensional concave perspective layer is a concave area, when the ink is transferred, the concave area does not contact the ink and is not subjected to a force, so that the position of the semi-transparent pattern layer or the semi-transparent color layer corresponding to the concave area has no ink coverage, improving the printing position accuracy of the semi-transparent pattern layer or the semi-transparent color layer, avoiding the effect that the semi-transparent pattern layer or the semi-transparent color layer covers the three-dimensional concave pattern, and reducing the three-dimensional effect of the multi-layer structure.

[0118] S18. Transfer an optical texture layer onto the side of the semi-transparent pattern layer or semi-transparent color layer away from the transparent carrier film and onto the three-dimensional linear pattern layer;

[0119] In this step, an optical texture layer is transferred onto the surface of the semi-transparent pattern layer or semi-transparent color layer away from the transparent carrier film and onto the three-dimensional linear pattern layer through a transfer process. The optical texture layer is a transparent film with a micron-level concave-convex structure, which is used to produce a diffuse reflection or diffraction effect, making the multi-layer structure more dazzling. Since the semi-transparent pattern layer or semi-transparent color layer is semi-transparent, the user can see the optical texture layer through the semi-transparent pattern layer or semi-transparent color layer as Figure 3 and Figure 4 shown, Figure 3 and Figure 4 are the visual effect diagrams of the multi-layer structure after removing the color. Of course, multiple other effects can also be superimposed according to the actual situation to make the appearance effect of the multi-layer structure richer.

[0120] S19. Electroplate a plating layer on the side of the optical texture layer away from the transparent carrier film;

[0121] In this step, a plating layer is deposited on the surface of the optical texture away from the transparent carrier film through processes including but not limited to evaporation deposition, sputtering deposition, ion plating, pulsed laser deposition (PLD), cathodic arc deposition, and ion beam assisted deposition (IBAD). The material of the plating layer includes one of metal targets, ceramic targets, or alloy targets. Among them, metal targets include nickel target, titanium target, zinc target, chromium target, magnesium target, niobium target, tin target, aluminum target, indium target, iron target, zirconium-aluminum target, titanium-aluminum target, zirconium target, aluminum-silicon target, silicon target, copper target, tantalum target, germanium target, silver target, cobalt target, gold target, gadolinium target, lanthanum target, yttrium target, cerium target, tungsten target, stainless steel target, nickel-chromium target, hafnium target, molybdenum target, iron-nickel target, tungsten target, etc.; ceramic targets include indium tin oxide target, magnesium oxide target, iron oxide target, silicon nitride target, silicon carbide target, titanium nitride target, chromium oxide target, zinc oxide target, zinc sulfide target, silicon dioxide target, silicon monoxide target, zirconium dioxide target, niobium pentoxide target, titanium dioxide target, zirconium dioxide target, hafnium dioxide target, titanium diboride target, zirconium diboride target, tungsten trioxide target, aluminum trioxide target, tantalum pentoxide target, niobium pentoxide target, magnesium fluoride target, yttrium fluoride target, zinc selenide target, aluminum nitride target, silicon nitride target, boron nitride target, lithium niobate target, cadmium sulfide target, praseodymium titanate target, barium titanate target, lanthanum titanate target, nickel oxide target, sputtering target, etc.; alloy targets include iron-cobalt target, aluminum-silicon target, titanium-silicon target, chromium-silicon target, zinc-aluminum target, titanium-zinc target, titanium-aluminum target, titanium-zirconium target, titanium-silicon target, titanium-nickel target, nickel-chromium target, nickel-aluminum target, nickel-vanadium target, nickel-iron target, etc.

[0122] Preferably, the material of the electroplated layer is one of titanium dioxide, silicon dioxide, zirconium dioxide, niobium pentoxide, indium oxide or indium tin oxide. This is beneficial to increasing the adhesion between the electroplated layer and the optical texture layer. At the same time, color materials can also be added to the material of the electroplated layer according to the needs of users to achieve a gorgeous color effect of the multi-layer structure.

[0123] Among them, when the electroplated layer is a decorative layer coating, its electroplating thickness is 0.1 - 1μm; when the electroplated layer is a tool hard coating, its electroplating thickness is 2 - 5μm; when the electroplated layer is an optical thin film, its electroplating thickness is 10nm - 500nm; when the electroplated layer is semiconductor metallization, its electroplating thickness is 10nm - 500nm; when the electroplated layer is a wear-resistant / corrosion-resistant coating, its electroplating thickness is 1 - 10μm.

