Electronic assembly, electronic equipment and chip structure

Abstract

The invention provides an electronic assembly, electronic equipment and a chip structure, relates to the technical field of packaging, and is used for improving the heat dissipation capability of the electronic assembly. The electronic assembly comprises a circuit board, a first chip, a second chip and a heat transfer plate. The heat transfer plate is located on one side of the circuit board. The first chip is located between the heat transfer plate and the circuit board, and the first chip is connected with the circuit board and the heat transfer plate. The second chip is located on the side, away from the circuit board, of the heat transfer plate and connected with the heat transfer plate. The chip structure can be applied to an electronic component, and the electronic component can be applied to electronic equipment.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of packaging technology, and in particular, to an electronic component, an electronic device, and a chip structure. Background Art

[0002] Package on package (POP) is an integrated circuit packaging method, generally used to combine vertically discrete system-on-chip (SOC) and memory chips. For example, two or more chips are installed on top of each other, that is, stacked, to form a POP packaged device. At this time, signal interconnection can be provided between chips through a standard interface, which has the advantages of high bandwidth and short signal transmission path. POP packaged devices are often used in electronic devices such as mobile phones, personal digital assistants (PDAs) and digital cameras to achieve higher density device layout. However, as the performance of electronic devices improves generation by generation, the thermal power consumption of the chip itself is also increasing. Therefore, the challenges brought by the heat dissipation of POP packaged devices have become increasingly prominent. Summary of the invention

[0003] The present application provides an electronic component, an electronic device and a chip structure for enhancing the heat dissipation capability of the electronic component.

[0004] In one aspect, an electronic component is provided, comprising: a circuit board, a first chip, a second chip and a heat transfer plate. The heat transfer plate is located on one side of the circuit board. The first chip is located between the heat transfer plate and the circuit board, the first chip is connected to the circuit board, and the first chip is connected to the heat transfer plate. The second chip is located on a side of the heat transfer plate away from the circuit board, and the second chip is connected to the heat transfer plate.

[0005] In the electronic assembly provided by the embodiment of the present application, since a heat transfer plate is provided between the first chip and the second chip, the heat of the first chip and the second chip can be respectively conducted outwardly through the heat transfer plate, for example, it can be conducted outwardly to an external heat dissipation structure, where the external heat dissipation structure can be, for example, an air-cooled radiator, a liquid cooling plate, a temperature equalizing plate (Vapor Chamber, VC), etc. In this way, the problem of large thermal resistance of the heat dissipation path of the first chip caused by the need for the heat of the first chip to pass upwards through the second chip before it can be dissipated is improved, and / or the problem of large thermal resistance of the heat dissipation path of the second chip caused by the need for the heat of the second chip to pass downwards through the first chip before it can be dissipated is improved. Therefore, the electronic assembly provided by the embodiment of the present application has the advantages of high heat dissipation efficiency of the first chip and the second chip, and can be applied to use scenarios with greater heat power consumption, and improve the performance of electronic devices using the electronic assembly.

[0006] In some embodiments, one side surface of the first chip adjacent to the heat transfer plate includes a plurality of first contacts. The electronic component further includes a plurality of first solder balls located between the heat transfer plate and the first chip. The heat transfer plate is connected to the plurality of first contacts through the plurality of first solder balls.

[0007] Exemplarily, all of the plurality of first solder balls between the heat transfer plate and the first chip can be used to transmit electrical signals (such as data signals, control signals, etc. required during the operation of the first chip).

[0008] Exemplarily, there can be at least one first solder ball that is not used to transmit electrical signals (such as data signals, control signals, etc. required during the operation of the first chip), but is used to increase heat transfer and reliability to improve the heat transfer efficiency between the first chip and the heat transfer plate. At this time, a filling adhesive can also be filled in the gaps between the plurality of first solder balls to further improve the heat transfer efficiency between the first chip and the heat transfer plate.

[0009] Exemplarily, for the first contacts connected to the first solder balls that are not used to transmit electrical signals, signal lines connected to these first contacts may not be provided inside the first chip.

[0010] Exemplarily, for the contacts on the heat transfer plate connected to the first solder balls that are not used to transmit electrical signals, signal lines connected to these contacts may not be provided in the heat transfer plate either.

[0011] In some embodiments, one side surface of the second chip adjacent to the heat transfer plate includes a plurality of second contacts. The electronic component further includes a plurality of second solder balls located between the heat transfer plate and the second chip. The heat transfer plate is connected to the plurality of second contacts through the plurality of second solder balls.

[0012] Exemplarily, all of the plurality of second solder balls between the heat transfer plate and the second chip can be used to transmit electrical signals (such as data signals, control signals, etc. required during the operation of the second chip).

[0013] Exemplarily, there can be at least one second solder ball that is not used to transmit electrical signals (such as data signals, control signals, etc. required during the operation of the second chip), but is used to increase heat transfer and reliability to improve the heat transfer efficiency between the second chip and the heat transfer plate. At this time, a filling adhesive can also be filled in the gaps between the second solder balls to further improve the heat transfer efficiency between the second chip and the heat transfer plate.

[0014] Exemplarily, for the second contacts connected to the second solder balls that are not used to transmit electrical signals, signal lines connected to these second contacts may not be provided inside the second chip.

[0015] Exemplarily, for the contact on the heat transfer plate connected to the second solder ball that is not used for transmitting electrical signals, signal lines connected to this contact may not be provided in the heat transfer plate.

[0016] In some embodiments, the electronic component further includes a filling adhesive filled between the heat transfer plate and the first chip. In this embodiment, the heat transfer efficiency between the first chip and the heat transfer plate can be further improved.

[0017] In some embodiments, the electronic component further includes a filling adhesive filled between the heat transfer plate and the second chip. In this embodiment, the heat transfer efficiency between the second chip and the heat transfer plate can be further improved.

[0018] In some embodiments, the first chip includes a first die and a first protection part; the heat transfer plate is stacked on the side of the first die facing away from the circuit board; the surface of the heat transfer plate facing away from the circuit board includes a heat dissipation surface and a plurality of third contacts, and the heat dissipation surface is electrically insulated from the plurality of third contacts; the first protection part surrounds the first die and the heat transfer plate, and the first protection part exposes the heat dissipation surface and the third contacts; the plurality of third contacts are connected to the second chip. With such an arrangement, the heat in the first chip is more easily conducted out from the heat dissipation surface of the heat transfer plate, improving the heat dissipation effect of the first chip.

[0019] In some embodiments, the first protection part includes a first packaging substrate and a first encapsulation part; the surface of the first die facing away from the heat transfer plate is connected to the first packaging substrate; the first encapsulation part is connected to the first packaging substrate and at least surrounds the side surface of the first die, all or part of the surface of the heat transfer plate close to the first die. The first chip further includes a heat conduction part located within the first encapsulation part, and the heat conduction part is connected to the first packaging substrate and the heat transfer plate. In this embodiment, by providing the heat conduction part to connect the first packaging substrate and the heat transfer plate, the heat in the first chip is more easily transferred to the heat transfer plate, so as to be conducted to the above-mentioned first heat conduction structure and first heat dissipation heat sink through the heat dissipation surface of the heat transfer plate, improving the heat dissipation efficiency.

[0020] In some embodiments, the first chip further includes a connection board stacked between the first die and the heat transfer plate, and the connection board is in contact with both the first die and the heat transfer plate at the same time. In this embodiment, by adding the connection board, the heat of the first die can be better conducted into the heat transfer plate, with higher heat transfer efficiency, so as to be conducted to the above-mentioned first heat conduction structure and first heat dissipation heat sink through the heat dissipation surface of the heat transfer plate, improving the heat dissipation efficiency.

[0021] In some embodiments, the surface of the heat transfer plate facing away from the circuit board includes a heat dissipation surface and a plurality of third contacts. The heat dissipation surface is electrically insulated from the plurality of third contacts, and the plurality of third contacts are connected to the second chip. In this embodiment, the third contacts can be used for heat conduction and signal conduction simultaneously. The heat dissipation surface can be used to conduct heat to an external heat dissipation structure. Exemplarily, the heat dissipation surface includes a metal surface, and the metal surface has a high heat dissipation efficiency.

[0022] In some embodiments, the plurality of third contacts form at least one third contact group; the heat dissipation surface includes a first heat dissipation surface, and the first heat dissipation surface surrounds at least one side of the third contact group. One third contact group here can be used to electrically connect one second chip. At this time, the heat dissipation surface includes a first heat dissipation surface, and the first heat dissipation surface surrounds at least one side of the third contact group. For example, for a rectangular third contact group, the first heat dissipation surface can surround one side, two sides, three sides or four sides of the third contact group.

