Semiconductor transmission equipment positioning device and semiconductor manufacturing and carrying system

Abstract

The invention relates to a semiconductor transmission equipment positioning device and a semiconductor manufacturing and carrying system. A first recognizer is at least used for recognizing fine positioning information of a target first graphic identifier which is at the minimum distance from the position of current semiconductor transmission equipment; the controller is configured to obtain fine positioning information of a deceleration reference point when the semiconductor transmission equipment decelerates to approach a target goods storage / pickup point on an air track; according to the fine positioning information of the deceleration reference point, the code of the target first graphic identifier, the size of the first graphic identifier, the offset vector and the distance between the adjacent first graphic identifiers, the position of the current semiconductor transmission equipment and / or the real-time distance between the current semiconductor transmission equipment and the target goods storage / pickup point are / is determined; the precise positioning of the distance between the semiconductor transmission equipment and the target stop point is realized.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technologies, and particularly to a positioning device for semiconductor transfer equipment and a semiconductor manufacturing handling system. Background Art

[0002] An Automated Material Handling System (AMHS) is a core technology for efficient and precise material handling in semiconductor manufacturing, and is widely used in wafer manufacturing, packaging and testing, etc. In a semiconductor device production factory, different production equipment is partitioned, and material transfer between different partitions is carried out through the OverHead-Hoist-Transportation (OHT) of the AMHS and semiconductor overhead cranes walking between different partitions.

[0003] During the operation and material handling process of a semiconductor overhead crane, it is necessary to real-time locate the position of the semiconductor overhead crane in the AMHS to precisely control the semiconductor overhead crane to efficiently and intelligently execute the material transfer task between different partitions.

[0004] However, when the semiconductor overhead crane approaches the target point, it needs to decelerate in advance, and it is very difficult to accurately identify the distance from the current position of the semiconductor overhead crane to the target point, resulting in difficulty in efficiently and accurately stopping at the target point, seriously affecting the efficiency, intelligence and reliability of the semiconductor automated material handling system. Summary of the Invention

[0005] Based on this, in view of the technical problems in the above background art, it is necessary to provide a positioning device for semiconductor transfer equipment and a semiconductor manufacturing handling system, which can at least improve the accuracy of the semiconductor transfer equipment stopping at the target storage / pickup point and shorten the parking time.

[0006] According to some embodiments of the present application, a positioning device for a semiconductor transfer device is provided, including a plurality of first graphic identifiers, a first identifier, and a controller. The plurality of first graphic identifiers are arranged at intervals along the straight-line direction of the semiconductor transfer device on the first side of the overhead track of the semiconductor transfer device. The first identifier is at least used to identify the fine positioning information of the target first graphic identifier with the smallest distance from the current position of the semiconductor transfer device. The fine positioning information includes the code of the target first graphic identifier in the coding sequence of the plurality of first graphic identifiers, and the offset vector of the mapping point of the current position of the semiconductor transfer device in the target first graphic identifier relative to the center point of the target first graphic identifier. The controller is connected to the first identifier and is configured to: obtain the fine positioning information of the deceleration reference point when the semiconductor transfer device decelerates and approaches the target storage / retrieval point on the overhead track; determine the current position of the semiconductor transfer device and / or the real-time distance between the semiconductor transfer device and the target storage / retrieval point according to the fine positioning information of the deceleration reference point, the code of the target first graphic identifier, the size of the first graphic identifier, the offset vector, and the spacing between adjacent first graphic identifiers.

[0007] In the positioning device for a semiconductor transfer device in the above embodiments, by arranging a plurality of first graphic identifiers on the first side of the overhead track along the straight-line direction of the semiconductor transfer device, and using the controller connected to the first identifier to obtain the fine positioning information of the deceleration reference point when the semiconductor transfer device decelerates and approaches the target storage / retrieval point on the overhead track. The fine positioning information includes the code of the target first graphic identifier in the coding sequence of the plurality of first graphic identifiers, and the offset vector of the mapping point of the current position of the semiconductor transfer device in the target first graphic identifier relative to the center point of the target first graphic identifier. Thus, the controller can determine the current position of the semiconductor transfer device and the real-time end distance between the current position of the semiconductor transfer device and the target storage / retrieval point according to the fine positioning information of the deceleration reference point, the code of the target first graphic identifier, the size of the first graphic identifier, the offset vector, and the spacing between adjacent first graphic identifiers, realizing accurate positioning of the distance between the semiconductor transfer device and the target stop point, ensuring that the semiconductor transfer device can be accurately controlled to stop at the target storage / retrieval point, thereby effectively improving the efficiency, intelligence, and reliability of the semiconductor automatic handling system.

[0008] In some embodiments, the first graphic identifier includes at least one sub-graphic located on at least one side of the center point of the first graphic identifier; the first identifier is used to obtain the center point position of the target first graphic identifier based on the at least one sub-graphic, and to determine the offset vector based on the center point of the field of view of the target first graphic identifier identified by the first identifier and the center point of the target first graphic identifier, so as to accurately determine based on the offset vector whether the current semiconductor transmission equipment is located in front of or behind the center point of the field of view of the target first graphic identifier in the forward direction of the semiconductor transmission equipment, and the exact distance between the current semiconductor transmission equipment and the center point of the field of view of the target first graphic identifier, thereby accurately locating the position of the current semiconductor transmission equipment and accurately determining the real-time terminal distance between the current semiconductor transmission equipment position and the target storage / pick-up point.

[0009] In some embodiments, the first graphic identifier includes a graphic code group, which includes at least one sub-graphic located on at least one side of the center point of the first graphic identifier; the coding sequence includes at least a code for indicating the mileage of the semiconductor transmission equipment between the current first graphic identifier and a known reference point on the aerial track, thereby facilitating the determination of the mileage of the semiconductor transmission equipment between the current semiconductor transmission equipment position and the known reference point on the aerial track based on the coding information of the target first graphic identifier, and when the target storage / pick-up point location information is known in the aerial track map information, the real-time terminal distance between the current semiconductor transmission equipment position and the target storage / pick-up point can be accurately located.

