Transmission dispensing detection device and transmission dispensing detection method of die bonder

Abstract

The invention relates to a transmission dispensing detection device of a die bonder and a transmission dispensing detection method.The transmission dispensing detection device comprises a workbench, a transmission mechanism, a dispensing height measurement mechanism and an AOI detection mechanism, the left side and the right side of a first vertical frame are provided with a first displacement mechanism and a second displacement mechanism respectively, and the output end of the first displacement mechanism is provided with a first connecting plate; the glue dispensing and height measuring mechanism comprises a glue dispensing functional head and a height measuring functional head, the glue dispensing functional head and the height measuring functional head are both arranged on a first connecting plate, a second connecting plate is arranged at the output end of the second displacement mechanism, the AOI detection mechanism is arranged on the second connecting plate, and the first connecting plate and the second connecting plate are located at the head end and the tail end of the conveying mechanism respectively. Through the design of integrating the functions of transmission, dispensing, height measurement and AOI detection, the overall operation efficiency of the production line is greatly improved, meanwhile, the accuracy of appearance detection is guaranteed, and through the compact design, the space occupied by equipment is effectively reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of die bonders, and particularly to a transfer dispensing detection device and a transfer dispensing detection method for a die bonder. Background Art

[0002] With the rapid development of the semiconductor industry, the die bonder, as one of the key devices, plays an important role in the chip manufacturing process. In the traditional die bonder, when performing operations such as transfer, dispensing, and detection, due to the particularity of the industry, high precision is required. Therefore, functional components such as transfer, dispensing, detection, loading and unloading devices, etc. occupy a large volume, and often multiple independent modules or devices are required to complete the corresponding tasks. This not only increases the overall complexity of the device, but also may lead to problems such as low production efficiency, inaccurate dispensing precision, and unstable product quality due to insufficient coordination between different modules. Summary of the Invention

[0003] The present invention aims to at least solve the technical problems existing in the prior art. For this purpose, the present invention provides a transfer dispensing detection device and a transfer dispensing detection method for a die bonder, which integrate transfer, dispensing, height measurement and AOI detection functions, can accurately position, simplify the device structure, and also improve the precision and efficiency of the die bonding process, thereby improving the overall production quality and work efficiency.

[0004] A transfer dispensing detection device for a die bonder according to some embodiments of the first aspect of the present invention includes a workbench, a transfer mechanism, a dispensing height measurement mechanism, and an AOI detection mechanism. A first vertical frame and a second vertical frame are provided on the workbench. A first displacement mechanism and a second displacement mechanism are respectively provided on the left and right sides of the first vertical frame. The transfer mechanism is provided on the second vertical frame. A first connecting plate is provided at the output end of the first displacement mechanism. The dispensing height measurement mechanism includes a dispensing function head and a height measurement function head. Both the dispensing function head and the height measurement function head are provided on the first connecting plate. A second connecting plate is provided at the output end of the second displacement mechanism. The AOI detection mechanism is provided on the second connecting plate. The first connecting plate and the second connecting plate are respectively located at the head and tail ends of the transfer mechanism.

[0005] A transfer dispensing detection device for a die bonder according to some embodiments of the first aspect of the present invention has at least the following beneficial effects:

[0006] Through the design of integrating functions of transmission, dispensing, height measurement and AOI detection, the present invention reduces the conversion and coordination time between different functional modules, greatly improves the overall operation efficiency of the production line, uses the first displacement mechanism and the second displacement mechanism to accurately control the positions of the dispensing function head and the AOI detection mechanism, ensures that each chip can obtain a consistent and accurate amount of dispensed glue and position, and at the same time guarantees the accuracy of appearance detection. Compared with the traditional multi-module or equipment combination method, the present invention effectively reduces the space occupied by the equipment and simplifies the overall structure through a compact design, making maintenance more convenient, reducing operation complexity. The device can flexibly adjust the working parameters of each functional component according to different production process requirements, has strong adaptability and scalability, and is suitable for the production requirements of various specifications of chips.

[0007] A transmission, dispensing and detection device for a die bonder according to some embodiments of the first aspect of the present invention, the bottom of the first vertical frame extends forward to form an assembly platform, the height of the second vertical frame is less than the height of the first vertical frame, and the transmission mechanism is located at the bottom of the assembly platform.

[0008] A transmission, dispensing and detection device for a die bonder according to some embodiments of the first aspect of the present invention, the transmission mechanism includes a frame, a linear drive mechanism, a lifting mechanism and a lifting platform. A first connecting frame is provided at the front end of the frame, a second connecting frame is provided at the front end of the first connecting frame, a first avoidance space is provided between the frame and the first connecting frame, a second avoidance space is provided between the first connecting frame and the second connecting frame. The linear drive mechanism is provided on the top of the frame, the output end of the linear drive mechanism is connected to the lifting mechanism, the lifting mechanism is located in the first avoidance space, the output end of the lifting mechanism is connected to the lifting platform, a connecting portion is provided at the rear end of the lifting platform, a first avoidance groove is provided at the top of the connecting portion, the first connecting frame is located in the first avoidance groove, and the front end of the lifting platform extends into the second avoidance space.

