Low-rigidity vibration reduction device and vibration reduction assembly for MEMS inertial system

Abstract

The invention provides a low-rigidity vibration reduction device and a vibration reduction assembly for an MEMS inertial system, and relates to the technical field of vibration reduction devices for MEMS inertial systems. A vibration damping main body of the vibration damping device is provided with a clamping part and a vibration damping part which are connected with each other, a mounting groove is formed in one side of the clamping part, and the mounting groove is matched with the angle of the position where the vertex of the MEMS inertia sensitive assembly is located; the vibration reduction part is provided with a first vibration reduction through hole and a second vibration reduction through hole which are independent of each other, and the hole channel direction of the first vibration reduction through hole intersects with the hole channel direction of the second vibration reduction through hole. According to the vibration reduction device, the mounting groove is formed so that the vibration reduction device can be matched with the position where the vertex of the MEMS inertia sensitive assembly is located, the vibration reduction effect is achieved, the rigidity of the vibration reduction body can be effectively reduced through the first vibration reduction through hole and the second vibration reduction through hole, meanwhile, the resonant frequency of the vibration reduction body can be effectively reduced, and the vibration reduction effect is improved. Therefore, the device has the advantage of resisting large impact vibration.

Description

Technical Field

[0001] This specification relates to the technical field of MEMS inertial system damping devices. Specifically, it relates to a low-stiffness damping device and a damping assembly for a MEMS inertial system. Background Art

[0002] In recent years, MEMS inertial technology has developed rapidly. MEMS inertial systems have been widely penetrated into military and civilian fields. Especially in the application scenarios of medium- and low-precision aircraft, due to their low cost, lightweight, and high-performance characteristics, they have begun to gradually replace fiber optic inertial systems. Currently, the new generation of military equipment such as unmanned aerial vehicles and miniature missiles is developing towards low cost, lightweight, autonomy, etc., and has the ability to perform high-speed, highly maneuverable, fast-response attacks and intercept targets, which also puts higher requirements on the performance, volume, weight, and reliability of inertial systems. Especially for MEMS inertial systems, they should have the characteristics of low cost, high reliability, strong resistance to mechanical environments, and high performance. The current damping design solutions for MEMS inertial systems mostly use damping devices with a T-shaped structure. The above-mentioned damping devices have relatively complex structures, high manufacturing difficulty and cost; moreover, the assembly method is also relatively complex, resulting in an increase in the product assembly cost; due to the special structure form and installation method, the assembly consistency is not easy to control, so that the damping effects in all directions of the MEMS inertial system are different, and it is easy to cause additional angular motion of the damped inertial measurement component, which affects the output accuracy of the inertial system. In addition, the volume of the existing damping devices cannot be made very small, which is not conducive to the miniaturization design of MEMS inertial systems. Summary of the Invention

[0003] An object of this specification is to provide a low-stiffness damping device for a MEMS inertial system, which can overcome the above-mentioned defects existing in the damping devices of existing MEMS inertial systems.

[0004] Another object of this specification is to provide a damping assembly for a MEMS inertial system, which has all the advantages of the above-mentioned low-stiffness damping device for a MEMS inertial system.

[0005] The embodiments of this specification are implemented as follows:

[0006] On the one hand, this specification provides a low-stiffness damping device for a MEMS inertial system. The MEMS inertial system includes a structural main body and a MEMS inertial sensitive component. The MEMS inertial sensitive component is disposed in a chamber formed by the cooperation of the structural main body, and includes a damping main body;

[0007] The damping main body has a clamping part and a damping part connected to each other. One side of the clamping part is provided with an installation groove, and the installation groove is adapted to the angle at the position of the vertex of the MEMS inertial sensing component; the damping part is provided with independent first damping through holes and second damping through holes, and the hole channel directions of the first damping through holes and the second damping through holes intersect.

[0008] In some embodiments of the present specification, the hole channel direction of the first damping through hole is consistent with the height direction of the MEMS inertial sensing component.