[0010] In some embodiments, the semiconductor transmission equipment positioning device further comprises a plurality of second graphic identifiers and a second identifier, wherein the plurality of second graphic identifiers are arranged at intervals along the straight direction of the semiconductor transmission equipment on the second side of the semiconductor transmission equipment aerial track away from the first side along the first direction, and the first direction intersects with the straight direction of the semiconductor transmission equipment; the second identifier is connected to the controller and is at least used to identify the coarse positioning information of the target second graphic identifier with the smallest distance from the current semiconductor transmission equipment position; the coarse positioning information comprises the code of the target second graphic identifier in the code sequence of the plurality of second graphic identifiers, and the interval between the current semiconductor transmission equipment position and the recognition starting point of the target second graphic identifier of the semiconductor transmission equipment; The mileage of the semiconductor transmission equipment can be determined according to the coding information of the second graphic mark of the target, so as to determine the mileage of the semiconductor transmission equipment between the current position of the semiconductor transmission equipment and the known reference point on the aerial track (for example, the starting point of the semiconductor transmission equipment operation). When the position information of the target storage / pickup point in the aerial track map information is known, the real-time terminal distance between the current position of the semiconductor transmission equipment and the target storage / pickup point can be located (roughly located) within a preset accuracy range. If the real-time distance is less than or equal to the deceleration threshold, the semiconductor transmission equipment is controlled to decelerate and the precise positioning information of the first graphic mark of the target is obtained, so as to accurately locate the real-time terminal distance between the current position of the semiconductor transmission equipment and the target storage / pickup point.

[0011] In some embodiments, a plurality of second graphic identifiers are evenly spaced along the straight - running direction of the semiconductor transfer device; the controller is configured to: calculate the real - time end - point distance between the current position of the semiconductor transfer device and the target storage / retrieval point according to the starting position of the semiconductor transfer device in the air track during operation, the number of second graphic identifiers between the target second graphic identifiers, the target size of the second graphic identifier, the mileage of the semiconductor transfer device in the interval, and the track position information of the target storage / retrieval point; if the real - time end - point distance is greater than the first threshold and less than or equal to the second threshold, control the semiconductor transfer device to decelerate at the first - level speed; the first threshold is less than the second threshold; if the real - time end - point distance is greater than the third threshold and less than or equal to the first threshold, control the semiconductor transfer device to decelerate at the second - level speed; the third threshold is less than the first threshold; the second - level speed is less than the first - level speed; if the real - time end - point distance is greater than the fourth threshold and less than or equal to the third threshold, control the semiconductor transfer device to decelerate at the third - level speed; the fourth threshold is less than the third threshold; the third - level speed is less than the second - level speed. Realize gradient deceleration to control the semiconductor transfer device to approach the target storage / retrieval point, and ensure that the semiconductor transfer device accurately stops at the target storage / retrieval point while effectively shortening the time for the semiconductor transfer device to decelerate and travel to the target storage / retrieval point.

[0012] In some embodiments, the controller is configured to: obtain the coordinate system information of the air track, where the coordinate system information includes the track type of the air track that the semiconductor transfer device needs to pass through when performing the current operation task, and the number of sections, length, and graphic identifier information of different types of tracks. The track types include straight tracks and curved tracks, and the graphic identifier information includes the code, size, and spacing distance of the first graphic identifier, and the code, size, and spacing distance of the second graphic identifier; if the current semiconductor transfer device is located on a straight track, passes through the target storage / retrieval point during operation, and the real - time end - point distance is less than or equal to the reverse - distance threshold, then control the semiconductor transfer device to reverse to the target storage / retrieval point and stop, avoiding the situation where the semiconductor transfer device travels beyond the target storage / retrieval point and then detours to move forward again to the target storage / retrieval point and stop, thereby reducing the time for the semiconductor transfer device to perform the current operation task and effectively improving the efficiency of the semiconductor transfer device traveling to the target storage / retrieval point.

[0013] In some embodiments, the controller is configured to: if the distance between the starting position of the next adjacent operation task of the semiconductor transfer device and the current position of the semiconductor transfer device is less than or equal to the reverse - distance threshold, and the starting position is behind the forward direction of the current semiconductor transfer device, then control the semiconductor transfer device to reverse to the starting position and stop, thereby effectively shortening the time for the semiconductor transfer device to perform the next adjacent handling task.

[0014] In some embodiments, the semiconductor transfer device positioning apparatus further includes a motor encoder. The motor encoder is disposed on the semiconductor transfer device and is connected to the controller. It is used to obtain the mileage of the semiconductor transfer device between the current position of the semiconductor transfer device and the starting point of recognition of the target first graphic identifier, and to obtain the mileage of the semiconductor transfer device between the current position of the semiconductor transfer device and the starting point of recognition of the target second graphic identifier, so as to determine the real-time end distance between the current semiconductor transfer device and the target storage / pickup point when the current position of the semiconductor transfer device is between adjacent first graphic identifiers or between adjacent second graphic identifiers.

[0015] In some embodiments, the controller is further configured to: before or during controlling the semiconductor transfer device to reverse or move forward to the stop point, obtain the spacing distance between the semiconductor transfer device and other semiconductor transfer devices in its forward direction; if the spacing distance is less than or equal to the safety distance, control the semiconductor transfer device to stop, otherwise, control the semiconductor transfer device to run to the stop point; the stop point includes the starting point of operation or the target storage / pickup point. This avoids the semiconductor transfer device from colliding or contacting other semiconductor transfer devices during the process of reversing or moving forward to the stop point, and improves the reliability of the operation of the semiconductor transfer device.

[0016] In some embodiments, the controller is further configured to, before obtaining the fine positioning information, perform the following fine positioning verification task: control the semiconductor transfer device to run on the air track at a preset verification speed, and obtain the verification start code and the starting mileage of the semiconductor transfer device. The verification start code includes the code of the first identifier closest to the starting operation point of the semiconductor transfer device; when the semiconductor transfer device runs a preset travel value on the air track at the preset verification speed, obtain the verification end code and the end mileage of the semiconductor transfer device; according to the verification start code, the starting mileage, the verification end code, and the end mileage, obtain the first calibration value for calibrating the fine positioning information. This avoids measurement errors in the driving mileage of the semiconductor transfer device due to factors such as mechanical wear, mechanical errors of the semiconductor transfer device, and recognition measurement errors of the first identifier for the first graphic identifier, and ensures the measurement accuracy of the driving mileage of the semiconductor transfer device.

[0017] In some embodiments, the controller is further configured to perform the following rough positioning verification tasks before obtaining the rough positioning information: obtain the initial rough positioning information and the starting mileage at the starting point of the operation of the semiconductor transfer device; obtain the rough positioning information and the mileage when the semiconductor transfer device travels to a preset position on the air track; obtain a second calibration value for calibrating the rough positioning information according to the initial rough positioning information, the starting mileage, the rough positioning information and the mileage at the preset position. To avoid measurement errors in the driving mileage of the semiconductor transfer device caused by factors such as mechanical wear, mechanical errors of the semiconductor transfer device, and recognition and measurement errors of the second identifier for the second graphic identifier, and ensure the measurement accuracy of the driving mileage of the semiconductor transfer device.

