Semiconductor core part coating uniformity improving device

Abstract

The invention discloses a semiconductor core part coating uniformity improving device, and relates to the technical field of coating uniformity improving devices.The semiconductor core part coating uniformity improving device comprises a uniformity improving mechanism, a cleaning mechanism is arranged on the uniformity improving mechanism, and the cleaning mechanism comprises two connecting blocks, an electromagnetic clutch and a mounting hole; the surface of each of the two connecting blocks is additionally provided with two lower scrapers, the surface of each of the two side rods is additionally provided with two side scrapers, and the surface of each of the two top rods is additionally provided with two top scrapers. Compared with the prior art, the coating material cleaning device has the advantages that uniformly stressed coating materials such as high-purity cobalt or nickel-platinum alloy can be cleaned for the cavity of the coating uniformity improving device, so that the inner wall of the cavity cannot be damaged, the cleaning efficiency is improved, the downtime is reduced, the overall production benefit is improved, and the use efficiency of the coating uniformity improving device is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of film coating uniformity improvement devices, and specifically to a device for improving the film coating uniformity of semiconductor core components. Background Technique

[0002] Semiconductor core components refer to the components that play key functions in semiconductor devices and determine their performance and quality.

[0003] During the film coating process of semiconductor core components, due to the extremely high precision and performance requirements of the components, ordinary film coating is difficult to meet the needs. At this time, in order to ensure the formation of a uniform and high-quality film coating material such as high-purity cobalt or nickel-platinum alloy on the surface of the core components and improve the product performance and yield rate, workers generally use a film coating uniformity improvement device to assist the film coating equipment in performing film coating operations on semiconductor core components.

[0004] However, the existing semiconductor core component film coating uniformity improvement devices have the following deficiencies:

[0005] When semiconductor core parts are coated with film coating materials such as high-purity cobalt-palladium or nickel-platinum alloy-palladium, some high-purity cobalt or nickel-platinum alloy and other film coating materials will be sputtered on the chamber wall of the film coating uniformity improvement device. The traditional cleaning method is manual cleaning. However, manual cleaning is prone to uneven manual force and damage to the chamber wall, which will reduce the cleaning efficiency, increase the downtime, and is not conducive to improving the overall production efficiency.

[0006] Therefore, we propose a new device for improving the film coating uniformity of semiconductor core components to solve the problems raised in the above background technique. Summary of the Invention

[0007] The purpose of the present invention is to provide a device for improving the film coating uniformity of semiconductor core components. By setting a cleaning mechanism, the chamber of the film coating uniformity improvement device can be cleaned with uniform force, so that the inner wall of the chamber will not be damaged, thereby improving the cleaning efficiency, reducing the downtime, and then improving the overall production efficiency to solve the technical problems raised in the background technique.

[0008] To achieve the above purpose, the present invention provides the following technical solution: A device for improving the film coating uniformity of semiconductor core components, including a uniformity improvement mechanism, and a cleaning mechanism is arranged on the uniformity improvement mechanism. The cleaning mechanism is used to clean the film coating materials such as high-purity cobalt or nickel-platinum alloy sputtered on the chamber wall of the uniformity improvement mechanism;

[0009] The cleaning mechanism includes two connecting blocks, an electromagnetic clutch, and mounting holes. A circular tube is fixed inside the mounting holes. A rubber sleeve is provided inside the circular tube. Two lower scrapers are additionally installed on the surfaces of the two connecting blocks. Side rods are fixed at positions near the edges at the tops of the two connecting blocks. Two side scrapers are additionally installed on the surfaces of the two side rods. Top rods are fixed at the tops of the two side rods. Two top scrapers are additionally installed on the surfaces of the two top rods. Auxiliary grooves are preset on the surfaces of the two lower scrapers.

[0010] Preferably, the rubber sleeve is used for connecting the energized wire of the electromagnetic clutch to an external device. The two connecting blocks are installed through bolts and nuts.