[0009] In some embodiments of the present specification, the hole channel direction of the second damping through hole is perpendicular to the hole channel direction of the first damping through hole, and the hole channel direction of the second damping through hole faces the clamping part from the MEMS inertial sensing component.

[0010] In some embodiments of the present specification, the clamping part is a rounded cube, and the installation groove is formed at the positions of two vertices along the height direction of the clamping part. One end of the first damping through hole can penetrate through the positions of another group of two vertices along the height direction of the clamping part.

[0011] In some embodiments of the present specification, the shape of the damping part is a rounded cube, the number of the first damping through holes is two, and the setting directions of the two first damping through holes are the diagonal directions of the damping part.

[0012] In some embodiments of the present specification, the setting position of one end of the second damping through hole corresponds to the position of the installation groove, and the second damping through hole can penetrate along the other diagonal direction of the damping part.

[0013] In some embodiments of the present specification, the hole diameters of the first damping through hole and the second damping through hole are 0.98 mm to 1.02 mm.

[0014] In some embodiments of the present specification, the height of the damping main body is 4.98 mm to 5.02 mm, the width of the damping main body is 4.48 mm to 4.52 mm, and the width of the damping main body is 4.48 mm to 4.52 mm.

[0015] In some embodiments of the present specification, the installation groove is formed by the cooperation of a curved side wall and a flat side wall arranged perpendicular to each other, and the curved side wall can abut against the angle at the position of the vertex of the MEMS inertial sensing component.

[0016] On the other hand, this specification provides a vibration damping component for a MEMS inertial system, including eight of the above-mentioned low-stiffness vibration damping devices for a MEMS inertial system. The eight above-mentioned low-stiffness vibration damping devices for a MEMS inertial system are respectively arranged at the corners of the eight vertices of the MEMS inertial sensing component.

[0017] The embodiments of this specification have at least the following advantages or beneficial effects:

[0018] Compared with the prior art, the low-stiffness vibration damping device for a MEMS inertial system can be adapted to the position of the vertex of the MEMS inertial sensing component by setting the installation groove, so as to achieve the vibration damping effect. By setting the first vibration damping through hole and the above-mentioned second vibration damping through hole, the stiffness of the vibration damping main body can be effectively reduced, and at the same time, the resonance frequency of the vibration damping main body can be effectively reduced, thus having the advantage of resisting large impact vibrations. Description of the Drawings

[0019] In order to more clearly illustrate the technical solutions of the embodiments of this specification, the drawings required for the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this specification, and therefore should not be regarded as a limitation of the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0020] Figure 1 Schematic structural diagram of the low-stiffness vibration damping device for a MEMS inertial system provided by this specification;

[0021] Figure 2 Another schematic structural diagram of the low-stiffness vibration damping device for a MEMS inertial system provided by this specification;

[0022] Figure 3 Schematic diagram of the size setting of the vibration damping main body provided by this specification;

[0023] Figure 4 Schematic diagram of the position setting of the vibration damping component for a MEMS inertial system provided by this specification.

[0024] Reference Signs: 1, clamping part; 11, installation groove; 2, vibration damping part; 21, first vibration damping through hole; 22, second vibration damping through hole; 3, MEMS inertial sensing component. Detailed Embodiments

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this specification clearer, the following will clearly and completely describe the technical solutions in the embodiments of this specification in conjunction with the accompanying drawings in the embodiments of this specification. Obviously, the described embodiments are some, but not all, of the embodiments of this specification. Generally, the components of the embodiments of this specification described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0026] Therefore, the following detailed description of the embodiments of this specification provided in the accompanying drawings is not intended to limit the scope of this specification that is claimed, but merely represents selected embodiments of this specification. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in this specification without creative efforts fall within the scope of protection of this specification.

