Micro device carrier plate and light-emitting element transfer method
By introducing storage tanks on the micro device carrier plate, the dust pollution problem caused by insufficient decomposition of laser release glue is solved, which improves production efficiency and reduces costs.
Patent Information
- Application Number
- CN202510412317.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-02
- Publication Date
- 2025-07-25
AI Technical Summary
During the production process of micro-light emitting diode displays, insufficient decomposition of laser release glue leads to dust pollution, affecting production capacity and increasing costs.
The storage tank is introduced on the micro device carrier plate, which surrounds the light-emitting element to store the dust generated when the laser release glue is not decomposed sufficiently, and prevent the dust from spreading to other areas.
The product production process is simplified, the production capacity is improved, the production cost is reduced, and the impact of frequent etching and cleaning is avoided.
Smart Images
Figure CN120376495A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of display technology, and in particular to a micro-device carrier and a light-emitting element transfer method. Background Art
[0002] With the continuous development of science and technology, more and more display products, such as mobile phones, tablets, laptops and smart wearable devices, are widely used in people's daily life and work, bringing great convenience to people's daily life and work, and becoming an indispensable tool for people today.
[0003] Micro-LED display is a display that integrates a high-density, tiny-sized LED array on a substrate to realize image display. It is regarded as the next generation of display due to its advantages such as high quality, thin body and low energy consumption, and is gradually becoming the mainstream in display devices.
[0004] In the production process of micro-LED displays, a micro-device carrier is usually used to transfer light-emitting components. How to increase the production capacity of micro-LEDs and reduce production costs has become one of the technical issues that need to be solved urgently at this stage. Summary of the invention
[0005] In order to solve the above technical problems, the present disclosure provides a micro-device carrier and a light-emitting element transfer method, aiming to improve production capacity and reduce production costs.
[0006] In a first aspect, the present disclosure provides a micro device carrier for transferring a light emitting element, the micro device carrier comprising:
[0007] substrate;
[0008] A light emitting element is arranged on one side of the substrate, and the light emitting element and the substrate are fixed by laser release glue;
[0009] A receiving groove is fixed on one side of the base, the receiving groove surrounds the light emitting element, and the receiving groove includes an opening, and the opening exposes the light emitting element.
[0010] In a second aspect, based on the same inventive concept, the present disclosure provides a light emitting element transfer method, comprising:
[0011] The micro-device carrier of the first aspect is arranged opposite to the temporary substrate, and the side of the micro-device carrier provided with the light-emitting element faces the temporary substrate;
[0012] On the side of the micro-device carrier away from the temporary substrate, a laser is used to irradiate the area on the micro-device carrier where the light-emitting element to be transferred is located, so that the light-emitting element to be transferred is separated from the micro-device carrier and transferred to the temporary substrate.
[0013] The technical solutions provided by the embodiments of the present disclosure have the following advantages compared with the prior art:
[0014] In the micro-device carrier provided by the embodiments of the present disclosure, a receiving groove is introduced around the light-emitting element. When, under the action of laser, the laser release glue decomposes incompletely to form dust, since the receiving groove is provided around the light-emitting element, the formed dust can be received by the receiving groove, avoiding the diffusion of dust to other areas. Moreover, since adjacent light-emitting elements are isolated by the receiving groove, the receiving groove can also block the diffusion of dust to the areas corresponding to adjacent light-emitting elements, preventing the light-emitting elements in other positions from being contaminated by dust. In this way, after the transfer of the light-emitting element is completed, since the dust is concentrated in the receiving groove corresponding to the transferred light-emitting element, the dust in the receiving groove can be cleaned separately, without the need to etch and clean the entire micro-device carrier, thus avoiding the problems of frequent etching and cleaning of the micro-device carrier in the related art that affect production capacity and the resulting increase in production costs. Therefore, the method of introducing the receiving groove in the micro-device carrier in the embodiments of the present disclosure avoids the diffusion of dust, simplifies the product manufacturing process, is conducive to improving production capacity, and reduces production costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The accompanying drawings herein are incorporated into the specification and constitute a part of this specification, showing embodiments consistent with the present disclosure and, together with the specification, are used to explain the principles of the present disclosure.
[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the accompanying drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.
[0017] Figure 1 Shown is a schematic diagram of repairing a light-emitting element on a receiving carrier using a micro-device carrier in the related art;
[0018] Figure 2 Shown is a plan view of a micro-device carrier provided by an embodiment of the present disclosure;
[0019] Figure 3 Shown as Figure 2 a cross-sectional view of the micro-device carrier in the AA direction in
[0020] Figure 4 Shown is a manufacturing process diagram of a micro-device carrier provided by an embodiment of the present disclosure;
[0021] Figure 5The figure shows a schematic process of transferring at least one light-emitting element on the micro-device carrier provided by the embodiments of the present disclosure to a transient substrate;
[0022] Figure 6 As shown, Figure 2 Another AA-direction cross-sectional view of the micro-device carrier in [description];
[0023] Figure 7 As shown, Figure 2 A BB-direction cross-sectional view of the micro-device carrier in [description];
[0024] Figure 8 The figure shows a schematic structural view of a light-emitting element in the micro-device carrier provided by the embodiments of the present disclosure;
[0025] Figure 9 As shown, Figure 2 Another AA-direction cross-sectional view of the micro-device carrier in [description];
[0026] Figure 10 The figure shows a flowchart of a method for transferring a light-emitting element provided by the embodiments of the present disclosure. Detailed implementation manners
[0027] In order to more clearly understand the above objects, features, and advantages of the present disclosure, the solutions of the present disclosure will be further described below. It should be noted that, without conflict, the embodiments of the present disclosure and the features in the embodiments may be combined with each other.