[0011] Preferably, the two connecting blocks are installed on the driven end of the electromagnetic clutch. Reinforcing rods are additionally installed on the surfaces of the two side rods. Two ends of each reinforcing rod are respectively installed on the top of the corresponding connecting block and the bottom of the corresponding top rod.

[0012] Preferably, the uniformity improvement mechanism includes a base and a top cover with holes. Circular ring grooves are preset on the top of the base and the bottom of the top cover with holes. A transparent tube is arranged between the two circular ring grooves. Two symmetrically arranged ventilation holes and a first cylindrical hole are preset on the base.

[0013] Preferably, two second cylindrical holes are preset on the top of the top cover with holes. Two first manual valves are additionally installed on the top of the top cover with holes. The interiors of the two first manual valves are respectively communicated with the interiors of the two second cylindrical holes.

[0014] Preferably, mounting tubes are fixed inside the two ventilation holes. A second manual valve is additionally installed at the air inlet end of one of the mounting tubes. A gas flow control valve is additionally installed at the air inlet end of the second manual valve. A plasma generator is additionally installed at one end of the other mounting tube.

[0015] Preferably, a sealing block is fixed at a position near the air outlet in the interior of one of the ventilation holes. Two symmetrically arranged gas diversion holes are preset on the inner wall of one of the ventilation holes. A sealing sleeve is fixed inside the first cylindrical hole. A rotating shaft is arranged inside the sealing sleeve.

[0016] Preferably, a mounting block is additionally installed at the top end of the rotating shaft. The driving end of the electromagnetic clutch is squeezed and fixed between the rotating shaft and the mounting block. A motor is additionally installed at the bottom of the base. The output end of the motor is installed on the bottom of the rotating shaft.

[0017] Preferably, sealing rings are adhesively connected inside the two circular ring grooves. The outer walls of the two sealing rings are in contact with the inner wall of the transparent tube. The bottoms of the two connecting blocks and the bottoms of the four lower scrapers are in contact with the top of the base.

[0018] Preferably, one end surface of each of the two connecting blocks, the surfaces of the two side rods, one end surface of each of the two top rods, and the surfaces of the four side scrapers are all in contact with the inner wall of the transparent tube. The tops of the two top rods are in contact with the surfaces of the four top scrapers, and the mounting holes are preset at the top of the base.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0020] 1. By providing a cleaning mechanism, the present invention can perform a uniformly stressed cleaning operation on the chamber of the film coating uniformity improvement device, so that the inner wall of the chamber will not be damaged, thereby improving the cleaning efficiency, reducing the downtime, and then enhancing the overall production efficiency, that is, improving the use efficiency of the film coating uniformity improvement device. When it is necessary to clean the film coating materials sputtered on the bottom of the perforated top cover, the inner wall of the transparent tube, and the top of the base during the film coating process of semiconductor core components, at this time, by cooperating with the controller on the film coating equipment, the driving end and the driven end of the electromagnetic clutch can be fixed together. Subsequently, by cooperating with the controller, motor, rotating shaft, base, sealing sleeve, and mounting block on the film coating equipment, all the connecting blocks, all the side rods, all the top rods, all the lower scrapers, all the side scrapers, all the strengthening rods, and all the top scrapers can be rotated together.

[0021] 2. Then, by cooperating with all the connecting blocks, all the side rods, all the top rods, all the lower scrapers, all the side scrapers, all the top scrapers, the controller, motor, base, rotating shaft, sealing sleeve, and mounting block on the film coating equipment, the film coating materials on the bottom of the perforated top cover, the inner wall of the transparent tube, and the top of the base can be cleaned off. After that, by separating the perforated top cover, the transparent tube, and the base, the scraped film coating material slag can be disposed of.

[0022] 3. By providing a film coating uniformity improvement device, the present invention can perform a film coating operation on semiconductor core components with uniform high-purity cobalt or nickel-platinum alloy and other film coating materials. When it is necessary to perform a film coating operation on semiconductor core components, first place the semiconductor core components to be film coated on the placement table installed on the top of the mounting block. Subsequently, by cooperating with the vacuum mechanism on the film coating equipment and one of the opened first manual valves, the space inside composed of the base, the transparent tube, and the perforated top cover can be evacuated. Then, by cooperating with the gas delivery mechanism, gas flow control valve, opened second manual valve, corresponding ventilation holes, and two gas distribution holes on the film coating equipment, the transported gas can be evenly distributed inside the above space, so that the film coating material can be stably and uniformly deposited on the surface of the semiconductor core components in the later stage.

