Temperature monitoring device, method and system for chip testing

Abstract

The embodiment of the invention discloses a temperature monitoring device, method and system for a chip test, relates to the technical field of integrated circuits, and can be matched with an automatic classifier to effectively control the temperature of a chip in the test, so that the temperature of the tested chip cannot be out of control even if the automatic classifier is paused or fails. The device comprises a temperature acquisition module which is configured to acquire the chip temperature of a tested chip in a test; the control module is configured to acquire the chip temperature from the temperature acquisition module, pre-process the chip temperature and perform control operation according to a pre-processing result; wherein the control operation comprises at least one of the following operations: sending a target temperature to the automatic classifier, so that the automatic classifier performs temperature control on the tested chip according to the target temperature, and the target temperature is related to the chip temperature; and sending test termination indication information to the preset object, so that the preset object terminates the chip test. The method can be used in chip testing.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuits, and in particular, to a temperature monitoring device, method and system for chip testing. Background Art

[0002] In the automatic test equipment (ATE) test and system level test (SLT) of chips, the chips under test are often in a state of high power consumption and high heat generation. Therefore, precise and effective control of the test temperature will directly affect the test yield, test cost, and even test safety.

[0003] In the related art, temperature control is usually implemented by an automatic sorter (handler). However, the automatic sorter has complex functions, and temperature control is just one of many functions. If the automatic sorter pauses or malfunctions due to certain reasons, the chip temperature control will also be affected, which is likely to lead to out-of-control test temperature, affecting the test yield, test cost, and test safety.

[0004] In view of the problem that once the automatic sorter pauses or malfunctions during chip testing, it is likely to cause out-of-control chip test temperature, there is no effective solution in the related art. Summary of the Invention

[0005] In view of this, embodiments of the present invention provide a temperature monitoring device, method and system for chip testing, which can effectively control the temperature of the chip under test in cooperation with the automatic sorter, and even if the automatic sorter pauses or malfunctions, the temperature of the chip under test will not get out of control.

[0006] In a first aspect, an embodiment of the present invention provides a temperature monitoring device for chip testing, including: a temperature acquisition module configured to acquire the chip temperature of the chip under test during testing; a control module configured to obtain the chip temperature from the temperature acquisition module, preprocess the chip temperature, and perform a control operation according to the preprocessing result, where the control operation includes at least one of the following: sending a target temperature to the automatic sorter so that the automatic sorter controls the temperature of the chip under test according to the target temperature, and the target temperature is related to the chip temperature; sending a test termination indication message to a preset object so that the preset object terminates the chip test, and the preset object includes the chip under test or the testing machine.

[0007] In one embodiment, the control module includes: a first comparison sub-module configured to compare the chip temperature with a first temperature threshold; a first sending sub-module configured to send the test termination indication information to the preset object when the chip temperature is greater than or equal to the first temperature threshold.

[0008] In one embodiment, the control module includes: a detection sub-module configured to detect a parameter value of a pre-cooling indication parameter; a second comparison sub-module configured to compare the chip temperature with a second temperature threshold when the pre-cooling indication parameter is a first value; a determination sub-module configured to determine the target temperature according to the chip temperature and the comparison result of the second comparison sub-module; a second sending sub-module configured to send the target temperature to the automatic sorter so that the automatic sorter controls the temperature of the chip under test according to the target temperature.

[0009] In one embodiment, the determination sub-module is configured to: when the chip temperature is greater than or equal to the second temperature threshold, add the chip temperature to a preset temperature to obtain the target temperature, where the preset temperature is greater than 0; or, when the chip temperature is less than the second temperature threshold, determine the chip temperature as the target temperature.

[0010] In one embodiment, the value range of the preset temperature is from 5 degrees Celsius to 30 degrees Celsius.

[0011] In one embodiment, the determination sub-module is further configured to determine the chip temperature as the target temperature when the pre-cooling indication parameter is a second value.

[0012] In one embodiment, the control module is further configured to transmit the chip temperature to a display device so that the display device displays the chip temperature.

[0013] In one embodiment, the chip temperature is displayed in the form of a temperature curve.

[0014] In one embodiment, the control module is further configured to transmit the chip temperature to a storage device so that the storage device stores the chip temperature.

[0015] In one embodiment, the chip temperature includes a first temperature and / or a second temperature, the first temperature is the temperature of the chip housing; the second temperature is the temperature inside the chip; the control module is configured to any one of the following: obtain the first temperature from the temperature acquisition module; obtain the second temperature from the temperature acquisition module; obtain the first temperature and the second temperature from the temperature acquisition module in a polling manner.

[0016] In one embodiment, the number of the second temperatures is at least one, and the number of the second temperatures is related to the number of processor cores in the chip under test; the control module is configured to respectively obtain each of the second temperatures from the temperature acquisition module, select the maximum value from the second temperatures for preprocessing, and perform the control operation according to the preprocessing result.

[0017] In a second aspect, an embodiment of the present invention further provides a temperature monitoring method for chip testing, including: obtaining the chip temperature of the chip under test during the test; preprocessing the chip temperature; performing a control operation according to the preprocessing result; where the control operation includes at least one of the following: sending a target temperature to an automatic sorter to enable the automatic sorter to perform temperature control on the chip under test according to the target temperature, and the target temperature is related to the chip temperature; sending a test termination indication message to a preset object to enable the preset object to terminate the chip test, and the preset object includes the chip under test or a testing machine.

[0018] In one embodiment, the preprocessing of the chip temperature includes: comparing the chip temperature with a first temperature threshold; and in the case where the chip temperature is greater than or equal to the first temperature threshold, sending the test termination indication message to the preset object.

[0019] In one embodiment, the preprocessing of the chip temperature includes: detecting a parameter value of a pre-cooling indication parameter; in the case where the pre-cooling indication parameter is a first value, comparing the chip temperature with a second temperature threshold; determining the target temperature according to the chip temperature and the comparison result between the chip temperature and the second temperature threshold; and sending the target temperature to the automatic sorter to enable the automatic sorter to perform temperature control on the chip under test according to the target temperature.

[0020] In one embodiment, the determining the target temperature according to the chip temperature and the comparison result between the chip temperature and the second temperature threshold includes: in the case where the chip temperature is greater than or equal to the second temperature threshold, adding the chip temperature to a preset temperature to obtain the target temperature, where the preset temperature is greater than 0; or, in the case where the chip temperature is less than the second temperature threshold, determining the chip temperature as the target temperature.