[0028] Many specific details are set forth in the following description to facilitate a thorough understanding of the present disclosure, but the present disclosure may be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only a part of the embodiments of the present disclosure, rather than all of the embodiments.
[0029] In the manufacturing process of a micro-light-emitting diode display, usually several light-emitting elements are first fabricated on a substrate, and then the light-emitting elements are transferred to a target substrate through multiple steps. During the process of transferring the light-emitting elements to the target substrate, the light-emitting elements need to be temporarily bonded to a carrier first to form a micro-device carrier. In the manufacturing process, the light-emitting elements on the micro-device carrier are transferred to a receiving carrier. When the light-emitting elements in some areas on the receiving carrier need to be repaired, the light-emitting elements in the original areas are removed, and the light-emitting elements on the micro-device carrier are transferred to the corresponding areas again. Figure 1The following shows a schematic diagram of repairing a light-emitting element 03 on a receiving carrier 02 using a micro-device carrier 01 in the related art. At a position where repair is needed, laser irradiation is applied to the micro-device carrier 01. Under the action of the laser, the laser release glue 04 causes the corresponding light-emitting element to detach from the micro-device carrier. During this process, if the interaction between the laser and the laser release glue is insufficient, it will lead to insufficient decomposition of the laser release glue. Insufficient decomposition of the laser release glue will generate dust, and the dust will contaminate other light-emitting elements on the micro-device carrier. When other light-emitting elements need to be transferred to the receiving carrier, the accumulation of dust will cause these light-emitting elements to fall off in subsequent processes. Therefore, after each laser repair is completed, it is necessary to etch and clean the light-emitting element side of the micro-device carrier to remove the dust corresponding to the laser release glue. However, frequent cleaning will have a great impact on production capacity and will also increase production costs invisibly.
[0030] To solve the above technical problems, the embodiments of the present disclosure provide a micro-device carrier and a method for transferring light-emitting elements, aiming to reduce the influence of dust on light-emitting elements in the product manufacturing process, improve production capacity, and reduce production costs.
[0031] The following will specifically describe the content of the present disclosure in conjunction with the accompanying drawings and specific embodiments.
[0032] Figure 2 The following shows a plan view of a micro-device carrier provided by an embodiment of the present disclosure. Figure 3 The following shows Figure 2 a cross-sectional view of the micro-device carrier in the AA direction in Figure 2 and Figure 3 . The embodiments of the present disclosure provide a micro-device carrier 100 for transferring light-emitting elements 20. The micro-device carrier includes:
[0033] a substrate 10;
[0034] a light-emitting element 20 disposed on one side of the substrate 10, and the light-emitting element 20 is fixed to the substrate 10 through a laser release glue 30;
[0035] a receiving groove 40 fixed to one side of the substrate 10, the receiving groove 40 surrounds the light-emitting element 20, and the receiving groove 40 includes an opening K, and the opening K exposes the light-emitting element 20.
[0036] Optionally, the light-emitting element mentioned in the embodiments of the present disclosure is a micro-light-emitting diode.
[0037] It should be noted that Figure 2 only the micro-device carrier 100 with a rectangular structure is taken as an example to illustrate the micro-device carrier in the present disclosure, and the actual shape of the micro-device carrier 100 is not limited. In some other embodiments of the present disclosure, the micro-device carrier 100 may also be embodied as a non-rectangular structure such as a circle. In addition,Figure 2 The shape, size, and arrangement of the light-emitting elements 20 are also for illustration only, and the present disclosure does not specifically limit this. The number of light-emitting elements 20 on the micro-device carrier 100 is also for illustration only. Figure 3 The shown film layer structure illustrates the relative positional relationship among the substrate 10, the light-emitting elements 20, and the receiving grooves 40, but does not limit the size of the light-emitting elements 20, the thickness of the substrate 10, and the size of the receiving grooves 40.
[0038] Please continue to refer to Figure 2 and Figure 3 In the micro-device carrier 100 provided by the embodiments of the present disclosure, optionally, the substrate 10 is a rigid substrate for supporting the light-emitting elements 20 and the receiving grooves 40. Optionally, during the manufacturing process, after transferring the light-emitting elements 20 to the substrate 10 of the micro-device carrier, the receiving grooves 40 are fabricated on the substrate 10. The following will describe a manufacturing process of the micro-device carrier.