[0027] It should be noted that similar reference numerals and letters indicate similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0028] In the description of the embodiments of this specification, it should be noted that if terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are used to indicate the orientation or positional relationship, it is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this specification is commonly placed during use. It is only for the convenience of describing this specification and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of this specification. In addition, terms such as "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0029] In addition, if terms such as "horizontal", "vertical", "hanging" are used, it does not mean that the component is required to be absolutely horizontal or hanging, but it can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and it does not mean that the structure must be completely horizontal, but it can be slightly inclined.

[0030] In the description of the embodiments of this specification, it should also be noted that unless otherwise clearly specified and limited, if terms such as "set", "installed", "connected", "connected" are used, they should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this specification can be understood according to specific circumstances.

[0031] Please refer to Figures 1 to 3 , an embodiment of this specification provides a low-stiffness vibration damping device for a MEMS inertial system, which mainly includes a vibration damping main body;

[0032] The vibration damping main body has a clamping portion 1 and a vibration damping portion 2 connected to each other. On one side of the clamping portion 1, there is an installation groove 11, and the installation groove 11 is adapted to the angle at the vertex position of the MEMS inertial sensitive component 3; the vibration damping portion 2 is provided with independent first vibration damping through holes 21 and second vibration damping through holes 22, and the hole channel directions of the first vibration damping through holes 21 and the second vibration damping through holes 22 intersect.

[0033] It should be noted here that the above clamping portion 1 and vibration damping portion 2 can be manufactured by integral molding. The separate descriptions of the above clamping portion 1 and vibration damping portion 2 are only for clearly describing the setting relationship and setting position, rather than two separate components.

[0034] Specifically, the above vibration damping device is provided with an installation groove 11 so that it can be adapted to the vertex position of the MEMS inertial sensitive component 3, thereby achieving a vibration damping effect. By setting the first vibration damping through holes 21 and the second vibration damping through holes 22, the stiffness of the vibration damping main body can be effectively reduced, and at the same time, the resonance frequency of the vibration damping main body can be effectively reduced, thus having the advantage of resisting large impact vibrations.

[0035] In this embodiment, the hole channel direction of the first vibration damping through hole 21 is consistent with the height direction of the MEMS inertial sensitive component 3. The hole channel direction of the second vibration damping through hole 22 is perpendicular to the hole channel direction of the first vibration damping through hole 21, and the hole channel direction of the second vibration damping through hole 22 faces the clamping portion 1 from the MEMS inertial sensitive component 3.

[0036] In detail, the hole channel direction of the above first vibration damping through hole 21 is the height direction of the vibration damping main body. The channel direction of the second vibration damping through hole 22 faces the clamping portion 1 from the MEMS inertial sensitive component 3 and is perpendicular to the setting direction of the second vibration damping through hole 22, which can further reduce the stiffness of the above vibration damping main body. Moreover, through the above setting method, the space structure utilization rate of the vibration damping main body can be greatly improved, that is, while the volume of the vibration damping main body is smaller, the above first vibration damping through hole 21 and the above second vibration damping through hole 22 are independently arranged (that is, two non-connected through holes), and the stiffness of the above vibration damping main body can be reduced. It can be seen that the above setting method can further reduce the volume of the vibration damping main body, so as to be applicable to the situation where the space of the MEMS inertial system is extremely limited.

[0037] In this embodiment, the clamping portion 1 is a rounded cube, and the mounting groove 11 is formed at positions where two vertices of the clamping portion 1 are located along its height direction. One end of the first damping through hole 21 can penetrate through positions where another group of two vertices of the clamping portion 1 are located along its height direction.

[0038] In this embodiment, the shape of the damping portion 2 is a rounded cube. The number of the first damping through holes 21 is two, and the arrangement direction of the two first damping through holes 21 is the diagonal direction of the damping portion 2.

[0039] Specifically, the original shapes of the above-mentioned clamping portion 1 and the above-mentioned damping portion 2 are both rounded cubes with the same width and length settings, so that the shape of the above-mentioned damping main body is formed by fitting into a rounded cube. It can be seen that the structural shape of the damping main body provided with the mounting groove 11 is regular, having the advantages of low manufacturing cost, low manufacturing difficulty, and simple assembly method.