[0021] In one embodiment, the value range of the preset temperature is from 5 degrees Celsius to 30 degrees Celsius.

[0022] In one embodiment, after detecting the parameter value of the pre-cooling indication parameter, the method further includes: when the pre-cooling indication parameter is the second value, determining the chip temperature as the target temperature.

[0023] In one embodiment, after obtaining the chip temperature of the chip under test during the test, the method further includes: transmitting the chip temperature to a display device so that the display device displays the chip temperature.

[0024] In one embodiment, the chip temperature is displayed in the form of a temperature curve.

[0025] In one embodiment, after obtaining the chip temperature of the chip under test during the test, the method further includes: transmitting the chip temperature to a storage device so that the storage device stores the chip temperature.

[0026] In one embodiment, the chip temperature includes a first temperature and / or a second temperature. The first temperature is the temperature of the chip housing; the second temperature is the temperature inside the chip; obtaining the chip temperature of the chip under test during the test includes any one of the following: obtaining the first temperature; obtaining the second temperature; polling to obtain the first temperature and the second temperature.

[0027] In one embodiment, the number of the second temperatures is at least one, and the number of the second temperatures is related to the number of processor cores in the chip under test; obtaining the chip temperature of the chip under test during the test includes: respectively obtaining each of the second temperatures, selecting the maximum value from each of the second temperatures for preprocessing, and performing the control operation according to the preprocessing result.

[0028] In a third aspect, an embodiment of the present invention further provides a temperature monitoring system for chip testing, including: a temperature monitoring device, where the temperature monitoring device includes any one of the temperature monitoring devices for chip testing provided by the embodiments of the present invention; an automatic sorter, electrically connected to the temperature monitoring device, and configured to perform temperature control on the chip under test according to the target temperature output by the temperature monitoring device.

[0029] In a fourth aspect, an embodiment of the present invention further provides a chip testing system, including: a tester, a temperature monitoring device, and an automatic sorter; the tester is configured to test the chip under test or terminate the test of the chip under test according to the indication of the temperature monitoring device; the temperature monitoring device is electrically connected to the tester, and the temperature monitoring device includes any one of the temperature monitoring devices for chip testing provided by the embodiments of the present invention; the automatic sorter is electrically connected to the temperature monitoring device and is configured to perform temperature control on the chip under test according to the target temperature output by the temperature monitoring device.

[0030] In a fifth aspect, an embodiment of the present invention further provides an electronic device, which includes: a processor and a memory, the processor being electrically connected to the memory; the memory is used to store executable program codes; the processor runs a program corresponding to the executable program codes by reading the executable program codes stored in the memory to implement any one of the temperature monitoring methods for chip testing provided by the embodiments of the present invention.

[0031] In a sixth aspect, an embodiment of the present invention further provides a computer-readable storage medium, characterized in that the computer-readable storage medium stores one or more programs, and the one or more programs can be executed by one or more processors to implement any one of the temperature monitoring methods for chip testing provided by the embodiments of the present invention.

[0032] For the temperature monitoring device, method and system for chip testing provided by the embodiments of the present invention, the temperature acquisition module can acquire the chip temperature of the chip under test during the test, and the control module can obtain the chip temperature from the temperature acquisition module and preprocess the chip temperature, and perform control operations according to the preprocessing results. Since the control operations can include sending a target temperature to an automatic sorter to enable the automatic sorter to perform temperature control on the chip under test according to the target temperature, or can include sending a test termination instruction message to a preset object to enable the preset object to terminate the chip test. In this way, the temperature monitoring device can cooperate with the automatic sorter to effectively control the temperature of the chip under test. Even if the automatic sorter pauses or fails, it can also send a test termination instruction message to the preset object when needed according to the preprocessing results of the chip temperature to terminate the chip test, thereby effectively avoiding the out-of-control of the chip temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained according to these drawings without creative efforts.

[0034] Figure 1 FIG. is a schematic structural diagram of a temperature monitoring device for chip testing provided by an embodiment of the present invention; Figure 2 FIG. is another schematic structural diagram of a temperature monitoring device for chip testing provided by an embodiment of the present invention; Figure 3 FIG. is still another schematic structural diagram of a temperature monitoring device for chip testing provided by an embodiment of the present invention; Figure 4 A schematic diagram of the connection relationship between the temperature monitoring device and other devices in the embodiment of the present invention; Figure 5 For Figure 4 A flowchart of temperature control by the temperature monitoring device in the shown embodiment; Figure 6 For Figure 4 Another flowchart of temperature control by the temperature monitoring device in the shown embodiment; Figure 7 For Figure 4 Another flowchart of temperature control by the temperature monitoring device in the shown embodiment; Figure 8 For Figure 4 Another flowchart of temperature control by the temperature monitoring device in the shown embodiment; Figure 9 For Figure 4 A flowchart of temperature display by the temperature monitoring device in the shown embodiment; Figure 10 A flowchart of the temperature monitoring method for chip testing provided by the embodiment of the present invention; Figure 11 A schematic structural diagram of the temperature monitoring system for chip testing provided by the embodiment of the present invention; Figure 12 A schematic structural diagram of the chip testing system provided by the embodiment of the present invention; Figure 13 A schematic structural diagram of the electronic device provided by the embodiment of the present invention. Detailed implementation manners

[0035] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0036] It should be clear that the described embodiments are only a part of the embodiments of the present invention, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without any creative work belong to the scope of protection of the present invention.

[0037] In a first aspect, the embodiment of the present invention provides a temperature monitoring device for chip testing, which can effectively control the temperature of the chip under test in cooperation with an automated sorter. Even if the automated sorter pauses or malfunctions, the temperature of the chip under test will not get out of control.

[0038] As Figure 1 shown, the embodiment of the present invention provides a temperature monitoring device 1 for chip testing, including: A temperature acquisition module 11, configured to acquire the chip temperature of the chip under test 2 during testing; The control module 12 is configured to obtain the chip temperature from the temperature acquisition module 11 and preprocess the chip temperature, and perform control operations according to the preprocessing results; wherein, the control operations include at least one of the following: sending a target temperature to the automatic sorter 3 to enable the automatic sorter 3 to perform temperature control on the device under test chip 2 according to the target temperature, where the target temperature is related to the chip temperature; sending a test termination indication message to a preset object to enable the preset object to terminate the chip test, and the preset object includes the device under test chip 2 or the tester 4.