[0009] A transmission, dispensing and detection device for a die bonder according to some embodiments of the first aspect of the present invention, a third connecting plate is provided at the output end of the lifting mechanism, a fourth connecting plate is provided at the bottom of the third connecting plate, positioning blocks are provided on both sides of the rear end of the lifting platform, a positioning groove is provided between the two positioning blocks, and the bottom of the fourth connecting plate is connected to the bottom of the positioning groove.

[0010] A transfer, dispensing and detection device of a die bonder according to some embodiments of the first aspect of the present invention. Gas connection ports are provided on the positioning blocks. First gas flow channels are provided at both the left and right ends of the connecting portion. A second gas flow channel is provided at the rear end of the lifting platform. The second gas flow channel. A receiving space is provided in the middle of the lifting platform. A plurality of receiving grooves are formed in the top of the lifting platform. The gas connection ports, the first gas flow channels, the second gas flow channel, the receiving space and the receiving grooves are connected in sequence. The receiving grooves are arranged in an array.

[0011] A transfer, dispensing and detection device of a die bonder according to some embodiments of the first aspect of the present invention. The second gas flow channel is arranged horizontally. The two first gas flow channels are respectively connected to both ends of the second gas flow channel. A long strip-shaped notch is provided at the top of the first gas flow channel. The receiving space is connected to the second gas flow channel through the notch.

[0012] A transfer, dispensing and detection device of a die bonder according to some embodiments of the first aspect of the present invention. The first displacement mechanism includes an X-axis displacement mechanism. A first Y-axis displacement mechanism is provided at the output end of the X-axis displacement mechanism. A Z-axis displacement mechanism is provided at the output end of the first Y-axis displacement mechanism. The first connecting plate is provided at the output end of the Z-axis displacement mechanism.

[0013] A transfer, dispensing and detection device of a die bonder according to some embodiments of the first aspect of the present invention. The height measurement function head includes a 2D camera, a height measurement sensor, a beam splitter and a first light source. A first connecting block is provided at the upper end of the first connecting plate. The 2D camera is provided on the first connecting block. A second connecting block is provided at the lower end of the first connecting plate. The beam splitter is provided on the second connecting block. The first light source is provided at the bottom of the second connecting block. The height measurement sensor is provided outside the second connecting block. The 2D camera and the height measurement sensor are respectively provided on the top and the front end of the beam splitter.

[0014] A transfer, dispensing and detection device of a die bonder according to some embodiments of the first aspect of the present invention. The second displacement mechanism includes a second Y-axis displacement mechanism. The second connecting plate is provided at the output end of the second Y-axis displacement mechanism. The AOI detection component includes a camera, a lens group, a second light source and an annular light source. A first fixing plate, a second fixing plate, a third fixing plate and a fourth fixing plate are sequentially arranged on the second connecting plate from top to bottom. The camera is connected to the first fixing plate. The lens group is connected to the second fixing plate. The second light source is connected to the third fixing plate. The annular light source is connected to the fourth fixing plate.

[0015] A transfer dispensing detection method for a die bonder according to some embodiments of the second aspect of the present invention is applied to the transfer dispensing detection mechanism of the die bonder described in the embodiments of the first aspect. The transfer dispensing detection method includes the following steps:

[0016] S100. The transfer mechanism drives a plurality of chips to be transported to the bottom of the first connecting plate;

[0017] S200. The first displacement mechanism drives the dispensing function head on the first connecting plate to move to the top of the chip for dispensing;

[0018] S300. After dispensing, the height measuring function head measures the thickness of the colloid of the previous dispensing, and adjusts the amount of colloid for the next dispensing according to the preset colloid thickness in the system;

[0019] S400. Repeat S200 - S300 until dispensing of all chips is completed;

[0020] S500. The AOI detection mechanism detects the appearance of the chips.

[0021] The beneficial effects of a transfer dispensing detection method for a die bonder according to some embodiments of the second aspect of the present invention have been described in a transfer dispensing detection method for a die bonder according to some embodiments of the first aspect, and will not be repeated here.

[0022] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, where:

[0024] Figure 1 is a schematic structural diagram of an embodiment of the present invention.

[0025] Figure 2 is a side view of an embodiment of the present invention.

[0026] Figure 3 is a schematic structural diagram of the transfer mechanism of an embodiment of the present invention.

[0027] Figure 4 is a side view of the transfer mechanism of an embodiment of the present invention.

