Detection device and detection method for layer deviation of ABF support plate
Through the vibration isolation platform and adjustment mechanism combined with infrared vision sensors and 3D profiler detection devices, the efficiency and accuracy of ABF carrier plate layer deviation detection are solved, and efficient and accurate layer deviation detection is achieved, meeting the needs of high-density interconnection and high-speed signal transmission.
Patent Information
- Application Number
- CN202510700186.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-28
- Publication Date
- 2025-07-25
AI Technical Summary
The prior art is difficult to efficiently and at low cost to detect the layer deviation of the ABF carrier plate, especially the precise detection of the blind hole position, resulting in high product scrapping rate, low detection efficiency and poor accuracy, which cannot meet the needs of high-density interconnection and high-speed signal transmission.
The vibration isolation platform and adjustment mechanism are used to combine infrared vision sensors and 3D contour instruments to accurately locate the blind holes and metal patterns of the ABF carrier plate through the adjustment mechanism, and image data is obtained using infrared vision sensors, and the offset and direction of the blind holes and metal patterns are calculated by fitting the least squares method to achieve accurate detection.
It realizes efficient and accurate detection of ABF carrier plate layer bias, reduces product scrapping rate, improves detection efficiency and accuracy, and meets the requirements of high-density interconnection and high-speed signal transmission.
Smart Images
Figure CN120368864A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of advanced packaging and testing technologies, and particularly relates to a detection device and a detection method for layer deviation of an ABF carrier board. Background Art
[0002] The ABF carrier board belongs to a type of IC carrier board and is a carrier for connecting and transmitting signals between a bare chip (DIE) and a printed circuit board (PCB), and is crucial in the chip packaging process. The ABF film used in the ABF carrier board has characteristics such as insulation, thinner thickness, low coefficient of thermal expansion, good high-temperature stability, and suitability for micro-hole processing, thereby enabling higher-layer stacking and having greater advantages in application scenarios such as high-density interconnection and high-speed signal transmission. With the popularization of technologies such as AI chips and Chiplets, the continuous increase in the number of layers of the ABF carrier board and the decreasing fineness of the circuit pattern are inevitable requirements for chip performance upgrading and the development of advanced packaging technologies.
[0003] In the ABF carrier board, the conduction of interlayer circuits is achieved by blind holes distributed throughout the carrier board. Blind holes can be drilled on the ABF film using a laser, and then copper is plated to connect adjacent upper and lower layers of circuits. Compared with ordinary circuit boards and other carrier boards, the ABF carrier board with finer circuits and more stacking layers has more stringent requirements for layer deviation. A small layer deviation will cause misalignment of patterns such as blind holes and circuits, which will not only increase the risks of short circuits and open circuits, but also cause problems such as increased signal loss, warping, and stress concentration. Therefore, the detection and control of layer deviation, especially the precise detection of the position of blind holes, will directly affect the reliability, performance, and yield of chips.
[0004] Since a general optical system cannot penetrate the ABF film to observe the patterns under the film, the existing related detections usually adopt the following methods: 1. Using the slicing method to detect the interlayer alignment, but each slicing will cause the product to be scrapped and unusable, and this method is time-consuming, costly, and can only be sampled instead of fully inspected; 2. Detecting through an X-ray device, which has low efficiency and high cost, and there is a risk of scrapping the ABF film product due to ray irradiation; 3. Setting special metal graphic structures and detecting layer deviation through methods such as electrical testing, but the accuracy is poor and it is not easy to judge the deviation direction, which is generally used for ordinary circuit boards and is not applicable to ABF carrier boards; 4. By setting patterns and through holes in the invalid area and using an ordinary optical microscope for alignment detection, its accuracy will be affected by the processing accuracy of the required structure, and this method not only reduces the available area of the effective area of the product, but also cannot directly judge the offset amount of structures such as blind holes and circuits in the effective area, and cannot effectively reflect the layer deviation state of the ABF carrier board. Summary of the Invention
[0005] The purpose of the present invention is to solve the deficiencies existing in the prior art and propose a detection device and a detection method for layer deviation of an ABF carrier board.