[0124] S20. A cover bottom layer is formed on the side of the first decorative layer away from the transparent carrier film to obtain a multi-layer structure;

[0125] In this step, the description of the above step S20 refers to S7 of the first embodiment, and this step will not be elaborated here.

[0126] As Figure 5 shown, Figure 5 The multi-layer structure 100 is made by the preparation method of the above first embodiment or second embodiment. Specifically, the multi-layer structure 100 includes a transparent carrier film 10, a three-dimensional concave perspective layer 20 provided on one side of the transparent carrier film 10, a three-dimensional linear pattern layer 30 provided in the three-dimensional concave pattern of the three-dimensional concave perspective layer 20 to form a three-dimensional linear pattern, a first decorative layer 40 provided on the side of the three-dimensional concave perspective layer 20 away from the transparent carrier film 10 and on the three-dimensional linear pattern layer 30, and a cover bottom layer 50 provided on the side of the first decorative layer 40 away from the transparent carrier film 10. Among them, the semi-transparent layer can be a semi-transparent pattern layer or a semi-transparent pattern layer; specifically, the first decorative layer 40 includes an optical texture layer 401, an electroplated layer 402 and a semi-transparent pattern layer 403, or the first decorative layer 40 includes an optical texture layer 401, an electroplated layer 402 and a semi-transparent color layer. The semi-transparent pattern layer 403 or the semi-transparent color layer is printed with ink on the surface of the side of the three-dimensional concave perspective layer 20 away from the transparent carrier film 10 except for the three-dimensional concave pattern. The optical texture layer 401 is provided on the side of the semi-transparent pattern layer 403 or the semi-transparent color layer away from the transparent carrier film 10 and on the three-dimensional linear pattern layer 30; the electroplated layer 402 is provided on the side of the optical texture layer 401 away from the transparent carrier film 10. The metal edge of the three-dimensional linear pattern layer 30 and the first decorative layer 40 are combined to form a gold inlaid jade or cloisonné enamel effect.

[0127] Please refer to Figure 6 shown. In the embodiment of the present invention, a third embodiment of the preparation method of a multi-layer structure with a local 3D stereoscopic pattern is also disclosed:

[0128] S30. Provide a transparent carrier film, and coat a transparent liquid coating on one side of the transparent carrier film;

[0129] In this step, for the description of the above step S30, refer to S1 of the first embodiment, and this step will not be elaborated here.

[0130] S31. Provide a transfer mold with a preset three-dimensional convex pattern, press the three-dimensional convex pattern of the transfer mold on the liquid coating, cure the liquid coating, and separate the cured liquid coating from the transfer mold, so that the cured liquid coating forms a three-dimensional concave perspective layer with a three-dimensional concave pattern that matches the convex and concave of the three-dimensional convex pattern;

[0131] In this step, for the description of the above step S31, refer to S2 of the first embodiment, and this step will not be elaborated here.

[0132] S32. Print ink on the surface of the three-dimensional concave perspective layer away from the transparent carrier film except for the three-dimensional concave pattern through a lithographic printing process, so as to form a second decorative layer having a second avoidance portion at a position corresponding to the three-dimensional concave pattern;

[0133] In this step, the principle of lithographic printing is to utilize the property that water and oil are immiscible, establish an oleophilic and hydrophobic graphic area and a hydrophilic and oleophobic blank area on the surface of the printing plate, and perform printing through the principle of oil-water repulsion. Moreover, the lithographic printing process has the advantages of fast printing speed, high printing quality, and low printing cost. Because in the lithographic printing process, the surface of the three-dimensional concave perspective layer away from the transparent carrier film contacts the rubber blanket, and then the ink is transferred from the rubber blanket to the surface of the three-dimensional concave perspective layer away from the transparent carrier film through pressure. So, for the surface of the three-dimensional concave perspective layer with the three-dimensional concave pattern, the flat part has contact and pressure when contacting the rubber blanket, while for the three-dimensional concave pattern, since it is concave, there is no contact and no pressure. Therefore, it is achieved that the three-dimensional concave pattern is not covered and filled with ink, and at the same time, the position of the second decorative layer corresponding to the three-dimensional concave pattern is not covered with ink, thus forming a second avoidance portion communicating with the three-dimensional concave pattern. And the ink printed on the surface of the three-dimensional concave perspective layer away from the transparent carrier film except for the three-dimensional concave pattern forms the second decorative layer. The second decorative layer is one of a non-transparent pattern layer or a non-transparent color layer, or is non-transparent and has both a pattern and a color, making the appearance effect of the multi-layer structure rich and gorgeous.