[0039] Figure 4 Shown is a manufacturing process diagram of the micro-device carrier provided by the embodiments of the present disclosure. First, the light-emitting elements 20 on the substrate 00 (such as a wafer) are transferred onto the substrate 10 provided with the laser release glue 30, so that the light-emitting elements 20 are fixed on the substrate 10 through the laser release glue 30. At this time, the electrodes of the light-emitting elements 20 are in direct contact with the laser release glue 30. Second, the original substrate 00 fixed to the light-emitting elements 20 is removed. Then, the laser release glue 30 on the substrate 10 is etched, and the laser release glue 30 directly below the light-emitting elements 20 is retained, while the laser release glue 30 in other areas is removed. Finally, the receiving grooves 40 are fabricated on the substrate 10 to form the micro-device carrier as shown in Figure 3 Optionally, the receiving grooves 40 can be fabricated using the yellow light process. Of course, in some other embodiments of the present disclosure, the receiving grooves 40 can also be fabricated using other feasible processes, and the present disclosure does not specifically limit this.
[0040] It should be noted that when fabricating the receiving grooves 40 on the micro-device carrier, the receiving grooves 40 are located around each light-emitting element 20, and an opening K is formed between the light-emitting elements 20 and the receiving grooves 40. This opening K is used to release the light-emitting elements 20 during the process of transferring the light-emitting elements 20 from the micro-device carrier. Therefore, the size of this opening K is equal to or slightly larger than the size of the light-emitting elements 20 to avoid interference with the release process of the light-emitting elements 20.
[0041] Figure 5The figure shows a schematic process of transferring at least one light-emitting element 20 on the micro-device carrier provided in the embodiment of the present disclosure to a transient substrate. The micro-device carrier and the transient substrate are arranged opposite to each other. The side of the micro-device carrier where the light-emitting element 20 is provided faces the transient substrate 90, and the side of the transient substrate 90 where the light-emitting element 20 is provided faces the micro-device carrier 100. During the manufacturing process, on the side of the micro-device carrier 100 facing away from the transient substrate, a laser is used to irradiate the area where the light-emitting element 20 to be transferred is located on the micro-device carrier. Due to the action of the laser, the laser-release glue 30 between the light-emitting element 20 to be transferred and the substrate 10 in the micro-device carrier 100 decomposes, causing the light-emitting element 20 to be transferred to detach from the micro-device carrier 100 and be transferred to the transient substrate 90.
[0042] In the micro-device carrier 100 provided in the embodiment of the present disclosure, a receiving groove 40 is introduced around the light-emitting element 20. When the laser-release glue 30 decomposes incompletely to form dust 31 under the action of the laser, since the receiving groove 40 is provided around the light-emitting element 20, the receiving groove 40 can receive the formed dust 31 to prevent the dust from spreading to other areas. Moreover, since adjacent light-emitting elements 20 are isolated by the receiving groove 40, the receiving groove 40 can also block the spread of dust to the areas corresponding to adjacent light-emitting elements 20, preventing the light-emitting elements 20 at other positions from being contaminated by dust. In this way, after the transfer of the light-emitting element 20 is completed, since the dust is concentrated in the receiving groove 40 corresponding to the light-emitting element 20 that has been transferred away, the dust in the receiving groove 40 can be cleaned separately without etching and cleaning the entire micro-device carrier, thereby avoiding the problems of frequent etching and cleaning of the micro-device carrier in the related art that affect production capacity and the resulting increase in production costs. Therefore, the method of introducing the receiving groove 40 in the micro-device carrier in the embodiment of the present disclosure avoids the spread of dust, simplifies the product manufacturing process, is beneficial to improving production capacity, enhancing product yield, and reducing production costs.
[0043] Please refer to Figure 3 , in an alternative embodiment of the present disclosure, along the direction from the light-emitting element 20 to the receiving groove 40, the width s of the opening of the receiving groove 40 is greater than or equal to 3 μm. The spacing width between adjacent light-emitting elements 20 on the micro-device carrier is about 7 μm, and the width of the light-emitting element 20 is usually less than 3 μm. When the width s of the opening between the receiving groove 40 and the light-emitting element 20 in the embodiment of the present disclosure is set to be greater than or equal to 3 μm, it is beneficial to avoid interference between the light-emitting element 20 and the receiving groove 40 when the light-emitting element 20 is released by laser irradiation, thereby realizing the smooth transfer of the light-emitting element 20.
[0044] Optionally, in the direction from the light-emitting element 20 towards the receiving groove 40, the width of the opening of the receiving groove 40 is less than 7 micrometers. In this way, the receiving groove 40 has a certain lateral extension space, which is conducive to increasing the accommodation space of the receiving groove 40, realizing the accommodation of dust caused by uneven decomposition of the laser release glue 30 during the laser irradiation process. The larger the accommodation space of the receiving groove 40, the more conducive it is to avoid the overflow of dust, and thus it is conducive to avoiding the pollution of other light-emitting elements 20 by dust.
[0045] Optionally, the size of the opening of the receiving groove 40 is equivalent to or less than the size of the light spot during the laser repair process.
[0046] Please continue to refer to Figure 3 , in an alternative embodiment of the present disclosure, the receiving groove 40 includes a first part B1 and a second part B2 connected to each other. The first part B1 is perpendicular to the plane where the substrate 10 is located, and the second part B2 is parallel to the plane where the substrate 10 is located. In the direction perpendicular to the plane where the substrate 10 is located, the first part B1 is located between the second part B2 and the substrate 10; in the direction from the light-emitting element 20 towards the receiving groove 40, the distance between the second part B2 and the light-emitting element 20 is less than the distance between the first part B1 and the light-emitting element 20.