[0023] In some embodiments, the area of the first heat dissipation surface is larger than the area of each of the third contacts. In this way, it is beneficial to improve the heat dissipation efficiency of the first heat dissipation surface.

[0024] In some embodiments, the heat dissipation surface further includes a second heat dissipation surface; a heat transfer portion adapted to the second heat dissipation surface is specifically provided inside the heat transfer plate. Such a setting can effectively reduce the thermal resistance on the transfer path. The thermal resistance refers to the heat transferred from the first chip passing through the heat transfer portion inside the heat transfer plate to the heat dissipation surface, so as to be transferred to the first heat sink through the first heat conduction structure outside the heat transfer plate, improving the heat dissipation efficiency. For example, vias can be drilled inside the PCB board and filled with a material having a higher thermal conductivity than the insulating dielectric layer (i.e., the heat transfer portion), such as copper metal, to improve the heat dissipation efficiency.

[0025] In some embodiments, the heat dissipation surface includes a metal surface. Such a setting is conducive to improving the heat transfer efficiency of the heat transfer plate. In some embodiments, the electronic component also includes a first heat sink and a first heat conductive structure. The first heat sink is located on the side of the second chip away from the heat transfer plate; the first heat conductive structure connects the heat dissipation surface of the heat transfer plate and the first heat sink. Among them, the first heat sink can be an air-cooled radiator, a liquid cooling plate, a temperature equalizing plate, etc., and the first heat sink can be directly used to dissipate heat for the second chip. In this embodiment, since the first heat conductive structure is further provided to connect the heat dissipation surface (such as the first heat dissipation surface) of the heat transfer plate and the first heat sink, the heat of the first chip can be transferred to the first heat sink through the heat transfer plate and the second chip (the thermal resistance of this path is large), and can also be transferred to the first heat sink through the heat transfer plate and the first heat conductive structure (the thermal resistance of this path is small), and the heat dissipation efficiency is greatly improved. In some embodiments, the first heat conductive structure includes at least one of metal, alloy, graphite, pure silicon, cobalt and electronic components. Among them, metals include but are not limited to one of the elements such as copper, silver, and aluminum, and alloys include but are not limited to a combination of multiple elements such as copper, silver, and aluminum. Metals, alloys, graphite, and pure silicon all have high heat transfer efficiency. Diamond copper can also be called diamond copper. It is a composite material of metallic copper and diamond, which has a higher heat transfer efficiency than copper. In addition, it should be noted that the electronic components can be devices with certain functions such as capacitors, inductors, and resistors. When the first heat-conducting structure includes electronic components, while having a heat transfer function, it can also meet some functional requirements in electrical aspects, and is more practical.

[0026] In some embodiments, the first heat-conducting structure is welded to the heat dissipation surface of the heat transfer plate or a thermal interface material (TIM) is added. For example, the first heat-conducting structure can be welded to the first heat dissipation surface of the heat transfer plate, so that the thermal resistance between the first heat-conducting structure and the heat transfer plate can be reduced, thereby improving the heat transfer efficiency.

[0027] In some embodiments, a thermal interface material is filled between the first heat sink and the first heat conductive structure. The thermal interface material has the characteristics of bridging the micro gap of the contact interface and reducing the interface contact thermal resistance, which can increase the heat transfer efficiency between the first heat conductive structure and the first heat sink and improve the heat dissipation effect of the first chip.

[0028] The first heat sink and the first heat conducting structure may be an integrated structure, which can further reduce the contact thermal resistance and lower the thermal resistance on the heat transfer path (the thermal resistance from the first chip to the first heat sink).

[0029] In some embodiments, the heat transfer plate and the first heat conducting structure may be an integral structure. Such an arrangement can reduce the contact thermal resistance between the first heat conducting structure and the heat transfer plate and lower the thermal resistance on the heat transfer path (the thermal resistance from the first chip to the first heat sink). A heat transfer portion adapted to the second heat dissipation surface may be specifically formed inside the heat transfer plate. Such an arrangement can effectively reduce the thermal resistance on the transfer path. The thermal resistance refers to the heat transferred from the first chip being transferred to the second heat dissipation surface through the heat transfer portion inside the heat transfer plate, so as to be transferred to the first heat sink through the first heat conducting structure outside the heat transfer plate, thereby improving the heat dissipation efficiency. For example, vias may be drilled inside the PCB board, especially at the positions corresponding to the first heat conducting structure, and materials with a higher thermal conductivity than the insulating dielectric layer (i.e., the heat transfer portion), such as copper, may be filled to improve the heat dissipation efficiency. Exemplarily, taking the PCB board as an example, the "integral structure" here may be that after forming a relatively thick PCB board, other positions except the area of the first heat conducting structure are milled thinner, thereby forming an integral heat transfer plate and the first heat conducting structure. At this time, the first heat conducting structure may simultaneously include conductive posts and the insulating materials around them.

[0030] In some embodiments, a thermal interface material (TIM) is filled between the first heat sink and the second chip. The thermal interface material has the characteristics of bridging the micro gaps at the contact interface and reducing the interface contact thermal resistance, which can increase the heat transfer efficiency between the second chip and the first heat sink and improve the heat dissipation effect of the second chip.

[0031] In some embodiments, the first heat conducting structure is located between the heat transfer plate and the first heat sink, and the first heat conducting structure is located on at least one side of the second chip. In this embodiment, the first heat conducting structure may be located on one side or multiple sides of the second chip. For example, when the second chip is rectangular, the first heat conducting structure may be arranged around the second chip.

[0032] In some embodiments, the first heat conducting structure includes a first heat conducting portion that extends along a first direction, and the first direction is parallel to the plane where the heat transfer plate is located. The number of the second chips is multiple; the multiple second chips are arranged along the first direction, and the multiple second chips are located on the same side of the first heat conducting portion.

[0033] Based on the above embodiments, the first heat conducting structure may further include a second heat conducting portion that extends along the first direction. In the second direction, the multiple second chips are located between the first heat conducting portion and the second heat conducting portion; the second direction intersects with the first direction;

[0034] In some embodiments, the number of the second chips is multiple; the first heat conducting structure is located between at least two of the second chips.

[0035] On the basis of the above embodiment, the heat transfer plate further includes an opening. The first heat-conducting structure is connected to the first chip through the opening. In this example, the first heat-conducting structure can be directly connected to the first chip, which is beneficial to further reduce the thermal resistance between the first chip and the first heat sink and improve the heat dissipation efficiency. At least one first heat-conducting structure is added between the heat transfer plate and the circuit board to increase the reliability of the electronic components, and also increase the thermal interaction characteristics between the heat transfer plate and the circuit board, thereby enhancing the heat dissipation; the supporting structure is not limited to metal, non-metallic materials, and some functional devices, and the connection with the heat transfer plate is not limited to adhesive bonding, welding and direct physical contact; the connection between the first heat-conducting structure and the circuit board is not limited to adhesive bonding, welding and direct physical contact.

[0036] In some embodiments, a thermal interface material is filled between the first heat-conducting structure and the first chip. The thermal interface material has the characteristic of reducing the interface contact thermal resistance, which can increase the heat transfer efficiency between the first chip and the first heat-conducting structure and improve the heat dissipation effect of the first chip.

[0037] In some embodiments, the heat transfer plate includes a first contact surface and a second contact surface. The first contact surface is the inner wall surface of the opening, the second contact surface is located on the side of the heat transfer plate away from the first chip, and the second contact surface surrounds the opening. The first heat conductive structure is connected to at least one of the first contact surface and the second contact surface. In this embodiment, when the first heat conductive structure is connected to the first contact surface and / or the second contact surface, the thermal resistance between the first heat conductive structure and the heat transfer plate can be reduced, thereby improving the heat transfer efficiency.

[0038] In some embodiments, the electronic component further comprises: a support structure, which is located between the heat transfer plate and the circuit board, and simultaneously connects the heat transfer plate and the circuit board. In this embodiment, the support structure can be used to support the heat transfer plate to increase the reliability of the electronic component. The support structure here is not limited to metal, non-metallic materials, and certain functional devices. The connection between the support structure and the heat transfer plate is not limited to adhesive bonding, welding, and direct physical contact. The connection between the support structure and the circuit board is not limited to adhesive bonding, welding, and direct physical contact.

