Novel silicon carbide embedded buried core module package circuit board sintering device and method

Abstract

The present invention discloses a novel sintering device and method for a silicon carbide embedded buried core module packaged circuit board, and relates to the field of sintering process technology. The device includes: a machine platform, on which a plurality of spaced-apart workstations are arranged, including a loading station, a plurality of preheating stations, a sintering station, a plurality of cooling stations, and an unloading station in sequence; a lifting mechanism, which is arranged on the machine platform and is located on both sides of the plurality of stations; a supporting mechanism, which is located on both sides of the plurality of stations and is movably connected to the lifting mechanism; a driving mechanism, which is arranged on the machine platform and is transmission-connected to the supporting mechanism; a sintering mechanism, which is arranged above the sintering station, and the sintering mechanism can rise and fall in the vertical direction, and the sintering mechanism includes a processing chamber, and a liftable upper die is arranged inside the processing chamber, and a nozzle for providing inert gas is also arranged inside the processing chamber. The novel sintering device for a silicon carbide embedded buried core module packaged circuit board according to the embodiment of the present invention can improve the sintering quality and sintering efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board sintering, and in particular to a novel device and method for sintering a circuit board packaged with a silicon carbide embedded buried core module. Background Art

[0002] The sintering process is required during the production of printed circuit boards (PCBs), but because PCBs (especially flexible PCBs) easily absorb moisture, this moisture can evaporate instantly during sintering, leading to substrate delamination, blistering, and solder spatter. After sintering, excessive grain growth can occur due to excessive temperatures. Furthermore, existing PCB sintering processes are inefficient. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a novel sintering device and method for a silicon carbide embedded buried core module packaged circuit board, which can improve sintering efficiency and sintering quality.

[0004] On the one hand, a novel silicon carbide embedded buried core module package circuit board sintering device according to an embodiment of the present invention includes:

[0005] A machine platform is provided with a plurality of spaced-apart workstations, which include a loading station, a plurality of preheating stations, a sintering station, a plurality of cooling stations and an unloading station in sequence. The preheating temperature of the plurality of preheating stations gradually increases, and the cooling rate of the plurality of cooling stations gradually decreases. Each of the preheating station, the sintering station and the cooling station is provided with a carrying platform, and the carrying platform is provided with a first positioning member. The carrying platform of the sintering station includes a base and a support platform, and the support platform is liftably provided in the middle of the base;

[0006] A lifting mechanism is provided on the machine platform and is located on both sides of the plurality of workstations;

[0007] a support mechanism located on both sides of the plurality of workstations and movably connected to the lifting mechanism, the lifting mechanism being used to drive the support mechanism to rise or fall, the support mechanism comprising a plurality of retractable support assemblies, each of the support assemblies being provided with a second positioning member;

[0008] A driving mechanism is provided on the machine platform and is in transmission connection with the supporting mechanism, and is used to drive the supporting mechanism to move in a distribution direction of the plurality of workstations;

[0009] The sintering mechanism is arranged above the sintering station. The sintering mechanism can rise and fall in the vertical direction. The sintering mechanism includes a processing chamber, a liftable upper die is provided inside the processing chamber, and a nozzle for providing inert gas is also provided inside the processing chamber.

[0010] According to some embodiments of the present invention, the lifting mechanism includes two lifting devices symmetrically arranged on both sides of the plurality of workstations, each of the lifting devices including:

[0011] A mounting plate, wherein the bottoms of both ends of the mounting plate are respectively provided with inclined blocks, the bottoms of both ends of the mounting plate are respectively connected to the surface of the machine through elastic connection devices, and the supporting mechanism is provided on the mounting plate;

[0012] A driver is located in the lower middle part of the mounting plate, and telescopic devices are provided at both ends of the driver. The bottom of each inclined block close to the driver is higher than the bottom of the side away from the driver. The output end of each telescopic device is connected to a slider, and each slider is slidably set in the corresponding slide rail. The top of the slider is provided with a pulley that abuts against the bottom of the inclined block;

[0013] The guide rod is arranged on the machine platform. The side of the mounting plate is provided with a first guide groove, and the first guide groove is sleeved on the outside of the guide rod.

[0014] According to some embodiments of the present invention, the support mechanism includes two support assemblies symmetrically arranged on both sides of the plurality of workstations, and the support assemblies include:

[0015] A plurality of guide blocks, wherein the plurality of guide blocks are spaced apart and arranged on the surface of the mounting plate, and a second guide groove is provided on a side of the guide block facing the work station;

[0016] A support rod, the support rod being inserted into the second guide groove of the plurality of guide blocks, one end of the support rod being connected to the driving mechanism, a plurality of telescopic assemblies being provided on a side of the support rod facing the workstation, each of the telescopic assemblies being connected to a support plate;

[0017] The support plate is used to place the plate to be processed, the corners of the plate to be processed are provided with second positioning holes corresponding to the second positioning pieces, and the middle of the plate to be processed is provided with a first positioning hole corresponding to the first positioning piece.

[0018] According to some embodiments of the present invention, a blanking mechanism is provided on a side of the blanking station away from the cooling station, and the blanking mechanism includes:

[0019] A lifting platform, wherein the lifting platform is provided with multiple layers of first placement platforms spaced apart in the vertical direction, each layer of the first placement platforms includes two first placement blocks arranged opposite to each other, cooling air holes are provided between two adjacent layers of the first placement platforms, a through hole is provided at the position of the machine platform corresponding to the lifting platform, and the lifting platform is passed through the through hole;

[0020] A conveying platform is located below the machine platform and is arranged inside the lifting platform, and the two first placement blocks of the first placement platform are respectively located on both sides of the conveying platform;

[0021] The grabbing robot is arranged on the surface of the machine platform and is located on a side of the lifting platform away from the cooling station.

[0022] According to some embodiments of the present invention, the driving mechanism includes:

[0023] A fixing frame is provided on the surface of the machine;

[0024] A feeding cylinder is arranged on the fixing frame;

[0025] A connecting plate, both sides of which are connected to the supporting mechanisms on both sides of the plurality of workstations, and a middle portion of the connecting plate is connected to the output shaft of the feeding cylinder.

[0026] According to some embodiments of the present invention, the novel silicon carbide embedded buried core module package circuit board sintering device further includes a limiting mechanism, which is used to detect the position of the supporting mechanism and limit the moving stroke of the feeding cylinder.

[0027] On the other hand, a circuit board sintering method according to an embodiment of the present invention is applied to the above-mentioned novel silicon carbide embedded buried core module package circuit board sintering device, and the circuit board sintering method includes:

[0028] Initialization: the first support assembly is located at the loading station, and the remaining support assemblies are respectively located at the preheating station, the sintering station, and the cooling station;

[0029] The plate to be processed is placed on the first supporting assembly, and the plate to be processed is positioned by the second positioning member and the second positioning hole; a first positioning hole corresponding to the first positioning member is provided in the middle of the plate to be processed, and second positioning holes corresponding to the second positioning member are provided at the corners of the plate to be processed;

[0030] All the support assemblies are driven to move to the next station by the driving mechanism, so that the first support assembly is located at the first preheating station;

[0031] The support assembly is driven down by the lifting mechanism to place the plate to be processed on the first support assembly on the supporting platform of the first preheating station, and the plate to be processed is positioned by the first positioning member and the first positioning hole;

[0032] The supporting assembly is driven to continue to descend by the lifting mechanism, so that the first positioning member leaves the first positioning hole, and the supporting assembly is retracted;

[0033] The first support assembly is moved to the loading station by the driving mechanism, the support assembly is extended, and the support assembly is raised and reset by the lifting mechanism;

[0034] placing the next plate to be processed on the first support assembly, and returning to move all the support assemblies to the next station via the driving mechanism so that the first support assembly is located at the first preheating station;

[0035] After the plate to be processed passes through multiple preheating stations for progressive preheating, it is sintered by the sintering mechanism. After sintering, the plate to be processed passes through multiple cooling stations for descending cooling. After cooling, the plate to be processed is placed at the unloading station.