[0040] In this embodiment, the mounting groove 11 is formed by the cooperation of a curved side wall and a flat side wall which are perpendicularly arranged, and the curved side wall can abut against the corner at the position of the vertex of the MEMS inertial sensitive component 3.

[0041] In this embodiment, a cube has eight vertices. On the side of the above-mentioned clamping portion 1 close to the MEMS inertial sensitive component 3, that is, at positions where two vertices close to the above-mentioned MEMS inertial sensitive component 3 are located (the connection direction of the two vertices is the height direction of the above-mentioned damping main body), the above-mentioned mounting groove 11 is provided. The above-mentioned mounting groove 11 has three side walls, and any two of them are perpendicular to each other. The two adjacent side walls in the width and length directions cooperate to form a curved side wall, so as to abut against the circumferential side wall of the MEMS inertial sensitive component 3, which can effectively increase the contact area between the above-mentioned MEMS inertial sensitive component 3 and the damping main body and improve the damping effect.

[0042] In this embodiment, the setting position of one end of the second damping through hole 22 corresponds to the position of the mounting groove 1v, and the second damping through hole 22 can penetrate along the other diagonal direction of the damping portion 2.

[0043] In this embodiment, the above-mentioned damping portion 2 has two diagonal directions, which are divided into a first diagonal direction and a second diagonal direction. The first damping through holes 21 that can penetrate the height of the damping main body are arranged at two angular positions in the first diagonal direction, that is, the two first damping through holes 21 are located in the first diagonal direction.

[0044] In this embodiment, one above-mentioned second damping through hole 22 is arranged along the above-mentioned second diagonal direction of the above-mentioned damping portion 2, that is, the above-mentioned second damping through hole 22 is arranged between the two above-mentioned first damping through holes 21.

[0045] It can be seen that by setting the through holes in the above-mentioned vertical and horizontal directions, the stiffness of the vibration damping main body can be effectively reduced, and at the same time, the resonance frequency of the vibration damping main body can be reduced.

[0046] In this embodiment, the hole diameters of the first vibration damping through hole 21 and the second vibration damping through hole 22 are 0.98 mm to 1.02 mm.

[0047] In this embodiment, the height of the vibration damping main body is 4.98 mm to 5.02 mm, the width of the vibration damping main body is 4.48 mm to 4.52 mm, and the width of the vibration damping main body is 4.48 mm to 4.52 mm.

[0048] Specifically, the specific dimension setting of the above-mentioned vibration damping main body can not only make the volume of the above-mentioned vibration damping main body smaller, but also meet the vibration damping requirements of the vibration damping main body.

[0049] In detail, the side wall thickness of the above-mentioned installation groove 11 is 2 mm.

[0050] Please refer to Figure 4 , another embodiment of this specification provides a vibration damping component for a MEMS inertial system, which mainly includes eight of the above-mentioned low-stiffness vibration damping devices for a MEMS inertial system. The eight above-mentioned low-stiffness vibration damping devices for a MEMS inertial system are respectively arranged at the corners of the eight vertex positions of the MEMS inertial sensitive component 3.

[0051] Specifically, the eight above-mentioned vibration damping devices are respectively arranged at the eight vertex positions of the above-mentioned MEMS inertial sensitive component 3, and the setting directions of their first vibration damping through holes 21 are all the same, and the setting directions of the second vibration damping through holes 22 are all in the direction of the MEMS inertial sensitive component 3 facing the clamping portion 1.

