Electrochemical device and electric equipment

Abstract

The invention discloses an electrochemical device and electric equipment. The electrochemical device comprises a shell, an electrode assembly and a first bonding component, the electrode assembly is arranged in the shell and comprises a first side face and a second side face which are opposite in the first direction and a third side face and a fourth side face which are opposite in the second direction, and the second direction is perpendicular to the first direction. The first bonding component comprises a first side part and a second side part which are opposite to each other, the first side part comprises a first bonding area, a first non-bonding area and a second bonding area which are arranged in sequence, the first bonding area is bonded with the first side surface, the second bonding area is bonded with the second side surface, the second side part comprises a third bonding area, and the third bonding area is bonded with the shell. In the second direction, the projection of the first non-bonding area overlaps with the third side face, and the projection of the third bonding area overlaps with the third side face. The first non-bonding area of the first bonding part is not bonded with the third side surface, so that the risk that the electrode assembly is damaged is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of energy storage, and particularly to an electrochemical device and an electrical device. Background Art

[0002] When a battery or an electrical device equipped with a battery is impacted, such as by dropping, there is a risk of the electrode assembly inside the battery moving. The movement of the electrode assembly easily causes the battery to fail. To address the problem of battery failure, a double-sided adhesive layer is usually provided between the electrode assembly and the housing of the electrochemical device, with one side adhered to the housing and the other side adhered to the electrode assembly.

[0003] When the battery is impacted, if the viscosity of the adhesive layer is too small, it is likely to separate from the electrode assembly or the housing, resulting in the relative movement of the electrode assembly with respect to the housing, which may cause the battery cell to fail; if the viscosity of the adhesive layer is too large, after the adhesive layer transfers the impact force to the outer foil of the electrode assembly, it is likely to cause tearing of the outer foil of the electrode assembly. Summary of the Invention

[0004] In view of this, the present application provides an electrochemical device and an electrical device, aiming to reduce the risk of relative movement of the electrode assembly with respect to the housing and the risk of damage to the outer foil of the electrode assembly.

[0005] In a first aspect of the present application, an electrochemical device is provided. The electrochemical device includes a housing, an electrode assembly, and a first bonding component. The electrode assembly is disposed inside the housing. The electrode assembly includes a first side surface, a second side surface, a third side surface, and a fourth side surface. Along a first direction, the first side surface and the second side surface are oppositely disposed. Along a second direction, the third side surface and the fourth side surface are oppositely disposed. The third side surface and the fourth side surface are located between the first side surface and the second side surface, and the first direction is perpendicular to the second direction. The first bonding component is disposed between the housing and the electrode assembly. The first bonding component includes an opposite first side portion and a second side portion. The first side portion includes a first bonding area, a first non-bonding area, and a second bonding area arranged in sequence. The first bonding area is bonded to the first side surface, and the second bonding area is bonded to the second side surface. The second side portion includes a third bonding area, and the third bonding area is bonded to the housing. Along the second direction, the projection of the first non-bonding area overlaps with the third side surface, and the projection of the third bonding area overlaps with the third side surface.

[0006] The electrode assembly is connected to the housing through the first bonding area, the second bonding area, and the third bonding area of the first bonding member, which helps to limit the relative movement between the electrode assembly and the housing, thereby reducing the risk of the electrode assembly moving around in the housing when the electrochemical device is impacted. The first bonding member is provided with a first non-bonding area that is not bonded to the first side surface, which helps to reduce the impact force transmitted by the first bonding member to the electrode assembly when the electrochemical device is impacted, thereby reducing the risk of damage to the outer pole pieces of the electrode assembly. Moreover, the first bonding area is bonded to the first side surface, and the second bonding area is bonded to the second side surface, dispersing the impact force transmitted by the first bonding member to the electrode assembly, which helps to further reduce the risk of the electrode assembly moving around in the housing when the electrochemical device is impacted, and also helps to further reduce the risk of damage to the outer pole pieces of the electrode assembly.

[0007] In any of the above optional embodiments, the first direction is the thickness direction of the electrode assembly.

[0008] In any of the above optional embodiments, the second direction is the thickness direction of the electrode assembly, so that the first bonding member is bonded to the side surface of the electrode assembly in the width direction or the length direction, thereby reducing the risk of damage to the outer pole pieces of the electrode assembly. Moreover, when the second direction is the thickness direction of the electrode assembly, it is also beneficial to increase the bonding area between the first bonding member and the housing, and beneficial to enhance the bonding firmness between the first bonding member and the housing.

[0009] In any of the above optional embodiments, the first non-bonding area includes a first sub-non-bonding area and a second sub-non-bonding area, and the second sub-non-bonding area is located between the first bonding area and the first sub-non-bonding area. Along the second direction, the projection of the first sub-non-bonding area covers the third side surface, and along the first direction, the projection of the second sub-non-bonding area overlaps with the first side surface. Such a setting helps to extend the first non-bonding area to one side of the first side surface, helps to reduce the impact force transmitted by the first bonding member to the electrode assembly, and helps to further reduce the pulling force of the first bonding member on the first side surface, thereby reducing the risk of damage to the outer pole pieces of the electrode assembly.

[0010] In any of the above optional embodiments, the first non-bonding area includes a first sub-non-bonding area and a third sub-non-bonding area, and the third sub-non-bonding area is located between the second bonding area and the first sub-non-bonding area. Along the second direction, the projection of the first sub-non-bonding area covers the third side surface, and along the first direction, the projection of the third sub-non-bonding area overlaps with the second side surface. Such a setting helps to extend the first non-bonding area to one side of the second side surface, helps to reduce the impact force transmitted by the first bonding member to the electrode assembly, and helps to further reduce the pulling force of the first bonding member on the second side surface, thereby reducing the risk of damage to the outer pole pieces of the electrode assembly.

[0011] In any of the above optional embodiments, the housing includes a first side wall and a second side wall opposite to each other in a first direction, and a third side wall and a fourth side wall opposite to each other in a second direction; the first side surface is adjacent to the first side wall, the second side surface is adjacent to the second side wall, and the third side surface is adjacent to the third side wall.

[0012] In any of the above optional embodiments, in the second direction, the projection of the third bonding area covers the third side surface, which is beneficial to improving the bonding firmness between the housing and the first bonding component, reducing the risk of the first bonding component detaching from the housing, and thus being beneficial to suppressing the displacement of the electrode assembly.

[0013] In any of the above optional embodiments, the third bonding area includes a first sub-bonding area and a second sub-bonding area. The first sub-bonding area is located between the third side surface and the third side wall, and the second sub-bonding area is located between the first side surface and the first side wall. Such a setting is beneficial to improving the bonding firmness between the housing and the first bonding component, reducing the risk of the first bonding component detaching from the housing, and thus being beneficial to suppressing the displacement of the electrode assembly.

[0014] In any of the above optional embodiments, in the first direction, the projection of the third bonding area does not overlap with the first side surface. Such a setting is beneficial to reducing or eliminating the part where the first bonding component is bonded to both the housing and the electrode assembly, and is beneficial to making the first bonding component more likely to dissipate force through deformation and absorb the force transmitted by the housing when the electrochemical device is impacted, thereby reducing the risk of damage to the outer ring electrode sheets of the electrode assembly.

[0015] In any of the above optional embodiments, the third bonding area includes a first sub-bonding area and a third sub-bonding area. The first sub-bonding area is located between the third side surface and the third side wall, and the third sub-bonding area is located between the second side surface and the second side wall. Such a setting is beneficial to improving the bonding firmness between the housing and the first bonding component, reducing the risk of the first bonding component detaching from the housing, and thus being beneficial to suppressing the displacement of the electrode assembly.