[0039] In some embodiments, the support structure is configured as a second heat-conducting structure. In this way, the heat transfer plate and the circuit board can be increased at the same time.

[0040] In some embodiments, the support structure is arranged around the first chip, so that the support effect of the support structure on the heat transfer plate can be improved, and the stability and reliability are high.

[0041] In some embodiments, the heat transfer plate and the second heat-conducting structure can be an integrated structure. Such an arrangement can reduce the contact thermal resistance between the second heat-conducting structure and the heat transfer plate, and reduce the thermal resistance on the heat transfer path (the thermal resistance from the first chip to the second heat-conducting structure). The heat transfer plate is specially provided with a heat transfer portion adapted to the heat dissipation surface in contact with the second heat-conducting structure. Such an arrangement can effectively reduce the thermal resistance on the transfer path. The thermal resistance refers to the heat transferred from the first chip to the heat dissipation surface through the heat transfer portion inside the heat transfer plate, so as to be transferred to the circuit board or other heat dissipation structures through the second heat-conducting structure outside the heat transfer plate, thereby improving the heat dissipation efficiency. For example, a hole can be drilled inside the PCB board, especially at the position corresponding to the first heat-conducting structure, and filled with a material (i.e., a heat transfer portion) with a higher thermal conductivity than the insulating medium layer, such as metal copper, to improve the heat dissipation efficiency. For example, taking the PCB board as an example, the "integrated structure" here can be that after forming a thicker PCB board, other positions except the second heat-conducting structure area are milled thin to form an integrated heat transfer plate and the second heat-conducting structure. At this time, the second heat-conducting structure can also include a conductive column and the insulating material around it.

[0042] In some embodiments, the electronic component further includes: a third heat-conducting structure and a second heat sink; the second heat sink is located on the side of the circuit board away from the heat transfer plate; the third heat-conducting structure is located between the heat transfer plate and the second heat sink, the third heat-conducting structure passes through the opening on the circuit board, one end of the third heat-conducting structure is connected to the heat transfer plate, and the other end is connected to the second heat sink. In this embodiment, the third heat-conducting structure can pass through the circuit board and directly achieve thermal connection with the second heat sink on the side of the circuit board away from the first chip, so as to achieve efficient heat transfer from the heat transfer plate to the second heat sink on the side of the circuit board away from the first chip, so as to achieve a heat dissipation effect. The third heat-conducting structure here is not limited to metals, non-metals, and alloys.

[0043] In some embodiments, the third heat-conducting structure is disposed around the first chip. Here, the third heat-conducting structure can also play a good role in supporting the heat transfer plate.

[0044] In some embodiments, the third heat conduction structure and the heat transfer plate are thermally connected by a thermal interface material or welding. In this way, the heat transfer plate and the third heat conduction structure have a high heat transfer efficiency. One side of the heat transfer plate close to the third heat conduction structure includes a third heat dissipation surface, and a heat transfer portion adapted to the third heat dissipation surface is specifically made inside. Such a setting can effectively reduce the thermal resistance on the transfer path. The thermal resistance refers to the heat transferred from the first chip being transferred to the heat dissipation surface through the heat transfer portion inside the heat transfer plate, so as to be transferred to the first heat dissipation heat sink through the first heat conduction structure outside the heat transfer plate, improving the heat dissipation efficiency. For example, vias can be drilled inside the PCB board and filled with a material (i.e., the heat transfer portion) with a higher thermal conductivity than the insulating dielectric layer, such as copper, to improve the heat dissipation efficiency.

[0045] In some embodiments, the third heat conduction structure and the second heat dissipation heat sink are connected by welding or through a thermal interface material. In this way, the third heat conduction structure and the second heat dissipation heat sink have a high heat transfer efficiency.

[0046] In some embodiments, the third heat conduction structure and the second heat dissipation heat sink are of an integral structure. In this way, the third heat conduction structure and the second heat dissipation heat sink have a higher heat transfer efficiency.

[0047] In some embodiments, the heat transfer plate and the third heat conduction structure can be of an integral structure. Such a setting can reduce the contact thermal resistance between the third heat conduction structure and the heat transfer plate and lower the thermal resistance on the heat transfer path (the thermal resistance from the first chip to the first heat dissipation heat sink). A heat transfer portion adapted to the heat dissipation surface in contact with the third heat conduction structure is specifically made inside the heat transfer plate. Such a setting can effectively reduce the thermal resistance on the transfer path. The thermal resistance refers to the heat transferred from the first chip being transferred to the heat dissipation surface through the heat transfer portion inside the heat transfer plate, so as to be transferred to the first heat dissipation heat sink through the first heat conduction structure outside the heat transfer plate, improving the heat dissipation efficiency. For example, vias can be drilled inside the PCB board, especially at the position corresponding to the first heat conduction structure, and filled with a material (i.e., the heat transfer portion) with a higher thermal conductivity than the insulating dielectric layer, such as copper, to improve the heat dissipation efficiency. Exemplarily, taking the PCB board as an example, the "integral structure" here can be that after forming a relatively thick PCB board, other positions except the area of the third heat conduction structure are milled thin to form an integral heat transfer plate and third heat conduction structure. At this time, the third heat conduction structure can include both the conductive column and the insulating material around it.

[0048] On the other hand, a chip structure is provided, including a first die, a heat transfer plate, and a first protection part; the heat transfer plate is stacked on one side of the first die; the surface of the heat transfer plate facing away from the first die includes a heat dissipation surface and a plurality of third contacts, and the heat dissipation surface is electrically insulated from the plurality of third contacts; the first protection part surrounds all or part of the first die and the surface of the heat transfer plate close to the first die (for example, in the direction parallel to the circuit board, the relative size of the first protection part and the heat transfer plate can be larger, smaller, or equal, or larger or smaller in a certain direction, which is not limited here), and the first protection part exposes the heat dissipation surface and the third contacts. With such a setting, the heat in the first chip is more easily conducted out from the heat dissipation surface of the heat transfer plate, improving the heat dissipation effect of the first chip.

[0049] In some embodiments, the first protection part includes a first encapsulation substrate and a first plastic encapsulation part; the surface of the first die facing away from the heat transfer plate is connected to the first encapsulation substrate; the first plastic encapsulation part is connected to the first encapsulation substrate and at least surrounds the side surface of the first die and all or part of the surface of the heat transfer plate close to the first die. The first chip further includes a heat conduction part, which is located in the first plastic encapsulation part, and the heat conduction part is connected to the first encapsulation substrate and the heat transfer plate. In this embodiment, by providing the heat conduction part to connect the first encapsulation substrate and the heat transfer plate, the heat in the first chip is more easily transferred to the heat transfer plate, thereby improving the heat dissipation efficiency. The number of the heat conduction parts here can be one or more, and among them, it is not limited that some or all of the heat conduction parts have both the functions of transmitting signals and transferring heat at the same time.

[0050] In some embodiments, the first chip further includes a connection board, which is stacked between the first die and the heat transfer plate, and the connection board is connected to both the first die and the heat transfer plate at the same time. In this embodiment, by adding the connection board, the heat of the first die can be better conducted into the heat transfer plate, with higher heat transfer efficiency and more conducive to reducing the junction temperature of the first chip.

[0051] In some embodiments, the first die in the first chip is directly connected to the heat transfer plate. In this embodiment, the heat of the first die can be better conducted into the heat transfer plate, with higher heat transfer efficiency and more conducive to reducing the junction temperature of the first chip.

[0052] Based on the above-mentioned some embodiments, the connection between the first die and the heat transfer plate, between the first die and the connection board, and between the connection board and the heat transfer plate can be fixed into a specific relative structure by means of filling glue, welding, soldering points or plastic encapsulation parts, so that the heat can be better transferred from the first die to the heat transfer plate.

[0053] In some embodiments, for the chip structure, reference may be made to the previous embodiments, and at least one of a first heat conduction structure, a second heat conduction structure, and a third heat conduction structure may be provided on the chip structure. On this basis, by way of example, the heat transfer plate and at least one of the first heat conduction structure, the second heat conduction structure, and the third heat conduction structure may be made into an integral structure (reference may be made to the foregoing, and details are not described herein again) to further reduce the thermal resistance and improve the heat transfer performance.