[0134] Among them, the second avoidance portion is hollowed out at a position corresponding to the three-dimensional concave pattern, which is convenient for materials to enter the three-dimensional concave pattern through the hollow during subsequent electroplating or silk printing, so as to form a three-dimensional linear pattern.

[0135] S33. Electroplate on the side of the second decorative layer away from the transparent carrier film, and the electroplating material enters the three-dimensional concave pattern through the second avoidance part, so as to form a three-dimensional linear pattern layer in the three-dimensional concave pattern;

[0136] In this step, there are two electroplating methods, specifically:

[0137] The first is physical vapor deposition (PVD) electron beam evaporation: Put the substrate into the coating equipment, pump the air in the coating equipment to vacuum, and directly heat and evaporate the material by using an electron beam, so that the evaporated material is vaporized and transported to the texture surface of the substrate, and condenses on the texture surface to form a color thin film layer. (According to the product color and performance requirements, multiple layers of electroplating materials can be superimposed), and the coating material is a metal target.

[0138] The second method is PVD plasma sputtering: Put the substrate into the coating equipment, pump the air in the coating equipment to vacuum, use ions to bombard the surface of the target, and then use gas discharge to generate gas ionization. Its positive ions bombard the cathode target body at high speed under the action of an electric field, ejecting atoms or molecules of the cathode target body, and flying to the texture surface area of the substrate to form a color thin film layer (According to the product color and performance requirements, multiple layers of electroplating materials can be superimposed).

[0139] Since the electroplating process vaporizes the electroplating material or ejects atoms or molecules of the electroplating material, it can enter the three-dimensional concave pattern to deposit and form a three-dimensional linear pattern. Therefore, by electroplating on the surface of the second decorative layer away from the transparent carrier film, the electroplating material enters the three-dimensional concave pattern through the second avoidance part, so that a three-dimensional linear pattern is formed in the three-dimensional concave pattern, and an electroplated layer with a three-dimensional linear pattern is obtained. And the electroplating material can be a metal material of colors such as gold, silver, and purplish red. Therefore, the three-dimensional linear pattern forms the visual effect of a metal edge, and the metal edge of the three-dimensional linear pattern layer combines with the second decorative layer to form the effect of gold inlaid with jade or cloisonné enamel, as Figure 7 shown, Figure 7 is the visual effect diagram after removing the color of the multi-layer structure, making the appearance effect of the multi-layer structure rich and gorgeous.

[0140] S34. Prepare a cover bottom layer on the side of the three-dimensional linear pattern layer away from the transparent carrier film to obtain a multi-layer structure.

[0141] In this step, screen-print ink on the surface of the three-dimensional linear pattern layer away from the transparent carrier film to form a cover bottom layer. The cover bottom layer is used to enhance and reflect the color of the electroplated layer, making the three-dimensional effect of the three-dimensional linear pattern layer more obvious and making the second decorative layer more clearly displayed, and obtaining a multi-layer structure with a local 3D three-dimensional pattern.

[0142] In this embodiment, first, a transparent liquid coating is applied on a transparent carrier film. Then, the three-dimensional convex pattern of the transfer mold is pressed on the liquid coating, and the liquid coating is cured. After that, the cured liquid coating is separated from the transfer mold to form a three-dimensional concave perspective layer with a three-dimensional concave pattern. Then, by means of lithography, ink is printed on the surface of the three-dimensional concave perspective layer away from the carrier film except for the three-dimensional concave pattern, so as to form a second decorative layer with a second avoidance portion at the position corresponding to the three-dimensional concave pattern. Then, electroplating is carried out on the side of the second decorative layer away from the transparent carrier film, and the electroplating material enters the three-dimensional concave pattern through the second avoidance portion, so as to form a three-dimensional linear pattern layer within the three-dimensional concave pattern. The metal edges of the three-dimensional linear pattern layer are combined with the second decorative layer to form a gold-inlaid jade or cloisonné enamel effect, making the multi-layer structure more gorgeous and the appearance more abundant. A cover bottom layer is formed on the side of the three-dimensional linear pattern layer away from the transparent carrier film, making the appearance effect of the multi-layer structure more clearly displayed. The process is simple, with low cost and high production efficiency.