[0023] 4. Next, the present invention utilizes the cooperation of the controller, plasma generator, corresponding installation tube, and corresponding ventilation holes on the coating equipment to ionize the gas inside the above-mentioned space, generate plasma, and at the same time, with the cooperation of the plasma, it can remove impurities and oxides on the surface of the semiconductor core components to be coated. At the same time, cobalt atoms or nickel-platinum alloys in coating materials such as high-purity cobalt-palladium or nickel-platinum alloy palladium can be detached from the target surface with relatively high kinetic energy, fly towards the surface of the semiconductor core components, and deposit into a film. Then, by using the cooperation of the controller, motor, base, mounting block, and rotating shaft on the coating equipment, the semiconductor core components placed on the placement table can be rotated to perform uniform coating operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a perspective view from the bottom angle of a device for improving the coating uniformity of semiconductor core components according to the present invention;

[0025] Figure 2 It is a perspective view from the top angle of a device for improving the coating uniformity of semiconductor core components according to the present invention;

[0026] Figure 3 It is a partial cross-sectional perspective view of a device for improving the coating uniformity of semiconductor core components according to the present invention;

[0027] Figure 4 It is a schematic diagram of the partial cross-sectional structure of a device for improving the coating uniformity of semiconductor core components according to the present invention from another angle;

[0028] Figure 5 It is a partial cross-sectional perspective view from the top angle of a device for improving the coating uniformity of semiconductor core components according to the present invention;

[0029] Figure 6 It is a partial perspective view from the top angle of a device for improving the coating uniformity of semiconductor core components according to the present invention;

[0030] Figure 7 It is a perspective view of the rotating shaft of a device for improving the coating uniformity of semiconductor core components according to the present invention;

[0031] Figure 8 It is a schematic diagram of the three-dimensional structure of the base, first cylindrical hole, gas diversion hole, ventilation hole, and mounting hole of a device for improving the coating uniformity of semiconductor core components according to the present invention.

[0032] In the figure: 1. Uniformity improvement mechanism; 101. Base; 102. Ring groove; 103. Perforated top cover; 104. First manual valve; 105. Transparent tube; 106. Installation tube; 107. Second manual valve; 108. Gas flow control valve; 109. Plasma generator; 110. First cylindrical hole; 111. Gas diversion hole; 112. Sealing sleeve; 113. Rotating shaft; 114. Installation block; 115. Motor; 116. Sealing ring; 117. Ventilation hole; 118. Second cylindrical hole; 119. Sealing block; 2. Cleaning mechanism; 201. Connecting block; 202. Electromagnetic clutch; 203. Installation hole; 204. Round tube; 205. Rubber sleeve; 206. Lower scraping blade; 207. Side rod; 208. Side scraping blade; 209. Top rod; 210. Top scraping blade; 211. Reinforcing rod; 212. Auxiliary groove. Detailed implementation mode