[0054] On the other hand, an electronic device is provided, including: a housing; and an electronic component as described in any of the previous embodiments, located in the housing. Since the electronic device provided in this embodiment includes the electronic component in any of the previous embodiments, it has the beneficial effects of the electronic component in any of the previous embodiments, which are not described herein again. Description of the Drawings

[0055] Figure 1 A structural diagram of an electronic device provided by an embodiment of the present application;

[0056] Figure 2 A structural diagram of an electronic component provided by an embodiment of the present application;

[0057] Figure 3 A top view of a heat transfer plate provided by an embodiment of the present application;

[0058] Figure 4 is Figure 2 A top view of the positional relationship among the heat transfer plate, the second chip, and the first heat conduction structure in

[0059] Figure 5 is Figure 2 Another top view of the positional relationship among the heat transfer plate, the second chip, and the first heat conduction structure in

[0060] Figure 6 A structural diagram of another electronic component provided by an embodiment of the present application;

[0061] Figure 7 A structural diagram of yet another electronic component provided by an embodiment of the present application;

[0062] Figure 8 is Figure 6 or Figure 7 A top view of the positional relationship among the heat transfer plate, the second chip, and the first heat conduction structure in

[0063] Figure 9 A structural diagram of yet another electronic component provided by an embodiment of the present application;

[0064] Figure 10 A structural diagram of yet another electronic component provided by an embodiment of the present application;

[0065] Figure 11 Another structural diagram of an electronic component provided by an embodiment of the present application;

[0066] Figure 12 For Figure 9 , Figure 10 Or Figure 11 A top view of the positional relationship among the first chip, the second chip, and the first heat conduction structure in

[0067] Figure 13 Another structural diagram of an electronic component provided by an embodiment of the present application;

[0068] Figure 14 For Figure 13 A top view of the positional relationship among the first chip, the second chip, and the first heat conduction structure in

[0069] Figure 15 Another structural diagram of an electronic component provided by an embodiment of the present application;

[0070] Figure 16 Another structural diagram of an electronic component provided by an embodiment of the present application. Detailed implementation manners

[0071] Next, the technical solutions in the embodiments of the present application will be described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments.

[0072] Hereinafter, the terms "first", "second", etc. are only for convenience of description, and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0073] In the embodiments of the present application, unless otherwise clearly specified and limited, the term "connection" may be a direct mechanical connection or an electrical connection, or may be an indirect mechanical connection or an electrical connection through an intermediate medium. Here, the mechanical connection may not be limited to whether it is used for transmitting electrical signals, and the electrical connection is used for transmitting electrical signals.

[0074] In the embodiments of the present application, "thermal connection" and "heat transfer connection" refer to any connection method that can achieve heat transfer, such as a direct mechanical connection or an indirect mechanical connection through an intermediate medium (such as a thermal interface material).

[0075] In the embodiments of the present application, "welding" includes any welding method, such as the welding method by Ball Grid Array (BGA) or Land Grid Array (LGA), or for example, the welding method by adding solder over the entire surface.

[0076] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0077] In the embodiments of the present application, "and / or" describes the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, or B exists alone, where A and B can be singular or plural. The character " / " generally indicates that the associated objects before and after are in an "or" relationship.

[0078] In the embodiments of the present application, direction indicators such as up, down, left, right, front and back, etc., used to explain the structure and movement directions of different components in the present application are relative. When the components are in the positions shown in the figure, these indicators are appropriate. However, if the description of the component positions changes, then these direction indicators will also change accordingly.

[0079] The embodiments of the present application provide an electronic device. The electronic device can be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a digital camera, a personal computer, a notebook computer, a smart watch, a vehicle-mounted device, a wearable device, augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses, a VR helmet, a server, a switch, a bridge (also known as a bridge), a repeater, a router or a gateway (also known as a protocol converter), etc. It can be understood that the embodiments of the present application do not impose special restrictions on the specific form of the electronic device 1000.

[0080] Figure 1 This is a structural diagram of an electronic device 1000 provided by the embodiments of the present application. As Figure 1As shown, the electronic device 1000 may include a housing 1001 and an electronic component 100. Here, the specific shape and material of the housing 1001 are not limited. That is, for different types of electronic devices 1000, the housing 1001 with different shapes and different materials can be used according to their own needs. The electronic component 100 is located inside the housing 1001. For example, the electronic component 100 may be connected to the inner wall structure of the housing 1001, and the connection methods here include but are not limited to at least one of snap connection, screw connection, bonding, etc. The electronic component 100 here may also be referred to as a POP package device.

[0081] Figure 2 This is a structural diagram of an electronic component 100 provided by an embodiment of the present application. As Figure 2 shown, the electronic component 100 includes a circuit board 110, a first chip 10, a second chip 20, and a heat transfer plate 120.

[0082] The circuit board 110 may be a printed circuit board (PCB). The circuit board 110 may be the main board of the electronic device 1000. In some examples, the circuit board 110 includes a conductive layer and an insulating layer arranged in a stacked manner. The front and / or back of the circuit board 110 can be used to connect chips or other electronic components, such as capacitors, resistors, inductors, etc.

[0083] The heat transfer plate 120 is located on one side of the circuit board 110. For example, in the thickness direction Z of the circuit board 110, the heat transfer plate 120 may be arranged face to face with the circuit board 110. The face-to-face arrangement can be understood as: in the thickness direction Z, the orthographic projection of the heat transfer plate 120 overlaps with the orthographic projection of the circuit board 110.

[0084] The first chip 10 is located between the heat transfer plate 120 and the circuit board 110. The first chip 10 is connected to the circuit board 110 and the first chip 10 is connected to the heat transfer plate 120. In some examples, the first chip 10 may be a system on chip (SOC). Exemplarily, the first chip 10 and the circuit board 110 may be connected by a Ball Grid Array (BGA) or a Land Grid Array (LGA) method. Among them, the BGA packaging method mainly uses solder balls for connection, and the LGA packaging method mainly uses solder joints for connection. Here, the solder joints are flat, and the volume of the solder joints is smaller than the volume of the solder balls. On this basis, an underfill may also be filled in the remaining gap between the first chip 10 and the circuit board 110. The materials of the underfill include but are not limited to silicone, etc. In this way, electrical signals can be transmitted between the first chip 10 and the circuit board 110.

[0085] Regarding the connection manner between the first chip 10 and the heat transfer plate 120, exemplarily, it can all be electrical connections capable of transmitting electrical signals, or part can be electrical connections for transmitting electrical signals and part can be heat transfer connections not for transmitting electrical signals. In this embodiment, the connection between the heat transfer plate 120 and the first chip 10 is taken as an example where part is an electrical connection for transmitting electrical signals and part is a heat transfer connection not for transmitting electrical signals. Exemplarily, between the first chip 10 and the heat transfer plate 120, the above BGA packaging method or LGA packaging method can also be adopted, and a filling adhesive is filled to further improve the heat transfer efficiency between the first chip 10 and the heat transfer plate 120.

[0086] The second chip 20 is located on the side of the heat transfer plate 120 away from the circuit board 110, and the second chip 20 is connected to the heat transfer plate 120. In some examples, the second chip 20 can be a double data rate synchronous dynamic random access memory (DDR SDRAM). Exemplarily, the above BGA or LGA packaging method can also be adopted between the second chip 20 and the heat transfer plate 120, and a filling adhesive is also filled to further improve the heat transfer efficiency between the second chip 20 and the heat transfer plate 120. Moreover, the connection between the heat transfer plate 120 and the second chip 20 can all be electrical connections capable of transmitting electrical signals, or part can be electrical connections for transmitting electrical signals and part can be heat transfer connections not for transmitting electrical signals. This application does not limit this, and in the embodiments of this application, the connection between the heat transfer plate 120 and the second chip 20 is taken as an example where part is an electrical connection for transmitting electrical signals and part is a heat transfer connection not for transmitting electrical signals. In this way, the second chip 20 can be electrically connected to the first chip 10 through the heat transfer plate 120, and through the heat transfer plate 120, electrical signals can be mutually transmitted between the first chip 10 and the second chip 20, and there is no need to set up redundant external leads to connect the first chip 10 and the second chip 20. And, the heat transfer plate 120 has the functions of both heat conduction and signal conduction at the same time.

[0087] The types of the above first chip 10 and second chip 20 can be the same or different. And, in addition to the above examples, the first chip 10 and the second chip 20 can also be other chips, such as a central processing unit (CPU), a graphics processing unit (GPU), or a low-power double data rate synchronous dynamic random access memory, etc. The embodiments of this application do not further limit the types of the first chip 10 and the second chip 20.