[0018] In some embodiments, the controller is further configured to: determine the map data of the operation of the semiconductor transfer device on the air track according to the historical data of the fine positioning information and the historical data of the rough positioning information of the semiconductor transfer device running on the air track. The map data includes: the mileage of the semiconductor transfer device corresponding to the encoding in the encoding sequences of multiple first graphic identifiers from the starting point of the air track, and the mileage of the semiconductor transfer device corresponding to the encoding in the encoding sequences of multiple second graphic identifiers from the starting point of the air track. Thereby, it is convenient to accurately position the distance between the semiconductor transfer device and the target stop point according to the map data of the operation of the semiconductor transfer device on the air track and the current position identification data of the semiconductor transfer device, and ensure that the semiconductor transfer device can be accurately controlled to stop at the target storage / retrieval point, thereby effectively improving the efficiency, intelligence and reliability of the semiconductor automatic handling system.

[0019] According to some embodiments of the present application, a semiconductor manufacturing handling system is provided, including a semiconductor transfer device, an overhead rail, and a semiconductor transfer device positioning device in any embodiment of the present application; wherein, the overhead rail is used to support the travel of the semiconductor transfer device, and the semiconductor transfer device stores and retrieves the semiconductor material boxes it transports at the workstations of corresponding processes; the semiconductor transfer device positioning device is used to determine the current position of the semiconductor transfer device and / or the real-time end distance between the current position of the semiconductor transfer device and the target storage / retrieval point. In this embodiment, the mapping point of the current position of the semiconductor transfer device in the target first graphic identifier can be obtained, and the offset vector compared with the center point of the target first graphic identifier, so that it can be accurately determined according to the offset vector whether the current semiconductor transfer device is in front of or behind the center point of the field of view of the target first graphic identifier in the forward direction of the semiconductor transfer device, and the accurate distance between the current semiconductor transfer device and the center point of the field of view of the target first graphic identifier. Compared with the traditional technology that can only roughly judge between which two first graphic identifiers or between which two second graphic identifiers the current semiconductor transfer device is located, this embodiment effectively improves the accuracy of measuring the distance between the semiconductor transfer device and the target stop point. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0021] Figure 1 It is a schematic diagram of an application scenario of a semiconductor transfer device positioning device provided in an embodiment of the present application;

[0022] Figure 2 It is a schematic diagram of an application scenario of a semiconductor transfer device positioning device provided in another embodiment of the present application;

[0023] Figure 3 It is a schematic diagram of the circuit principle of a semiconductor transfer device positioning device provided in an embodiment of the present application;

[0024] Figure 4 It is a schematic diagram of a first graphic identifier in a semiconductor transfer device positioning device provided in an embodiment of the present application;

[0025] Figure 5 It is a schematic diagram of the working principle of a first identifier of a semiconductor transfer device positioning device provided in an embodiment of the present application;

[0026] Figure 6Schematic diagram of the principle of decelerating and positioning a semiconductor transfer device in a semiconductor transfer device positioning device provided in an embodiment of the present application;

[0027] Figure 7 Schematic diagram of a second graphic identifier in a semiconductor transfer device positioning device provided in an embodiment of the present application;

[0028] Figure 8 Schematic diagram of a partial application scenario of a semiconductor transfer device positioning device provided in another embodiment of the present application;

[0029] Figure 9 Schematic diagram of the structure of a semiconductor transfer device in a semiconductor transfer device positioning device provided in an embodiment of the present application;

[0030] Figure 10 Schematic diagram of the working principle of a semiconductor transfer device in a semiconductor transfer device positioning device provided in an embodiment of the present application.

[0031] Wherein:

[0032] 100, straight rail; 200, curved rail; 10, first graphic identifier; 20, first identifier; 30, controller; 40, second identifier; 50, second graphic identifier; 300, semiconductor transfer device; 11, graphic code group; 111, sub-graphic; 1111, code; 15, storage location; 16, machine position; 51, input module; 52, safety module; 53, operation module; 54, control module; 55, output module; 21, barcode scanner; 22, camera; 2, vehicle body. Detailed implementation manners

[0033] For the convenience of understanding the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0035] When using "including", "having", and "comprising" described herein, unless a clear limiting term is used, such as "only", "consisting of", etc., another component can also be added. Unless otherwise mentioned, terms in the singular form can include the plural form and should not be construed as having a quantity of one.

[0036] In this application, unless otherwise clearly defined and limited, terms such as "install", "connect", "link", "fix", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] In addition, terms such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features.

[0038] In semiconductor manufacturing enterprises, to solve the risks and uncertainties brought by manual handling, AMHS has emerged and has been widely used in the semiconductor manufacturing industry. In the track system of AMHS, it includes track types such as turnout tracks, turning tracks, straight tracks, etc., as well as complex environmental layout settings around the tracks. It is necessary to set corresponding sensors on different types of tracks to assist in positioning the current position of the overhead crane.

[0039] In the related art, when the semiconductor transfer device approaches the target parking point, because it cannot accurately determine the real-time end distance between the overhead crane and the target parking point, in order to match the response time of the sensor, it is necessary to control the semiconductor transfer device to approach the target point at a low speed to ensure that when the sensor detects that the overhead crane is approaching the target parking point, the semiconductor transfer device can be controlled to stop in time; when the goods delivery point is 100 mm behind the goods pickup point, most overhead cranes need to circle the track at least once to control the semiconductor transfer device to stop at the goods delivery point in time, seriously wasting the effective cargo handling time of the overhead crane.

[0040] This application aims to provide a semiconductor transfer device positioning device and a semiconductor manufacturing handling system, which can at least improve the accuracy of the semiconductor transfer device stopping at the target storage / pickup point and shorten the parking time, thereby effectively improving the efficiency, intelligence and reliability of the semiconductor automatic handling system.

[0041] Please refer to Figures 1-4, in some embodiments, the present application provides a positioning device for a semiconductor transfer device, including a plurality of first graphic identifiers 10, a first identifier 20, and a controller 30. The plurality of first graphic identifiers 10 are arranged at intervals along the straight-line direction of the semiconductor transfer device (e.g., the m direction) on the first side of the overhead track of the semiconductor transfer device; the first identifier 20 is at least used to identify the fine positioning information of the target first graphic identifier 10 with the smallest distance from the current position of the semiconductor transfer device. The fine positioning information includes the code 1111 of the target first graphic identifier 10 in the coding sequence of the plurality of first graphic identifiers 10, and the offset vector of the mapping point of the current position of the semiconductor transfer device in the target first graphic identifier 10 compared to the center point 1112 of the target first graphic identifier 10; the controller 30 is connected to the first identifier 20 and is configured to: obtain the fine positioning information of the deceleration reference point when the semiconductor transfer device decelerates and approaches the target storage / retrieval point on the overhead track; determine the current position of the semiconductor transfer device and / or the real-time distance between the semiconductor transfer device and the target storage / retrieval point according to the fine positioning information of the deceleration reference point (e.g., the deceleration starting point), the code 1111 of the target first graphic identifier 10, the size of the first graphic identifier 10, the offset vector, and the spacing between adjacent first graphic identifiers 10.