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0034] Example 1: Please refer to Figures 1-8As shown in the figure, the present invention provides a technical solution: a device for improving the coating uniformity of semiconductor core components, including a uniformity improvement mechanism 1. The uniformity improvement mechanism 1 includes a base 101 and a perforated top cover 103. Circular grooves 102 are preset on the top of the base 101 and the bottom of the perforated top cover 103. A transparent tube 105 is arranged between the interiors of the two circular grooves 102. Two symmetrically arranged ventilation holes 117 and first cylindrical holes 110 are preset on the base 101. Two second cylindrical holes 118 are preset on the top of the perforated top cover 103. Two first manual valves 104 are additionally installed on the top of the perforated top cover 103. The interiors of the two first manual valves 104 are respectively communicated with the interiors of the two second cylindrical holes 118. Installation pipes 106 are fixed inside the two ventilation holes 117. A second manual valve 107 is additionally installed at the air inlet end of one of the installation pipes 106. A gas flow control valve 108 is additionally installed at the air inlet end of the second manual valve 107. A plasma generator 109 is additionally installed at one end of the other installation pipe 106. A sealing block 119 is fixed near the air outlet in the interior of one of the ventilation holes 117. Two symmetrically arranged gas diversion holes 111 are preset on the inner wall of one of the ventilation holes 117. A sealing sleeve 112 is fixed inside the first cylindrical hole 110. A rotating shaft 113 is arranged inside the sealing sleeve 112. An installation block 114 is additionally installed at the top end of the rotating shaft 113. A motor 115 is additionally installed at the bottom of the base 101. The output end of the motor 115 is installed with the bottom of the rotating shaft 113. Sealing rings 116 are adhesively connected inside the two circular grooves 102. The outer walls of the two sealing rings 116 are in contact with the inner wall of the transparent tube 105.

[0035] In this embodiment, when the semiconductor core component needs to be coated, first remove the perforated top cover 103 from the transparent tube 105. Then place the semiconductor core component to be coated on the placement table, and then install the perforated top cover 103 back in place. Next, open the valve of one of the first manual valves 104. Then, with the cooperation of the vacuum mechanism on the coating equipment and the opened first manual valve 104, evacuate the space composed of the base 101, the transparent tube 105, and the perforated top cover 103 to a vacuum. When this space is evacuated, first close one of the first manual valves 104, and then stop the vacuum mechanism on the coating equipment. Then, use the controller on the coating equipment to set the gas flow rate of the gas flow control valve 108. Next, open the second manual valve 107. Then, with the cooperation of the gas delivery mechanism on the coating equipment, the opened gas flow control valve 108, and the opened second manual valve 107, deliver gas into the corresponding ventilation holes 117. Then, the gas entering the ventilation holes 117 will be evenly distributed in the above space through the cooperation of the two gas diversion holes 111 (which can provide a stable and uniform gas phase environment for coating materials such as high-purity cobalt-palladium or nickel-platinum alloy, thus ensuring that the high-purity cobalt-palladium or nickel-platinum alloy and other coating materials can be evenly deposited on the surface of the semiconductor core component). When an appropriate amount of gas is injected into this space, first close the second manual valve 107, and then stop the gas delivery mechanism on the coating equipment from delivering gas to the gas flow control valve 108. Then, use the air on the coating equipment to turn on the plasma generator 109. At this time, the activated plasma generator 109 will, in cooperation with the corresponding ventilation holes 117 and the corresponding mounting pipes 106, ionize the gas inside the above space (coating chamber), generating plasma. Then, the high-energy particles in the generated plasma will bombard the surface of the semiconductor core component, removing impurities and oxides on the surface of the semiconductor core component, making its surface cleaner and more activated (which is beneficial to the uniform adhesion of the coating material). At the same time, the generated plasma will also bombard the surface of coating materials such as high-purity cobalt-palladium or nickel-platinum alloy, causing cobalt atoms or nickel-platinum alloy to fly off the target surface with a higher kinetic energy and deposit on the surface of the semiconductor core component to form a film. Then, use the controller on the coating equipment to start the motor 115. At this time, the started motor 115 will, in cooperation with the base 101 and the sealing sleeve 112, drive the rotating shaft 113 to rotate. The rotating rotating shaft 113 will drive the mounting block 114 to rotate. At the same time, the rotating mounting block 114 will also drive the semiconductor core component on the placement table to rotate through the placement table, thereby increasing the uniformity of the coating. When the semiconductor core component completes the coating operation, first use the controller on the coating equipment to turn off the plasma generator 109 and the motor 115. Then, open the other first manual valve 104. At this time, with the cooperation of the opened other first manual valve 104 and the corresponding second cylindrical hole 118, the above space returns to normal atmospheric pressure.Next, remove the perforated top cover 103 from the transparent tube 105. Then, remove the semiconductor core component with the coating from the placement table, and reinstall the perforated top cover 103 in place.