[0016] In any of the above optional embodiments, in the first direction, the projection of the third bonding area does not overlap with the second side surface. Such a setting is beneficial to reducing or eliminating the part where the first bonding component is bonded to both the housing and the electrode assembly, and is beneficial to making the first bonding component more likely to dissipate force through deformation and absorb the force transmitted by the housing when the electrochemical device is impacted, thereby reducing the risk of damage to the outer ring electrode sheets of the electrode assembly.

[0017] In any of the above optional embodiments, the first direction is the thickness direction of the electrode assembly. The first bonding area includes a fourth sub-bonding area and a fifth sub-bonding area. The fourth sub-bonding area is located between the first side surface and the first side wall, and the fifth sub-bonding area is located between the third side surface and the third side wall. Such an arrangement enables the first bonding member to bond to a part of the third side surface, increasing the bonding area between the first bonding member and the electrode assembly and expanding the distribution of the bonding area, which is beneficial to improving the bonding firmness between the first bonding member and the third side surface and is beneficial to suppressing the displacement of the electrode assembly.

[0018] In any of the above optional embodiments, the first direction is the thickness direction of the electrode assembly. The second bonding area includes a sixth sub-bonding area and a seventh sub-bonding area. The sixth sub-bonding area is located between the second side surface and the second side wall, and the seventh sub-bonding area is located between the third side surface and the third side wall. Such an arrangement enables the first bonding member to bond to a part of the third side surface, increasing the bonding area between the first bonding member and the electrode assembly and expanding the distribution of the bonding area, which is beneficial to improving the bonding firmness between the first bonding member and the third side surface and is beneficial to suppressing the displacement of the electrode assembly.

[0019] In any of the above optional embodiments, the first direction is the thickness direction of the electrode assembly. Along the first direction, the thickness of the electrode assembly is T, and along the second direction, the width of the electrode assembly is W. The length of the projection of the third bonding area along the second direction in the first direction is T1, and 0.5T ≤ T1 ≤ T. This is beneficial for the first bonding member 30 to suppress the displacement of the electrode assembly and reduce the risk of damage to the outer pole pieces of the electrode assembly.

[0020] In any of the above optional embodiments, the first direction is the thickness direction of the electrode assembly. The length of the projection of the first bonding area along the first direction in the second direction is W1, and 0.1W ≤ W1 ≤ 0.5W. This is beneficial for the first bonding member 30 to suppress the displacement of the electrode assembly and reduce the risk of damage to the outer pole pieces of the electrode assembly.

[0021] In any of the above optional embodiments, the first direction is the thickness direction of the electrode assembly. The length of the projection of the second bonding area along the first direction in the second direction is W2, and 0.1W ≤ W2 ≤ 0.5W. This is beneficial for the first bonding member 30 to suppress the displacement of the electrode assembly and reduce the risk of damage to the outer pole pieces of the electrode assembly.

[0022] In any of the above optional embodiments, the first direction is the thickness direction of the electrode assembly. Along the second direction, the distance between the third bonding area and the first bonding area is h1, and h1 ≤ 0.25T.

[0023] In any of the above optional embodiments, the first direction is the thickness direction of the electrode assembly. Along the second direction, the distance between the third bonding region and the second bonding region is h2, and h2 ≤ 0.25T.

[0024] In any of the above optional embodiments, the second direction is the thickness direction of the electrode assembly. Along the second direction, the thickness of the electrode assembly is T, along the first direction, the width of the electrode assembly is W, and the length of the projection of the third bonding region along the second direction in the first direction is L1, satisfying 0.5W ≤ L1 ≤ W.

[0025] In any of the above optional embodiments, the second direction is the thickness direction of the electrode assembly. The length of the projection of the first bonding region along the first direction in the second direction is L2, satisfying 0.5T ≤ L2 ≤ T.

[0026] In any of the above optional embodiments, the second direction is the thickness direction of the electrode assembly. The length of the projection of the second bonding region along the first direction in the second direction is L3, satisfying 0.5T ≤ L3 ≤ T.

[0027] In any of the above optional embodiments, the second direction is the thickness direction of the electrode assembly. Along the first direction, the distance between the third bonding region and the first bonding region is h3, and h3 ≤ 0.25W.

[0028] In any of the above optional embodiments, the second direction is the thickness direction of the electrode assembly. Along the first direction, the distance between the third bonding region and the second bonding region is h4, and h4 ≤ 0.25W.

[0029] In any of the above optional embodiments, the first bonding member includes a first base layer, a first bonding layer, a second bonding layer, and a third bonding layer. The first base layer is disposed between the housing and the electrode assembly. The first bonding layer is disposed on the surface of the first base layer facing the first side. The second bonding layer is disposed on the surface of the first base layer facing the second side. The third bonding layer is disposed on the surface of the first base layer facing the housing. With such a setting, the first bonding member is formed by a tape having double-sided bonding layers. Compared with a bonding structure formed by bonding multiple tapes, it is beneficial to reduce the overall thickness of the electrochemical device and improve the energy density of the electrochemical device.

[0030] In any of the above optional embodiments, the electrochemical device further includes a second bonding member disposed between the housing and the electrode assembly. The second bonding member includes an opposite third side and a fourth side. The third side includes a fourth bonding area, a second non-bonding area, and a fifth bonding area arranged in sequence. The fourth bonding area is bonded to the first side surface, the fifth bonding area is bonded to the second side surface, and the fourth side includes a sixth bonding area bonded to the housing. Along the second direction, the projection of the second non-bonding area overlaps with the fourth side surface, and the projection of the sixth bonding area overlaps with the fourth side surface. Thus, the first bonding member and the second bonding member are connected to the housing, which helps reduce the risk of the electrode assembly moving around in the housing when the electrochemical device is impacted. Moreover, the first bonding member and the second bonding member transfer the impact force of the housing to both sides of the electrode assembly in the second direction, which helps disperse the impact force received by the electrode assembly and further reduces the risk of damage to the outer pole pieces of the electrode assembly.

[0031] In a second aspect of the present application, there is provided an electrical device including the electrochemical device in any of the above embodiments. The risk of the electrochemical device moving around during a drop test and the risk of damage to the electrode assembly are reduced, thereby improving the reliability of the electrical device during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic structural diagram of an electrochemical device provided by an embodiment of the present application.

[0033] Figure 2 is Figure 1 the exploded schematic diagram of the electrochemical device in

[0034] Figure 3 It is a simplified cross-sectional view of an electrochemical device provided by an embodiment of the present application.

[0035] Figure 4 It is a simplified cross-sectional view of an electrochemical device provided by an embodiment of the present application.

[0036] Figure 5 It is a simplified cross-sectional view of an electrochemical device provided by an embodiment of the present application.

[0037] Figure 6 It is a simplified cross-sectional view of an electrochemical device provided by an embodiment of the present application.

[0038] Figure 7 It is a simplified cross-sectional view of an electrochemical device provided by an embodiment of the present application.

[0039] Figure 8 It is a simplified cross-sectional view of an electrochemical device provided by an embodiment of the present application.

[0040] Figure 9 It is a simplified partial cross-sectional view of an electrochemical device provided by an embodiment of the present application.

[0041] Figure 10 The side view of the first bonding component provided in another embodiment of the present application.

[0042] Figure 11 The partial sectional schematic diagram of the electrochemical device provided in an embodiment of the present application.

[0043] Figure 12 The side view of the first bonding component provided in another embodiment of the present application.

[0044] Figure 13 The schematic diagram of the electrical equipment provided in an embodiment of the present application.