[0042] As an example, the semiconductor transfer device can be an overhead crane or other transport vehicle for carrying semiconductor material boxes. The overhead track can be an overhead crane track or a transport vehicle track.

[0043] As an example, please continue to refer to Figures 1-4 , by arranging a plurality of first graphic identifiers 10 on the first side of the overhead track along the straight-line direction of the semiconductor transfer device (e.g., the m direction), and using the controller 30 connected to the first identifier 20 to obtain the fine positioning information of the deceleration reference point when the semiconductor transfer device decelerates and approaches the target storage / retrieval point on the overhead track. The fine positioning information includes the code 1111 of the target first graphic identifier 10 in the coding sequence of the plurality of first graphic identifiers 10, and the offset vector of the mapping point of the current position of the semiconductor transfer device in the target first graphic identifier 10 compared to the center point of the target first graphic identifier 10; so that the controller 30 can determine the current position of the semiconductor transfer device and the real-time distance between the current position of the semiconductor transfer device and the target storage / retrieval point according to the fine positioning information of the deceleration reference point, the code 1111 of the target first graphic identifier 10, the size of the first graphic identifier 10, the offset vector, and the spacing between adjacent first graphic identifiers 10, realizing accurate positioning of the distance between the semiconductor transfer device and the target stop point, ensuring that the semiconductor transfer device can be accurately controlled to stop at the target storage / retrieval point, thereby effectively improving the efficiency, intelligence, and reliability of the semiconductor automatic handling system.

[0044] As an example, please continue to refer to Figures 3-4, the first graphic identifier 10 includes at least one sub-graphic 111 located on at least one side of the center point of the first graphic identifier 10; the first recognizer 20 is used to obtain the center point position of the target first graphic identifier 10 according to at least one sub-graphic 111, and determine the offset vector based on the center point of the field of view of the target first graphic identifier 10 recognized by the first recognizer 20 and the center point of the target first graphic identifier 10, so as to accurately determine whether the current semiconductor transfer device is in front of or behind the center point of the field of view of the target first graphic identifier 10 in the forward direction of the semiconductor transfer device according to the offset vector, and the accurate distance between the current semiconductor transfer device and the center point of the field of view of the target first graphic identifier 10, so as to accurately locate the position of the current semiconductor transfer device and accurately determine the real-time distance between the position of the current semiconductor transfer device and the target storage / pickup point.

[0045] As an example, please continue to refer to Figures 3-5 , the first graphic identifier 10 includes a graphic code group 11, the graphic code group 11 includes at least one sub-graphic 111 located on at least one side of the center point 1112 of the first graphic identifier 10; the coding sequence includes at least a code 1111 for indicating the mileage of the semiconductor transfer device between the current first graphic identifier 10 and the reference point on the air track, so as to facilitate determining the mileage of the semiconductor transfer device between the position of the current semiconductor transfer device and the reference point on the air track according to the code 1111 information of the target first graphic identifier 10. When the position information of the target storage / pickup point in the air track map information is known, the real-time distance between the position of the current semiconductor transfer device and the target storage / pickup point can be accurately located.

[0046] As an example, please continue to refer to Figures 4-5 , the graphic code group 11 includes 4 sub-graphics 111 with the center point 1112 of the first graphic identifier 10 as the symmetry center. One graphic code group 11 is correspondingly set with one code 1111, and the codes 1111 of different graphic code groups 11 are different. The code 1111 of the graphic code group 11 corresponds to the mileage of the semiconductor transfer device between this graphic code group 11 and the reference point on the track (such as the starting point of the semiconductor transfer device operation), so as to facilitate determining the mileage of the semiconductor transfer device between the position of the current semiconductor transfer device and the reference point on the air track according to the code 1111 information of the target first graphic identifier 10.

[0047] As an example, please continue to refer to Figures 4-6, the first identifier 20 can be a camera, and the graphic code group 11 in the first graphic identifier 10 can include 4 two-dimensional codes symmetrically centered on the center point 1112 of the first graphic identifier 10. The camera obtains the offset vector between the point p (such as the center point of the field of view of the target first graphic identifier 10) and the center point 1112 of the first graphic identifier 10 by identifying the center point of the field of view of the target first graphic identifier 10. According to this offset vector, the spacing y1 between the point p and the center point 1112 of the first graphic identifier 10 in the straight-ahead direction (such as the m direction) of the semiconductor transport device can be determined. If the spacing between the center points of adjacent graphic code groups 11 in the m direction is a; the code of the target first graphic identifier 10 is n, where n is the number of first graphic identifiers 10 passed through when running from the starting point of the semiconductor transport device on the current track of the semiconductor transport device along the m direction to the target first graphic identifier 10 with the code n. Therefore, the coordinate z of the current position of the semiconductor transport device is z = a • n + y1, or z = a • n - y1. If the current position of the semiconductor transport device has not reached the center point 1112 of the target first graphic identifier 10 in the m direction, then the coordinate z of the current position of the semiconductor transport device is z = a • n - y1; if the current position of the semiconductor transport device exceeds the center point 1112 of the target first graphic identifier 10 in the m direction, then the coordinate z of the current position of the semiconductor transport device is z = a • n + y1.

[0048] As an example, please continue to refer to Figures 4-5 , the length of the two-dimensional code can be set to 9 mm, the spacing between adjacent two-dimensional codes is 9 mm, the spacing between adjacent graphic code groups 11 is 9 mm, the spacing a between the center points of adjacent graphic code groups 11 in the m direction is 36 mm, and the coordinate z of the current position of the semiconductor transport device is z = 36 • n + y1, or z = 36 • n - y1. Among them, if the current position of the semiconductor transport device has not reached the center point 1112 of the target first graphic identifier 10 in the m direction, then the coordinate z of the current position of the semiconductor transport device is z = 36 • n - y1; if the current position of the semiconductor transport device exceeds the center point 1112 of the target first graphic identifier 10 in the m direction, then the coordinate z of the current position of the semiconductor transport device is z = 36 • n + y1.