[0028] Figure 5 is a schematic structural diagram of the lifting mechanism of an embodiment of the present invention.

[0029] Figure 6 is a cross-sectional view of the lifting mechanism of an embodiment of the present invention.

[0030] Figure 7 is Figure 6 an enlarged view of part A in

[0031] Figure 8 a schematic structural diagram of the dispensing height measurement mechanism according to an embodiment of the present invention.

[0032] Figure 9 a schematic structural diagram of the dispensing height measurement mechanism according to an embodiment of the present invention with the fixing frame hidden.

[0033] Figure 10 a schematic structural diagram of the AOI detection mechanism according to an embodiment of the present invention Figure One .

[0034] Figure 11 a schematic structural diagram of the AOI detection mechanism according to an embodiment of the present invention Figure Two .

[0035] Reference Numerals: 1, workbench; 2, transmission mechanism; 3, dispensing height measuring mechanism; 4, AOI inspection mechanism; 5, first vertical frame; 6, second vertical frame; 7, first displacement mechanism; 8, second displacement mechanism; 9, first connecting plate; 10, dispensing function head; 11, height measuring function head; 12, second connecting plate; 13, assembly platform; 14, frame; 15, linear drive mechanism; 16, lifting mechanism; 17, lifting platform; 18, first connecting frame; 19, second connecting frame; 20, first avoidance space; 21, second avoidance space; 22, connecting portion; 23, first avoidance groove; 24, third connecting plate; 25, fourth connecting plate; 26, positioning block; 27, positioning groove; 28, gas connection port; 29, first gas flow channel; 30, second gas flow channel; 31, long strip-shaped notch; 32, accommodation space; 33, receiving groove; 35, support column; 36, first fixing plate; 37, second fixing plate; 38, assembly plate; 39, first step portion; 40, second step portion; 42, third connecting plate; 43, second avoidance groove; 44, first boss; 45, second boss; 46, third connecting frame; 47, third avoidance groove; 48, X-axis displacement mechanism; 49, first Y-axis displacement mechanism; 50, Z-axis displacement mechanism; 51, 2D camera; 52, height measuring sensor; 53, beam splitter; 54, first light source; 55, first connecting block; 56, second connecting block; 57, fifth connecting plate; 58, sixth connecting plate; 59, fixing frame; 60, first drive motor; 61, right angle commutator; 62, rotating shaft; 64, first lead screw; 65, first lead screw nut; 66, second Y-axis displacement mechanism; 67, camera; 68, lens group; 69, second light source; 70, annular light source; 71, first fixing plate; 72, second fixing plate; 73, third fixing plate; 74, fourth fixing plate; 75, second drive motor; 76, second lead screw; 77, second lead screw nut; 78, seventh connecting plate; 79, fifth fixing plate; 80, air injection pipe; 81, hose; 82, side plate; 83, slide rail; 85, code reader; 86, coding scale; 87, photoelectric switch; 88, installation groove. Detailed Embodiments

[0036] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, in which the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions from beginning to end. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation of the present invention.

[0037] In the description of the present invention, it should be understood that for the orientation description, such as the orientation or positional relationship indicated by up, down, left, right, front, back, etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred modules or elements must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0038] In the description of the present invention, if the first and second are described only for the purpose of distinguishing technical features, it should not be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or the sequence of the indicated technical features.

[0039] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installation, connection, etc. should be understood in a broad sense. Those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

[0040] As Figures 1 - 11 shown, an embodiment of the first aspect of the present invention provides a transfer, dispensing and detection device for a die bonder.

[0041] A transfer, dispensing and detection device for a die bonder includes a workbench 1, a transfer mechanism 2, a dispensing height measuring mechanism 3 and an AOI detection mechanism 4. A first vertical frame 5 and a second vertical frame 6 are arranged on the workbench 1. A first displacement mechanism 7 and a second displacement mechanism 8 are respectively arranged on the left and right sides of the first vertical frame 5. The transfer mechanism 2 is arranged on the second vertical frame 6. A first connecting plate 9 is arranged at the output end of the first displacement mechanism 7. The dispensing height measuring mechanism 3 includes a dispensing function head 10 and a height measuring function head 11. Both the dispensing function head 10 and the height measuring function head 11 are arranged on the first connecting plate 9. A second connecting plate 12 is arranged at the output end of the second displacement mechanism 8. The AOI detection mechanism 4 is arranged on the second connecting plate 12. The first connecting plate 9 and the second connecting plate 12 are respectively located at the head and tail ends of the transfer mechanism 2.