[0088] In the electronic component 100 provided by the embodiment of the present application, since a heat transfer plate 120 is provided between the first chip 10 and the second chip 20, the heat of the first chip 10 and the second chip 20 can be conducted outward through the heat transfer plate 120 respectively. For example, it can be conducted outward to an external heat dissipation structure, where the external heat dissipation structure can be, for example, an air-cooled radiator, a liquid-cooled plate, a heat pipe, etc. In this way, the problem of large thermal resistance in the heat dissipation path of the first chip 10 caused by the heat of the first chip 10 needing to pass upward through the second chip 20 before heat dissipation is improved, and / or the problem of large thermal resistance in the heat dissipation path of the second chip 20 caused by the heat of the second chip 20 needing to pass downward through the first chip 10 before heat dissipation is improved. Therefore, for the electronic component 100 provided by the embodiment of the present application, the first chip 10 and the second chip 20 have high heat dissipation efficiency, can be applied to usage scenarios with greater thermal power consumption, and improve the performance of the electronic device 1000 using the electronic component 100.

[0089] One side surface of the first chip 10 close to the heat transfer plate 120 may include a plurality of first contacts. Exemplarily, when the first chip 10 and the heat transfer plate 120 are connected by a BGA packaging method, as Figure 2 shown, the electronic component 100 may further include a plurality of first solder balls 91 located between the heat transfer plate 120 and the first chip 10. The heat transfer plate 120 is connected to the plurality of first contacts through the plurality of first solder balls 91.

[0090] Exemplarily, a plurality of first solder balls 91 between the heat transfer plate 120 and the first chip 10 may all be used to transmit electrical signals, such as data signals, control signals, etc. required during the operation of the first chip 10.

[0091] Exemplarily, there may be at least one first solder ball 91 that is not used to transmit electrical signals, such as data signals, control signals, etc. required during the operation of the first chip 10, but is used to increase heat transfer and reliability to improve the heat transfer efficiency between the first chip 10 and the heat transfer plate 120. At this time, a filling adhesive may also be filled in the gaps between the first solder balls 91 to further improve the heat transfer efficiency between the first chip 10 and the heat transfer plate 120.

[0092] One side surface of the second chip 20 close to the heat transfer plate 120 may include a plurality of second contacts. Exemplarily, when the second chip 20 and the heat transfer plate 120 are connected by a BGA packaging method, as Figure 2 shown, the electronic component 100 may further include a plurality of second solder balls 92 located between the heat transfer plate 120 and the second chip 20. The heat transfer plate 120 is connected to the plurality of second contacts through the plurality of second solder balls 92.

[0093] Exemplarily, multiple second solder balls 92 between the heat transfer plate 120 and the second chip 20 can all be used to transmit electrical signals, such as data signals, control signals, etc. required during the operation of the second chip 20.

[0094] Exemplarily, there can be at least one second solder ball 92 that is not used to transmit electrical signals, such as not used to transmit data signals, control signals, etc. required during the operation of the second chip 20, but is used to increase heat transfer and reliability to improve the heat transfer efficiency between the second chip 20 and the heat transfer plate 120. At this time, a filling adhesive can also be filled in the gaps between the second solder balls 92 to further improve the heat transfer efficiency between the second chip 20 and the heat transfer plate 120.

[0095] Figure 3 This is a top view of a heat transfer plate 120 provided by an embodiment of the present application. Please refer to Figure 3 , in some embodiments, the surface of the heat transfer plate 120 facing away from the circuit board 110 includes a heat dissipation surface 1210 and a plurality of third contacts 1220. The heat dissipation surface 1210 is electrically insulated from the plurality of third contacts 1220, and the plurality of third contacts 1220 can be connected to the second chip through a plurality of second solder balls 92. In this embodiment, the third contacts 1220 can be used for heat conduction and signal conduction at the same time. The heat dissipation surface 1210 can be used to conduct heat to an external heat dissipation structure. Exemplarily, the heat dissipation surface 1210 includes a metal surface, and the metal surface has a high heat dissipation efficiency.

[0096] There are various structural forms of the heat transfer plate 120 provided by the embodiments of the present application, for example, including but not limited to the following two examples.

[0097] Heat transfer plate example one: The heat transfer plate 120 includes a PCB board, and the PCB board includes a metal layer and an insulating layer stacked. The heat dissipation surface 1210 and the third contacts 1220 can be metal surfaces exposed at the openings of the insulating layer, such as copper surfaces. Among them, the metal layer where the heat dissipation surface is located and the metal layer where the third contacts are located can be separated by the insulating layer to achieve electrical insulation.

[0098] Heat transfer plate example two, the heat transfer plate 120 is a metal plate, such as a copper plate. By drilling holes in the copper plate, insulating side walls are provided on the inner walls of the holes, and then conductive posts are provided inside the insulating side walls, third contacts with the function of conducting electrical signals can be formed. And other surfaces of the copper plate can be used as heat dissipation surfaces, so that the heat transfer plate 120 can have a higher heat transfer efficiency.

[0099] Among them, the plurality of third contacts 1220 can form at least one third contact group 1230 (that is Figure 3All the third contacts 1220 within the dashed box form a third contact group 1230). Here, a third contact group 1230 can be used to electrically connect a second chip 20. The heat dissipation surface 1210 can include a first heat dissipation surface 1211, and the first heat dissipation surface 1211 can be disposed on at least one side of the third contact group 1230. For example, for a rectangular third contact group 1230, the first heat dissipation surface 1211 can be disposed on one side, two sides, three sides or four sides of the third contact group 1230. Figure 3 Taking the example that the first heat dissipation surface 1211 is arranged in a circle around the third contact group 1230 for illustration.

[0100] Exemplarily, the area of the first heat dissipation surface 1211 is larger than the area of each third contact 1220. In this way, it is beneficial to improve the heat dissipation efficiency of the first heat dissipation surface 1211.

[0101] Exemplarily, the heat dissipation surface 1210 can further include a second heat dissipation surface 1212. The heat transfer plate 120 can include vias, and the heat transfer plate 120 can further include a heat transfer portion disposed in the vias. The surface of the heat transfer portion facing away from the circuit board 110 is the second heat dissipation surface 1212. For example, vias can be drilled on the surface of the PCB board, and a heat transfer portion with a higher heat transfer efficiency than the insulating layer, such as copper, can be filled to improve the heat dissipation efficiency. The heat transfer portion here can be located around the third contact group 1230 or between any two third contacts 1220. The size relationship between the area of the second heat dissipation surface 1212 and the area of the third contact 1220 is not restricted here, as long as it does not affect the electrical connection performance between the third contact 1220 and the second chip 20.

[0102] In the embodiments of the present application, there are various ways to set the external heat dissipation structure: For example, the external heat dissipation structure can be independently arranged from the electronic component 100 and directly connected to the heat transfer plate 120 to quickly dissipate heat from the first chip 10 and the second chip 20 simultaneously. Another example is that the external heat dissipation structure can be integrated in the film layer of the circuit board 110 and then connected to the heat transfer plate 120 through a connecting portion. Since the heat can bypass the first chip 10, the thermal resistance of the second chip 20 can be reduced, and heat can be quickly dissipated from the first chip 10 and the second chip 20 simultaneously. Another example is that the external heat dissipation structure can be arranged on the side of the second chip 20 facing away from the first chip 10 and then connected to the heat transfer plate 120 through a connecting portion. Since the heat can bypass the second chip 20, the thermal resistance of the first chip 10 can be reduced, and heat can be quickly dissipated from the first chip 10 and the second chip 20 simultaneously. In the following, an example of an external heat dissipation structure is provided by way of example.

[0103] Please refer back to Figure 2 and in combination with Figure 3, in some embodiments, the external heat dissipation structure may include a first heat sink 130 and a first heat conduction structure 30. The first heat sink 130 is located on the side of the second chip 20 away from the heat transfer plate 120. The first heat conduction structure 30 connects the heat dissipation surface 1210 of the heat transfer plate 120 and the first heat sink 130. Among them, the first heat sink 130 may be an air-cooled radiator, a liquid-cooled plate, a heat pipe, etc., and the first heat sink 130 can be directly used to dissipate heat from the second chip 20. In this embodiment, since the first heat conduction structure 30 is further provided to connect the heat dissipation surface 1210 (such as the first heat dissipation surface 1211) of the heat transfer plate 120 and the first heat sink 130, the heat of the first chip 10 can be transferred to the first heat sink 130 through the heat transfer plate 120 and the second chip 20 (the thermal resistance of this path is relatively large), and can also be transferred to the first heat sink 130 through the heat transfer plate 120 and the first heat conduction structure 30 (the thermal resistance of this path is relatively small), so the heat dissipation efficiency is greatly improved.

