Anti-parallel diode for integrated circuits

Abstract

The application provides an anti-reverse diode for integrated circuits, and relates to the technical field of diodes, which comprises an anti-reverse diode base, a mounting groove is formed in the upper end of the anti-reverse diode base, a first insertion groove is symmetrically formed in the inside of the mounting groove, a first inner groove is formed in the upper end of the anti-reverse diode base, the first inner groove and the first insertion groove are in communication, and a heat dissipation mechanism is fixedly installed on the upper end of the anti-reverse diode base; the heat dissipation mechanism comprises a heat dissipation plate main body, the heat dissipation plate main body is fixedly installed on the anti-reverse diode base, a containing groove is formed in the upper end of the heat dissipation plate main body, a heat transfer block is installed in the containing groove through bolts, and a rectangular groove is formed in the inside of the heat transfer block. The device can maintain good heat dissipation performance under different temperature conditions, ensures that internal components work in a suitable temperature range, avoids problems such as performance decline and frequent faults caused by overheating, and thus guarantees stable operation of the device, improves the reliability and stability of the device.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of diodes, more specifically, relates to a reverse prevention diode for integrated circuits. BACKGROUND

[0002] In the field of electronic circuits, the circuit board serves as the carrier for various electronic components and plays a crucial role. Reverse prevention diodes, as commonly used electronic devices on circuit boards, are used to prevent reverse current flow and ensure the normal operation of the circuit. However, the existing reverse prevention diodes have significant shortcomings in terms of heat dissipation when used with circuit boards.

[0003] On the one hand, the heat dissipation technology of reverse prevention diodes on current circuit boards has limitations. In most cases, it relies solely on a single heat dissipation method, which is difficult to adapt to the diversified working temperature conditions of circuit boards. For example, when the circuit board is applied to devices in high-temperature environments, such as electronic control systems near high-temperature industrial furnaces, or devices that are in a high-load running state for a long time (such as circuit boards for uninterrupted operation of data center servers), the traditional single heat dissipation method cannot effectively cope with the large amount of heat generated. The overheating of the reverse prevention diode will cause the performance of its internal components to deteriorate, thereby affecting the normal operation of the entire circuit board, and even causing device failure, reducing the stability and reliability of the circuit board and related devices.

[0004] On the other hand, the installation method of the heat dissipation fins of the reverse prevention diode also has problems when combined with the circuit board. The existing heat dissipation fins are usually installed in the reverse prevention diode housing in a fixed vertical manner. However, the space layout on the circuit board is complex, and the heat dissipation space around the reverse prevention diode often presents an irregular shape. In this case, the fixed vertical installation of the heat dissipation fins will cause the formation of airflow dead zones in the reverse prevention diode housing, and air cannot fully and sufficiently contact the fin surface, resulting in insufficient heat exchange process, greatly reducing the heat dissipation efficiency, and ultimately affecting the heat dissipation effect of the reverse prevention diode on the circuit board, adversely affecting the overall performance of the circuit board.

[0005] In summary, the existing reverse prevention diodes have obvious shortcomings in terms of heat dissipation technology and heat dissipation fin installation method when working with circuit boards, and innovative heat dissipation solutions are urgently needed to improve the heat dissipation capacity of reverse prevention diodes in different circuit board working scenarios, ensuring the stable operation of the circuit board and the reliable performance of electronic devices. SUMMARY

[0006] To solve the above technical problems, the present application provides a reverse prevention diode for integrated circuits to solve the above problems.

[0007] An anti-reverse diode for integrated circuits includes an anti-reverse diode base, a mounting groove at the upper end of the base, first slots symmetrically arranged inside the mounting groove, a first inner groove at the upper end of the base, the first inner groove and the first slots being connected, two second slots symmetrically arranged inside each of the two first slots, first strip grooves symmetrically arranged on both side walls of the base, an anti-reverse diode housing above the base, heat dissipation grooves on both side walls of the housing, an inner strip fixedly installed inside the housing, first wedge blocks evenly and equidistantly fixedly installed on the inner strip, and inserts symmetrically fixedly installed at the lower end of the housing, two inserts respectively fitting into two first slots, two inserts each having a second inner groove inside, two second wedge blocks symmetrically slidingly installed inside each of the two second inner grooves, two sets of second wedge blocks respectively fitting into two sets of second slots, and a first spring fixedly installed inside each set of second wedge blocks.