[0042] Through the design of integrating functions of transmission, dispensing, height measurement and AOI detection, the present invention reduces the conversion and coordination time between different functional modules, greatly improving the overall operation efficiency of the production line. The first displacement mechanism 7 and the second displacement mechanism 8 are used to accurately control the positions of the dispensing function head 10 and the AOI detection mechanism 4, ensuring that each chip can obtain a consistent and accurate dispensing amount and position, while ensuring the accuracy of appearance detection. Compared with the traditional multi-module or equipment combination method, through the compact design, the present invention effectively reduces the space occupied by the equipment and simplifies the overall structure, making maintenance more convenient, reducing the operation complexity. The device can flexibly adjust the working parameters of each functional component according to different production process requirements, with strong adaptability and scalability, and is suitable for the production requirements of various specifications of chips.

[0043] For the transmission, dispensing and detection device of a die bonder in this embodiment, the bottom of the first vertical frame 5 extends forward to form an assembly platform 13, and the height of the second vertical frame 6 is less than that of the first vertical frame 5. The transmission mechanism 2 is located at the bottom of the assembly platform 13. Specifically, the assembly platform 13 formed by the forward extension of the bottom of the first vertical frame 5 provides a stable foundation for other components, and the lower height design of the second vertical frame 6 optimizes the overall structural layout. The assembly platform can make room for the transmission mechanism 2. The first vertical frame 5 and the second vertical frame 6 lift the overall structure, facilitating the layout of various equipment and circuits.

[0044] A transfer, dispensing and detection device of a die bonder according to this embodiment, the transfer mechanism 2 includes a frame 14, a linear drive mechanism 15, a lifting mechanism 16 and a lifting platform 17. A first connecting frame 18 is provided at the front end of the frame 14, and a second connecting frame 19 is provided at the front end of the first connecting frame 18. A first avoidance space 20 is provided between the frame 14 and the first connecting frame 18, and a second avoidance space 21 is provided between the first connecting frame 18 and the second connecting frame 19. The linear drive mechanism 15 is provided at the top of the frame 14, and the output end of the linear drive mechanism 15 is connected to the lifting mechanism 16. The lifting mechanism 16 is located in the first avoidance space 20, and the output end of the lifting mechanism 16 is connected to the lifting platform 17. A connecting portion 22 is provided at the rear end of the lifting platform 17, and a first avoidance groove 23 is provided at the top of the connecting portion 22. The first connecting frame 18 is located in the first avoidance groove 23, and the front end of the lifting platform 17 extends into the second avoidance space 21. Specifically, by designing the first avoidance space 20 and the second avoidance space 21, the linear drive mechanism 15 and the lifting mechanism 16 are prevented from directly contacting the track or other fixed components during operation, thereby greatly reducing the possibility of metal dust generated by friction and mechanical vibration, helping to prevent semiconductor products from being contaminated, ensuring that their electrical performance is not affected, protecting the chips from the risk of falling due to vibration, thus improving the quality of the final product, reducing the maintenance cost. At the same time, a first avoidance groove 23 is provided in the connecting portion at the rear end of the lifting platform 17, and the first connecting frame 18 is located therein, so that the overall structure does not occupy the space at the bottom of the frame, and the avoidance is carried out skillfully, which is beneficial to the arrangement of various components at the bottom of the frame.

[0045] A transfer, dispensing and detection device of a die bonder according to this embodiment, a third connecting plate 24 is provided at the output end of the lifting mechanism 16, a fourth connecting plate 25 is provided at the bottom of the third connecting plate 24, positioning blocks 26 are provided on both sides of the rear end of the lifting platform 17, and a positioning groove 27 is provided between the two positioning blocks 26. The bottom of the fourth connecting plate 25 is connected to the bottom of the positioning groove 27. Specifically, the above arrangement enhances the connection stability between components, makes the lifting platform 17 move more smoothly up and down, further reduces the vibration risk, and improves the operation accuracy. By providing a positioning groove 27 between the two positioning blocks 26, the horizontal height of the lifting mechanism 16 can be appropriately lowered into the first avoidance space 20, which can improve the stability to a certain extent.

[0046] A transfer, dispensing and detection device of a die bonder according to this embodiment. Gas connection ports 28 are arranged on the positioning blocks 26. First gas channels 29 are arranged at both the left and right ends of the connecting portion 22. A second gas channel 30 is arranged at the rear end of the lifting platform 17. The second gas channel 30 is arranged horizontally. The two first gas channels 29 are respectively communicated with both ends of the second gas channel 30. A long strip-shaped notch 31 is arranged at the top of the first gas channel 29. The accommodation space 32 is communicated with the second gas channel 30 through the notch 31. An accommodation space 32 is arranged in the middle of the lifting platform 17. A plurality of accommodation grooves 33 are formed at the top of the lifting platform 17. The gas connection ports 28, the first gas channels 29, the second gas channel 30, the accommodation space 32 and the accommodation grooves 33 are communicated in sequence. The accommodation grooves 33 are distributed in an array. Specifically, by arranging the gas connection ports 28 on the positioning blocks 26 and arranging the first and second gas channels 29, the second gas channel 30, the accommodation space 32 and the accommodation grooves 33 on the lifting platform 17, a complete gas flow path is formed, and the chip can be adsorbed in the accommodation grooves 33, greatly improving the stability of chip transfer.