[0143] Please refer to Figure 8 as shown, the fourth embodiment of a preparation method for a multi-layer structure with a local 3D stereoscopic pattern is also disclosed in the embodiment of the present invention:

[0144] S40. Provide a transparent carrier film, and apply a transparent liquid coating on one side of the transparent carrier film;

[0145] In this step, the description of the above step S40 refers to S1 of the first embodiment, and will not be elaborated here.

[0146] S41. Provide a transfer mold with a preset three-dimensional convex pattern, press the three-dimensional convex pattern of the transfer mold on the liquid coating, cure the liquid coating, and separate the cured liquid coating from the transfer mold, so that the cured liquid coating forms a three-dimensional concave perspective layer with a three-dimensional concave pattern that matches the convex and concave of the three-dimensional convex pattern;

[0147] In this step, the description of the above step S40 refers to S2 of the first embodiment, and will not be elaborated here.

[0148] S42. Provide a printing plate with preset graphic information, and coat ink on the side of the printing plate with graphic information;

[0149] The steps of S42 include:

[0150] 1) Transfer the preset graphic information to the printing plate by means of photography or electronic color separation. The printing plate has an oil-loving and water-repellent graphic area and a water-loving and oil-repellent blank area. Among them, the first graphic information includes one or more of patterns or characters;

[0151] 2) Apply the ink to the graphic area of the printing plate so that the graphic area adsorbs the ink;

[0152] 3) Wet the non-graphic area of the printing plate with dampening solution so that a water film forms on the non-graphic area.

[0153] In this step, first, determine the style of the graphic to be printed. The graphic style can be just a pattern or a combination of pattern and text. Then, transfer the designed graphic style to the printing plate by photographing or electronic color separation. Usually, the printing plate is made of materials such as aluminum plates and zinc plates, and its surface is treated to form an oil-loving and water-repellent graphic area and a water-loving and oil-repellent non-graphic area. Then, apply the ink to the graphic area of the printing plate so that the graphic area adsorbs the ink, and wet the non-graphic area of the printing plate with dampening solution so that a water film forms on the non-graphic area. Then, perform printing based on the principle of oil-water repulsion.

[0154] S43. Transfer the ink to the blanket;

[0155] In this step, cover the blanket on the ink surface of the printing plate so that the ink on the printing plate is transferred to the blanket; that is, cover the blanket on the ink surface of the printing plate so that the blanket contacts the ink on the printing plate, thereby causing the ink on the printing plate to be transferred from the printing plate to the blanket. The operation is simple and the cost is low.

[0156] S44. Cover the side of the blanket with the ink on the side of the three-dimensional recessed perspective layer away from the transparent carrier film, and apply pressure so that the ink is transferred from the blanket to the surface of the three-dimensional recessed perspective layer except for the three-dimensional recessed pattern, forming a second decorative layer with a second avoidance portion;

[0157] In this step, cover the side of the blanket with ink on the surface of the three-dimensional concave perspective layer away from the transparent carrier film. The surface of the three-dimensional concave perspective layer away from the transparent carrier film is the surface of the three-dimensional concave perspective layer with a three-dimensional concave pattern, so that the ink is in direct planar contact with the surface of the three-dimensional concave perspective layer with the three-dimensional concave pattern, but does not contact the three-dimensional concave pattern because the three-dimensional concave pattern is lower than the plane. When pressure is applied to the blanket, the pressure acts on the plane of the three-dimensional concave perspective layer, causing the ink to transfer from the blanket to the plane of the three-dimensional concave perspective layer, forming a second decorative layer. Since the three-dimensional concave pattern is lower than the plane, the pressure cannot act on the three-dimensional concave pattern. Therefore, the three-dimensional concave pattern is not filled and covered with ink, and a hollowed-out second avoidance portion is formed at the position of the second decorative layer corresponding to the three-dimensional concave pattern. Because lithography is to transfer the ink from the blanket to the printing sheet through pressure after the printing sheet and the blanket are in contact, by setting the three-dimensional concave pattern on the printing surface, the position of the three-dimensional concave pattern is not filled with ink, preparing for the subsequent preparation of a three-dimensional linear pattern.

[0158] S45. Electroplate on the side of the second decorative layer away from the transparent carrier film, and the electroplating material enters the three-dimensional concave pattern through the second avoidance portion, so as to form a three-dimensional linear pattern layer in the three-dimensional concave pattern;

[0159] In this step, the description of the above step S45 refers to S33 of the third embodiment, and this step will not be elaborated here.