[0036] Embodiment 2: As Figures 1-8 shown, a cleaning mechanism 2 is provided on the uniformity improvement mechanism 1. The cleaning mechanism 2 is used to clean the coating materials such as high-purity cobalt or nickel-platinum alloy sputtered on the cavity wall of the uniformity improvement mechanism 1. The cleaning mechanism 2 includes two connecting blocks 201, an electromagnetic clutch 202, and mounting holes 203. A circular tube 204 is fixed inside the mounting hole 203. A rubber sleeve 205 is provided inside the circular tube 204. Two lower scrapers 206 are additionally installed on the surfaces of the two connecting blocks 201. Side rods 207 are fixed at positions near the edges of the tops of the two connecting blocks 201. Two side scrapers 208 are additionally installed on the surfaces of the two side rods 207. Top rods 209 are fixed at the tops of the two side rods 207. Two top scrapers 210 are additionally installed on the surfaces of the two top rods 209. Among them, auxiliary grooves 212 are preset on the surfaces of the two lower scrapers 206. The rubber sleeve 205 is used to connect the energized wire of the electromagnetic clutch 202 to an external device. The two connecting blocks 201 are installed through bolts and nuts. The two connecting blocks 201 and the driven end of the electromagnetic clutch 202 are installed. Reinforcing rods 211 are additionally installed on the surfaces of the two side rods 207. The two ends of each reinforcing rod 211 are respectively installed with the top of the corresponding connecting block 201 and the bottom of the corresponding top rod 209. The uniformity improvement mechanism 1 includes a base 101 and a perforated top cover 103. Circular grooves 102 are preset on the top of the base 101 and the bottom of the perforated top cover 103. A transparent tube 105 is arranged between the two circular grooves 102. Two symmetrically arranged ventilation holes 117 and first cylindrical holes 110 are preset on the base 101. Two symmetrically arranged gas diversion holes 111 are preset on the inner wall of one of the ventilation holes 117. A sealing sleeve 112 is fixed inside the first cylindrical hole 110. A rotating shaft 113 is arranged inside the sealing sleeve 112. A mounting block 114 is additionally installed at the top end of the rotating shaft 113. The driving end of the electromagnetic clutch 202 is pressed and fixed between the rotating shaft 113 and the mounting block 114. The bottoms of the two connecting blocks 201 and the bottoms of the four lower scrapers 206 are in contact with the top of the base 101. The surfaces of one end of the two connecting blocks 201, the surfaces of the two side rods 207, the surfaces of one end of the two top rods 209, and the surfaces of the four side scrapers 208 are in contact with the inner wall of the transparent tube 105. The tops of the two top rods 209 and the surfaces of the four top scrapers 210 are in contact. The mounting holes 203 are preset on the top of the base 101.

[0037] In this embodiment, when it is necessary to clean the coating materials sputtered on the bottom of the perforated top cover 103, the inner wall of the transparent tube 105, and the top of the base 101 during the coating process of semiconductor core components, the electromagnetic clutch 202 is directly activated by the controller on the coating equipment at this time. At this time, the driving end and the driven end of the energized electromagnetic clutch 202 will be fixed together. Subsequently, the motor 115 is activated by the controller on the coating equipment. At this time, the activated motor 115 will drive the two connecting blocks 201 to rotate simultaneously under the cooperation of the base 101, the sealing sleeve 112, and the mounting block 114. Then, the two rotating connecting blocks 201 will drive the lower scrapers 206 connected thereto to rotate simultaneously. Each rotating connecting block 201 will also drive the side rod 207 and the corresponding top rod 209 connected thereto to rotate under the cooperation of the strengthening rod 211 connected thereto. The simultaneously rotating side rod 207 and top rod 209 will also drive the two side scrapers 208 thereon to rotate. At this time, all the rotating connecting blocks 201, all the side rods 207, all the top rods 209, all the lower scrapers 206, all the side scrapers 208, and all the top scrapers 210 will cooperate together to clean the bottom of the perforated top cover 103, the inner wall of the transparent tube 105, and the top of the base 101. When the connecting block 201 rotates 90 degrees, the output end of the motor 115 is reversed by the controller on the coating equipment at this time. At this time, the connecting block 201 will rotate for reset. When the connecting block 201 rotates back to its original position for reset, the connecting block 201 is continuously rotated. At this time, all the rotating connecting blocks 201, all the side rods 207, all the top rods 209, all the lower scrapers 206, all the side scrapers 208, and all the top scrapers 210 will cooperate together to clean the remaining part of the bottom of the perforated top cover 103, the inner wall of the transparent tube 105, and the top of the base 101. When the reset connecting block 201 returns to its original position and then completes a 90-degree rotation operation, the cleaning operation of the bottom of the perforated top cover 103, the inner wall of the transparent tube 105, and the top of the base 101 is completed at this time. Then, through the cooperation of the controller, the motor 115, and the previous linkage components on the coating equipment, until the connecting block 201 returns to its original position. Subsequently, the perforated top cover 103, the transparent tube 105, and the base 101 are separated, and then the scraped coating material residues are cleaned up.