[0104] It should be noted that, in the case where the heat transfer plate 120 and the first heat conduction structure 30 are not provided, when the power consumption of the first chip 10 is relatively large, the heat has not been transferred to the first heat sink, and the junction temperature of the first chip 10 has exceeded the temperature, so it is not suitable for high-power consumption scenarios. For example, for a certain type of first chip 10 with a power consumption of 4W, after the heat dissipation solution is determined, the temperature of the upper first heat sink is about 35°C, while the junction temperature of the first chip 10 has exceeded 115°C, indicating that the thermal resistance between the top of the first chip 10 and the first heat sink 130 is relatively large; further reducing the temperature of the first heat sink 130, although the junction temperature of the first chip 10 may be further reduced, the cost performance is not high. In the embodiment of the present application, since the heat transfer plate 120 and the first heat conduction structure 30 are provided, the heat of the first chip 10 can be quickly transferred to the first heat sink 130, reducing the junction temperature of the first chip 10, thereby greatly improving the working performance of the first chip 10 and enabling it to meet the usage requirements of larger power consumption scenarios.

[0105] Exemplarily, the first heat conduction structure 30 may include at least one of metal, alloy, graphite, pure silicon, diamond copper, and electronic components. Among them, the metal includes, but is not limited to, one of elements such as copper, silver, and aluminum, and the alloy includes, but is not limited to, a combination of multiple elements such as copper, silver, and aluminum. Metals, alloys, graphite, and pure silicon all have relatively high heat transfer efficiency. Diamond copper, also known as diamond copper, is a composite material of metal copper and diamond, and has a higher heat transfer efficiency compared to copper. In addition, it should be noted that the electronic components may be devices with certain functions such as capacitors, inductors, and resistors. When the first heat conduction structure 30 includes electronic components, while having a heat transfer function, it can also meet some functional requirements in terms of electricity, and the practicality is higher.

[0106] In some embodiments, the first heat conduction structure 30 may be welded to the heat dissipation surface 1210 of the heat transfer plate 120. For example, the first heat conduction structure 30 may be welded to the first heat dissipation surface 1211 of the heat transfer plate 120, so that the thermal resistance between the first heat conduction structure 30 and the heat transfer plate 120 can be reduced, and the heat transfer efficiency can be improved.

[0107] In some embodiments, the first heat conduction structure 30 may also cover the second heat dissipation surface 1212 of the heat transfer plate 120. For example, the first heat conduction structure 30 may also be welded to the second heat dissipation surface 1212 to further improve the heat transfer efficiency.

[0108] In some embodiments, a thermal interface material (TIM) may be filled between the first heat sink 130 and the first heat conduction structure 30. The thermal interface material has the characteristics of bridging the micro gaps of the contact interface and reducing the interface contact thermal resistance, which can increase the heat transfer efficiency between the first heat conduction structure 30 and the first heat sink 130 and improve the heat dissipation effect of the first chip 10.

[0109] In some embodiments, a thermal interface material (TIM) may be filled between the first heat sink 130 and the second chip 20. The thermal interface material has the characteristics of bridging the micro gaps of the contact interface and reducing the interface contact thermal resistance, which can increase the heat transfer efficiency between the second chip 20 and the first heat sink 130 and improve the heat dissipation effect of the second chip.

[0110] Exemplarily, the thermal interface material between the first heat sink 130 and the first heat conduction structure 30 and the thermal interface material between the first heat sink 130 and the second chip 20 may be independent structures or an integrated structure.

[0111] Figure 4 For Figure 2 a top view of the positional relationship among the heat transfer plate 120, the second chip 20, and the first heat conduction structure 30. As Figure 2 shown, in some embodiments, the first heat conduction structure 30 is located between the heat transfer plate 120 and the first heat sink 130, and the first heat conduction structure 30 is located on at least one side of the second chip 20. In this embodiment, the first heat conduction structure 30 may be located on one side or multiple sides of the second chip 20. For example, in Figure 4 the example where, when the second chip 20 is rectangular, the first heat conduction structure 30 may be arranged to surround the second chip 20 for one week.

[0112] In addition to Figure 4 the setting manner of the first heat conduction structure 30 in, the following are also examples of the first heat conduction structure 30, including but not limited to.

[0113] The first heat conduction structure, example one: Please refer to Figure 5 , Figure 5 which is Figure 2 another top view of the positional relationship among the heat transfer plate 120, the second chip 20, and the first heat conduction structure 30 in Figure 5 . The first heat conduction structure 30 includes a first heat conduction portion 301 that extends along a first direction, and the first direction is parallel to the plane where the heat transfer plate 120 is located. The number of the second chips 20 is multiple,

[0114] Based on the first example of the first heat conduction structure 30, exemplarily, continue to refer to Figure 5 , the first heat conduction structure 30 further includes a second heat conduction portion 302 that extends along the first direction. In the second direction, the multiple second chips 20 are located between the first heat conduction portion 301 and the second heat conduction portion 302; the second direction intersects with the first direction.

[0115] Figure 6 is a structural diagram of another electronic component 100 provided by an embodiment of the present application, Figure 7 is a structural diagram of yet another electronic component 100 provided by an embodiment of the present application, Figure 8 which is Figure 6 or Figure 7 a top view of the positional relationship among the heat transfer plate 120, the second chip 20, and the first heat conduction structure 30 in

[0116] The second heat conduction structure, example two: Please refer to Figure 6 and Figure 8 , the number of the second chips 20 is multiple; the first heat conduction structure 30 can be located between at least two second chips 20.

[0117] Based on the second example of the first heat conduction structure, exemplarily, please refer to Figure 7 , the heat transfer plate 120 includes an opening; the first heat conduction structure 30 passes through the opening and is connected to the first chip 10. In this example, the first heat conduction structure 30 can be directly connected to the first chip 10, which is beneficial to further reducing the thermal resistance between the first chip 10 and the first heat sink 130 and improving the heat dissipation efficiency.

[0118] Exemplarily, a thermal interface material is filled between the first heat conduction structure 30 and the first chip 10. The thermal interface material has a high heat transfer coefficient, which can increase the heat transfer efficiency between the first chip 10 and the first heat conduction structure 30 and improve the heat dissipation effect of the first chip 10.

[0119] Exemplarily, the heat transfer plate 120 includes a first contact surface a1 and a second contact surface a2. The first contact surface a1 is the inner wall surface of the opening, and the second contact surface a2 is located on the side of the heat transfer plate 120 away from the first chip 10, and the second contact surface a2 can surround the opening. The first heat conductive structure 30 can be connected to at least one of the first contact surface a1 and the second contact surface a2. The connection method here includes but is not limited to direct contact, gluing, welding and the like. In this example, when the first heat conductive structure 30 is connected to the first contact surface a1 and / or the second contact surface a2, the thermal resistance between the first heat conductive structure 30 and the heat transfer plate 120 can be reduced, thereby improving the heat transfer efficiency.

[0120] In the above description, the heat transfer plate 120 is designed to be independent of the first chip 10 as an example. In the following description, a solution of integrating the heat transfer plate 120 into the first chip 10 is introduced.

[0121] Figure 9 This is a structural diagram of another electronic component 100 provided in an embodiment of the present application. Figure 10 A structural diagram of another electronic component 100 provided in an embodiment of the present application, Figure 11 A structural diagram of another electronic component 100 provided in an embodiment of the present application, Figure 12 for Figure 9 , Figure 10 or Figure 11 A top view of the positional relationship among the first chip 10, the second chip 20 and the first heat conducting structure 30. Figure 13 A structural diagram of another electronic component 100 provided in an embodiment of the present application, Figure 14 for Figure 13 A top view of the positional relationship among the first chip 10, the second chip 20 and the first heat conducting structure 30.

[0122] See also Figure 9 and Figure 13 The embodiment of the present application provides a chip structure 200, specifically: the heat transfer plate 120 is integrated into the chip structure 200. The chip structure 200 can be used as the first chip 10 and applied in the electronic component 100. Hereinafter, the chip structure 200 is taken as the first chip 10 for introduction.