[0049] As an example, please continue to refer to Figures 1-7, the semiconductor transfer device positioning device further includes a plurality of second graphic identifiers 50 and a second identifier 40. The plurality of second graphic identifiers 50 are arranged at intervals along the straight running direction of the semiconductor transfer device (for example, the m direction) on the second side of the overhead track of the semiconductor transfer device that deviates from the first side along the first direction. The first direction intersects with the straight running direction of the semiconductor transfer device, for example, is perpendicular; the second identifier 40 is connected to the controller 30 and is at least used to identify the rough positioning information of the target second graphic identifier 50 with the smallest distance from the current position of the semiconductor transfer device. The rough positioning information includes the code of the target second graphic identifier 50 in the coding sequence of the plurality of second graphic identifiers 50, and the mileage of the semiconductor transfer device in the interval between the current position of the semiconductor transfer device and the starting point of identification of the target second graphic identifier 50.

[0050] As an example, please refer to Figures 6-7 , taking the semiconductor transfer device as an overhead crane as an example, the specific implementation principle of the embodiments of the present application will be exemplarily described. The starting point of the current operation task of the overhead crane is A, and the end point is B. The overhead crane executes the first operation stage speed V1 between A-K1. The first operation stage is a high-speed operation stage. The overhead crane executes the second operation stage speed V2 between K1-K2. The second operation stage speed V2 is less than the first operation stage speed V1. The overhead crane executes the positioning stage speed V3 between K2-K3 or K2-B. The positioning stage speed V3 is less than the second operation stage speed V2. B indicates the position of the target storage / pickup point. During the process of the overhead crane moving forward to the end point B, it may be affected by various factors and cannot accurately stop at the end point B. For example, the overhead crane may decelerate from point K2 and stop at point K3, and needs to move forward and compensate for a certain distance to just stop at the end point B. The overhead crane starts running at the positioning stage speed V3 from K2 and stops at K3, and then executes the forward compensation speed Vb and stops at the target storage / pickup point B. The forward compensation speed Vb between K3-B is less than the speed of the overhead crane in the second operation stage. On the one hand, it ensures that the overhead crane runs at a lower speed between K2-B and stops at the target storage / pickup point B; on the other hand, it can control the semiconductor transfer device to complete the first-stage deceleration between K1-K2, avoiding the overhead crane running in the low-speed V3 state for a long time. Between K2-B, the overhead crane decelerates and approaches the target storage / pickup point B. Based on the controller 30, according to the fine positioning information of the deceleration reference point, the code 1111 of the target first graphic identifier 10, the size of the first graphic identifier 10, the offset vector, and the distance between adjacent first graphic identifiers 10, the current position of the overhead crane and the real-time distance between the current position of the overhead crane and the target storage / pickup point can be determined, realizing the accurate positioning of the distance between the semiconductor overhead crane and the target stop point, thereby ensuring that the semiconductor overhead crane accurately stops at the target storage / pickup point and can reduce the time for the overhead crane to execute the current cargo transportation task.

[0051] As an example, please continue to refer to Figure 6, point A can be the starting point of the straight track where the overhead crane is located, and the end point is B. For the specific operation process, please refer to the previous content and will not be elaborated here.

[0052] As an example, please continue to refer to Figures 6-7 , K1 is the starting point of deceleration of the semiconductor transfer device. The semiconductor transfer device completes the first-stage deceleration between K1 - K2, so that the speed V3 of the semiconductor transfer device in the forward compensation stage meets the time response requirement for the first recognizer 20 to recognize the first graphic identifier 10.

[0053] As an example, please continue to refer to Figures 6-7 , the controller 30 determines the mileage of the semiconductor transfer device between the current position of the semiconductor transfer device and the reference point (such as the starting point of the operation of the semiconductor transfer device) on the aerial track according to the encoding 1111 information of the target second graphic identifier 50. When the position information of the target storage / retrieval point B is known in the aerial track map information, it can locate (coarse positioning) the real-time distance between the current position of the semiconductor transfer device and the target storage / retrieval point B within a preset accuracy range. If the real-time distance is less than or equal to the deceleration threshold (the mileage of the semiconductor transfer device between K1 - B), then it controls the semiconductor transfer device to decelerate and obtains the fine positioning information of the target first graphic identifier 10 to accurately locate the real-time distance between the current position of the semiconductor transfer device and the target storage / retrieval point.

[0054] As an example, please continue to refer to Figures 6-7, a plurality of second graphic identifiers 50 are evenly spaced along the straight - running direction of the semiconductor transfer device; the controller 30 is configured to: calculate the real - time end - point distance between the current position of the semiconductor transfer device and the target storage / pick - up point according to the starting position of the semiconductor transfer device on the air track, the number of second graphic identifiers 50 between the target second graphic identifiers 50, the target size of the second graphic identifiers 50, the mileage of the semiconductor transfer device in the interval between the current position of the semiconductor transfer device and the recognition starting point of the target second graphic identifier 50, and the track position information of the target storage / pick - up point; if the real - time end - point distance is greater than the first threshold (e.g., 400 mm) and less than or equal to the second threshold (e.g., 800 mm), control the semiconductor transfer device to decelerate at the first - level speed; the first threshold is less than the second threshold; if the real - time end - point distance is greater than the third threshold (e.g., 100 mm) and less than or equal to the first threshold (e.g., 400 mm), control the semiconductor transfer device to decelerate at the second - level speed; the third threshold is less than the first threshold; the second - level speed is less than the first - level speed; if the real - time end - point distance is greater than the fourth threshold (e.g., 10 mm) and less than or equal to the third threshold (e.g., 100 mm), control the semiconductor transfer device to decelerate at the third - level speed; the fourth threshold is less than the third threshold; the third - level speed is less than the second - level speed. Realize gradient deceleration to control the semiconductor transfer device to approach the target storage / pick - up point, effectively shortening the time for the semiconductor transfer device to decelerate and travel to the target storage / pick - up point, and ensuring that the semiconductor transfer device stops accurately at the target storage / pick - up point.

[0055] As an example, please continue to refer to Figures 6-9 , the second identifier may include a barcode scanner 21, the second graphic identifier 50 may include a one - dimensional code, and the controller 30 is configured to: obtain the coordinate system information of the air track, where the coordinate system information includes the track type of the air track that the semiconductor transfer device needs to pass through when performing the current operation task, and the number of sections, lengths, and graphic identifier information of different types of tracks. The track types include straight tracks 100 and curved tracks 200, and the graphic identifier information includes the encoding, size, and spacing distance of the first graphic identifier 10, and the encoding, size, and spacing distance of the second graphic identifier 50; if the current semiconductor transfer device is located on the straight track 100, passes through the target storage / pick - up point during operation, and the real - time end - point distance is less than or equal to the reverse - distance threshold, then control the semiconductor transfer device to reverse to the target storage / pick - up point and stop, avoiding the situation where the semiconductor transfer device travels beyond the target storage / pick - up point, resulting in the semiconductor transfer device detouring and then moving forward again to stop at the target storage / pick - up point, thereby reducing the time for the semiconductor transfer device to perform the current operation task and effectively improving the efficiency of the semiconductor transfer device traveling to the target storage / pick - up point.