[0006] To achieve the above object, the present invention adopts the following technical solutions: A detection device for layer deviation of an ABF carrier board, comprising:
[0007] A vibration isolation platform;
[0008] A connecting frame is arranged on one side of the vibration isolation platform;
[0009] A first adjustment mechanism is arranged above the vibration isolation platform, and an adsorption platform is arranged on the first adjustment mechanism for reciprocating movement of the adsorption platform along the arrangement direction of the first adjustment mechanism;
[0010] A second adjustment mechanism is arranged on the connecting frame, and a detection mechanism is arranged on the second adjustment mechanism for reciprocating movement of the detection mechanism along the arrangement direction of the second adjustment mechanism;
[0011] The adsorption platform places the test piece, and by adjusting the adsorption platform and the detection mechanism, the blind holes on the test piece are detected.
[0012] As a further description of the above technical solution: The vibration isolation platform is vertically arranged with the connecting frame, the arrangement direction of the first adjustment mechanism is vertically arranged with the connecting frame, and the second adjustment mechanism is parallel to the vibration isolation platform.
[0013] As a further description of the above technical solution: The detection mechanism includes a mounting plate, the mounting plate is connected to the second adjustment mechanism, an infrared vision sensor is arranged on the mounting plate, and an objective lens is arranged below the infrared vision sensor.
[0014] As a further description of the above technical solution: An infrared ring light source is arranged below the mounting plate, and the infrared vision sensor images and detects the test piece below through the infrared ring light source.
[0015] As a further description of the above technical solution: A 3D profiler is also arranged on the second adjustment mechanism.
[0016] As a further description of the above technical solution: The first adjustment mechanism and the second adjustment mechanism are linear motors.
[0017] As a further description of the above technical solution: The test piece includes a carrier board, a plurality of blind holes are formed on the carrier board, and a metal pattern is arranged below the blind holes.
[0018] It also includes a method for detecting layer deviation, and the detection method is applicable to the detection device described in any one of the above technical solutions, including:
[0019] S1: According to the coordinates of the blind hole on the component to be measured, control the first adjustment mechanism and the second adjustment mechanism to move the blind hole below the detection mechanism;
[0020] S2: Take a picture of the blind hole to obtain infrared image data, and determine the position of the metal pattern corresponding to the blind hole according to the infrared image data;
[0021] S3: Perform fitting calculation on the blind hole and the metal pattern to obtain the positions of the first center of the blind hole and the second center of the metal pattern, and calculate the blind hole offset and the offset direction as the layer offset.
[0022] As a further description of the above technical solution: It also includes controlling the first adjustment mechanism and the second adjustment mechanism to move the blind hole below the 3D profiler according to the relative distance between the 3D profiler and the detection mechanism, and detecting the size of the blind hole.
[0023] As a further description of the above technical solution: The method for performing fitting calculation on the blind hole and the metal pattern includes: performing circle fitting using the least squares method according to the position of the blind hole and the position of the corresponding metal pattern.
[0024] The above technical solution has the following advantages or beneficial effects:
[0025] The position of the blind hole to be measured is flexibly adjusted by the first adjustment mechanism and the second adjustment mechanism. The ABF component to be measured can be detected by the detection mechanism, and the positions of the blind hole and the metal pattern therein can be identified and imaged, facilitating subsequent fitting calculation to obtain the blind hole offset and the offset direction, that is, the layer offset. Description of the Drawings
[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0027] Figure 1 It is the structural schematic diagram of the detection device proposed by the present invention;
[0028] Figure 2 It is the cross-sectional view of the component to be measured in the present invention;
[0029] Figure 3 It is the imaging diagram of the existing detection equipment;
[0030] Figure 4 It is the imaging diagram of the detection equipment proposed by the present invention;
[0031] Figure 5 Flow chart of the detection method proposed by the present invention;
[0032] Figure 6 Schematic diagram for calculating the offset according to the infrared image in the present invention.