[0045] Description of the main component symbols

[0046] Electrochemical device 100

[0047] Housing 10

[0048] First side wall 11

[0049] Second side wall 12

[0050] Third side wall 13

[0051] Fourth side wall 14

[0052] Fifth side wall 15

[0053] Sixth side wall 16

[0054] Electrode assembly 20

[0055] First side 21

[0056] First region 211

[0057] Second region 212

[0058] Third region 213

[0059] Second side 22

[0060] Third side 23

[0061] Fourth side 24

[0062] Fifth side 25

[0063] Sixth side 26

[0064] First bonding component 30

[0065] First side portion 31

[0066] First bonding region 311

[0067] Fourth sub-bonding area 311a

[0068] Fifth sub-bonding area 311b

[0069] First bonding layer 3111

[0070] First non-bonding area 312

[0071] First sub-non-bonding area 3121

[0072] Second sub-non-bonding area 3122

[0073] Third sub-non-bonding area 3123

[0074] First non-bonding layer 312a

[0075] Second bonding area 313

[0076] Sixth sub-bonding area 313a

[0077] Seventh sub-bonding area 313b

[0078] Second bonding layer 3131

[0079] Second side 32

[0080] Third bonding area 321

[0081] First sub-bonding area 321a

[0082] Second sub-bonding area 321b

[0083] Third sub-bonding area 321c

[0084] Third bonding layer 3211

[0085] Fourth bonding layer 3212

[0086] Fifth bonding layer 3213

[0087] Third non-bonding area 322

[0088] Third non-bonding layer 322a

[0089] Fourth non-bonding area 323

[0090] Fourth non-bonding layer 323a

[0091] Base material layer 301

[0092] Second bonding component 40

[0093] Third side 41

[0094] Fourth bonding area 411

[0095] Second non-bonding area 412

[0096] Fifth bonding area 413

[0097] Fourth side 42

[0098] Sixth bonding area 421

[0099] Tab 50

[0100] Device main body 200

[0101] Electrical equipment 1000

[0102] First direction X

[0103] Second direction Y

[0104] Third direction Z Detailed implementation manners

[0105] The technical solutions in the embodiments of the present application will be described below. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments.

[0106] It should be noted that in the present application, the center of a certain area refers to the centroid of the planar shape of the area when the area is a continuous whole. It can be understood that the centroid of the planar shape can be determined by the suspension method. Suspend the planar shape with a thin line, draw a straight line in the vertical direction from the starting point of the thin line, and then suspend the planar shape with a different end point from the first time and draw another straight line in the previous method. The intersection of the two straight lines is the centroid of the planar shape. When the area is composed of multiple discrete areas, the center of the area is the center of the smallest circumscribed circle containing the multiple discrete areas. It can be understood that the smallest circumscribed circle is the circle that contains the multiple discrete areas and has the smallest radius.

[0107] It can be understood that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediate component at the same time. When a component is considered to be "disposed on" another component, it can be directly disposed on the other component or there may be an intermediate component at the same time. The terms "top", "bottom" and similar expressions used herein are only for the purpose of illustration.

[0108] The terms "first", "second", etc. are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity, specific order or primary-secondary relationship of the indicated technical features.

[0109] The term "vertical" is used to describe the ideal state between two components. In the actual production or use state, there can be a state approximately vertical between two components. The two components described as "vertical" may not be absolutely straight lines or planes, and may also be approximately straight lines or planes. From a macroscopic perspective, as long as the overall extension direction is a straight line or a plane, the components can be considered "straight lines" or "planes".

[0110] It should be understood that the dimensions and thicknesses of the components shown in the drawings are for better understanding and more convenient description, and this application is not limited to the dimensions and thicknesses shown in the drawings.

[0111] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0112] Some embodiments of this application will be described below in conjunction with the drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0113] Please refer to Figure 1 and Figure 2 , an electrochemical device 100 is provided in an embodiment of this application. The electrochemical device 100 includes a housing 10, an electrode assembly 20, and a first bonding member 30. The electrode assembly 20 is disposed in the housing 10, and the first bonding member 30 is disposed between the housing 10 and the electrode assembly 20. The first bonding member 30 bonds the housing 10 and the electrode assembly 20.

[0114] In some embodiments, please refer to Figure 1 and Figure 3 , the housing 10 includes a first side wall 11 and a second side wall 12 that are oppositely disposed along a first direction X, and the electrode assembly 20 is located between the first side wall 11 and the second side wall 12.

[0115] In some embodiments, please refer to Figure 1 and Figure 3 , the housing 10 further includes a third side wall 13, a fourth side wall 14, a fifth side wall 15, and a sixth side wall 16. The third side wall 13 and the fourth side wall 14 are oppositely disposed along a second direction Y, and the fifth side wall 15 and the sixth side wall 16 are oppositely disposed along a third direction Z. The first direction X, the second direction Y, and the third direction Z are perpendicular to each other in pairs. Among them, the first side wall 11, the second side wall 12, the third side wall 13, the fourth side wall 14, the fifth side wall 15, and the sixth side wall 16 enclose a space for accommodating the electrode assembly 20.

[0116] In some embodiments, the electrochemical device 100 is a pouch cell, and the housing 10 is an aluminum-plastic film. In some other embodiments, the electrochemical device 100 is a steel-shell battery, and the housing 10 is a steel casing.

[0117] In some embodiments, the electrode assembly 20 includes a positive electrode tab, a negative electrode tab, and a separator. The positive electrode tab, the negative electrode tab, and the separator may be stacked to form a stacked structure, or may be wound after being stacked to form a wound structure.

[0118] In some embodiments, the positive electrode tab includes a positive current collector and a positive active material layer provided on the positive current collector; the negative electrode tab includes a negative current collector and a negative active material layer provided on the negative current collector.

[0119] In some embodiments, a part of the positive current collector is provided with a positive active material layer, and a part of the positive current collector is not provided with a positive active material layer; a part of the negative current collector is provided with a negative active material layer, and a part of the negative current collector is not provided with a negative active material layer.

[0120] Wherein, the positive current collector and the negative current collector may be metal layers. As an exemplary example, the positive current collector may be a metal layer including at least one of aluminum, nickel, tantalum, and titanium, such as aluminum foil. The positive active material layer includes a positive active material, and the positive active material may include at least one of lithium cobaltate, lithium nickel cobalt manganate, lithium nickel cobalt aluminate, lithium iron phosphate, lithium manganese iron phosphate, or lithium manganate. The negative current collector may be a metal layer including at least one of copper, nickel, tantalum, and titanium, such as copper foil. The negative active material layer includes a negative active material, and the negative active material may include at least one of graphite, hard carbon, soft carbon, silicon, silicon oxide material, and silicon carbon material.

[0121] In some embodiments, the outermost layer of the electrode assembly 20 has a positive current collector layer without a positive active material layer, and the positive current collector is aluminum foil.

[0122] In some embodiments, please refer to Figure 3 , the electrode assembly 20 includes a first side 21, a second side 22, and a third side 23. Along the first direction X, the first side 21 and the second side 22 are oppositely arranged, and the third side 23 is located between the first side 21 and the second side 22.

[0123] In some embodiments, please refer to Figure 3 , the first side 21 is adjacent to the first side wall 11 compared to the second side wall 12, the first side 21 is oppositely arranged to the first side wall 11, and the second side 22 faces away from the first side wall 11. The second side 22 is adjacent to the second side wall 12 compared to the first side wall 11, and the third side 23 is adjacent to the third side wall 13 compared to the fourth side wall 14.

[0124] In some embodiments, referring to Figure 3 , the first side surface 21 includes a first region 211, a second region 212, and a third region 213. Along the second direction Y, the second region 212 is located between the first region 211 and the third region 213.

[0125] In some embodiments, referring to Figure 3 , the electrode assembly 20 further includes a fourth side surface 24, and the fourth side surface 24 is located between the first side surface 21 and the second side surface 22. The third side surface 23 and the fourth side surface 24 are oppositely arranged along the second direction Y. The fourth side surface 24 is adjacent to the fourth side wall 14 compared with the third side wall 13.