[0056] As an example, please continue to refer to Figure 2 , with the semiconductor transfer device at Figure 2Taking the example of executing the current running task on a circular track with the arrow indicating the direction, the track types of the aerial track to be passed by the running task include straight tracks and curved tracks. The aerial tracks to be passed by the running task include straight track 1, straight track 3, curved track 2, and curved track 4. The number of sections of the aerial track that the semiconductor transfer device needs to pass through for the current running task is 4.

[0057] As an example, please continue to refer to Figures 8-9 , the controller 30 is configured to: if the distance between the running start point of the next adjacent running task of the semiconductor transfer device and the current position of the semiconductor transfer device is less than or equal to the reverse distance threshold, and the running start point is behind the forward direction of the current semiconductor transfer device, then control the semiconductor transfer device to reverse to the running start point and stop, thereby effectively shortening the time for the semiconductor transfer device to execute the next adjacent handling task.

[0058] As an example, please continue to refer to Figures 8-9 , when the semiconductor transfer device picks up goods from storage position 15 (a storage bin) and places them on the machine 16 below the track, when there is no precise positioning QR code assistance, the semiconductor transfer device needs to make a full circle before putting down the goods; when it can rely on QR code data for positioning, the semiconductor transfer device can reverse to machine position 16 and directly put down the goods, saving a large amount of picking and placing time and also reducing the occupation of track resources.

[0059] In some embodiments, the semiconductor transfer device positioning device further includes a motor encoder. The motor encoder is disposed on the semiconductor transfer device and is connected to the controller, and is used to obtain the mileage of the semiconductor transfer device between the current position of the semiconductor transfer device and the recognition start point of the target first graphic identifier, and to obtain the mileage of the semiconductor transfer device between the current position of the semiconductor transfer device and the recognition start point of the target second graphic identifier, so as to determine the real-time end distance between the current semiconductor transfer device and the target storage / picking point when the current position of the semiconductor transfer device is between adjacent first graphic identifiers or between adjacent second graphic identifiers.

[0060] In some embodiments, the controller is further configured to: before or during controlling the semiconductor transfer device to reverse or move forward to the stop point, obtain the interval distance between the semiconductor transfer device and other semiconductor transfer devices in its forward direction; if the interval distance is less than or equal to the safety distance, then control the semiconductor transfer device to stop, otherwise, control the semiconductor transfer device to run to the stop point; the stop point includes the running start point or the target storage / picking point. This avoids the semiconductor transfer device from colliding or contacting with other semiconductor transfer devices during the process of reversing or moving forward to the stop point, and improves the reliability of the operation of the semiconductor transfer device.

[0061] In some embodiments, the semiconductor transfer device can use radar and a rangefinder to ensure that the spacing distance from other semiconductor transfer devices in front or behind is greater than a preset safety distance, such as 500 mm, to avoid collision or contact between different semiconductor transfer devices. If the controller determines, based on the radar and the rangefinder, that the spacing distance between other semiconductor transfer devices in the forward direction and itself is less than or equal to the safety distance, it controls the semiconductor transfer device to stop.

[0062] It should be noted that controlling the semiconductor transfer device to stop generally means controlling the semiconductor transfer device to perform a braking and stopping action to prompt the semiconductor transfer device to stop quickly.

[0063] As an example, please refer to Figures 9-10 , one-dimensional codes (second graphic identifiers) and two-dimensional codes (first graphic identifiers) can be respectively set at the bottom ends of the tracks at both ends of the straight tracks of the semiconductor transfer devices arranged in parallel. During the periodic or daily calibration phase, a one-dimensional code can be scanned by the barcode scanner 21 to obtain the encoding sequence of the one-dimensional code. The encoding sequence of the one-dimensional code includes at least the encoding for indicating the mileage of the semiconductor transfer device between the current one-dimensional code and a known reference point on the overhead track; a two-dimensional code can be recognized by the camera 22 to obtain the encoding sequence of the two-dimensional code. The encoding sequence of the two-dimensional code includes at least the encoding for indicating the mileage of the semiconductor transfer device between the current two-dimensional code and a known reference point on the overhead track. The obtained encoding sequences of the one-dimensional code and the two-dimensional code are saved in the database as the first data for subsequent comparison. During the operation task phase of the semiconductor transfer device, the real-time position of the semiconductor transfer device on the track is determined based on the real-time scanning data of the barcode scanner 21 or the camera 22 and this first data.

[0064] As an example, when all pick-and-place points are used for the first time, the teaching function is used to back up the working point data to the database for storage. When the action of the target point needs to be executed, the coordinate system information of the grid corresponding to the overhead track will be sent to the semiconductor transfer device along with the task. The coordinate system information of the overhead track includes the grid number (Station_ID), the track number (Station_Path_ID), the encoding sequence of the two-dimensional code (Station_QR_Code), the encoding sequence of the one-dimensional code (Station_YR_Code), etc.

[0065] As an example, please refer to Figures 9-10, the controller 30 is respectively connected to an input module 51, a safety module 52, an arithmetic module 53, a control module 54, and an output module 55. The input module 51 is used to obtain the spacing detection data of the semiconductor transfer device to avoid collisions when the spacing of the semiconductor transfer device is less than or equal to the safety distance threshold; the input module 51 is used to obtain obstacle detection data to avoid the semiconductor transfer device from colliding with or contacting obstacles; the input module 51 is used to obtain the first identification data of the first graphic identifier recognized by the first identifier, and the second identification data of the second graphic identifier recognized by the second identifier. The safety module 52 is used to obtain the spacing-safety condition judgment of the semiconductor transfer device to judge whether the spacing of the semiconductor transfer device is less than or equal to the safety distance threshold; the safety module 52 is used to obtain the obstacle-safety condition judgment of the semiconductor transfer device to judge whether the spacing between the semiconductor transfer device and the obstacle is less than or equal to the safety obstacle distance threshold to avoid the semiconductor transfer device from colliding with or contacting obstacles; the safety module 52 is used to obtain the path attribute condition judgment of the semiconductor transfer device, at least for judging the track type; the safety module 52 is used to obtain the passage restriction condition judgment of the semiconductor transfer device, at least for judging whether the semiconductor transfer device can pass through the front track, whether it needs to detour or change the track type. The arithmetic module 53 is used to perform real-time speed calculation on the semiconductor transfer device. The control module 54 is used to perform parking control or running control on the semiconductor transfer device. The output module 55 is used to send a forward instruction / backward instruction / stop instruction to the semiconductor transfer device. The forward instruction is used to instruct the semiconductor transfer device to move forward, the backward instruction is used to instruct the semiconductor transfer device to move backward or reverse, and the stop instruction is used to instruct the semiconductor transfer device to stop.