[0039] In the temperature monitoring device 1 for chip testing provided by the embodiments of the present invention, its temperature acquisition module 11 can acquire the chip temperature of the device under test chip 2 during the test, and its control module 12 can obtain the chip temperature from the temperature acquisition module 11 and preprocess the chip temperature, and perform control operations according to the preprocessing results. Since the control operations can include sending a target temperature to the automatic sorter 3 to enable the automatic sorter 3 to perform temperature control on the device under test chip 2 according to the target temperature, or can also include sending a test termination indication message to a preset object to enable the preset object to terminate the chip test, in this way, the temperature monitoring device 1 can cooperate with the automatic sorter 3 to perform effective temperature control on the device under test chip 2. Even if the automatic sorter pauses or fails, it can also send a test termination indication message to the preset object when needed according to the preprocessing results of the chip temperature to terminate the chip test, thereby effectively avoiding the out-of-control of the chip temperature.

[0040] In the embodiments of the present invention, the control module 12 can be connected to the temperature acquisition module 11. Optionally, this connection can include both electrical connection and communication connection.

[0041] For the sake of easy understanding, first, a brief description of the test environment of the device under test chip is given. As Figure 1 shown, during the test of the device under test chip 2, the device under test chip 2 can be set on the tester 4 or on a circuit board. The tester 4 can communicate with the device under test chip 2 to test the device under test chip 2. During the test, the operation of the device under test chip 2 may cause high power consumption and high heat generation. For this reason, the temperature monitoring device 1 can acquire the chip temperature of the device under test chip 2, preprocess the chip temperature, and cooperate with the automatic sorter 3 to achieve temperature control of the device under test chip 2.

[0042] Specifically, in the embodiments of the present invention, the temperature acquisition module 11 may include various devices, circuits, chips, etc. that can obtain the temperature of the chip 2 to be measured. In an embodiment of the present invention, a temperature sensor may be provided on the surface or inside of the chip 2 to be measured, and the temperature acquisition module 11 may be various devices, circuits or chips that can communicate with these temperature sensors to obtain the chip temperature. Optionally, different temperature sensors may perform temperature acquisition through the same temperature acquisition module 11 or through different temperature acquisition modules 11. The embodiments of the present invention do not limit this. Exemplarily, in an example, the temperature sensor provided on the surface of the chip 2 to be measured may include, for example, a thermocouple, etc., and the temperature acquisition module 11 corresponding to this temperature sensor may include, for example, a max31856 chip; the temperature sensor provided inside the chip may include, for example, a temperature triode, etc., and the temperature acquisition module 11 corresponding to this temperature sensor may include an EMC1412 chip.

[0043] Since the positions and types of temperature sensors in the chip are different, the temperatures sensed by different temperature sensors are also correspondingly different. Based on this, the chip temperatures acquired by the temperature acquisition module 11 are also different. For example, in an embodiment of the present invention, the chip temperatures acquired by the temperature acquisition module 11 may include a first temperature and / or a second temperature, where the first temperature is the temperature of the chip housing, and the second temperature is the temperature inside the chip. Then, based on this, the control module 12 may be configured as any one of the following: obtaining the first temperature from the temperature acquisition module 11; obtaining the second temperature from the temperature acquisition module 12; polling to obtain the first temperature and the second temperature from the temperature acquisition module 11. That is to say, in the embodiments of the present invention, according to the needs of temperature control, either only the first temperature of the chip housing can be read, or only the second temperature inside the chip can be read, or the first temperature and the second temperature can be read alternately. The embodiments of the present invention do not limit this.

[0044] In the embodiments of the present invention, the number of internal temperature sensors of the chip 2 to be measured may be at least one, and each temperature sensor may be dispersed at different positions inside the chip 2 to be measured, so as to be able to monitor the chip temperature of the chip 2 to be measured more comprehensively. Then, based on this, the number of the second temperatures may also be at least one, and the number of the second temperatures may correspond to the number of internal temperature sensors of the chip 2 to be measured.

[0045] In one example, the number of the second temperatures may be related to the number of processor cores in the chip under test 2. For example, a temperature sensor may be set in each processor core to obtain a corresponding second temperature. In this way, the chip temperature near each processor core can be measured separately, so as to measure the temperature at different heat - generating positions in the chip under test 2, making the measurement faster and the obtained chip temperature more accurate. Based on this, the control module 12 may be configured to respectively obtain each second temperature from the temperature acquisition module 11, select the maximum value from each second temperature for pre - processing, and perform control operations according to the pre - processing results. For example, in one example, for a chip under test 2 with 4 processor cores, each second temperature may include: 60 degrees Celsius, 75 degrees Celsius, 80 degrees Celsius, 92 degrees Celsius. Then the control module 12 may pre - process the maximum value of 92 degrees Celsius among them and perform control operations according to the pre - processing results.

[0046] The control module 12 may include various circuits or chips with control functions. For example, the control module 12 may include various single - chip microcomputers, MCUs (Micro Controller Unit), FPGAs (Field Programmable Gate Array), CPLDs (Complex Programmable Logic Device), etc. Optionally, when performing control operations, the control module 12 may execute different control operations according to different chip temperatures. Exemplarily, in some cases, the control module 12 may stop the test in time when the chip temperature is too high. In other cases, the control module 12 may cooperate with the automatic sorter 3 to control the chip temperature.

[0047] Specifically, as Figure 2As shown, in one embodiment of the present invention, the control module 12 may include a first comparison sub-module 121 and a first transmission sub-module 122. Among them, the first comparison sub-module 121 may be configured to compare the chip temperature collected by the temperature acquisition module 11 with a first temperature threshold; the first transmission sub-module 122 may be configured to, when the chip temperature is greater than or equal to the first temperature threshold, send test termination indication information to a preset object to cause the preset object to terminate the chip test. Among them, the preset object may include the chip under test, or may include a tester, where the tester may be either a test host or an automatic test equipment. That is to say, in this embodiment, when the chip temperature is greater than or equal to the first temperature threshold, the control module 12 may terminate the test, thereby avoiding damage to the chip due to excessive temperature. Among them, the first temperature threshold may be the highest temperature that the chip can withstand, and the specific value may be set and adjusted as needed. For example, in one example, the first temperature threshold may be 120 degrees Celsius.

[0048] As Figure 3 shown, in another embodiment of the present invention, the control module 12 may include a detection sub-module 123, a second comparison sub-module 124, a determination sub-module 125, and a second transmission sub-module 126. Among them, the detection sub-module 123 may be configured to detect the parameter value of the pre-cooling indication parameter; the second comparison sub-module 126 may be configured to compare the chip temperature with a second temperature threshold when the pre-cooling indication parameter is a first value, where the second temperature threshold may be less than the first temperature threshold; the determination sub-module 125 may be configured to determine the target temperature according to the chip temperature and the comparison result of the second comparison sub-module 124; the second transmission sub-module 126 may be configured to send the target temperature to the automatic sorter 3 to cause the automatic sorter 3 to perform temperature control on the chip under test 2 according to the target temperature.