[0047] A transfer, dispensing and detection device of a die bonder according to this embodiment. Since the positioning blocks 26 in this embodiment are located on both sides of the positioning grooves 27, the first gas channels 29 will be connected to both sides of the second gas channel 30, and the connecting portion 22 is provided with a first avoidance groove 23, and the first gas channel 29 needs to be provided with a corner. Therefore, the width L3 of the first gas channel 29 and the width L4 of the second gas channel 30 should be greater than the height L5 of the accommodation space 32 to ensure the efficiency of sucking the gas in the accommodation space 32 into the first gas channel 29 from the second gas channel 30 and finally sucking it out from the gas connection port 28. The dimension settings of the above channels and the accommodation space 32 ensure the chip adsorption effect of this embodiment under the condition of setting the first avoidance groove 23.

[0048] A transfer, dispensing and detection device of a die bonder according to this embodiment. A plurality of support columns 35 are arranged in the accommodation space 32. The upper and lower ends of the support columns 35 are respectively connected to the upper and lower ends of the accommodation space 32. Specifically, arranging a plurality of support columns 35 in the accommodation space 32 not only increases the structural strength of the lifting platform 17, but also can assist in the uniform distribution of air flow, ensuring the stability and safety of the chip on the lifting platform 17.

[0049] A transfer, dispensing and detection device of a die bonder according to this embodiment. A first fixing plate 36 is provided at the output end of the linear driving mechanism 15. A second fixing plate 37 is provided at the front end of the first fixing plate 36. The second fixing plate 37 extends into the first avoidance space 20. An assembly plate 38 is provided at the bottom of the second fixing plate 37. The lifting mechanism 16 is provided on the assembly plate 38. Specifically, the output end of the linear driving mechanism 15 is provided with the first fixing plate 36 and the second fixing plate 37, making the installation of the lifting mechanism 16 more stable. At the same time, the second fixing plate 37 can extend into the first avoidance space 20 to ensure precise control during its operation and improve the reliability of the entire transfer mechanism.

[0050] A transfer, dispensing and detection device of a die bonder according to this embodiment. A first step portion 39 is provided at the top of one side of the first connecting plate 9 close to the second connecting plate 12. A second step portion 40 is provided at the top of one side of the second connecting plate 12 close to the first connecting plate 9. The first step portion 39 and the second step portion 40 are correspondingly arranged. Specifically, corresponding step portions are provided between the first connecting plate 9 and the second connecting plate 12, enabling the lifting platform 17 to lift between the two step portions and limiting the range of the forward and backward movement of the lifting platform 17.

[0051] A transfer, dispensing and detection device of a die bonder according to this embodiment. The distance between the top of the first avoidance groove 23 and the bottom of the first connecting frame 18 is L1, and the height of the first step portion 39 and the second step portion 40 is L2, and L1 is less than L2. Specifically, L1 refers to the distance between the top of the first avoidance groove 23 and the bottom of the first connecting frame 18 when the lifting platform 17 is at the bottommost position, that is, the maximum height that the lifting platform 17 can rise is less than the height of the first step portion 39 and the second step portion 40, ensuring that the lifting platform 17 is always located between the first step portion 39 and the second step portion 40.

[0052] A transfer, dispensing and detection device of a die bonder according to this embodiment. A plurality of third connecting plates 42 are provided between the first connecting frame 18 and the second connecting frame 19. The bottoms of the third connecting plates 42 are recessed upward to form second avoidance grooves 43. The second avoidance grooves 43 are located at the top of the second avoidance space 21. Specifically, a plurality of third connecting plates 42 are provided between the first connecting frame 18 and the second connecting frame 19, and the bottoms are recessed upward to form the second avoidance grooves 43. Such a design not only ensures the connection stability but also provides an avoidance space to ensure that the chips during transmission will not contact the chips on the lifting platform 17.

[0053] A transfer, dispensing and detection device of a die bonder according to this embodiment. There are two second vertical frames 6, and a first boss 44 and a second boss 45 are respectively arranged at the front and rear ends of the second vertical frame 6. A third connecting frame 46 is arranged at the front end of the second connecting frame 19. The third connecting frame 46 is connected to the top of the first boss 44. Both ends of the frame 14 are respectively connected to two second bosses 45. A third avoidance groove 47 is arranged between the first boss 44 and the second boss 45. Both the first avoidance space 20 and the second avoidance space 21 are located at the top of the third avoidance groove 47. Specifically, the first boss 44 and the second boss 45 respectively arranged at the front and rear ends of the second vertical frame 6, and the design of the third connecting frame 46 provide a solid foundation support for the whole device. The formed third avoidance groove 47 can avoid positions for the lifting mechanism 16 and the lifting platform 17, that is, both the lifting mechanism 16 and the lifting platform 17 are in the third avoidance groove 47 and can slide smoothly without interference.