[0160] S46. Prepare a cover bottom layer on the side of the three-dimensional linear pattern layer away from the transparent carrier film to obtain a multi-layer structure;

[0161] In this step, the description of the above step S46 refers to S34 of the third embodiment, and this step will not be elaborated here.

[0162] S47. Form a surface treatment layer on the side of the transparent carrier film away from the cover bottom layer.

[0163] In this step, the surface treatment layer is applied by a curtain coating process on the surface of the transparent carrier film away from the cover bottom layer, and the surface treatment layer improves the hardness and wear resistance of the multi-layer structure.

[0164] As Figure 9 shown, Figure 9The multi-layer structure 100 is made by the preparation method of the above-mentioned third embodiment or fourth embodiment. Specifically, the multi-layer structure 100 includes a transparent carrier film 10, a three-dimensional concave perspective layer 20 disposed on the transparent carrier film 10, and a second decorative layer 60 disposed on the surface of the side of the three-dimensional concave perspective layer 20 away from the transparent carrier film 10 except for the three-dimensional concave pattern. Among them, the second decorative layer 60 has a second avoidance portion, a three-dimensional linear pattern layer 30 disposed on the second decorative layer 60 and disposed within the three-dimensional concave pattern of the three-dimensional concave perspective layer 20, and a cover bottom layer 50 disposed on the side of the three-dimensional linear pattern layer 30 away from the transparent carrier film 10. The metal edge of the three-dimensional linear pattern layer 30 is combined with the first decorative layer 40 to form a gold-inlaid jade or cloisonné enamel effect.

[0165] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; under the idea of the present invention, the technical features in the above embodiments or different embodiments can also be combined, and the steps can be implemented in any order, and there are many other variations in different aspects of the present invention as described above. For the sake of brevity, they are not provided in detail; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A method for preparing a multi-layer structure with a local 3D stereoscopic pattern, characterized in that, The preparation method includes: providing a transparent carrier film, and coating a transparent liquid coating on one side of the transparent carrier film; providing a transfer mold with a preset three-dimensional raised pattern, pressing the three-dimensional raised pattern of the transfer mold on the liquid coating, curing the liquid coating, and separating the cured liquid coating from the transfer mold, so that the cured liquid coating forms a three-dimensional concave perspective layer having a three-dimensional concave pattern that matches the convex and concave of the three-dimensional raised pattern; printing ink on the surface of the three-dimensional concave perspective layer away from the transparent carrier film except for the three-dimensional concave pattern by a lithographic printing process to form a mask layer having a first avoidance portion corresponding to the position of the three-dimensional concave pattern; electroplating on the side of the mask layer away from the transparent carrier film, and the electroplating material enters the three-dimensional concave pattern through the first avoidance portion, so that a three-dimensional linear pattern layer is formed in the three-dimensional concave pattern; peeling off the mask layer and the three-dimensional linear pattern layer covering the mask layer; forming a first decorative layer on the side of the three-dimensional concave perspective layer away from the transparent carrier film and on the three-dimensional linear pattern layer; forming a cover bottom layer on the side of the first decorative layer away from the transparent carrier film to obtain a multi-layer structure.

2. The preparation method according to claim 1, wherein The step of peeling off the mask layer and the three-dimensional linear pattern layer covering the mask layer includes: peeling off the mask layer and the three-dimensional linear pattern layer covering the mask layer by a release peeling process.

3. The preparation method according to claim 1, wherein The step of forming the first decorative layer on the side of the three-dimensional concave perspective layer away from the transparent carrier film and on the three-dimensional linear pattern layer is formed in three steps, including: printing ink on the surface of the three-dimensional concave perspective layer away from the transparent carrier film except for the three-dimensional concave pattern by a lithographic printing process to form a semi-transparent pattern layer or a semi-transparent color layer; transferring an optical texture layer on the side of the semi-transparent pattern layer or the semi-transparent color layer away from the transparent carrier film and on the three-dimensional linear pattern layer; electroplating to form an electroplated layer on the side of the optical texture layer away from the transparent carrier film.