[0052] It can be seen that by installing and setting eight vibration damping devices, the above-mentioned MEMS inertial sensitive component 3 can be stably and reliably fixed in the limited space of the MEMS inertial system, thereby reducing the volume of the vibration damping device, improving the utilization rate of the limited space of the MEMS inertial system. At the same time, through the installation method of the above eight vibration damping devices, the vibration damping effect of the vibration damping device in each direction can be made consistent, which can greatly improve the balance degree of the MEMS inertial sensitive component 3 in the system, can greatly improve the anti-large impact vibration performance of the MEMS inertial system, and improve the environmental adaptability and reliability of the system. Moreover, the above assembly method has the advantages of simplicity, low assembly cost and high installation accuracy. Furthermore, the above vibration damping device can effectively improve the situation that the traditional vibration damping device is prone to cause additional angular motion of the inertial measurement component to be vibration-damped, which affects the output accuracy of the inertial system.

[0053] The above are only the preferred embodiments of this specification and are not intended to limit this specification. For those skilled in the art, various modifications and changes can be made to this specification. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this specification shall be included within the protection scope of this specification.

Claims

1. A low-stiffness vibration damping device for a MEMS inertial system, the MEMS inertial system comprising a structural main body and a MEMS inertial sensitive component, the MEMS inertial sensitive component being disposed in a chamber formed by the cooperation of the structural main body, characterized in that, Comprising a vibration damping main body; The vibration damping main body has a clamping portion and a vibration damping portion connected to each other. One side of the clamping portion is provided with a mounting groove, and the mounting groove is adapted to the angle at the position where the vertex of the MEMS inertial sensitive component is located; the vibration damping portion is provided with independent first vibration damping through holes and second vibration damping through holes, and the hole channel directions of the first vibration damping through holes and the second vibration damping through holes intersect.

2. The low-stiffness vibration damping device for a MEMS inertial system according to claim 1, wherein The hole channel direction of the first vibration damping through hole is consistent with the height direction of the MEMS inertial sensitive component.

3. The low-stiffness vibration damping device for a MEMS inertial system according to claim 2, characterized in that, The hole channel direction of the second vibration damping through hole is perpendicular to the hole channel direction of the first vibration damping through hole, and the hole channel direction of the second vibration damping through hole faces the clamping portion from the MEMS inertial sensitive component.

4. The low-stiffness vibration damping device for a MEMS inertial system according to claim 3, wherein The clamping portion is a rounded cube, and the mounting groove is formed at the positions of two vertices along the height direction of the clamping portion. One end of the first vibration damping through hole can penetrate through the positions of the other group of two vertices along the height direction of the clamping portion.

5. The low-stiffness vibration damping device for a MEMS inertial system according to claim 4, characterized in that, The shape of the vibration damping portion is a rounded cube, the number of the first vibration damping through holes is two, and the setting directions of the two first vibration damping through holes are the diagonal directions of the vibration damping portion.

6. The low-stiffness vibration damping device for a MEMS inertial system according to claim 5, wherein The setting position of one end of the second vibration damping through hole corresponds to the position of the mounting groove, and the second vibration damping through hole can penetrate along the other diagonal direction of the vibration damping portion.

7. The low-stiffness vibration damping device for a MEMS inertial system according to claim 1, characterized in that, The hole diameters of the first vibration damping through hole and the second vibration damping through hole are 0.98 mm to 1.02 mm.

8. The low-stiffness vibration damping device for a MEMS inertial system according to claim 1, characterized in that The height of the vibration damping main body is 4.98 mm to 5.02 mm, the width of the vibration damping main body is 4.48 mm to 4.52 mm, and the width of the vibration damping main body is 4.48 mm to 4.52 mm.

9. The low-stiffness vibration damping device for a MEMS inertial system according to claim 1, wherein The mounting groove is formed by the cooperation of a curved side wall and a flat side wall arranged perpendicular to each other, and the curved side wall can abut against the angle at the position where the vertex of the MEMS inertial sensitive component is located.

10. A vibration damping component for a MEMS inertial system, characterized in that, Including eight low-stiffness vibration damping devices for MEMS inertial systems according to any one of claims 1-9, and the eight low-stiffness vibration damping devices for MEMS inertial systems are respectively arranged at the angles at the positions of the eight vertices of the MEMS inertial sensitive component.

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