[0036] According to some embodiments of the present invention, sintering the plate to be processed by the sintering mechanism includes:

[0037] When the support assembly places the plate to be processed on the support table, the support assembly contracts, and the support table descends to the surface of the base, so that the base and the support table support the plate to be processed;

[0038] The processing chamber is driven to descend to the surface of the machine table by the sintering mechanism so that the processing chamber surrounds the base;

[0039] After the processing chamber provides inert gas through the nozzle, the upper die descends to contact the plate to be processed to provide sintering pressure;

[0040] After the plate to be processed is sintered at a preset sintering pressure and temperature, the upper die and the processing chamber are both lifted up and reset.

[0041] According to some embodiments of the present invention, a unloading mechanism is provided on a side of the unloading station away from the cooling station, the unloading mechanism includes a lifting platform, a conveying platform and a grasping robot, the lifting platform is provided with multiple layers of first placement platforms spaced apart in the vertical direction, each layer of the first placement platform includes two first placement blocks arranged opposite to each other, cooling air holes are provided between two adjacent layers of the first placement platforms, a through hole is provided on the machine platform corresponding to the lifting platform, and the lifting platform is passed through the through hole; the conveying platform is located below the machine platform and passed through the inside of the lifting platform, and the two first placement blocks of the first placement platform are respectively located on both sides of the conveying platform; the grasping robot is provided on the surface of the machine platform and is located on a side of the lifting platform away from the unloading station;

[0042] The cooled plate to be processed is placed at the blanking station, comprising:

[0043] When the support assembly moves the cooled plate to be processed to the unloading station, the grabbing robot grabs the plate to be processed and places it on the first placement block of the first placement table on the corresponding layer, and provides cold air to the plate to be processed on the first placement block through the corresponding cooling air holes;

[0044] Each time a plate to be processed is placed on the lifting platform, the lifting platform is lowered by the distance of the first placement platform, and the blowing efficiency of the cooling holes is gradually reduced;

[0045] When the first placement block descends to the conveying table, the board to be processed on the first placement block is transferred to the conveying table;

[0046] The conveying platform conveys the plate to be processed to the unloading location;

[0047] When the first placement table on the top layer of the lifting platform places the board to be processed, the lifting platform directly descends to the surface of the conveying table, transfers the boards to be processed on all the first placement tables of the lifting platform to the conveying table, and then the lifting platform rises and resets.

[0048] According to some embodiments of the present invention, the loading station further includes a loading mechanism, the loading mechanism includes a loading table and a loading robot, the loading table includes multiple layers of retractable second placement tables, each layer of the second placement table is provided with retractable second placement blocks on both sides, each layer of the second placement table is used to place the corresponding plate to be processed, and the loading robot is located on the side of the loading table away from the preheating station;

[0049] Placing the plate to be processed on the first supporting assembly and positioning the plate to be processed through the second positioning member and the second positioning hole comprises:

[0050] When the support assembly is in a retracted state, the loading robot absorbs the plate to be processed from the second placement table on the uppermost layer and moves to the top of the support assembly, and the second placement block of the second placement table on the uppermost layer retracts;

[0051] When the support assembly is in an extended state, the loading robot places the board to be processed on the support assembly and positions the board to be processed through the first positioning member and the first positioning hole.

[0052] On the other hand, a storage medium according to an embodiment of the present invention stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the circuit board sintering method described in the above embodiment.

[0053] According to the embodiment of the present invention, the novel silicon carbide embedded buried core module package circuit board sintering device and method have at least the following beneficial effects: by preheating the board to be processed multiple times before sintering and cooling the board to be processed multiple times after sintering, and the preheating temperature gradually increases and the cooling rate gradually decreases, the sintering quality of the board to be processed is improved and the product yield is improved; through the mutual cooperation of the lifting mechanism, the supporting mechanism and the driving mechanism, the automatic transportation of the board to be processed is realized and the sintering rate of the board to be processed is improved; by setting the processing chamber and the nozzle, inert gas is provided for the sintering process, thereby preventing the board to be processed from being oxidized in a high temperature environment.

[0054] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which:

[0056] Figure 1 This is a schematic structural diagram of a novel silicon carbide embedded buried core module package circuit board sintering device according to an embodiment of the present invention;

[0057] Figure 2 This is a schematic structural diagram of the novel silicon carbide embedded buried core module package circuit board sintering device according to an embodiment of the present invention after removing the board to be processed;

[0058] Figure 3 for Figure 2 An enlarged schematic diagram of part A is shown;

[0059] Figure 4 This is a schematic structural diagram of a plate to be processed according to an embodiment of the present invention;

[0060] Figure 5 for Figure 2 An enlarged schematic diagram of part B is shown;

[0061] Figure 6 This is a structural schematic diagram of a novel silicon carbide embedded buried core module package circuit board sintering device from another perspective according to an embodiment of the present invention;

[0062] Figure 7 for Figure 6 An enlarged schematic diagram of part C is shown;

[0063] Figure 8 A flowchart of the steps of a circuit board sintering method according to an embodiment of the present invention;

[0064] Reference numerals:

[0065] Machine 100, loading station 110, preheating station 120, sintering station 130, cooling station 140, unloading station 150, carrying platform 160, base 161, support platform 162, second positioning member 170, through hole 180, first positioning member 190;

[0066] Lifting mechanism 200, mounting plate 210, inclined block 211, elastic connecting device 212, first guide groove 213, driver 220, telescopic device 221, slider 222, slide rail 223, pulley 224, guide rod 230;

[0067] Support mechanism 300, support assembly 310, guide block 311, support rod 312, telescopic assembly 313, support plate 314;

[0068] Driving mechanism 400, fixing frame 410, feeding cylinder 420, connecting plate 430;

[0069] Sintering mechanism 500, processing chamber 510;

[0070] Unloading mechanism 600, lifting platform 610, first placement platform 611, first placement block 612, conveying platform 620, grabbing robot 630, lifting drive device 640;

[0071] Limiting mechanism 700;

[0072] The plate to be processed 800, the second positioning hole 810, and the first positioning hole 820;

[0073] Control mechanism 900. DETAILED DESCRIPTION

[0074] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. The step numbers in the following embodiments are provided only for the convenience of explanation and do not limit the order of the steps. The order of execution of the steps in the embodiments can be adaptively adjusted according to the understanding of those skilled in the art.

[0075] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0076] The terms "first," "second," "third," and "fourth," etc., in the specification, claims, and accompanying drawings of the present invention are used to distinguish between different items, not to describe a specific order. Furthermore, the terms "including," "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not limited to the listed steps or elements, but may optionally include steps or elements not listed, or may optionally include other steps or elements inherent to the process, method, product, or apparatus.

[0077] References to "embodiments" in this disclosure mean that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the disclosure. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0078] The sintering process is required during the production of printed circuit boards (PCBs), but because PCBs (especially flexible PCBs) easily absorb moisture, this moisture can evaporate instantly during sintering, leading to substrate delamination, blistering, and solder spatter. After sintering, excessive grain growth can occur due to excessive temperatures. Furthermore, existing PCB sintering processes are inefficient.