[0123] The first chip 10 may expose the heat dissipation surface 1210 of the heat transfer plate 120 (refer to Figure 3 ) and a plurality of third contacts 1230 (refer to Figure 3) That is to say, the surface of the first chip 10 facing away from the circuit board 110 includes the heat dissipation surface 1210 of the heat transfer plate 120 and a plurality of third contacts 1230. Among them, the heat dissipation surface 1210 can be used to connect to the first heat conduction structure 30, and the plurality of third contacts 1230 can be used to connect to the second chip 20. In this embodiment, the heat transfer plate 120 is integrated into the chip structure 200, so that the heat in the first chip 10 can be more easily exported from the heat dissipation surface 1210 of the heat transfer plate 120, improving the heat dissipation effect of the first chip 10.

[0124] Refer to Figure 12 and Figure 14 , for the solution of integrating the above heat transfer plate 120 into the first chip 10, the arrangement manner of the first heat conduction structure 30 can still refer to any of the previous embodiments. For example, as Figure 12 shown, the first heat conduction structure 30 can still be arranged in a circle around the second chip 20. Another example, as Figure 14 shown, the first heat conduction structure 30 can still be arranged on one side of the second chip 20. In other embodiments, the first heat conduction structure 30 can also be arranged on any one side or multiple sides of the second chip 20, and the present application does not limit this.

[0125] Refer to Figure 10 , in some embodiments, the chip structure 200 can include a first die 101, a heat transfer plate 120, and a first protection part 102; the heat transfer plate 120 is arranged on one side of the first die 101. The surface of the heat transfer plate 120 facing away from the first die 101 includes a heat dissipation surface 1210 (which can be referred back to Figure 3 ) and a plurality of third contacts 1230 (which can be referred back to Figure 3 ), the heat dissipation surface 1210 is electrically insulated from the plurality of third contacts 1230; the first protection part 102 surrounds the first die 101 and the heat transfer plate 120, and the first protection part 102 exposes the heat dissipation surface 1210 and the third contacts 1230. With such an arrangement, the heat in the first chip 10 can be more easily exported from the heat dissipation surface 1210 of the heat transfer plate 120, improving the heat dissipation effect of the first chip 10.

[0126] In some embodiments, as Figure 10 shown, the first protection part 102 includes a first encapsulation substrate 1021 and a first plastic encapsulation part 1022; the surface of the first die 101 facing away from the heat transfer plate 120 is connected to the first encapsulation substrate 1021; the first plastic encapsulation part 1022 is connected to the first encapsulation substrate 1021 and at least surrounds all or part of the side surface of the first die 101 and the surface of the heat transfer plate 120 facing away from the first die 101.

[0127] Exemplarily, the heat transfer plate 120 and the first encapsulation substrate 1021 can be connected by the above BGA encapsulation method or LGA encapsulation method.

[0128] Exemplarily, the chip structure 200 further includes a heat conducting part 103, which is located within the first encapsulation part 1022, and the heat conducting part 103 connects the first encapsulation substrate 1021 and the heat transfer plate 120. Among them, the heat conducting part 103 can be the third solder ball 1031, and the number of arranged third solder balls 1031 can be multiple. For example, at least one circle of third solder balls 1031 is arranged around the first die 101, and the third solder balls 1031 in each circle are arranged at intervals.

[0129] In this embodiment, by arranging the heat conducting part 103 to connect the first encapsulation substrate 1021 and the heat transfer plate 120, the heat in the first chip 10 can be more easily transferred to the heat transfer plate 120, so as to be conducted to the first heat conducting structure 30 and the first heat sink 130 through the heat dissipation surface of the heat transfer plate 120, thereby improving the heat dissipation efficiency.

[0130] Exemplarily, as Figure 11 shown, the chip structure 200 further includes a connecting plate 104, which is laminated between the first die 101 and the heat transfer plate 120, and the connecting plate 104 is in contact with both the first die 101 and the heat transfer plate 120 at the same time.

[0131] In this example, by adding the connecting plate 104, the heat of the first die 101 can be better conducted to the heat transfer plate 120, with higher heat transfer efficiency, and the first chip 10 is less likely to have a junction temperature.

[0132] The chip structure 200 provided by the embodiment of the present application can be used as the first chip 10 and applied in the previous electronic component 100. When forming the electronic component 100, there is no need to assemble a separate heat transfer plate 120 again, and the assembly process is simpler.

[0133] Figure 15 This is a structural diagram of another electronic component 100 provided by the embodiment of the present application. In some embodiments, as Figure 15 shown, the electronic component 100 further includes: a support structure 81, which is located between the heat transfer plate 120 and the circuit board 110 and connects the heat transfer plate 120 and the circuit board 110 at the same time. In this embodiment, the support structure 81 can be used to support the heat transfer plate 120, increasing the reliability of the electronic component 100. The support structure 81 here is not limited to metals, non-metals, and certain functional devices, etc. The connection between the support structure 81 and the heat transfer plate 120 is not limited to glue bonding, welding, and direct physical contact. The connection between the support structure 81 and the circuit board 110 is not limited to glue bonding, welding, and direct physical contact.

[0134] Exemplarily, the support structure 81 can be configured as the second heat conducting structure. In this way, the thermal interaction characteristics between the heat transfer plate 120 and the circuit board 110 can be increased at the same time, thereby enhancing heat dissipation.

[0135] For example, the support structure 81 may be disposed around the first chip 10. In this way, the support effect of the support structure 81 on the heat transfer plate 120 may be improved, and the stability and reliability are high.

[0136] Figure 16 The present application provides a structural diagram of another electronic component 100. In some embodiments, Figure 16 As shown, the electronic component 100 also includes: a third heat-conducting structure 82 and a second heat sink 83. The second heat sink 83 is located on the side of the circuit board 110 away from the heat transfer plate 120; the third heat-conducting structure 82 is located between the heat transfer plate 120 and the second heat sink 83, and the third heat-conducting structure 82 passes through the opening on the circuit board 110, one end of the third heat-conducting structure 82 is connected to the heat transfer plate 120, and the other end is connected to the second heat sink 83. In this embodiment, the third heat-conducting structure 82 can pass through the circuit board 110 and directly achieve thermal connection with the second heat sink 83 on the side of the circuit board 110 away from the first chip 10, so as to achieve efficient heat transfer from the heat transfer plate 120 to the second heat sink 83 on the side of the circuit board 110 away from the first chip 10, so as to achieve a heat dissipation effect. The third heat-conducting structure 82 here is not limited to metal, non-metal, and alloy.

[0137] Exemplarily, the third heat conducting structure 82 is disposed around the first chip 10. Here, the third heat conducting structure 82 can also play a role in supporting the heat transfer plate 120 well.

[0138] Exemplarily, the third heat-conducting structure 82 and the second heat sink 83 are connected by welding or by a thermal interface material, so that the third heat-conducting structure 82 and the second heat sink 83 have a higher heat transfer efficiency.

[0139] Exemplarily, the third heat conducting structure 82 and the second heat sink 83 are an integrated structure, so that the third heat conducting structure 82 and the second heat sink 83 have a higher heat transfer efficiency.

[0140] In some embodiments, for the chip structure 200, any one or more of the above embodiments may be referred to, and at least one of the first heat-conducting structure 30, the supporting structure 81 and the third heat-conducting structure 82 may be provided on the chip structure 200. It should be noted that the schemes in all the embodiments of the first heat-conducting structure 30, the supporting structure 81 and the third heat-conducting structure 82 may be provided separately or simultaneously, that is, the embodiments may be combined, and the technical scheme formed by the combination shall be covered within the protection scope of the present application.

[0141] For the chip structure 200 and the electronic component 100, exemplarily, the heat transfer plate 120 can also be made into an integral structure with at least one of the first heat conduction structure 30, the support structure 81, and the third heat conduction structure 82 (for details, please refer to the previous text and will not be elaborated here) to further reduce the thermal resistance and improve the heat transfer performance.

[0142] The above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or substitutions, which should all be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electronic component, characterized in that, include: A circuit board, a first chip, a second chip and a heat transfer plate; the heat transfer plate is located on one side of the circuit board; The first chip is located between the heat transfer plate and the circuit board, connected to the circuit board, and connected to the heat transfer plate; the second chip is located on a side of the heat transfer plate away from the circuit board, and connected to the heat transfer plate.

2. The electronic component according to claim 1, characterized in that, A surface of the first chip on one side close to the heat transfer plate includes a plurality of first contacts; The electronic component also includes a plurality of first solder balls located between the heat transfer plate and the first chip; the heat transfer plate is connected to the plurality of first contacts through the plurality of first solder balls, and at least one of the plurality of first solder balls is not used for transmitting electrical signals.