[0126] In some embodiments, the electrode assembly 20 is a wound structure, and the third side surface 23 and the fourth side surface 24 are arc-shaped side surfaces.

[0127] In some embodiments, referring to Figure 2 , the electrode assembly 20 further includes a fifth side surface 25 and a sixth side surface 26, and the fifth side surface 25 and the sixth side surface 26 are oppositely arranged along the third direction Z.

[0128] In some embodiments, referring to Figure 1 and Figure 2 , the electrochemical device 100 further includes a tab 50, and the tab 50 is connected to the electrode assembly 20. Along the third direction Z, the tab 50 extends out of the housing 10 from the fifth side surface 25 or the sixth side surface 26 of the electrode assembly 20 to lead out the polarity of the electrode assembly 20. Among them, when the tab 50 is connected to the positive electrode tab of the electrode assembly 20, the tab 50 is a positive electrode tab 50, and when the tab 50 is connected to the negative electrode tab of the electrode assembly 20, the tab 50 is a negative electrode tab 50. The tab 50 can be made of metal copper or metal aluminum, and no specific limitation is made here.

[0129] In some embodiments, referring to Figure 3 , the first bonding member 30 includes a first side portion 31 and a second side portion 32 which are oppositely arranged. The first side portion 31 is adjacent to the electrode assembly 20 compared with the second side portion 32. The first side portion 31 includes a first bonding region 311, a first non-bonding region 312, and a second bonding region 313 which are arranged in sequence. The first bonding region 311 is bonded to the first side surface 21, and the second bonding region 313 is bonded to the second side surface 22. The second side portion 32 includes a third bonding region 321, and the third bonding region 321 is bonded to the housing 10. Along the second direction Y, the projection of the first non-bonding region 312 overlaps with the third side surface 23, and the projection of the third bonding region 321 overlaps with the third side surface 23. The second direction Y is perpendicular to the first direction X.

[0130] The electrode assembly 20 is connected to the housing 10 through the first bonding area 311, the second bonding area 313, and the third bonding area 321 of the first bonding member 30, which is beneficial to restricting the relative movement between the electrode assembly 20 and the housing 10, thereby reducing the risk of the electrode assembly 20 moving around in the housing 10 when the electrochemical device 100 is impacted. The first bonding member 30 is provided with a first non-bonding area 312 that is not bonded to the first side 21, which is beneficial to reducing the impact force transmitted from the first bonding member 30 to the electrode assembly 20 when the electrochemical device 100 is impacted, thereby reducing the risk of damage to the outer pole pieces of the electrode assembly 20. Moreover, the first bonding area 311 is bonded to the first side 21, and the second bonding area 313 is bonded to the second side 22, dispersing the impact force transmitted from the first bonding member 30 to the electrode assembly 20, which is beneficial to further reducing the risk of the electrode assembly 20 moving around in the housing 10 when the electrochemical device 100 is impacted, and is also beneficial to further reducing the risk of damage to the outer pole pieces of the electrode assembly 20.

[0131] Wherein, Figure 3 is a schematic cross-sectional view of the electrochemical device 100. For the sake of clarity of the drawings, the detailed structure of the lamination or winding of the pole pieces in the electrode assembly 20 in the drawings of the present application is omitted.

[0132] In some embodiments, please refer to Figure 3 , the electrochemical device 100 further includes a second bonding member 40. The second bonding member 40 is disposed between the housing 10 and the electrode assembly 20. The second bonding member 40 includes opposite third side portions 41 and fourth side portions 42. The third side portion 41 includes a fourth bonding area 411, a second non-bonding area 412, and a fifth bonding area 413 arranged in sequence. The fourth bonding area 411 is bonded to the first side 21, and the fifth bonding area 413 is bonded to the second side 22. The fourth side portion 42 includes a sixth bonding area 421, and the sixth bonding area 421 is bonded to the housing 10. Along the second direction Y, the projection of the second non-bonding area 412 overlaps with the fourth side 24, and the projection of the sixth bonding area 421 overlaps with the fourth side 24. The second non-bonding area 412 is beneficial to reducing the impact force transmitted from the second bonding member 40 to the electrode assembly 20 when the electrochemical device 100 is impacted, thereby reducing the risk of damage to the outer pole pieces of the electrode assembly 20. Moreover, the fourth bonding area 411 is bonded to the first side 21, and the fifth bonding area 413 is bonded to the second side 22, dispersing the impact force transmitted from the second bonding member 40 to the electrode assembly 20, which is beneficial to further reducing the risk of the electrode assembly 20 moving around in the housing 10 when the electrochemical device 100 is impacted, and is also beneficial to further reducing the risk of damage to the outer pole pieces of the electrode assembly 20.

[0133] In the above embodiments, the electrode assembly 20 is connected to the housing 10 through the first bonding member 30 and the second bonding member 40, which helps to reduce the risk of the electrode assembly 20 moving within the housing 10 when the electrochemical device 100 is impacted. Moreover, the first bonding member 30 and the second bonding member 40 transfer the impact force of the housing 10 to both sides of the electrode assembly 20 in the second direction Y, which helps to disperse the impact force received by the electrode assembly 20 and further reduces the risk of damage to the outer pole pieces of the electrode assembly 20.

[0134] In some embodiments, referring to Figure 3 , the first region 211 is connected to the third side surface 23, and the third region 213 is connected to the fourth side surface 24. The first bonding region 311 is bonded to the first region 211, and the fourth bonding region 411 is bonded to the third region 213, which helps to disperse the impact force to the regions at both ends of the electrode assembly 20 along the second direction Y by the first bonding member 30 and the second bonding member 40, and further reduces the risk of damage to the outer pole pieces of the electrode assembly 20.

[0135] The following describes the implementation manner of the first bonding member 30. To make the drawings clear, the distance between the components that are relatively close is enlarged in the drawings. In addition, the implementation manner of the second bonding member 40 can refer to the implementation manner of the first bonding member 30.

[0136] In some embodiments, referring to Figure 3 , the first direction X is the thickness direction of the electrode assembly 20.

[0137] In some embodiments, referring to Figure 4 , the second direction Y is the thickness direction of the electrode assembly 20. Such a setting makes the first bonding member 30 bond to the side surface of the electrode assembly 20 in the width direction or the length direction, thereby reducing the risk of damage to the outer pole pieces of the electrode assembly 20. Moreover, when the second direction Y is the thickness direction of the electrode assembly 20, it is also beneficial to increase the bonding area between the first bonding member 30 and the housing 10 and improve the bonding firmness between the first bonding member 30 and the housing 10.

[0138] In some embodiments, referring to Figure 5, the first non-bonding area 312 includes a first sub-non-bonding area 3121 and a second sub-non-bonding area 3122. The second sub-non-bonding area 3122 is located between the first bonding area 311 and the first sub-non-bonding area 3121. Along the second direction Y, the projection of the first sub-non-bonding area 3121 covers the third side surface 23. Along the first direction X, the projection of the second sub-non-bonding area 3122 overlaps with the first side surface 21. With such a setting, it is beneficial to extend the first non-bonding area 312 to one side of the first side surface 21, which is beneficial to reducing the impact force transmitted by the first bonding component 30 to the electrode assembly 20, and is beneficial to further reducing the pulling force of the first bonding component 30 on the first side surface 21, thereby reducing the risk of damage to the outer ring pole pieces of the electrode assembly 20.