[0047] Please combine Figure 2 and Figure 3 , the first part B1 in the receiving groove 40 can be regarded as a support structure in contact with the substrate. The second part B2 is located on the side of the first part B1 away from the substrate 10 and is connected to the first part B1. Optionally, the first part B1 is perpendicular to the substrate 10, and the second part B2 is parallel to the substrate 10. In the direction parallel to the substrate 10, in the receiving groove 40 and the corresponding light-emitting element 20, the distance between the second part B2 and the light-emitting element 20 is smaller, and the distance between the first part B1 and the light-emitting element 20 is larger. It is equivalent to that the second part B2 extends in the direction towards the light-emitting element 20 relative to the first part B1. The end of the second part B2 towards the light-emitting element 20 surrounds the light-emitting element 20 to form the opening K of the receiving groove 40 as a whole, and this opening K exposes the light-emitting element 20. In this way, an accommodation space is formed between the vertically arranged first part B1 and the horizontally arranged second part B2, and the dust 31 caused by uneven decomposition of the laser release glue 30 is accommodated in this accommodation space. For example, please refer to Figure 5Meanwhile, it is also beneficial to block the diffusion of the dust 31 to the areas of other light-emitting elements 20, thereby avoiding the contamination of other light-emitting elements 20 by the dust. In addition, the receiving grooves 40 correspondingly arranged for other light-emitting elements 20 can also block the contamination of the corresponding light-emitting elements 20 by external dust. The dual protection of the receiving grooves 40 corresponding to the light-emitting elements 20 to be transferred and the receiving grooves 40 of other light-emitting elements 20 effectively avoids dust contamination, thus avoiding the problems of reduced production capacity and increased costs caused by the need to frequently clean the micro-device carrier due to dust contamination in the prior art.
[0048] Please continue to refer to Figure 3 In an alternative embodiment of the present disclosure, along the direction perpendicular to the plane where the substrate 10 is located, the distance between the surface of the second part B2 facing away from the substrate 10 and the substrate 10 is d1, and the thickness of the laser release adhesive 30 is d2, where d1≥d2. That is to say, when introducing the receiving groove 40 in the micro-device carrier in the embodiment of the present disclosure, the vertical height of the receiving groove 40 is greater than the thickness of the laser release adhesive 30. If the thickness of the laser release adhesive 30 is relatively large while the height of the receiving groove 40 is relatively small, the amount of dust caused by insufficient decomposition of the laser release adhesive 30 may be relatively large, and the small space of the receiving groove 40 will cause dust to overflow. Therefore, in this embodiment, the vertical height of the receiving groove 40 is set to be greater than the thickness of the laser release adhesive 30, which is beneficial to increasing the longitudinal space of the receiving groove 40, that is, the space in the direction perpendicular to the plane where the substrate 10 is located, which is equivalent to being beneficial to increasing the overall accommodating space of the receiving groove 40, thereby being beneficial to increasing the amount of dust that the receiving groove 40 can accommodate and avoiding the problem of dust overflow caused by the too small accommodating space of the receiving groove 40.
[0049] Please continue to refer to Figure 3, in an alternative embodiment of the present disclosure, along the direction perpendicular to the plane where the substrate 10 is located, the distance between the surface of the light-emitting element 20 facing away from the substrate 10 and the substrate 10 is d3, where the distance d1 between the surface of the second part B2 facing away from the substrate 10 and the substrate 10 is d1≥d3. That is to say, when the receiving groove 40 is arranged around the light-emitting element 20 in the micro-device carrier board, the surface of the second part B2 of the receiving groove 40 facing away from the substrate 10 can be flush with the surface of the light-emitting element 20 facing away from the substrate 10, that is, the distance d3 between the surface of the light-emitting element 20 facing away from the substrate 10 and the substrate 10 is equal to the distance d1 between the surface of the second part B2 of the receiving groove 40 facing away from the substrate 10 and the substrate 10. At this time, the surface of the light-emitting element 20 facing away from the substrate 10 can be used as a reference surface to manufacture the receiving groove 40, which is beneficial to simplifying the manufacturing process of the receiving groove 40. In addition, when the surface of the second part B2 of the receiving groove 40 facing away from the substrate 10 is set to be flush with the surface of the light-emitting element 20 facing away from the substrate 10, it is also beneficial to increase the longitudinal depth of the receiving groove 40, increase the amount of dust that the receiving groove 40 can accommodate, thereby reducing or avoiding dust overflow and contaminating other light-emitting elements 20. In addition, when the surface of the light-emitting element 20 facing away from the substrate 10 is flush with the surface of the second part B2 of the receiving groove 40 facing away from the substrate 10, since the opening K of the receiving groove 40 is substantially surrounded by the second part B2, in the direction of the light-emitting element 20 pointing to the receiving groove 40, there is an overlap between the light-emitting element 20 and the opening K of the receiving groove 40. When transferring the light-emitting element 20 by laser irradiation, the light-emitting element 20 can directly descend from the position of the opening K of the receiving groove 40, which is beneficial to reducing the probability of interference with the opening K of the receiving groove 40 during the descending process, and thus is beneficial to improving the transfer yield of the light-emitting element 20.