[0049] In this embodiment, the pre-cooling indication parameter may be used to indicate whether pre-cooling operation of the chip is allowed. The pre-cooling indication parameter may be a variable or a control bit of a register. In the embodiments of the present invention, the pre-cooling operation may be used in such a situation: the current temperature of the chip under test 2 is stable and no cooling operation is required, but the chip under test 2 is about to load a high-speed program or a large load, and the chip temperature will rise sharply accordingly. To avoid too rapid a rise in the chip temperature and insufficient time for cooling, the chip under test can be pre-cooled before the chip temperature rises sharply. In this way, even if the chip temperature rises sharply subsequently, the highest temperature reached will not cause damage to the chip under test 2. That is to say, in the embodiments of the present invention, the pre-cooling operation can obtain a sufficient chip temperature soaring buffer zone to prevent test failure caused by instantaneous soaring of chip power consumption and temperature.

[0050] In specific implementation, the parameter value of the pre-cooling indication parameter may include a first value or a second value, and the first value is different from the second value. When the pre-cooling indication parameter is the first value, it may indicate that pre-cooling operation is allowed for the chip under test. When the pre-cooling indication parameter is the second value, it may indicate that pre-cooling operation is not allowed for the chip under test. When testing the chip under test, the parameter value of the preset temperature indication parameter can be set and adjusted according to the operating conditions and load conditions of the chip under test. For example, under normal circumstances, the preset temperature indication parameter can be set to the second value, and pre-cooling operation is not allowed for the chip under test. When it is detected that a high-speed program or high-power load is about to be loaded, the preset temperature indication parameter can be set to the first value, and pre-cooling operation is allowed for the chip under test.

[0051] Further, when the pre-cooling indication parameter is the first value, the second comparison sub-module 124 can compare the chip temperature with a second temperature threshold. The second temperature threshold may be equal to the chip temperature corresponding to the relatively stable operating state of the chip under test 2, such as 60 degrees Celsius, 65 degrees Celsius, etc. The determination sub-module 125 can determine the target temperature according to the comparison result of the second comparison sub-module 124.

[0052] Specifically, in an embodiment of the present invention, the determination sub-module 125 may be configured to: when the chip temperature is greater than or equal to the second temperature threshold, add the chip temperature to the preset temperature to obtain the target temperature, where the preset temperature is greater than 0. That is to say, in this embodiment, when pre-cooling is allowed for the chip under test, if the chip temperature is already greater than or equal to the second temperature threshold, the preset temperature can be added to the current chip temperature to obtain the target temperature. Since the preset temperature is greater than 0, the target temperature will be higher than the chip temperature. In this way, after sending the target temperature to the automatic sorter 3, the automatic sorter 3 will perform temperature control on the chip under test based on the target temperature. For example, when the target temperature reaches the temperature threshold (such as the temperature threshold of 70 degrees Celsius) set by the automatic sorter 3 for cooling operation, the actual temperature of the chip under test does not reach this temperature threshold (the chip temperature is, for example, 60 degrees Celsius, and the preset temperature is, for example, 10 degrees Celsius), that is, pre-cooling operation is performed on the chip under test in advance, so as to achieve pre-cooling of the chip under test.

[0053] Optionally, in another embodiment of the present invention, the determination sub-module 125 may be configured to: when the chip temperature is less than the second temperature threshold, determine the chip temperature as the target temperature. That is to say, if the current chip temperature has not reached the second temperature threshold, it means that the temperature of the chip under test 2 is at a relatively low level at this time. It is not necessary to add the preset temperature to the chip temperature temporarily, but directly determine the chip temperature as the target temperature to avoid the pre-cooling operation from reducing the chip temperature too low.

[0054] In an embodiment of the present invention, the specific value of the preset temperature can be set and adjusted according to the estimated sharpness of the temperature rise of the chip under test and the duration of the temperature rise. Exemplarily, in one example, the value range of the preset temperature can be from 5 degrees Celsius to 30 degrees Celsius.

[0055] The foregoing embodiments have detailed how the determination sub-module 125 determines the target temperature when the pre-cooling indication parameter is the first value, that is, when pre-cooling of the chip under test is allowed. However, the embodiments of the present invention are not limited thereto. In other embodiments of the present invention, the pre-cooling indication parameter can be the second value. In this case, the determination sub-module 125 can also determine the target temperature. For example, in an embodiment of the present invention, the determination sub-module 125 can also be configured to determine the chip temperature as the target temperature when the pre-cooling indication parameter is the second value. That is to say, when pre-cooling of the chip under test is not allowed, the chip temperature can be transmitted to the automatic sorter 3 as the target temperature, so that the automatic sorter 3 controls the temperature of the chip under test 2 according to the target temperature.

[0056] Furthermore, in an embodiment of the present invention, the temperature monitoring device for chip testing can not only cooperate with the automatic sorter 3 to control the chip temperature, but also monitor the chip temperature in other ways.

[0057] For example, in an embodiment of the present invention, the control module 12 can also be configured to transmit the chip temperature to a display device so that the display device displays the chip temperature. In this way, the chip temperature can be prominently and intuitively displayed through the display device, which is convenient for the user to quickly view. Compared with the prior art, when viewing the chip temperature through the automatic sorter 3, it is necessary to operate in a complex interface menu, which can greatly improve the viewing efficiency of the user for the chip temperature.

[0058] In an embodiment of the present invention, the chip temperature can be displayed in various ways such as numbers, charts, etc. Exemplarily, in one example, the chip temperature can be displayed in the form of a temperature curve. Displaying the chip temperature in the form of a temperature curve can allow the user to understand the temperature change of the chip during the entire test process, and can also determine whether there is an obstacle to the heat conduction of the chip under test 2 by comparing the temperature curve of the first temperature with the temperature curve of the second temperature.

[0059] Furthermore, in another embodiment of the present invention, the control module 12 can also be configured to transmit the chip temperature to a storage device so that the storage device stores the chip temperature, thereby facilitating the test engineer to trace the temperature change of the abnormal chip under test. Among them, the storage device can include various disks or memory cards, and the embodiments of the present invention do not limit this.