[0139] In some embodiments, please refer to Figure 5 , the first non-bonding area 312 includes a first sub-non-bonding area 3121 and a third sub-non-bonding area 3123. The third sub-non-bonding area 3123 is located between the second bonding area 313 and the first sub-non-bonding area 3121. Along the second direction Y, the projection of the first sub-non-bonding area 3121 covers the third side surface 23. Along the first direction X, the projection of the third sub-non-bonding area 3123 overlaps with the second side surface 22. With such a setting, it is beneficial to extend the first non-bonding area 312 to one side of the second side surface 22, which is beneficial to reducing the impact force transmitted by the first bonding component 30 to the electrode assembly 20, and is beneficial to further reducing the pulling force of the first bonding component 30 on the second side surface 22, thereby reducing the risk of damage to the outer ring pole pieces of the electrode assembly 20.

[0140] In some embodiments, please refer to Figure 5 , the second side portion 32 further includes a third non-bonding area 322 and a fourth non-bonding area 323. The third bonding area 321 is disposed between the third non-bonding area 322 and the fourth non-bonding area 323. Along the first direction X, the projection of the third non-bonding area 322 overlaps with the first bonding area 311. Along the first direction X, the projection of the fourth non-bonding area 323 overlaps with the second bonding area 313. Along the second direction Y, the projection of the third bonding area 321 is within the projection range of the first non-bonding area 312. The third non-bonding area 322 overlaps with the first non-bonding area 312, and the fourth non-bonding area 323 overlaps with the first non-bonding area 312.

[0141] There is a local part of the first bonding component 30 in the above embodiments that is neither bonded to the housing 10 nor bonded to the electrode assembly 20. When the electrochemical device 100 is impacted, during the process of the force of the housing 10 being transmitted to the electrode assembly 20, it is dissipated and absorbed through the local deformation of the first bonding component 30. While suppressing the relative position movement between the electrode assembly 20 and the housing 10, the force transmitted by the first bonding component 30 to the electrode assembly 20 is further reduced, thereby reducing the risk of damage to the outer ring pole pieces of the electrode assembly 20.

[0142] In some embodiments, referring to Figure 6 along the second direction Y, the projection of the third bonding region 321 covers the third side surface 23, which is beneficial to increasing the bonding area between the housing 10 and the first bonding component 30, beneficial to enhancing the firmness of the bonding between the housing 10 and the first bonding component 30, reducing the risk of the first bonding component 30 detaching from the housing 10, and thus beneficial to suppressing the crosstalk of the electrode assembly 20.

[0143] In some embodiments, referring to Figure 6 the third bonding region 321 includes a first sub-bonding region 321a and a second sub-bonding region 321b. The first sub-bonding region 321a is located between the third side surface 23 and the third side wall 13, and the second sub-bonding region 321b is located between the first side surface 21 and the first side wall 11, which is beneficial to increasing the bonding area between the housing 10 and the first bonding component 30, beneficial to enhancing the firmness of the bonding between the housing 10 and the first bonding component 30, reducing the risk of the first bonding component 30 detaching from the housing 10, and thus beneficial to suppressing the crosstalk of the electrode assembly 20.

[0144] In some embodiments, referring to Figure 6 the third bonding region 321 includes a first sub-bonding region 321a and a third sub-bonding region 321c. The first sub-bonding region 321a is located between the third side surface 23 and the third side wall 13, and the third sub-bonding region 321c is located between the second side surface 22 and the second side wall 12, which is beneficial to increasing the bonding area between the housing 10 and the first bonding component 30, beneficial to enhancing the firmness of the bonding between the housing 10 and the first bonding component 30, reducing the risk of the first bonding component 30 detaching from the housing 10, and thus beneficial to suppressing the crosstalk of the electrode assembly 20.

[0145] In some embodiments, referring to Figure 5 along the first direction X, the projection of the third bonding region 321 does not overlap with the first side surface 21. Such a setting is beneficial to reducing or eliminating the part where the first bonding component 30 is bonded to both the housing 10 and the electrode assembly 20, beneficial to making the first bonding component 30 more easily dissipate force through deformation and absorb the force transmitted by the housing 10 when the electrochemical device 100 is impacted, and thus reducing the risk of damage to the outer ring pole pieces of the electrode assembly 20.

[0146] In some embodiments, referring to Figure 5 along the first direction X, the projection of the third bonding region 321 does not overlap with the second side surface 22. Such a setting is beneficial to reducing or eliminating the part where the first bonding component 30 is bonded to both the housing 10 and the electrode assembly 20, beneficial to making the first bonding component 30 more easily dissipate force through deformation and absorb the force transmitted by the housing 10 when the electrochemical device 100 is impacted, and thus reducing the risk of damage to the outer ring pole pieces of the electrode assembly 20.

[0147] In some embodiments, referring to Figure 7 , the first direction X is the thickness direction of the electrode assembly 20. The first bonding area 311 includes a fourth sub-bonding area 311a and a fifth sub-bonding area 311b. The fourth sub-bonding area 311a is located between the first side surface 21 and the first side wall 11, and the fifth sub-bonding area 311b is located between the third side surface 23 and the third side wall 13. Such an arrangement enables the first bonding member 30 to bond to a part of the third side surface 23, increasing the bonding area between the first bonding member 30 and the electrode assembly 20 and expanding the distribution of the bonding area, which is beneficial to improving the firmness of the bonding between the first bonding member 30 and the third side surface 23 and is beneficial to suppressing the crosstalk of the electrode assembly 20.

[0148] In some embodiments, referring to Figure 7 , the first direction X is the thickness direction of the electrode assembly 20. The second bonding area 313 includes a sixth sub-bonding area 313a and a seventh sub-bonding area 313b. The sixth sub-bonding area 313a is located between the second side surface 22 and the second side wall 12, and the seventh sub-bonding area 313b is located between the third side surface 23 and the third side wall 13. Such an arrangement enables the first bonding member 30 to bond to a part of the third side surface 23, increasing the bonding area between the first bonding member 30 and the electrode assembly 20 and expanding the distribution of the bonding area, which is beneficial to improving the firmness of the bonding between the first bonding member 30 and the third side surface 23 and is beneficial to suppressing the crosstalk of the electrode assembly 20.

[0149] In some embodiments, referring to Figure 8 , the first direction X is the thickness direction of the electrode assembly 20. Along the first direction X, the thickness of the electrode assembly 20 is T, and along the second direction Y, the width of the electrode assembly 20 is W. The length of the projection of the third bonding area 321 along the second direction Y in the first direction X is T1, satisfying 0.5T ≤ T1 ≤ T. This is beneficial for the first bonding member 30 to suppress the crosstalk of the electrode assembly 20 and reduce the risk of damage to the outer pole pieces of the electrode assembly 20.

[0150] In some embodiments, referring to Figure 8 , the first direction X is the thickness direction of the electrode assembly 20. The length of the projection of the first bonding area 311 along the first direction X in the second direction Y is W1, satisfying 0.1W ≤ W1 ≤ 0.5W. This is beneficial for the first bonding member 30 to suppress the crosstalk of the electrode assembly 20 and reduce the risk of damage to the outer pole pieces of the electrode assembly 20.

[0151] In some embodiments, referring to Figure 8 , the first direction X is the thickness direction of the electrode assembly 20. The length of the projection of the second bonding area 313 along the first direction X in the second direction Y is W2, satisfying 0.1W ≤ W2 ≤ 0.5W. This is beneficial for the first bonding member 30 to suppress the crosstalk of the electrode assembly 20 and reduce the risk of damage to the outer pole pieces of the electrode assembly 20.

[0152] In some embodiments, referring to Figure 8 , the first direction X is the thickness direction of the electrode assembly 20. Along the second direction Y, the distance between the third bonding area 321 and the first bonding area 311 is h1, and h1 ≤ 0.25T. This is beneficial for reducing the distance between the bonding areas on both sides of the first bonding member 30, and is beneficial for the first bonding member 30 to inhibit the movement of the electrode assembly 20 and reduce the risk of damage to the outer pole pieces of the electrode assembly 20.