[0050] The above embodiment shows the scheme where the surface of the light-emitting element 20 facing away from the substrate 10 is flush with the surface of the second part B2 facing away from the substrate 10. In some other embodiments of the present disclosure, the relative positional relationship between the surface of the light-emitting element 20 facing away from the substrate 10 and the surface of the second part B2 facing away from the substrate 10 may also be other. For example, please refer to Figure 6 , Figure 6 as shown in Figure 2Another AA-direction cross-sectional view of the micro-device carrier board. In some other embodiments of the present disclosure, after the receiving groove 40 is provided around the light-emitting element 20 in the micro-device carrier board, the surface of the second part B2 of the receiving groove 40 facing away from the substrate 10 is higher than the surface of the light-emitting element 20 facing away from the substrate 10, that is, the distance d3 between the surface of the light-emitting element 20 facing away from the substrate 10 and the substrate 10 is less than the distance d1 between the surface of the second part B2 of the receiving groove 40 facing away from the substrate 10 and the substrate 10, and the surface of the second part B2 of the receiving groove 40 facing away from the substrate 10 protrudes from the surface of the light-emitting element 20 facing away from the substrate 10 by a certain distance. In this way, it is equivalent to increasing the longitudinal space of the receiving groove 40, which is beneficial to increasing the space for the receiving groove 40 to accommodate dust. In addition, the way that the surface of the second part B2 of the receiving groove 40 facing away from the substrate 10 protrudes from the surface of the light-emitting element 20 facing away from the substrate 10 can accommodate a larger range of dust, which is beneficial to avoiding the overflow of dust.
[0051] Please continue to refer to Figure 3 and Figure 6 , in an alternative embodiment of the present disclosure, the first cross-section of the receiving groove 40 between adjacent light-emitting elements 20 is in a T-shaped structure, and the first cross-section is perpendicular to the plane where the substrate 10 is located and parallel to the arrangement direction of adjacent light-emitting elements 20.
[0052] When the first cross-section of the receiving groove 40 between adjacent light-emitting elements 20 is in a T-shaped structure, the part perpendicular to the plane where the substrate 10 is located in the T-shaped structure can be regarded as the first part B1 of the receiving groove 40, and the part parallel to the plane where the substrate 10 is located can be regarded as the second part B2 of the receiving groove 40. In this way, adjacent two light-emitting elements 20 can share the same first part B1, and there is no need to separately manufacture the corresponding first part B1 of the receiving groove 40 for different light-emitting elements 20, which is beneficial to simplifying the manufacturing process. When adjacent light-emitting elements 20 share the first part B1 of the receiving groove 40, the second part B2 located on the side of the first part B1 facing away from the substrate 10 can extend towards the directions of the adjacent two light-emitting elements 20 respectively, so as to form a T-shaped cross-sectional structure in the receiving groove 40 between adjacent light-emitting elements 20. The first part B1 and the second part B2 extending towards one of the light-emitting elements 20 form an L-shaped receiving space, and the first part B1 and the second part B2 extending towards the other light-emitting element 20 form another L-shaped receiving space, so as to realize the receiving of dust at the corresponding positions of different light-emitting elements 20. It should be noted that in the T-shaped receiving groove 40 between adjacent light-emitting elements 20, the second parts B2 corresponding to different light-emitting elements 20 can be integrally formed or separately manufactured, and the present disclosure does not specifically limit this.
[0053] Figure 7 As shown in Figure 2A BB cross-sectional view of a carrier board for micro-devices shows the relative positional relationship between the receiving groove 40 near the edge of the micro-device and the light-emitting element 20. Please refer to Figure 2 and Figure 7 , in an alternative embodiment of the present disclosure, the light-emitting element 20 includes an edge light-emitting element 21 adjacent to the edge B0 of the micro-device carrier board. The first cross-section of the receiving groove 40 between the edge light-emitting element 21 and the edge B0 of the micro-device carrier board is in an L-shaped structure. The first cross-section is perpendicular to the plane where the substrate 10 is located and parallel to the arrangement direction of the edge light-emitting element 21 and the edge B0.
[0054] It should be noted that the edge light-emitting element 21 mentioned in the embodiments of the present disclosure refers to the light-emitting element 20 adjacent to the edge of the micro-device carrier board, and no other light-emitting elements 20 are provided between the edge light-emitting element 21 and the edge B0 of the micro-device carrier board. Although Figure 7 only the receiving groove 40 corresponding to the edge light-emitting element 21 adjacent to the left edge B0 of the micro-device carrier board 100 is shown, the arrangement of the receiving groove 40 corresponding to the edge light-emitting element 21 adjacent to other edges can be set in the same way.