[0008] A heat dissipation mechanism is fixedly installed on the upper end of the anti-reverse diode base;

[0009] The heat dissipation mechanism includes a heat sink body, which is fixedly mounted on the anti-reverse diode base. A receiving groove is provided at the upper end of the heat sink body, and a heat transfer block is installed inside the receiving groove by bolts. A rectangular groove is provided inside the heat transfer block.

[0010] Preferably, the rectangular groove is equipped with fixed columns that are evenly and equidistantly installed inside, and each fixed column is rotatably mounted with a fin.

[0011] Preferably, each of the fins is provided with a wedge-shaped groove, and each wedge-shaped groove corresponds one-to-one with each first wedge-shaped block.

[0012] Preferably, each of the fixed columns is fitted with a torsion spring at both ends, and each torsion spring is fixedly connected to the fins and the inner wall of the rectangular groove at both ends, respectively. A slide is fixedly installed at the lower end of the heat sink body.

[0013] Preferably, a positioning post is fixedly installed at the center of the first inner groove, and the slide is slidably sleeved on the positioning post.

[0014] Preferably, the first inner groove is symmetrically provided with third wedge-shaped blocks, and each of the two third wedge-shaped blocks has a second strip groove inside.

[0015] Preferably, a slider is slidably installed at the center of each of the two second strip grooves, and both sliders are fixedly installed in the first inner groove.

[0016] Preferably, a second spring is fixedly installed at both ends of the two sliders, and the ends of the two sets of second springs away from the two sliders are respectively fixedly connected to the inner walls of the two second strip grooves.

[0017] Preferably, a fixing strip is fixedly installed inside each of the two sets of the first strip grooves, an inner column is fixedly installed inside each fixing strip, and a slide bar is slidably installed at both ends of each inner column, with each set of slide bars slidably installed in each of the first strip grooves.

[0018] Preferably, each inner column is fitted with a third spring at both ends, and each set of third springs is fixedly connected to a fixing strip and a sliding strip at both ends.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] In this invention, an anti-reverse diode base, an anti-reverse diode housing, a heat dissipation groove, inserts, a heat sink body, a slide, a positioning post, a third wedge block, and a second spring are provided. During installation, two inserts will press two third wedge blocks, which will slide towards the center on two sliders under the pressure. At this time, the second spring inside the two third wedge blocks will deform accordingly. The two third wedge blocks will then press the two ends of the slide, causing it to slide vertically upward on the positioning post. The slide will then move the heat sink body upward. After the anti-reverse diode housing is installed, the position of the heat sink body will be fixed in the middle of the heat dissipation groove. At the same time, the heat sink body will separate from the anti-reverse diode base. At this time, the air circulation channel formed by the two heat dissipation grooves will be divided into two by the heat sink body, distributed on the upper and lower sides of the heat sink body. Heat is dissipated through the two channels, and the heat sink body is suspended, which also increases the heat dissipation area, thus greatly improving the heat dissipation efficiency.

[0021] In this invention, an anti-reverse diode base, an anti-reverse diode housing, heat dissipation grooves, a heat dissipation plate body, a heat transfer block, and fins are provided. The heat generated by the equipment during operation is transferred to the heat transfer block through the heat dissipation plate body, and then to multiple fins through the heat transfer block. Since the lower end of the heat dissipation plate body is in contact with the anti-reverse diode base, and the anti-reverse diode housing is located above the heat transfer block through the air circulation channel formed by the two heat dissipation grooves, the air circulation will carry away the heat emitted from the fins, completing heat dissipation under normal operating conditions. This heat dissipation design makes full use of the internal structure, constructs a reasonable heat transfer and air circulation path, eliminates the need for additional complex heat dissipation equipment, and reduces costs. By designing a function to switch between two heat dissipation modes, the equipment can maintain good heat dissipation performance under different temperature conditions, ensuring that internal components work within a suitable temperature range, avoiding problems such as performance degradation and frequent failures due to overheating, thereby ensuring stable operation of the equipment and improving its reliability and stability.