[0079] To this end, an embodiment of the present invention provides a novel sintering device and method for a silicon carbide embedded buried core module packaged circuit board, which preheats the board to be processed multiple times before sintering and cools the board to be processed multiple times after sintering, and the preheating temperature gradually increases and the cooling rate gradually decreases, thereby improving the sintering quality of the board to be processed and improving the product yield; through the mutual cooperation of the lifting mechanism, the supporting mechanism and the driving mechanism, the automatic transportation of the board to be processed is realized, and the sintering rate of the board to be processed is improved; by setting a processing chamber and a nozzle, an inert gas is provided for the sintering process, thereby preventing the board to be processed from being oxidized in a high-temperature environment.

[0080] The novel silicon carbide embedded buried core module package circuit board sintering device and method according to the embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

[0081] On the one hand, if Figure 1As shown, an embodiment of the present invention proposes a novel sintering device for a silicon carbide embedded core module packaged circuit board, the device comprising: a machine platform 100, a lifting mechanism 200, a supporting mechanism 300, a driving mechanism 400 and a sintering mechanism 500; wherein, a plurality of spaced-apart stations are provided on the machine platform 100, including, from right to left, a loading station 110, a plurality of preheating stations 120, a sintering station 130, a plurality of cooling stations 140, and an unloading station 150, wherein the preheating temperature of the plurality of preheating stations 120 gradually increases, and the cooling rate of the plurality of cooling stations 140 gradually decreases; as shown in FIG. Figure 2 and Figure 3 As shown, each preheating station 120, sintering station 130 and cooling station 140 is provided with a carrier 160, and the carrier 160 is provided with a first positioning member 190. The carrier 160 of the sintering station 130 also includes a base 161 and a support platform 162, and the support platform 162 is arranged in the middle of the base 161 in a liftable manner; the lifting mechanism 200 is arranged on the machine 100 and is located on both sides of the plurality of stations; the support mechanism 300 is located on both sides of the plurality of stations and is movably connected to the lifting mechanism 200, and the lifting mechanism 200 is used to drive the support mechanism 300 to rise or fall, and the support mechanism 300 includes multiple A retractable support assembly 310 is provided, and the support assembly 310 is provided with a second positioning member 170; the driving mechanism 400 is provided on the machine platform 100 and is in transmission connection with the support mechanism 300, and the driving mechanism 400 is used to drive the support mechanism 300 to move in the distribution direction of multiple stations (i.e., the left and right direction); the sintering mechanism 500 is provided above the sintering station 130, and the sintering mechanism 500 can rise and fall in the vertical direction. The sintering mechanism 500 includes a processing chamber 510, and a liftable upper die is provided inside the processing chamber 510, and a nozzle for providing inert gas is also provided inside the processing chamber 510.

[0082] Specifically, the novel silicon carbide embedded core module package circuit board sintering device according to the embodiment of the present invention is used to automatically sinter the processing board 800. Figure 4As shown, in this example, the plate to be processed 800 is provided with second positioning holes 810 at the four corners and a first positioning hole 820 in the middle. When the plate to be processed 800 is to be sintered, the plate to be processed 800 is first loaded and placed at the loading station 110. The loading station 110, the preheating station 120, the sintering station 130 and the cooling station 140 all have corresponding support assemblies 310, and the support assembly 310 is provided with a second positioning member 170. Therefore, when loading, the plate to be processed 800 is placed on the support assembly 310 at the loading station 110 so that the second positioning member 170 of the support assembly 310 passes through the four second positioning holes 810 of the plate to be processed 800, thereby achieving positioning of the plate to be processed 800. After the plate 800 to be processed is placed, the drive mechanism 400 drives the support mechanism 300 to move one station from right to left. At this time, all support assemblies 310 move one station to the left, so that the support assembly 310 at the loading station 110 moves to the first preheating station 120, the support assembly 310 at the first preheating station 120 moves to the second preheating station 120, and so on. The support assembly 310 at the last preheating station 120 moves to the sintering station 130, the support assembly 310 at the sintering station 130 moves to the first cooling station 140, the support assembly 310 at the first cooling station 140 moves to the second cooling station 140, and so on. At this time, the plate 800 to be processed originally located at the loading station 110 moves to the first preheating station 120 and is located above the first preheating station 120. Subsequently, the entire support mechanism 300 is driven down by the lifting mechanism 200, so that the plate to be processed 800 is placed on the supporting platform 160, and the first positioning member 190 of the supporting platform 160 just passes through the first positioning hole 820 of the plate to be processed 800, thereby supporting and positioning the plate to be processed 800. Subsequently, the lifting mechanism 200 further drives the support mechanism 300 to descend, so that the second positioning member 170 leaves the second positioning hole 810, so that the support assembly 310 is separated from the plate to be processed 800; subsequently, the driving mechanism 400 drives the support mechanism 300 to move one station from left to right, so that each support assembly 310 returns to its original station again, that is, the support assembly 310 located at the first preheating station 120 returns to the loading station 110, and the remaining support assemblies 310 all move one station to the left. At the same time, the lifting mechanism 200 drives the entire support mechanism 300 to rise, so that each support assembly 310 is reset. By repeating the above process, the board 800 to be processed can be continuously transported from right to left. The support assembly 310 at each workstation can transport the board 800 to be processed at the current workstation to the next workstation, so that each board 800 to be processed passes through the loading station 110, multiple preheating stations 120, the sintering station 130, the cooling station 140 in sequence, and finally reaches the unloading station 150.It should be noted that, at the blanking station 150 , a supporting platform may also be provided for receiving the blanked plate 800 to be processed.

[0083] It should be noted that, in the embodiment of the present application, there are multiple preheating stations 120, and the preheating temperature of each preheating station 120 gradually increases from right to left, so as to perform progressive preheating on the plate to be processed 800. The temperature during the first preheating is relatively low, and is mainly used to remove the ambient moisture absorbed by the surface layer of the plate to be processed 800, so as to avoid rapid vaporization of moisture during sintering, resulting in delamination of the substrate or spattering of solder joints. The temperature of the secondary preheating is relatively high, and is used to further evaporate the solvent and trace moisture remaining in the deep layer of the plate to be processed 800, thereby reducing the risk of defects such as voids and sand holes after sintering. It should be noted that, in this example, two preheating stations 120 are set. In actual applications, more preheating stations 120 can be set to preheat the plate to be processed 800 multiple times, thereby improving the sintering quality.

[0084] like Figure 2As shown, in this example, the carrier platform 160 of the sintering station 130 further includes a base 161 and a support platform 162. The support platform 162 is movably disposed in the middle of the base 161, and the first positioning member 190 of the carrier platform 160 is disposed on the support platform 162. In the initial state, the support platform 162 rises to its highest point, so that when the support assembly 310 descends, the support platform 162 can receive the plate 800 to be processed. At the same time, in this example, the support assembly 310 is retractable. When the support assembly 310 carries the plate 800 to be processed, it is in an extended state. However, after the support assembly 310 places the plate 800 to be processed on the carrier platform 160 and detaches from the plate 800 to be processed, the support assembly 310 will retract, thereby preventing the plate 800 from being obstructed when the support platform 162 drives the plate 800 to descend. After receiving the plate 800 to be processed, the support platform 162 drives the plate 800 to be processed downward to the surface of the base 161. At this time, the surface of the support platform 162 is flush with the surface of the base 161, and the plate 800 to be processed is supported by the support platform 162 and the base 161. Through this solution, it is possible to avoid the sintering pressure provided by the sintering mechanism 500 from being unevenly applied to the plate 800 to be processed due to the lack of support from the support platform 162 on all sides of the plate 800 when the sintering mechanism 500 is sintering the plate 800, thereby improving the sintering quality of the plate 800. When the sintering mechanism 500 is sintering the plate 800 to be processed, it drives the processing chamber 510 to descend to the surface of the machine 100, thereby covering the support platform 160 at the sintering station 130 and the plate 800 to be processed, facilitating the supply of inert gas during the sintering process through the nozzle, preventing the plate 800 from oxidizing in a high-temperature environment, and improving sintering reliability and product yield. During sintering, the upper die inside the processing chamber 510 descends to the surface of the plate 800 to apply sintering pressure and sinter the plate 800. After sintering, the upper die rises and returns to its original position, and the processing chamber 510 also rises and returns to its original position. The support assembly at the sintering station 130 then transfers the sintered plate 800 to the cooling station 140 for cooling.