[0060] Exemplarily, the connection relationship between the temperature monitoring device for chip testing and other devices during chip testing can be as Figure 4 shown. Among them: The Tcase temperature, i.e., the first temperature, is the temperature of the chip housing sensed by using a T-type thermocouple.

[0061] The Tj temperature, i.e., the second temperature, is the temperature sensed by the temperature triode in the chip under test 2, also known as the junction temperature.

[0062] MCU: That is, the control module 12, which is used for data acquisition, processing, display, storage, or forwarding, etc.

[0063] MAX31856 chip: That is, a temperature acquisition module, which is used to acquire and store the Tcase temperature on the T-type thermocouple and is electrically connected to the control module 12 through the Serial Peripheral Interface (SPI) P1 bus.

[0064] EMC1412 chip: That is, another temperature acquisition module, which is used to acquire the temperature sensed by the temperature triode and is electrically connected to the MCU through the SMBus.

[0065] Handler temperature receiver (or Handler temperature controller): That is, the interface of the automatic sorter 3 (for example, it can be an RS232 serial port) and is electrically connected to the serial port R1 of the MCU.

[0066] Motherboard serial port: It is electrically connected to the serial port R2 of the MUC, receives commands from the SLT motherboard, such as switching to read the Tcase temperature or the Tj junction temperature, etc.

[0067] SD card: A memory card, which is electrically connected to the MCU through the Serial Peripheral Interface P2 interface and can store historical temperature records in the CSV (Comma Separated Values) format, facilitating the direct export of the temperature curve using Excel.

[0068] LCD screen: A display device, which is electrically connected to the MCU through the 8080 parallel port and can display information such as the chip temperature on the screen.

[0069] Based on the above connection relationship, the temperature monitoring device can perform corresponding control on the chip temperature.

[0070] Exemplarily, in the case where pre-cooling is not allowed, the temperature monitoring process of this temperature monitoring device can be as Figure 5 shown. As Figure 5 shown, the work process starts from receiving the SLT motherboard command at the serial port R2: Received Tcase temperature control command: The MCU reads the Tcase thermocouple temperature in the MAX31856 register through the Serial Peripheral Interface P1 bus, then transmits the Tcase temperature to the Handler temperature controller in a predefined format through the serial port R1, and at the same time displays the Tcase temperature on the LCD screen. This process repeats cyclically to achieve Tcase temperature control until the next new command is received.

[0071] Received Tj temperature control command: The SMBus bus of the MCU is connected to the Tj junction temperature plug on the SLT motherboard (for example, the junction temperature plug is provided by the chip EMC1412 on the motherboard), and the Tj junction temperature of the chip under test is read. Then the Tj junction temperature is transmitted to the Handler temperature controller in a predefined format through the serial port R1, and at the same time the Tj junction temperature is displayed on the LCD screen. This process repeats cyclically to achieve Tj junction temperature control until the next new command is received.

[0072] Received temperature recording command: If in the Tcase temperature control mode at this time, the Tcase temperature is displayed on the LCD screen and transmitted through the serial port R1, and the Tcase temperature is recorded on the SD card. If in the Tj temperature control mode at this time, the Tj temperature is displayed on the LCD screen and transmitted through the serial port R1, and the Tj temperature is recorded on the SD (Secure Digital) card. This process repeats cyclically to record the temperature change process until the stop temperature recording command is received.

[0073] The process of reading multiple second temperatures can be as Figure 6 shown. For large chips with multiple cores, each core has its own Tj junction temperature. By sequentially reading the Tj junction temperature of each core, the highest junction temperature is selected. It is transmitted to the Handler temperature controller in a predefined format through the serial port R1, and at the same time the highest Tj junction temperature is displayed on the LCD screen. This process repeats cyclically to achieve the highest Tj junction temperature control until the next new command is received. This working method can ensure that the internal maximum temperature of large chips with multiple cores does not exceed the preset value.

[0074] The over-temperature alarm process can be as Figure 7 shown. In this embodiment, the over-temperature threshold (i.e., the first temperature threshold) can be sent through the SLT motherboard and then stored in the over-temperature register. After each time the Tj / Tcase temperature is read, it will be compared with the over-temperature threshold in the over-temperature register. If the actual temperature read exceeds the over-temperature threshold, the alarm information will be sent to the SLT motherboard through the serial port R2. The SLT motherboard will stop the test in time to protect from being damaged by high temperature.

[0075] The pre-cooling process can be as Figure 8As shown in the figure, the pre-drop temperature (i.e., the preset temperature mentioned above) can be written into the pre-drop temperature register first. If the obtained actual Tj / Tcase temperature is greater than the second temperature threshold, the target temperature is obtained by adding the pre-drop temperature to the obtained actual Tj / Tcase temperature, and the target temperature is transmitted to the Handler temperature control. After receiving the higher temperature, the Handler temperature controller will start the cooling operation until the received target temperature is lower than the cooling threshold of the handler. This function can be used before the chip power consumption soars, preventing the temperature from soaring caused by the soaring power consumption, thereby causing the chip test to fail.

[0076] The temperature curve display process can be as Figure 9 shown. The temperature curve plotting function can help users understand the temperature change of the chip during the entire test process, and can also judge whether there is an obstacle to heat conduction by comparing the Tcase vs Tj temperature curves.

[0077] In a second aspect, an embodiment of the present invention provides a temperature monitoring method for chip testing, which can effectively control the temperature of the chip under test in cooperation with an automatic sorter. Even if the automatic sorter pauses or fails, the temperature of the chip under test will not get out of control.

[0078] As Figure 10 shown, the temperature monitoring method for chip testing provided by the embodiment of the present invention may include: S61. Obtain the chip temperature of the chip under test during the test; S62. Preprocess the chip temperature; S63. Perform a control operation according to the preprocessing result; wherein, the control operation includes at least one of the following: sending a target temperature to the automatic sorter so that the automatic sorter controls the temperature of the chip under test according to the target temperature, and the target temperature is related to the chip temperature; sending a test termination instruction message to a preset object so that the preset object terminates the chip test, and the preset object includes the chip under test or the testing machine.

[0079] The temperature monitoring method for chip testing provided by the embodiments of the present invention can obtain the chip temperature of the chip under test during the test, preprocess the chip temperature, and perform control operations according to the preprocessing results. Since the control operations can include sending a target temperature to an automated sorter to enable the automated sorter to perform temperature control on the chip under test according to the target temperature, or can include sending a test termination instruction message to a preset object to enable the preset object to terminate the chip test. In this way, the temperature monitoring device can cooperate with the automated sorter to effectively control the temperature of the chip under test. Even if the automated sorter pauses or malfunctions, it can send a test termination instruction message to the preset object when needed according to the preprocessing results of the chip temperature to terminate the chip test, thereby effectively avoiding the out-of-control of the chip temperature.