[0054] A transfer, dispensing and detection device of a die bonder according to this embodiment. The first displacement mechanism 7 includes an X-axis displacement mechanism 48. The output end of the X-axis displacement mechanism 48 is provided with a first Y-axis displacement mechanism 49. The output end of the first Y-axis displacement mechanism 49 is provided with a Z-axis displacement mechanism 50. The first connecting plate 9 is arranged at the output end of the Z-axis displacement mechanism 50. Specifically, the X-axis, Y-axis and Z-axis displacement mechanisms are used to achieve precise positioning in three-dimensional directions, ensuring the accuracy of dispensing and height measurement. Since dispensing and height measurement can be completed at the same station, the error caused by multiple positionings is reduced, thereby improving the reliability and consistency of the product.

[0055] A transfer, dispensing and detection device of a die bonder according to this embodiment. The height measurement function head 11 includes a 2D camera 51, a height measurement sensor 52, a beam splitter 53 and a first light source 54. A first connecting block 55 is arranged at the upper end of the first connecting plate 9. The 2D camera 51 is arranged on the first connecting block 55. A second connecting block 56 is arranged at the lower end of the first connecting plate 9. The beam splitter 53 is arranged on the second connecting block 56. The first light source 54 is arranged at the bottom of the second connecting block 56. The height measurement sensor 52 is arranged outside the second connecting block 56. The 2D camera 51 and the height measurement sensor 52 are respectively arranged on the top and the front end of the beam splitter 53. Specifically, the height measurement sensor 52 uses a laser sensor. The arrangement of the beam splitter 53 makes the 2D camera 51 and the height measurement sensor 52 coaxial. The 2D camera 51 can achieve precise positioning, and the height measurement sensor 52 can monitor the dispensing amount. The next dispensing amount can be adjusted according to the previous dispensing amount. This design provides more accurate height measurement data, ensuring the accuracy of the dispensing process, not only improving the detection accuracy, but also enhancing the adaptability and flexibility of the system.

[0056] A transfer, dispensing and detection device of a die bonder according to this embodiment. A fifth connecting plate 57 is provided at the output end of the Y-axis displacement mechanism 49, and a sixth connecting plate 58 is provided at the rear end of the Z-axis displacement mechanism 50. A fixing frame 59 is provided on the fifth connecting plate 57, and the fixing frame 59 is connected to the sixth connecting plate 58. Specifically, by providing the fifth connecting plate 57 at the output end of the Y-axis displacement mechanism 49, providing the sixth connecting plate 58 at the rear end of the Z-axis displacement mechanism 50, and connecting the fixing frame 59 to both of them, the stability of the entire moving system is increased, ensuring the accuracy and repeatability of the position during the dispensing and height measurement processes.

[0057] A transfer, dispensing and detection device of a die bonder according to this embodiment. The Z-axis displacement mechanism 50 includes a first driving motor 60 and a right-angle commutator 61. The first driving motor 60 is provided on the fifth connecting plate 57. A rotating shaft 62 is provided at the output end of the first driving motor 60. The right-angle commutator 61 is provided at the rear end of the sixth connecting plate 58. The rotating shaft 62 is connected to the input end of the right-angle commutator 61. A first lead screw 64 is provided at the output end of the right-angle commutator 61. A first lead screw nut 65 is provided at the rear end of the first connecting plate 9. The first lead screw nut 65 is connected to the first lead screw 64. The rotating shaft 62 is arranged along the Y-axis direction, and the first lead screw 64 is arranged along the Z-axis direction. Specifically, the design of the first driving motor 60 cooperating with the right-angle commutator 61 in the Z-axis displacement mechanism 50 realizes efficient vertical motion conversion, improves the positioning speed and accuracy in the Z-axis direction, reduces energy consumption at the same time, and prolongs the service life of the equipment. Since the transfer mechanism 2 is located at the bottom of the X, Y, and Z-axis displacement mechanisms, and the assembly platform 13 is formed by the front end of the bottom of the first vertical frame 5 extending forward, setting the first driving motor 60 on the fifth connecting plate 57 in the present invention can adjust the center of gravity to a certain extent.