[0085] It should be noted that in the embodiment of the present application, there are multiple cooling stations 140, and the cooling rate of each cooling station 140 gradually decreases from right to left, so that the plate to be processed 800 is cooled in a decreasing manner. The cooling rate during the first cooling is relatively high, so that the plate to be processed 800 can be cooled quickly, accelerating the process of leaving the brittle temperature range of the material and reducing excessive grain growth; the cooling rate of the secondary cooling is relatively low, which is used to reduce residual stress and avoid warping of the plate to be processed 800 or micro cracks in the welds. It should be noted that in this example, two cooling stations 140 are set. In actual applications, more cooling stations 140 can be set to cool the plate to be processed 800 multiple times, thereby ensuring product quality.

[0086] According to the novel silicon carbide embedded buried core module packaged circuit board sintering device of the embodiment of the present invention, the plate to be processed 800 is preheated multiple times before sintering and the plate to be processed 800 is cooled multiple times after sintering, and the preheating temperature gradually increases and the cooling rate gradually decreases, thereby improving the sintering quality of the plate to be processed 800 and improving the product yield; through the mutual cooperation of the lifting mechanism 200, the supporting mechanism 300 and the driving mechanism 400, the automatic transportation of the plate to be processed 800 is realized, and the sintering rate of the plate to be processed 800 is improved; by providing the processing chamber 510 and the nozzle, inert gas is provided for the sintering process, thereby preventing the plate to be processed 800 from being oxidized in a high temperature environment.

[0087] Furthermore, in some embodiments of the present application, the lifting mechanism 200 includes two symmetrically arranged on both sides of the plurality of stations (the Figure 1 Two lifting devices (shown on the front and rear sides) such as Figure 2 and Figure 5 As shown, each lifting device includes: a mounting plate 210, a driver 220 and a guide rod 230, wherein the bottoms of the left and right ends of the mounting plate 210 are respectively provided with inclined blocks 211, and the bottom of each inclined block 211 close to the driver 220 is higher than the bottom of the side away from the driver 220. The bottoms of both ends of the mounting plate 210 are respectively connected to the surface of the machine 100 through elastic connection devices 212, and the support mechanism 300 is provided on the mounting plate 210; the driver 220 is located on the mounting plate 210. In the lower middle part of the mounting plate 210, telescopic devices 221 are provided at both ends of the driver 220. The output end of each telescopic device 221 is connected to a slider 222. Each slider 222 is slidably set in the corresponding slide rail 223. The top of the slider 222 is provided with a pulley 224 that abuts against the bottom of the inclined block 211; the guide rod 230 is set on the machine 100, and the side of the mounting plate 210 is provided with a first guide groove 213, which is sleeved on the outside of the guide rod 230.

[0088] Specifically, in this example, when the actuator 220 drives the slider 222 along the slide rail 223 from left to right via the telescopic device 221, the bottom of the right side of the inclined block 211 is higher. Therefore, due to the interaction between the pulley 224 and the inclined block 211, the mounting plate 210 gradually descends, thereby driving the support mechanism 300 downward. When the actuator 220 drives the slider 222 along the slide rail 223 from right to left via the telescopic device 221, the bottom of the left side of the inclined block 211 is lower. Therefore, due to the interaction between the pulley 224 and the inclined block 211, the mounting plate 210 gradually ascends, thereby driving the support mechanism 300 upward. The telescopic device 221 can be a telescopic rod or the output shaft of a cylinder. Because the mounting plate 210 is long, the sliders 222 and inclined blocks 211 are provided on both the left and right sides of the actuator 220. This allows for synchronized movement of both sides of the mounting plate 210, making the lifting and lowering of the mounting plate 210 more stable. At the same time, because the mounting plate 210 is provided with a first guide groove 213, and the first guide groove 213 is sleeved on the outside of the guide rod 230, the mounting plate 210 can rise or fall along the guide rod 230, making the lifting and lowering of the mounting plate 210 and the support mechanism 300 more stable. By providing a pulley 224 on the top of the slider 222, the pulley 224 and the inclined block 211 can more easily move relative to each other, making the lifting drive more stable.

[0089] Furthermore, in some embodiments of the present application, the support mechanism 300 includes two symmetrically arranged on both sides of the plurality of stations (i.e. Figure 1 Two support assemblies 310 (shown on the front and rear sides) are provided, as shown in FIG. Figure 6 and Figure 7As shown, the support assembly 310 includes: a plurality of guide blocks 311 and a support rod 312. The plurality of guide blocks 311 are spaced apart on the surface of the mounting plate 210. The guide blocks 311 are provided with a second guide groove on the side facing the workstation. The support rod 312 is inserted into the second guide groove of the plurality of guide blocks 311. One end of the support rod 312 is connected to the drive mechanism 400. The side of the support rod 312 facing the workstation is provided with a plurality of telescopic assemblies 313. Each telescopic assembly 313 is connected to a support plate 314. Specifically, the support rod 312 is inserted into the second guide groove of the guide block 311. When the drive mechanism 400 drives the support rod 312 to move, the support rod 312 can move along the second guide groove, thereby achieving stable movement. At the same time, because the telescopic assembly 313 is provided on the support rod 312 and is connected to the support plate 314, when the support rod 312 moves, it will drive the telescopic assembly 313 and the support plate 314 to move together. The support plate 314 is used to place the plate 800 to be processed, and a second positioning member 170 is provided on the support plate 314 to position the plate 800 to be processed. The telescopic assembly 313 can be a telescopic rod or a telescopic cylinder, etc., for driving the plate 800 to be processed toward or away from the workstation.

[0090] Furthermore, in some embodiments of the present application, Figure 1 As shown, the driving mechanism 400 includes a fixed frame 410, a feeding cylinder 420 and a connecting plate 430. The fixed frame 410 is arranged on the surface of the machine 100, and the feeding cylinder 420 is arranged on the fixed frame 410. The two sides of the connecting plate 430 are connected to the support mechanism 300 on both sides of multiple workstations, and the middle part of the connecting plate 430 is connected to the output shaft of the feeding cylinder 420. Specifically, in this example, the fixed frame 410 is used to fix and install the feeding cylinder 420. The output shaft of the feeding cylinder 420 is connected to the connecting plate 430. The feeding cylinder 420 is extended and retracted to drive the connecting plate 430 to move left and right. At the same time, the connecting plate 430 is connected to the support rods 312 of the front and rear support assemblies 310. When the connecting plate 430 moves left and right, it will drive the support rods 312 to move left and right, thereby realizing the left and right movement of the support assembly 310.

[0091] Furthermore, in some embodiments of the present application, Figure 1As shown, the novel silicon carbide embedded buried core module package circuit board sintering device also includes a limiting mechanism 700, which is used to detect the position of the support mechanism 300 and limit the movement stroke of the feeding cylinder 420. It should be noted that the limiting mechanism 700 can use a displacement sensor or other types of sensors to detect the movement stroke of the feeding cylinder 420, ensuring that the feeding cylinder 420 drives the support mechanism 300 to move a distance of one station each time, ensuring that the movement distance of the support mechanism 300 is accurate; alternatively, the limiting mechanism 700 can also include a limiting block for limiting the movement of the support mechanism 300. When the support mechanism 300 moves to a specific position, the limiting block prevents the support mechanism 300 from continuing to move.