[0033] Legend description:
[0034] 1. Vibration isolation platform; 2. Connecting frame; 3. First adjustment mechanism; 4. Adsorption platform; 5. Second adjustment mechanism; 6. Detection mechanism; 61. Mounting plate; 62. Infrared vision sensor; 63. Objective lens; 64. Infrared ring light source; 7. Test piece; 71. Carrier plate; 72. Blind hole; 73. Metal pattern; 8. 3D profiler. Specific implementation manner
[0035] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.
[0036] Referring to Figures 1-4 , an embodiment provided by the present invention: a detection device for layer deviation of an ABF carrier plate, including: a vibration isolation platform 1; a connecting frame 2 is arranged on one side of the vibration isolation platform 1; a first adjustment mechanism 3 is arranged above the vibration isolation platform 1, and an adsorption platform 4 is arranged on the first adjustment mechanism 3 to enable the adsorption platform 4 to reciprocate along the arrangement direction of the first adjustment mechanism 3; a second adjustment mechanism 5 is arranged on the connecting frame 2, and a detection mechanism 6 is arranged on the second adjustment mechanism 5 to enable the detection mechanism 6 to reciprocate along the arrangement direction of the second adjustment mechanism 5; the adsorption platform 4 places the test piece 7, and by adjusting the adsorption platform 4 and the detection mechanism 6, the blind hole on the test piece 7 is detected.
[0037] In this embodiment, the vibration isolation platform 1 is a marble vibration isolation platform, a connecting frame 2 is arranged above the vibration isolation platform, the connecting frame 2 is a marble gantry support, a first adjustment mechanism 3 is arranged on the vibration isolation platform 1 to drive the adsorption platform 4 to move in the horizontal direction and can move from below the connecting frame 2, and a second adjustment mechanism 5 is arranged on the front surface of the upper end of the connecting frame 2 to drive the detection mechanism 6 to move in the horizontal position along a direction perpendicular to the first adjustment mechanism 3 to adjust the relative position between the detection mechanism 6 and the test piece 7 on the adsorption platform 4, and the test piece is an ABF carrier plate.
[0038] The position of the workpiece 7 to be measured is flexibly adjusted by the first adjustment mechanism 3 and the second adjustment mechanism 5. The workpiece 7 to be measured can be detected by the detection mechanism 6, and the positions of the blind holes and metal patterns therein are identified and imaged, facilitating subsequent fitting calculations to obtain the offset of the blind holes.
[0039] The vibration isolation platform 1 is perpendicular to the connecting frame 2. The setting direction of the first adjustment mechanism 3 is perpendicular to the connecting frame 2, and the second adjustment mechanism 5 is parallel to the vibration isolation platform 1. The first adjustment mechanism 3 and the second adjustment mechanism 5 are linear motors for adjusting the relative position between the workpiece 7 to be measured and the detection mechanism 6, so that the workpiece 7 is moved below the detection mechanism 6 for photographing and identification.
[0040] The detection mechanism 6 includes a mounting plate 61. The mounting plate 61 is connected to the second adjustment mechanism 5. An infrared vision sensor 62 is provided on the mounting plate 61, and an objective lens 63 is provided below the infrared vision sensor 62.
[0041] In this embodiment, the detection mechanism 6 is connected to the second adjustment mechanism 5 through the mounting plate 61 to drive the infrared vision sensor 62 to move. The infrared vision sensor 62 is preferably an infrared camera with a pixel of 5 million, providing sufficient sampling resolution to meet the accuracy requirements for calculating the blind hole size and offset. An objective lens 63 is provided below the infrared vision sensor 62. Preferably, the objective lens 63 is a telecentric lens with a magnification of 4X and a distance of 63 mm from the workpiece 7 to be measured. Image data is obtained by photographing and identifying through the detection mechanism 6 (refer to Figure 4 ). Compared with the image data obtained by the existing photographing and identification (refer to Figure 3 ), the positions of the blind holes 72 and metal patterns 73 can be accurately identified.
[0042] An infrared ring light source 64 is provided below the mounting plate 61. The infrared vision sensor 62 detects the workpiece 7 below through the infrared ring light source 64.