4. The preparation method according to claim 1, characterized in that, The step of printing ink on the surface of the three-dimensional concave perspective layer away from the transparent carrier film except for the three-dimensional concave pattern by a lithographic printing process to form a mask layer having a first avoidance portion corresponding to the position of the three-dimensional concave pattern is formed in three steps, including: providing a printing plate with preset graphic information, and coating ink on the side of the printing plate provided with the graphic information; transferring the ink to a rubber blanket; covering the side of the rubber blanket having the ink on the side of the three-dimensional concave perspective layer away from the transparent carrier film, and applying pressure, so that the ink is transferred from the rubber blanket to the surface of the three-dimensional concave perspective layer except for the three-dimensional concave pattern to form a mask layer having a first avoidance portion.

5. A multi-layer structure with a local 3D stereoscopic pattern, characterized in that, The multi-layer structure is made by the preparation method according to any one of claims 1 to 4, and the multi-layer structure includes: a transparent carrier film; a three-dimensional concave perspective layer, and the three-dimensional concave perspective layer is arranged on one side of the transparent carrier film; A three-dimensional linear pattern layer, which is disposed within the three-dimensional concave pattern of the three-dimensional concave perspective layer; A first decorative layer, which is disposed on the side of the three-dimensional concave perspective layer away from the transparent carrier film and on the three-dimensional linear pattern layer; A cover bottom layer, which is disposed on the side of the first decorative layer away from the transparent carrier film.

6. The multi-layer structure according to claim 5, wherein, The first decorative layer includes at least one semi-transparent layer and one optical texture layer.

7. A method for preparing a multi-layer structure with a local 3D stereoscopic pattern, characterized in that, The preparation method includes: Providing a transparent carrier film and coating a transparent liquid coating on one side of the transparent carrier film; Providing a transfer mold with a preset three-dimensional convex pattern, pressing the three-dimensional convex pattern of the transfer mold on the liquid coating, curing the liquid coating, and separating the cured liquid coating from the transfer mold, so that the cured liquid coating forms a three-dimensional concave perspective layer having a three-dimensional concave pattern that is concave-convexly matched with the three-dimensional convex pattern; Printing ink on the surface of the three-dimensional concave perspective layer away from the transparent carrier film except for the three-dimensional concave pattern by a lithographic printing process to form a second decorative layer having a second avoidance portion corresponding to the position of the three-dimensional concave pattern; Electroplating on the side of the second decorative layer away from the transparent carrier film, and the electroplating material enters the three-dimensional concave pattern through the second avoidance portion, so that a three-dimensional linear pattern layer is formed within the three-dimensional concave pattern; Preparing a cover bottom layer on the side of the three-dimensional linear pattern layer away from the transparent carrier film to obtain a multi-layer structure.

8. The preparation method according to claim 7, characterized in that, The second decorative layer may be one or more of a non-transparent pattern layer or a non-transparent color layer.

9. The preparation method according to claim 7, wherein, After preparing the cover bottom layer on the side of the three-dimensional linear pattern layer away from the transparent carrier film to obtain a multi-layer structure, it further includes: Forming a surface treatment layer on the side of the transparent carrier film away from the cover bottom layer.

10. The preparation method according to claim 7, characterized in that, The step of printing ink on the surface of the three-dimensional concave perspective layer away from the transparent carrier film except for the three-dimensional concave pattern by a lithographic printing process to form a second decorative layer having a second avoidance portion corresponding to the position of the three-dimensional concave pattern is formed in three steps, including: Providing a printing plate with preset graphic information and coating ink on the side of the printing plate provided with the graphic information; Transferring the ink to a rubber blanket; Covering the side of the rubber blanket having the ink on the side of the three-dimensional concave perspective layer away from the transparent carrier film and applying pressure, so that the ink is transferred from the rubber blanket to the surface of the three-dimensional concave perspective layer except for the three-dimensional concave pattern to form a second decorative layer having a second avoidance portion.

11. A multi-layer structure with a local 3D stereoscopic pattern, characterized in that, The multi-layer structure is made by the preparation method according to any one of claims 7 to 10, and the multi-layer structure includes A transparent carrier film; A three-dimensional concave perspective layer, which is disposed on the transparent carrier film; A second decorative layer, which is disposed on the surface of the three-dimensional concave perspective layer away from the transparent carrier film except for the three-dimensional concave pattern of the three-dimensional concave perspective layer; The three-dimensional linear pattern layer is disposed on the second decorative layer and within the three-dimensional recessed pattern of the three-dimensional recessed perspective layer; The cover bottom layer is disposed on the side of the three-dimensional linear pattern layer away from the transparent carrier film.

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