[0092] Furthermore, in some embodiments of the present application, a blanking mechanism 600 is provided on the side of the blanking station 150 away from the cooling station 140. It should be noted that for the loading station 110, preheating station 120, sintering station 130, cooling station 140 and blanking station 150, the distance between each station is equal. For the blanking mechanism 600, the blanking mechanism 600 is located on the left side of the blanking station 150 to ensure that when the driving mechanism 400 drives the supporting mechanism 300 to move one station to the left, the supporting assembly 310 originally located at the last cooling station 140 is located at the blanking station 150 and does not interfere with the blanking mechanism 600. Figure 1As shown, the unloading mechanism 600 includes a lifting platform 610, a conveying platform 620 and a grabbing robot 630. The lifting platform 610 has multiple layers of first placement platforms 611 spaced apart in the vertical direction. Each layer of the first placement platform 611 includes two first placement blocks 612 arranged opposite to each other. Cooling air holes are arranged between the two adjacent layers of the first placement platforms 611. A through hole 180 is opened at the unloading station 150 of the machine 100, and the lifting platform 610 is passed through the through hole 180; the conveying platform 620 is located below the machine 100 and is passed through the inside of the lifting platform 610. The two first placement blocks 612 of the first placement platform 611 are respectively located on both sides of the conveying platform 620; the grabbing robot 630 is arranged on the surface of the machine 100 and is located on the side of the lifting platform 610 away from the cooling station 140. When the support assembly 310 moves the board 800 to the left by one station, the board 800 to be processed is located at the unloading station 150, and the grabbing robot 630 extends to remove the board 800 to be processed from the support assembly 310, and then the grabbing robot 630 is retracted to move the board 800 to be processed from right to left to the first placement platform 611; then, the lifting platform 610 descends the distance of one layer of the first placement platform 611. Every time the lifting platform 610 receives a board 800 to be processed, it descends the distance of one layer. When the first placement platform 611 with the board 800 to be processed is placed descends to the conveying platform 620, since the two first placement blocks 612 are located on both sides of the conveying platform 620, the two first placement blocks 612 can descend to the bottom of the conveying platform 620, while the board 800 to be processed cannot descend to the bottom of the conveying platform 620, but remains on the surface of the conveying platform 620, so that the conveying platform 620 can unload the board 800 to be processed. It should be noted that the cooling holes between the two adjacent first placement platforms 611 will provide cooling gas to completely restore the plate 800 to a normal temperature state, and the rate at which the cooling holes provide cooling gas will gradually decrease with each descent of the lifting platform 610, thereby saving energy consumption. Figure 1 As shown, the lifting platform 610 is driven to move up and down by a lifting drive device 640 .

[0093] Furthermore, if Figure 1 As shown, in some embodiments of the present application, the novel silicon carbide embedded buried core module packaged circuit board sintering device also includes a control mechanism 900, which is used to control the operation of the entire novel silicon carbide embedded buried core module packaged circuit board sintering device. The control mechanism 900 is provided with control buttons such as start, stop, emergency stop, rise, fall, forward, and backward. The user can set the automation program through the control mechanism 900, or operate manually.

[0094] On the other hand, Figure 8As shown, based on the above-mentioned novel silicon carbide embedded buried core module package circuit board sintering device, the present invention also proposes a circuit board sintering method, which includes the following steps:

[0095] Step S100: Initialization, where the first support assembly 310 is located at the loading station 110, and the remaining support assemblies 310 are respectively located at the preheating station 120, the sintering station 130, and the cooling stations 140;

[0096] Step S200: placing the plate to be processed 800 on the first support assembly 310, and positioning the plate to be processed 800 through the second positioning member 170 and the second positioning hole 810;

[0097] Step S300: driving all support assemblies 310 to move to the next station via the driving mechanism 400, so that the first support assembly 310 is located at the first preheating station 120;

[0098] Step S400: The support assembly 310 is driven downward by the lifting mechanism 200 to place the plate 800 to be processed on the first support assembly 310 on the carrier 160 of the first preheating station 120 , and the plate 800 to be processed is positioned by the first positioning member 190 and the first positioning hole 820 ;

[0099] Step S500: The lifting mechanism 200 drives the support assembly 310 to continue to descend, so that the first positioning member 190 leaves the first positioning hole 820 and the support assembly 310 shrinks;

[0100] Step S600: The first support assembly 310 is moved to the loading station 110 by the driving mechanism 400, the support assembly 310 is extended, and the support assembly 310 is raised and reset by the lifting mechanism 200;

[0101] Step S700: placing the next plate to be processed 800 on the first support assembly 310 and returning to step S300;

[0102] Step S800: After the plate to be processed 800 passes through multiple preheating stations 120 for progressive preheating, it is sintered by the sintering mechanism 500. After sintering, the plate to be processed 800 passes through multiple cooling stations 140 for descending cooling. The cooled plate to be processed 800 is placed at the unloading station 150.

[0103] Specifically, the novel silicon carbide embedded core module package circuit board sintering device according to the embodiment of the present invention is used to automatically sinter the processing board 800. Figure 4As shown, in this example, the plate to be processed 800 is provided with second positioning holes 810 at the four corners and a first positioning hole 820 in the middle. When the plate to be processed 800 is to be sintered, the plate to be processed 800 is first loaded and placed at the loading station 110. The loading station 110, the preheating station 120, the sintering station 130 and the cooling station 140 all have corresponding support assemblies 310, and the support assembly 310 is provided with a second positioning member 170. Therefore, when loading, the plate to be processed 800 is placed on the support assembly 310 at the loading station 110 so that the second positioning member 170 of the support assembly 310 passes through the four second positioning holes 810 of the plate to be processed 800, thereby achieving positioning of the plate to be processed 800. After the plate 800 to be processed is placed, the drive mechanism 400 drives the support mechanism 300 to move one station from right to left. At this time, all support assemblies 310 move one station to the left, so that the support assembly 310 at the loading station 110 moves to the first preheating station 120, the support assembly 310 at the first preheating station 120 moves to the second preheating station 120, and so on. The support assembly 310 at the last preheating station 120 moves to the sintering station 130, the support assembly 310 at the sintering station 130 moves to the first cooling station 140, the support assembly 310 at the first cooling station 140 moves to the second cooling station 140, and so on. At this time, the plate 800 to be processed originally located at the loading station 110 moves to the first preheating station 120 and is located above the first preheating station 120. Subsequently, the entire support mechanism 300 is driven down by the lifting mechanism 200, so that the plate to be processed 800 is placed on the supporting platform 160, and the first positioning member 190 of the supporting platform 160 just passes through the first positioning hole 820 of the plate to be processed 800, thereby supporting and positioning the plate to be processed 800. Subsequently, the lifting mechanism 200 further drives the support mechanism 300 to descend, so that the second positioning member 170 leaves the second positioning hole 810, so that the support assembly 310 is separated from the plate to be processed 800; subsequently, the driving mechanism 400 drives the support mechanism 300 to move one station from left to right, so that each support assembly 310 returns to its original station again, that is, the support assembly 310 located at the first preheating station 120 returns to the loading station 110, and the remaining support assemblies 310 all move one station to the left. At the same time, the lifting mechanism 200 drives the entire support mechanism 300 to rise, so that each support assembly 310 is reset. By repeating the above process, the board 800 to be processed can be continuously transported from right to left. The support assembly 310 at each workstation can transport the board 800 to be processed at the current workstation to the next workstation, so that each board 800 to be processed passes through the loading station 110, multiple preheating stations 120, the sintering station 130, the cooling station 140 in sequence, and finally reaches the unloading station 150.