[0080] In an embodiment of the present invention, a temperature sensor can be provided on the surface or inside of the chip under test. Since the position and type of the temperature sensor in the chip are different, the temperatures sensed by different temperature sensors are also correspondingly different. Correspondingly, the collected chip temperatures are also different.

[0081] For example, in an embodiment of the present invention, the obtained chip temperature can include a first temperature and / or a second temperature. Among them, the first temperature is the temperature of the chip housing, and the second temperature is the temperature inside the chip. Based on this, obtaining the chip temperature of the chip under test during the test can include any one of the following: obtaining the first temperature; obtaining the second temperature; polling to obtain the first temperature and the second temperature. That is to say, in the embodiments of the present invention, according to the needs of temperature control, only the first temperature of the chip housing can be read, only the second temperature inside the chip can be read, or the first temperature and the second temperature can be read alternately. The embodiments of the present invention do not limit this.

[0082] In the embodiments of the present invention, the number of internal temperature sensors of the chip under test can be at least one, and each temperature sensor can be dispersed at different positions inside the chip under test, so as to be able to monitor the chip temperature of the chip under test more comprehensively. Based on this, the number of the second temperatures can also be at least one, and the number of the second temperatures can correspond to the number of internal temperature sensors of the chip under test.

[0083] In one example, the number of second temperatures can be related to the number of processor cores in the chip under test. For example, a temperature sensor can be set in each processor core to obtain a corresponding second temperature. In this way, the chip temperature near each processor core can be measured separately, so as to measure the temperature at different heat - generating positions in the chip under test, making the measurement faster and the obtained chip temperature more accurate. Based on this, obtaining the chip temperature of the chip under test during the test can include: separately obtaining each second temperature, selecting the maximum value from each second temperature for pre - processing, and performing a control operation according to the pre - processing result.

[0084] Optionally, when performing the control operation, different control operations can be executed according to different chip temperatures. Exemplarily, in some cases, the test can be stopped in time when the chip temperature is too high. In other cases, it can cooperate with an automatic sorter to control the chip temperature.

[0085] Specifically, in one implementation, step S62 for pre - processing the chip temperature can include: comparing the chip temperature with a first temperature threshold; in the case where the chip temperature is greater than or equal to the first temperature threshold, sending the test termination indication information to the preset object to cause the preset object to terminate the chip test. The preset object can include the chip under test or the testing machine. The testing machine can be either the main testing machine or the automatic testing equipment. That is to say, in this embodiment, the test can be terminated when the chip temperature is greater than or equal to the first temperature threshold, thus avoiding damage due to too high chip temperature. The first temperature threshold can be the highest temperature that the chip can withstand, and the specific value can be set and adjusted as needed. For example, in one example, the first temperature threshold can be 120 degrees Celsius.

[0086] In one implementation, step S62 for pre - processing the chip temperature can include: detecting the parameter value of the pre - cooling indication parameter; in the case where the pre - cooling indication parameter is the first value, comparing the chip temperature with a second temperature threshold, where the second temperature threshold can be less than the first temperature threshold; determining the target temperature according to the chip temperature and the comparison result of the chip temperature with the second temperature threshold; sending the target temperature to the automatic sorter to cause the automatic sorter to control the temperature of the chip under test according to the target temperature.

[0087] In this embodiment, the pre-cooling indication parameter can be used to indicate whether pre-cooling operation is allowed for the chip. The pre-cooling indication parameter can be a variable or a control bit of a register. In the embodiments of the present invention, the pre-cooling operation can be used in such a situation: the current temperature of the chip under test is stable and no cooling operation is required, but the chip under test is about to load a high-speed program or a large load, and the chip temperature will rise sharply accordingly. To avoid too rapid a rise in the chip temperature and lack of time for cooling, the chip under test can be cooled in advance before the chip temperature rises sharply. In this way, even if the chip temperature rises sharply subsequently, the maximum temperature reached will not damage the chip under test. That is to say, in the embodiments of the present invention, the pre-cooling operation can obtain a sufficient chip temperature soaring buffer zone to prevent test failures caused by instantaneous soar of chip power consumption and temperature.

[0088] In specific implementation, the parameter value of the pre-cooling indication parameter can include a first value or a second value, and the first value is different from the second value. When the pre-cooling indication parameter is the first value, it can indicate that pre-cooling operation is allowed for the chip under test. When the pre-cooling indication parameter is the second value, it can indicate that pre-cooling operation is not allowed for the chip under test. When testing the chip under test, the parameter value of the preset temperature indication parameter can be set and adjusted according to the operating conditions and load conditions of the chip under test. For example, under normal circumstances, the preset temperature indication parameter can be set to the second value to disallow pre-cooling operation for the chip under test. When it is detected that a high-speed program or a high-power load is about to be loaded, the preset temperature indication parameter can be set to the first value to allow pre-cooling operation for the chip under test.

[0089] Further, in an embodiment of the present invention, when the pre-cooling indication parameter is the first value, determining the target temperature according to the chip temperature and the comparison result between the chip temperature and the second temperature threshold may specifically include: when the chip temperature is greater than or equal to the second temperature threshold, adding the chip temperature and a preset temperature to obtain the target temperature, where the preset temperature is greater than 0. The second temperature threshold may be equal to the chip temperature corresponding to the measured chip 2 being in a relatively stable working state, such as 60 degrees Celsius, 65 degrees Celsius, etc. That is to say, in this embodiment, when pre-cooling the measured chip is allowed, if the chip temperature is already greater than or equal to the second temperature threshold, a preset temperature can be added to the current chip temperature to obtain the target temperature. Since the preset temperature is greater than 0, the target temperature will be higher than the chip temperature. In this way, after sending the target temperature to the automated sorter, the automated sorter will perform temperature control on the measured chip based on the target temperature. For example, when the target temperature reaches the temperature threshold for cooling operation set by the automated sorter (for example, the temperature threshold is 70 degrees Celsius), the actual temperature of the measured chip has not reached this temperature threshold (the chip temperature is, for example, 60 degrees Celsius, and the preset temperature is, for example, 10 degrees Celsius), that is, the measured chip is pre-cooled in advance, thereby realizing pre-cooling of the measured chip.