[0022] In this invention, an anti-reverse diode housing, an inner strip, a first wedge block, a fixing post, fins, a wedge groove, and a torsion spring are provided. When the heat dissipation channel is adjusted, as the anti-reverse diode housing descends, the inner strip inside the housing also descends, and the first wedge block on the inner strip moves synchronously with it. Under the movement of the first wedge block, it slides into the wedge groove. At this time, the fins are subjected to a squeezing force and will rotate on the fixing post. The torsion spring fixed to it will twist accordingly, and the fins will change from a vertical state to an inclined state. By changing the fins to an inclined state, the inclined installation can increase the turbulence of air on the fin surface, avoid the formation of airflow dead zones, and make the heat exchange between the air and the fins more complete. For irregular heat dissipation spaces such as the anti-reverse diode housing, the inclined fin installation may be more conducive to improving the overall heat dissipation effect.

[0023] In this invention, a first slot, a first strip groove, an anti-reverse diode housing, a second wedge block, a slider, and a third spring are provided. When the anti-reverse diode housing needs to be disassembled, sliders of different heights can be pulled according to the status of the equipment. At this time, the two sliders will move towards the center inside the first strip groove, and the two sliders will compress the two third springs. Under the sliding of the two sliders, the two sets of second wedge blocks will be compressed, causing them to slide into the channels of the two first slots. Then, the anti-reverse diode housing can be pulled out, completing the disassembly. Compared with the traditional complicated disassembly method, there is no need to use multiple tools for tedious disassembly work. Maintenance personnel can quickly start the repair or replacement of the anti-reverse diode housing components, which significantly improves the efficiency of equipment maintenance.

[0024] In this invention, the solution improves the overall sealing performance by designing the anti-reverse diode housing to be inserted into the mounting slot and using mounting sealant. Attached Figure Description

[0025] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0026] Figure 2 This is a schematic diagram of the explosion-proof diode housing connection structure of the present invention;

[0027] Figure 3 This is a schematic diagram of the exploded structure of the inner strip connection of the present invention;

[0028] Figure 4 This is a schematic diagram of the exploded structure of the heat transfer block connection of the present invention;

[0029] Figure 5 This is a schematic diagram of the exploded structure of the fin connection of the present invention;

[0030] Figure 6 This is an exploded view of the carriage connection structure of the present invention;

[0031] Figure 7 This is a schematic diagram of the exploded structure of the third wedge block connection of the present invention;

[0032] Figure 8 This is an exploded view of the fixing strip connection structure of the present invention;

[0033] Figure 9 This is a schematic diagram of the anti-reverse diode base structure of the present invention;

[0034] Figure 10 This is a schematic diagram of the slider connection structure of the present invention.

[0035] In the figure, the correspondence between the component names and the attached drawing numbers is as follows: 11. Anti-reverse diode base; 12. Mounting slot; 13. First slot; 14. First inner slot; 15. Second slot; 16. First strip slot; 17. Anti-reverse diode housing; 18. Heat dissipation slot; 19. Inner strip; 21. First wedge block; 22. Insert block; 23. Second inner slot; 24. Second wedge block; 25. First spring; 31. Heat sink body; 32. Receiving slot; 33. Heat transfer block; 34. Rectangular slot; 35. Fixing post; 36. Fin; 37. Wedge slot; 38. Torsion spring; 39. Slide; 41. Positioning post; 42. Third wedge block; 43. Second strip slot; 44. Slider; 45. Second spring; 51. Fixing strip; 52. Inner post; 53. Slider; 54. Third spring. Detailed Implementation

[0036] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of the invention.