[0043] An infrared ring light source 64 is provided below the mounting plate 61. It is an infrared ring light source with a distance of 20 mm from the workpiece 7 to be measured, and the workpiece 7 can be clearly imaged at the current position.
[0044] A 3D profiler 8 is also provided on the second adjustment mechanism 5.
[0045] The applicant also found in the research that due to reasons such as the shrinkage and expansion of the ABF substrate, the deviation of the laser position of the blind hole, and the positioning accuracy of the platform, when the traditional 3D profiler measures the 3D dimensions (upper and lower hole diameters, depth, roundness, roughness, etc.) of the blind hole, it is necessary to first use a low-magnification objective lens (such as a 5X objective lens) for rough positioning through autofocus and image recognition, and then switch to a measurement objective lens such as a 50X objective lens to measure the blind hole dimensions using techniques such as confocal or interference. This rough positioning method is slow and inefficient. Since there are a large number of blind holes with the same shape on the surface of the ABF substrate, there are multiple blind holes in the field of view of the low-magnification objective lens (5X objective lens), and it is impossible to distinguish which one is the blind hole to be measured through ordinary methods, and it is easy to identify and locate a non-measured hole.
[0046] The detection device designed according to this embodiment is also provided with a 3D profiler. In this embodiment, a 3D profiler 8 can also be set on the second adjustment mechanism 5. The blind hole 72 on the workpiece to be measured 7 is directly moved to the center of the field of view of the 50X objective lens of the 3D profiler 8 through the first adjustment mechanism 3 and the second adjustment mechanism 5, and the dimensions of the blind hole 72 are measured by confocal or white light interference. The time for the 3D profiler 8 to use the low-magnification objective lens for autofocus and switch the objective lens back and forth is saved.
[0047] Refer to Figure 2 , the workpiece to be measured 7 includes a substrate 71, and a plurality of blind holes 72 are formed on the substrate 71, and a metal pattern 73 is arranged below the blind hole 72.
[0048] In this embodiment, the substrate 71 is formed by preparing an ABF film material. A plurality of blind holes 72 are formed on the substrate 71, and a metal pattern 73 is arranged below the blind hole 72. The material of the metal pattern 73 is copper and is used for electrical connection.
[0049] Refer to Figure 5 , there is also an embodiment of a detection method for the layer deviation of the ABF substrate. The detection method is applicable to the detection device in any of the above technical solutions, including:
[0050] S1: According to the coordinates of the blind hole at the workpiece to be measured, control the first adjustment mechanism and the second adjustment mechanism to move the blind hole below the detection mechanism;
[0051] S2: Take a picture of the blind hole to obtain image data, and determine the position of the metal pattern corresponding to the blind hole according to the image data;
[0052] S3: Fit and calculate the blind hole and the metal pattern to obtain the positions of the first center of the blind hole and the second center of the metal pattern, and calculate the blind hole offset and the offset direction as the layer deviation.
[0053] In this embodiment, the position of the blind hole 72 on the workpiece to be measured 7 is known. The coordinate information of the blind hole 72 in the coordinate system of the workpiece to be measured 7 can be obtained through the design drawing or measurement, and the first adjustment mechanism and the second adjustment mechanism are controlled to adjust the blind hole to move to the detection area below the detection mechanism 6.
[0054] After the blind hole 72 is located below the detection mechanism 6, the infrared vision sensor 62 in the detection mechanism 6 will take a picture of the blind hole 72 to obtain image data containing the blind hole 72, and the obtained image data is analyzed through an image processing algorithm. Optionally, the edge detection algorithm can be used to identify the edge of the blind hole 72 and find the position of the metal pattern corresponding to the blind hole in the image.
[0055] Refer to Figure 6 , after determining the positions of the blind hole 72 and the metal pattern 73 in the image, a fitting algorithm, such as the least squares method for fitting a circle, is used to fit the contours of the blind hole and the metal pattern, so as to calculate the position of the first center O1 of the blind hole 72 and the position of the second center O2 of the metal pattern 73, and the aperture value φ of the blind hole 72. After obtaining the positions of the two centers, by calculating the distance and angular relationship between the two centers in the coordinate system, the blind hole offset and the offset direction can be obtained.