[0153] In some embodiments, referring to Figure 8 , the first direction X is the thickness direction of the electrode assembly 20. Along the second direction Y, the distance between the third bonding area 321 and the second bonding area 313 is h2, and h2 ≤ 0.25T. This is beneficial for reducing the distance between the bonding areas on both sides of the first bonding member 30, and is beneficial for the first bonding member 30 to inhibit the movement of the electrode assembly 20 and reduce the risk of damage to the outer pole pieces of the electrode assembly 20.

[0154] In some embodiments, referring to Figure 4 , the second direction Y is the thickness direction of the electrode assembly 20. Along the second direction Y, the thickness of the electrode assembly 20 is T, and along the first direction X, the width of the electrode assembly 20 is W. The length of the projection of the third bonding area 321 along the second direction Y in the first direction X is L1, satisfying 0.5W ≤ L1 ≤ W. When this condition is met, it is beneficial to reduce the risk of movement of the electrode assembly 20 and the risk of damage to the outer pole pieces of the electrode assembly 20.

[0155] In some embodiments, referring to Figure 4 , the second direction Y is the thickness direction of the electrode assembly 20. The length of the projection of the first bonding area 311 along the first direction X in the second direction Y is L2, satisfying 0.5T ≤ L2 ≤ T. When this condition is met, it is beneficial to reduce the risk of movement of the electrode assembly 20 and the risk of damage to the outer pole pieces of the electrode assembly 20.

[0156] In some embodiments, referring to Figure 4 , the second direction Y is the thickness direction of the electrode assembly 20. The length of the projection of the second bonding area 313 along the first direction X in the second direction Y is L3, satisfying 0.5T ≤ L3 ≤ T. When this condition is met, it is beneficial to reduce the risk of movement of the electrode assembly 20 and the risk of damage to the outer pole pieces of the electrode assembly 20.

[0157] In some embodiments, referring to Figure 4, the second direction Y is the thickness direction of the electrode assembly 20. Along the first direction X, the distance between the third bonding area 321 and the first bonding area 311 is h3, and h3 ≤ 0.25W. This is beneficial to reducing the distance between the bonding areas on both sides of the first bonding component 30, and is beneficial for the first bonding component 30 to inhibit the movement of the electrode assembly 20 and reduce the risk of damage to the outer pole pieces of the electrode assembly 20.

[0158] In some embodiments, please refer to Figure 4 , the second direction Y is the thickness direction of the electrode assembly 20. Along the first direction X, the distance between the third bonding area 321 and the second bonding area 313 is h4, and h4 ≤ 0.25W. This is beneficial to reducing the distance between the bonding areas on both sides of the first bonding component 30, and is beneficial for the first bonding component 30 to inhibit the movement of the electrode assembly 20 and reduce the risk of damage to the outer pole pieces of the electrode assembly 20.

[0159] In order to verify the influence of each bonding area of the first bonding component 30 on the electrochemical device 100, the following drop test was conducted:

[0160] Lithium-ion soft-pack batteries with a rectangular maximum projection surface were selected, and the drop pass rates of the soft-pack batteries were compared. 20 batteries were taken from each group for the drop pass rate comparison experiment. The batteries were set to be tested in the drop order of six sides and four corners, and the drop height was 1.8 m. After the drop, observe whether the housing 10 is broken or leaking, and count the number of batteries with the housing 10 broken or leaking; if the housing 10 is not broken or leaking, then disassemble the lithium-ion soft-pack battery and observe whether there is tearing or damage to the outer pole pieces of the electrode assembly 20, and count the number of batteries with the outer pole pieces torn or damaged. Among them, if the housing 10 is not broken and leaking, and there is no tearing or damage to the outer pole pieces, it is determined to pass the test; otherwise, it is determined to fail the test. Pass rate = number of passes / 20 × 100%.

[0161] In the above experiment, the first direction X is the thickness direction of the electrode assembly 20. The thickness T of the electrode assembly 20 along the first direction X is 4.8 mm (millimeters), the width W of the electrode assembly 20 along the second direction Y is 64 mm, and the length L of the electrode assembly 20 along the third direction Z is 87 mm. In Example 16, please refer to Figure 6, the third bonding area 321 includes a first sub-bonding area 321a, a second sub-bonding area 321b, and a third sub-bonding area 321c. The first sub-bonding area 321a is located between the third side surface 23 and the third side wall 13. The second sub-bonding area 321b is located between the first side surface 21 and the first side wall 11. The third sub-bonding area 321c is located between the second side surface 22 and the second side wall 12. The length T1 of the first sub-bonding area 321a in the first direction X is 4.8 mm. The length of the second sub-bonding area 321b in the second direction Y is 12.8 mm. The length of the third sub-bonding area 321c in the second direction Y is 12.8 mm. In Example 17, please refer to Figure 7 , the first bonding area 311 includes a fourth sub-bonding area 311a and a fifth sub-bonding area 311b. The second bonding area 313 includes a sixth sub-bonding area 313a and a seventh sub-bonding area 313b. The fourth sub-bonding area 311a is located between the first side surface 21 and the first side wall 11. The fifth sub-bonding area 311b is located between the third side surface 23 and the third side wall 13. The sixth sub-bonding area 313a is located between the second side surface 22 and the second side wall 12. The seventh sub-bonding area 313b is located between the third side surface 23 and the third side wall 13. The lengths of the fourth sub-bonding area 311a and the sixth sub-bonding area 313a in the second direction Y are both 10.8 mm. The lengths of the fifth sub-bonding area 311b and the seventh sub-bonding area 313b in the first direction X are both 2 mm.

[0162] In the comparative example, a double-sided tape with a length of 60.9 mm and a width of 38 mm is used to bond the first side wall 11 and the first side surface 21. The following Table 1 shows the size data of each bonding area of the first bonding component 30 and the test results in the above test.

[0163] Table 1: Test Results of Size Changes in Each Bonding Area of the First Bonding Component 30

[0164]

[0165]

[0166] Referring to the content of Table 1 above, it can be seen that when at least one of the conditions 0.5T ≤ T1 ≤ T, 0.1W ≤ W1 ≤ 0.5W, 0.1W ≤ W2 ≤ 0.5W, h1 ≤ 0.25T, and h2 ≤ 0.25T is satisfied, the passing rate of the battery drop test is better, which is beneficial to reducing the risk of the electrode assembly 20 moving around and the risk of the outer pole pieces of the electrode assembly 20 being damaged.

[0167] To verify the influence of each bonding area of the first bonding component 30 on the electrochemical device 100, a drop test as recorded in Table 2 was also conducted. The difference between this test and the drop test recorded in Table 1 is that in the test of Table 2, the first direction X is the width direction of the electrode assembly 20. The width W of the electrode assembly 20 along the first direction X is 64 mm, the thickness T of the electrode assembly 20 along the second direction Y is 4.8 mm, and the length L of the electrode assembly 20 along the third direction Z is 87 mm.

[0168] In the comparative example in Table 2, a double-sided tape with a length of 60.9 mm and a width of 38 mm was used to bond the first side wall 11 and the first side surface 21. The following Table 2 shows the size data of each bonding area of the first bonding component 30 in the above test and the test results.

[0169] Table 2: Test Results of Size Changes in Each Bonding Area of the First Bonding Component 30

[0170]

[0171] Referring to the content of Table 2 above, when at least one of the conditions of 0.5W ≤ L1 ≤ W, 0.5T ≤ L2 ≤ T, 0.5T ≤ L3 ≤ T, h3 ≤ 0.25W, and h4 ≤ 0.25W is satisfied, the passing rate of the battery drop test is better, which is beneficial to reducing the risk of the electrode assembly 20 moving around and the risk of the outer pole pieces of the electrode assembly 20 being damaged.