[0038] The effect and working principle achieved by the entire mechanism are as follows:

[0039] In the preparation stage, first connect one of the first manual valves 104 to the intake pipe of the vacuum mechanism on the coating equipment. Subsequently, connect the second manual valve 107 to the outlet pipe of the gas delivery mechanism on the coating equipment. Then, connect the plasma generator 109 to the controller on the coating equipment. After that, install the core component placement table on the mounting block 114. Next, connect the gas flow control valve 108, the motor 115, and the electromagnetic clutch 202 to the controller on the coating equipment. Then, install the fixing frame on the perforated top cover 103 and align the coating materials such as high-purity cobalt-palladium or nickel-platinum alloy palladium installed thereon with the core component placement table. Finally, install the base 101 on the coating equipment;

[0040] During the coating stage, first remove the perforated top cover 103 from the transparent tube 105. Then place the semiconductor core component to be coated on the placement table. Next, reinstall the perforated top cover 103 in place. Then open the valve of one of the first manual valves 104. After that, with the cooperation of the vacuum mechanism on the coating equipment and the opened first manual valve 104, evacuate the space composed of the base 101, the transparent tube 105, and the perforated top cover 103 to a vacuum. When this space is evacuated, first close one of the first manual valves 104, and then stop the vacuum mechanism on the coating equipment. Then use the controller on the coating equipment to set the gas flow rate of the gas flow control valve 108. Next, open the second manual valve 107. After that, with the cooperation of the gas delivery mechanism on the coating equipment, the opened gas flow control valve 108, and the opened second manual valve 107, deliver gas into the corresponding ventilation holes 117. Then the gas entering the ventilation holes 117 will be evenly dispersed in the above space through the cooperation of the two gas diversion holes 111 (which can provide a stable and uniform gas phase environment for coating materials such as high-purity cobalt-palladium or nickel-platinum alloy, thus ensuring that the coating materials such as high-purity cobalt-palladium or nickel-platinum alloy can be evenly deposited on the surface of the semiconductor core component). When an appropriate amount of gas is injected into this space, first close the second manual valve 107, and then stop the gas delivery mechanism on the coating equipment from delivering gas to the gas flow control valve 108. Then use the air on the coating equipment to turn on the plasma generator 109. At this time, the activated plasma generator 109 will, with the cooperation of the corresponding ventilation holes 117 and the corresponding mounting tubes 106, ionize the gas inside the above space (coating chamber), generating plasma. Subsequently, the high-energy particles in the generated plasma will bombard the surface of the semiconductor core component, removing impurities and oxides on the surface of the semiconductor core component, making its surface cleaner and more activated (which is beneficial to the uniform adhesion of the coating material). At the same time, the generated plasma will also bombard the surface of the coating materials such as high-purity cobalt-palladium or nickel-platinum alloy, causing cobalt atoms or nickel-platinum alloy to fly off the target surface towards the surface of the semiconductor core component with a higher kinetic energy and deposit into a film. Then use the controller on the coating equipment to start the motor 115. At this time, the started motor 115 will, with the cooperation of the base 101 and the seal sleeve 112, drive the rotating shaft 113 to rotate. The rotating rotating shaft 113 will drive the mounting block 114 to rotate. At the same time, the rotating mounting block 114 will also drive the semiconductor core component on the placement table to rotate through the cooperation of the placement table, thereby increasing the uniformity of the coating. When the semiconductor core component completes the coating operation, first use the controller on the coating equipment to turn off the plasma generator 109 and the motor 115. Then open the other first manual valve 104. At this time, with the cooperation of the opened other first manual valve 104 and the corresponding second cylindrical hole 118, the above space returns to normal atmospheric pressure. Then remove the perforated top cover 103 from the transparent tube 105.After that, the coated semiconductor core component is removed from the placement table, and then the perforated top cover 103 is reinstalled in place;