[0066] As an example, please continue to refer to Figures 9-10 , the controller 30 is further configured to perform the following fine positioning verification tasks before obtaining the fine positioning information: control the semiconductor transfer device to run on the aerial track at a preset verification speed, and obtain the verification start code and the start mileage of the semiconductor transfer device. The verification start code includes the code of the first identifier 20 closest to the starting running point of the semiconductor transfer device; when the semiconductor transfer device runs a preset travel value on the aerial track at the preset verification speed, obtain the verification end code and the end mileage of the semiconductor transfer device; according to the verification start code, the start mileage, the verification end code, and the end mileage, obtain the first calibration value for calibrating the fine positioning information. To avoid measurement errors in the driving mileage of the semiconductor transfer device caused by factors such as mechanical wear, mechanical errors of the semiconductor transfer device, and recognition and measurement errors of the first identifier 20 for the first graphic identifier 10, and ensure the measurement accuracy of the driving mileage of the semiconductor transfer device.

[0067] As an example, please continue to refer to Figures 9-10, the controller 30 is further configured to perform the following rough positioning verification tasks before obtaining the rough positioning information: obtain the initial rough positioning information and starting mileage at the starting point of the semiconductor transfer device; obtain the rough positioning information and mileage when the semiconductor transfer device moves forward to a preset position on the air track; obtain a second calibration value for calibrating the rough positioning information according to the initial rough positioning information, starting mileage, rough positioning information and mileage at the preset position. To avoid measurement errors in the driving mileage of the semiconductor transfer device caused by factors such as mechanical wear and mechanical errors of the semiconductor transfer device, and the recognition and measurement errors of the second identifier 40 for the second graphic identifier 50, and ensure the measurement accuracy of the driving mileage of the semiconductor transfer device.

[0068] Exemplarily, after the semiconductor transfer device has traveled for a long time, there is wear on the running wheels, and it is necessary to verify the diameter of the running wheels: As an independent verification task, run at a low speed on a long straight track, read the QR code value at the start, record the starting walking encoder value, read the QR code value at the end point and record the ending walking encoder value after walking a specified distance, and calculate a new electronic sub-ratio through ratio conversion to ensure that the walking encoder value is equal to the QR code distance value. Record the current encoder value and camera data at the starting point of the long straight track, and read the current encoder value and camera data again after walking a certain distance, and correct the conversion relationship between the current encoder value and the walking length through data difference comparison.

[0069] As an example, please continue to refer to Figures 9-10 , the controller 30 is further configured to: determine the map data of the semiconductor transfer device running on the air track according to the historical data of the fine positioning information and the historical data of the rough positioning information of the semiconductor transfer device running on the air track, and the map data includes: the mileage of the semiconductor transfer device corresponding to the code 1111 in the coding sequences of multiple first graphic identifiers 10 from the starting point of the air track, and the mileage of the semiconductor transfer device corresponding to the code 1111 in the coding sequences of multiple second graphic identifiers 50 from the starting point of the air track. Thus, it is convenient to accurately position the distance between the semiconductor transfer device and the target stop point according to the map data of the semiconductor transfer device running on the air track and the current position identification data of the semiconductor transfer device, and ensure that the semiconductor transfer device can be accurately controlled to stop at the target storage / retrieval point, thereby effectively improving the efficiency, intelligence and reliability of the semiconductor automatic handling system.

[0070] In some embodiments of the present application, a semiconductor manufacturing handling system is provided, including a semiconductor transfer device, an overhead track, and a semiconductor transfer device positioning device in any embodiment of the present application; wherein, the overhead track is used to support the travel of the semiconductor transfer device, and the semiconductor transfer device stores and retrieves the semiconductor material boxes it transports at the workstations of corresponding processes; the semiconductor transfer device positioning device is used to determine the current position of the semiconductor transfer device and / or the real-time end distance between the current position of the semiconductor transfer device and the target storage / retrieval point. This embodiment can obtain the offset vector of the mapped point of the current position of the semiconductor transfer device in the target first graphic identifier compared with the center point of the target first graphic identifier, so that it can accurately determine, based on the offset vector, whether the current semiconductor transfer device is in front of or behind the center point of the field of view of the target first graphic identifier in the forward direction of the semiconductor transfer device, and the accurate distance between the current semiconductor transfer device and the center point of the field of view of the target first graphic identifier. Compared with the traditional technology that can only roughly judge between which two first graphic identifiers or between which two second graphic identifiers the current semiconductor transfer device is located, this embodiment effectively improves the accuracy of measuring the distance between the semiconductor transfer device and the target stop point.

[0071] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0072] The above-described embodiments only represent several implementation manners of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the appended claims.

Claims

1. A positioning device for a semiconductor transmission device, characterized in that, include: A plurality of first graphic marks are arranged at intervals on a first side of the aerial track of the semiconductor transmission equipment along the straight direction of the semiconductor transmission equipment; A first identifier is at least used to identify the precise positioning information of the target first graphic mark that is the smallest distance from the current semiconductor transmission equipment position; the precise positioning information includes the code of the target first graphic mark in the code sequence of the plurality of first graphic marks, and the offset vector of the mapping point of the current semiconductor transmission equipment position in the target first graphic mark compared to the center point of the target first graphic mark; A controller, connected to the first identifier, is configured to: Acquire precise positioning information of a deceleration reference point of the semiconductor transport device when the semiconductor transport device decelerates on the aerial track and approaches a target storage / pickup point; Based on the precise positioning information of the deceleration reference point, the code, the size of the first graphic mark, the offset vector, and the distance between adjacent first graphic marks, the current position of the semiconductor transmission equipment and / or the real-time distance between it and the target storage / pick-up point is determined.

2. The semiconductor transmission device positioning device according to claim 1, characterized in that, The first graphic mark includes at least one sub-graphic located on at least one side of the center point thereof; The first identifier is used to obtain the position of the center point of the target first graphic mark according to the at least one sub-graphic, and to determine the offset vector according to the center point of the field of view of the target first graphic mark identified by the first identifier and the center point of the target first graphic mark.