[0172] In some embodiments, please refer to Figure 9 and Figure 10 , the first bonding component 30 includes a first base layer 301, a first bonding layer 3111, a second bonding layer 3131, and a third bonding layer 3211. The first base layer 301 is disposed between the housing 10 and the electrode assembly 20. The first bonding layer 3111 is disposed on the surface of the first base layer 301 facing the first side surface 21. The second bonding layer 3131 is disposed on the surface of the first base layer 301 facing the second side surface 22. The third bonding layer 3211 is disposed on the surface of the first base layer 301 facing the housing 10. In this embodiment, the first bonding component 30 is formed by a tape with double-sided bonding layers. Compared with the bonding structure formed by bonding multiple tapes, it is beneficial to reduce the overall thickness of the electrochemical device 100 and improve the energy density of the electrochemical device 100.

[0173] In some embodiments, please refer to Figure 11, the first bonding component 30 further includes a fourth bonding layer 3212. The fourth bonding layer 3212 is disposed on the surface of the first base layer 301 facing the housing 10, and the fourth bonding layer 3212 is bonded to the first side wall 11 of the housing 10. The fourth bonding layer 3212 is conducive to improving the bonding firmness between the housing 10 and the first bonding component 30, reducing the risk of the first bonding component 30 detaching from the housing 10, and thus is conducive to suppressing the movement of the electrode assembly 20.

[0174] It can be understood that the fourth bonding layer 3212 and the third bonding layer 3211 may be two independent bonding layers; the third bonding layer 3211 and the fourth bonding layer 3212 may also be an integrated bonding layer structure. For example, the integrated bonding layer at different positions is divided into the third bonding layer 3211 and the fourth bonding layer 3212.

[0175] In some embodiments, please refer to Figure 11 , the first bonding component 30 further includes a fifth bonding layer 3213. The fifth bonding layer 3213 is disposed on the surface of the first base layer 301 facing the housing 10, and the fifth bonding layer 3213 is bonded to the second side wall 12 of the housing 10. The fifth bonding layer 3213 is conducive to improving the bonding firmness between the housing 10 and the first bonding component 30, reducing the risk of the first bonding component 30 detaching from the housing 10, and thus is conducive to suppressing the movement of the electrode assembly 20.

[0176] It can be understood that the third bonding layer 3211, the fourth bonding layer 3212, and the fifth bonding layer 3213 may be three independent bonding layers; the third bonding layer 3211, the fourth bonding layer 3212, and the fifth bonding layer 3213 may also be an integrated bonding layer structure. For example, the integrated bonding layer at different positions is divided into the third bonding layer 3211, the fourth bonding layer 3212, and the fifth bonding layer 3213.

[0177] It should be noted that when the first bonding component 30 is composed of the first base layer 301, the first bonding layer 3111, and the second bonding layer 3131, the first bonding layer 3111 forms the first bonding region 311, the second bonding layer 3131 forms the second bonding region 313, and the third bonding layer 3211 forms the third bonding region 321. When the first bonding component 30 is composed of the first base layer 301, the first bonding layer 3111, the second bonding layer 3131, the third bonding layer 3211, the fourth bonding layer 3212, and the fifth bonding layer 3213, the first bonding layer 3111 forms the first bonding region 311, the second bonding layer 3131 forms the second bonding region 313, and the third bonding layer 3211, the fourth bonding layer 3212, and the fifth bonding layer 3213 jointly form the third bonding region 321.

[0178] In some embodiments, please refer to Figure 5, a part of the surface of the base material layer 301 facing the electrode assembly 20 is exposed to form a first non-bonding area 312, a part of the surface of the base material layer 301 facing the housing 10 is exposed to form a third non-bonding area 322, and a part of the surface of the base material layer 301 facing the housing 10 is exposed to form a fourth non-bonding area 323. With such an arrangement, it is not necessary to laminate multiple tapes to prevent a part of the first bonding member 30 from bonding to the housing 10 and a part of the first bonding member 30 from bonding to the electrode assembly 20, which is beneficial to reducing the overall thickness of the electrochemical device 100 and improving the energy density of the electrochemical device 100.

[0179] In some embodiments, the first adhesive layer 3111, the second adhesive layer 3131, the third adhesive layer 3211, the fourth adhesive layer 3212, and the fifth adhesive layer 3213 may be adhesive substances that have adhesiveness without activation at room temperature; the first adhesive layer 3111, the second adhesive layer 3131, the third adhesive layer 3211, the fourth adhesive layer 3212, and the fifth adhesive layer 3213 may also be adhesive substances that do not have adhesiveness at room temperature but have activated adhesiveness after a hot pressing process.

[0180] It can be understood that the first adhesive layer 3111, the second adhesive layer 3131, the third adhesive layer 3211, the fourth adhesive layer 3212, and the fifth adhesive layer 3213 can be formed by coating an adhesive substance in a preset area of the base material layer 301; they can also be formed by coating the entire double-sided surface of the base material layer 301 with an adhesive substance and then removing the excess adhesive substance locally.

[0181] In some embodiments, the material of the base material layer 301 can be any one of PET (polyethylene terephthalate), PVC (polyvinyl chloride), or PI (polyimide).

[0182] In some embodiments, the material of the first adhesive layer 3111 includes at least one of polymethyl methacrylate, polypropylene, polyethylene, polyamide, styrene-butadiene rubber, nitrile rubber, cis-butadiene rubber, isoprene rubber, ethylene-propylene rubber, and chloroprene rubber. Among them, the materials of the second adhesive layer 3131, the third adhesive layer 3211, the fourth adhesive layer 3212, and the fifth adhesive layer 3213 can be the same as or different from the material of the first adhesive layer 3111.

[0183] In some other embodiments, please refer to Figure 12, the first adhesive component 30 further includes a first non - adhesive layer 312a, a third non - adhesive layer 322a, and a fourth non - adhesive layer 323a. The first non - adhesive layer 312a is adhered to the surface of the first adhesive layer 3111 and / or the second adhesive layer 3131 to form a first non - adhesive area 312; the third non - adhesive layer 322a is adhered to the surface of the third adhesive layer 3211 to form a third non - adhesive area 322; the fourth non - adhesive layer 323a is adhered to the surface of the third adhesive layer 3211 to form a fourth non - adhesive area 323. In this way, after directly coating the first adhesive layer 3111, the second adhesive layer 3131, and the third adhesive layer 3211 on the substrate layer 301, the first non - adhesive area 312, the third non - adhesive area 322, and the fourth non - adhesive area 323 are formed by adhering the first non - adhesive layer 312a, the third non - adhesive layer 322a, and the fourth non - adhesive layer 323a on the first adhesive layer 3111, the second adhesive layer 3131, and the third adhesive layer 3211. By adjusting the area and the set position of the first non - adhesive layer 312a, the third non - adhesive layer 322a, and the fourth non - adhesive layer 323a, the area and the position of the first non - adhesive area 312, the third non - adhesive area 322, and the fourth non - adhesive area 323 can be adjusted, making the formation method and the adjustment method of the non - adhesive area have the advantages of simple operation, high efficiency, and low cost.

[0184] It can be understood that the first non - adhesive layer 312a, the third non - adhesive layer 322a, and the fourth non - adhesive layer 323a can be layers without adhesive substances on both sides, or layers with adhesive substances on one side and without adhesive substances on the other side. As an exemplary example, the substrate layer 301, the first adhesive layer 3111, and the second adhesive layer 3131 form a double - sided adhesive tape, the first non - adhesive layer 312a, the third non - adhesive layer 322a, and the fourth non - adhesive layer 323a are single - sided adhesive tapes, and the first adhesive component 30 is composed of multiple adhesive tape layers stacked together.