[0104] It should be noted that, in the embodiment of the present application, there are multiple preheating stations 120, and the preheating temperature of each preheating station 120 gradually increases from right to left, so as to perform progressive preheating on the plate to be processed 800. The temperature during the first preheating is relatively low, and is mainly used to remove the ambient moisture absorbed by the surface layer of the plate to be processed 800, so as to avoid rapid vaporization of moisture during sintering, resulting in delamination of the substrate or spattering of solder joints. The temperature of the secondary preheating is relatively high, and is used to further evaporate the solvent and trace moisture remaining in the deep layer of the plate to be processed 800, thereby reducing the risk of defects such as voids and sand holes after sintering. It should be noted that, in this example, two preheating stations 120 are set. In actual applications, more preheating stations 120 can be set to preheat the plate to be processed 800 multiple times, thereby improving the sintering quality.

[0105] It should be noted that in the embodiment of the present application, there are multiple cooling stations 140, and the cooling rate of each cooling station 140 gradually decreases from right to left, so that the plate to be processed 800 is cooled in a decreasing manner. The cooling rate during the first cooling is relatively high, so that the plate to be processed 800 can be cooled quickly, accelerating the process of leaving the brittle temperature range of the material and reducing excessive grain growth; the cooling rate of the secondary cooling is relatively low, which is used to reduce residual stress and avoid warping of the plate to be processed 800 or micro cracks in the welds. It should be noted that in this example, two cooling stations 140 are set. In actual applications, more cooling stations 140 can be set to cool the plate to be processed 800 multiple times, thereby ensuring product quality.

[0106] like Figure 2As shown, in this example, the carrier platform 160 of the sintering station 130 further includes a base 161 and a support platform 162. The support platform 162 is movably disposed in the middle of the base 161, and the first positioning member 190 of the carrier platform 160 is disposed on the support platform 162. In the initial state, the support platform 162 rises to its highest point, so that when the support assembly 310 descends, the support platform 162 can receive the plate 800 to be processed. At the same time, in this example, the support assembly 310 is retractable. When the support assembly 310 carries the plate 800 to be processed, it is in an extended state. However, after the support assembly 310 places the plate 800 to be processed on the carrier platform 160 and detaches from the plate 800 to be processed, the support assembly 310 will retract, thereby preventing the plate 800 from being obstructed when the support platform 162 drives the plate 800 to descend. After receiving the plate 800 to be processed, the support platform 162 lowers the plate 800 to the surface of the base 161. At this point, the surface of the support platform 162 is flush with the surface of the base 161, and the support platform 162 and the base 161 jointly support the plate 800 to be processed. This solution can prevent the sintering pressure provided by the sintering mechanism 500 from being evenly applied to the plate 800 to be processed due to the lack of support from the support platform 162 on all sides of the plate 800 when the sintering mechanism 500 is sintering the plate 800, thereby improving the sintering quality of the plate 800 to be processed.

[0107] In this example, sintering the plate 800 to be processed specifically includes the following four steps:

[0108] (1) After the support assembly 310 places the plate to be processed 800 on the support table 162, the support assembly 310 contracts, and the support table 162 descends to the surface of the base 161, so that the base 161 and the support table 162 support the plate to be processed 800;

[0109] (2) The sintering mechanism 500 drives the processing chamber 510 to descend to the surface of the machine table 100 so that the processing chamber 510 surrounds the base 161;

[0110] (3) After the processing chamber 510 provides inert gas through the nozzle, the upper die descends to contact the plate to be processed 800 to provide sintering pressure;

[0111] (4) After the plate to be processed 800 is sintered at the preset sintering pressure and sintering temperature, the upper die and the processing chamber 510 are both raised and reset.

[0112] Specifically, when the sintering mechanism 500 is sintering the plate 800 to be processed, the processing chamber 510 will be driven to descend to the surface of the machine 100, thereby covering the supporting platform 160 at the sintering station 130 and the plate 800 to be processed, so as to facilitate the provision of inert gas for the sintering process through the nozzle, thereby preventing the plate 800 to be processed from oxidizing in a high-temperature environment, and improving the sintering reliability and product yield. During sintering, the upper die inside the processing chamber 510 will descend to the surface of the plate 800 to be processed, thereby applying sintering pressure to sinter the plate 800 to be processed. After sintering is completed, the upper die rises and resets, and the processing chamber 510 also rises and resets, and the sintered plate 800 to be processed is transferred to the cooling station 140 for cooling through the support assembly at the sintering station 130.

[0113] Furthermore, in some embodiments of the present application, Figure 1 As shown, a unloading mechanism 600 is provided on the side of the unloading station 150 away from the cooling station 140. It should be noted that for the loading station 110, the preheating station 120, the sintering station 130, the cooling station 140 and the unloading station 150, the distance between each station is equal. For the unloading mechanism 600, the unloading mechanism 600 is located on the left side of the unloading station 150 to ensure that when the driving mechanism 400 drives the supporting mechanism 300 to move one station to the left, the supporting assembly 310 originally located at the last cooling station 140 is located at the unloading station 150 and will not interfere with the unloading mechanism 600. The unloading mechanism 600 includes a lifting platform 610, a conveying platform 620, and a gripping robot 630. The lifting platform 610 has multiple layers of first placement platforms 611 spaced apart in the vertical direction. Each layer of the first placement platform 611 includes two first placement blocks 612 arranged opposite to each other. Cooling air holes are provided between two adjacent layers of the first placement platforms 611. A through hole 180 is provided at the position of the machine 100 corresponding to the unloading station 150, and the lifting platform 610 is passed through the through hole 180. The conveying platform 620 is located below the machine 100 and passed through the interior of the lifting platform 610. The two first placement blocks 612 of the first placement platform 611 are respectively located on both sides of the conveying platform 620. The gripping robot 630 is provided on the surface of the machine 100 and on the side of the lifting platform 610 away from the cooling station 140. The unloading mechanism 600 unloads the plate 800 to be processed, which specifically includes the following five steps:

[0114] (1) When the support assembly 310 moves the cooled plate to be processed 800 to the unloading station 150, the gripping robot 630 grabs the plate to be processed 800 and places it on the first placement block 612 of the first placement table 611 of the corresponding layer, and provides cooling air to the plate to be processed 800 on the first placement block 612 through the corresponding cooling air holes;

[0115] (2) After each plate 800 to be processed is placed on the lifting platform 610, the lifting platform 610 descends by the distance of the first placement platform 611, and the blowing efficiency of the cooling air holes gradually decreases;

[0116] (3) When the first placement block 612 descends to the conveying table 620 , the board to be processed 800 on the first placement block 612 is transferred to the conveying table 620 ;

[0117] (4) The conveying platform 620 conveys the plate to be processed 800 to the unloading location;

[0118] (5) When the first placement table 611 on the top layer of the lifting platform 610 places the board 800 to be processed, the lifting platform 610 directly descends to the surface of the conveying table 620, transfers all the boards 800 to be processed on the lifting platform 610 to the conveying table 620, and then the lifting platform 610 rises and resets.