[0041] During the cleaning stage, when it is necessary to clean the coating material sputtered on the bottom of the perforated top cover 103, the inner wall of the transparent tube 105, and the top of the base 101 during the coating process of the semiconductor core component, at this time, the electromagnetic clutch 202 is directly activated by the controller on the coating equipment. At this time, the driving end and the driven end of the energized electromagnetic clutch 202 will be fixed together. Subsequently, the motor 115 is activated by the controller on the coating equipment. At this time, the activated motor 115 will drive the two connecting blocks 201 to rotate simultaneously under the cooperation of the base 101, the sealing sleeve 112, and the mounting block 114. Then, the two rotating connecting blocks 201 will drive the lower scraping knives 206 connected to them to rotate simultaneously. Each rotating connecting block 201 will also drive the side rod 207 and the corresponding top rod 209 connected to it to rotate under the cooperation of the reinforcing rod 211 connected to it. The simultaneously rotating side rod 207 and top rod 209 will also drive the two side scraping knives 208 on them to rotate. At this time, all the rotating connecting blocks 201, all the side rods 207, all the top rods 209, all the lower scraping knives 206, all the side scraping knives 208, and all the top scraping knives 210 will cooperate together to clean the bottom of the perforated top cover 103, the inner wall of the transparent tube 105, and the top of the base 101. When the connecting block 201 rotates 90 degrees, at this time, the output end of the motor 115 is reversed by the controller on the coating equipment. At this time, the connecting block 201 will rotate back to its original position. When the connecting block 201 rotates back to its original position, continue to rotate the connecting block 201. At this time, all the rotating connecting blocks 201, all the side rods 207, all the top rods 209, all the lower scraping knives 206, all the side scraping knives 208, and all the top scraping knives 210 will cooperate together to clean the remaining parts of the bottom of the perforated top cover 103, the inner wall of the transparent tube 105, and the top of the base 101. When the reset connecting block 201 returns to its original position and then completes a 90-degree rotation operation, at this time, the bottom of the perforated top cover 103, the inner wall of the transparent tube 105, and the top of the base 101 are completed with the cleaning operation. At this time, with the cooperation of the controller, the motor 115, and the previous linkage components on the coating equipment, until the connecting block 201 returns to its original position. Subsequently, the perforated top cover 103, the transparent tube 105, and the base 101 are separated, and then the scraped coating material residue is cleaned up.

[0042] Among them, the first manual valve 104, the second manual valve 107, the gas flow control valve 108, the plasma generator 109, the motor 115, and the electromagnetic clutch 202 are all existing technologies, and their models can be selected according to the actual situation and will not be explained in detail here.