[0185] Please refer to Figure 13 , an embodiment in the present application further provides an electrical device 1000, and the electrical device 1000 includes the above - mentioned electrochemical device 100.

[0186] In some embodiments, please refer to Figure 13 , the electrical device 1000 further includes a device main body 200, and the electrochemical device 100 is installed on the device main body 200 to supply power to the device main body 200.

[0187] In some embodiments, the electrical device 1000 can be a mobile phone, a laptop computer, a tablet computer, etc., and will not be listed one by one here.

[0188] Since the electrical device 1000 adopts the technical solution of any one of the embodiments of the above-mentioned electrochemical device 100, it has at least the beneficial effects brought by the technical solution of any one of the embodiments of the above-mentioned electrochemical device 100, which will not be elaborated herein one by one.

[0189] In addition, those of ordinary skill in the art should recognize that the above embodiments are only used to illustrate the present application and are not used to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application should be included within the protection scope of the present application.

Claims

1. An electrochemical device, characterized in that, Comprising: A housing; An electrode assembly disposed within the housing, the electrode assembly including a first side, a second side, a third side, and a fourth side. Along a first direction, the first side and the second side are oppositely disposed. Along a second direction, the third side and the fourth side are oppositely disposed. The third side and the fourth side are located between the first side and the second side, and the first direction is perpendicular to the second direction; A first bonding member disposed between the housing and the electrode assembly. The first bonding member includes a first side portion and a second side portion that are opposite to each other. The first side portion includes a first bonding region, a first non-bonding region, and a second bonding region that are sequentially arranged. The first bonding region is bonded to the first side, the second bonding region is bonded to the second side, and the second side portion includes a third bonding region that is bonded to the housing; Along the second direction, the projection of the first non-bonding region overlaps with the third side, and the projection of the third bonding region overlaps with the third side.

2. The electrochemical device according to claim 1, characterized in that, Satisfying any one of the following conditions: (1) The first direction is the thickness direction of the electrode assembly; (2) The second direction is the thickness direction of the electrode assembly.

3. The electrochemical device according to claim 1, characterized in that, The first bonding member satisfies at least one of the following conditions: (1) The first non-bonding region includes a first sub-non-bonding region and a second sub-non-bonding region. The second sub-non-bonding region is located between the first bonding region and the first sub-non-bonding region. Along the second direction, the projection of the first sub-non-bonding region covers the third side. Along the first direction, the projection of the second sub-non-bonding region overlaps with the first side; (2) The first non-bonding region includes a first sub-non-bonding region and a third sub-non-bonding region. The third sub-non-bonding region is located between the second bonding region and the first sub-non-bonding region. Along the second direction, the projection of the first sub-non-bonding region covers the third side. Along the first direction, the projection of the third sub-non-bonding region overlaps with the second side.

4. The electrochemical device according to claim 1, wherein The housing includes a first side wall and a second side wall that are opposite to each other along the first direction, and a third side wall and a fourth side wall that are opposite to each other along the second direction. The first side is adjacent to the first side wall, the second side is adjacent to the second side wall, the third side is adjacent to the third side wall. The electrochemical device satisfies at least one of the following conditions: (1) Along the second direction, the projection of the third bonding region covers the third side; (2) The third bonding region includes a first sub-bonding region and a second sub-bonding region. The first sub-bonding region is located between the third side and the third side wall, and the second sub-bonding region is located between the first side and the first side wall; (3) The third bonding region includes a first sub-bonding region and a third sub-bonding region. The first sub-bonding region is located between the third side and the third side wall, and the third sub-bonding region is located between the second side and the second side wall.

5. The electrochemical device according to claim 1, characterized in that, The housing includes a first side wall and a second side wall opposite to each other in a first direction, and a third side wall and a fourth side wall opposite to each other in a second direction; the first side surface is adjacent to the first side wall, the second side surface is adjacent to the second side wall, the third side surface is adjacent to the third side wall, and the electrochemical device satisfies at least one of the following conditions: (1) In the first direction, the projection of the third bonding area does not overlap with the first side surface; (2) In the first direction, the projection of the third bonding area does not overlap with the second side surface.

6. The electrochemical device according to claim 1, wherein The first direction is the thickness direction of the electrode assembly. The housing includes a first side wall and a second side wall opposite to each other in a first direction, and a third side wall and a fourth side wall opposite to each other in a second direction; the first side surface is adjacent to the first side wall, the second side surface is adjacent to the second side wall, the third side surface is adjacent to the third side wall, and the electrochemical device satisfies at least one of the following conditions: (1) The first bonding area includes a fourth sub-bonding area and a fifth sub-bonding area. The fourth sub-bonding area is located between the first side surface and the first side wall, and the fifth sub-bonding area is located between the third side surface and the third side wall; (2) The second bonding area includes a sixth sub-bonding area and a seventh sub-bonding area. The sixth sub-bonding area is located between the second side surface and the second side wall, and the seventh sub-bonding area is located between the third side surface and the third side wall.

7. The electrochemical device according to claim 1, characterized in that, The first direction is the thickness direction of the electrode assembly; in the first direction, the thickness of the electrode assembly is T, and in the second direction, the width of the electrode assembly is W. The first bonding member satisfies at least one of the following conditions: (1) The length of the projection of the third bonding area in the first direction along the second direction is T1, and 0.5T ≤ T1 ≤ T; (2) The length of the projection of the first bonding area in the second direction along the first direction is W1, and 0.1W ≤ W1 ≤ 0.5W; (3) The length of the projection of the second bonding area in the second direction along the first direction is W2, and 0.1W ≤ W2 ≤ 0.5W; (4) In the second direction, the distance between the third bonding area and the first bonding area is h1, and h1 ≤ 0.25T; (5) In the second direction, the distance between the third bonding area and the second bonding area is h2, and h2 ≤ 0.25T.

8. The electrochemical device according to claim 1, wherein The second direction is the thickness direction of the electrode assembly; in the second direction, the thickness of the electrode assembly is T, and in the first direction, the width of the electrode assembly is W. The first bonding member satisfies at least one of the following conditions: (1) The length of the projection of the third bonding area in the first direction along the second direction is L1, and 0.5W ≤ L1 ≤ W; (2) The length of the projection of the first bonding area in the second direction along the first direction is L2, and 0.5T ≤ L2 ≤ T; (3) The length of the projection of the second bonding area in the second direction along the first direction is L3, and 0.5T ≤ L3 ≤ T; (4) Along the first direction, the distance between the third bonding area and the first bonding area is h3, and h3 ≤ 0.25W; (5) Along the first direction, the distance between the third bonding area and the second bonding area is h4, and h4 ≤ 0.25W.

9. The electrochemical device according to claim 1, characterized in that, The first bonding component includes a first base layer, a first bonding layer, a second bonding layer, and a third bonding layer. The first base layer is disposed between the housing and the electrode assembly. The first bonding layer is disposed on the surface of the first base layer facing the first side. The second bonding layer is disposed on the surface of the first base layer facing the second side. The third bonding layer is disposed on the surface of the first base layer facing the housing.

10. The electrochemical device according to any one of claims 1 to 9, characterized in that, The electrochemical device further includes a second bonding component, which is disposed between the housing and the electrode assembly. The second bonding component includes an opposite third side portion and a fourth side portion. The third side portion includes a fourth bonding area, a second non-bonding area, and a fifth bonding area arranged in sequence. The fourth bonding area is bonded to the first side. The fifth bonding area is bonded to the second side. The fourth side portion includes a sixth bonding area, and the sixth bonding area is bonded to the housing; Along the second direction, the projection of the second non-bonding area overlaps with the fourth side, and the projection of the sixth bonding area overlaps with the fourth side.

11. An electrical device, characterized in that, Comprising the electrochemical device according to any one of claims 1 to 10.

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