[0058] A transfer, dispensing and detection device of a die bonder according to this embodiment. A second Y-axis displacement mechanism 66 is provided on the first upright frame 5. The second connecting plate 12 is arranged at the output end of the second Y-axis displacement mechanism 66. The AOI detection component 4 includes a camera 67, a lens group 68, a second light source 69 and an annular light source 70. A first fixing plate 71, a second fixing plate 72, a third fixing plate 73 and a fourth fixing plate 74 are successively arranged on the second connecting plate 12 from top to bottom. The camera 67 is connected to the first fixing plate 71, the lens group 68 is connected to the second fixing plate 72, the second light source 69 is connected to the third fixing plate 73, and the annular light source 70 is connected to the fourth fixing plate 74. Specifically, the AOI detection component 4 integrates a high-resolution camera 67, an optimally designed lens group 68 and an appropriate second light source 69, which can achieve high-precision detection. Especially, the ability to identify subtle defects is greatly enhanced, ensuring the high-quality standard of the final product.

[0059] A transfer, dispensing and detection device of a die bonder according to this embodiment. A second driving motor 75 is provided at the top of the second connecting plate 12. A second lead screw 76 is arranged at the output end of the second driving motor 75. A second lead screw nut 77 is sleeved on the second lead screw 76. A seventh connecting plate 78 is arranged on the outer periphery of the second lead screw nut 77. A fifth fixing plate 79 is arranged on the outer side of the bottom of the seventh connecting plate 78. An air spraying pipe 80 is provided on the fifth fixing plate 79. A hose 81 is arranged at the top of the air spraying pipe 80. Specifically, the moving mechanism composed of the second driving motor 75, the second lead screw 76 and the second lead screw nut 77 can achieve the precise displacement of the fifth fixing plate 79 and the air spraying pipe 80 thereon, which is used to remove dust or foreign matters in the detection area, ensuring the cleanliness of the detection environment, and thus improving the accuracy of the detection result.

[0060] A transfer, dispensing and detection device of a die bonder according to this embodiment. A side plate 82 is arranged on the outer side of the second connecting plate 12. A slide rail 83 is arranged on the outer side of the second Y-axis displacement mechanism 66. A slider (not shown) is arranged on the inner side of the side plate 82. The slider is slidably connected to the slide rail 83. Specifically, the slide rail 83 arranged on the outer side of the second Y-axis displacement mechanism 66 cooperates with the slider on the inner side of the side plate 82, providing a stable and precise moving mode, enhancing the stability during the operation of the device, effectively reducing the influence of mechanical vibration on the detection process, and improving the detection accuracy.

[0061] A transfer, dispensing and detection device of a die bonder according to this embodiment. A code reader 85 is provided at the outer bottom of the second Y-axis displacement mechanism 66. A coding scale 86 is provided at the outer bottom of the side plate 82. The code reader 85 is correspondingly arranged with the coding scale 86. Two photoelectric switches 87 are provided at the outer bottom of the second Y-axis displacement mechanism 66. An installation groove 88 is provided at the bottom of the side plate 82. The photoelectric switch 87 is installed in the installation groove 88. Specifically, the combination of the code reader 85 and the coding scale 86 provided at the outer bottom of the second Y-axis displacement mechanism 66 can monitor and feedback the position information of the second connecting plate 12 in real time. The photoelectric switch 87 is used to limit its travel range, ensuring the safety and accuracy of equipment operation, improving the degree of automation, and also enhancing the control precision and response speed of the system.

[0062] The second aspect of the embodiment of the present invention provides a transfer, dispensing and detection method of a die bonder, which is applied to the transfer, dispensing and detection mechanism of the die bonder described in the first aspect of the embodiment. The transfer, dispensing and detection method includes the following steps:

[0063] S100. The transfer mechanism 2 drives a plurality of chips to be transported to the bottom of the first connecting plate 9;

[0064] S200. The first displacement mechanism 7 drives the dispensing function head 10 on the first connecting plate 9 to move to the top of the chip for dispensing;

[0065] S300. After the dispensing is completed, the height measuring function head 11 measures the thickness of the colloid of the previous dispensing, and adjusts the amount of colloid for the next dispensing according to the preset colloid thickness in the system;

[0066] S400. Repeat S200 - S300 until the dispensing of all chips is completed;

[0067] S500. The AOI detection mechanism 4 detects the appearance of the chips.

[0068] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirits of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A transfer, dispensing and detection device for a die bonder, characterized in that: It includes a workbench, a transmission mechanism, a dispensing height measuring mechanism and an AOI detection mechanism. A first vertical frame and a second vertical frame are arranged on the workbench. A first displacement mechanism and a second displacement mechanism are respectively arranged on the left and right sides of the first vertical frame. The transmission mechanism is arranged on the second vertical frame. A first connecting plate is arranged at the output end of the first displacement mechanism. The dispensing height measuring mechanism includes a dispensing function head and a height measuring function head. Both the dispensing function head and the height measuring function head are arranged on the first connecting plate. A second connecting plate is arranged at the output end of the second displacement mechanism. The AOI detection mechanism is arranged on the second connecting plate. The first connecting plate and the second connecting plate are respectively located at the head and tail ends of the transmission mechanism.