3. The electronic component according to claim 1 or 2, characterized in that A surface of the second chip on one side close to the heat transfer plate includes a plurality of second contacts; The electronic component also includes a plurality of second solder balls located between the heat transfer plate and the second chip; the heat transfer plate is connected to the plurality of second contacts through the plurality of second solder balls, and at least one of the plurality of second solder balls is not used for transmitting electrical signals.

4. The electronic component according to any one of claims 1 to 3, characterized in that The electronic component further includes a filling glue filled between the heat transfer plate and the first chip, and / or filled between the heat transfer plate and the second chip.

5. The electronic component according to claim 1, characterized in that, The first chip includes a first bare die and a first protective portion; the heat transfer plate is arranged on a side of the first bare die away from the circuit board; the surface of the heat transfer plate away from the circuit board includes a heat dissipation surface and a plurality of third contacts, and the heat dissipation surface is electrically insulated from the plurality of third contacts; the first protective portion surrounds the first bare die and the heat transfer plate, and the first protective portion exposes the heat dissipation surface and the third contacts; the plurality of third contacts are connected to the second chip.

6. The electronic component according to claim 5, wherein The first protection part includes a first packaging substrate and a first plastic sealing part; the surface of the first bare chip facing away from the heat transfer plate is connected to the first packaging substrate; the first plastic sealing part is connected to the first packaging substrate and at least surrounds the side surface of the first bare chip and all or part of the side of the heat transfer plate close to the first bare chip; The first chip further includes a heat conducting portion, the heat conducting portion is located in the first plastic packaging portion, and the heat conducting portion connects the first packaging substrate and the heat transfer plate.

7. The electronic component according to claim 6, characterized in that: The number of the heat conducting parts is one or more, wherein at least one of the heat conducting parts is configured to conduct electrical signals.

8. The electronic component according to any one of claims 5 to 7, characterized in that: The first die is connected to the heat transfer plate; Alternatively, the first chip further includes a connecting plate, the connecting plate is stacked between the first bare chip and the heat transfer plate, and the connecting plate simultaneously connects the first bare chip and the heat transfer plate.

9. The electronic component according to any one of claims 1-4, characterized in that, The surface of the heat transfer plate facing away from the circuit board includes a heat dissipation surface and a plurality of third contacts, the heat dissipation surface is electrically insulated from the plurality of third contacts, and the plurality of third contacts are connected to the second chip.

10. The electronic component according to any one of claims 5-9, characterized in that, The plurality of third contacts form at least one third contact group; the heat dissipation surface comprises a first heat dissipation surface, and the first heat dissipation surface is disposed around at least one side of the third contact group.

11. The electronic component according to any one of claims 5-10, characterized in that, The heat dissipation surface further includes a second heat dissipation surface; The heat transfer plate includes a through hole; the heat transfer plate includes a heat transfer portion located in the through hole, and the heat transfer portion includes the second heat dissipation surface.

12. The electronic component according to any one of claims 5-11, characterized in that, It further includes a first heat sink and a first heat conduction structure; The first heat sink is located on a side of the second chip away from the heat transfer plate; The first heat conduction structure connects the heat dissipation surface of the heat transfer plate and the first heat sink.

13. The electronic component according to claim 12, wherein, The first heat conduction structure is connected to the heat dissipation surface of the heat transfer plate by welding or a thermal interface material; Or, The first heat conduction structure and the heat transfer plate are of an integral structure.

14. The electronic component according to claim 12 or 13, wherein A thermal interface material is filled between the first heat sink and the first heat conduction structure, or the first heat sink and the first heat conduction structure are of an integral structure; And / or, A thermal interface material is filled between the first heat sink and the second chip.

15. The electronic component according to any one of claims 12-14, wherein The first heat conduction structure is located between the heat transfer plate and the first heat sink, and the first heat conduction structure is located on at least one side of the second chip.

16. The electronic component according to claim 15, wherein The first heat conduction structure includes a first heat conduction portion that extends in a first direction, and the first direction is parallel to the plane where the heat transfer plate is located; The number of the second chips is multiple; the multiple second chips are arranged along the first direction, and the multiple second chips are located on the same side of the first heat conduction portion.

17. The electronic component according to claim 16, wherein, The first heat conduction structure further includes a second heat conduction portion that extends along the first direction; In a second direction, the multiple second chips are located between the first heat conduction portion and the second heat conduction portion; the second direction intersects with the first direction.

18. The electronic component according to claim 17, wherein The number of the second chips is multiple; the first heat conduction structure is located between at least two of the second chips.

19. The electronic component according to claim 18, wherein The heat transfer plate includes an opening; The first heat conduction structure passes through the opening and is connected to the first chip.

20. The electronic component according to claim 19, wherein A thermal interface material is filled between the first heat conduction structure and the first chip.

21. The electronic component according to claim 19 or 20, wherein The heat transfer plate includes a first contact surface and a second contact surface; The first contact surface is the inner wall surface of the opening, the second contact surface is located on a side of the heat transfer plate away from the first chip, and the second contact surface surrounds the opening; The first heat conduction structure is connected to at least one of the first contact surface and the second contact surface.

22. The electronic component according to any one of claims 1-21, characterized in that, It further includes: A support structure, located between the heat transfer plate and the circuit board, and simultaneously connecting the heat transfer plate and the circuit board.

23. The electronic component according to claim 22, wherein The support structure is configured as a second heat-conducting structure, and the second heat-conducting structure and the heat transfer plate are an integrated structure; And / or, the supporting structure is arranged around the first chip.

24. The electronic component according to any one of claims 1-23, characterized in that, Also includes: a third heat conducting structure and a second heat sink; The second heat sink is located on a side of the circuit board away from the heat transfer plate; The third heat conducting structure is located between the heat transfer plate and the second heat sink. The third heat conducting structure passes through an opening on the circuit board. One end of the third heat conducting structure is connected to the heat transfer plate, and the other end is connected to the second heat sink.

25. The electronic component according to claim 24, wherein The third heat-conducting structure is arranged in at least one of the following ways: The third heat-conducting structure is arranged around the first chip; Alternatively, the third heat-conducting structure and the second heat sink are connected by welding or thermal interface material, or the third heat-conducting structure and the second heat sink are an integrated structure; Alternatively, the third heat conducting structure and the heat transfer plate are an integrated structure.

26. A chip structure, characterized in that, The invention comprises a first bare chip, a heat transfer plate and a first protection part; the heat transfer plate is arranged on one side of the first bare chip; the surface of the heat transfer plate facing away from the first bare chip comprises a heat dissipation surface and a plurality of third contacts, and the heat dissipation surface is electrically insulated from the plurality of third contacts; the first protection part surrounds the first bare chip and all or part of a side of the heat transfer plate close to the first bare chip, and the first protection part exposes the heat dissipation surface and the third contacts.

27. The chip structure according to claim 26, wherein, The first protection part includes a first packaging substrate and a first plastic sealing part; the surface of the first bare chip facing away from the heat transfer plate is connected to the first packaging substrate; the first plastic sealing part is connected to the first packaging substrate and at least surrounds the side surface of the first bare chip and all or part of the side of the heat transfer plate close to the first bare chip; The first chip further includes a heat conducting portion, the heat conducting portion is located in the first plastic packaging portion, and the heat conducting portion connects the first packaging substrate and the heat transfer plate.

28. The chip structure according to claim 27, characterized in that: The number of the heat conducting parts is one or more, wherein at least one of the heat conducting parts is configured to conduct electrical signals.

29. The chip structure according to any one of claims 26 to 28, characterized in that: The first die is connected to the heat transfer plate; Alternatively, the first chip further includes a connecting plate, the connecting plate is stacked between the first bare chip and the heat transfer plate, and the connecting plate simultaneously connects the first bare chip and the heat transfer plate.

30. The chip structure according to any one of claims 26 to 29, characterized in that: It also includes: a first heat-conducting structure, located on a side of the heat transfer plate away from the first bare chip; the first heat-conducting structure and the heat transfer plate are an integrated structure; or, It also includes a second heat-conducting structure, which is located on a side of the heat transfer plate facing the first die; the second heat-conducting structure and the heat transfer plate are an integrated structure; or, It also includes a third heat-conducting structure, which is located on a side of the heat transfer plate facing the first bare chip; the third heat-conducting structure and the heat transfer plate are an integrated structure.

31. An electronic device, characterized in that, Comprising the electronic component according to any one of claims 1-25, or the chip structure according to any one of claims 26-30.

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