[0055] Please continue to refer to Figure 2 and Figure 7 , in the present disclosure, a receiving groove 40 is also provided between the edge light-emitting element 21 and the adjacent edge B0 of the micro-device carrier board. The cross-sectional structure of the receiving groove 40 between the edge light-emitting element 21 and the adjacent light-emitting element 20 is different. The receiving groove 40 adjacent to the edge of the micro-device carrier board is in an L-shaped structure. Among them, the vertical part perpendicular to the plane where the substrate 10 is located in the L-shaped structure can be regarded as the first part B1 of the receiving groove 40, and the horizontal part parallel to the plane where the substrate 10 is located can be regarded as the second part B2 of the receiving groove 40. The second part B2 extends in the direction of the light-emitting element 20 and does not extend in the direction of the edge of the micro-device carrier board, thus forming an L-shaped cross-sectional structure. Considering that dust is formed due to insufficient decomposition of the laser release glue 30 during the transfer of the light-emitting element 20, no dust will be generated at the edge position of the micro-device carrier board. Therefore, the receiving groove 40 between the edge light-emitting element 21 and the adjacent edge of the micro-device carrier board only needs to be set in an L-shaped cross-sectional structure to collect the dust in the area where the corresponding light-emitting element 20 is located, and there is no need to further extend the second part B2 to form a receiving groove 40 in the area near the edge of the micro-device carrier board. Therefore, setting the receiving groove 40 between the edge light-emitting element 21 and the adjacent micro-device carrier board in an L-shaped structure and extending the second part B2 in the direction of the light-emitting element 20 can not only achieve the collection of dust but also help save the materials required to form the receiving groove 40 and reduce production costs.
[0056] Please refer to Figure 2 、Figure 3 and Figure 7 , in an alternative embodiment of the present disclosure, the receiving grooves 40 corresponding to different light-emitting elements 20 are integrally formed insulating structures, which are embodied as integrally formed grid-like structures in Figure 2 , and the openings of the grids correspond to the openings of the receiving grooves 40.
[0057] Please refer to Figure 5 . During the manufacturing process, after transferring the light-emitting element 20 to the micro-device carrier board and etching away the laser release glue 30 between adjacent light-emitting elements 20, the receiving groove 40 is then fabricated on the substrate 10 of the micro-device carrier board. If different processes are used to fabricate the receiving grooves 40 between different light-emitting elements 20 respectively, the manufacturing difficulty of the receiving grooves 40 will be increased invisibly, and the production efficiency will be reduced. Therefore, when the receiving grooves 40 corresponding to different light-emitting elements 20 on the micro-device carrier board are fabricated by an integral forming process in the embodiments of the present disclosure, there is no need to introduce different manufacturing processes for the receiving grooves 40 corresponding to different light-emitting elements 20 respectively, which is beneficial to simplifying the manufacturing process of the receiving grooves 40 on the micro-device carrier board and improving the production efficiency. Optionally, the receiving grooves 40 on the micro-device carrier board can be fabricated by a yellow light process. The material of the receiving groove 40 is an insulating material, which is beneficial to avoiding the influence of static electricity on the light-emitting element 20 during the manufacturing process.
[0058] Please continue to refer to Figure 3 . In an alternative embodiment of the present disclosure, the light-emitting element 20 includes a light-emitting chip 22 and a first electrode P1 and a second electrode P2 electrically connected to the light-emitting chip 22. Along the direction perpendicular to the plane where the substrate 10 is located, the first electrode P1 and the second electrode P2 are located on the side of the light-emitting chip 22 facing the substrate 10; the laser release glue 30 is at least located on the side of the first electrode P1 and the second electrode P2 facing the substrate 10.
[0059] Figure 8 The following shows a schematic structural diagram of the light-emitting element 20 in the micro-device carrier board provided in the embodiments of the present disclosure. Please refer to Figure 8 . The light-emitting element 20 includes an epitaxial layer 92, an n-type GaN contact layer 93, a quantum well light-emitting layer 94, and a P-type GaN contact layer 95. The two electrodes P1 and P2 of the light-emitting element 2020 are electrically connected to the n-type GaN contact layer 93 and the P-type GaN contact layer 95 respectively. Optionally, the light-emitting element 20 further includes a reflective layer 96. The light-emitting chip mentioned in this embodiment can be regarded as a combined structure of the epitaxial layer 92, the n-type GaN contact layer 93, the quantum well light-emitting layer 94, and the P-type GaN contact layer 95. It should be noted that Figure 8 The specific structure of the light-emitting element 20 shown in the illustrated embodiment is only schematic, and the present disclosure does not limit the actual structure of the light-emitting element 20.
[0060] On the micro-device carrier board, the first electrode P1 and the second electrode P2 of the light-emitting element 20 are located between the light-emitting chip 22 and the substrate 10 of the micro-device carrier board. A laser-release adhesive 30 is provided on the substrate 10 of the micro-device carrier board. When the light-emitting element 20 is transferred onto the micro-device carrier board, the first electrode P1 and the second electrode P2 in the light-emitting element 20 come into contact with the laser-release adhesive 30. The laser-release adhesive 30 is at least located between the first electrode P1 and the substrate 10 of the micro-device carrier board, and between the second electrode P2 and the substrate 10 of the micro-device carrier board. The laser-release adhesive 30 has a certain adhesive force and can fix the light-emitting element 20 on the substrate 10 of the micro-device carrier board. The thickness of the laser-release adhesive 30 on the micro-device carrier board is different, and the relative positional relationship between the laser-release adhesive 30 and the light-emitting element 20 may also be different. For example Figure 9 , in this embodiment, the thickness of the laser-release adhesive 30 is small. After the light-emitting element 20 is transferred onto the micro-device carrier board, the laser-release adhesive 30 is only located between the first electrode and the second electrode and the substrate 10, and does not extend further in the direction of the light-emitting chip. Among them, Figure 9 as shown Figure 2 in another AA cross-sectional view of the micro-device carrier board in. When the thickness of the laser-release adhesive 30 on the micro-device carrier board is set to be small, in the subsequent process of transferring the light-emitting element 20, the light-emitting element 20 can be detached from the micro-device carrier board by laser irradiation for a short time, which is beneficial to improving the transfer efficiency.