2. The transfer dotting detection device of a die bonder according to claim 1, wherein: The bottom of the first vertical frame extends forward to form an assembly platform. The height of the second vertical frame is less than that of the first vertical frame. The transmission mechanism is located at the bottom of the assembly platform.

3. The transfer, dispensing and detection device of a die bonder according to claim 1, wherein: The transmission mechanism includes a frame, a linear driving mechanism, a lifting mechanism and a lifting platform. A first connecting frame is arranged at the front end of the frame. A second connecting frame is arranged at the front end of the first connecting frame. A first avoidance space is arranged between the frame and the first connecting frame. A second avoidance space is arranged between the first connecting frame and the second connecting frame. The linear driving mechanism is arranged on the top of the frame. The output end of the linear driving mechanism is connected to the lifting mechanism. The lifting mechanism is located in the first avoidance space. The output end of the lifting mechanism is connected to the lifting platform. A connecting part is arranged at the rear end of the lifting platform. A first avoidance groove is arranged at the top of the connecting part. The first connecting frame is located in the first avoidance groove. The front end of the lifting platform extends into the second avoidance space.

4. The transfer dotting detection device of a die bonder according to claim 3, characterized in that: The output end of the lifting mechanism is provided with a third connecting plate. A fourth connecting plate is arranged at the bottom of the third connecting plate. Positioning blocks are arranged on both sides of the rear end of the lifting platform. A positioning groove is arranged between the two positioning blocks. The bottom of the fourth connecting plate is connected to the bottom of the positioning groove.

5. The transfer, dispensing and detection device of a die bonder according to claim 4, characterized in that: Gas connection ports are arranged on the positioning blocks. First gas flow channels are arranged at the left and right ends of the connecting part. A second gas flow channel is arranged at the rear end of the lifting platform. The second gas flow channel, a receiving space is arranged in the middle of the lifting platform. A plurality of receiving grooves are arranged at the top of the lifting platform. The gas connection ports, the first gas flow channels, the second gas flow channel, the receiving space and the receiving grooves are sequentially communicated. The receiving grooves are arranged in an array.

6. The transfer, dispensing and detecting device of a die bonder according to claim 5, wherein: The second gas flow channel is arranged horizontally. The two first gas flow channels are respectively communicated with the two ends of the second gas flow channel. A long strip-shaped notch is arranged at the top of the first gas flow channel. The receiving space is communicated with the second gas flow channel through the notch.

7. The dispensing detection device for the transfer point of a die bonder according to claim 1, characterized in that: The first displacement mechanism includes an X-axis displacement mechanism. A first Y-axis displacement mechanism is arranged at the output end of the X-axis displacement mechanism. A Z-axis displacement mechanism is arranged at the output end of the first Y-axis displacement mechanism. The first connecting plate is arranged at the output end of the Z-axis displacement mechanism.

8. The transfer, dispensing and detection device of a die bonder according to claim 1, wherein: The height measurement function head includes a 2D camera, a height measurement sensor, a beam splitter, and a first light source. A first connection block is provided at the upper end of the first connection plate, and the 2D camera is arranged on the first connection block. A second connection block is provided at the lower end of the first connection plate, and the beam splitter is arranged on the second connection block. The first light source is provided at the bottom of the second connection block, and the height measurement sensor is arranged outside the second connection block. The 2D camera and the height measurement sensor are respectively arranged on the top and the front end of the beam splitter.

9. The transfer, dispensing and detection device of a die bonder according to claim 1, wherein: The second displacement mechanism includes a second Y-axis displacement mechanism, and the second connection plate is arranged at the output end of the second Y-axis displacement mechanism. The AOI detection component includes a camera, a lens group, a second light source, and an annular light source. A first fixing plate, a second fixing plate, a third fixing plate, and a fourth fixing plate are sequentially arranged from top to bottom on the second connection plate. The camera is connected to the first fixing plate, the lens group is connected to the second fixing plate, the second light source is connected to the third fixing plate, and the annular light source is connected to the fourth fixing plate.

10. A transfer and dispensing detection method for a die bonder, characterized in that, Applied to the transfer and dispensing detection mechanism of the die bonder according to any one of claims 1-9, the transfer and dispensing detection method includes the following steps: S100. The transfer mechanism drives a plurality of chips to be transported to the bottom of the first connection plate; S200. The first displacement mechanism drives the dispensing function head on the first connection plate to move to the top of the chip for dispensing; S300. After dispensing, the height measurement function head measures the thickness of the colloid of the previous dispensing, and adjusts the amount of colloid for the next dispensing according to the preset colloid thickness in the system; S400. Repeat S200-S300 until all chips are dispensed; S500. The AOI detection mechanism detects the appearance of the chips.

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