[0056] According to the relative distance between the 3D profiler and the detection mechanism, the first adjustment mechanism and the second adjustment mechanism are controlled to move the blind hole below the 3D profiler to detect the size of the blind hole.
[0057] In this embodiment, the blind hole 72 on the workpiece to be measured 7 can also be directly moved to the center of the 50X objective lens field of view of the 3D profiler 8 through the 3D profiler 8, the first adjustment mechanism 3 and the second adjustment mechanism 5, and the size of the blind hole 72 is measured by means of confocal or white light interference. This saves the time for the 3D profiler 8 to perform autofocus with a low-power objective lens and switch the objective lens back and forth.
[0058] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.
[0059] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.
Claims
1. A detecting device for layer deviation of an ABF carrier board, characterized in that, Comprising: A vibration isolation platform (1); A connecting frame (2) is arranged on one side of the vibration isolation platform (1); A first adjustment mechanism (3) is arranged above the vibration isolation platform (1), and an adsorption platform (4) is arranged on the first adjustment mechanism (3) to enable the adsorption platform (4) to reciprocate along the arrangement direction of the first adjustment mechanism (3); A second adjustment mechanism (5) is arranged on the connecting frame (2), and a detection mechanism (6) is arranged on the second adjustment mechanism (5) to enable the detection mechanism (6) to reciprocate along the arrangement direction of the second adjustment mechanism (5); The adsorption platform (4) places the workpiece to be measured (7), and by adjusting the adsorption platform (4) and the detection mechanism (6), the blind hole on the workpiece to be measured (7) is detected.
2. The detection device according to claim 1, wherein: The vibration isolation platform (1) is perpendicularly arranged with the connecting frame (2), the arrangement direction of the first adjustment mechanism (3) is perpendicularly arranged with the connecting frame (2), and the second adjustment mechanism (5) is parallel to the vibration isolation platform (1).
3. The detection device according to claim 1, characterized in that: The detection mechanism (6) includes a mounting plate (61), the mounting plate (61) is connected with the second adjustment mechanism (5), an infrared vision sensor (62) is arranged on the mounting plate (61), and an objective lens (63) is arranged below the infrared vision sensor (62).
4. The detection device according to claim 3, characterized in that: An infrared ring light source (64) is arranged below the mounting plate (61), and the infrared vision sensor (62) detects the workpiece to be measured (7) below through the infrared ring light source (64).
5. The detection device according to claim 1, characterized in that: A 3D profiler (8) is also arranged on the second adjustment mechanism (5).
6. The detection device according to claim 1, wherein: The first adjustment mechanism (3) and the second adjustment mechanism (5) are linear motors.
7. The detection device according to claim 1, characterized in that: The workpiece to be measured (7) includes a carrier plate (71), a plurality of blind holes (72) are formed on the carrier plate (71), and a metal pattern (73) is arranged below the blind holes (72).
8. A method for detecting the layer shift of an ABF carrier board, characterized in that, The detection method is applicable to the detection device described in any one of the above claims 1-7, and includes: S1: According to the coordinates of the blind hole at the workpiece to be measured, control the first adjustment mechanism and the second adjustment mechanism to move the blind hole below the detection mechanism; S2: Take a picture of the blind hole to obtain image data, and determine the position of the metal pattern corresponding to the blind hole according to the image data; S3: Fit and calculate the blind hole and the metal pattern to obtain the positions of the first center of the blind hole and the second center of the metal pattern, and calculate the blind hole offset and the offset direction as the layer offset.
9. The detection method according to claim 8, characterized in that: It further includes, according to the relative distance between the 3D profiler and the detection mechanism, controlling the first adjustment mechanism and the second adjustment mechanism to move the blind hole below the 3D profiler to detect the size of the blind hole.
10. The detection method according to claim 8, wherein: The method for fitting and calculating the blind hole and the metal pattern includes: performing circle fitting using the least squares method according to the position of the blind hole and the position of the corresponding metal pattern.