[0119] Specifically, when the support assembly 310 moves the cooled board 800 to the unloading station 150, the grabbing robot 630 extends out to remove the board 800 to be processed from the support assembly 310, and then the grabbing robot 630 retracts and moves the board 800 to be processed from right to left to the first placement table 611; then, the lifting platform 610 descends the distance of one layer of the first placement table 611. Every time the lifting platform 610 receives a board 800 to be processed, it descends the distance of one layer. When the first placement table 611 with the board 800 to be processed is placed descends to the conveying table 620, since the two first placement blocks 612 are located on both sides of the conveying table 620, the two first placement blocks 612 can descend to the bottom of the conveying table 620, while the board 800 to be processed cannot descend to the bottom of the conveying table 620, but remains on the surface of the conveying table 620, so that the conveying table 620 can unload the board 800 to be processed. It should be noted that the cooling holes between the two adjacent first placement platforms 611 will provide cooling gas to completely restore the plate 800 to a normal temperature state, and the rate at which the cooling holes provide cooling gas will gradually decrease with each descent of the lifting platform 610, thereby saving energy consumption. Figure 1 As shown, the lifting platform 610 is driven to move up and down by a lifting drive device 640 .

[0120] Furthermore, in some embodiments of the present application, the loading station 110 further includes a loading mechanism (not shown), which includes a loading table and a loading robot. The loading table includes multiple layers of second placement tables, and each layer of the second placement table has retractable second placement blocks on both sides. Each layer of the second placement table is used to place a corresponding plate 800 to be processed. The loading robot is located on the side of the loading table away from the preheating station 120.

[0121] The above-mentioned step S200: placing the plate to be processed 800 on the first support assembly 310 and positioning the plate to be processed 800 through the second positioning member 170 and the second positioning hole 810 includes the following two steps:

[0122] (1) When the support assembly 310 is in a retracted state, the loading robot absorbs the plate to be processed 800 from the second placement table on the top layer and moves to the top of the support assembly 310, and the second placement block of the second placement table on the top layer retracts;

[0123] (2) When the support assembly 310 is in the extended state, the loading robot places the plate to be processed 800 on the support assembly 310 and positions the plate to be processed 800 through the first positioning member 190 and the first positioning hole 820.

[0124] By providing a loading mechanism, the plate 800 to be processed can be automatically loaded, thereby improving the sintering efficiency.

[0125] According to the circuit board sintering method of an embodiment of the present invention, the board to be processed 800 is preheated multiple times before sintering and cooled multiple times after sintering, and the preheating temperature gradually increases and the cooling rate gradually decreases, thereby improving the sintering quality of the board to be processed 800 and improving the product yield; through the mutual cooperation of the lifting mechanism 200, the supporting mechanism 300 and the driving mechanism 400, the automatic transportation of the board to be processed 800 is realized, and the sintering rate of the board to be processed 800 is improved; by providing a processing chamber 510 and a nozzle, an inert gas is provided for the sintering process, thereby preventing the board to be processed 800 from being oxidized in a high-temperature environment; by providing a loading mechanism and an unloading mechanism 600, the loading and unloading rates of the board to be processed 800 are improved.

[0126] On the other hand, an embodiment of the present invention further provides a storage medium, which is a computer-readable storage medium and stores a computer program. When the computer program is executed by a processor, the above-mentioned circuit board sintering method is implemented.

[0127] The memory, as a non-transient computer-readable storage medium, can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory optionally includes a memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of the above-mentioned networks include but are not limited to the Internet, an intranet, a local area network, a mobile communication network and a combination thereof. The device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and are located in one place, or may be distributed to multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

[0128] Although specific embodiments are described herein, those skilled in the art will recognize that many other modifications or alternative embodiments are also within the scope of this disclosure. For example, any of the functions and / or processing capabilities described in conjunction with a particular device or component may be performed by any other device or component. In addition, although various exemplary implementations and architectures have been described in accordance with embodiments of the present disclosure, those skilled in the art will recognize that many other modifications to the exemplary implementations and architectures described herein are also within the scope of this disclosure.

[0129] Some aspects of the present disclosure have been described above with reference to the block diagrams and flow charts of the systems, methods, systems and / or computer program products according to the exemplary embodiments. It should be understood that the combination of one or more blocks in the block diagram and the flow chart and the blocks in the block diagram and the flow chart can be realized by executing computer executable program instructions respectively. Equally, according to some embodiments, some blocks in the block diagram and the flow chart may not need to be executed in the order shown, or may not need to be executed in full. In addition, additional components and / or operations beyond those components and / or operations shown in the blocks in the block diagram and the flow chart may be present in certain embodiments.

[0130] Therefore, the blocks in the block diagrams and flow charts support combinations of means for performing the specified functions, combinations of elements or steps for performing the specified functions, and program instruction means for performing the specified functions. It should also be understood that each block in the block diagrams and flow charts, and combinations of blocks in the block diagrams and flow charts, can be implemented by a dedicated hardware computer system that performs the specific functions, elements, or steps, or a combination of dedicated hardware and computer instructions.

[0131] The program modules, applications, etc. described herein may include one or more software components, including, for example, software objects, methods, data structures, etc. Each such software component may include computer-executable instructions that, in response to execution, cause at least a portion of the functionality described herein (e.g., one or more operations of the illustrative methods described herein) to be performed.

[0132] Software component can be encoded with any one in various programming languages.A kind of exemplary programming language can be low-level programming language, such as the assembly language associated with specific hardware architecture and / or operating system platform.Comprise that the software component of assembly language instruction may need to be converted to executable machine code by assembler before being executed by hardware architecture and / or platform.Another exemplary programming language can be a more advanced programming language, and it can be transplanted across multiple architectures.Comprise that the software component of more advanced programming language may need to be converted to intermediate representation by interpreter or compiler before execution.Other examples of programming language include but are not limited to macro language, shell or command language, job control language, script language, database query or search language or report writing language.In one or more exemplary embodiments, the software component that comprises the instruction of one in the above-mentioned programming language example can be directly executed by operating system or other software component, without first being converted into another form.

[0133] Software components can be stored as files or other data storage structures. Software components of similar types or related functions can be stored together, such as in a specific directory, folder, or library. Software components can be static (e.g., preset or fixed) or dynamic (e.g., created or modified at execution time).

[0134] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the scope of the present invention.

Claims

1. A novel silicon carbide embedded buried core module package circuit board sintering device, characterized in that: include: A machine platform is provided with a plurality of spaced-apart workstations, which include a loading station, a plurality of preheating stations, a sintering station, a plurality of cooling stations and an unloading station in sequence. The preheating temperature of the plurality of preheating stations gradually increases, and the cooling rate of the plurality of cooling stations gradually decreases. Each of the preheating station, the sintering station and the cooling station is provided with a carrying platform, and the carrying platform is provided with a first positioning member. The carrying platform of the sintering station includes a base and a support platform, and the support platform is liftably provided in the middle of the base; A lifting mechanism is provided on the machine platform and is located on both sides of the plurality of workstations, the lifting mechanism comprising two lifting devices symmetrically provided on both sides of the plurality of workstations, each of the lifting devices having a mounting plate; a support mechanism located on both sides of the plurality of workstations and movably connected to the lifting mechanism, the lifting mechanism being used to drive the support mechanism to rise or fall, the support mechanism comprising a plurality of retractable support assemblies, each of the support assemblies being provided with a second positioning member; A driving mechanism is provided on the machine platform and is in transmission connection with the supporting mechanism, and is used to drive the supporting mechanism to move in a distribution direction of the plurality of workstations; a sintering mechanism disposed above the sintering station, capable of rising and falling in the vertical direction, comprising a processing chamber, wherein a liftable upper die is disposed inside the processing chamber, and a nozzle for providing an inert gas is also disposed inside the processing chamber; Wherein, the support mechanism includes two support assemblies symmetrically arranged on both sides of the plurality of workstations, and the support assemblies include: A plurality of guide blocks, wherein the plurality of guide blocks are spaced apart and arranged on the surface of the mounting plate, and a second guide groove is provided on a side of the guide block facing the work station; a support rod, the support rod being inserted into the second guide grooves of the plurality of guide blocks, one end of the support rod being connected to the driving mechanism, a plurality of telescopic assemblies being provided on a side of the support rod facing the workstation, each of the telescopic assemblies being connected to a support plate; The support plate is used to place the plate to be processed, the corners of the plate to be processed are provided with second positioning holes corresponding to the second positioning pieces, and the middle of the plate to be processed is provided with a first positioning hole corresponding to the first positioning piece.

