Multi-layer circuit board drilling tool

Abstract

The invention discloses a drilling tool for a multilayer circuit board, which comprises a vacuum positioning seat, a plurality of vacuum adsorption grooves are arranged on the vacuum positioning seat, a material residue collecting channel is arranged on the vacuum positioning seat corresponding to a hole opening position of the multilayer circuit board, and the material residue collecting channel is connected with a negative pressure collector. According to the drilling tool for the multilayer circuit board, positioning of the multilayer circuit board is achieved through the multiple vacuum adsorption grooves, the positioning efficiency is higher, positioning is stable, and safety is high.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit board production, and particularly to a drilling tooling for multi-layer printed circuit boards. Background Art

[0002] During the production process of multi-layer printed circuit boards, wiring holes need to be drilled corresponding to three winding wires respectively. Therefore, drilling processing is required. Traditional drilling tooling relies on mechanical positioning, and the mechanical positioning has two problems. One is low efficiency, and the other is that the multi-layer printed circuit board may be damaged due to improper operation. Summary of the Invention

[0003] To solve the deficiencies in the prior art, the present invention provides a drilling tooling for multi-layer printed circuit boards. The drilling tooling for multi-layer printed circuit boards realizes the positioning of the multi-layer printed circuit board through multiple vacuum adsorption grooves, with higher positioning efficiency, stable positioning, and high safety.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] The present invention provides a drilling tooling for multi-layer printed circuit boards, including a vacuum positioning seat. Multiple vacuum adsorption grooves are opened on the vacuum positioning seat. A slag collection channel is arranged on the vacuum positioning seat corresponding to the hole opening positions of the multi-layer printed circuit board, and the slag collection channel is connected with a negative pressure collector.

[0006] Before drilling, the multi-layer printed circuit board is placed on the vacuum positioning seat, and the multi-layer printed circuit board is adsorbed, fixed, and positioned through multiple vacuum adsorption grooves. The slag generated during drilling falls into the slag collection channel and is collected by the negative pressure collector.

[0007] The drilling tooling for multi-layer printed circuit boards of the present invention realizes the positioning of the multi-layer printed circuit board through multiple vacuum adsorption grooves, with higher positioning efficiency, stable positioning, and high safety.

[0008] In a further technical solution, a positioning ring is arranged on the vacuum positioning seat. The inner diameter of the positioning ring matches the outer diameter shape and size of the multi-layer printed circuit board to be drilled. An inclined surface is opened between the inner diameter and the upper side surface of the positioning ring.

[0009] The arrangement of the positioning ring enables the multi-layer printed circuit board to automatically slide down along the inclined surface on the positioning ring under the suction force of the vacuum adsorption groove when being placed, and finally enter the predetermined position, realizing rapid and accurate positioning.

[0010] In a further technical solution, multiple vacuum adsorption grooves are all independently connected to a negative pressure pump.

[0011] Independent negative pressure ensures the effect of vacuum adsorption.

[0012] In a further technical solution, a nozzle facing the vacuum positioning seat is further provided on the drilling tooling.

[0013] The setting of the nozzle enables the vacuum positioning seat to be blown with air after drilling to clean the drill chips. The main components of the drill chips are glass fiber and resin, and the particle size is 5 - 500 μm.

[0014] In a further technical solution, all three opening positions are within the range of the same slag collection channel.

[0015] Since the three wiring holes of the multilayer circuit board are close to each other in position, collecting them using the same slag collection channel can save negative pressure resources and simplify the structure.

[0016] The beneficial effects are as follows:

[0017] 1. The drilling tooling for the multilayer circuit board realizes the positioning of the multilayer circuit board through multiple vacuum adsorption grooves, with higher positioning efficiency, stable positioning and high safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic structural diagram of the drilling tooling for the multilayer circuit board according to an embodiment of the present invention.

[0019] 11. Vacuum positioning seat; 12. Vacuum adsorption groove; 13. Positioning ring; 14. Slag collection channel; 15. Negative pressure collector. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] The present invention will be further described below with reference to the accompanying drawings:

[0021] Embodiment:

[0022] A drilling tooling for a multilayer circuit board, as Figure 1 shown, includes a vacuum positioning seat 11. Multiple vacuum adsorption grooves 12 are provided on the vacuum positioning seat 11. A slag collection channel 14 is provided on the vacuum positioning seat 11 corresponding to the opening positions of the multilayer circuit board. The slag collection channel 14 is connected to a negative pressure collector 15.

[0023] Before drilling, the multilayer circuit board is placed on the vacuum positioning seat 11, and the multilayer circuit board is adsorbed, fixed and positioned through multiple vacuum adsorption grooves 12. The drill slag from drilling falls into the slag collection channel 14 and is collected by the negative pressure collector 15.

[0024] The drilling tooling for the multilayer circuit board of the present invention realizes the positioning of the multilayer circuit board through multiple vacuum adsorption grooves, with higher positioning efficiency, stable positioning and high safety.

[0025] In another embodiment, a positioning ring 13 is provided on the vacuum positioning seat 11. The inner diameter of the positioning ring 13 matches the outer diameter shape and size of the multi-layer circuit board to be drilled. An inclined surface is provided between the inner diameter of the positioning ring 13 and the upper side surface.

[0026] The setting of the positioning ring 13 enables the multi-layer circuit board to automatically slide down along the inclined surface on the positioning ring 13 when being placed, in cooperation with the suction force of the vacuum suction groove 12, and finally enter the predetermined position, realizing rapid and accurate positioning.

[0027] In another embodiment, multiple vacuum suction grooves 12 are all independently connected to a negative pressure pump.

[0028] Independent negative pressure ensures the effect of vacuum suction.

[0029] In another embodiment, a nozzle facing the vacuum positioning seat 11 is further provided on the drilling tooling.

[0030] The setting of the nozzle enables blowing air on the vacuum positioning seat 11 after drilling to clean the drilling debris. The main components of the drilling debris are glass fiber and resin, and the particle size is 5 - 500 μm.

[0031] In another embodiment, all three hole-opening positions are within the range of the same slag collection channel 14.

[0032] Since the positions of the three wiring holes of the multi-layer circuit board are close to each other, collecting them using the same slag collection channel 14 can save negative pressure resources and simplify the structure.

[0033] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed.

Claims

1. A drilling tooling for a multi-layer circuit board, characterized in that, It includes a vacuum positioning seat, on which a plurality of vacuum adsorption grooves are provided. A slag collection channel is arranged at the position corresponding to the opening positions of the multi-layer circuit boards on the vacuum positioning seat, and the slag collection channel is connected to a negative pressure collector.

2. The drilling tooling for the multi-layer circuit board according to claim 1, wherein A positioning ring is arranged on the vacuum positioning seat, and the inner diameter of the positioning ring matches the outer diameter shape and size of the multi-layer circuit board to be drilled. An inclined surface is provided between the inner diameter and the upper side surface of the positioning ring.

3. The drilling tooling for the multi-layer circuit board according to claim 1, characterized in that, A plurality of the vacuum adsorption grooves are all independently connected to a negative pressure pump.

4. The drilling tooling for the multi-layer circuit board according to claim 1, characterized in that, An air nozzle facing the vacuum positioning seat is further arranged on the drilling tooling.

5. The drilling tooling for the multi-layer circuit board according to claim 1, characterized in that, All three opening positions are within the range of the same slag collection channel.

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