[0090] Optionally, in another embodiment of the present invention, when the chip temperature is less than the second temperature threshold, the chip temperature may be determined as the target temperature. That is to say, if the current chip temperature has not reached the second temperature threshold, it means that the temperature of the measured chip is at a relatively low level at this time. It is possible not to add the preset temperature to the chip temperature temporarily, but directly determine the chip temperature as the target temperature to prevent the pre-cooling operation from reducing the chip temperature too low.

[0091] In the embodiments of the present invention, the specific value of the preset temperature can be set and adjusted according to the estimated sharpness of the temperature rise of the measured chip and the duration of the temperature rise. Exemplarily, in one example, the value range of the preset temperature can be from 5 degrees Celsius to 30 degrees Celsius.

[0092] The foregoing embodiments have described in detail how to determine the target temperature when the pre-cooling indication parameter is the first value, that is, when pre-cooling the chip under test is allowed. However, the embodiments of the present invention are not limited thereto. In other embodiments of the present invention, the pre-cooling indication parameter may be the second value, and in this case, the target temperature can also be determined. For example, in one embodiment of the present invention, when the pre-cooling indication parameter is the second value, the chip temperature can be determined as the target temperature. That is to say, when pre-cooling the chip under test is not allowed, the chip temperature can be transmitted to the automatic sorter as the target temperature, so that the automatic sorter can control the temperature of the chip under test according to the target temperature.

[0093] Further, in the embodiments of the present invention, the temperature monitoring method for chip testing can not only cooperate with the automatic sorter to control the chip temperature, but also monitor the chip temperature in other ways.

[0094] For example, in one embodiment of the present invention, after obtaining the chip temperature of the chip under test during the test, the chip temperature can also be transmitted to a display device, so that the display device can display the chip temperature. In this way, the chip temperature can be prominently and intuitively displayed through the display device, which is convenient for the user to quickly view. Compared with the prior art, when viewing the chip temperature through the automatic sorter, it is necessary to operate in a complex interface menu, which can greatly improve the viewing efficiency of the user for the chip temperature.

[0095] In the embodiments of the present invention, the chip temperature can be displayed in various ways such as numbers, charts, etc. Exemplarily, in one example, the chip temperature can be displayed in the form of a temperature curve. Displaying the chip temperature in the form of a temperature curve can allow the user to understand the temperature change of the chip during the entire test process, and can also determine whether there is an obstruction in the heat conduction of the chip under test by comparing the temperature curve of the first temperature with the temperature curve of the second temperature.

[0096] Further, in another embodiment of the present invention, after obtaining the chip temperature of the chip under test during the test, the chip temperature can also be transmitted to a storage device, so that the storage device stores the chip temperature, thereby facilitating the test engineer to trace the temperature change of the abnormal chip under test. Among them, the storage device may include various disks or memory cards, and the embodiments of the present invention do not limit this.

[0097] Correspondingly, in the third aspect, as Figure 11 shown, the embodiments of the present invention also provide a temperature monitoring system 8 for chip testing, including: A temperature monitoring device 1, where the temperature monitoring device includes any one of the temperature monitoring devices for chip testing provided in the foregoing embodiments; The automated sorter 3 is electrically connected to the temperature monitoring device 1 and is configured to perform temperature control on the chip under test according to the target temperature output by the temperature monitoring device 1.

[0098] The temperature monitoring system 8 for chip testing provided by the embodiments of the present invention includes any one of the temperature monitoring devices for chip testing provided by the foregoing embodiments. Therefore, the corresponding beneficial technical effects can also be achieved, which have been described in detail above and will not be repeated here.

[0099] Correspondingly, in a fourth aspect, as Figure 12 shown, the embodiments of the present invention further provide a chip testing system 9, including: a tester 4, a temperature monitoring device 1, and an automated sorter 3; The tester 4 is used to test the chip under test 2 or terminate the test of the chip under test 2 according to the instruction of the temperature monitoring device 1; The temperature monitoring device 1 is electrically connected to the tester 4, and the temperature monitoring device 1 is any one of the temperature monitoring devices for chip testing provided by the foregoing embodiments; The automated sorter 3 is electrically connected to the temperature monitoring device 1 and is used to perform temperature control on the chip under test 2 according to the target temperature output by the temperature monitoring device 1.

[0100] The chip testing system 9 provided by the embodiments of the present invention includes any one of the temperature monitoring devices for chip testing provided by the foregoing embodiments. Therefore, the corresponding beneficial technical effects can also be achieved, which have been described in detail above and will not be repeated here.

[0101] Correspondingly, in a fifth aspect, the embodiments of the present invention further provide an electronic device that can effectively control the temperature of the chip under test in cooperation with the automated sorter. Even if the automated sorter pauses or malfunctions, the temperature of the chip under test will not get out of control.

[0102] As Figure 13 shown, the electronic device provided by the embodiments of the present invention may include: a processor 71 and a memory 72. The processor 71 is electrically connected to the memory 72; the memory 72 is used to store executable program code; the processor 71 runs a program corresponding to the executable program code by reading the executable program code stored in the memory 72 to implement any one of the temperature monitoring methods for chip testing provided by the foregoing embodiments.

[0103] For the specific execution process of the above steps by the processor 71 and the further steps executed by the processor 71 by running the executable program code, reference may be made to the description of the foregoing embodiments and will not be repeated here.

[0104] Accordingly, in a sixth aspect, an embodiment of the present invention further provides a computer-readable storage medium storing one or more programs, which can be executed by one or more processors to implement any one of the temperature monitoring methods for chip testing provided in the foregoing embodiments, and thus can also achieve corresponding technical effects. The details have been described in detail above and will not be repeated here.

[0105] It should be noted that, in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "comprising a..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

[0106] Each embodiment in this specification is described in a related manner. The same or similar parts among the embodiments can be referred to each other, and the differences between each embodiment and other embodiments are emphasized.

[0107] In particular, for the device embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the description of the method embodiments.

[0108] For convenience of description, the above device is described by dividing it into various units / modules according to functions. Of course, when implementing the present invention, the functions of the various units / modules can be implemented in the same or multiple software and / or hardware.

[0109] Those of ordinary skill in the art can understand that all or part of the processes of implementing the methods in the above embodiments can be completed by instructing relevant hardware through a computer program, and the program can be stored in a computer-readable storage medium. When the program is executed, it can include the processes of the above method embodiments. Among them, the storage medium can be a magnetic disk, an optical disk, a read-only memory (ROM), or a random access memory (RAM), etc.