[0061] Of course, in some other embodiments of the present disclosure, the thickness of the laser-release adhesive 30 on the micro-device carrier board can be appropriately increased. When the light-emitting element 20 is transferred onto the micro-device carrier board, the sides of the first electrode and the second electrode of the light-emitting element 20 and the area between the first electrode P1 and the second electrode P2 are also filled with the excitation-light release adhesive. For example, please refer to Figure 3, in an alternative embodiment of the present disclosure, along the arrangement direction of the first electrode P1 and the second electrode P2, the laser release adhesive 30 is also located between the first electrode P1 and the second electrode P2; the thickness of the laser release adhesive 30 located between the first electrode P1 and the second electrode P2 is D1, and the thickness of the laser release adhesive 30 located on the side of the first electrode P1 and the second electrode P2 facing the substrate 10 is D2, where D2 < D1. At this time, the thickness of the laser release adhesive 30 filled between the first electrode P1 and the second electrode P2 is greater than the thickness of the laser release adhesive 30 between the first electrode P1 and the second electrode P2 and the substrate 10. This is beneficial to increasing the contact area between the light-emitting element 20 and the laser release adhesive 30. When transferring the light-emitting element 20 to the micro-device carrier board, it is beneficial to improve the fixing reliability between the light-emitting element 20 and the micro-device carrier board, and avoid the problem of unnecessary detachment of the light-emitting element 20 due to unreliable fixing between the light-emitting element 20 and the micro-device carrier board during the process of transferring the light-emitting element 20 using the micro-device carrier board. Optionally, in the micro-device carrier board, the laser release adhesive 30 is only located on the side of the light-emitting chip in the light-emitting element 20 facing the first electrode P1 and the second electrode P2, and the laser release adhesive 30 partially covers the light-emitting element 20, which is beneficial to avoiding the influence of the laser release adhesive 30 on the light-emitting efficiency of the light-emitting chip, and at the same time, it is also beneficial to avoid the problem of increasing the transfer difficulty of the light-emitting element 20 due to the too thick laser release adhesive 30. Of course, to ensure the fixing reliability between the light-emitting element 20 and the micro-device carrier board, in the process shown in Figure 4 , the thickness of the laser release adhesive 30 on the micro-device carrier board can be set to be relatively large. When transferring the light-emitting element 20 to the corresponding position of the laser release adhesive 30, the laser release adhesive 30 may cover at least part of the side surface of the light-emitting chip. During the subsequent etching process, the laser release adhesive 30 located on the side surface of the light-emitting chip is removed, which can not only avoid affecting the light emission of the light-emitting chip, but also be beneficial to improving the fixing reliability between the light-emitting element 20 and the substrate 10 on the micro-device carrier board, and at the same time, it is also convenient for the subsequent process of transferring the light-emitting element 20 by laser irradiation.
[0062] Figure 10 The following is a flowchart of a method for transferring the light-emitting element 20 provided by an embodiment of the present disclosure. Based on the same inventive concept, the present disclosure also provides a method for transferring the light-emitting element 20. Please refer to Figure 10 and Figure 5 , and this method for transferring the light-emitting element includes:
[0063] S1. Oppositely arrange the micro-device carrier board 100 in the foregoing embodiment of the present disclosure and the transient substrate 90, and make the side of the micro-device carrier board 100 provided with the light-emitting element 20 face the transient substrate 90;
[0064] S2. On the side of the micro-device carrier 100 facing away from the transient substrate 90, the area on the micro-device carrier 100 where the light-emitting element 20 to be transferred is located is irradiated with a laser, so that the light-emitting element 20 to be transferred detaches from the micro-device carrier 100 and is transferred to the transient substrate 90.
[0065] The above transfer method can be applied to the process of repairing the missing light-emitting element 20 area on the transient substrate 90, and of course, it is also applicable to the process of transferring multiple light-emitting elements 20 on the micro-device carrier 100 to the transient substrate 90. In the process of transferring the light-emitting element 20 on the micro-device carrier 100 to the transient substrate 90, first, the micro-device carrier 100 and the transient substrate 90 are arranged opposite to each other, so that the side of the micro-device carrier 100 where the light-emitting element 20 is arranged faces the transient substrate 90. On the side of the micro-device carrier 100 facing away from the transient substrate 90, the area on the micro-device carrier 100 where the light-emitting element 20 to be transferred is located is irradiated with a laser. Due to the action of the laser, the laser-release glue 30 between the light-emitting element 20 to be transferred and the substrate 10 in the micro-device carrier 100 decomposes, so that the light-emitting element 20 to be transferred detaches from the micro-device carrier 100 and is transferred to the transient substrate 90.