[0037] Please see Figures 1-10This invention provides a reverse-shielded diode for integrated circuits, including a reverse-shielded diode base 11. A mounting groove 12 is formed at the upper end of the base 11. First slots 13 are symmetrically formed inside the mounting groove 12. A first inner groove 14 is formed at the upper end of the base 11, and the first inner groove 14 is connected to the first slots 13. Second slots 15 are symmetrically formed inside both first slots 13. First strip grooves 16 are symmetrically formed on both side walls of the base 11. A reverse-shielded diode housing 17 is disposed above the base 11. The reverse-shielded diode housing 17 has two... Heat dissipation grooves 18 are provided on the side walls. An inner strip 19 is fixedly installed inside the anti-reverse diode housing 17. First wedge blocks 21 are fixedly installed evenly and at equal intervals on the inner strip 19. Insert blocks 22 are symmetrically fixedly installed at the lower end of the anti-reverse diode housing 17. The two insert blocks 22 are respectively adapted to the two first slots 13. The two insert blocks 22 are each provided with a second inner groove 23. The two second inner grooves 23 are symmetrically slidably installed with second wedge blocks 24. The two sets of second wedge blocks 24 are respectively adapted to the two sets of second slots 15. A first spring 25 is fixedly installed inside each set of second wedge blocks 24.

[0038] A heat dissipation mechanism is fixedly installed on the upper end of the anti-reverse diode base 11;

[0039] The heat dissipation mechanism includes a heat sink body 31, which is fixedly mounted on the anti-reverse diode base 11. A receiving groove 32 is formed at the upper end of the heat sink body 31. A heat transfer block 33 is bolted inside the receiving groove 32. A rectangular groove 34 is formed inside the heat transfer block 33. Fixing posts 35 are evenly and equidistantly fixed inside the rectangular groove 34. A fin 36 is rotatably mounted on each fixing post 35. A wedge-shaped groove 37 is formed on each fin 36, and each wedge-shaped groove 37 corresponds one-to-one with each first wedge block 21. A torsion spring 38 is sleeved at both ends of each fixing post 35, and both ends of each torsion spring 38 are fixedly connected to the fin 36 and the inner wall of the rectangular groove 34, respectively. A slide 39 is fixedly installed at the lower end of the heat sink body 31. In use, the heat transfer block 33 can be first installed in the receiving groove 32 using bolts. Then, the heat sink body 31 can be installed inside the anti-reverse diode base 11. At this time, the slide 39 will also be inserted into the positioning post 41, completing the installation of the heat sink body 31. At this point, sealant can be applied to the anti-reverse diode housing 17 (the connection point with the anti-reverse diode base 11) to seal the connection. Then, the anti-reverse diode housing 17 can be inserted into the mounting groove 12. At this time, the two insertion blocks 22 on the anti-reverse diode housing 17 will be inserted into the two first slots 13. The two sets of... The second wedge block 24 will be subjected to compressive force and slide towards the center within the second inner groove 23. At this time, the two first springs 25 will be compressed accordingly. When the two sets of second wedge blocks 24 slide to a position level with the second slot 15 at the upper end, the first springs 25 will restore their deformation and spring the two sets of second wedge blocks 24 into the second slot 15, completing the snap-fit. At this time, the anti-reverse diode housing 17 will also be just inserted into the mounting groove 12. The heat generated by the equipment operation will be transferred through the heat sink body 31 to the heat transfer block 33, and then transferred through the heat transfer block 33 to the multiple fins 36. Since the lower end of the heat sink body 31 is in contact with the anti-reverse diode base 11 at this time, the anti-reverse diode... The diode housing 17 is located above the heat transfer block 33 through an airflow channel formed by two heat dissipation slots 18. At this time, the air circulation will carry away the heat dissipated from the fins 36, completing the heat dissipation under normal operating conditions. This heat dissipation design makes full use of the internal structure and constructs a reasonable heat transfer and airflow path. It does not require additional complex heat dissipation equipment, reducing costs. By designing a function to switch between two heat dissipation modes, the device can maintain good heat dissipation performance under different temperature conditions, ensuring that the internal components work within a suitable temperature range, avoiding problems such as performance degradation and frequent failures due to overheating, thereby ensuring stable operation of the device and improving its reliability and stability.When the heat dissipation channel is adjusted, as the anti-reverse diode housing 17 descends, the inner strip 19 inside the anti-reverse diode housing 17 will also descend accordingly. The first wedge block 21 on the inner strip 19 will also move synchronously with it. Under the movement of the first wedge block 21, it will slide into the wedge groove 37. At this time, the fin 36 will be squeezed and rotate on the fixed post 35. The torsion spring 38 fixed to it will twist accordingly, and the fin 36 will change from a vertical state to an inclined state. By changing the fin 36 to an inclined state, the inclined installation can increase the turbulence of air on the surface of the fin 36, avoid the formation of airflow dead zones, and make the heat exchange between the air and the fin 36 more sufficient. For irregular heat dissipation spaces like the anti-reverse diode housing 17, the inclined installation of the fin 36 may be more conducive to improving the overall heat dissipation effect.