[0043] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A device for improving the coating uniformity of semiconductor core components, including a uniformity improvement mechanism (1), characterized in that: A cleaning mechanism (2) is provided on the uniformity improvement mechanism (1). The cleaning mechanism (2) is used to clean coating materials such as high-purity cobalt or nickel-platinum alloy sputtered on the cavity wall of the uniformity improvement mechanism (1). The cleaning mechanism (2) includes two connecting blocks (201), an electromagnetic clutch (202), and a mounting hole (203). A circular tube (204) is fixed inside the mounting hole (203). A rubber sleeve (205) is provided inside the circular tube (204). Two lower scrapers (206) are additionally installed on the surfaces of the two connecting blocks (201). Side rods (207) are fixed at positions near the edges of the tops of the two connecting blocks (201). Two side scrapers (208) are additionally installed on the surfaces of the two side rods (207). Top rods (209) are fixed at the tops of the two side rods (207). Two top scrapers (210) are additionally installed on the surfaces of the two top rods (209). Auxiliary grooves (212) are preset on the surfaces of two of the lower scrapers (206).

2. The device for improving the coating uniformity of semiconductor core components according to claim 1, wherein: The rubber sleeve (205) is used for connecting the energized wire of the electromagnetic clutch (202) to an external device. The two connecting blocks (201) are installed through bolts and nuts.

3. The device for improving the coating uniformity of semiconductor core components according to claim 1, wherein: The two connecting blocks (201) are installed on the driven end of the electromagnetic clutch (202). Reinforcing rods (211) are additionally installed on the surfaces of the two side rods (207). The two ends of each reinforcing rod (211) are respectively installed on the top of the corresponding connecting block (201) and the bottom of the corresponding top rod (209).

4. The semiconductor core component film coating uniformity improvement device according to claim 1, wherein: The uniformity improvement mechanism (1) includes a base (101) and a perforated top cover (103). Circular grooves (102) are preset on the top of the base (101) and the bottom of the perforated top cover (103). A transparent tube (105) is arranged between the two circular grooves (102). Two symmetrically arranged ventilation holes (117) and a first cylindrical hole (110) are preset on the base (101).

5. The device for improving the coating uniformity of semiconductor core components according to claim 4, wherein: Two second cylindrical holes (118) are preset on the top of the perforated top cover (103). Two first manual valves (104) are additionally installed on the top of the perforated top cover (103). The interiors of the two first manual valves (104) are respectively communicated with the interiors of the two second cylindrical holes (118).

6. The semiconductor core component film coating uniformity improvement device according to claim 4, characterized in that: Mounting tubes (106) are fixed inside the two ventilation holes (117). A second manual valve (107) is additionally installed at the intake end of one of the mounting tubes (106). A gas flow control valve (108) is additionally installed at the intake end of the second manual valve (107). A plasma generator (109) is additionally installed at one end of the other mounting tube (106).

7. The semiconductor core component film coating uniformity improvement device according to claim 4, characterized in that: A sealing block (119) is fixed at a position near the outlet in the interior of one of the ventilation holes (117). Two symmetrically arranged gas diversion holes (111) are preset on the inner wall of one of the ventilation holes (117). A sealing sleeve (112) is fixed inside the first cylindrical hole (110). A rotating shaft (113) is arranged inside the sealing sleeve (112).

8. The device for improving the coating uniformity of semiconductor core components according to claim 7, characterized in that: An installation block (114) is installed at the top of the rotating shaft (113). The driving end of the electromagnetic clutch (202) is squeezed and fixed between the rotating shaft (113) and the installation block (114). A motor (115) is installed at the bottom of the base (101), and the output end of the motor (115) is installed with the bottom of the rotating shaft (113).

9. The device for improving the coating uniformity of semiconductor core components according to claim 4, characterized in that: Sealing rings (116) are adhesively connected inside the two circular ring grooves (102). The outer walls of the two sealing rings (116) are in contact with the inner wall of the transparent tube (105). The bottoms of the two connecting blocks (201) and the bottoms of the four lower scraping blades (206) are in contact with the top of the base (101).

10. The semiconductor core component film coating uniformity improvement device according to claim 4, wherein: One end surface of the two connecting blocks (201), the surfaces of the two side rods (207), one end surface of the two ejector rods (209), and the surfaces of the four side scraping blades (208) are all in contact with the inner wall of the transparent tube (105). The tops of the two ejector rods (209) are in contact with the surfaces of the four top scraping blades (210). The installation holes (203) are preset on the top of the base (101).

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