2. The novel silicon carbide embedded buried core module package circuit board sintering device according to claim 1 is characterized in that: Each of the lifting devices comprises: A mounting plate, wherein the bottoms of both ends of the mounting plate are respectively provided with inclined blocks, the bottoms of both ends of the mounting plate are respectively connected to the surface of the machine through elastic connection devices, and the supporting mechanism is provided on the mounting plate; A driver is located in the lower middle part of the mounting plate, and telescopic devices are provided at both ends of the driver. The bottom of each inclined block close to the driver is higher than the bottom of the side away from the driver. The output end of each telescopic device is connected to a slider, and each slider is slidably set in the corresponding slide rail. The top of the slider is provided with a pulley that abuts against the bottom of the inclined block; The guide rod is arranged on the machine platform. The side of the mounting plate is provided with a first guide groove, and the first guide groove is sleeved on the outside of the guide rod.

3. The novel silicon carbide embedded buried core module package circuit board sintering device according to claim 1 is characterized in that: A blanking mechanism is provided on a side of the blanking station away from the cooling station, and the blanking mechanism comprises: A lifting platform, wherein the lifting platform is provided with multiple layers of first placement platforms spaced apart in the vertical direction, each layer of the first placement platforms includes two first placement blocks arranged opposite to each other, cooling air holes are provided between two adjacent layers of the first placement platforms, a through hole is provided at the position of the machine platform corresponding to the lifting platform, and the lifting platform is passed through the through hole; A conveying platform is located below the machine platform and is arranged inside the lifting platform, and the two first placement blocks of the first placement platform are respectively located on both sides of the conveying platform; The grabbing robot is arranged on the surface of the machine platform and is located on a side of the lifting platform away from the unloading station.

4. The novel silicon carbide embedded buried core module package circuit board sintering device according to claim 1 is characterized in that: The driving mechanism comprises: A fixing frame is provided on the surface of the machine; A feeding cylinder is arranged on the fixing frame; A connecting plate, both sides of which are connected to the supporting mechanisms on both sides of the plurality of workstations, and a middle portion of the connecting plate is connected to the output shaft of the feeding cylinder.

5. The novel silicon carbide embedded buried core module package circuit board sintering device according to claim 4 is characterized in that: The novel silicon carbide embedded buried core module package circuit board sintering device also includes a limiting mechanism, which is used to detect the position of the supporting mechanism and limit the moving stroke of the feeding cylinder.

6. A circuit board sintering method, characterized in that: Applicable to the novel silicon carbide embedded buried core module package circuit board sintering device as claimed in claim 1, the circuit board sintering method includes: Initialization: the first support assembly is located at the loading station, and the remaining support assemblies are respectively located at the preheating station, the sintering station, and the cooling station; The plate to be processed is placed on the first supporting assembly, and the plate to be processed is positioned by the second positioning member and the second positioning hole; a first positioning hole corresponding to the first positioning member is provided in the middle of the plate to be processed, and second positioning holes corresponding to the second positioning member are provided at the corners of the plate to be processed; All the support assemblies are driven to move to the next station by the driving mechanism, so that the first support assembly is located at the first preheating station; The support assembly is driven down by the lifting mechanism to place the plate to be processed on the first support assembly on the supporting platform of the first preheating station, and the plate to be processed is positioned by the first positioning member and the first positioning hole; The supporting assembly is driven to continue to descend by the lifting mechanism, so that the first positioning member leaves the first positioning hole, and the supporting assembly is retracted; The first support assembly is moved to the loading station by the driving mechanism, the support assembly is extended, and the support assembly is raised and reset by the lifting mechanism; placing the next plate to be processed on the first support assembly, and returning to move all the support assemblies to the next station via the driving mechanism so that the first support assembly is located at the first preheating station; After the plate to be processed passes through multiple preheating stations for progressive preheating, it is sintered by the sintering mechanism. After sintering, the plate to be processed passes through multiple cooling stations for descending cooling. After cooling, the plate to be processed is placed at the unloading station.

7. The circuit board sintering method according to claim 6, characterized in that: The sintering of the plate to be processed by the sintering mechanism includes: When the support assembly places the plate to be processed on the support table, the support assembly contracts, and the support table descends to the surface of the base, so that the base and the support table support the plate to be processed; The processing chamber is driven to descend to the surface of the machine table by the sintering mechanism so that the processing chamber surrounds the base; After the processing chamber provides inert gas through the nozzle, the upper die descends to contact the plate to be processed to provide sintering pressure; After the plate to be processed is sintered at a preset sintering pressure and temperature, the upper die and the processing chamber are both lifted up and reset.

8. The circuit board sintering method according to claim 6, characterized in that: A blanking mechanism is provided on the side of the blanking station away from the cooling station, and the blanking mechanism includes a lifting platform, a conveying platform and a grabbing robot. The lifting platform is provided with multiple layers of first placement platforms at intervals in the vertical direction, and each layer of the first placement platform includes two first placement blocks arranged opposite to each other, and cooling air holes are provided between two adjacent layers of the first placement platforms. A through hole is opened on the machine platform corresponding to the lifting platform, and the lifting platform is passed through the through hole; the conveying platform is located below the machine platform and passed through the inside of the lifting platform, and the two first placement blocks of the first placement platform are respectively located on both sides of the conveying platform; the grabbing robot is provided on the surface of the machine platform and is located on the side of the lifting platform away from the blanking station; The cooled plate to be processed is placed at the blanking station, comprising: When the support assembly moves the cooled plate to be processed to the unloading station, the grabbing robot grabs the plate to be processed and places it on the first placement block of the first placement table on the corresponding layer, and provides cold air to the plate to be processed on the first placement block through the corresponding cooling air holes; Each time a plate to be processed is placed on the lifting platform, the lifting platform is lowered by the distance of the first placement platform, and the blowing efficiency of the cooling holes is gradually reduced; When the first placement block descends to the conveying table, the board to be processed on the first placement block is transferred to the conveying table; The conveying platform conveys the plate to be processed to the unloading location; When the first placement table on the top layer of the lifting platform places the board to be processed, the lifting platform directly descends to the surface of the conveying table, transfers the boards to be processed on all the first placement tables of the lifting platform to the conveying table, and then the lifting platform rises and resets.

9. The circuit board sintering method according to claim 8, characterized in that: The loading station also includes a loading mechanism, which includes a loading platform and a loading robot. The loading platform includes multiple layers of retractable second placement platforms, and each layer of the second placement platform has retractable second placement blocks on both sides. Each layer of the second placement platform is used to place the corresponding plate to be processed. The loading robot is located on the side of the loading platform away from the preheating station. Placing the plate to be processed on the first supporting assembly and positioning the plate to be processed through the second positioning member and the second positioning hole comprises: When the support assembly is in a retracted state, the loading robot absorbs the plate to be processed from the second placement table on the uppermost layer and moves to the top of the support assembly, and the second placement block of the second placement table on the uppermost layer retracts; When the support assembly is in an extended state, the loading robot places the board to be processed on the support assembly and positions the board to be processed through the first positioning member and the first positioning hole.

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