[0040] A positioning post 41 is fixedly installed at the center of the first inner groove 14. The slide 39 is slidably sleeved on the positioning post 41. Symmetrically arranged third wedge blocks 42 are arranged inside the first inner groove 14. Each of the two third wedge blocks 42 has a second groove 43. A slider 44 is slidably installed at the center of each of the two second grooves 43. Both sliders 44 are fixedly installed in the first inner groove 14. Second springs 45 are fixedly installed at both ends of each slider 44. The ends of the two second springs 45 furthest from the two sliders 44 are fixedly connected to the inner walls of the two second grooves 43. When the diode operates for a long time in a high-temperature environment, the anti-reverse diode housing 17 can be pressed downwards. At this time, the principle is the same as in step one, and the two sets of second wedge blocks 24 will spring into the second slot 15 located at the lower end. During this process, the two inserts 22 will squeeze the two third wedge blocks 44. 2. When the two third wedge blocks 42 are subjected to the squeezing force, they will slide towards the middle on the two sliders 44. At this time, the second springs 45 inside the two third wedge blocks 42 will deform accordingly. The two third wedge blocks 42 will squeeze the two ends of the slide 39 so that it slides vertically upward on the positioning post 41. The slide 39 will drive the heat sink body 31 to move upward. After the anti-reverse diode housing 17 is installed, the position of the heat sink body 31 will be fixed in the middle of the heat sink 18. At the same time, the heat sink body 31 will separate from the anti-reverse diode base 11. At this time, the anti-reverse diode housing 17 will be divided into two by the heat sink body 31 through the air circulation channel formed by the two heat sinks 18, which are distributed on the upper and lower sides of the heat sink body 31. At this time, heat dissipation is carried out through the two channels. At this time, the heat sink body 31 is in a suspended state, which also increases the heat dissipation area. Therefore, the heat dissipation efficiency is greatly improved.

[0041] Both sets of first strip grooves 16 have fixed strips 51 fixedly installed inside, and each fixed strip 51 has an inner post 52 fixedly installed inside. Each inner post 52 has a slider 53 slidably installed at both ends. Each set of sliders 53 is slidably installed in each first strip groove 16. Each inner post 52 has a third spring 54 sleeved at both ends. Each set of third springs 54 is fixedly connected to the fixed strips 51 and sliders 53 at both ends. When the anti-reverse diode housing 17 needs to be disassembled, the sliders 53 at different heights can be pulled according to the status of the equipment. At this time, the two sliders 53... 3. The device will move towards the center inside the first slot 16. The two sliders 53 will compress the two third springs 54. At this time, the two sliders 53 will compress the two sets of second wedge blocks 24, causing them to slide into the channels of the two first slots 13. Then the anti-reverse diode housing 17 can be pulled out to complete the disassembly. Compared with the traditional complicated disassembly method, there is no need to use multiple tools for tedious disassembly work. Maintenance personnel can quickly start to repair or replace the anti-reverse diode housing 17, which significantly improves the efficiency of equipment maintenance.

[0042] Working principle:

[0043] First, the heat transfer block 33 is installed in the receiving groove 32 with bolts. Then, the heat sink body 31 is installed inside the anti-reverse diode base 11. At this time, the slide 39 will also be inserted into the positioning post 41, completing the installation of the heat sink body 31. Next, sealant is applied to the anti-reverse diode housing 17 (the connection point with the anti-reverse diode base 11) to seal the connection. Then, the anti-reverse diode housing 17 is inserted into the mounting groove 12. The two inserts 22 on the anti-reverse diode housing 17 are then inserted into the two first slots 13. The two sets of second wedges 24 inside the inserts 22 are then subjected to pressure and slide towards the center within the second inner groove 23. The two first springs 25 are compressed accordingly. When the two sets of second wedges 24 slide to a position level with the upper second slot 15, the first springs 25 return to their original shape, springing the two sets of second wedges 24 into the second slot 15, completing the engagement. At this point, the anti-reverse diode... The diode housing 17 is also fully submerged in the mounting slot 12. At this time, the heat generated by the equipment operation will be transferred to the heat transfer block 33 through the heat sink body 31, and then transferred to the multiple fins 36 through the heat transfer block 33. Since the lower end of the heat sink body 31 is in contact with the anti-reverse diode base 11, and the anti-reverse diode housing 17 is located above the heat transfer block 33 through the air circulation channel formed by the two heat sink slots 18, the air circulation will carry away the heat dissipated on the fins 36, and the heat dissipation is completed under normal operating conditions. This heat dissipation design makes full use of the internal structure and constructs a reasonable heat transfer and air circulation path. It does not require additional complex heat dissipation equipment, which reduces costs. By designing the function of switching between two heat dissipation methods, the equipment can maintain good heat dissipation performance under different temperature conditions, ensuring that the internal components work within a suitable temperature range, avoiding problems such as performance degradation and frequent failures due to overheating, thereby ensuring stable operation of the equipment and improving the reliability and stability of the equipment.

[0044] The second step involves pressing down on the anti-reverse diode housing 17 after the diode has been operating in a high-temperature environment for an extended period. Similar to the first step, the two sets of second wedges 24 will spring into the lower second slot 15. During this process, the two inserts 22 will press against the two third wedges 42. The two third wedges 42, under pressure, will slide towards the center on the two sliders 44. At this time, the second springs 45 inside the two third wedges 42 will deform, causing the two third wedges 42 to press against both ends of the slide 39, making it perpendicular to the positioning post 41. As the slide 39 moves upward, the heat sink body 31 will move upward. After the anti-reverse diode housing 17 is installed, the position of the heat sink body 31 will be fixed in the middle of the heat sink 18. At the same time, the heat sink body 31 will separate from the anti-reverse diode base 11. At this time, the anti-reverse diode housing 17 will be divided into two air circulation channels by the heat sink body 31 through the two heat sinks 18, which are distributed on the upper and lower sides of the heat sink body 31. At this time, heat is dissipated through the two channels. Moreover, the heat sink body 31 is in a suspended state at this time, which also increases the heat dissipation area, thus greatly improving the heat dissipation efficiency.

[0045] Third, when adjusting the heat dissipation channel, as the anti-reverse diode housing 17 descends, the inner strip 19 inside the anti-reverse diode housing 17 will also descend accordingly. The first wedge block 21 on the inner strip 19 will also move synchronously with it. Under the movement of the first wedge block 21, it will slide into the wedge groove 37. At this time, the fin 36 will be squeezed and rotate on the fixed post 35. The torsion spring 38 fixed to it will twist accordingly, and the fin 36 will change from a vertical state to an inclined state. By changing the fin 36 to an inclined state, the inclined installation can increase the turbulence of air on the surface of the fin 36, avoid the formation of airflow dead zones, and make the heat exchange between the air and the fin 36 more sufficient. For irregular heat dissipation spaces like the anti-reverse diode housing 17, the inclined installation of the fin 36 may be more conducive to improving the overall heat dissipation effect.

[0046] Fourth step: When the anti-reverse diode housing 17 needs to be disassembled, the sliders 53 at different heights can be pulled according to the status of the equipment. At this time, the two sliders 53 will move towards the center inside the first slot 16. The two sliders 53 will compress the two third springs 54. At this time, the two sliders 53 will compress the two sets of second wedge blocks 24 under the sliding of the two sliders 53, so that they slide into the channels of the two first slots 13. Then the anti-reverse diode housing 17 can be pulled out to complete the disassembly. Compared with the traditional complicated disassembly method, there is no need to use multiple tools for tedious disassembly work. Maintenance personnel can quickly start the repair or replacement of the anti-reverse diode housing 17, which significantly improves the efficiency of equipment maintenance.

[0047] Fifthly, this solution improves the overall sealing performance by designing the anti-reverse diode housing 17 to be inserted into the mounting slot 12 and using mounting sealant.

[0048] The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and to design various embodiments with various modifications suitable for a particular purpose.