[0066] In the micro-device carrier 100 provided by the embodiment of the present disclosure, a storage groove 40 is introduced around the light-emitting element 20. When the laser-release glue 30 decomposes incompletely to form dust 31 under the action of the laser, since the storage groove 40 is provided around the light-emitting element 20, the storage groove 40 can store the formed dust 31 to prevent the dust from spreading to other areas. Moreover, since the adjacent light-emitting elements 20 are isolated by the storage groove 40, the storage groove 40 can also block the dust from spreading to the area corresponding to the adjacent light-emitting elements 20, preventing the light-emitting elements 20 at other positions from being contaminated by the dust. In this way, after the transfer of the light-emitting element 20 is completed, since the dust is concentrated in the storage groove 40 corresponding to the transferred light-emitting element 20, the dust in the storage groove 40 can be cleaned separately, without etching and cleaning the entire micro-device carrier 100, thus avoiding the problems of affecting production capacity due to frequent etching and cleaning of the micro-device carrier 100 in the related art and the resulting increase in production cost. Therefore, the method of introducing the storage groove 40 in the micro-device carrier 100 in the embodiment of the present disclosure avoids the spread of dust, simplifies the product manufacturing process, is conducive to improving production capacity, and reduces production cost.
[0067] It should be noted that, in this document, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising said element.
[0068] The above are only specific embodiments of the present disclosure, enabling those skilled in the art to understand or implement the present disclosure. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to these embodiments described herein, but rather will conform to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A micro-device carrier board, characterized in that, For transferring a light-emitting element, the micro-device carrier plate comprises: A substrate; A light-emitting element disposed on one side of the substrate, and the light-emitting element is fixed to the substrate by a laser release adhesive; A receiving groove fixed to one side of the substrate, the receiving groove surrounds the light-emitting element, the receiving groove includes an opening, and the opening exposes the light-emitting element.
2. The micro-device carrier board according to claim 1, characterized in that, Along the direction from the light-emitting element to the receiving groove, the width of the opening is greater than or equal to 3 μm.
3. The micro-device carrier board according to claim 1, wherein The receiving groove includes a first part and a second part connected to each other. The first part is perpendicular to the plane where the substrate is located, and the second part is parallel to the plane where the substrate is located. Along the direction perpendicular to the plane where the substrate is located, the first part is located between the second part and the substrate; Along the direction from the light-emitting element to the receiving groove, the distance between the second part and the light-emitting element is less than the distance between the first part and the light-emitting element.
4. The micro-device carrier board according to claim 3, characterized in that, Along the direction perpendicular to the plane where the substrate is located, the distance between the surface of the second part facing away from the substrate and the substrate is d1, and the thickness of the laser release adhesive is d2, and d1≥d2.
5. The micro-device carrier board according to claim 4, wherein Along the direction perpendicular to the plane where the substrate is located, the distance between the surface of the light-emitting element facing away from the substrate and the substrate is d3, wherein d1≥d3.
6. The micro-device carrier board according to claim 3, characterized in that, The first cross-section of the receiving groove between adjacent light-emitting elements has a T-shaped structure, and the first cross-section is perpendicular to the plane where the substrate is located and parallel to the arrangement direction of adjacent light-emitting elements.
7. The micro-device carrier board according to claim 3, characterized in that, The light-emitting element includes an edge light-emitting element adjacent to the edge of the micro-device carrier plate. The first cross-section of the receiving groove between the edge light-emitting element and the edge of the micro-device carrier plate has an L-shaped structure, and the first cross-section is perpendicular to the plane where the substrate is located and parallel to the arrangement direction of the edge light-emitting element and the edge.
8. The micro-device carrier board according to claim 1, wherein The receiving grooves corresponding to different light-emitting elements are an integrally formed insulating structure.
9. The micro-device carrier board according to claim 1, wherein The light-emitting element includes a light-emitting chip, a first electrode and a second electrode electrically connected to the light-emitting chip. Along the direction perpendicular to the plane where the substrate is located, the first electrode and the second electrode are located on the side of the light-emitting chip facing the substrate; The laser release adhesive is at least located on the side of the first electrode and the second electrode facing the substrate.
10. The micro-device carrier board according to claim 9, wherein, Along the arrangement direction of the first electrode and the second electrode, the laser release adhesive is also located between the first electrode and the second electrode; the thickness of the laser release adhesive located between the first electrode and the second electrode is D1, and the thickness of the laser release adhesive located on the side of the first electrode and the second electrode facing the substrate is D2, and D2<D1.
11. A method for transferring a light-emitting element, characterized in that, Comprising: Oppositely arrange the micro-device carrier plate according to any one of claims 1 to 10 and the transient substrate, and make the side of the micro-device carrier plate provided with the light-emitting element face the transient substrate; On the side of the micro-device carrier plate facing away from the transient substrate, irradiate the area where the light-emitting element to be transferred on the micro-device carrier plate with a laser, so that the light-emitting element to be transferred detaches from the micro-device carrier plate and is transferred to the transient substrate.