3. The semiconductor transmission device positioning device according to claim 1, characterized in that, The first graphic identifier includes a graphic code group, which includes at least one sub-graphic located on at least one side of a center point of the first graphic identifier; the coding sequence includes at least a code for indicating the mileage of semiconductor transmission equipment between the current first graphic identifier and a known reference point on the aerial track.

4. The semiconductor transfer device positioning apparatus according to claim 1, wherein, Also includes: A plurality of second graphic marks are arranged at intervals along the straight direction of the semiconductor transmission equipment on a second side of the aerial track away from the first side along a first direction, wherein the first direction intersects with the straight direction of the semiconductor transmission equipment; A second identifier, connected to the controller, for at least identifying rough positioning information of a target second graphic mark having the smallest distance from the current semiconductor transmission device position; The coarse positioning information includes the code of the target second graphic identifier in the code sequence of the plurality of second graphic identifiers, as well as the semiconductor transmission equipment mileage between the current semiconductor transmission equipment position and the identification starting point of the target second graphic identifier.

5. The semiconductor transfer device positioning device according to claim 4, wherein, The plurality of second graphic marks are evenly spaced along the straight direction of the semiconductor transmission equipment; The controller is configured to: Calculate the real-time terminal distance between the current semiconductor transport equipment position and the target storage / pickup point according to the operation starting point position of the semiconductor transport equipment on the aerial track, the number of second graphic identifiers between the target second graphic identifiers, the target size of the second graphic identifier, the mileage of the semiconductor transport equipment in the interval, and the track position information of the target storage / pickup point; If the real-time end point distance is greater than the first threshold and less than or equal to the second threshold, control the semiconductor transfer device to decelerate and travel at the first-stage speed; the first threshold is less than the second threshold; If the real-time end point distance is greater than the third threshold and less than or equal to the first threshold, control the semiconductor transfer device to decelerate and travel at the second-stage speed; the third threshold is less than the first threshold; the second-stage speed is less than the first-stage speed; If the real-time end point distance is greater than the fourth threshold and less than or equal to the third threshold, control the semiconductor transfer device to decelerate and travel at the third-stage speed; the fourth threshold is less than the third threshold; the third-stage speed is less than the second-stage speed.

6. The semiconductor transfer device positioning device according to claim 5, wherein The controller is configured to: Obtain the coordinate system information of the aerial track, where the coordinate system information includes the track type of the aerial track that the semiconductor transfer device needs to pass through when performing the current operation task, and the number of sections, length, and graphic identification information of different types of tracks. The track type includes straight tracks and curved tracks, and the graphic identification information includes the code, size, and spacing distance of the first graphic identification, and the code, size, and spacing distance of the second graphic identification; If the current semiconductor transfer device is located on a straight track, runs through the target storage / pickup point, and the real-time end point distance is less than or equal to the reverse distance threshold, control the semiconductor transfer device to reverse to the target storage / pickup point and stop.

7. The semiconductor transfer device positioning apparatus according to claim 5, wherein, The controller is configured to: If the distance between the starting point of the adjacent next operation task of the semiconductor transfer device and the current position of the semiconductor transfer device is less than or equal to the reverse distance threshold, and the starting point is behind the forward direction of the current semiconductor transfer device, control the semiconductor transfer device to reverse to the starting point and stop.

8. The semiconductor transmission device positioning device according to claim 6 or 7, characterized in that The controller is further configured to: Before or during controlling the semiconductor transfer device to reverse or move forward to the stop point, obtain the spacing distance between the semiconductor transfer device and other semiconductor transfer devices in its forward direction; If the spacing distance is less than or equal to the safety distance, control the semiconductor transfer device to stop; otherwise, control the semiconductor transfer device to run to the stop point; the stop point includes the starting point or the target storage / pickup point.

9. The semiconductor transfer device positioning apparatus according to claim 4, wherein, It further includes: A motor encoder, which is arranged on the semiconductor transfer device and is connected to the controller, and is used to obtain the mileage of the semiconductor transfer device between the current position of the semiconductor transfer device and the starting point of recognition of the target first graphic identification; And It is also used to obtain the mileage of the semiconductor transfer device between the current position of the semiconductor transfer device and the starting point of recognition of the target second graphic identification.

10. The semiconductor transmission device positioning device according to any one of claims 1-7, characterized in that, The controller is further configured to, before obtaining the precise positioning information, perform the following precise positioning verification task: Control the semiconductor transfer device to run on the aerial track at a preset verification speed, and obtain the verification start code and the starting mileage of the semiconductor transfer device. The verification start code includes the code of the first identifier closest to the starting operation point of the semiconductor transfer device; After the semiconductor transfer device runs a preset travel value on the aerial track at the preset calibration speed, obtain the calibration termination code and the termination mileage of the semiconductor transfer device; Obtain a first calibration value for calibrating the fine positioning information according to the calibration start code, the start mileage, the calibration termination code, and the termination mileage.

11. The semiconductor transmission device positioning apparatus according to claim 4, wherein The controller is further configured to perform the following rough positioning calibration tasks before obtaining the rough positioning information: Obtain the initial rough positioning information and the start mileage at the starting point of the operation of the semiconductor transfer device; Obtain the rough positioning information and the mileage when the semiconductor transfer device moves forward to a preset position on the aerial track; Obtain a second calibration value for calibrating the rough positioning information according to the initial rough positioning information, the start mileage, the rough positioning information and the mileage at the preset position.

12. The semiconductor transfer device positioning apparatus according to claim 4, wherein, The controller is further configured to: Determine the map data of the semiconductor transfer device running on the aerial track according to the historical data of the fine positioning information and the historical data of the rough positioning information of the semiconductor transfer device running on the aerial track. The map data includes: the mileage of the semiconductor transfer device corresponding to the encoding in the encoding sequences of multiple first graphic identifiers from the starting point of the aerial track, and the mileage of the semiconductor transfer device corresponding to the encoding in the encoding sequences of multiple second graphic identifiers from the starting point of the aerial track.

13. A semiconductor manufacturing handling system, characterized in that, Comprising: A semiconductor transfer device; An aerial track for supporting the travel of the semiconductor transfer device, and the semiconductor transfer device stores and retrieves the semiconductor material boxes it transports at the workstations of the corresponding processes; And The semiconductor transfer device positioning device according to any one of claims 1-12; Wherein, the semiconductor transfer device positioning device is used to determine the current position of the semiconductor transfer device and / or the real-time distance between the semiconductor transfer device and the target storage / retrieval point.

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