Claims

1. An integrated circuit reverse prevention diode comprising a reverse prevention diode base (11) having a mounting groove (12) formed in an upper end portion thereof, characterized in that: The first insertion groove (13) is symmetrically arranged in the mounting groove (12), and the first inner groove (14) is arranged at the upper end of the anti-reverse diode base (11). Wherein, the anti-reverse diode shell (17) is arranged above the anti-reverse diode base (11), the heat dissipation grooves (18) are arranged on the side walls of the anti-reverse diode shell (17), the inner bars (19) are fixedly installed in the anti-reverse diode shell (17), the first wedge-shaped blocks (21) are fixedly installed on the inner bars (19) in a uniform and equidistant manner, the insertion blocks (22) are fixedly installed at the lower end of the anti-reverse diode shell (17) in a symmetrical manner, the two insertion blocks (22) are matched with the two first insertion grooves (13) respectively, the second inner grooves (23) are arranged in the two insertion blocks (22) respectively, the second wedge-shaped blocks (24) are symmetrically and slidably installed in the two second inner grooves (23) respectively, the two groups of second wedge-shaped blocks (24) are matched with the two groups of second insertion grooves (15) respectively, and the first springs (25) are fixedly installed in each group of second wedge-shaped blocks (24). The heat dissipation mechanism is fixedly installed on the anti-reverse diode base (11). The heat dissipation mechanism comprises a heat dissipation plate body (31), the heat dissipation plate body (31) is fixedly installed on the anti-reverse diode base (11), the heat dissipation plate body (31) is provided with a containing groove (32) at the upper end, and the heat transfer block (33) is installed in the containing groove (32) through bolts.

2. The reverse prevention diode for integrated circuits according to claim 1, wherein The fixed columns (35) are fixedly installed in the rectangular grooves (34) in a uniform and equidistant manner. Wherein, the fins (36) are rotatably installed on each fixed column (35).

3. The reverse prevention diode for integrated circuits according to claim 2, wherein The wedge-shaped grooves (37) are arranged on each fin (36). Wherein, each wedge-shaped groove (37) is one-to-one corresponding to each first wedge-shaped block (21).

4. The antiparallel diode for integrated circuits according to claim 3, wherein The torsional springs (38) are sleeved on both ends of each fixed column (35), and the torsional springs (38) are fixedly connected with the fins (36) and the inner walls of the rectangular grooves (34) respectively. Wherein, the slide rails (39) are slidably sleeved on the positioning columns (41).

5. The antireflection diode for integrated circuits as claimed in claim 4, wherein The positioning columns (41) are fixedly installed in the first inner grooves (14). Wherein, the slide rails (39) are slidably sleeved on the positioning columns (41).

6. The antiparallel diode for integrated circuits according to claim 5, wherein The third wedge-shaped blocks (42) are symmetrically arranged in the first inner grooves (14). Wherein, the second strip-shaped grooves (43) are arranged in the third wedge-shaped blocks (42) respectively.

7. The antireflection diode for integrated circuits as claimed in claim 6, wherein The sliding blocks (44) are slidably installed in the second strip-shaped grooves (43) respectively. Wherein, the sliding blocks (44) are fixedly installed in the first inner grooves (14).

8. The antiparallel diode for integrated circuits according to claim 7, wherein the first and second diodes are formed by a first and a second pn junction, respectively. The second springs (45) are fixedly installed on both ends of the sliding blocks (44). Two groups of second springs (45) are fixedly connected with the inner walls of two second grooves (43) respectively at one end away from the two sliders (44).

9. The anti-reverse diode for integrated circuits as described in claim 1, characterized in that, Two groups of first grooves (16) are fixedly installed with fixed bars (51) inside, and each fixed bar (51) is fixedly installed with an inner column (52) inside; Wherein, the two ends of each inner column (52) are slidingly installed with a sliding bar (53), and each group of sliding bars (53) is slidingly installed in each first groove (16).

10. The antireflection diode for integrated circuits as claimed in claim 9, wherein The two ends of each inner column (52) are sleeved with a third spring (54); Wherein, the two ends of each group of third springs (54) are fixedly connected with the fixed bar (51) and the sliding bar (53).

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