[0110] As described above, it is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A temperature monitoring device for chip testing, characterized in that, Including: A temperature acquisition module configured to acquire the chip temperature of a chip under test during testing; A control module configured to obtain the chip temperature from the temperature acquisition module and preprocess the chip temperature, and perform control operations according to the preprocessing result; wherein, the control operations include at least one of the following: sending a target temperature to an automatic sorter to enable the automatic sorter to perform temperature control on the chip under test according to the target temperature, the target temperature being related to the chip temperature; sending a test termination indication message to a preset object to enable the preset object to terminate the chip test, the preset object including the chip under test or a testing machine.

2. The device according to claim 1, characterized in that, The control module includes: A first comparison sub-module configured to compare the chip temperature with a first temperature threshold; A first sending sub-module configured to send the test termination indication message to the preset object when the chip temperature is greater than or equal to the first temperature threshold.

3. The device according to claim 1, characterized in that, The control module includes: A detection sub-module configured to detect the parameter value of a pre-cooling indication parameter; A second comparison sub-module configured to compare the chip temperature with a second temperature threshold when the pre-cooling indication parameter is a first value; A determination sub-module configured to determine the target temperature according to the chip temperature and the comparison result of the second comparison sub-module; A second sending sub-module configured to send the target temperature to the automatic sorter to enable the automatic sorter to perform temperature control on the chip under test according to the target temperature.

4. The device according to claim 3, characterized in that The determination sub-module is configured to: When the chip temperature is greater than or equal to the second temperature threshold, add the chip temperature to a preset temperature to obtain the target temperature, where the preset temperature is greater than 0; Or, When the chip temperature is less than the second temperature threshold, determine the chip temperature as the target temperature.

5. The device according to claim 4, characterized in that, The value range of the preset temperature is from 5 degrees Celsius to 30 degrees Celsius.

6. The device according to claim 3, wherein The determination sub-module is further configured to determine the chip temperature as the target temperature when the pre-cooling indication parameter is a second value.

7. The device according to any one of claims 1 to 6, characterized in that, The control module is further configured to transmit the chip temperature to a display device to enable the display device to display the chip temperature.

8. The device according to claim 7, characterized in that, The chip temperature is displayed in the form of a temperature curve.

9. The device according to any one of claims 1 to 6, characterized in that The control module is further configured to transmit the chip temperature to a storage device to enable the storage device to store the chip temperature.

10. The device according to any one of claims 1 to 6, characterized in that The chip temperature includes a first temperature and / or a second temperature, the first temperature being the temperature of the chip housing; the second temperature being the temperature inside the chip; The control module is configured to be any one of the following: Obtain the first temperature from the temperature acquisition module; Obtain the second temperature from the temperature acquisition module; Pollingly obtain the first temperature and the second temperature from the temperature acquisition module.

11. The device according to claim 10, characterized in that, The number of the second temperatures is at least one, and the number of the second temperatures is related to the number of processor cores in the chip under test; The control module is configured to obtain each of the second temperatures from the temperature acquisition module, select the maximum value from the second temperatures for preprocessing, and perform the control operation according to the preprocessing result.

12. A temperature monitoring method for chip testing, characterized in that, It includes: Obtain the chip temperature of the chip under test during the test; Perform preprocessing on the chip temperature; Perform a control operation according to the preprocessing result; wherein, the control operation includes at least one of the following: sending a target temperature to an automatic sorter to enable the automatic sorter to perform temperature control on the chip under test according to the target temperature, and the target temperature is related to the chip temperature; sending a test termination instruction message to a preset object to enable the preset object to terminate the chip test, and the preset object includes the chip under test or a testing machine.

13. The method according to claim 12, wherein The performing preprocessing on the chip temperature includes: Compare the chip temperature with a first temperature threshold; In the case where the chip temperature is greater than or equal to the first temperature threshold, send the test termination instruction message to the preset object.

14. The method according to claim 12, wherein The performing preprocessing on the chip temperature includes: Detect the parameter value of a pre-cooling indication parameter; In the case where the pre-cooling indication parameter is a first value, compare the chip temperature with a second temperature threshold; Determine the target temperature according to the chip temperature and the comparison result between the chip temperature and the second temperature threshold; Send the target temperature to the automatic sorter to enable the automatic sorter to perform temperature control on the chip under test according to the target temperature.

15. The method according to claim 14, wherein The determining the target temperature according to the chip temperature and the comparison result between the chip temperature and the second temperature threshold includes: In the case where the chip temperature is greater than or equal to the second temperature threshold, add the chip temperature to a preset temperature to obtain the target temperature, wherein the preset temperature is greater than 0; Or, In the case where the chip temperature is less than the second temperature threshold, determine the chip temperature as the target temperature.

16. The method according to claim 14, wherein After detecting the parameter value of the pre-cooling indication parameter, the method further includes: In the case where the pre-cooling indication parameter is a second value, determine the chip temperature as the target temperature.

17. The method according to any one of claims 12 to 16, characterized in that, The chip temperature includes a first temperature and / or a second temperature, the first temperature is the temperature of the chip housing; the second temperature is the temperature inside the chip; The obtaining the chip temperature of the chip under test during the test includes any one of the following: Obtain the first temperature; Obtain the second temperature; Pollingly obtain the first temperature and the second temperature.

18. A temperature monitoring system for chip testing, characterized in that, It includes: A temperature monitoring device, the temperature monitoring device includes the temperature monitoring device for chip testing according to any one of claims 1-11; An automatic sorter, electrically connected to the temperature monitoring device, and configured to perform temperature control on the chip under test according to the target temperature output by the temperature monitoring device.

19. A chip testing system, characterized in that, It includes: A testing machine, a temperature monitoring device, an automatic sorter; The testing machine is used to test the chip under test, or terminate the test of the chip under test according to the indication of the temperature monitoring device; The temperature monitoring device is electrically connected to the test machine, and the temperature monitoring device includes the temperature monitoring device for chip testing according to any one of claims 1-11; An automated sorter, electrically connected to the temperature monitoring device, is configured to perform temperature control on the chip under test according to the target temperature output by the temperature monitoring device.

20. An electronic device, characterized in that, The electronic device includes: a processor and a memory, and the processor is electrically connected to the memory; the memory is configured to store executable program codes; the processor runs a program corresponding to the executable program codes by reading the executable program codes stored in the memory, so as to implement the temperature monitoring method for chip testing according to any one of claims 12 to 17.

21. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores one or more programs, and the one or more programs can be executed by one or more processors to implement the temperature monitoring method for chip testing according to any one of claims 12 to 17.

Images